KR101994134B1 - Light emitting module - Google Patents

Light emitting module Download PDF

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Publication number
KR101994134B1
KR101994134B1 KR1020120100646A KR20120100646A KR101994134B1 KR 101994134 B1 KR101994134 B1 KR 101994134B1 KR 1020120100646 A KR1020120100646 A KR 1020120100646A KR 20120100646 A KR20120100646 A KR 20120100646A KR 101994134 B1 KR101994134 B1 KR 101994134B1
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KR
South Korea
Prior art keywords
lead
light emitting
light source
thickness
disposed
Prior art date
Application number
KR1020120100646A
Other languages
Korean (ko)
Other versions
KR20130111160A (en
Inventor
김정현
박영민
강석원
손영혜
Original Assignee
삼성디스플레이 주식회사
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Application filed by 삼성디스플레이 주식회사 filed Critical 삼성디스플레이 주식회사
Priority to US13/653,231 priority Critical patent/US9081226B2/en
Publication of KR20130111160A publication Critical patent/KR20130111160A/en
Application granted granted Critical
Publication of KR101994134B1 publication Critical patent/KR101994134B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The light emitting module includes a printed circuit board and a light emitting package. Holes are formed in the printed circuit board. The light emitting package includes a light source and a lead and is disposed on the printed circuit board. The light emitting package includes a stepped part having a predetermined height, and the stepped part is disposed in the hole formed in the printed circuit board. Therefore, the thickness of the light emitting module can be reduced, thereby reducing the thickness of the display device and the width of the bezel.

Description

Light emitting module {LIGHT EMITTING MODULE}

The present invention relates to a light emitting module, and more particularly, to a light emitting module used in a display device.

Recently, a light emitting diode (LED) has been widely used as a light source of a display device including a liquid crystal display, an electrophoretic display, and a MEMS display.

In general, the light emitting diode is mounted on a printed circuit board. A protection material for protecting the light emitting diode is formed around the light emitting diode, and a sealing portion for sealing and protecting the light emitting diode is formed on the light emitting diode.

When reducing the height of the protective material and the height of the sealing portion, there is a problem that the reliability of the light emitting diode is lowered, there is a limit in reducing the thickness of the light emitting module including the printed circuit board and the light emitting diode.

Therefore, a technique for reducing the thickness of the light emitting module and improving the reliability of the light emitting module is required.

Accordingly, the technical problem of the present invention is conceived in this respect, the object of the present invention is to provide a light emitting module having a reduced thickness and improved reliability.

The light emitting module according to the embodiment for realizing the object of the present invention includes a printed circuit board and a light emitting package. Holes are formed in the printed circuit board. The light emitting package includes a light source and a lead and is disposed on the printed circuit board. The light emitting package includes a stepped part having a predetermined height, and the stepped part is disposed in the hole formed in the printed circuit board.

In one embodiment of the present invention, the lead is formed in the main lead portion, the first bending portion extending downward from the main lead portion, and the end of the first bending portion and extending in a direction parallel to the main lead portion A second bending part may be included, and the light source may be disposed on the second bending part.

In one embodiment of the present invention, the stepped portion may be disposed under the light source.

In one embodiment of the present invention, the height of the stepped portion may be equal to the overall thickness of the lead and the printed circuit board.

In one embodiment of the invention, the light source may be covered by a protective material, the thickness of the protective material disposed on the top surface of the light source and the thickness of the protective material disposed on the back surface of the light source may be the same. .

In one embodiment of the invention, the light emitting package may comprise a lead frame, the lead frame is a first portion bent downward from the lead and a second extending from the end of the first portion parallel to the lead And a portion, wherein the light source may be disposed on the second portion parallel to the lead.

According to the light emitting module, the thickness of the light emitting module can be reduced, thereby reducing the thickness of the display device and the width of the bezel.

