KR102003698B1 - A integrated circuit(ic), adpative power supply using ic characteristics and adpative power supply method according to ic characteristics, electric equipment having the same, and manufacturing method of ic - Google Patents

A integrated circuit(ic), adpative power supply using ic characteristics and adpative power supply method according to ic characteristics, electric equipment having the same, and manufacturing method of ic Download PDF

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KR102003698B1
KR102003698B1 KR1020120072167A KR20120072167A KR102003698B1 KR 102003698 B1 KR102003698 B1 KR 102003698B1 KR 1020120072167 A KR1020120072167 A KR 1020120072167A KR 20120072167 A KR20120072167 A KR 20120072167A KR 102003698 B1 KR102003698 B1 KR 102003698B1
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South Korea
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semiconductor integrated
integrated circuit
power supply
power
slew rate
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KR1020120072167A
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Korean (ko)
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KR20130076683A (en
Inventor
원강영
한제희
손태용
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삼성전자 주식회사
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Priority to EP12195555.3A priority Critical patent/EP2610704A3/en
Priority to US13/711,876 priority patent/US9513649B2/en
Priority to CN201210585175.4A priority patent/CN103199856B/en
Publication of KR20130076683A publication Critical patent/KR20130076683A/en
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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/14Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/147Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2207/00Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store
    • G11C2207/22Control and timing of internal memory operations
    • G11C2207/2227Standby or low power modes
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03LAUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L7/00Automatic control of frequency or phase; Synchronisation
    • H03L7/06Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
    • H03L7/08Details of the phase-locked loop

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Power Sources (AREA)

Abstract

The present invention provides an adaptive power supply for a semiconductor integrated circuit, comprising: a power input unit receiving power from an external power supply unit; A core driven by the power input through the power input unit; And determining a characteristic of the core and controlling the power supply unit to supply the power according to the determined characteristic.

Description

Adaptive power supply and power supply method according to semiconductor integrated circuit, semiconductor integrated circuit characteristics, manufacturing method of electronic device and semiconductor integrated circuit including them METHOD ACCORDING TO IC CHARACTERISTICS, ELECTRIC EQUIPMENT HAVING THE SAME, AND MANUFACTURING METHOD OF IC}

The present invention provides a semiconductor integrated circuit that can be supplied with an optimized power supply according to the characteristics of the semiconductor integrated circuit, an adaptive power supply device and a power supply method capable of supplying an optimized power to the semiconductor integrated circuit, and a power supply optimized for the semiconductor integrated circuit. The present invention relates to an electronic device including an adaptive power supply capable of supplying an electronic device, and a method of manufacturing a semiconductor integrated circuit.

Conventional semiconductor integrated circuit (IC) power supplies only supply a fixed power source as guaranteed in the specification, as shown in FIG. However, even in the case of the semiconductor chips within the specification, the chips corresponding to each characteristic corner may have low VCC margin or excessive power consumption and heat generation depending on the characteristics of the semiconductor chips. Additional circuitry and countermeasures may be needed to compensate for this.

In addition, in the case of changing to another semiconductor integrated circuit having a similar power supply specification rather than the same semiconductor integrated circuit, it is necessary to modify the power supply circuit due to the characteristic difference. In particular, even if a main board including a power supply is not changed and only a board separately configured by a function upgrade or the like is needed, a circuit change of the main board power supply may be necessary.

In semiconductor integrated circuits, dispersion occurs depending on the wafer and the process. 2 is a graph showing the distribution of each semiconductor wafer and its specification range.

The power supply specifications are determined tightly in consideration of the margins caused by scattering of wafers and processes due to semiconductor characteristics. Therefore, this tight power supply specification can result in a large number of chips in the process resulting in reduced yield.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described problems, and to provide a power supply method for identifying characteristics of semiconductor integrated circuits used in a TV system and supplying power optimized for each characteristic to the semiconductor integrated circuits. .

Another object of the present invention is to increase the manufacturing yield of semiconductor integrated circuits by minimizing the overall power consumption and heat dissipation and freeing the power specifications of the semiconductor integrated circuits by adaptively supplying power in a direction that complements the characteristics of semiconductor integrated circuits. Is in.

It is still another object of the present invention to apply a system for changing a semiconductor integrated circuit, a system for changing a module including a semiconductor integrated circuit, or the like to change characteristics of the same semiconductor integrated circuit as well as a semiconductor integrated circuit having a power supply specification of a similar area. The present invention provides a semiconductor integrated circuit capable of adaptively changing a power supply even when a circuit is changed, and compatibility according to a module change.

Another object of the present invention is to store a characteristic index value according to the characteristics of the semiconductor integrated circuit, a semiconductor integrated circuit, a method of manufacturing a semiconductor integrated circuit, an electronic device and a semiconductor integrated circuit which can be adaptively supplied with a power according to the chip characteristics It is an object to provide a driving method.

According to an aspect of the present invention, there is provided a semiconductor integrated circuit, comprising: a power input unit receiving power from an external power supply unit; A core driven by the power input through the power input unit; And a controller which determines a characteristic of the core and controls the power supply unit to supply the power according to the determined characteristic.

The semiconductor integrated circuit further includes a phase locked loop (PLL) unit, and the controller determines the characteristics of the core by analyzing a phase locked loop of the phase locked loop (PLL) unit. Do.

In the semiconductor integrated circuit, the characteristic is preferably determined by a PLL rising / falling slew rate.

In the semiconductor integrated circuit, the characteristic may include a first characteristic NN when the PLL rising / falling slew rate falls within a predetermined range, and a second characteristic FF when the phase fixed loop falls below the predetermined range. When the predetermined range is exceeded, it is preferable to include the third (SS) characteristic.

In the semiconductor integrated circuit, when the characteristic is determined as the second characteristic FF, the controller may supply power lower than the reference power.

In the semiconductor integrated circuit, when the characteristic is determined to be the third characteristic SS, the controller may supply power higher than the reference power.

In the semiconductor integrated circuit, the lowered power source is preferably included within the specification range of the semiconductor integrated circuit.

In the semiconductor integrated circuit, the elevated power supply is preferably included within the specification range of the semiconductor integrated circuit.

