KR101981703B1 - Electronic device with thermal spreader - Google Patents

Abstract

An electronic device with improved heat generation is disclosed herein. The disclosed electronic device includes a housing including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction, a display exposed through at least a portion of the first surface, A printed circuit board disposed between the first surface and the second surface, an electronic component disposed on the printed circuit board, and a conductive structure at least partially surrounding the electronic component, wherein the shielding structure mounted on the printed circuit board A shielding structure that encloses a side surface of the electronic component and a shield cover that covers an upper surface of the electronic component and that is disposed on the shield frame and closes a space accommodated in the electronic component; Wherein the first end is thermally coupled to a portion of the shielding structure and the first end is closer to the shielding structure than the second end Arranged between the heat pipe arrangement disposed between the electronic component and the shield cover to which the first thermal interface material and the first end portion and the shield cover of the heat pipe it is possible to include a second heat transfer material. Other embodiments are possible.

Description

[0001] ELECTRONIC DEVICE WITH THERMAL SPREADER [0002]

Various embodiments of the present invention are directed to electronic devices having a heat collection / diffusion structure.

Electronic devices such as smartphones or tablet computers are becoming an important means of delivering rapidly changing information. Such an electronic device facilitates user's work through a graphical user interface (GUI) environment using a touch screen, and provides various multimedia media based on the web environment.

Electronic devices are equipped with various communication components and electronic components in order to provide various functions. For example, a stereo speaker module is mounted on an electronic device to provide a music listening function using stereo sound. In addition, the camera module is mounted on an electronic device to provide a photographing function. Further, the communication module is mounted on an electronic device, and a communication function with other electronic devices through the network is provided.

In addition, for a higher performance electronic device, more electronic components are mounted on the printed circuit board in a confined space.

The electronic device may increase the heat generation of the mounted component due to slimming of the main body and use of a high-end application processor (AP).

BACKGROUND ART [0002] As a heat source of an electronic device, a printed circuit board (hereinafter referred to as a substrate) on which various electronic components are mounted may be a main heat source, and an application processor (AP) mounted on a substrate has a high heat generation. It is one of the H / W designs.

Various embodiments of the present invention can provide an electronic device having a heat collecting / diffusing structure of a heat generating part using a heat pipe, among a plurality of parts mounted on a substrate.

An electronic device according to various embodiments of the present invention includes a housing including a first surface oriented in a first direction and a second surface oriented in a second direction opposite to the first direction; A display exposed through at least a portion of the first surface; A printed circuit board disposed between the first surface and the second surface; An electronic component disposed on the printed circuit board; A shield structure mounted on the printed circuit board, the shield structure comprising a conductive structure at least partially surrounding the electronic component, the shield structure comprising: a shield frame surrounding a side surface of the electronic component; and a shield frame surrounding the top surface of the electronic component, And a shield cover disposed to close a space accommodated in the electronic component; A heat pipe including a first end and a second end, the first end being thermally coupled to a portion of the shielding structure, the first end being disposed closer to the shielding structure than the second end; A first heat transfer material disposed between the electronic component and the shield cover; And a second heat transfer material disposed between the first end of the heat pipe and the shield cover.

An electronic device according to various embodiments of the present invention includes a housing including a first surface oriented in a first direction and a second surface oriented in a second direction opposite to the first direction; A display exposed through at least a portion of the first surface; A printed circuit board disposed between the first surface and the second surface; A plurality of heating elements disposed on the printed circuit board; A shielding structure mounted on the printed circuit board, the shielding structure including a conductive structure at least partially surrounding the plurality of heating elements, comprising: a shield frame surrounding at least a part of a side surface of the plurality of heating elements; And a shield cover disposed on the shield frame to close a space in which the plurality of heating elements are accommodated; A heat pipe including a first end and a second end, the first end being thermally coupled to a portion of the shielding structure, the first end being disposed closer to the shielding structure than the second end; A first heat transfer material disposed between the heat generating elements and the shield cover; And a second heat transfer material disposed between the first end of the heat pipe and the shield cover.

An electronic device according to various embodiments of the present invention includes a support structure; A printed circuit board comprising a first side facing the support structure and a second side opposite to the first side; At least one heat source disposed on the first surface of the printed circuit board; A shield structure mounted on the printed circuit board, the shield structure including a conductive structure at least partially surrounding the heat source, the shield frame surrounding a side surface of the heat source, and a shield frame surrounding the top surface of the heat source, A shielding structure including a shield cover closing a space in which the heat source is housed; A heat pipe including a first end and a second end, the first end being thermally coupled to a portion of the shielding structure, the first end being disposed closer to the shielding structure than the second end; A first heat transfer material disposed between the heat source and the shield cover; A second heat transfer material disposed between the first end of the heat pipe and the shield cover; And a heat collecting member that is thermally coupled to the heat source and transfers heat generated from the heat source to at least the first end of the heat pipe.

An electronic device according to various embodiments of the present invention includes a display; A circuit board disposed below the display; An electronic component disposed on a face of the circuit board facing the display; A first heat transfer member disposed on the electronic component; A shielding member surrounding at least a portion of the electronic component and at least a portion of the first heat transfer member so as to shield electromagnetic interference (EMI) associated with the electronic component; A second heat transfer member disposed on the shielding member; A heat pipe disposed over the shield member to receive at least a portion of the heat emitted from the electronic component through the first heat transfer member, the shield member, and the second heat transfer member; And a support member surrounding at least a portion of the heat pipe and supporting the display.

An electronic device according to various embodiments of the present invention may utilize a heat pipe to provide a heat collection / diffusion structure of the heat generating component.

An electronic device according to various embodiments of the present invention can provide a heat collecting / diffusing structure of a heat generating component including a heat transfer structure in a shielding structure while maintaining a shielding structure.

An electronic device according to various embodiments of the present invention provides an electronic device having a heat collecting / diffusing structure that can transfer heat to a portion that is relatively cooler than a heat generating component using a metal heat collecting device or a heat pipe .

1A is a perspective view illustrating a front surface of an electronic device according to various embodiments.
1B is a perspective view showing a rear surface of an electronic device according to various embodiments.
1C is a diagram showing six sides of an electronic device according to various embodiments, respectively.
Figs. 2 and 3 are exploded perspective views each showing a configuration of an electronic device according to various embodiments. Fig.
4 is a plan view showing a state in which a heat pipe according to various embodiments of the present invention is disposed in an electronic device.
5 is a plan view showing a state in which a heat pipe according to various embodiments of the present invention is disposed in an electronic device.
6 is a perspective view illustrating a heat pipe according to various embodiments of the present invention.
FIG. 7A is an exemplary view illustrating a heat transfer flow of a heat pipe combined with a heat collecting apparatus according to various embodiments of the present invention. FIG.
7B is a cross-sectional view of line AA of FIG. 7A.
7C is a cross-sectional view of line BB of FIG. 7A.
8A is a cross-sectional view illustrating a heat transfer structure of a heat pipe combined with a heat collecting apparatus according to various embodiments of the present invention.
8B is a view of an electrical system in which a heat pipe incorporating a heat collecting device according to various embodiments of the present invention is disposed.
8C is a cross-sectional view of an electrical system in which a heat pipe incorporating a heat collecting device according to various embodiments of the present invention is disposed.
9-14 are cross-sectional views, respectively, of an electronic device in which a heat transfer structure is applied in a laminated form to a shield structure according to various embodiments of the present invention.
15 is a perspective view showing a substrate to which a heat pipe is applied in a lateral direction of a shielding structure according to various embodiments of the present invention.
16A is a perspective view showing a heat collecting apparatus according to various embodiments of the present invention.
16B is a plan view showing a state in which a heat pipe is partially coupled to a heat collecting apparatus according to various embodiments of the present invention.
17A-17D are cross-sectional views each showing a state in which a portion of a heat pipe is coupled to a support structure according to various embodiments of the present invention.
18A and 18B are cross-sectional views respectively showing a state in which a heat pipe is partially coupled to a heat collecting apparatus according to various embodiments of the present invention.
19A is a plan view showing a state where a heat pipe is coupled to a reinforcing plate of a display according to various embodiments of the present invention.
FIG. 19B is a cross-sectional view taken along the line AA in FIG. 19A. FIG.
20A is a plan view showing a heat pipe coupled to a rear cover according to various embodiments of the present invention.
20B is a cross-sectional view taken along the line BB of FIG. 20A.
21 is a plan view showing a heat pipe coupled to a rear case according to various embodiments of the present invention.
22A is a view illustrating a state in which heat pipes are disposed in the first and second receiving grooves according to various embodiments of the present invention.
22B is a cross-sectional view illustrating a state in which heat pipes are disposed in the first and second receiving grooves according to various embodiments of the present invention.
23A is a view of a heat gathering / diffusion structure provided with clips and a heat pipe in a plurality of shielding structures according to various embodiments of the present invention.
23B is a perspective view illustrating a state where the clip is coupled between the first and second shielding structures according to various embodiments of the present invention.
FIG. 24 is a cross-sectional view showing a state in which a heat collecting / diffusing structure is provided on the first and second surfaces of the substrate according to various embodiments of the present invention, respectively.
25 is a cross-sectional view illustrating the structure of a PBA provided with a heat collecting / diffusing structure according to various embodiments of the present invention.
26 is a cross-sectional view illustrating the structure of a PBA provided with a heat collecting / diffusing structure according to various embodiments of the present invention.
27 to 29 are illustrations each showing the arrangement of a heat pipe coupled with a heat collecting / diffusing device according to various embodiments of the present invention.

Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood, however, that this disclosure is not intended to limit the present disclosure to the particular embodiments, but includes various modifications, equivalents, and / or alternatives of the embodiments of the present disclosure. In connection with the description of the drawings, like reference numerals may be used for similar components.

In this document, the expressions " having, " " having, " " comprising, " or &Quot;, and does not exclude the presence of additional features.

In this document, the expressions "A or B," "at least one of A or / and B," or "one or more of A and / or B," etc. may include all possible combinations of the listed items . For example, "A or B," "at least one of A and B," or "at least one of A or B" includes (1) at least one A, (2) at least one B, (3) at least one A and at least one B all together.

The terms "first," "second," "first," or "second," etc. used in various embodiments may describe various components in any order and / or importance, Lt; / RTI > The representations may be used to distinguish one component from another. For example, the first user equipment and the second user equipment may represent different user equipment, regardless of order or importance. For example, without departing from the scope of the present disclosure, the first component may be referred to as a second component, and similarly, the second component may be named as the first component.