1A is a perspective view illustrating a light emitting module according to an embodiment of the present invention.
FIG. 1B is a plan view illustrating the printed circuit board of FIG. 1A.
1C is an enlarged perspective view illustrating the light emitting package of FIG. 1A.
FIG. 2A is a cross-sectional view taken along the line II ′ of FIG. 1A.
FIG. 2B is a cross-sectional view taken along the line II-II 'of FIG. 1A.
3A to 3E are cross-sectional views illustrating a method of manufacturing the light emitting module illustrated in FIGS. 1 to 2B.
4 is an exploded perspective view illustrating a display device including the light emitting module illustrated in FIGS. 1 to 2B.
5A is a perspective view illustrating a light emitting module according to an embodiment of the present invention.
FIG. 5B is a plan view illustrating the printed circuit board of FIG. 5A.
5C is an enlarged perspective view illustrating the light emitting package of FIG. 5A.
FIG. 6A is a cross-sectional view taken along the line III-III ′ of FIG. 5A.
FIG. 6B is a cross-sectional view taken along the line IV-IV 'of FIG. 5A.
7A to 7E are cross-sectional views illustrating a method of manufacturing the light emitting module illustrated in FIGS. 5 to 6B.
8 is an exploded perspective view illustrating a display device including the light emitting module illustrated in FIGS. 5 to 6B.

Hereinafter, with reference to the accompanying drawings, it will be described in detail a preferred embodiment of the present invention.

Example 1

1A is a perspective view illustrating a light emitting module according to an embodiment of the present invention, FIG. 1B is a plan view illustrating the printed circuit board 110 of FIG. 1A, and FIG. 1C is an enlarged perspective view illustrating the light emitting package 130 of FIG. 1A. 2A is a cross-sectional view taken along the line II ′ of FIG. 1A, and FIG. 2B is a cross-sectional view taken along the line II-II ′ of FIG. 1A.

1A to 2B, the light emitting module 100 according to the present embodiment includes the printed circuit board 110 and the light emitting package 130.

The printed circuit board 110 includes a base substrate 111, a first wiring layer 121, and a second wiring layer 123. The hole 125 is formed in the printed circuit board 110.

For example, the printed circuit board 110 may be a flexible printed circuit board (FPCB) having flexibility. Alternatively, the printed circuit board 110 may be a metal core printed circuit board (MCPCB) for transferring heat.

The first wiring layer 121 is disposed on the base substrate 111 and transfers first driving power. The second wiring layer 123 is disposed on the base substrate 111, spaced apart from the first wiring layer 121, and transmits a second driving power.

The polarity of the second driving power transmitted by the second wiring layer 123 may be different from the polarity of the first driving power transmitted by the first wiring layer 121. For example, the polarity of the first driving power transmitted by the first wiring layer 121 is positive and the polarity of the second driving power transmitted by the second wiring layer 123 is negative. May be polarity. In contrast, the polarity of the first driving power that is transmitted by the first wiring layer 121 is negative and the polarity of the second driving power that is transmitted by the second wiring layer 123 is positive. It may be the polarity of.

The light emitting package 130 includes a first lead 131, a second lead 133, a light source 150, a first wiring 141, a second wiring 143, a protective material 160, and a sealing unit 170. ).

The first lead 131 is disposed on the first wiring layer 121. The light source 150 is disposed on the first lead 131, and the height of the first lead 131 on which the light source 150 is disposed is lower than the height of the upper part where the light source 150 is not disposed. For example, the first lead 131 may include a main lead portion extending in a first direction, a first bending portion extending downward from the main lead portion, and an end portion of the first bending portion extending from an end of the first lead portion. And a second parallel bending portion. The light source 150 is disposed on the second bending part. The second lead 133 is disposed on the second wiring layer 123. The first lead 131 and the second lead 133 are spaced apart from each other and face each other. Each of the first lead 131 and the second lead 133 may have a 'C' shape.