The semiconductor integrated circuit may further include a storage unit configured to store chip specific information including an index value of the core characteristic.

In the semiconductor integrated circuit, the controller may control the power supply unit to supply power corresponding to the index value of the core characteristic.

In the semiconductor integrated circuit, the index value is preferably an index value classified according to the magnitude of the leakage current measurement value of the transistor in the core.

The semiconductor integrated circuit may further include at least two output ports connected to the power supply device.

In the semiconductor integrated circuit, the controller may transmit a control signal according to the characteristics of the core to the power supply device through the output port.

In the semiconductor integrated circuit, the output port may include an output port for outputting whether the semiconductor integrated circuit state is normal.

In the semiconductor integrated circuit, it is preferable that the normal state of the semiconductor integrated circuit is output as 'high (H)' and 'low (L)'.

In the semiconductor integrated circuit, whether the state of the semiconductor integrated circuit is normal is output as one of 'high' and 'low' and 'cyclically high' and 'low'. It is desirable to be.

The semiconductor integrated circuit may further include a second controller configured to check periodic fluctuation values of the 'high (H)' and the 'low (L)'.

In the semiconductor integrated circuit, in the abnormal state as a result of the check, it is preferable to restart the power of the semiconductor integrated circuit by turning the power from 'OFF' to 'ON'.

In the semiconductor integrated circuit, the restarted semiconductor integrated circuit preferably operates a boot program based on information stored in an internal storage unit.

A power supply apparatus for a semiconductor integrated circuit according to an embodiment of the present invention, the power supply unit for supplying power to the semiconductor integrated circuit; And a control unit controlling the power supply unit according to the characteristics of the semiconductor integrated circuit.

In the power supply device, the control unit may determine a characteristic of the semiconductor integrated circuit by analyzing a phase locked loop of a phase locked loop (PLL) portion of the semiconductor integrated circuit.

In the power supply, the characteristic may be determined by a PLL rising / falling slew rate.

In the power supply device, the characteristic may include a first characteristic NN when the PLL rising / falling slew rate falls within a predetermined predetermined range, and a second characteristic FF when less than the predetermined range. When the predetermined range is exceeded, it is preferable to include the third (SS) characteristic.

In the power supply device, when the characteristic is determined as the second characteristic FF, the controller may supply power lower than the reference power.

In the power supply device, when the characteristic is determined as the third characteristic SS, the controller may supply power higher than the reference power.

In the power supply device, the lowered power supply is preferably included in the specification range of the semiconductor integrated circuit.

In the power supply device, the elevated power is preferably included within the specification range of the semiconductor integrated circuit.

In the power supply device, the control unit may control the power supply unit to supply power corresponding to chip specific information including an index value of a core characteristic of the semiconductor integrated circuit.

The power supply device may further include an input port for inputting characteristic information of the semiconductor integrated circuit.

In the power supply device, the controller may control the power supply device based on input characteristic information of the semiconductor integrated circuit.

In the power supply device, the input port preferably includes an input port for inputting whether the semiconductor integrated circuit state is normal.

It is preferable that the normal state of the semiconductor integrated circuit is output as 'high' and 'low'.

In the power supply, the state of the semiconductor integrated circuit state is output as one of 'high (H)' and 'low (L)' and a periodic variation value of 'high (H)' and 'low (L)'. It is desirable to be.

The power supply device may further include a second control unit which checks periodic fluctuation values of the 'high' and 'low'.

In the power supply device, when the check result is in an abnormal state, the power of the semiconductor integrated circuit may be restarted by turning the power from the “OFF” to the “ON”.

In the power supply device, the restarted semiconductor integrated circuit preferably operates a boot program based on information stored in an internal storage unit.

According to an embodiment of the present invention, a power supply method of a semiconductor integrated circuit may include supplying reference power to the semiconductor integrated circuit; Determining characteristics of the semiconductor integrated circuit according to the power source; The method may include controlling the power supply unit to supply power according to the determined characteristics of the semiconductor integrated circuit.

The power supply method may further include determining a characteristic of the semiconductor integrated circuit by analyzing a phase locked loop of a phase locked loop (PLL).

In the power supply method, the characteristic is preferably determined by a PLL rising / falling slew rate.

In the power supply method, the characteristic is a first characteristic (NN) when the PLL rising / falling slew rate falls within a predetermined range, and the second characteristic (FF) when it is less than the predetermined range. When the predetermined range is exceeded, it is preferable to include the third (SS) characteristic.

In the power supply method, when the characteristic is determined as the second characteristic FF, the power supply unit may supply power lower than the reference power.

In the power supply method, when the characteristic is determined to be the third characteristic SS, the power supply unit may supply power higher than the reference power.

In the power supply method, the lowered power is preferably included in the specification range of the semiconductor integrated circuit.

In the power supply method, the elevated power is preferably included in the specification range of the semiconductor integrated circuit.

The power supply method may further include storing chip specific information including an index value of a core characteristic of the semiconductor integrated circuit in a storage unit of the semiconductor integrated circuit.

In the power supply method, preferably, the controlling step includes controlling the power supply unit to supply power corresponding to the index value of the core characteristic.

In the power supply method, the index value is preferably an index value classified according to the magnitude of the leakage current measurement value of the transistor in the core.

In the power supply method, it is preferable to include the step of outputting a control signal for controlling the power supply in accordance with the core characteristics of the semiconductor integrated circuit.

In the power supply method, it is preferable that the step of outputting whether the internal operating state of the semiconductor integrated circuit.

In the power supply method, the normal part may be output as 'high (H)' and 'low (L)'.

In the power supply method, the normal state may be output as one of 'high (H)' and 'low (L) and a periodic variation value of' high (H) 'and' low (L) '.

In the power supply method, the method may further include checking a periodic variation value of the 'high' and the 'low'.

In the power supply method, it is preferable to restart the power source of the semiconductor integrated circuit from 'off' to 'on' in the abnormal state as a result of the check.

In the power supply method, it is preferable that the restarted semiconductor integrated circuit operates a booting program based on information stored in an internal storage unit.

An electronic device including a semiconductor integrated circuit and a power supply device according to an exemplary embodiment of the present invention preferably includes the semiconductor integrated circuit of claim 1.

