KR102005570B1 - Solar cell module - Google Patents

Abstract

The present invention relates to a solar cell module.
A solar cell module according to an embodiment of the present invention includes: a solar cell panel having a plurality of strings formed by electrically connecting a plurality of solar cells arranged in a first direction; An interconnect for electrically connecting a plurality of solar cells within a string; And a junction box for collecting power generated in the plurality of solar cells; A lead wire electrically connecting one end of the interconnector and the electrode portion to each other; And a conductive joint portion positioned between the lead wire and the electrode portion of the junction box, wherein one end of the lead wire contacting the conductive joint portion has at least one hole.

Description

Solar cell module {SOLAR CELL MODULE}

The present invention relates to a solar cell module.

Recently, as energy resources such as petroleum and coal are expected to be depleted, interest in alternative energy to replace them is increasing, and solar cells that produce electric energy from solar energy are attracting attention.
The solar power generation system is formed by connecting a plurality of solar cell modules in series or in parallel, and each solar cell module has a plurality of solar cells arranged in a plurality of strings. Here, the string is formed by connecting a plurality of solar cells arranged in a line in series.
Each of the solar cell modules is provided with a branching device, for example, a junction box for taking out electric power generated from a plurality of solar cells to an external system, and is connected in series with a neighboring solar cell module by a cable connected to the junction box They are connected in parallel.
The string and the junction box are electrically connected by a lead wire where one end of the lead wire is connected to the string and the other end is soldered to the electrode portion of the junction box so that the string and the junction box can be electrically connected .
However, when soldering the lead wire to the junction box, soldering is performed in a state in which the solder is sandwiched between the electrode part and the lead wire, the contact area is small and the contact resistance is large, the electrode part and the lead wire are not sufficiently bonded, there is a problem.

Patent Registration No. 10-1077504 (published on October 28, 2011)
Japanese Patent Application Laid-Open No. 2004-281800 (published on October 10, 2004)
Japanese Patent Application Laid-Open No. 10-2013-0012134 (Publication date: 2013.02.01.)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a solar cell module with improved efficiency.

According to an embodiment of the present invention, a solar cell module includes: a solar cell panel having a plurality of strings formed by electrically connecting a plurality of solar cells arranged in a first direction; An interconnect for electrically connecting a plurality of solar cells within each string; And a junction box for collecting power generated in the plurality of solar cells; A lead wire electrically connecting one end of the interconnector and the electrode portion to each other; And a conductive joint portion positioned between the lead wire and the electrode portion of the junction box, and one end of the lead wire contacting the conductive joint portion may have at least one hole.

Here, the maximum diameter of at least one hole is 2 mm, and the maximum width of the lead wire may be 5 mm.

The conductive joint may also be located on one end of the lead wire through at least one hole, at least one hole. At least one hole may be a plurality of holes.

Also, the melting point of the first conductive material contained in the conductive joint is lower than the melting point of the second conductive material contained in the lead wire, the melting point of the first conductive material is at least about 200 ° C, and the melting point of the second conductive material is about 1000 Lt; / RTI >

And, the conductive joint may be located on the entire upper surface of the lead wire or on a part of the upper surface.

The solar cell module according to the present invention has a hole in a lead wire for electrically connecting a plurality of solar cells and a junction box so that the bonding force between the junction box and the lead wire is improved and the contact resistance is reduced through the soldering process using holes, The efficiency of the battery can be maximized. Thus, the reliability of the solar cell module can be secured.

1 is a plan view of a solar cell module according to an embodiment of the present invention.
2 is an exploded perspective view of the solar cell panel shown in Fig.
3 is a rear view of the solar cell panel shown in Fig.
4 is an enlarged view of a main part showing the connection structure between the lead wires and the junction box shown in Fig.
5 is a schematic view showing the internal configuration of the junction box shown in Fig.
6A and 6B are perspective views for showing a state before the junction box and the lead wire shown in Fig. 5 are connected to each other.
7A and 7B are perspective views showing a state after connection of the junction box and the lead wire shown in FIG. 5 according to the embodiment of the present invention.
8A and 8B are perspective views showing a state after connection of the junction box and the lead wire shown in FIG. 5 according to another embodiment of the present invention.
Figs. 9A and 9B are detailed sectional views showing the state after connection of the junction box and the lead wire shown in Fig. 5; Fig.
10 is a perspective view of the main part of the solar cell shown in Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

In the drawings, the thickness is enlarged to clearly represent the layers and regions. When a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case directly above another portion but also the case where there is another portion in between. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle. Further, when a certain portion is formed as "whole" on another portion, it means not only that it is formed on the entire surface of the other portion but also that it is not formed on the edge portion.