It is also possible that a component (eg, a first component) is "(operatively or communicatively coupled) / to" another component (eg, a second component) It is to be understood that when an element is referred to as being " connected to ", it is to be understood that the element may be directly connected to the other element or may be connected through another element (e.g., a third element). On the other hand, when it is mentioned that a component (e.g., a first component) is " directly connected " or " directly connected " to another component (e.g., a second component) It can be understood that there is no other component (e.g., a third component) between other components.

The phrase " configured to " as used herein is intended to encompass, depending on the context, for example, having the ability to be suitable for, The present invention may be used interchangeably with "designed to," "adapted to," "made to," or "capable of". The term " configured to (or configured) " may not necessarily mean specifically designed to be "specifically designed." Instead, in some circumstances, the expression "a device configured to" (Or set) to perform phrases A, B, and C. For example, a processor " configured (or configured) to perform phrases A, B, and C " (E. G., An embedded processor), or a generic-purpose processor (e. G., A CPU or application processor) capable of performing the operations by executing one or more software programs stored in the memory device.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the other embodiments. The singular expressions may include plural expressions unless the context clearly dictates otherwise. All terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the art of the present disclosure. Commonly used predefined terms may be interpreted to have the same or similar meaning as the contextual meanings of the related art and are not to be construed as ideal or overly formal in meaning unless expressly defined in this document . In some cases, the terms defined herein may not be construed to exclude embodiments of the present disclosure.

An electronic device in accordance with various embodiments of the present disclosure can be, for example, a smartphone, a tablet personal computer, a mobile phone, a videophone, an electronic book reader e- book reader, a desktop personal computer, a laptop personal computer, a netbook computer, a workstation, a server, a personal digital assistant (PDA), a portable multimedia player (PMP) Player, a mobile medical device, a camera, or a wearable device (e.g. smart glasses, head-mounted-device (HMD)), electronic apparel, electronic bracelets, electronic necklaces, An electronic device, an electronic device, an apparel, an electronic tattoo, a smart mirror, or a smart watch).

In some embodiments, the electronic device may be a smart home appliance. Smart home appliances include, for example, televisions, digital video disk players, audio, refrigerators, air conditioners, vacuum cleaners, ovens, microwaves, washing machines, air cleaners, set- (Such as a home automation control panel, a security control panel, a TV box, such as Samsung HomeSync ^TM , Apple TV ^TM or Google TV ^TM , a game console such as Xbox ^TM , PlayStation ^TM , An electronic key, a camcorder, or an electronic photo frame.

In an alternative embodiment, the electronic device may be any of a variety of medical devices (e.g., various portable medical measurement devices such as a blood glucose meter, a heart rate meter, a blood pressure meter, or a body temperature meter), magnetic resonance angiography (MRA) A global positioning system receiver, an event data recorder (EDR), a flight data recorder (FDR), an automotive infotainment device, a navigation system, a navigation system, Electronic devices (eg marine navigation devices, gyro compass, etc.), avionics, security devices, head units for vehicles, industrial or home robots, ATMs (automatic teller's machines) point of sale or internet of things such as light bulbs, various sensors, electric or gas meters, sprinkler devices, fire alarms, thermostats, street lights, toasters, A water tank, a heater, a boiler, and the like).

According to some embodiments, the electronic device is a piece of furniture or a part of a building / structure, an electronic board, an electronic signature receiving device, a projector, Water, electricity, gas, or radio wave measuring instruments, etc.). In various embodiments, the electronic device may be a combination of one or more of the various devices described above. An electronic device according to some embodiments may be a flexible electronic device. Further, the electronic device according to the embodiment of the present disclosure is not limited to the above-described devices, and may include a new electronic device according to technological advancement.

Hereinafter, an electronic device according to various embodiments will be described with reference to the accompanying drawings. In this document, the term user may refer to a person using an electronic device or a device using an electronic device (e.g., an artificial intelligence electronic device).

1B is a perspective view showing a rear surface of an electronic device according to various embodiments, FIG. 1C is a perspective view showing an electronic device according to various embodiments in front and rear, Fig.

1A to 1C, an electronic device 100 according to various embodiments may be provided with a display 101 (or a touch screen may be referred to as a touch screen) on a front surface 1001 thereof. And a receiver 102 for receiving the voice of the other party on the upper side of the display 101 may be disposed. A microphone 103 for transmitting the voice of the user of the electronic device to the other party may be disposed below the display 101. [

The electronic device 100 according to various embodiments may be arranged with components for performing various functions of the electronic device 100 in the periphery where the receiver 102 is installed. The components may include at least one sensor module 104. The sensor module 104 may include at least one of an illuminance sensor (e.g., a light sensor), a proximity sensor (e.g., a light sensor), an infrared sensor, and an ultrasonic sensor. According to one embodiment, the part may include a front camera 105. According to one embodiment, the component may include an indicator 106 for informing the user of the status information of the electronic device 100.

The display 101 according to various embodiments may be formed with a large screen to occupy most of the front side of the electronic device 100. The main home screen is the first screen displayed on the display 101 when the electronic device 100 is turned on. Also, when the electronic device 100 has different pages of different home screens, the main home screen may be the first home screen of the plurality of pages. The home screen may display shortcut icons for executing frequently used applications, a main menu switch key, time, weather, and the like. The main menu switching key may display a menu screen on the display 101. [ In addition, a status bar may be formed at the upper portion of the display 101 to indicate the status of the device 100 such as the battery charging status, the intensity of the received signal, and the current time. A home key 110a, a menu key 110b, and a back key 110c may be formed on the lower portion of the display 101.

The home key 110a according to various embodiments may display a main home screen on the display 101. [ For example, when the home key 110a is touched in a state that a home screen or a menu screen different from the main home screen is displayed on the display 101, the main home screen may be displayed on the display 101. [ Also, when the home key 110a is touched while applications are being executed on the display 101, the main home screen may be displayed on the display 101. FIG. The home key 110a may also be used to display recently used applications on the display 101 or to display a task manager. The home key 110a may be deleted from the front of the electronic device 100. [ A fingerprint recognition sensor device may be disposed on the upper surface of the home key 110a. The home key performs a first function (a home screen return function, a wakeup / sleep function, and the like) by an operation of physically pressing the second key, and the second key Etc.). ≪ / RTI >

The menu key 110b according to various embodiments may provide a connection menu that may be used on the display 101. [ For example, the connection menu may include a widget add menu, a wallpaper change menu, a search menu, an edit menu, a configuration menu, and the like. The back key 110c according to various embodiments may display a screen that was executed immediately before the currently running screen or may terminate the most recently used application.

The electronic device 100 according to various embodiments may include a metal frame 120 as a metal housing. The metal frame 120 may be disposed along the rim of the electronic device 100 and extended to at least a portion of the rear surface of the electronic device 100 that extends with the rim. The metal frame 120 may be at least part of the thickness of the electronic device 100 along the rim of the electronic device and may be formed in a closed loop shape.

The metal frame 120 according to various embodiments may be disposed only in at least a part of the rim of the electronic device 100. [ When the metal frame 120 is part of the housing of the electronic device 100, the remaining portion of the housing may be replaced by a non-metallic member. In this case, the housing may be formed in such a manner that a non-metallic member is insert-injected into the metal frame 120. The metal frame 120 includes at least one segment 125 and 126 so that the unit metal frame separated by the segments 125 and 126 may be utilized as an antenna radiator. The upper frame 123 may be a unit frame by a pair of segment portions 125 formed at regular intervals. The lower frame 124 may be a unit frame formed by a pair of segment portions 126 formed at regular intervals. The segment portions 125 and 126 may be formed together when the nonmetal member is insert-injected into the metal member.

The metal frame 120 according to various embodiments may have a closed loop shape along the rim. The metal frame 120 may include a left frame 121, a right frame 122, an upper frame 123, and a lower frame 124, when the electronic device 100 is viewed from the front.

The lower frame 124 according to various embodiments may be arranged with various electronic components. A speaker 108 may be disposed on one side of the microphone 103. At the other side of the microphone 103, an interface connector 107 for charging the electronic device 100 by receiving data transmission / reception function by an external device and an external power source may be disposed. An ear jack hole 109 may be disposed at one side of the interface connector 107. The microphone 103, the speaker 108, the interface connector 107 and the ear jack hole 109 described above are all located within the area of the unit frame formed by the pair of segment portions 126 disposed in the lower frame 124 . However, the present invention is not limited to this, and at least one of the above-described electronic components may be disposed in an area including the segment 126 or outside the unit frame.

Various electronic components may also be disposed on the upper frame 123 according to various embodiments. The upper frame 123 may be provided with a socket device 116 for inserting a card-shaped external device. The socket device 116 may receive at least one of a unique ID card (e.g., a SIM card, a UIM card, etc.) for an electronic device, and a memory card for storage expansion. The infrared sensor module 118 may be disposed on one side of the socket device 116 and the auxiliary microphone device 117 may be disposed on one side of the infrared sensor module 118. The socket device 116, the infrared sensor module 118 and the auxiliary microphone device 117 may both be all disposed in the region of the unit frame formed by the pair of segment portions 125 disposed in the upper frame 123 . However, the present invention is not limited to this, and at least one of the above-described electronic components may be disposed in an area including the segment 125 or outside the segment.

At least one first side key button 111 may be disposed in the left frame 121 according to various embodiments. At least one first side key button 111 is partially protruded and arranged in the left frame 121 to perform a volume up / down function, a scroll function, and the like.

At least one second side key button 112 may be disposed in the right frame 122 according to various embodiments. The second side key button 112 may perform a power on / off function, a wakeup / sleep function of the electronic device, and the like.

The back camera 100 may be disposed on the rear surface 1002 of the electronic device 100 and the at least one electronic device 114 may be disposed on one side of the rear camera 113. [ For example, the electronic component 114 may include at least one of an illuminance sensor (e.g., a light sensor), a proximity sensor (e.g., a light sensor), an infrared sensor, an ultrasonic sensor, a heart rate sensor,

The front surface 1001 including the display 101 according to various embodiments includes a flat surface portion 1011 and a left curved surface portion 1012 and a right curved surface portion 1013 which are formed on both left and right sides of the flat surface portion 1011, ). The front surface 1001 of the electronic device 100 may include both the display area 101 and other areas (e.g., a BM area) using one window. The left and right curved portions 1012 and 1013 may extend in the X axis direction of the electronic device 100 at the plane portion 1011. [ The left and right curved portions 1012 and 1013 may be the side of the electronic device 100. [ In this case, the left and right curved portions 1012 and 1013 and the left and right frames 121 and 122 of the metal frame 120 may be the side of the electronic device 100 together. However, the present invention is not limited to this, and the front surface 1001 including the display 101 may include at least one of the left and right curved portions 1012 and 1013. [ The front surface 1001 may include only the left curved portion 1012 along the plane portion 1011 or may include only the right curved portion 1013 along the plane portion 1011. [

The front surface 1001 according to various embodiments includes a window (shown in FIG. 2) 240 including curved portions 1012 and 1013 on the left and right and a flexible display module applied to at least a portion of the lower side of the window can do. According to one embodiment, a window (shown in FIG. 3) 130 may be formed in a manner that the upper surface and the rear surface are bent at the same time (hereinafter, referred to as a '3-D method'). However, the present invention is not limited thereto. A window (shown in FIG. 3) 130 may be formed in a manner that the left and right portions of the upper surface are formed in a curved shape and the rear surface is formed in a plane (hereinafter referred to as a 2.5D method). The window may be formed of a transparent glass material (e.g., sapphire glass) or a transparent synthetic resin material.