Electronic device including a semiconductor integrated circuit and a power supply device according to another embodiment of the present invention preferably comprises the power supply device of claim 18 to 32.

A method of manufacturing a semiconductor integrated circuit according to an embodiment of the present invention includes measuring a leakage current value of a core of the semiconductor integrated circuit; Generating unique information including a characteristic index value corresponding to the measured leakage current value; And storing the unique information in the semiconductor integrated circuit.

Power supply of the semiconductor integrated circuit according to the present invention can stabilize the platform (Patform) and reduce the cost by adaptively supplying a more efficient and optimized power according to the characteristics of the semiconductor integrated circuit applied to the TV system.

In addition, it is possible to provide an optimal power supply for the changed characteristics of the semiconductor integrated circuit in a platform in which a separate module receiving the corresponding power is supplied or a semiconductor integrated circuit unit is changed.

In addition, by identifying the characteristics of the semiconductor integrated circuit and adaptively supplying power, the power specification can be set more freely, thereby increasing the semiconductor process yield.

1 is a block diagram showing a power supply apparatus of a conventional semiconductor integrated circuit;
FIG. 2 is a graph showing wafer-specific dispersion and spec range according to the semiconductor integrated circuit; FIG.
3 is a block diagram showing a display device that can be upgraded to improve functionality and performance;
4 is a block diagram showing a configuration of a semiconductor integrated circuit according to an embodiment of the present invention;
5 is a diagram illustrating an example of semiconductor integrated circuit characteristics according to PLL slow rate analysis;
6 is a block diagram showing a configuration of a power supply device of a semiconductor integrated circuit according to an embodiment of the present invention; and
7 is a block diagram showing a configuration of a power supply device for a semiconductor integrated circuit according to another embodiment of the present invention;
8 is a block diagram showing a configuration of a semiconductor integrated circuit according to another embodiment of the present invention;
9 is a flowchart illustrating a power supply method of a semiconductor integrated circuit according to the present invention;
10 is a flowchart illustrating a method of manufacturing a semiconductor integrated circuit according to the present invention;
11 is a block diagram illustrating a power supply method of a semiconductor integrated circuit according to another embodiment of the present invention; and
12 is a block diagram illustrating a power supply method of a semiconductor integrated circuit according to still another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. For convenience of description, parts not directly related to the present invention are omitted, and like reference numerals designate like elements throughout the specification.

3 is a block diagram illustrating a configuration of a display system 1 capable of hardware / software upgrade as an example of an electronic device including a semiconductor integrated circuit (not shown) and power supply devices 210 and 310 according to the present invention.

As shown in FIG. 3, the display system 1 includes a display apparatus 200 for processing an image signal provided from an external image source 400 in accordance with a signal processing process and displaying the image as an image, and the display apparatus 200. Upgrade apparatus 300 for upgrading the hardware.

In the system 1 of the present embodiment, a description will be given of a case in which the display apparatus 200 is implemented as a TV displaying a broadcast image based on a broadcast signal / broadcast information / broadcast data received from a transmitting device of a broadcast station.

In addition, since the display apparatus 200 is not limited to the type of image that can be displayed, for example, the display apparatus 200 may display a moving image or a still image based on signals / data received from various types of image sources 400. Images such as an image, an application, an on-screen display (OSD), and a graphic user interface (GUI) for controlling various operations may be displayed.

The upgrade apparatus 300 is communicatively connected to the display apparatus 200. The upgrade apparatus 300 may upgrade an existing hardware configuration of the connected display apparatus 200 and process an image signal by the hardware configuration of the upgraded display apparatus 200, thereby displaying an image having a higher quality. have.

The upgrade apparatus 300 may be connected to the display apparatus 200 by wire or wirelessly. The upgrade apparatus 300 may be connected by wire to the display apparatus 200, thereby providing data / information between the upgrade apparatus 300 and the display apparatus 200. Allows signal / power to be sent and received. The upgrade apparatus 300 and the display apparatus 200 each include a connector / terminal configuration (not shown) for physical / electrical connection to each other.

The display apparatus 200 may independently process an image signal received from the outside according to a signal processing process and display the image signal. However, in accordance with the connection of the display apparatus 200 and the upgrade apparatus 300, the hardware / software configuration of the display system 1 which performs the above-described signal processing is upgraded, thereby providing a user with a relatively improved image quality. Can be.

The display apparatus 200 includes a first signal connector 202 to which at least one image source 400 is connected, and a first signal processor to process an image signal received from the image source 400 through the first signal connector 202. A signal processor 220, a display 230 for displaying a video signal processed by the first signal processor 220 as an image, a user input 240 for outputting a predetermined command according to a user's operation, A first power supply unit 210 having a first storage unit 250 for storing unlimited data / information, and at least one power connection unit 212 for supplying power required for the upgrade apparatus 300; The first controller 260 controls the operation of the overall configuration of the display apparatus 200.

The image signal received from the at least one image source 400 is transmitted to the first signal processor 220 through the first signal connector 202.

The first signal processor 220 performs various preset signal processing on the image signal received from the first signal connector 202. The first signal processor 220 outputs an image signal on which the process is performed to the display 230, thereby displaying an image based on the image signal on the display 230.

The display 230 displays an image based on the image signal output from the first signal processor 220.

The user input unit 240 transmits various preset control commands or unlimited information to the first control unit 260 by a user's manipulation and input.

The first storage unit 250 stores unrestricted data under the control of the first controller 260.

The first controller 260 performs a control operation on various components of the display apparatus 200. For example, the first controller 260 may perform a signal processing process processed by the first signal processor 220, transmit / receive signals / information / data through the first signal connector 202, and the user input unit 240. The overall operation of the display apparatus 200 is controlled by performing a corresponding control operation with respect to the command from.

The first power supply device 210 supplies all the power used in the display device 200. The first power supply 210 may include, for example, a CPU core voltage for driving the first controller 260 and the first signal processor 220, a memory voltage for driving the first storage unit 250, An input / output (I / O) voltage for driving the user input device 240, a driving voltage for driving the display unit 230 and a speaker (not shown), and a voltage for driving other peripheral devices are generated. The first power supply 210 may include a switched-mode power supply (SMPS) or a DC-DC converter.