Hereinafter, the front surface may be one surface of the semiconductor substrate to which the direct light is incident, and the rear surface may be the opposite surface of the semiconductor substrate in which direct light is not incident, or reflected light other than direct light may be incident.

In the following description, the meaning of two different components having the same length or width means that they are equal to each other within an error range of 10%.

Embodiments of the present invention will now be described with reference to the accompanying drawings.

FIG. 1 is a plan view of a solar cell module according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view of the solar cell panel shown in FIG. 1, FIG. 3 is a rear view of the solar cell panel shown in FIG. 1 And FIG. 10 is a perspective view of the main part of the solar cell shown in FIG.

Referring to the drawings, a solar cell module 100 according to an embodiment of the present invention may include a solar cell panel 200.

The solar cell panel 200 includes a plurality of solar cells 210, an interconnector 220 for electrically connecting the adjacent solar cells 210, a protective film (EVA: Ethylene Vinyl Acetate) for protecting the solar cells 210 A transparent member 240 disposed on the protective film 230 toward the light receiving surface of the solar cells 210 and an opaque back sheet 250 disposed on the lower side of the protective film 230 opposite to the light receiving surface. ).

The solar cell module 100 may include a frame 400 for receiving the components integrated by the lamination process and a junction box 300 for collecting power generated from the solar cells 210 .

The rear sheet 250 protects the solar cell 210 from the external environment by preventing moisture from penetrating the rear surface of the solar cell module 100. Such a backsheet 250 may have a multi-layer structure such as a layer preventing moisture and oxygen penetration, a layer preventing chemical corrosion, and a layer having an insulating property.

The protective film 230 is integrated with the solar cells 210 by a lamination process in a state in which the protection films 230 are disposed on the upper and lower portions of the solar cells 210 to prevent corrosion due to moisture penetration, . The protective film 230 may be made of a material such as ethylene vinyl acetate (EVA).

The transparent member 240 positioned on the protective film 230 is made of tempered glass or the like having a high transmittance and excellent breakage prevention function. At this time, the tempered glass may be a low iron tempered glass having a low iron content. The transparent member 240 may be embossed on the inner side to enhance the light scattering effect.

10, the solar cell 210 provided in the solar cell panel 200 of the present embodiment includes a substrate 211, an emitter 212 positioned on the light-receiving surface of the substrate 211 on which light is incident, A plurality of first electrodes 213 located on the emitter section 212, at least one first collector section 214 located on the emitter section 212 in a direction intersecting the first electrode 213, The antireflection film 215 located on the emitter section 212 where the electrode 213 and the first current collector 214 are not located, the second electrode 216 and the second current collector section 216 located on the opposite side of the light- 217).

The solar cell 210 may further include a back surface field (BSF) portion formed between the second electrode 216 and the substrate 211. The rear electric field portion is a region in which impurities of the same conductivity type as that of the substrate 211 are doped at a higher concentration than the substrate 211, for example, a p + region.

This rear surface electric field portion acts as a potential barrier at the rear surface of the substrate 211. [ Therefore, the efficiency of the solar cell can be improved because the recombination of electrons and holes at the rear side of the substrate 211 and the disappearance thereof are reduced.

The substrate 211 is a semiconductor substrate made of silicon of the first conductivity type, for example, p-type conductivity type. The silicon may be monocrystalline silicon, polycrystalline silicon or amorphous silicon. When the substrate 211 has a p-type conductivity type, it contains an impurity of a trivalent element such as boron (B), gallium (Ga), indium (In), or the like.

The substrate 211 may be textured to form the surface of the substrate 211 as a texturing surface. When the surface of the substrate 211 is formed as a textured surface, the light reflection on the light receiving surface of the substrate 211 is reduced, and the incidence and reflection operations are performed on the textured surface, so that light is trapped inside the solar cell, . Therefore, the efficiency of the solar cell 110 is improved.