The protective material 160 is formed to protect the light source 150. The protective material 160 may include a stepped portion disposed in the hole 125 formed in the printed circuit board 110. The stepped portion is formed at least under the light source 150. The height of the stepped portion may be equal to the sum of the thickness of the first lead 131 and the thickness of the printed circuit board 110. The thickness of the protective material 160 disposed on the upper surface of the light source 150 and the thickness of the protective material 160 disposed on the rear surface of the light source 150 may be the same. In contrast, the thickness of the protective material 160 disposed on the upper surface of the light source 150 and the thickness of the protective material 160 disposed on the rear surface of the first lead 131 on which the light source 150 is disposed. May be the same. However, this is not limitative. The thickness of the protective material 160 disposed on the top surface of the light source 150, the thickness of the protective material 160 disposed on the rear surface of the light source 150, and the first lead on which the light source 150 is disposed The thickness of the protective material 160 disposed on the rear surface of the 131 may be equal to the thickness of the printed circuit board 110, the thickness of the light guide plate of the backlight assembly including the light emitting module 100, and the thickness of the reflecting plate. It may vary depending on the structure of the light emitting module 100. The protective material 160 may be a mold compound.

In addition, the protective material 160 forms an accommodation space in which the light source 150 is disposed between the first lead 131 and the second lead 133. Thus, the protective material 160 covers the light source 150 to protect the light source 150. In addition, the protective material 160 includes a groove formed in a direction in which the light source 150 generates light.

The light source 150 is disposed on the first lead 131. In addition, at least a portion of the light source 150 may be disposed in the hole 125 formed in the printed circuit board 110.

The light source 150 may be formed by the first driving power delivered by the first wiring layer 121 of the printed circuit board 110 and the second wiring layer 123 of the printed circuit board 110. 2 Receive driving power.

For example, the light source 150 is electrically connected to the first lead 131 formed on the first wiring layer 121 through the first wiring 141. Therefore, a first opening may be formed in the protective material 160 to expose the first lead 131 to which the first wire 141 is connected. In addition, the light source 150 is electrically connected to the second lead 133 formed on the second wiring layer 123 through the second wiring 143. Therefore, a second opening may be formed in the protective material 160 to expose the second lead 133 to which the second wire 143 is connected.

The light source 150 may generate the light in a direction horizontal to the printed circuit board 110. Accordingly, the light source 150 may generate the light from the side surface of the light emitting package 130 and may generate the light in a side view manner. For example, the light source 150 may be a light emitting diode (LED).

The sealing unit 170 seals the light source 150 to protect the light source 150. For example, the seal 170 may include an epoxy material. In addition, the sealing unit 170 may further include a fluorescent material 180.

3A to 3E are cross-sectional views illustrating a method of manufacturing the light emitting module 100 illustrated in FIGS. 1 to 2B.

Referring to FIG. 3A, the hole 125 is formed in the printed circuit board 110. The printed circuit board 110 includes the base substrate 111, the first wiring layer 121, and the second wiring layer 123 formed on the base substrate 111. The first wiring layer 121 is disposed on the base substrate 111 and transmits the first driving power. The second wiring layer 123 is disposed on the base substrate 111, spaced apart from the first wiring layer 121, and transmits the second driving power.

Referring to FIG. 3B, the light emitting package 130 is formed separately from the printed circuit board 110. Specifically, a lead frame including the first lead 131 and the second lead 133 is prepared, and the light source 150 is disposed on the first lead 131. The light source 150 may be attached to the first lead 131 through an adhesive material. The height of the first lead 131 on which the light source 150 is disposed is lower than the height of the upper part of the first lead 131 on which the light source 150 is not disposed. The first lead 131 and the second lead 133 are spaced apart from each other and face each other.

The first lead 131 and the light source 150 are electrically connected to each other through the first wire 141, and the second lead 133 and the light source 150 are the second wire 143. It is electrically connected to each other through.

Referring to FIG. 3C, the protective material 160 is formed. The protective material 160 is formed between the first lead 131 and the second lead 133. In addition, the protective material 160 may include a stepped portion inserted into the hole 125 formed in the printed circuit board 110. The hole 125 may form an accommodation space into which the light source 150 disposed between the first lead 131 and the second lead 133 is inserted.