The first power supply device 210 according to the embodiment of the present invention includes at least one power connection unit 212 for outputting a DC voltage to supply power to the upgrade apparatus 300.

According to the present exemplary embodiment, the upgrade apparatus 300, which is provided to upgrade the display apparatus 200, is connected to the first signal connection unit 202 to upgrade at least one of the existing hardware configuration and software configuration of the display apparatus 200. .

The upgrade apparatus 300 performs a process corresponding to at least a part of the signal processing of the second signal connector 302 and the first signal processor 220 connected to the first signal connector 202 of the display apparatus 200. A second signal processor 320 capable of processing, a second storage unit 350 for storing unlimited data / information, and a second power supply device 510 for supplying power for upgrading the upgrade apparatus 300. And, the second control unit 360 for controlling the overall operation of the upgrade apparatus (300).

The second power supply device 510 may be a regulator, for example, a DC-DC converter. The second power supply device 510 may be connected to the power connection unit 212 of the display device 200 to output power required for the upgrade apparatus 300. Receive voltage. The second power supply device 510 is a CPU core voltage for driving the second controller 360 and the second signal processor 320 using the DC voltage input from the display apparatus 200, and the second storage unit. The memory voltage driving 350 and the voltage driving other peripheral devices may be output.

As shown in FIG. 3, since the upgrade apparatus 300 does not have a display apparatus (the display unit 130 for outputting audio and video or a speaker (not shown), most of the power is consumed by the second controller 360 configured of a semiconductor integrated circuit). ) And the second signal processor 320. When the upgrade apparatus 300 receives power from the first power supply 210 of the display apparatus 200 via USB, USB 2.0 is DC 0.5V. USB3.0 can supply voltage of DC 0.9V.

In addition, the upgrade apparatus 300 connected to upgrade the display apparatus 200 may upgrade itself to a higher specification. In this case, it is uneconomical to replace the upgrade apparatus 300 as a whole. Therefore, only the second signal processor 320 and the second controller 360, which are the main components, are upgraded, and the second power supply 510 or the second storage unit 350 is upgraded. ) Can be used as is. In this case, when the second signal processor 320 and the second controller 360 are replaced, the characteristic corner of the semiconductor integrated circuit supplied before may be changed, in which case unnecessary heat generation, power consumption or low voltage (Vcc) Lack of margin can occur.

The display system 1 shown in FIG. 3 includes a large number of semiconductor integrated circuits (not shown). These semiconductor integrated circuits may be supplied with a core voltage through the first power supply 210 and the second power supply 510. 4 illustrates a semiconductor integrated circuit 560 according to an exemplary embodiment of the present invention, which may be used in the first control unit 260, the second control unit 360, and the like, and the first power supply device 260 and the second power supply device of FIG. 3. A block diagram illustrating a configuration of a power supply 510 that may be used as 360.

The power supply 510 may include a DC-DC converter, and supplies a core voltage of, for example, about 1.1V to the semiconductor integrated circuit 560.

The semiconductor integrated circuits IC and 560 may include a power input unit 562 that receives a core voltage from the power supply 510, a core 564, a phase locked loop (PLL) unit 566, and a phase. The controller 568 may analyze the characteristics of the fixed loop unit 566. In this case, the semiconductor integrated circuit 560 may manufacture the power input unit 562, the phase locked loop (PLL) unit 564, and the controller 566 as one chip.

The power input unit 562 may receive a core voltage, for example, a voltage of DC1.1V from the power supply 510 and supply the same to the core 564.

The core 564 may receive a Gore voltage and perform calculation and data processing.

The phase locked loop (PLL) section 366 is for matching the input signal with the reference frequency and the output signal with the frequency. The microprocessor converts the internal clock frequency into an integer multiple of the external clock frequency to speed it up. Can also be used to

The controller 368 analyzes the PLL rising / falling slew rate of the phase locked loop (PLL) unit 364 in which a difference occurs according to a semiconductor integrated circuit and a system environment. PLL slew rate (PLL slew rate) is the maximum change in the output voltage to the input, through which the characteristics of the semiconductor integrated circuit 560 can be determined.

5 illustrates an example of a sample determined according to PLL rise / fall slew rate analysis for the semiconductor integrated circuit 560 according to the present invention. In FIG. 5, the PLL rising / falling slew rate of the semiconductor integrated circuit 560 may be analyzed. That is, for the FF sample, the PLL slew rate is very small, for the SS sample, the PLL slew rate is very large, and for the NN sample, it is about halfway between the FF sample and the SS sample. As described above, when the PLL slew rate corresponds to a predetermined range, it may be determined as a normal (NN) characteristic, a fast (FF) characteristic if less than a predetermined range, and a slow (SS) if exceeding a certain range. Of course, the three types of normal (NN), fast (FF), and slow (SS) characteristics are just one example, and it is possible to classify them into more various stages according to the setting.

The controller 368 generates a power control signal to the power supply 510 according to the characteristics of the semiconductor integrated circuit 560 as follows.

When the PLL rising / falling slew rate is the semiconductor integrated circuit 560 corresponding to the normal (NN) characteristic, the reference power supplied to the power input unit 562 is not changed. Here, the reference power source is an initial set power source guaranteed by the specification of the semiconductor integrated circuit.

In the case of the semiconductor integrated circuit 560 having the fast PLL rising / falling slew rate (FF), power consumption due to leakage current increases and heat generation is high, so that the power input unit 562 is lower than the reference power source. Thus, even if a power source lower than the reference power source is applied, the range is preferably within the range of the specification (SPEC) of the semiconductor integrated circuit 560.

In the case of the semiconductor integrated circuit 560 having the slow / low slew rate of the PLL, the low voltage (Vcc) margin is insufficient so that the power input unit 562 is applied higher than the reference power. Similarly, even if a power source higher than the reference power source is applied, the range is preferably within the range of the specification SPEC of the semiconductor integrated circuit 560.