The emitter portion 212 is a region doped with an impurity having a second conductivity type opposite to the conductivity type of the substrate 211, for example, an n-type conductivity type. The substrate 211 and the pn Junction. When the emitter section 212 has an n-type conductivity type, the emitter section 212 dopes an impurity of a pentavalent element such as phosphorus (P), arsenic (As), antimony (Sb) .

Accordingly, when electrons in the semiconductor are energized by the light incident on the substrate 211, the electrons move toward the n-type semiconductor and the holes move toward the p-type semiconductor. Therefore, when the substrate 211 is p-type and the emitter portion 212 is n-type, the separated holes move toward the substrate 211, and the separated electrons move toward the emitter portion 212.

Conversely, the substrate 211 may be of the n-type conductivity type and may be made of a semiconductor material other than silicon. When the substrate 211 has an n-type conductivity type, the substrate 211 may contain impurities of pentavalent elements such as phosphorus (P), arsenic (As), antimony (Sb)

The emitter portion 212 forms a p-n junction with the substrate 11, so that when the substrate 211 has an n-type conductivity type, the emitter portion 212 has a p-type conductivity type. In this case, the separated electrons move toward the substrate 211, and the separated holes move toward the emitter 212.

When the emitter section 212 has a p-type conductivity type, the emitter section 212 dopes an impurity of a trivalent element such as boron (B), gallium (Ga), indium (In) .

An antireflection film 215 made of at least one material selected from the group consisting of silicon nitride (SiNx), silicon oxide (SiO ₂ ), and titanium dioxide (TiO ₂ ) is formed on the emitter 212 of the substrate 211. The antireflection film 215 reduces the reflectivity of light incident on the solar cell 210 and increases the selectivity of a specific wavelength region to increase the efficiency of the solar cell 210. The antireflection film 215 may have a thickness of about 70 nm to 80 nm and may be omitted if necessary.

The plurality of first electrodes 213 may be formed on the emitter layer 212 and electrically connected to the emitter layer 212 to be spaced apart from the adjacent first electrodes 213 . Each of the first electrodes 213 may collect electrons, for example, electrons, which have migrated toward the emitter section 212, and may transfer the collected electrons to the first current collector 214.

The plurality of first electrodes 213 may be formed of at least one conductive material such as Ni, Cu, Ag, Al, Sn, Zn ), Indium (In), titanium (Ti), gold (Au), and combinations thereof, but may be made of other conductive metal materials.

A plurality of first current collectors 214 may be disposed on the emitter layer 212. A first current collector 214, also referred to as a bus bar, is formed in a direction crossing the first electrode 213. Accordingly, the first electrode 213 and the first current collector 214 may be disposed to cross the emitter layer 212.

The first current collector 214 may be formed of at least one conductive material and may be connected to the emitter 212 and the first electrode 213. Therefore, the first current collector 214 can output a charge, for example, electrons, transmitted from the first electrode 213 to an external device.

The conductive metal material constituting the first current collector 214 may be at least one selected from the group consisting of Ni, Cu, Ag, Al, Sn, Zn, (Ti), gold (Au), and combinations thereof, but may be made of other conductive metal materials. In this embodiment, the plurality of first current collectors 214 includes the same material as the first electrode 213, but may include a material different from that of the first electrode 213.

The first electrode 213 and the first current collector 214 are formed by applying a conductive metal material on the antireflection film 215 and then patterning the conductive metal material. In the process of firing the conductive metal material, the etchant, And may be electrically connected to the emitter section 212 as the antireflection film is etched by a glass frit.

The second electrode 216 is formed on the opposite side of the light-receiving surface of the substrate 211, that is, on the rear surface of the substrate 211, and collects charge, for example, holes moving toward the substrate 211.

The second electrode 216 is made of at least one conductive material. The conductive material may be at least one selected from the group consisting of Ni, Cu, Ag, Al, Sn, Zn, In, Ti, Au, And combinations thereof, but may be made of other conductive materials.

A plurality of second current collectors 217 are located on the same plane as the second electrode 216. The second current collector 217 is formed in a direction intersecting the first electrode 213, that is, in a direction parallel to the first current collector 214.