The electronic device 100 according to various embodiments may control the display module to selectively display information. The electronic device 100 can configure the screen only on the flat surface 1011 by controlling the display module. The electronic device 100 may configure the screen by including any one of the left and right curved portions 1012 and 1013 together with the plane portion 1011 by controlling the display module. The electronic device 100 may control the display module to constitute a screen with at least one curved portion of the left and right curved portions 1012 and 1013 except for the flat portion 1011. [

The rear surface 1002 of the electronic device 100 according to various embodiments may be formed entirely by one rear surface-surface-mounting member 115. The rear surface 1002 includes a planar portion 1151 that is formed substantially at the center and may or may not include left and right curved portions on the left and right sides of the planar portion 1151.

2 is an exploded perspective view of an electronic device according to various embodiments. The electronic device 200 according to various embodiments may be the same electronic device as the electronic device 100 described above.

2, the electronic device 200 according to various embodiments includes a PCB 260, an internal support structure 220, a display module 230, and a front window 240 (Which may be roughly referred to as a first plate facing the first direction) may be arranged in a sequential manner.

The electronic device 200 according to various embodiments includes a wireless power transmitting and receiving member 280 (which may include a flexible printed circuit board having an antenna pattern) and a rear window 250 (Which may be referred to as a second plate facing a second direction which is roughly opposite to the first direction) are sequentially stacked.

The battery pack 270 according to various embodiments may be accommodated in the accommodation space 211 of the battery pack 270 formed in the housing 210 and may be disposed while avoiding the PCB 260. According to one embodiment, the battery pack 270 and the PCB 260 may be arranged in a parallel manner without being overlapped.

The display module 230 according to various embodiments may be fixed to the inner support structure 220 and the front window 240 may be fixed to the inner support structure 220 by a first adhesive member 291 . The rear window 250 according to various embodiments may be secured in a manner that it is attached to the housing 210 by the second adhesive member 292. [ An electronic device according to various embodiments may include at least a portion of a side member that encloses at least a portion of the space between the first plate and the second plate.

The front window 240 according to various embodiments may include a planar portion 240a and a left bending portion 240b and a right bending portion 240c bent in both directions at the planar portion 240a. For example, the front window 240 may be positioned on the top of the electronic device 200 to display a screen displayed on the display module 230 using a transparent material, . Although the left and right bending portions 240b and 240c are formed in a 3D manner, the shape of the upper and lower single refraction type or the upper, lower, left, and right birefringent shapes . According to one embodiment, the rear surface of the front window 240 may further include a touch panel, which may receive a touch input signal from the outside.

The display module 230 according to various embodiments may be formed in a shape corresponding to the front window 240 (shape having a corresponding curvature). According to one embodiment, the display module 230 may include left and right bending portions 230b and 230c around the flat portion 230a. The display module 230 according to one embodiment may be a flexible display module. According to one embodiment, when the rear surface of the front window 240 is planar (hereinafter, referred to as '2D mode' or 2.5D mode), the rear surface of the front window 240 is flat, (on-cell tsp AMOLED) may be applied

The first adhesive member 291 according to various embodiments is a component for securing the front window 240 to an internal support structure (e.g., bracket) 220 disposed within an electronic device, such as a double-sided tape Tape, and may be a liquid adhesive layer, such as a bond. For example, when a double-sided tape is applied with the first adhesive member 291, a general PET (polyEthylene terephthalate) material can be applied to the inner substrate, and a functional substrate can be applied. For example, it is possible to strengthen the impact resistance by using a foam tape or a substrate made of an impact resistant fabric to prevent the front window from being damaged by an external impact.

The inner support structure 220 according to various embodiments may be disposed within the electronic device 200 and used as a component to enhance the overall rigidity of the electronic device. For example, at least one of Al, Mg and STS may be used for the inner support structure 220. According to one embodiment, the inner support structure 220 may be made of high-rigidity plastic containing glass fiber, or metal and plastic may be used together. According to one embodiment, as the material of the inner support structure 220, when the metal member and the non-metal member are used together, the inner support structure 220 may be formed by insert injection of a non-metallic member into the metal member. The inner support structure 220 is positioned on the back surface of the display module 230 and has a shape (curvature) similar to that of the back surface of the display module 230 and can support the display module 330. Between the inner support structure 220 and the display module 230, a sheet such as a sponge, an elastic member such as a rubber, an adhesive layer such as a double-sided tape, And may further be disposed to protect the display module 230.

The electronic device 200 according to various embodiments may include an auxiliary device for reinforcing internal rigidity or improving thermal characteristics, antenna characteristics, etc., by adding metal or composite material in the form of a plate to the hole area 221 as needed .

The inner support structure 220 according to various embodiments may be coupled to a housing (e.g., a rear case) 210 to create a space therein, in which at least one electronic component may be disposed. The electronic component may include a printed circuit board (PCB) 260. However, the present invention is not limited to the PCB 260, but may include an antenna device, a sound device, a power supply device, a sensor device, and the like.

A battery pack 270 according to various embodiments may supply power to the electronic device 200. [ According to one embodiment, one side of the battery pack 270 is adjacent to the display module 230 and the other side of the battery pack 270 is adjacent to the rear window 250 so that deformation and breakage of the counterpart when the battery pack 270 is inflated during charging . In order to prevent this, a swelling gap between the battery pack 270 and the partner (e.g., the display module 230 and the rear window 250) can be protected. According to one embodiment, the battery pack 270 may be integrated into the electronic device 200. However, when the rear window 250 is detachably mounted on the electronic device 200, the battery pack 270 may be detachably mounted.

The housing 210 according to various embodiments may form an exterior (e.g., a side including a metal bezel) of the electronic device 200 and may be combined with the internal support structure 220 to create an internal space. According to one embodiment, the front surface of the housing 210 may be disposed with the front window 240, and the rear surface thereof with the rear window 250. However, the present invention is not limited to this, and the back surface can be variously embodied such as injection by synthetic resin, metal, and composite of metal and synthetic resin. According to one embodiment, the gap between the housing 210 and the internal structure formed by the rear window 250 is greater than the gap between the rear window 250 and the rear window 250 when the external impact occurs, It is possible to prevent breakage.

The wireless power transmitting and receiving member 280 according to various embodiments may be disposed on the back surface of the housing 210. According to one embodiment, the wireless power transmitting and receiving member 280 is attached to one side of the inner mounting component or to a portion of the inner side of the housing 210, particularly an area adjacent to the generally rear window 250, in the form of a thin film, And forms a contact with the PCB 260 therein. According to one embodiment, the wireless power transmitting and receiving member 280 may be embedded or attached as part of a battery pack 270 or the like, or as part of the housing 210, As shown in FIG.

The second adhesive member 292 according to various embodiments may be applied in a form similar to the first adhesive member 291 described above as a component for fixing the rear window 250 to the housing 210. [

According to various embodiments, the rear window 250 may be applied in a similar fashion to the front window 240 described above. According to one embodiment, the front surface (the surface exposed to the outside) of the rear window 250 may be formed to have a curvature inclined to both left and right ends. The rear surface of the rear window 250 according to one embodiment may be formed in a flat surface and adhered by the housing 210 and the second adhesive member 292.

3 is an exploded perspective view showing a main configuration of an electronic device according to various embodiments.

Referring to FIG. 3, the electronic device 300 according to various embodiments may have at least one member related to the appearance on the external surface. For example, the external appearance of the electronic device 300 may include an exterior member, such as a front cover 310, a back cover 320, a case 330 including side walls 331 (sidewall) . In addition, the external appearance of the electronic device 300 may include a home key, a receiver, or the like disposed on the front surface thereof, and a rear camera, a flash or a speaker may be disposed on the rear surface thereof, , A connector or a microphone hole may be disposed.

The electronic device 300 according to various embodiments may require a structure in which foreign matter such as water is prevented from penetrating into the external environment, for example, the members disposed in the external appearance. The electronic device 300 according to various embodiments may include a front cover 310, a back cover 320, a case 330, a structure 340, and a waterproof structure.

The front cover 310 according to various embodiments can form the front surface of the electronic device 300 and can take the front appearance. The front cover of the electronic device 300 according to various embodiments may be composed of a transparent member. For example, the transparent member may include transparent synthetic resin or glass. The display supported on the structure may include a screen area exposed through the front cover.

The back cover 320 according to various embodiments may form the back surface of the electronic device 300 and may serve as a back surface. The back cover 320 of the electronic device 300 according to various embodiments may be composed of a transparent or opaque member. For example, the transparent member may include transparent synthetic resin or glass, and the opaque member may be made of a material such as translucent / opaque synthetic resin or metal.

The side wall 331 of the case 330 according to various embodiments can form the side of the rim of the electronic device 300 and can take the side appearance. The sidewall 331 of the electronic device according to various embodiments may be comprised of a conductive material, i. E., A conductive sidewall. For example, the side wall may be made of a metal material and can operate as an antenna radiator. The side walls 331 according to various embodiments may surround at least a portion of the space provided by the front cover 310 and the rear cover 320. [ The side walls 331 according to various embodiments may be formed integrally with a conductive structure or a non-conductive structure.

The electronic device 300 according to various embodiments can be divided into a first space and a second space by the rear case 330 by the front cover 310, the rear cover 320 and the side wall 331 have. The rear cover 320 may be divided into a first space and the front cover 310 may be divided into a second space with respect to the rear case 330.

A plurality of internal support structures 340 may be formed according to various embodiments. A first structure for supporting a display, a substrate, or the like may be constructed, and a second structure capable of supporting the exterior member may be configured . For example, a structure capable of supporting and protecting other components such as the battery B can be constructed. The inner support structure 340 according to various embodiments may be composed of synthetic resin, metal, or a combination thereof, and may also be made of a metal alloy containing magnesium.

