KR101987711B1 - Nozzle capable of fluid spray at entire substrate and substrate cleaning system using the same - Google Patents

Abstract

A nozzle capable of injecting fluid onto the entire substrate of the present invention includes: a nozzle body connected to a fluid supply source to receive a fluid; And a baffle plate provided on the nozzle body and having at least one opening for spraying the fluid supplied from the fluid supply source to the entire substrate. According to at least one of the embodiments of the present invention, the fluid can be injected into the entire substrate to be cleaned at one time without moving the nozzle from which the fluid is ejected, and the entire substrate can be cleaned with the fluid to be ejected at one time. According to at least one of the embodiments of the present invention, the entire substrate can be cleaned at a time, thereby reducing the cleaning time.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a nozzle for cleaning a substrate,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a nozzle capable of fluid ejection over a substrate and a substrate cleaning system using the same, more particularly, to a nozzle capable of cleaning a substrate by spraying a fluid onto the substrate, ≪ / RTI >

In order to manufacture a semiconductor device, a multilayer thin film is formed on a semiconductor substrate or a display substrate, and etching and cleaning processes are generally adopted for thin film formation. In the etching and cleaning processes, a thin film such as a nitride film deposited on the back surface of the substrate and particles act as a foreign substance in a subsequent process. Such unnecessary foreign matters such as thin films on the back surface of the substrate are removed using a substrate cleaning apparatus.

In particular, the cleaning process removes small particles, contaminants and unnecessary film remaining on the surface of the semiconductor substrate when performing these unit processes. In recent years, as the pattern formed on the semiconductor substrate has become finer, the importance of the cleaning process has increased.

Such a cleaning process includes a chemical solution treatment process for etching or removing contaminants on a semiconductor substrate by a chemical reaction, a rinsing process for cleaning a semiconductor wafer treated with a chemical solution by a chemical solution treatment process with deionizewater (DIW) And a drying step of drying the processed semiconductor wafer.

Generally, in the chemical solution treatment process, a nozzle for supplying a chemical liquid is disposed on an upper portion of a semiconductor substrate, and a nozzle cleans the semiconductor substrate by spraying a chemical solution on an upper surface of the semiconductor substrate. Such a chemical solution treatment process can cause environmental pollution in accordance with the used chemical solution, and a process for preventing environmental pollution is required, so that the cleaning cost is often high.

On the other hand, a technique for cleaning a semiconductor substrate without using such a chemical solution has been developed. For example, pure water and steam are injected into a semiconductor substrate to clean a washing surface.

The pure water and steam cleaning apparatus clean the substrate by spraying pure water and steam onto the substrate using a nozzle. At this time, the nozzle is linear or rotating, moving on the upper part of the substrate, and spraying pure water or steam. Therefore, in order to process the entire substrate, the nozzle must be moved several times. At this time, the upper portion of the substrate not included in the copper line through which the nozzle is moved may not be cleaned properly. Further, since the nozzle has to be moved several times, the structure of the cleaning device is complicated and power consumption for driving the cleaning device is large. In addition, since the substrate cleaning time is increased, the entire process time is increased.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a nozzle capable of jetting fluid onto the entire substrate to be cleaned at one time without moving the nozzle, and a substrate cleaning system using the same.

According to an aspect of the present invention, there is provided a nozzle comprising: a nozzle body connected to a fluid supply source and supplied with a fluid; And a baffle plate provided on the nozzle body and having at least one opening for spraying the fluid supplied from the fluid supply source to the entire substrate.

In one embodiment, the distance between the central region and the peripheral region is the same, or the distance from the central region to the edge region becomes narrower.

In one embodiment, the opening is formed in a slit shape.

In one embodiment, the opening has a center opening formed in a central region of the baffle plate; And an edge opening formed in an area except for a central area of the baffle plate.

In one embodiment, the nozzle body includes: a first nozzle body having a hollow space in which a fluid remains; And a second nozzle body in which the first nozzle body is spaced apart from the first nozzle body, wherein fluid supplied to the nozzle body is injected through the first nozzle body, And is injected through a spaced space between the body and the second nozzle body.

In one embodiment, the fluid supplied to the first nozzle body is supplied at the same time as the fluid supplied to the spaced space between the first nozzle body and the second nozzle body, or at another time.

In one embodiment, the apparatus further includes a suction unit for sucking the fluid injected into the substrate again.

In one embodiment, the baffle plate includes a hot wire inside.