The second current collector 217 is made of at least one conductive material and is electrically connected to the second electrode 216. Accordingly, the second current collector 217 outputs a charge, for example, a hole, transmitted from the second electrode 216 to an external device.

The conductive metal material constituting the second current collector 217 may be at least one selected from the group consisting of Ni, Cu, Ag, Al, Sn, Zn, (Ti), gold (Au), and combinations thereof, but may be made of other conductive metal materials.

Hereinafter, the electrical connection structure of the solar cell panel 200 will be described in detail.

The solar cell panel 200 includes a first region A1 in which a plurality of solar cells 210 are located and a second region A2 located in a rim of the first region A1 and a first region A1 A plurality of solar cells 210 are arranged in a plurality of strings.

Here, the string refers to a minimum series group in which a plurality of solar cells 210 are arranged in a line and are electrically connected.

Accordingly, the solar cell module 100 shown in Figs. 1 and 3 may have six strings, for example, first to sixth strings S1 to S6.

Hereinafter, the strings S1 and S6 spaced apart from each other by a predetermined distance and located on both sides of the solar cell panel 200 are referred to as a first outer string S1 and a second outer string S6, The strings S2 to S5 located between the string S1 and the second external string S6 are referred to as a first internal string S2, a second internal string S3, a third internal string S4, 4 Internal string (S5).

The plurality of solar cells 210 arranged in the strings S1 to S6 may be electrically connected by the interconnector 220. [

More specifically, a first current collecting portion (see Fig. 10, 214) of any one of a plurality of solar cells 210 arranged adjacent to each other longitudinally in one string, for example, the first external string S1 May be electrically connected to the second current collecting part (see FIG. 10, 217) of the adjacent solar cell by the interconnector 220a.

The inter connecter 220a located on the lower side of the first outer string S1 is connected to the inter connector 220b located on the lower side of the first inner string S2 by the other inter connecter 222, The inter connecter 220c located below the inner string S3 is connected to the inter connector 220d located below the third inner string S4 by the inter connector 222 and the fourth inner string S5 The inter connecter 220e located at the lower side of the second outer string S6 may be connected to the inter connecter 220f located below the second outer string S6 by the inter connector 222. [

Lead wires (LW) may be connected to the interconnectors 220a, 220b, 220c, 220d, 220c, and 220f positioned on the upper side of the strings S1 to S6.

The lead wire connected to the interconnector 220a located on the upper side of the first outer string S1 is referred to as a first lead wire LW1 and the interconnector 220f located on the upper side of the second outer string S6, Is referred to as a second lead wire (LW2).

The leads connected to the interconnectors 220b and 220c of the first internal string S2 and the second internal string S3 are referred to as a third lead LW3 and the third internal string S4 and the fourth internal string S4, And the lead wire connected to the interconnectors 220d and 220e in the step S5 is referred to as a fourth lead wire LW4.

According to an aspect of the present invention, the first lead wire to the fourth lead wire LW1 to LW4 are located in the second area A2 of the solar cell panel and include an ICP (interconnector connection part) , And a junction box connection part, respectively.

The first to fourth lead lines LW1 to LW4 do not overlap each other and the interconnecting connection portions ICP of the first to fourth lead lines LW1 to LW4 intersect with the plurality of strings S1 to S6, Respectively, that is, in directions intersecting with the interconnectors 220a-220f.

Therefore, since it is not necessary to use an insulating tube or an insulating film for insulating the lead wires LW1 to LW4 from the solar cells, the reliability of the insulating tube or the insulating film can be prevented from deteriorating.

The lead wires LW1 to LW4 are made of at least one conductive material and may be formed of at least one selected from the group consisting of Ni, Cu, Ag, Al, Sn, (Zn), indium (In), titanium (Ti), gold (Au), lead (Pb) and combinations thereof but may be made of other conductive metal materials. In this embodiment, the lead wires LW1 to LW4 are made of a conductive material having a tin (Sn) content of about 60 wt%, a lead (Pb) content of about 40 wt% and a melting point of about 229 DEG C, ) Of about 99.9% by weight and a melting point of about 1083 ° C.

Meanwhile, each of the first through fourth lead wires LW1 through LW4 may include one junction box junction (JCP). The junction box junctions JCP of the first to fourth lead lines LW1 to LW4 are arranged in a direction parallel to the interconnectors 220a to 220f and in a direction intersecting the interconnectors 220a to 220f And < / RTI > The junction box junctions JCP of the first lead wire to the fourth lead wire LW1 to LW4 according to such a configuration may be formed in a stepped shape.