Hereinafter, a structure for improving heat dissipation of a heat generating component among a plurality of components mounted on a substrate of an electronic device will be described.

4 is a plan view showing a state in which a heat pipe according to various embodiments of the present invention is disposed in an electronic device.

4, an electronic device 400 according to various embodiments may employ a heat pipe 450 that is mounted to an internal support structure 420 to cool the temperature of the heat source 412. For example, the heat pipe 450 conveys the heat from the heat source 412 of the relatively hot zone to the low temperature region with a relatively low temperature, and diffuses the heat transfer path to the region around the heat pipe 450 And can perform a function of heat dispersion to an area remote from the area around the heat pipe 450. The heat pipe 450 may be a heat transfer member capable of transferring a large amount of heat to a relatively low temperature region using a fluid having a high specific heat.

The heat pipe 450 according to various embodiments may be disposed in the low temperature region where one end 451 is disposed close to the heat source 412 in the high temperature region and the other end 452 is away from the high temperature region. In the heat pipe 450 according to various embodiments, a heat source 412, which is a high-temperature region, may be disposed in a remaining portion except for one end 451 and the other end 452.

The heat pipe 450 may be a heat transfer path, a heat transfer diffusion path, or a heat dissipation path. The heat pipe 450 according to various embodiments may be configured in various shapes, some of which should be disposed close to the heat source 412 and the other part of which should be disposed in a lower temperature region than the heat source 412.

The heat pipe 450 according to various embodiments must not transmit heat to other parts 411 disposed in the periphery while transferring heat. To this end, the electronic device 400 according to various embodiments may have a heat transfer prevention structure 432 that prevents heat transfer generated by the heat pipe 450.

The electronic device 400 according to various embodiments may include a component 411, e.g., a data input device, located near the heat source 412. [ The data input device may be a side input device and may be an external component that may be disposed to be visible outside the electronic device 400. For example, a first side key button device of the electronic device 400, or a second side key button device. However, as located near the heat source 412, the components in the heat affected area of the heat pipe 450 can equally have a heat transfer prevention structure.

The heat transfer prevention structure 432 generated by the heat pipe 450 according to various embodiments includes at least one opening formed in the inner support structure 420 ).

The apertures 432 according to various embodiments may extend beyond the length of the region in which the component 411 is located. For example, the heat transmitted through the heat source 412 may pass through the heat pipe 450 and diffuse into the peripheral region to reach the component 411, where the heat transfer path is blocked by the opening 432 , Heat transfer from the component 411 can be blocked. For example, the opening 432 may be configured in a slit or slot shape.

5 is a plan view showing a state in which a heat pipe according to various embodiments of the present invention is disposed in an electronic device.

Referring to FIG. 5, an electronic device 500 according to various embodiments may be the same electronic device as each of the electronic devices 100, 200, 300 shown in FIGS. 1A-1C, 2, and 3. FIG. The electronic device according to various embodiments differs from the electronic device 400 shown in Fig. 4 only in the configuration of the opening 522, and the remaining configuration is the same, so that the description of the remaining configuration will be omitted . The openings 522 formed in the inner support structure 520 of the electronic device according to various embodiments may include a material 523 having a low heat transfer rate. For example, the material 523 may include an insulating material such as synthetic resin.

6 is a perspective view illustrating a heat pipe according to various embodiments of the present invention.

Referring to FIG. 6, the heat pipe according to various embodiments may be the same pipe as the heat pipe 450 shown in FIG. The heat pipe 650 according to various embodiments may include a first and a second portion, a first end 651 and a second end 652. The first portion 651 may be one end of the heat pipe 650 and the second portion 652 may be the other end of the heat pipe.

The heat pipe 650 according to various embodiments can be configured in a variety of shapes, the important point being that the first end 651 may be disposed close to the heat source and the second end 652 may be relatively low And may be disposed in a region that is somewhat spaced apart from the heat source. By disposing such a heat pipe 650 in an electronic device, the temperature of the heat source can be dispersed in a relatively low temperature region.

The heat pipe 650 according to various embodiments may have a flat cross-sectional shape in order to maximize the bonding surface with the heat source.

The heat pipe 650 according to various embodiments may contain a small amount of working fluid in the vacuum-treated pipe, and may absorb heat in the heat generating portion to vaporize the liquid fluid. The vaporized fluid can be moved by the vapor pressure to the condensation section and can transfer heat to the outside from the condensation section. The fluid can be made liquefied. The liquefied fluid can be returned to the heat generating portion by the capillary force due to the microstructure in the tube, and the working fluid can be structured to transmit heat while repeating vaporization-liquefaction.

FIG. 7A is an exemplary view illustrating a heat transfer flow of a heat pipe combined with a heat collecting apparatus according to various embodiments of the present invention. FIG. FIG. 7B is a cross-sectional view of line A-A of FIG. 7A. 7C is a cross-sectional view of line B-B in Fig. 7A.

7A to 7C, the heat pipe 750 according to various embodiments may further include a heat collecting device 760 for collecting heat generated in the heat generating source 712. For example, the heat collecting device 760 may be disposed between the heat source and the heat pipe 750, and may transfer the heat of the heat source to the heat pipe 750. The heat collecting device 760 can perform a heat spreading function in addition to the heat collecting function. The heat collection or heat spreading function can be part of the heat transfer function and can be a heat dissipating function that transfers heat in the relatively high temperature region to the low temperature region.

The heat collecting device 760 according to various embodiments may have a structure or a shape for transmitting the heat generated from the heat source to the heat pipe 750. The heat source, for example AP, may be in the form of a chip, the top surface may be a rectangle or a square, and the heat collecting device 760 bonded to the top surface may have a rectangular or square shape.

The heat collecting device 760 according to various embodiments includes a metallic material, and may be made of a material having a good thermal conductivity, such as copper. One end 751 of the heat pipe can be disposed in the heat collecting device 760 and a coupling structure in which a possible area is in contact with the heat collecting device 760 and the end 751 can be provided. The heat collected by the heat collecting device 760 may be transferred to the heat pipe end 751 and then to the heat pipe end 752. The arrows can indicate the direction of heat transfer. Heat transferred to the heat pipe 750 may be transferred to the support structure 720 in a direction away from the heat pipe 750. The heat transferred to the support structure 720 may be transferred to a metal plate 721, such as copper. A shielding sheet 770 may be attached to the upper surface of the heat pipe 750.

8A is a cross-sectional view illustrating a heat transfer structure of a heat pipe combined with a heat collecting apparatus according to various embodiments of the present invention. 8B is a view of an electrical system in which a heat pipe incorporating a heat collecting device according to various embodiments of the present invention is disposed. 8C is a cross-sectional view of an electrical system in which a heat pipe incorporating a heat collecting device according to various embodiments of the present invention is disposed.

8A-8C, the electronic device 800 according to various embodiments may be the same electronic device as the electronic device 400 shown in FIG. In addition, the heat pipe 850 according to various embodiments may be the same heat pipe as the heat pipe 650 shown in FIG. The heat collecting device 860 according to various embodiments may be the same device as the heat collecting device 760 shown in Fig.

The electronic device 800 according to various embodiments includes a first electronic component 812 disposed on a first surface facing the first direction of the substrate 810 and a second electronic component 812 disposed on the second surface in a second direction opposite to the first direction of the substrate 810 A second electronic component 813 disposed on the second side facing the first substrate 820 and an internal support structure 820 supporting the substrate 810. [ In the electronic device 800 according to various embodiments, the side key button 8020 may be disposed in a third direction perpendicular to the first and second directions. The first electronic component 812 is a heat- By a shielding structure 840,

The electronic device 800 according to various embodiments may include a heat transfer material 830, a heat collecting device 860 and a heat pipe 850 to dissipate heat generated in the heat source 812 to a relatively low temperature region . The heat pipe 850 according to various embodiments may be the same heat pipe as the heat pipe 650 shown in FIG. The heat collecting device 860 according to various embodiments may be the same device as the heat collecting device 760 shown in Fig. 7 as a heat transfer device.

The heat source 812 according to various embodiments may be a chip type and may include an application processor (CPU), a central processor (CP), a power amplifier (PA) of a radio frequency unit, and the like mounted on a substrate.

The electronic device 800 according to various embodiments may further include a thermal interfacing material 830 (TIM) for transferring the heat of the heat source 812 to the heat collecting device 860.

The heat transfer material 830 (TIM) according to various embodiments may include a single layer or a multi-layer. For example, the heat transfer material 830 may have a constant thickness and may be opaque. According to one embodiment, the heat transfer material 830 (TIM) may have thermal conductivity. For example, the heat transfer material 830 (TIM) may have a thermal conductivity of at least 1 W / mk (e.g., 4 W / mk). In addition, the heat transfer material 830 (TIM) may or may not have electrical conductivity. For example, if the heat transfer material 830 (TIM) has electrical conductivity, it may block electrical noise or electromagnetic interference (EMI). Alternatively, the heat transfer material 830 may have excellent abrasion resistance or heat resistance. In addition, the heat transfer material 830 may comprise a thermoplastic material.

The heat transfer material 830 according to various embodiments may include phase change materials (PCM). The phase change material can change from a solid phase to a liquid phase by heat. Here, the liquid phase-change material may have viscosity. Alternatively, the liquid phase-change material may be compressible or incompressible. In addition, the heat transfer material 830 may include a material whose at least one physical property is changed by heat. For example, by heat, the heat transfer material can have a high viscosity.

The heat transfer material 830 according to various embodiments has mechanical properties (e.g., tensile strength or elasticity), is strong against tearing, and can be cured upon heat.

The heat transfer material 830 according to various embodiments may be formed in a manner that is surface treated with a thermal conductive material (e.g., silicon, silicone polymer, graphite, acrylic, etc.) have. The surface treatment method can increase the bonding force between the upper surface of the heat transfer material and the thermal conductive material. The heat transfer material 830 according to various embodiments may comprise a silicone polymer.

The electronic device 800 according to various embodiments may be arranged in a structure in which a heat source 812, a heat transfer material 830, and a heat collecting device 860 are stacked in a vertical direction. Also, at least a portion of the heat pipe 850 may be disposed submerged in the heat collecting device 860. The heat transfer material 812 and the heat transfer material 830 are directly bonded to each other in a stacked structure and the heat transfer material 830 and the heat collecting device 860 are directly bonded to each other in a stacked structure, 860 are directly bonded to the heat pipe 850 and the heat collecting device 860 including the heat frit 850 is directly adhered to the inner support structure 820 (which may be referred to as a midplot) have. Instead of the direct bonding, a lamination may be performed using a soldering joint, an adhesive layer or a mechanical bonding structure.