According to an embodiment of the present invention, there is provided a substrate cleaning system using a nozzle capable of fluid injection on an entire substrate, comprising: a steam generator for generating a steam by supplying a fluid; A nozzle connected to the steam generator and spraying steam; And a chamber provided with the nozzle and including a susceptor for supporting the substrate therein.

In one embodiment, the susceptor rotates while steam is injected from the nozzle.

Effects of a nozzle capable of fluid spraying on the entire substrate according to the present invention and a substrate cleaning system using the same will be described below.

According to at least one of the embodiments of the present invention, the fluid can be injected into the entire substrate to be cleaned at one time without moving the nozzle from which the fluid is ejected, and the entire substrate can be cleaned with the fluid to be ejected at one time.

According to at least one of the embodiments of the present invention, the entire substrate can be cleaned at a time, thereby reducing the cleaning time.

1 is a schematic view of a substrate cleaning system for treating a substrate using steam.
2 is a view showing an embodiment of the spray nozzle unit according to the preferred embodiment of the present invention.
3 is a cross-sectional view illustrating an injection nozzle unit according to a preferred embodiment of the present invention.
Figs. 4 and 5 are plan views showing various embodiments of openings in the injection nozzle portion. Fig.
6 is a plan view showing an embodiment of an injection nozzle portion having a central region and a peripheral region.
7 is a plan view showing an embodiment of an injection nozzle portion having openings of various sizes.
8 is a cross-sectional view showing openings of various shapes.
9 and 10 are views showing another embodiment of the jet nozzle unit.
11 is a view illustrating a process of spraying steam through the spray nozzle unit shown in FIG.
12 is a view showing an embodiment of an ejection nozzle unit in which the distance from the substrate is nonuniform.
Fig. 13 is a view showing an embodiment of the injection nozzle portion equipped with the suction portion.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals are used to designate identical or similar elements, and redundant description thereof will be omitted. The suffix "module" and " part "for the components used in the following description are given or mixed in consideration of ease of specification, and do not have their own meaning or role. In the following description of the embodiments of the present invention, a detailed description of related arts will be omitted when it is determined that the gist of the embodiments disclosed herein may be blurred. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. , ≪ / RTI > equivalents, and alternatives.

Terms including ordinals, such as first, second, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It will be apparent to those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.

1 is a schematic view of a substrate cleaning system for treating a substrate using steam.

1, a substrate cleaning system 100 according to the present invention includes a steam generator 104 for generating steam, a substrate processing chamber 101, and a spray nozzle unit 110 for spraying steam .

The steam generating unit 104 is configured to generate steam by supplying fluid such as water or a cleaning liquid from the fluid supply source 106 and heating it. The steam generating section 104 may include a heating device for heating the fluid to a high temperature. Alternatively, the steam generating unit 104 may generate steam by heating the fluid to a high temperature, and generate steam by reheating the steam.

The substrate processing chamber 101 may have a susceptor 102 for supporting the substrate 103 to be processed therein. The substrate processing chamber 101 may be a processing chamber for processing the target substrate 103 or a separate chamber for cleaning the target substrate 103. The upper portion of the substrate processing chamber 101 may be provided with a spray nozzle unit 110 for spraying steam onto the substrate 103.

The injection nozzle unit 110 is connected to the steam generating unit 104 and may be installed at an upper portion of the substrate processing chamber 101. The spray nozzle unit 110 is positioned above the susceptor 102. The steam sprayed from the spray nozzle unit 110 is sprayed onto the upper surface of the target substrate 103 mounted on the susceptor 102, The surface of the substrate 103 is cleaned.

2 is a view showing an embodiment of the spray nozzle unit according to the preferred embodiment of the present invention.

In the present invention, the injection nozzle unit 110 is configured to inject fluid, and in the following description, steam is injected as an example.

Referring to FIG. 2, the injection nozzle unit 210 according to the present invention can receive steam through a supply line 208 connected to the steam generating unit 104. The injection nozzle unit 210 may be formed in a shape of a cone 210, a quadrangular pyramid 250, or a cylinder 260 as a whole. The injection nozzle unit 210 may be formed in a different shape depending on the shape of the substrate to be processed. For example, the injection nozzle unit 210 may be formed in a conical or cylindrical shape to process a substrate such as a wafer, and may be formed in a quadrangular pyramid shape to process a substrate such as a glass.

In the present invention, the injection nozzle unit 210 formed in a conical shape will be described as an example.

3 is a cross-sectional view illustrating an injection nozzle unit according to a preferred embodiment of the present invention.