6 shows a power supply 510 according to another embodiment of the present invention. As shown in FIG. 6, the power supply device 510 may include a power supply unit 512 and a controller 518. The controller 518 is included in the power supply device 510, unlike one manufactured as one chip integrated in the semiconductor integrated circuit in FIG. 4. Of course, the control unit 568 may also be included in the semiconductor integrated circuit 560 separately from the control unit 518 of the power supply device 510. The controller 518 is connected to the PLL unit 566 of the semiconductor integrated circuit 560 to analyze the PLL rising / falling slew rate of the semiconductor integrated circuit 560 to analyze the power supply unit 512. To control. In this case, there is an advantage that can be applied to all the semiconductor integrated circuits already manufactured without the need to manufacture the semiconductor integrated circuit 560 separately. The function of the controller 518 is the same as that of the controller 568 of the semiconductor integrated circuit 560 shown in FIG.

7 shows a power supply 510 according to another embodiment of the present invention.

Electronic devices such as the upgraded display system 1 of the present invention shown in FIG. 3 can use a large number of semiconductor integrated circuits 560. For example, an MPU of the first and second signal processing units 220 and 320, a CPU of the first control units 260 and 360, an I / O controller of the user input unit 240, a communication controller of the first and second signal connection units 202 and 302, and the like. There is this.

As shown in FIG. 7, the control unit 518 of the power supply device 510 analyzes the PLL rising / falling slew rate of the PLL unit 566 of each of the plurality of semiconductor integrated circuits 560 so that the power supply unit 512 may determine the respective slew rates. It is possible to supply the power optimized to the semiconductor integrated circuit 560.

As such, by supplying optimized power to all the semiconductor integrated circuits of the upgraded display system 1, it is possible to minimize power consumption and heat generation and to ensure stable low voltage (Vcc) margin of the semiconductor integrated circuits.

As shown in FIGS. 4 to 7, instead of analyzing the PLL rising / falling slew rate of the PLL unit 566 of the semiconductor integrated circuit 560 to control the power supply device 510. While manufacturing the semiconductor integrated circuit 560, the transistor leakage current of the core 564 may be measured, and the characteristics of the semiconductor integrated circuit 560 may be classified according to its size to be used to control the power supply 510. .

8 is a diagram showing the configuration of a semiconductor integrated circuit 660 and a power supply device 610 according to another embodiment of the present invention.

The semiconductor integrated circuit 660 stores unique information including a characteristic index value representing a characteristic in the storage unit 669. Here, the characteristic index value may be an index value classified according to the magnitude of the leakage current measurement value of the transistor in the core 664 included in the semiconductor integrated circuit 660.

For example, the semiconductor integrated circuit 660 may include a characteristic index value indicating a first group when the leakage current value measured by at least one of the transistors constituting the core 664 falls within the first range, and belongs to the second range. In this case, it may include a property index value representing a second group or a property index value representing a third group if it belongs to the third range.

Such a characteristic index value may be included in the unique information. Here, the unique information may mean an identification (hereinafter, referred to as a chip ID) for identifying information about a process lot number, a wafer number, a position on a wafer, and the like of the semiconductor integrated circuit. That is, the characteristic index value may be inserted into the chip ID and stored in the semiconductor integrated circuit 660.

The power supply 610 may supply a power corresponding to a specific index value of the semiconductor integrated circuit 660 to the semiconductor integrated circuit.

That is, the power supply 610 converts external power into driving power required for driving the semiconductor integrated circuit 660, for example, a core voltage, and supplies the external power to the semiconductor integrated circuit 660. Herein, the power supply 610 may adaptively change the core voltage according to a specific index value included in the semiconductor integrated circuit 660 and supply it.

In detail, if the characteristic index value included in the semiconductor integrated circuit 660 is a characteristic index value, the power supply device 610 provides the semiconductor integrated circuit 660 with a core voltage corresponding to the first group. If the characteristic index value indicates that the second group, the core voltage corresponding to the second group is provided to the semiconductor integrated circuit 660. The power supply 610 provides the semiconductor integrated circuit 660 with a core voltage corresponding to the third group if the characteristic index value indicates that it is a third group.

As such, the power supply device 610 may provide different core voltages to the semiconductor integrated circuit 660 according to the characteristic index value of the semiconductor integrated circuit 660. Accordingly, power consumption of the semiconductor integrated circuit 660 may be reduced and a stable operation may be induced.

8 is a block diagram illustrating a detailed configuration of a semiconductor integrated circuit 660 according to an embodiment of the present invention. According to FIG. 8, the semiconductor integrated circuit 660 includes a storage 669, a controller 668, and a core 664. For convenience of description, the power supply 610 is shown in FIG. 2 together.

The storage unit 669 stores the unique information of the semiconductor integrated circuit. In detail, the storage unit 669 stores unique information including a property index value representing a property of the semiconductor integrated circuit 660. Here, the characteristic index value is an index value classified according to the magnitude of the leakage current measurement value of the transistor in the core 664, and may be inserted into unique information and stored in the storage 669 in the semiconductor integrated circuit 660. .

Typically, the core consists of a metal oxide semiconductor field effect transistor (MOSFET). The MOSFET has a large drain-source leakage current I ds when the switching speed is high, and a small drain current between the drain and source when the switching speed is slow. By using this characteristic, the present invention measures leakage current of at least one transistor constituting a core when manufacturing a semiconductor integrated circuit, and stores a specific index value according to a range to which the measured leakage current value belongs.

For example, when the leakage current of the transistor is 10 to 30 mA, the characteristic index value indicating that the first group, if 30 to 50 mA, the characteristic index value indicating that the second group, and 50 to 70 mA if the third group The characteristic index value indicated may be stored in the storage unit 669.

Here, the range of the leakage current as a reference for classifying the inserted characteristic index values may be set according to the magnitude and clock frequency of the core voltage for driving the semiconductor integrated circuit.

Specifically, semiconductor integrated circuits manufactured to have a specification desired by a user may also have different characteristics due to dispersion in semiconductor processes. In particular, the semiconductor integrated circuits present at the corners of the wafer may have a larger or smaller leakage current value between the drain and the source than the semiconductor integrated circuits satisfying the specification. On the other hand, semiconductor integrated circuits having a large leakage current have a high heat generation and power consumption due to an increase in current consumption, but may operate at a high clock frequency even when a low core voltage is applied. On the contrary, semiconductor integrated circuits with small leakage current operate at a high clock frequency only when a high core voltage is applied, but heat generation and power consumption are not high even when a high core voltage is applied because the leakage current is small.