Referring to FIG. 3D, after cutting a part of the lead frame, the first lead 131 and the second lead 133 are bent. Specifically, the first lead 131 and the second lead to cover a portion of the protective material 160 disposed on the first lead 131 and the second lead 133 opposite to each other. Bend 133. Thus, the light emitting package 130 is formed.

Referring to FIG. 3E, the light emitting package 130 is disposed on the printed circuit board 110.

Specifically, the stepped portion of the protective material 160 is inserted into the hole 125 of the printed circuit board 110, the first lead 131 is connected to the first wiring layer 121, and the second The light emitting package 130 is disposed on the printed circuit board 110 so that the lead 133 is connected to the second wiring layer 123. Thus, the light emitting module 100 is formed.

4 is an exploded perspective view illustrating a display device including the light emitting module 100 illustrated in FIGS. 1 to 2B.

Referring to FIG. 4, the display device 300 includes an upper storage container 310, a display panel 320, and a backlight assembly 400.

The upper accommodating container 310 is disposed on the display panel 320 to protect the display panel 320 from an external impact, and the upper surface of the upper accommodating container 310 is disposed on the display panel 320. A window for exposing the display area to the outside is formed.

The display panel 320 includes a thin film transistor substrate 322, an opposing substrate 324, and a liquid crystal layer (not shown), and the thin film transistor substrate 322 or the opposing substrate 324 may include a color filter. Can be.

The thin film transistor substrate 322 includes a first base substrate, a thin film transistor, and a pixel electrode. The opposing substrate 324 faces the thin film transistor substrate and includes a second base substrate and a common electrode. The liquid crystal layer is interposed between the thin film transistor substrate 322 and the counter substrate 324, and the liquid crystal of the liquid crystal layer is the common between the pixel electrode of the thin film transistor substrate 322 and the counter substrate 324. Is oriented by an electric field formed between the electrodes. The display panel 320 displays an image by using light emitted from the emission surface 423 of the light guide plate 420 included in the backlight assembly 400.

The backlight assembly 400 is disposed under the display panel 320 to provide light to the display panel 320, the light emitting module 100, the light guide plate 420, the reflective sheet 430, and the optical. Seats 440 and a lower receptacle 450.

The light emitting module 100 includes the printed circuit board 110 and the light emitting package 130. Since the light emitting module 100 is substantially the same as the light emitting module 100 illustrated in FIGS. 1 to 2B, detailed description thereof will be omitted.

The light guide plate 420 is disposed on one side of the light emitting module 100, and receives the light generated from the light emitting module 100 and the light incident through the side toward the display panel 320. It includes the exit surface 423 to exit.

The reflective sheet 430 is disposed between the light guide plate 420 and the lower storage container 450 to reflect the light leaked from the light guide plate 420.

The optical sheets 440 may be disposed on the light guide plate 420 to increase the efficiency of light emitted from the light guide plate 420. The optical sheets 440 may include a first optical sheet 441, a second optical sheet 442, and a third optical sheet 443. For example, the first optical sheet 441, the second optical sheet 442, and the third optical sheet 443 may be diffusion sheets, prism sheets, and light collecting sheets, respectively.

The lower storage container 450 is coupled to the upper storage container 310 to form the reflective sheet 430, the light guide plate 420, the light emitting module 100, the optical sheets 440, and the display panel ( 320).

The display device 300 may further include a mold frame 330. The mold frame 330 is disposed between the display panel 320 and the optical sheets 440 to support the display panel 320, the light guide plate 420, the optical sheets 440, and the optical sheet 440. The reflective sheet 430 is fixed to the lower storage container 450.