Hereinafter, a connection structure between the lead wires LW1 to LW4 and the junction box 300 will be described.

FIG. 4 is an enlarged view of a main part showing the connection structure between the lead wires and the junction box shown in FIG. 3, and FIG. 5 is a schematic view showing the internal structure of the junction box shown in FIG.

One junction box 300 may be located in the second area A2 of the solar panel 200 on the rear surface of the rear sheet.

The junction box 300 is located midway between the first outer string S1 and the first inner string S2. At this time, the junction box 300 may include a plurality of terminal boards 310 connected to three bypass diodes BD.

The junction connector ICP of the first lead wire LW1 connects the inter connecter 220a of the first external string S1 and the junction box connector JCP connected to the inter connector connector ICP is connected to the junction box And is connected to one terminal of the terminal plate 310 provided in the connector 300.

Likewise, the interconnector ICP of the second lead LW2 connects the interconnector 220f provided in the second external string S6 and the junction box connector JCP connected to the interconnector ICP, May be connected to one terminal of the terminal plate 310 provided in the junction box 300. [

The interconnection ICP of the third lead LW3 connects the first internal string S2 and the inter connectors 220b and 220c provided in the second internal string S3, And the junction box connection unit JCP may be connected to one terminal of the terminal plate 310 provided in the junction box 300. [

Likewise, the interconnecting connector ICP of the fourth lead LW4 connects the interconnects 220d and 220e provided in the third internal string S4 and the fourth internal string S5, (JCP) connected to the junction box (ICP) may be connected to one terminal of a terminal plate (310) provided in the junction box (300).

Thus, in the junction box 300, a first current, e.g., a positive current, may be collected and a second current, e.g., a negative current, may be collected.

Accordingly, a cable CB is connected to one terminal of the terminal board 310, and each cable CB can be electrically connected to a cable of a neighboring solar cell module.

Hereinafter, the electrical connection structure and connection method of the lead wire LW and the junction box 300 will be described in detail.

FIGS. 6A and 6B are perspective views showing a state before the connection of the junction box and the lead wire shown in FIG. 5 according to the embodiment of the present invention, and FIGS. 7A and 7B are cross- 8A and 8B are perspective views showing a state after connection of the junction box and the lead wire shown in FIG. 5 according to another embodiment of the present invention. FIG. 8A and FIG. 8B are perspective views showing a state after connection of a junction box and lead wires.

6A, the junction box 300 may include an electrode portion 311 connected to one end of the interconnector 220, that is, the lead wire LW.

Thus, the lead wire LW and the electrode portion 311 can be electrically and physically connected through the conductive joint portion 51. At this time, the lead wire LW may include at least one hole H.

In this embodiment, the width of the lead wire LW may be formed larger than the diameter of the hole H. [ For example, the maximum width W2 of the lead wire LW may be about 5 mm, and the maximum diameter W1 of the hole H may be about 2 mm.

In the present embodiment, the holes H are formed in a single number, but the present invention is not limited thereto. As shown in FIGS. 8A and 8B, a plurality of holes H may be formed.

7A and 7B, the conductive joint portion 51 is electrically connected to the first conductive joint portion 510 located between the lead wire LW and the electrode portion 311 and the hole H of the lead wire LW And a second conductive bonding portion 512 that is covered and positioned on the top of the lead wire LW. At this time, the second conductive connection part 512 may be located on the entire upper surface or a part of the surface of the lead wire LW.

At this time, the conductive joints 51 may be made of the same conductive material or different materials as the lead wires LW. For example, the conductive joint 51 may be made of a conductive material having a tin (Sn) content of about 99.3 wt%, a copper (Cu) content of about 0.7 wt% and a melting point of about 229 DEG C, LW) has a content of tin (Sn) of about 60 wt%, a content of lead (Pb) of about 40 wt% and a melting point of about 229 DEG C or copper (Cu) of about 99.9 wt% Lt; RTI ID = 0.0 > 1083 C. < / RTI >

On the other hand, the melting point of the conductive material contained in the conductive joint portion 51 may be higher than the melting point of the conductive material contained in the lead wire LW. This is because the lead wire LW is not melted and only the metal solder 50 is melted by the heat applied when performing the soldering process to connect the lead wire LW and the electrode portion 311 to form the lead wire LW and the electrode portion 311 and the hole H of the lead wire LW so that the conductive joint portion 51 can be located on the lead wire LW.