In the present invention, the semiconductor integrated circuits may be classified into different groups using the above characteristics.

First, semiconductor integrated circuits having a specification desired by a user are classified into one group. For example, applying a core voltage of 1 V assumes that the semiconductor integrated circuit operating at 1 GHz is a specification desired by the user. When the leakage current value measured in the semiconductor integrated circuits operating at 1 GHz when the core voltage of 1 V is applied is 30 to 50 mA, the same index value is applied to the semiconductor integrated circuits having the leakage current value in the corresponding range. Can be inserted into one group.

In addition, semiconductor integrated circuits having a larger or smaller leakage current value than a semiconductor integrated circuit having a specification desired by a user may be classified into different groups. For example, when the leakage current value measured in the semiconductor integrated circuits to which the core voltage of 1.1 V is applied to operate at 1 GHz falls within 10 to 30 mA, the semiconductor integrated circuits having the leakage current value in the corresponding range Insert the same index value into the other group. When the leakage current value measured in the semiconductor integrated circuits to which a core voltage of 0.9 V is applied to operate at 1 GHz falls within 30 to 50 mA, the same applies to the semiconductor integrated circuits having the leakage current value in the corresponding range. Insert index values to classify into another group.

As described above, the semiconductor integrated circuits may be classified by inserting characteristic index values into the semiconductor integrated circuits using the leakage current values of the semiconductor integrated circuits.

The controller 668 may control the power supply 610 to supply power corresponding to the characteristic index value in the unique information. In detail, the controller 668 reads the characteristic index value in the unique information stored in the storage 669, and supplies the core 664 with a core voltage corresponding to the read characteristic index value. Can be controlled. To this end, the storage unit 669 may store information on core voltages corresponding to the characteristic index values in advance.

As in the above-described example, it is assumed that the semiconductor integrated circuits are classified into first to third groups according to leakage current values. Specifically, the first group is semiconductor integrated circuits that must apply a core voltage of 1.1 V to operate at 1 GHz, and the second group is semiconductor integrated circuits that must apply a core voltage of 1 V to operate at 1 GHz. It is assumed that the third group is semiconductor integrated circuits that must apply a core voltage of 0.9 V to operate at 1 GHz.

In this case, if the characteristic index value read from the storage unit 669 is an index value indicating that the first group, the controller 668 may control the power supply 610 to provide a core voltage of 1.1V. Similarly, if the characteristic index value read from the storage unit 669 is an index value indicating that the second group, the controller 668 may control the power supply 610 to provide a core voltage of 1V. In addition, if the characteristic index value read from the storage unit 669 is an index value indicating that the third group, the controller 668 may control the power supply 610 to provide a core voltage of 1.1V.

Accordingly, the controller 668 may provide a core voltage for each characteristic of each semiconductor integrated circuit. Therefore, even for semiconductor integrated circuits having different characteristics due to dispersion in the semiconductor process, a corresponding core voltage can be provided, thereby inducing stable operation of the semiconductor integrated circuit and reducing power consumption.

The core 664 may control an operation of the semiconductor integrated circuit 660 by performing a function such as an operation or data processing. Although the semiconductor integrated circuit 660 is described as having only one core 664 in the present embodiment, this is only an example. In some cases, two or more cores may be formed according to the performance of the semiconductor integrated circuit 660. Of course, it can be provided.

The power supply 610 supplies a core voltage to the core 664 to drive the core 664 under the control of the controller 668.

In detail, the power supply 610 converts AC power supplied from an external power supply (not shown) into DC power. In addition, the power supply 610 may convert the DC power into a core voltage corresponding to the characteristic index value included in the storage 669 using a DC / DC converter, and supply the same to the core 664. That is, the power supply 610 may adaptively change the core voltage to supply the core 664 so as to correspond to the characteristic index value under the control of the controller 668.

9 is a flowchart illustrating a method of driving a semiconductor integrated circuit according to an embodiment of the present invention.

First, when the semiconductor integrated circuit which stores the unique information including the characteristic index value is mounted in the electronic device, the unique information stored in the storage unit 669 is read (S410). Here, the characteristic index value may be an index value classified according to the magnitude of the leakage current specific value of the core provided in the semiconductor integrated circuit.

Thereafter, a power source corresponding to the characteristic index value included in the unique information is supplied to the semiconductor integrated circuit to drive the semiconductor integrated circuit (S420). Specifically, the semiconductor integrated circuit 660 may be driven by providing a core voltage corresponding to the characteristic index value to the core 664 in the semiconductor integrated circuit.

10 is a flowchart illustrating a method of manufacturing a semiconductor integrated circuit that can be mounted and used in an electronic device according to an embodiment of the present invention.

First, the leakage current value of the core of the semiconductor integrated circuit is measured (S510). Specifically, the leakage current value between the drain and the source of the transistor constituting the core is measured.

Thereafter, chip-specific information including a characteristic index value corresponding to the measured leakage current value is generated (S520). Then, the chip specific information is stored in the semiconductor integrated circuit (S530).

Specifically, different characteristic index values are inserted into the chip specific information according to the range to which the measured leakage current value belongs.

For example, if the measured leakage current value belongs to the first range, the index value indicating that the first group, if it belongs to the second range, the index value indicating the second group, and if the third range belongs to the third group The index value may be inserted into the chip specific information and stored in the semiconductor integrated circuit.

The chip specific information may mean a chip identification (hereinafter, referred to as a chip ID) for identifying information about a process lot number, a wafer number, a position on a wafer, and the like of the chip. That is, the characteristic index value may be inserted into the chip ID and embedded in the semiconductor integrated circuit.

Meanwhile, the program for performing the method according to various embodiments of the present disclosure described above may be stored and used in various types of recording media.

Specifically, the code for performing the above-described methods may include random access memory (RAM), flash memory, read only memory (ROM), erasable programmable ROM (EPROM), electronically erasable and programmable ROM (EPROM), register, hard drive. It may be stored in various types of recording media readable by the terminal, such as a disk, a removable disk, a memory card, a USB memory, a CD-ROM, and the like.