Hereinafter, the mounting structure of the heat pipe associated with the shielding structure will be described.

9 is a cross-sectional view illustrating an electronic device in which a heat transfer structure is applied in a laminated structure to a shield structure according to various embodiments of the present invention.

9, an electronic device 900 according to various embodiments includes a substrate 910, a heat source 912, a shield structure 920, heat transfer materials 930 and 932, and a heat pipe 950 can do. The electronic device 900 according to various embodiments may be the same electronic device as the electronic device 400 shown in Fig. In addition, the heat pipe 950 according to various embodiments may be the same heat pipe as the heat pipe 650 shown in FIG.

The electronic device 900 according to various embodiments may be a structure in which heat generated in the heat source 912 is transmitted by the heat pipe 950 through the heat transfer materials 930 and 932. [ The heat transfer structure is applied to the shielding structure 920 so that heat generated in the heat generating portion 912 can be transmitted to the heat pipe 950 via the shielding structure 920.

The substrate 910 according to various embodiments may include a first surface 910a facing the first direction and a second surface 910b facing the second direction 910a opposite the first surface 910a. The substrate 910 may have various electronic components mounted on the first and second surfaces 910a and 910b, respectively. If the electronic component is in operation, the substrate 910 can be a heat source. A heat source 912 may be mounted on the first surface 910a of the substrate according to various embodiments. For example, the heat source 912 may be a chip type, and may include an application processor (AP), a central processor (CP), a power amplifier (PA) of a radio frequency unit, and the like.

The shielding structure 920 according to various embodiments may be a device for shielding electromagnetic waves generated in the heat source 912, and may include a shield can for shielding EMI. The shielding structure 920 may be disposed so as to surround the side surfaces and the upper surface of the heat generating source 912. The shield structure 920 may include a shield frame 921 surrounding the side of the heat source 912 and a shield cover 922 covering the shield frame 921. [ The shield cover 922 may be coupled to close the upper surface of the shield frame 921. The shield cover 922 is a plate including a thin metal material, and may include a shield film or a shield sheet. The shield cover 922 includes a metal material, and may include a material such as copper that is excellent in thermal conductivity and can prevent static electricity.

The thermal interfacing material (TIM) according to various embodiments may be liquid or may comprise a first heat transfer material 930 close to the liquid phase and a second heat transfer material 932 that is solid or near solid have.

The first heat transfer material 930 according to various embodiments may be disposed between the upper surface of the heat source 912 and the lower surface of the shield cover 922. Since the first heat transfer material 930 is a liquid or a material close to a liquid phase, the adhesion of the first heat transfer material 930 to the upper surface of the heat generating source 912 can be increased as compared with the solid second heat transfer material 932. The upper surface of the heat source 912 and the first heat transfer material 930 must closely contact each other to increase the thermal conductivity and the heat generated in the heat source 912 can be transferred to the first heat transfer material 930.

The second heat transfer material 932 according to various embodiments may be disposed between the top surface of the shield cover 922 and the bottom surface of the heat pipe 950. The second heat transfer material 932 may be a solid or a solid material and may transmit the heat transferred from the shield cover 922 to the heat pipe 950. In addition, the second heat transfer material 932 can transfer the heat transferred from the shield cover 922 to the inner support bracket 940, and can perform the additional transfer function. Since the internal support structure 940 is a low temperature region, the heat transferred from the second heat transfer material 932 can be transferred to the heat pipe 950 and transferred to the internal support bracket 940. In addition, the heat transferred to the internal support structure 940 may be transmitted back to the heat pipe 950. For example, the inner support structure 940 may include a bracket.

The electronic device 900 according to various embodiments may be configured such that the first heat transfer material 930 can be adhered on the heat generating source 912 in the form of a stack of upper and lower layers and a shield cover The second heat transfer material 932 may be disposed on the shield cover 922 in a stacked manner and the heat pipe 950 may be stacked on the second heat transfer material 932 in an upper and lower stacking manner, And the inner support structure 940 may be disposed. And can be densely adhered between the respective layers. Reference numeral 952 may refer to a tape that is an adhesive layer.

10 is a cross-sectional view illustrating an electronic device in which a shielding structure and a heat transfer structure are stacked according to various embodiments of the present invention.

Referring to FIG. 10, an electronic device 1000 according to various embodiments may be the same electronic device as the electronic device 400 shown in FIG. In addition, the heat pipe 1050 according to various embodiments may be the same heat pipe as the heat pipe 650 shown in FIG. The heat collecting apparatus 1060 according to various embodiments may be the same apparatus as the heat collecting apparatuses 760 and 860 shown in Figs. 7 and 8, respectively.

An electronic device 1000 according to various embodiments includes a substrate 1010, a heat source 1012, a shield structure 1020, a heat transfer material 1030, a heat collecting device 1060, a heat pipe 1050 .

The electronic device 1000 according to various embodiments is configured such that heat generated in the heat source 1012 is transferred through the heat transfer material 1030 and heat to be transferred is collected by the heat collection device 1060, And may be a structure that is transmitted by the heat pipe 1050. The heat transfer structure is applied to the shielding structure 1020 so that the heat generated in the heat generating portion 1012 can be transmitted to the heat pipe 1050 via the shielding structure 1020 and the heat collecting device 1060.

The substrate 1010 according to various embodiments may include a first surface 1010a facing the first direction and a second surface 1010b facing the second direction 1010a opposite to the first surface 1010a. The substrate 1010 may have various electronic components mounted on the first and second surfaces 1010a and 1010b, respectively. A heat source 1012 may be mounted on the first surface 1010a of the substrate according to various embodiments. For example, the heat source 1012 may be a chip type, and may include an application processor (AP), a central processor (CP), a power amplifier (PA) of a radio frequency unit,

The shielding structure 1020 according to various embodiments may include a shield can for shielding electromagnetic interference (EMI) from an electromagnetic wave generated from the heat source 1012. FIG. The shielding structure 1020 may be disposed so as to surround the side surface and the upper surface of the heat generating source 1012. The shielding structure 1020 may include a shield frame 1021 surrounding the side of the heat source 1012 and a shield cover 1022 covering the shield frame 1021. [ The shield cover 1022 is a plate including a thin metal material, and may be referred to as a shield film or a shield sheet. The shield cover 1022 includes a metal material, and may include a material such as copper that is excellent in thermal conductivity and can prevent static electricity.

The heat transfer material 1030 according to various embodiments may be disposed between the upper surface of the heat source 1012 and the lower surface of the shield cover 1022. [ The heat transfer material 1030 may be in the form of liquid or near liquid, or a solid or near-solid material. The upper surface of the heat source 1012 and the heat transfer material 1030 must be closely contacted with each other to increase the thermal conductivity and the heat generated in the heat source 1012 can be transferred to the heat transfer material 1030.

The heat collecting device 1060 according to various embodiments may be disposed between the upper surface of the shield cover 1022 and the heat pipe 1050 underneath. The heat collecting apparatus 1060 may collect heat transferred from the shield cover 1022 and transfer the collected heat to the heat pipe 1050. In addition, the heat collecting device 1060 may transfer the heat transferred from the shield cover 1022 to the inner support bracket 1040 to perform an additional transfer function. Since the internal support structure 1040 is in a low temperature region, the heat transferred from the heat collecting device 1060 can be directly transferred to the heat pipe 1050 and transferred to the internal support bracket 1040. In addition, the heat transferred to the inner support structure 1040 may be transmitted back to the heat pipe 1050. For example, the inner support structure 1040 may include a bracket.

The electronic device 900 according to various embodiments may be configured such that the first heat transfer material 930 can be adhered on the heat generating source 912 in the form of a stack of upper and lower layers and a shield cover The second heat transfer material 932 may be disposed on the shield cover 922 in a stacked manner and the heat pipe 950 may be stacked on the second heat transfer material 932 in an upper and lower stacking manner, And the inner support structure 940 may be disposed. And can be densely adhered between the respective layers. Reference numeral 1052 denotes a thermally conductive tape which is an adhesive layer of the heat pipe 1050 and reference numeral 1062 denotes a soldering portion or a solder layer for bonding the heat collecting device 1060 to the internal support structure 1040.

11 is a cross-sectional view showing an electronic device in which a heat transfer structure is laminated in a shield structure according to various embodiments of the present invention.

11, the electronic device 1100 according to various embodiments differs from the electronic device 1000 shown in FIG. 10 only in the configuration of the heat transfer material 1130, and the remaining configuration is the same , And a description of the remaining components will be omitted. The heat transfer material 1130 according to various embodiments may be disposed between the upper surface of the heat generating source 1112 and the lower surface of the shield cover 1122.

The heat transfer material 1130 according to various embodiments may be composed of a first heat transfer material 1131 that is liquid or near liquid and a second heat transfer material 1132 that is solid or near a solid phase. A liquid-phase or liquid-phase heat-transfer material is superior to a solid-phase heat-transfer material in close contact with other components. On the other hand, a solid-phase heat-transfer material is superior in heat conductivity to a liquid- It has properties.

The electronic device 1100 according to various embodiments may employ a mixed heat transfer material 1130 for transferring heat from the heat source 1112.

The upper surface of the heat source and the heat transfer material 1030 must closely contact each other to increase the thermal conductivity and the heat generated in the heat source 1112 can be transferred to the heat transfer material 1030. However, The material may be located on the top surface of the heat source. For a high thermal conductivity, the layer thickness of the second heat transfer material 1132 may be configured to be greater than the thickness of the first heat transfer material 1131 layer.

12 is a cross-sectional view illustrating an electronic device in which a shielding structure and a heat transfer structure according to various embodiments of the present invention are stacked.

12, since the electronic device 1200 according to various embodiments differs from the electronic device 1000 shown in FIG. 10 only in the configuration of the shielding structure 1220, and the remaining configuration is the same, Description of the remaining configuration will be omitted.

The shielding structure 1220 according to various embodiments may have a structure that surrounds the side surface and the upper surface of the heat source 1212 with a shield cover 1222. [ For example, the shielding cover 1222 may be composed of a shielding film, and may be closed by a portion 1221 on the side as well as on the top surface of the heat source 1212. [ The end 1223 of the shielding structure 1220 can be secured using a fastening structure using fasteners not shown on the substrate 1210 or by welding.

13 is a cross-sectional view illustrating an electronic device in which a shielding structure and a heat transfer structure according to various embodiments of the present invention are stacked.