The hole H of the lead wire LW is positioned on the upper surface of the lead wire LW and the electrode portion 311 and the lead wire LW so that the lead wire LW and the electrode portion 311 are electrically connected, And the contact resistance can be reduced. Thus, the efficiency of the solar cell module 100 can be increased.

Conventionally, the solder located on the electrode portion of the junction box is melted and directly heated to the lead wire to electrically connect the lead wire to the junction box. That is, by directly heating the lead wire to connect the lead wire and the electrode portion, the lead wire and the electrode portion can be electrically and physically connected by melting the solder located on the electrode portion. Accordingly, it is difficult to transfer heat to the solder by directly heating the upper portion of the lead wire in order to transmit heat to the solder located on the electrode portion, so that the solder is not melted smoothly and the bonding force between the lead wire and the electrode portion is somewhat reduced Problems could arise. Moreover, since the molten solder can be positioned only between the lead wire and the electrode portion, the bonding force between the lead wire and the electrode portion can be further reduced.

However, since the lead wire LW includes at least one hole H as in the present embodiment, the solder 50 positioned between the lead wire LW and the electrode portion 311 through the at least one hole H, The solder 50 can be easily melted without heat transfer hindrance to increase the bonding force between the lead wire LW and the electrode portion 311. [ The solder 50 melted through the at least one hole H of the lead wire LW is located on the entire upper surface or a part of the upper surface of the lead wire LW so that the distance between the lead wire LW and the electrode portion 311 The bonding force can be further improved.

The conductive bonding portion 51 described above can be formed by a soldering process.

6A and 6B, the metal solder 50 is coated on the electrode portion 311 to electrically connect the interconnector 220 and the junction box 300, and the metal solder 50 is coated on the electrode portion 311, The lead wire LW having the hole H can be positioned thereon.

At this time, the metal solder 50 is a conductive material having a melting point of about 200 ° C or higher and can be made into a solid state. (Au), or a combination of these materials, for example, nickel (Ni), copper (Cu), silver (Ag), aluminum (Al), tin (Sn), zinc (Zn), indium And may be made of a conductive material.

The lead wire LW is a conductive material having a melting point of about 1000 ° C or higher and is made of at least one selected from the group consisting of Ni, Cu, Ag, Al, Sn, Zn, ), Titanium (Ti), gold (Au), lead (Pb), and combinations thereof.

In this embodiment, the metal solder 50 may have a tin (Sn) content of about 99.3 wt%, a copper (Cu) content of about 0.7 wt% and a melting point of about 229 DEG C, The conductive material or copper (Cu) having a tin (Sn) content of about 60 wt%, a lead (Pb) content of about 40 wt% and a melting point of about 229 DEG C is about 99.9 wt% Lt; 0 > C.

Next, as shown in FIGS. 7A and 7B, the metal solder 50 is heat-treated at 360 by using a soldering iron (not shown) and melted to form the conductive joint portion 51.

The conductive bonding portion 51 may include a conductive bonding portion 51 located between the lead wire LW and the electrode portion 311 and over the lead wire LW through the hole H of the lead wire LW. At this time, the second conductive connection part 512 may be located on the entire upper surface or a part of the surface of the lead wire LW.

As described above, the holes H of the lead wire LW may be formed in a plurality of holes H, as shown in FIGS. 8A and 8B.

The conductive joint portion 51a is covered on the upper portion of the lead wire LW through the first conductive joint portion 510a located between the lead wire LW and the electrode portion 311 and the plurality of holes H of the lead wire LW And a second conductive connection 512a positioned therein. At this time, the second conductive connection part 512a may be located on the entire upper surface or a part of the surface of the lead wire LW.

Since the plurality of holes H are formed in this manner, the coupling force between the junction box 300 and the lead wire LW can be further improved as compared with when the holes H are formed by one hole H. Accordingly, the contact resistance between the junction box 300 and the lead wire LW is reduced, thereby maximizing the efficiency of the solar cell.