According to the present embodiment, the hole 125 is formed in the printed circuit board 110. The first lead 131 in which the light source 150 is disposed is disposed in the hole 125. The thickness of the light emitting module 100 is reduced while maintaining the thickness of the protective material 160 disposed on the upper surface of the light source 150 and the thickness of the protective material 160 disposed on the rear surface of the light source 150. You can. Therefore, the reliability of the light emitting module 100 can be improved. In addition, thicknesses of the backlight assembly 400 and the display device 300 including the light emitting module 100 may be reduced.

Example 2

5A is a perspective view illustrating a light emitting module according to an embodiment of the present invention. FIG. 5B is a plan view illustrating the printed circuit board 210 of FIG. 5A, and FIG. 5C is an enlarged perspective view illustrating the light emitting package 230 of FIG. 5A. 6A is a cross-sectional view taken along the line III-III 'of FIG. 5A, and FIG. 6B is a cross-sectional view taken along the line IV-IV ′ of FIG. 5A.

5A to 6B, the light emitting module 200 according to the present embodiment includes the printed circuit board 210 and the light emitting package 230.

The printed circuit board 210 includes a base substrate 211, a first wiring layer 221, and a second wiring layer 223 formed on the base substrate 211. Holes 225 are formed in the printed circuit board 210.

The printed circuit board 210 may be a flexible printed circuit board (FPCB) having flexibility. Alternatively, the printed circuit board 210 may be a metal core printed circuit board (MCPCB) for transferring heat.

The first wiring layer 221 is disposed on the base substrate 211 and transfers first driving power. The second wiring layer 223 is disposed on the base substrate 211, spaced apart from the first wiring layer 221, and transmits a second driving power.

The polarity of the second driving power transmitted by the second wiring layer 223 may be different from the polarity of the first driving power transmitted by the first wiring layer 221. For example, the polarity of the first driving power transmitted by the first wiring layer 221 is positive and the polarity of the second driving power transmitted by the second wiring layer 223 is negative. May be polarity. In contrast, the polarity of the first driving power that is transmitted by the first wiring layer 221 is negative and the polarity of the second driving power that is transmitted by the second wiring layer 223 is positive. It may be the polarity of.

The light emitting package 230 may include a lead frame having a first lead 231, a second lead 233, a light source 250, a first wiring 241, a second wiring 243, a protective material 260, and Seal 270.

The first lead 231 is disposed on the first wiring layer 221. The light source 250 is disposed on the first lead 231, and the height of the first lead 231 in which the light source 250 is disposed is lower than the height of the upper part where the light source 250 is not disposed. For example, the first lead 231 may include a main lead part extending in a first direction, a first bending part extending downward from the main lead part, and extending from an end of the first bending part and the main lead part. And a second parallel bending portion. The light source 250 is disposed on the second bending part. The second lead 233 is disposed on the second wiring layer 223. The first lead 231 and the second lead 233 are spaced apart from each other and face each other. Each of the first lead 231 and the second lead 233 may have a 'C' shape.

The protective material 260 is formed to protect the light source 250. The protective material 260 includes a stepped portion disposed in the hole 225 formed in the printed circuit board 210. The stepped portion is formed at least under the light source 250. The height of the stepped portion may be equal to the sum of the thickness of the first lead 231 and the thickness of the printed circuit board 210. The thickness of the protective material 260 disposed on the upper surface of the light source 250 and the thickness of the protective material 260 disposed on the rear surface of the light source 250 may be the same. In contrast, the thickness of the protective material 260 disposed on the upper surface of the light source 250 and the thickness of the protective material 260 disposed on the rear surface of the first lead 231 in which the light source 250 is disposed. May be the same. However, this is not limitative. The thickness of the protective material 260 disposed on the top surface of the light source 250, the thickness of the protective material 260 disposed on the rear surface of the light source 250, and the first lead on which the light source 250 is disposed The thickness of the protective material 260 disposed on the rear surface of the 231 may include the thickness of the printed circuit board 210, the thickness of the light guide plate of the backlight assembly including the light emitting module 200, and the thickness of the reflecting plate. It may vary depending on the structure of the light emitting module 200.