11 illustrates an output port for controlling the power supply device 610 in the semiconductor integrated circuit 660 according to the present invention.

Based on the different characteristic data of the semiconductor integrated circuit 660 itself, for example, FF, FS, SF, and SS, it is output through the output ports # 1 and # 2, and through this output, the semiconductor integrated circuit 660. The power supply 610 for supplying power to the controller can be controlled.

Values according to the characteristics of the semiconductor integrated circuit 660 output through the output port and the corresponding core voltage (VDDC) applied to the semiconductor integrated circuit can be set as shown in the table below.

#One #2 VDDC L (0) L (0) 1.05V L (0) H (1) 1.10V H (1) L (0) 1.15V H (1) H (1) 1.20 V

If output port # 1 is not the result of a normal internal process, an incorrect core voltage VDDC may be supplied. In this case, the semiconductor integrated circuit 660 may be in an inoperable state, or may be generated in a period from when the power is supplied to the inside of the semiconductor integrated circuit 660 until the self characteristic check is completed.

Accordingly, in order to solve this problem, as shown in FIG. 12, output ports # 3 and # 4 indicating the state of the semiconductor integrated circuit 660 may be added.

Output port 3 (# 3) outputs "L or 0" when the internal operation is not performed normally, and the power supply 610 is in the state that the output port (# 3) is 'L or 0' Only the specified standard voltage (Vref) is output.

After the semiconductor integrated circuit 660 starts up and confirms that the internal process is in normal operation, output port # 3 outputs "H or 1" and outputs its own process diagnosis results through output ports 1 and 2. do.

Output 4 (# 4) is output as "L or 0" or "H or 1" when the internal operation is not normal, and the signal is repeated as H → L → H in normal state Let's do it. At this time, for example, the second control unit 638 such as a microcomputer checks the output state of the fourth output port # 4, and if a change of the fourth output port # 4 is not detected, it is determined as a system error. By turning the core voltage (VDDC) from 'OFF' to 'ON', the system starts to operate normally.

The core voltage (VDDC) according to the status output of the 3rd and 4th output ports (# 3, # 4) can be set as shown in Table 2 below.

# 3 #4 VDDC L (0) Specific voltage (Vref) output H (1) Value output by # 1, # 2 L (0) Internal abnormality H (1) Steady state (cyclic 'H' output signal

In this case, the restarted semiconductor integrated circuit may operate a boot program based on information stored in the internal storage 669.

 While many embodiments of the invention have been shown and described thus far, those skilled in the art will be able to modify the embodiments without departing from the spirit or spirit of the invention. Accordingly, the scope of the invention should not be limited to the embodiments described thus far but rather by the appended claims and their equivalents.

110,210,310,510,610: power supply
160,560,660: semiconductor integrated circuit
164,564,664: core
200: display device
300: upgrade device
366: PLL section
368,518, 538, 568,668: control unit
669: storage

Claims (57)