Referring to FIG. 3, the injection nozzle unit 210 may include a nozzle body 312 and a baffle plate 320. The nozzle body 312 is connected to the supply line 308 at an upper portion thereof and may be formed in a conical shape having a hollow interior. The steam generated in the steam generator 104 is supplied into the nozzle body 312 through the supply line 308. A baffle plate 320 may be provided at a lower end (lower surface) of the nozzle body 312.

The baffle plate 320 is shaped like a circular plate having the same shape as the lower surface of the nozzle body 312. The baffle plate 320 may be provided with one or more openings 322. The opening 322 may be formed in a circular or slit shape, and the amount of steam injected may be adjusted according to the shape and size of the opening 322. Various modified embodiments of the opening 322 are described below.

The steam supplied into the nozzle body 312 may be injected into the substrate 303 through the opening 322. [ The opening 322 may be formed in a plurality of holes, and the shape of the hole may be various shapes such as a circle, a triangle, and a square.

A heat ray 324 may be inserted into the baffle plate 320. The heating wire 324 functions to heat the baffle plate 320 to an appropriate temperature. The baffle plate 320 is heated by the heating wire 324 so that the steam that is sprayed through the opening 322 of the baffle plate 320 The function of the temperature sensor can be improved. Therefore, the steam injected through the opening 322 is overheated and sprayed, thereby improving the cleaning efficiency of the substrate 303. [ Further, when the opening 322 is blocked by the water droplet, water droplets covering the opening 322 can be vaporized and removed by heating the baffle plate 320 to an appropriate temperature by the heat ray 324.

The size of the baffle plate 320 may be the same as or larger than the size of the substrate 303. Particularly, the steam injected through the opening 322 of the baffle plate 320 can be sprayed on the entire surface of the substrate 303 to be processed. In other words, the steam supplied to the spray nozzle unit 310 can be sprayed onto the substrate 303 at a time through the baffle plate 320.

Conventionally, since the size of the nozzle for spraying steam is very small as compared with the substrate to be processed, there is a problem that the nozzle must be moved in order to clean the substrate. However, according to the present invention, steam can be sprayed to the entire substrate to be treated 303 at once without moving the spray nozzle unit 310, thereby reducing the cleaning time.

The susceptor 302 on which the substrate 303 is placed may be fixed as shown in Fig. 3 (a) or may be rotationally driven by the motor 330, as shown in Fig. 3 (b) . Although not shown in the drawing, the susceptor 302 is fixed and the spray nozzle unit 310 can rotate, as shown in Fig. 3 (a). 3 (b), when the susceptor 302 rotates, the jetting nozzle unit 310 can rotate together.

Although not shown in the drawing, the baffle plate 320 is detachably installed to the nozzle body 312, so that the baffle plate 320 can be installed or removed according to a process of processing the substrate 303. Further, the baffle plate 320 can be exchanged and used.

Figs. 4 and 5 are plan views showing various embodiments of openings in the injection nozzle portion. Fig.

Referring to FIG. 4, the baffle plate 420 may have openings 422 of various shapes. The opening 422 may be formed in a plurality of slit shapes. The shape in which the steam is sprayed according to the pattern of the opening portion is also variously deformed.

4A), a plurality of slit-shaped openings 422 are formed such that one end is collected at the center and the other end is spaced apart from the edge of the baffle plate 420 by a predetermined distance . Here, the slit-shaped opening 422 may be formed as a curved line. The curved opening 422 may be formed to spray steam in the same or opposite direction as the rotating susceptor. The spacing between the plurality of openings 422 may be constant or may be different. The number of openings 422 is also not limited.

As another embodiment (see Fig. 4 (b)), the plurality of slit-shaped openings 424 may be formed linearly toward the edge around the center. The spacing between the plurality of openings 424 may be constant or may be different. The number of openings 424 is also not limited.

As another embodiment (see Fig. 4 (c)), the slit-shaped opening 426 may be formed in a spiral shape. Although only one opening 426 is shown in the drawing, a plurality of openings 426 may be formed at predetermined intervals.

As another embodiment (see Fig. 4 (d)), the opening 428 may be formed with a plurality of holes. The baffle plate 420 may be formed in a showerhead shape by forming a plurality of holes in the entire baffle plate 420 in the opening 428.

Referring to FIG. 5, the openings 522, 524, and 526 may be partially formed in a slit shape. Here, the overall arrangement structure is the same as the openings 422, 424 and 426 shown in Fig. The amount of steam injected by the number and size of the openings 522, 524, and 526 can be adjusted.