Referring to FIG. 13, the electronic device 1300 according to various embodiments may be the same electronic device as the electronic device 400 shown in FIG. In addition, the heat pipe 1350 according to various embodiments may be the same heat pipe as the heat pipe 650 shown in FIG.

The electronic device 1300 according to various embodiments may include a substrate 1310, a heat source 1312, a heat collecting device shielding structure 1320, a heat transfer material 1330, and a heat pipe 1350 have.

The electronic device 1300 according to various embodiments is configured such that the heat generated in the heat source 1312 is transferred through the heat transfer material 1330 and the heat to be transferred is collected by the heat collecting device shielding structure 1330, The heat transferred by the heat pipe 1350 can be a structure.

The shielding structure 1320 serving as a heat collecting device according to various embodiments may include a metal material to shield the EMI generated in the substrate 1310 and collect heat generated in the heat generating source. For example, the heat collecting device-shielding structure 1320 may provide a structure for performing the functions of the heat collecting device and the shielding structure shown in FIG.

The electronic device 1300 according to various embodiments can transmit and collect heat generated in the heat generating portion 1312 by the heat collecting device and shielding structure 1320 and directly to the heat pipe 1350. The heat collecting device shielding structure 1320 according to various embodiments may include a shield frame 1321 and a heat collecting device shield cover 1322.

The shielding structure 1320 serving as a heat collecting device according to various embodiments may be disposed so as to surround the side surface and the upper surface of the heat generating source 1312. The shield cover 1322 is a thin metal plate, and may include a shield film or a shield sheet. The shield cover 1322 includes a metal material and is excellent in thermal conductivity.

The heat transfer material 1330 according to various embodiments may be disposed between the upper surface of the heat source 1312 and the bottom surface of the heat collecting device and the shield cover 1322. The heat transfer material 1330 may be a liquid, a material close to a liquid phase, a solid phase, or a phase close to a solid phase. The upper surface of the heat source 1312 and the heat transfer material 1330 must closely contact each other to increase the thermal conductivity and heat generated in the heat source 1012 can be transferred to the heat transfer material 1030.

The shield cover 1322 serving as a heat collecting device according to various embodiments collects the heat transferred from the heat transfer material 1330 and transfers the collected heat to the heat pipe 1350. The heat collecting device and the shield cover 1322 can transfer the transferred heat to the inner support bracket 1340. Since the internal support structure 1340 is in a low temperature region, the heat transferred from the heat collecting device and the shield cover 1322 can be transferred to the heat pipe 1350 and transferred to the internal support bracket 1340. In addition, the heat transferred to the inner support structure 1340 may be transferred back to the heat pipe 1350.

The electronic device 1300 according to various embodiments may be configured such that a heat transfer material 1330 can be adhered on a heat generating source 1312 in a stacked structure of upper and lower layers and a shield cover The heat pipe 1350 and the internal support structure 1340 may be disposed on the heat collecting device shield cover 1322 in a stacked-up state. And can be densely adhered between the respective layers. Reference numeral 1352 denotes a thermally conductive tape which is an adhesive layer of the heat pipe 1350 and reference numeral 1362 denotes a soldering portion or solder layer for bonding the heat collecting device and the shield cover 1322 to the internal support structure 1340.

14 is a cross-sectional view showing an electronic device in which a heat transfer structure is laminated in a shield structure according to various embodiments of the present invention.

Referring to Fig. 14, an electronic device 1400 according to various embodiments may be the same electronic device as the electronic device shown in Figs. 1A to 1C. The electronic device 1400 according to various embodiments includes a substrate 1410, first and second heat sources 1411 and 1412, first and second shielding structures 1421 and 1422, first through fourth heat transfer materials 1431-1434, and a heat pipe 1450. Each of the first and second shielding structures 1421 and 1422 according to various embodiments may have the same structure as the shielding structure 1020 shown in FIG. In addition, the heat pipe 1450 according to various embodiments may be the same heat pipe as the heat pipe 650 shown in FIG.

The electronic device 1400 according to various embodiments transfers heat generated in the first heat source 1411 to the first shielding structure 1421 through the first heat transfer material 1431 and the heat generated in the fourth heat transfer material 1434, Or by heat pipe 1450 by way of heat pipe 1450. [ The electronic device 1400 according to various embodiments is configured such that the heat generated in the second heat generating source 1412 is transmitted to the second shield cover 1426 by the second heat transfer material 1432 and the heat generated in the second shield cover 1426 The transferred heat may be transferred to the fourth heat transfer material 1434 through the third heat transfer material 1433 and transferred by the heat pipe 1450 by the fourth heat transfer material 1434. [

The substrate 1410 according to various embodiments may include a first surface 1410a facing the first direction and a second surface 1410b facing the second direction 1450a opposite the first surface 1410a. The substrate 1410 may have various electronic components mounted on the first and second surfaces 1410a and 1410b, respectively. The first heat source 1411 may be disposed on the first side 1410a of the substrate and the second heat source 1412 may be disposed on the second side 1410b of the substrate. For example, each of the first and second heat sources 1411 and 1412 may be a chip type, and may include an application processor (AP), a central processor (CP), a power amplifier (PA) .

The first and second shielding structures 1421 and 1422 according to various embodiments are devices for shielding electromagnetic waves generated by the first and second heat sources 1411 and 1412. A shield can for shielding EMI Respectively. The first and second shielding structures 1421 and 1422 may be disposed so as to surround the side surfaces and the upper surface of the first and second heat sources 1411 and 1412, respectively.

The first shielding structure 1421 according to various embodiments includes a first shield frame 1423 surrounding the side of the first heat source 1411 and a first shield cover 1424 covering the first shield frame 9423 . The first shield cover 1424 can be coupled to close the upper surface of the first shield frame 1423. The first shield cover 1424 is a thin metal plate, and may include a shield film or a shield sheet. The first shield cover 1424 includes a metal material, and may include a material such as copper that is excellent in thermal conductivity and can prevent static electricity.

The second shielding structure 1422 according to various embodiments includes a second shield frame 1425 surrounding the side of the second heat source 1412 and a second shield cover 1426 covering the second shield frame 1425 . The second shield cover 1426 may be coupled to close the upper surface of the second shield frame 1425. The second shield cover 1426 is a thin metal plate, and may include a shield film or a shield sheet. The second shield cover 1426 includes a metal material, and may include a material such as copper that is excellent in thermal conductivity and can prevent static electricity.

The first to fourth thermal transfer materials 1431-1434 (TIM) according to various embodiments may be liquid, liquid-phase heat transfer material 930, solid or near-solid heat transfer material, Or a combination of these.

The first heat transfer material 1431 according to various embodiments may be disposed between the upper surface and the side of the first heat generating source 1411 and between the first shield cover 1424 and the first shield frame 1423. The first heat transfer material 1431 may be filled in the space enclosed by the first heat source 1411, the first shield cover 1424, and the first shield frame 1423. The heat generated in the first heat source 1411 is transferred to the first shield cover 1424 and the first shield frame 1423 and the heat transferred to the first shield frame 1423 is transferred to the fourth heat transfer material 1434 And finally delivered to the heat pipe 1450. Although not shown in the drawings, the first shield cover 1424 can be transmitted heat to the internal support structure. Also, although not shown, the heat pipe 1450 may further include a heat collecting device.

The second heat transfer material 1432 according to various embodiments may be disposed between the upper surface of the second heat source 1412 and the second shield cover 1426. [ The heat generated in the second heat source 1412 may be transferred to the second shield cover 1426 by the second heat transfer material 1432.

The third heat transfer material 1433 according to various embodiments may be filled in space between the second shield cover 1426 and the second shield frame 1425. The third heat transfer material 1433 filled in the space may be divided into two parts. The first portion 14331 may be a portion attached to the second shield cover 1426 and the second portion 14332 may be a portion disposed between the second shield frame 1425 and the fourth heat transfer material 1434 Lt; / RTI > The heat transferred in the second shield cover 1426 passes through the first portion 14331 and is transferred to the second portion 14332 and the heat transferred to the second portion 14332 is transferred to the fourth heat transfer material 1434, And finally, can be transmitted to the heat pipe 1450.

The fourth heat transfer material 1434 and the heat pipe 1450 according to various embodiments may be disposed in the lateral direction of the first heat source 1411 or the second heat source 1412 or the first and second heat sources 1411 and 1412 And may be a heat transfer path for transferring heat. The fourth heat transfer material 1434 may laterally extend with respect to the first and second heat sources 1411 and 1412 to transfer the heat transferred to the laterally facing heat pipe 1450.

The electronic device 140 according to various embodiments may be configured such that the first heat transfer structure disposed in the first shielding structure 1421 of the first side 1401a of the substrate is symmetrical to the second shielding structure 1422 of the second side of the substrate And the second heat transfer structure disposed in the second shielding structure 1422 of the substrate second surface 1410b may be disposed symmetrically to the first shielding structure 1421 of the substrate first surface 1410a have.

15 is a perspective view showing a substrate to which a heat pipe is applied in a lateral direction of a shielding structure according to various embodiments of the present invention.

Referring to FIG. 15, an electronic device 1500 according to various embodiments may be the same electronic device as the electronic device 100 shown in FIGS. 1A-1C. The electronic device 1500 according to various embodiments includes a substrate 1510, shielding structures 1521-1523 that are mounted on a first surface of the substrate 1510 and a plurality of shielding structures 1521-1523 And may include a heat pipe 1550 disposed on the side of each shield structure 1521-1523. A plurality of shield structures 1521-1523 may be mounted on the first surface of the substrate 1510 according to various embodiments, and each of the shield structures 1521-1523 may be disposed apart from each other. They can be disposed in contact with each other. Heat generated in each of the shield structures 1521-1523 may be transmitted to one heat pipe 1550. The heat pipe 1550 may be bonded to each shielding structure 1521-1523 by a soldering process. Each of the shield structures 1521-1523 can be lowered downward by the heat pipe 1550.

16A is a perspective view showing a heat collecting apparatus according to various embodiments of the present invention. 16B is a plan view showing a state in which a heat pipe is partially coupled to a heat collecting apparatus according to various embodiments of the present invention.

16A and 16B, the heat collecting apparatus 1660 according to various embodiments may be the same apparatus as the heat collecting apparatus 860 shown in FIG. 8A and the heat collecting apparatus 1060 shown in FIG. 10 have. The heat collecting device 1660 according to various embodiments may be configured to have a surface that faces the top surface of the heat source, particularly a surface having a size similar to that of the top surface of the heat source, and that includes a metal having a high thermal conductivity similar to copper material Lt; / RTI >

The heat collecting device 1660 according to various embodiments may include a first end 1661 of the heat pipe 1650 and a recess 1662 for engaging the first end portion. The recess 1662 is formed in a recessed shape with a predetermined depth on the upper surface of the heat collecting device 1660, and a part of the heat pipe is inserted into the recess to be joined by a soldering process or a double-sided tape .