In addition, the protective material 260 forms an accommodation space in which the light source 250 is disposed between the first lead 231 and the second lead 233. Thus, the protective material 260 covers the light source 250 to protect the light source 250. In addition, the protective material 260 includes a groove formed in a direction in which the light source 250 generates light. The protective material 260 may be a mold compound.

The light source 250 is disposed on the first lead 231. In addition, at least a portion of the light source 250 may be disposed in the hole 225 formed in the printed circuit board 210.

The light source 250 is the first driving power transmitted by the first wiring layer 221 of the printed circuit board 210 and the second wiring layer 223 of the printed circuit board 210. 2 Receive driving power.

For example, the light source 250 is electrically connected to the first lead 231 formed on the first wiring layer 221 through the first wiring 241. The light source 250 is electrically connected to the second lead 233 formed on the second wiring layer 223 through the second wiring 243.

The light source 250 may generate the light in a direction perpendicular to the printed circuit board 210. Therefore, the light source 250 may generate the light from the top surface of the light emitting module 200, and may generate the light in a top view manner. For example, the light source 250 may be a light emitting diode (LED).

The sealing part 270 seals the light source 250 to protect the light source 150. For example, the seal 270 may include an epoxy material. In addition, the sealing part 270 may further include a fluorescent material 280.

7A to 7E are cross-sectional views illustrating a method of manufacturing the light emitting module 200 illustrated in FIGS. 5 to 6B.

Referring to FIG. 7A, the hole 225 is formed in the printed circuit board 210. The printed circuit board 210 includes the base substrate 211, the first wiring layer 221, and the second wiring layer 223 formed on the base substrate 211. The first wiring layer 221 is disposed on the base substrate 211 and transmits the first driving power. The second wiring layer 223 is disposed on the base substrate 211, spaced apart from the first wiring layer 221, and transmits the second driving power.

Referring to FIG. 7B, the light emitting package 230 is formed separately from the printed circuit board 210. Specifically, the first lead 231 and the second lead 233 are prepared, and the light source 250 is disposed on the first lead 231. The light source 250 may be attached to the first lead 231 through an adhesive material. The height of the first lead 231 in which the light source 250 is disposed is lower than the height of the upper part of the first lead 231 in which the light source 250 is not disposed. The first lead 231 and the second lead 233 are spaced apart from each other and face each other.

The first lead 231 and the light source 250 are electrically connected to each other through the first wire 241, and the second lead 233 and the light source 250 are connected to the second wire 243. It is electrically connected to each other through.

Referring to FIG. 7C, the protective material 260 is formed. The protective material 260 is formed between the first lead 231 and the second lead 233. In addition, the protective material 260 includes a stepped portion inserted into the hole 225 formed in the printed circuit board 210. The hole 225 may form an accommodation space into which the light source 250 disposed between the first lead 231 and the second lead 233 is inserted.

Referring to FIG. 7D, after cutting a portion of the lead frame, the first lead 231 and the second lead 233 are bent. Specifically, the first lead 231 and the second lead to cover a portion of the protective material 260 disposed on the first lead 231 and the second lead 233 opposite to each other. Bend (233). Thus, the light emitting package 230 is formed.

Referring to FIG. 7E, the light emitting package 230 is disposed on the printed circuit board 210.

Specifically, the stepped portion of the protective material 260 is inserted into the hole 225 of the printed circuit board 210, the first lead 231 is connected to the first wiring layer 221, and the second The light emitting package 230 is disposed on the printed circuit board 210 so that the lead 233 is connected to the second wiring layer 223. Thus, the light emitting module 200 is formed.

FIG. 8 is an exploded perspective view illustrating a display device including the light emitting module 200 illustrated in FIGS. 5 to 6B.

Referring to FIG. 8, the display device 500 includes an upper storage container 310, a display panel 320, and a backlight assembly 600.

The upper accommodating container 310 is disposed on the display panel 320 to protect the display panel 320 from an external impact, and the upper surface of the upper accommodating container 310 is disposed on the display panel 320. A window for exposing the display area to the outside is formed.