6 is a plan view showing an embodiment of an injection nozzle portion having a central region and a peripheral region.

Referring to FIG. 6, the injection nozzle unit 610 may include a nozzle body 612 and a baffle plate 620. The opening formed in the baffle plate 620 may be divided into a center opening 622 formed in the central region and an edge opening 624 formed in the peripheral region 624. The center opening 622 injects steam into a central region (center region) of the substrate to be processed, and the edge opening 624 can inject steam into a region (edge region) other than the central region of the substrate. The steam supplied through the supply line 628 is injected with the greatest amount of pressure in the central region, and a small amount is injected into the peripheral region as a weak pressure (compared to the pressure at the center). Therefore, the substrate processing efficiency in the central region and the peripheral region of the substrate to be processed can be varied. Therefore, by regulating the size or the number of the center opening 622 and the edge opening 624, the amount of steam injected to the substrate can be controlled, and uniform processing efficiency can be achieved on the entire surface of the substrate. The distance between the center opening 622 and the edge opening 624 can be adjusted.

 7 is a plan view showing an embodiment of an injection nozzle portion having openings of various sizes.

Referring to FIG. 7, the baffle plate 710 may be divided into first, second, and third ejection regions 722, 724, and 726 having concentric circles. Openings of different sizes may be formed in the first, second, and third injection regions 722, 724, and 726. For example, an opening having a gradually larger size may be formed in the first and second injection regions 722 and 724 and 726, which are at the center. The amount of steam injected into the central region (injection with a strong pressure) and the amount of steam injected into the peripheral region (injection with a weak pressure) are almost the same, so steam can be uniformly sprayed throughout the baffle plate 710.

Or the number of openings formed in the first, second, and third injection regions 722, 724, and 726 and the density of the openings can be controlled. For example, the opening may be formed more densely toward the second and third ejection regions 724 and 726 in the first ejection region 722, which is the most central portion. The amount of steam injected into the central region (injection with a strong pressure) and the amount of steam injected into the peripheral region (injection with a weak pressure) are almost the same, so steam can be uniformly sprayed throughout the baffle plate 710.

8 is a cross-sectional view showing openings of various shapes.

8 (a), the opening 822 may be formed through the baffle plate 820 vertically. Or 8 (b), the opening 824 may be formed to have an inverted trapezoidal shape in section. That is, the upper size of the opening 824 may be larger than the lower size of the opening 824. The injected steam can then be injected intensively through the opening 824. 8 (c), the opening 826 may be formed to have a trapezoidal cross section. That is, the opening 826 may be formed such that the upper size is smaller than the lower size. Then, the injected steam can be sprayed while diffusing through the opening portion 826. Or 8 (d), the opening 828 may be formed obliquely to have a slope. The sprayed steam can then be sprayed in the direction in which the opening 828 is tilted.

The openings 822, 824, 826, and 828 of various shapes shown in FIG. 8 may be formed by mixing in one baffle plate.

FIGS. 9 and 10 are views showing another embodiment of the spray nozzle unit, and FIG. 11 is a view illustrating a process of spraying steam through the spray nozzle unit shown in FIG.

9 and 10, the injection nozzle unit 910 may include a plurality of nozzle bodies 912, 914, and 916. The first nozzle body 912 has a hollow space in which the fluid remains. The second nozzle body 914 is spaced apart from the first nozzle body 912 by a predetermined distance and includes a first nozzle body 912 therein. The third nozzle body 916 is spaced apart from the second nozzle body 916 by a predetermined distance and includes a second nozzle body 916 therein.

A predetermined space is formed between the plurality of nozzle bodies 912, 914, and 916. Through the space between the first nozzle body 912 and the first nozzle body 912 and the second nozzle body 914 and between the second nozzle body 914 and the third nozzle body 916 Steam is moved. The steam supplied to the space between the plurality of nozzle bodies 912, 914 and 916 is injected into the substrate through the opening 922 of the baffle plate 920.

The steam supplied between the plurality of nozzle bodies 912, 914 and 916 may be supplied at the same time or may be supplied with a time difference. For example, as shown in FIG. 11, steam is firstly supplied to the innermost first nozzle body 912 to spray steam, and the first nozzle body 912 and the second nozzle body 914 The steam is supplied through the space between the second nozzle body 914 and the third nozzle body 916 and the steam is injected through the space between the second nozzle body 914 and the third nozzle body 916. By spraying steam from the inside to the outside of the plurality of nozzle bodies 912, 914 and 916, the steam can be diffused and sprayed over the entire substrate to be treated. This has the effect of pushing the particles (foreign matter) cleaned by the steam to the outside of the substrate to be treated.