In a semiconductor integrated circuit,
A power input unit receiving power from an external power supply unit;
A core driven by the power input through the power input unit;
A phase locked loop (PLL) unit for matching an input signal to a reference frequency;
Analyze the PLL rising slew rate or the PLL falling slew rate of the phase-locked loop portion measured while a constant voltage is applied to the semiconductor integrated circuit,
And a control unit controlling the power supply unit to reduce or increase the power supplied from the power supply unit when the analyzed phase locked loop rising slew rate or phase locked loop falling slew rate is outside a predetermined predetermined range. Semiconductor integrated circuit.
delete delete delete The method of claim 1,
And the control unit causes the power supply unit to supply a power lower than a reference power source when the analyzed phase locked loop rising slew rate or phase locked loop falling slew rate is determined to be less than the predetermined range.
The method of claim 1,
And the controller is configured to cause the power supply unit to supply power higher than a reference power source when the analyzed phase locked loop rising slew rate or phase locked loop falling slew rate exceeds the predetermined range.
The method of claim 5,
The power supply lower than the reference power supply is a semiconductor integrated circuit, characterized in that included in the specification range of the semiconductor integrated circuit.
The method of claim 6,
And a power supply higher than the reference power supply is within a specification range of the semiconductor integrated circuit.
The method of claim 1,
And a storage unit which stores chip specific information including a characteristic index value of the core.
The method of claim 9,
And the control unit controls the power supply unit to supply power corresponding to the characteristic index value of the core.
The method of claim 10,
Wherein the characteristic index value is an index value classified according to a magnitude of a leakage current measurement value of a transistor in the core.
The method of claim 1,
And at least two output ports connected to the power supply and outputting values corresponding to the characteristics of the semiconductor integrated circuit.
The method of claim 12,
And the control unit transmits a control signal according to the characteristics of the core to the power supply unit through the output port.
The method of claim 12,
And the output port comprises an output port for outputting whether the semiconductor integrated circuit state is normal.
The method of claim 13,
The normal state of the semiconductor integrated circuit state is a semiconductor integrated circuit, characterized in that output in the "high (H)" and "low (L)".
The method of claim 13,
The semiconductor integrated circuit may be normally output as one of 'high' and 'low' as a periodic variation value of 'high' and 'low'. Integrated circuits.
The method of claim 16,
And a second control unit which checks the periodic fluctuation values of the 'high (H)' and the 'low (L)'.
The method of claim 17,
And in the abnormality state as a result of the check, restarting the power of the semiconductor integrated circuit from 'off' to 'on'.
The method of claim 18,
The restarted semiconductor integrated circuit is a semiconductor integrated circuit, characterized in that for running a boot program based on the information stored in the internal storage.
In the power supply of the semiconductor integrated circuit,
A power supply unit supplying power to the semiconductor integrated circuit;
Analyze the PLL rising slew rate or the PLL falling slew rate of the phase-locked loop portion of the semiconductor integrated circuit, which is measured while a constant voltage is applied to the semiconductor integrated circuit. And controlling the power supply to reduce or increase power supplied from the power supply to the semiconductor integrated circuit when the analyzed phase locked loop rising slew rate or phase locked loop falling slew rate is outside a predetermined range. A power supply device for a semiconductor integrated circuit comprising a control unit.
delete delete delete The method of claim 20,
The control unit supplies power to the semiconductor integrated circuit if the analyzed phase locked loop rising slew rate or phase locked loop falling slew rate is less than the predetermined range, so that the power supply unit supplies a power lower than a reference power supply. Device.
The method of claim 20,
The control unit causes the power supply unit to supply power higher than a reference power source when the analyzed phase locked loop rising slew rate or phase locked loop falling slew rate is determined to exceed the predetermined range. Power supply.
The method of claim 24,
And a power supply lower than the reference power supply is included in the specification range of the semiconductor integrated circuit.
The method of claim 25,
And a power supply higher than the reference power supply is included in the specification range of the semiconductor integrated circuit.
The method of claim 20,
And the control unit controls the power supply unit to supply power corresponding to chip specific information including a characteristic index value of the core of the semiconductor integrated circuit.
The method of claim 20,
And a input port for inputting characteristic information of the semiconductor integrated circuit.
The method of claim 29,
And the control unit controls the power supply device based on the input characteristic information of the semiconductor integrated circuit.
The method of claim 29,
And the input port comprises an input port for inputting whether the state of the semiconductor integrated circuit is normal.
The method of claim 31, wherein
The normal state of the semiconductor integrated circuit state is supplied to the 'high (H)' and 'low (L) input power supply device for a semiconductor integrated circuit.
The method of claim 31, wherein
The semiconductor integrated circuit may be normally input as one of 'high' and 'low' and 'cyclically high' and 'low'. Power supply for integrated circuits.
The method of claim 33, wherein
And a second control unit which checks the periodic fluctuation values of the 'high (H)' and the 'low (L)'.
The method of claim 34, wherein
The power supply of the semiconductor integrated circuit, characterized in that for restarting the power of the semiconductor integrated circuit from the "off" to "on" in the abnormal state.
36. The method of claim 35 wherein
The restarted semiconductor integrated circuit is a power supply device for a semiconductor integrated circuit, characterized in that for operating a boot program based on the information stored in the internal storage.
In the power supply method of a semiconductor integrated circuit,
Supplying a reference power source to the semiconductor integrated circuit;
Analyzing a PLL rising slew rate or a PLL falling slew rate of a phase-locked loop portion of the semiconductor integrated circuit measured while the reference power is applied to the semiconductor integrated circuit. Making a step;
Controlling the power supply to reduce or increase power supplied from the power supply to the semiconductor integrated circuit when the analyzed phase locked loop rising slew rate or phase locked loop falling slew rate is outside a predetermined range. Power supply method of a semiconductor integrated circuit comprising a.
delete delete delete The method of claim 37,
And if the analyzed phase-locked loop rising slew rate or phase-locked loop falling slew rate is determined to be less than the predetermined range, supplying power to the power supply unit lower than a reference power supply.
The method of claim 37,
If the analyzed phase locked loop rising slew rate or phase locked loop falling slew rate exceeds the predetermined range, the power supply unit supplies a power higher than a reference power supply. .
The method of claim 41, wherein
And a power supply lower than the reference power supply is within a specification range of the semiconductor integrated circuit.
The method of claim 42, wherein
A power supply higher than the reference power supply is included in the specification range of the semiconductor integrated circuit.
The method of claim 37,
And storing chip-specific information including a characteristic index value of the core of the semiconductor integrated circuit in a storage unit of the semiconductor integrated circuit.
The method of claim 45,
The controlling of the power supply unit includes controlling the power supply unit to supply power corresponding to the characteristic index value of the core.
The method of claim 45,
The characteristic index value is a power supply method of a semiconductor integrated circuit, characterized in that the index value classified according to the magnitude of the leakage current measurement value of the transistor in the core.
The method of claim 37,
The semiconductor integrated circuit power supply method of the semiconductor integrated circuit comprising the step of outputting a control signal for controlling the power supply in accordance with the characteristics of the core.
The method of claim 37,
And supplying whether the semiconductor integrated circuit is normally operating.
The method of claim 49,
The normal power supply method of a semiconductor integrated circuit, characterized in that the output is "high (H)" and "low (L).
The method of claim 49,
The power supply of the semiconductor integrated circuit is characterized in that the normal state is output as a periodic change value of one of 'high (H)' and 'low (L)' and 'high (H) and' low (L) '. Way.
The method of claim 51,
And checking the periodic fluctuation values of the 'high (H)' and 'low (L)'.
The method of claim 52, wherein
And in response to the check, turning the power of the semiconductor integrated circuit from 'off' to 'on' to restart the semiconductor integrated circuit.
The method of claim 53,
The restarted semiconductor integrated circuit power supply method of the semiconductor integrated circuit, characterized in that for operating a boot program based on the information stored in the storage.
In an electronic device including a semiconductor integrated circuit and a power supply device,
20. The electronic device of claim 1, wherein the semiconductor integrated circuit comprises the semiconductor integrated circuit according to any one of claims 1 and 5 to 19.
In an electronic device including a semiconductor integrated circuit and a power supply device,
The power supply device is an electronic device comprising the power supply device of any one of claims 20 and 24 to 36.
delete
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US13/711,876 US9513649B2 (en) 2011-12-28 2012-12-12 Integrated circuit (IC), adaptive power supply using IC characteristics and adaptive power supply method according to IC characteristics, electronic device including the same and manufacturing method of IC
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020026597A1 (en) * 1998-09-25 2002-02-28 Xia Dai Reducing leakage power consumption
US20040103330A1 (en) * 2002-11-25 2004-05-27 Bonnett William B. Adjusting voltage supplied to a processor in response to clock frequency
KR100653065B1 (en) * 2005-07-21 2006-12-01 삼성전자주식회사 Electronic equipment system and control method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020026597A1 (en) * 1998-09-25 2002-02-28 Xia Dai Reducing leakage power consumption
US20040103330A1 (en) * 2002-11-25 2004-05-27 Bonnett William B. Adjusting voltage supplied to a processor in response to clock frequency
KR100653065B1 (en) * 2005-07-21 2006-12-01 삼성전자주식회사 Electronic equipment system and control method thereof

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