17A to 17D, various coupling structures between the heat pipe and the heat collecting apparatus according to various embodiments will be described.

17A is a cross-sectional view illustrating a state in which a portion of a heat pipe 1750 is coupled to an internal support structure 1740 according to various embodiments of the present invention.

17A, a heat pipe 1750 according to various embodiments may be coupled to the recess formed in the inner support structure 1740 using a double-faced tape 1750b having a high thermal conductivity. Instead of the double-sided tape 1750b having a high thermal conductivity to be used as a bonding material, the heat pipe 1750 and the internal support structure 1740 can be joined by a soldering process. When the heat pipe 1740 is coupled to the recess of the inner support structure 1750, the heat pipe upper surface 1750a may be approximately coplanar with the upper surface 1740a of the inner support structure. The respective mating surfaces of heatpipes 1750 according to various embodiments may be in intimate contact with the respective mating surfaces formed in the recesses. For example, if there is a space between each of the mating surfaces of the heat pipe 1750 and each of the mating surfaces formed in the recess, the heat transfer efficiency may be reduced, Can be filled.

17B is a cross-sectional view illustrating a state in which a part of the heat pipe 1751 is coupled to the support structure 1741 according to various embodiments of the present invention.

17B, the heat pipe 1751 according to various embodiments can be coupled to the recess formed in the inner support structure 1741 using a double-faced tape 1751b having a high thermal conductivity. The heat pipe 1751 and the internal support structure 1741 can be joined by the soldering process in place of the double-faced tape 1751b having a high thermal conductivity used as a bonding material. When the heat pipe 1751 is coupled to the recess of the inner support structure 1741, the heat pipe upper surface 1751a may be disposed to protrude slightly from the upper surface 1741a of the inner support structure.

17C is a cross-sectional view illustrating a state in which a portion of the heat pipe 1752 is coupled to the support structure 1742 according to various embodiments of the present invention.

17C, a heat pipe 1752 according to various embodiments may be coupled using a PCM (phase change material) sheet 1752b to the recess formed in the inner support structure 1742. [ When the heat pipe 1752 is coupled to the recess of the inner support structure 1742, the heat pipe upper surface 1752a may be approximately coplanar with the upper surface 1742a of the inner support structure. The respective mating surfaces of the heat pipes 1752 in accordance with various embodiments may be in intimate contact with the respective mating surfaces formed in the recesses. For example, if there is a space between each mating surface of the heat pipe 1752 and each mating surface formed in the recess, the heat transfer efficiency may be reduced, Can be filled.

17D is a cross-sectional view illustrating a state in which a part of the heat pipe 1753 is coupled to the support structure 1743 according to various embodiments of the present invention.

17D, a heat pipe 1753 according to various embodiments may be fabricated integrally with the inner support structure 1743. As shown in FIG. When the inner support structure 1743 is manufactured by die casting or injection molding, the heat pipe 1753 may be integrally formed in the inner support structure 1743 by the above method.

18A is a cross-sectional view illustrating a state in which a part of heat pipe 1850 is coupled to heat collecting apparatus 1860 according to various embodiments of the present invention.

18A, a heat pipe 1850 according to various embodiments may be coupled to the recess formed in the heat collecting device 1860 using a soldering process. When the heat pipe 1850 is coupled to the recess of the heat collecting device 1860, the upper surface 1850a of the heat pipe 1850 may be approximately coplanar with the heat collecting device upper surface 1860a. The respective mating surfaces of the heatpipes 1850 according to various embodiments may be in intimate contact with the respective mating surfaces formed in the recesses.

18B is a cross-sectional view showing a state in which a part of the heat pipe 1852 is coupled to the heat collecting device 1862 according to various embodiments of the present invention.

18B, the heat collecting device 1862 according to various embodiments may have recesses formed therein and may form a recessed engagement structure 18621 to provide tight engagement with the heat- . When the heat pipe 1852 is coupled to the recess of the heat collecting device 1862, the heat pipe upper surface 1852a may be arranged slightly depressed from the heat collecting device upper surface 1862a.

19A is a plan view showing a state where a heat pipe is coupled to a reinforcing plate of a display according to various embodiments of the present invention. FIG. 19B is a cross-sectional view taken along line A-A of FIG. 19A.

Referring to Figs. 19A and 19B, an electronic device 1900 according to various embodiments may be the same electronic device as the electronic device 100 shown in Figs. 1A-1C. The electronic device 1900 according to various embodiments may include a display 1910 and a heat pipe 1920 that are exposed on the first side of the housing. The display 1910 may include a display module 1910 and a reinforcing plate 1921 that supports the display module 1910. For example, the reinforcing plate 1912 is made of a metal material and can resist the distortion of the display module 1910. The heat pipe 1920 can be integrally coupled to the reinforcing plate 1912. The heat transferred from the heat source can be transferred to the reinforcing plate 1912 through the heat pipe 1920.

20A is a plan view showing a heat pipe coupled to a rear cover according to various embodiments of the present invention. 20B is a cross-sectional view taken along the line B-B in FIG. 20A.

20A and 20B, an electronic device 2000 according to various embodiments may be the same electronic device as the electronic device 100 shown in FIGS. 1A through 1C. The electronic device 2000 according to various embodiments may include a back cover 2010 and a heat pipe 2020. The rear cover 2010 may be referred to as a battery cover or an accessory cover. The rear cover 2010 may be integrally or detachably attached to the rear case of the electronic device. The rear cover 2010 is made of a plastic injection material and can be detached from the rear case. Further, the rear cover 2010 may be constituted by a metal outer case integrally with the electronic device.

The heat pipe 2020 according to various embodiments may be coupled to the rear cover 2010, or may be manufactured integrally. When the rear cover 2010 is a flak stick injection molded article, the metal heat pipe 2020 can be manufactured by a double injection molding method. When the rear cover 2010 is made of a metal material, the heat pipe 2020 may be integrally formed when the rear cover is manufactured. The heat pipe 2020 may be formed on the inner surface 2010a of the rear cover, which faces or faces the heat source of the electronic device.

21 is a plan view showing a heat pipe coupled to a rear case according to various embodiments of the present invention.

Referring to FIG. 21, the electronic device 2100 according to various embodiments may form at least one heat pipe 2120 at a rim portion (edge circumference) of the rear case 2110. A recess is formed in the rear case 2110, and a heat pipe 2120 can be coupled to the recess. Since the rear case 2110 is made of a plastic material and the heat pipe 2120 is made of a metal material, the heat pipe 2120 can be manufactured by an insert injection method in the rear case 2110. Furthermore, the heat pipe 2120 coupled to the rear case 2110 can function not only as a heat transfer function, but also as a skeleton of the rear case 2110. The heat transferred to the heat pipe 2120 can be transferred to the housing rim portion 2130.

The rim portion 2130 according to various embodiments may be constituted by a metal frame, and may serve as an antenna radiator. Further, the rim portion 2130 can be combined with the heat pipe 2120 to perform a heat transfer function.

22A is a view illustrating a state in which heat pipes are disposed in the first and second receiving grooves according to various embodiments of the present invention. 22B is a cross-sectional view illustrating a state in which heat pipes are disposed in the first and second receiving grooves according to various embodiments of the present invention.

22A and 22B, an electronic device 2200 according to various embodiments may include first and second receiving grooves 2222 and 2224 for joining a heat pipe 2250 to a support structure 2220 have. The first portion 2252 of the heat pipe 2250 may be disposed in the first receiving groove 2222 and the second portion 2254 of the heat pipe 2250 may be disposed in the second receiving groove 2224. [ A heat pipe 2250 is disposed in the first and second receiving grooves 2222 and 2224 and the heat pipe 2250 disposed thereon can be fixed to the first and second receiving grooves 2222 and 2224 by soldering . Each of the first and second receiving grooves 2222 and 2224 may be formed by a grinding operation of the supporting structure 2220.

The first receiving groove 2222 according to various embodiments may surround the first portion 2252 of the heat pipe and the bottom may be configured in a stepped shape. For example, the bottom of the first receiving groove 2222 may be formed with a plurality of first steps 2222a. The heat pipe 2250 can be increased in the joint surface to the support structure 2220 by the first step 2222a. The stepped first receiving groove 2222 can improve the thermal conductivity to the support structure.

The second receiving groove 2224 according to various embodiments may surround the second portion 2254 of the heat pipe and the bottom may be configured in a stepped configuration. For example, the bottom of the second receiving groove 2224 may be formed with a plurality of second steps 2224a. The heat pipe 2250 can be increased in the joining surface with the support structure 2220 by the second step 2224a. The stepped second receiving groove 2224 can improve the thermal conductivity of the supporting structure.

23A is a view illustrating a heat dissipation structure using a clip and a heat pipe in a plurality of shield structures according to various embodiments of the present invention. 23B is a perspective view illustrating a state where the clip is coupled between the first and second shielding structures according to various embodiments of the present invention.

23A-23B, an electronic device 2300 according to various embodiments includes a plurality of shield structures 2340-2342 using one heat pipe 2350 and at least one clip 2360, The heat transfer path can be formed.

The first surface of the substrate 2310 according to various embodiments includes the first to third heating elements 2312, 2313, and 2314 and the first to third heating elements 2312, 2313, and 2314, To third shielding structures 2340, 2341, 2342, respectively. The first heating element 2312 is surrounded by the first shielding structure 2340 while the second heating element 2313 is surrounded by the second shielding structure 2341 and the third heating element 2314 is surrounded by the third shielding structure 2314. [ 2342, respectively. Each of the first to third shielding structures 2340-2342 may be disposed on the substrate 2310 in an interval.

The first and second chip structures 2340 and 2341 may be physically and electrically connected using a first clip 2360 and the second and third chip structures 2341 and 2342 may be connected to the second clip 2361). ≪ / RTI > The first clip 2360 is inserted into the engagement opening 2345 formed by the first and second shielding structures 2340 and 2341 so that the heat pipe 2350 is in close contact with the side surfaces of the first and second shielding structures 2340 and 2341 . The second clip 2361 is inserted into a mating opening (not shown) formed by the second and third shielding structures 2341 and 2342 so that the heat pipe 2350 is attached to the side surfaces of the second and third shielding structures 2341 and 2342 They can be closely arranged.