The display panel 320 includes a thin film transistor substrate 322, an opposing substrate 324, and a liquid crystal layer (not shown), and the thin film transistor substrate 322 or the opposing substrate 324 may include a color filter. Can be.

The thin film transistor substrate 322 includes a first base substrate, a thin film transistor, and a pixel electrode. The opposing substrate 324 faces the thin film transistor substrate and includes a second base substrate and a common electrode. The liquid crystal layer is interposed between the thin film transistor substrate 322 and the counter substrate 324, and the liquid crystal of the liquid crystal layer is the common between the pixel electrode of the thin film transistor substrate 322 and the counter substrate 324. Is oriented by an electric field formed between the electrodes. The display panel 320 displays an image by using light emitted from the emission surface 423 of the light guide plate 420 included in the backlight assembly 400.

The backlight assembly 600 is disposed under the display panel 320 to provide light to the display panel 320, the light emitting module 200, the light guide plate 420, the reflective sheet 430, and the optical. Seats 440 and a lower receptacle 450.

The light emitting module 200 includes the printed circuit board 210 and the light emitting package 230. Since the light emitting module 200 is substantially the same as the light emitting module 200 illustrated in FIGS. 5 to 6B, a detailed description thereof will be omitted.

The light guide plate 420 is disposed on one side of the light emitting module 200, and receives the light generated from the light emitting module 200 and the light incident through the side toward the display panel 320. It includes the exit surface 423 to exit.

The reflective sheet 430 is disposed between the light guide plate 420 and the lower storage container 450 to reflect the light leaked from the light guide plate 420.

The optical sheets 440 may be disposed on the light guide plate 420 to increase the efficiency of light emitted from the light guide plate 420. The optical sheets 440 may include a first optical sheet 441, a second optical sheet 442, and a third optical sheet 443. For example, the first optical sheet 441, the second optical sheet 442, and the third optical sheet 443 may be diffusion sheets, prism sheets, and light collecting sheets, respectively.

The lower storage container 450 is combined with the upper storage container 310 to form the reflective sheet 430, the light guide plate 420, the light emitting module 200, the optical sheets 440, and the display panel ( 320).

The display device 500 may further include a mold frame 330. The mold frame 330 is disposed between the display panel 320 and the optical sheets 440 to support the display panel 320, the light guide plate 420, the optical sheets 440, and the optical sheet 440. The reflective sheet 430 is fixed to the lower storage container 450.

According to the present embodiment, the hole 225 is formed in the printed circuit board 210, and a portion of the protective material 260 and a portion of the light source 250 are disposed in the hole 225. Therefore, the thickness of the light emitting module 200 may be reduced, and the reliability of the light emitting module 200 may be improved. In addition, a bezel of the display device 300 including the light emitting module 200 may be reduced.

As described above, according to the light emitting module, the thickness of the light emitting module can be reduced, thereby reducing the thickness of the display device and the width of the bezel.

Although described above with reference to the embodiments, those skilled in the art can be variously modified and changed within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. I can understand.

100, 200: light emitting module 110, 210: printed circuit board
130, 230: light emitting package 131, 133, 231, 233: lead
150, 250: light source 160, 260: protective material
170, 270: sealing part 180, 280: fluorescent material
300, 500: display device 310: upper storage container
320: display panel 330: mold frame
400 and 600: backlight assembly 420: light guide plate
430: reflective sheet 440: optical sheets
450: lower storage container

Claims (21)