In this embodiment, the conductive joint portion 51 can be formed by a soldering process using a soldering iron (not shown). However, the present invention is not limited to this and can be performed by a soldering process using another heat generator.

At this time, the melting point of the conductive material contained in the metal solder 50 is set to be higher than the melting point of the conductive material contained in the lead wire LW so that the metal solder 50 is melted by the soldering iron and the lead wire LW is not melted by the soldering iron Can be high.

Hereinafter, the connection state of the junction box 300 and the lead wire LW will be described in detail.

The specific configuration of the terminal board 310 is shown in more detail in Figs. 9A and 9B.

9A and 9B, the terminal plate 310 includes an electrode portion 311 and a lead wire connecting portion 312 to which the lead wire LW of the solar cell module 100 is connected, a diode connected to the diode BD, A connection portion 313, and an external cable connection portion 314 to which the cable CB is connected.

The electrode portion 311 may be formed to accommodate the width of the lead wire LW.

The lead wire connecting portion 312 is formed along the longitudinal direction of the lead wire LW and can have elasticity so that the lead wire LW can be smoothly connected.

The diode connection portion 313 is formed along the longitudinal direction of the terminal plate 310 and may include a groove to which the diode DB is connected.

The external cable connection part 314 is formed with a nut hole into which a fastening bolt (not shown) can be inserted, and can connect the cable CB through the nut hole.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

100: solar cell module 200: solar cell panel
210: solar cell 220: interconnect connector
230: protective film 240: transparent member
250: rear sheet 260: insulating film
300: junction box 310: terminal board
400: frame BD: bypass diode
LW1-LW4: first-fourth lead wire 50: metal solder
51: Conductive joint

Claims (21)

A solar cell panel comprising: a plurality of strings formed by electrically connecting a plurality of solar cells arranged in a first direction;
An interconnect for electrically connecting a plurality of solar cells within each string; And
A junction box for collecting power generated in the plurality of solar cells;
A lead wire electrically connecting one end of the interconnector to an electrode of the junction box;
And a conductive joint portion positioned between the lead wire and the electrode portion,
One end of the lead wire contacting the conductive joint has at least one hole,
The conductive joint fills the interior of the at least one hole and covers the entire upper surface of the lead wire,
And the maximum diameter of the at least one hole is 2 mm. delete delete The method according to claim 1,
Wherein the at least one hole has a plurality of holes. The method according to claim 1,
And the maximum width of the lead wire is 5 mm. delete delete delete The method according to claim 1,
Wherein the conductive joint and the lead wire are made of the same material. 10. The method of claim 9,
Wherein a melting point of the first conductive material contained in the conductive joint is lower than a melting point of the second conductive material contained in the lead wire. 11. The method of claim 10,
Wherein the first conductive material has a melting point of 200 ° C or higher. 11. The method of claim 10,
And the second conductive material has a melting point of 1000 ° C or higher. The method according to claim 1,
Wherein the conductive connection portion and the lead wire are made of a conductive material different from each other. 14. The method of claim 13,
Wherein a melting point of the first conductive material contained in the conductive joint is lower than a melting point of the second conductive material contained in the lead wire. 15. The method of claim 14,
Wherein the first conductive material has a melting point of 200 ° C or higher. 15. The method of claim 14,
And the second conductive material has a melting point of 1000 ° C or higher. The method according to claim 1,
The lead wire
A first lead wire electrically connecting the junction box of the first external solar cell located at one end of the string to the junction box,
A second lead wire electrically connecting the junction box of the second external solar cell located at the other end of the string to the junction box,
A third lead line for electrically connecting the junction box of the first internal solar cell located at the center of the string with the junction box,
And a fourth lead wire electrically connecting the junction box of the second internal solar cell located at the center of the string with the junction box. 18. The method of claim 17,
Wherein the first to fourth leads are not overlapped with each other. 18. The method of claim 17,
Wherein the first through fourth lead wires extend in a second direction intersecting with the first direction and a junction box connecting portion connected to the inter connector connecting portion and extending in the first direction. The method according to claim 1,
Wherein the solar cell panel includes a first region where the plurality of strings are located and a second region located at a rim of the first region. 21. The method of claim 20,
And the junction box is located in the second region.

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