12 is a view showing an embodiment of an ejection nozzle unit in which the distance from the substrate is nonuniform.

Referring to FIG. 12, the injection nozzle unit 1210 may be formed by providing a baffle plate 1220 having a concave upward central region on a nozzle body 1212. The distance d1 between the center area of the baffle plate 1220 and the substrate 1203 placed on the susceptor 1202 is equal to the distance d2 between the peripheral area of the baffle plate 1220 and the substrate 1203 ). In other words, the distance between the baffle plate 1220 and the substrate 1203 becomes narrower toward the edge (edge). As described above, since the amount of steam injected from the central region through the opening 1222 of the injection nozzle unit 1210 is larger than the amount of steam injected from the edge region, the baffle plate 1220 is formed into a concave shape The steam can be uniformly injected into the baffle plate 1220 as a whole.

Fig. 13 is a view showing an embodiment of the injection nozzle portion equipped with the suction portion.

Referring to FIG. 13, the injection nozzle unit 1310 may further include a suction unit 1350. The suction portion 1350 is installed along the outer periphery of the nozzle body 1312 and connected to the pump 1360. The steam supplied to the spray nozzle unit 1310 is sprayed on the entire upper surface of the target substrate 1303. Particles (foreign substances) contained in the target substrate 1303 are then cleaned by steam and separated from the target substrate 1303 by the sprayed steam. The particles separated from the target substrate 1303 and the sprayed steam are sucked into the suction unit 1350 of the spray nozzle unit 1310 and discharged to the outside or are filtered and reused.

The particles are separated from the target substrate 1303 by spraying steam on the target substrate 1303 using the spray nozzle unit 1310 and the separated particles are sucked by using the suction unit 1350, 1303 can be completely cleaned. Further, there is no need to perform a separate process for removing the separated particles.

The suction unit 1305 can be driven simultaneously with the spraying of the steam from the spray nozzle unit 1310 or the particles can be separated from the target substrate 1303 by spraying steam from the spray nozzle unit 1310 .

The foregoing detailed description should not be construed in any way as being restrictive and should be considered illustrative. The scope of the present invention should be determined by rational interpretation of the appended claims, and all changes within the scope of equivalents of the present invention are included in the scope of the present invention.

Claims (10)

A nozzle body connected to the fluid supply source and supplied with the fluid; And
And a baffle plate provided in the nozzle body and having one or more openings for spraying the fluid supplied from the fluid supply source to the entire substrate, the baffle plate having an upwardly concave shape,
Wherein the distance from the baffle plate to the substrate is reduced from a central region of the baffle plate to an edge region of the baffle plate.
delete The method according to claim 1,
The opening
A nozzle capable of jetting fluid across a substrate formed in a slit shape.
The method according to claim 1,
The opening
A center opening formed in a central region of the baffle plate; And
Wherein the baffle plate has an edge opening formed in an area except for the central area of the baffle plate.
The method according to claim 1,
The nozzle body includes:
A first nozzle body having a hollow space in which a fluid remains; And
And a second nozzle body in which the first nozzle body is disposed so as to be spaced apart from the first nozzle body,
The fluid supplied to the nozzle body is supplied to the nozzle body,
Wherein the nozzle is sprayed through the first nozzle body and is capable of jetting fluid across the substrate that is ejected through a spaced space between the first nozzle body and the second nozzle body.
6. The method of claim 5,
The fluid supplied to the first nozzle body may be supplied at the same time as the fluid supplied to the spaced space between the first nozzle body and the second nozzle body or may be supplied to the nozzle .
The method according to claim 1,
And a suction part for sucking the fluid ejected from the substrate again.
The method according to claim 1,
The baffle plate
A nozzle capable of fluid ejection over an entire substrate including a hot wire therein.
A steam generator for supplying steam to the steam generator to generate steam;
A nozzle connected to the steam generator and configured to spray steam by any one of the first to third aspects; And
Wherein a nozzle capable of ejecting fluid is used over the entire substrate including the chamber provided with the nozzle and the susceptor for supporting the substrate therein.
10. The method of claim 9,
Wherein the susceptor comprises:
And a nozzle capable of jetting fluid onto the entire substrate rotated while the steam is sprayed from the nozzle.

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