A printed circuit board on which holes are formed; And
A light emitting package including a light source and a lead, the light emitting package disposed on the printed circuit board
The protective material is formed of a stepped portion and a top portion, the stepped portion and a portion of the light source are disposed in a hole formed in the printed circuit board,
The width of the top of the protective material is wider than the width of the hole,
The light source is covered by the protective material and disposed in contact with the protective material,
The protective material light emitting module comprising a groove formed in the direction in which the light source generates light. 2. The lead of claim 1, wherein the lead is formed at a main lead portion, a first bending portion extending downward from the main lead portion, and a second end formed at an end of the first bending portion and extending in a direction parallel to the main lead portion. Including a bending part,
The light source module is characterized in that the light source is disposed on the second bending portion. The light emitting module of claim 2, wherein the stepped portion is disposed under the light source. The light emitting module of claim 3, wherein a height of the stepped portion is equal to a sum of a thickness of the lead and a thickness of the printed circuit board. The light emitting module of claim 1, wherein the stepped portion is disposed under the light source. The light emitting module of claim 5, wherein a height of the stepped portion is equal to a sum of a thickness of the lead and a thickness of the printed circuit board. The light emitting module of claim 1, wherein a height of the stepped portion is equal to a sum of a thickness of the lead and a thickness of the printed circuit board. The method of claim 1, wherein the light source is covered by a protective material,
The thickness of the protective material disposed on the upper surface of the light source and the thickness of the protective material disposed on the back of the light source is the same. The light emitting device of claim 8, wherein the light emitting package comprises a lead frame, the lead frame including a first portion bent downwardly from the lead and a second portion extending from an end of the first portion and parallel to the lead. ,
And the light source is disposed on the second portion parallel to the lead. The light emitting module of claim 9, wherein the stepped portion is disposed under the light source. The light emitting module of claim 10, wherein a height of the stepped portion is equal to a sum of a thickness of the lead and a thickness of the printed circuit board. The light emitting module of claim 8, wherein the stepped portion is disposed under the light source. The light emitting module of claim 12, wherein a height of the stepped portion is equal to a sum of a thickness of the lead and a thickness of the printed circuit board. The light emitting module of claim 8, wherein a height of the stepped portion is equal to a sum of a thickness of the lead and a thickness of the printed circuit board. The method of claim 1, wherein the light source is covered by a protective material,
The thickness of the protective material disposed on the upper surface of the light source and the thickness of the protective material disposed on the back of the lead is the same. The light emitting device of claim 15, wherein the light emitting package includes a lead frame, the lead frame including a first portion bent downwardly from the lead and a second portion extending from an end of the first portion and parallel to the lead. ,
And the light source is disposed on the second portion parallel to the lead. The light emitting module of claim 16, wherein the stepped portion is disposed under the light source. The light emitting module of claim 17, wherein a height of the stepped portion is equal to a sum of a thickness of the lead and a thickness of the printed circuit board. The light emitting module of claim 15, wherein the stepped portion is disposed under the light source. The light emitting module of claim 19, wherein the height of the stepped portion is equal to the sum of the thickness of the lead and the thickness of the printed circuit board. The light emitting module of claim 15, wherein a height of the stepped portion is equal to a sum of a thickness of the lead and a thickness of the printed circuit board.
KR1020120100646A 2012-03-29 2012-09-11 Light emitting module KR101994134B1 (en)

Priority Applications (1)

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KR20120032107 2012-03-29
KR1020120032107 2012-03-29

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040095782A1 (en) * 2002-11-15 2004-05-20 Citizen Electronics Co., Ltd. Light emitting device
KR100930425B1 (en) * 2008-01-25 2009-12-08 알티전자 주식회사 Side Light Emitting Diode Package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501103B1 (en) * 2001-10-23 2002-12-31 Lite-On Electronics, Inc. Light emitting diode assembly with low thermal resistance
KR100674871B1 (en) * 2005-06-01 2007-01-30 삼성전기주식회사 Side Emitting LED Package and Method of Manufacturing The Same
KR101240650B1 (en) * 2006-01-18 2013-03-08 삼성디스플레이 주식회사 Light emitting diode module and a backlight assembly provided with the same and a display device provided with the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040095782A1 (en) * 2002-11-15 2004-05-20 Citizen Electronics Co., Ltd. Light emitting device
KR100930425B1 (en) * 2008-01-25 2009-12-08 알티전자 주식회사 Side Light Emitting Diode Package

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