The heat pipe 2350 according to various embodiments is disposed between the side surfaces of the first, second and third shielding structures 2340-2342 and the first and second clips 2360 and 2361, 2313, and 2314 to the support structure 2320. The coupling positions of the first and second clips 2360 and 2361 are not limited to the first and second shielding structures 2340 and 2341 and between the second and third shielding structures 2341 and 2342, respectively. Reference symbol B refers to a battery pack.

24 is a cross-sectional view illustrating a state in which heat dissipation structures are respectively provided on the first and second surfaces of the substrate according to various embodiments of the present invention.

24, an electronic device 2400 according to various embodiments includes a first heat pipe 2450 on a first side of a substrate 2410 and a plurality of first heat pipes 2450 using at least one first clip 2460. In one embodiment, The first heat transfer path may be formed in the first shielding structure 2440. The electronic device 2400 in accordance with various embodiments may also include a second heat transfer path to the plurality of second shield structures 2345 using a second heat pipe 2452 and at least one second clip 2462. [ . Each of the first and second heat transfer paths may have the same structure as the heat transfer path shown in Figs. 23A and 23B.

The first and second heat transfer paths according to various embodiments may be symmetrically disposed on the first and second surfaces of the substrate 2410, respectively, or may be disposed asymmetrically.

Although not shown in the drawings, two or three heat pipes may be arranged in a parallel type or a non-overlapped type in a single heating element to provide a heat dissipating structure.

25 is a cross-sectional view showing a structure of a PBA provided with a heat dissipation structure according to various embodiments of the present invention.

Referring to FIG. 25, an electronic device 2500 having a heat radiating structure according to various embodiments may be manufactured in the following manner.

A heater 2512 having a thickness of about 1.15-1.3 mm and a shielding structure 2540 having a height of about 1.5-1.54 mm are mounted on the first surface of the substrate 2510 and a liquid heat transfer material The cover 2542 (approximately 0.04-0.06 mm in thickness) may be bonded onto the shielding structure 2540 after the cover 2530 (approximately 1.3-1.4 mm in thickness) is applied to complete the first heat dissipating structure. The vertical portion of the shield structure 2540 may have a thickness of approximately 0.1 mm and the horizontal portion may have a thickness of approximately 0.15 mm.

The heat pipe 2550 can be attached to the support structure 2520 using a double-sided tape. The heat pipe 2550 attached to the support structure 2520 is formed by attaching a solid heat transfer material 2560 (having a thickness of approximately 0.15-0.25 mm) and attaching to the cover 2542, Can be produced.

26 is a cross-sectional view showing the structure of a PBA provided with a heat dissipation structure according to various embodiments of the present invention.

Referring to FIG. 26, an electronic device 2600 having a heat dissipation structure according to various embodiments may be manufactured by the following method.

A heating element 2612 (approximately 1.15-1.3 mm in thickness) and a shielding structure 2640 (approximately 1.5-1.54 mm in height) may be mounted on the first surface of the substrate 2610.

The heat pipe 2650 can be attached to the support structure 2620 using a double-sided tape. The heat pipe 2650 module attached to the support structure 2620 can bond the copper plate 2660 (approximately 1.13-1.17 mm thick) to the soldering process. Next, the copper plate 2660 may be attached with a solid-state heat transfer material 2630 and a conductive tape 2642 (thickness of approximately 0.02-0.04 mm). The heat pipe 2650 module with the solid state heat transfer material 2630 and the conductive tape 2642 attached thereto is then electrically connected to the shield structure 2640 using the conductive tape 2642 in coupling the substrate 2610 to the support structure 2620. [ ), So that a PBA having a heat dissipation structure can be manufactured.

Figure 27 is an exemplary diagram illustrating the placement of a heat pipe incorporating a heat collecting / diffusing device in accordance with various embodiments of the present invention, respectively.

Referring to FIG. 27, the heat pipe 2750 according to various embodiments may be at least partially the same heat pipe as the heat pipe 450 shown in FIGS. The heat transfer structure shown in Fig. 27 can be equally applied to the shielding structure of the electronic device shown in Figs. 9 to 14 at least partially or entirely.

The heat pipe 2750 according to various embodiments may include the first to third heat generating parts P1 to P3 and corresponding first to third parts 2750a to 2750c. The first portion 2750a may be the one end portion of the heat pipe 2750 and the third portion 2750c may be the other end portion of the heat flight 2750 and the second portion 2750b may be the one- May be part of a heat pipe 2750 between the heat sinks 2750a, 2750c.

The heat pipe 2750 according to various embodiments may be configured in various shapes, for example, linear, curved, or combination of linear and curved shapes, and the position between the first to third heat generating parts P1 to P3 And the width and thickness can be adjusted according to the sizes of the first to third heat generating parts P1 to P3.

The heat pipe 2750 and the first and second heat collecting / diffusing devices 2760 and 2761 are disposed on the first to third heat generating parts P1 to P3 mounted on the electronic device, Can be transferred to a relatively low temperature region and diffused to the periphery. The heat pipe 2750 according to various embodiments may have a flat cross-sectional shape in order to maximize a bonding surface to a heat source, for example, a heat generating component.

The electronic device according to various embodiments may include a plurality of heating elements. For example, the plurality of heating elements disposed in the electronic device may be a printed circuit board on which a plurality of electronic components are disposed, and may be each electronic component disposed on the printed circuit board. For example, the heat generating component may include heat generating components, such as a PAM, an AP, or a memory, which emits heat in accordance with an operation mode of the electronic device among a plurality of electronic components disposed on the printed circuit board. For convenience of explanation, it is assumed that the PAM or the IF PMIC is referred to as a first heat generating component P1, the AP is referred to as a second heat generating component P2, and the memory is referred to as a third heat generating component P3. The first heat generating part P1 is arranged close to the first part 2750a of the heat pipe 2750 and the second heat generating part P2 is disposed on the second part 2750b, The third heat generating component P3 may be disposed. The first to third heat generating parts P1 to P3 can operate at different heat generating temperatures, respectively, depending on the operation mode of the electronic device.

The heat collecting / diffusing device according to various embodiments may be combined with a plurality of heat collecting / diffusing members in the heat frit 2750. 27 shows an example in which two single heat collecting / diffusing members 2760 and 2761 are disposed in the heat pipe 2750, but one or more heat collecting / diffusing members may be disposed along the heat frit 2750 .

The heat collecting / diffusing device according to various embodiments may include first and second heat collecting / diffusing members 2760,2761. The first heat collecting / diffusing member 2760 may be disposed adjacent to the first heat generating component P1. The second heat collecting / diffusing member 2761 may be disposed adjacent to at least one or more heat generating parts P2, P3.

The heat collecting / diffusing device according to various embodiments may perform a heat collecting function in the first mode and a heat spreading function in the second mode. In addition, the heat collecting / diffusing device can perform a part of the heat collecting function in the third mode, the other part performs the heat spreading function, the part performs the heat diffusing function in the fourth mode, Can be performed. Heat collection refers to the function of collecting the heat transferred from the exothermic parts, and thermal diffusion can mean the function of diffusing the heat to the surroundings.

The electronic device according to various embodiments may operate in various modes and may operate, for example, in a communication mode, a camera mode of operation, a game mode, and the like. The heat generation temperatures of the first to third heat generating components may be different depending on the respective modes. For example, in the communication mode of the electronic device, the first heat generating component, for example, the PAM (or IF PMIC) may be the hot zone region having the highest temperature, and in the camera operation mode or the game mode, Can be the hot zone region having the highest temperature. In other words, the heat generating temperature of each heat generating component may be different depending on the operation mode of the electronic device. The third heat generating component may be lower in temperature than the first and second heat generating components, or may be the temperature between the first and second heat generating components.

In the communication mode of the electronic device, since the first heat-generating component P1 is the hot-zone having the highest temperature, the heat generated in the first heat-generating component P1 is collected by the first heat collecting / diffusing member 2760 , And the collected heat may be transferred to a relatively low temperature heat pipe 2750. The heat transferred to the heat frit 2750 may then be diffused by the second heat collecting / diffusing member 2761 to a peripheral region that is relatively cool.

The heat generated in the second heat generating component P1 is transmitted to the second heat collecting / diffusing member P1 (i.e., the first heat collecting / diffusing member P1) because the second heat generating component P2 is the hot zone region having the highest temperature in the camera operation mode of the electronic device, 2761, and the collected heat can be transferred to a relatively low temperature heat pipe 2750. [0042] The heat transferred to the heat pipe 2750 may then be diffused by the first heat collecting / diffusing member 2760 to a peripheral region that is relatively cool and may diffuse to other portions of the second heat collecting / diffusing member.

Depending on the operating mode of the electronic device, i.e., the temperature difference between the first to third heat generating components P1 to P3, each of the first and second heat collecting / diffusing members 2760 and 2761 collects heat or diffuses And the like.

28 is an exemplary view showing the arrangement of a heat pipe combined with a heat collecting / diffusing device according to various embodiments of the present invention, respectively.

28, a heat pipe 2850 according to various embodiments may be combined with a single heat collecting / diffusing member 2860 to configure the heat transfer structure of the heat generating component. The heat pipe 2850 according to various embodiments may be at least partially the same heat pipe as the heat pipe 450 shown in Figs. The heat transfer structure of the heat generating component according to various embodiments may be at least partially or wholly applicable to the shielding structure of the electronic device shown in Figs. 9 to 14.

The heat collecting / diffusing member 2860 according to various embodiments may be configured to be sufficiently large to cover the entirety of the heat pipe 2850. The heat collecting / diffusing member 2860 includes a first portion 2861 disposed adjacent to the first heat generating component P1, a second portion 2862 disposed adjacent to the second heat generating component P2, And a third portion 2863 disposed in close proximity to the third heat generating component P3 The first, second and third portions 2861-2863 may be fabricated in one piece. it is assumed that a power amplifying module or IF PMIC is referred to as a first heat generating component P1, an AP (application processor) is referred to as a second heat generating component P2 and a memory is referred to as a third heat generating component P3.

In the communication mode of the electronic device, since the first heat-generating component P1 is the hot-zone having the highest temperature, the heat generated in the first heat-generating component P1 is transmitted to the first portion 2861 And the collected heat can be transferred to the heat pipe 2850 and the second portion 2862, which are relatively low temperature. The heat transferred to the heat pipe 2850 may then be diffused by the heat collecting / diffusing member 2860 to a peripheral region that is relatively cool.

Since the second heat generating component P2 is the hot zone area having the highest temperature in the camera operation mode of the electronic device, for example, the moving image shooting mode, the heat generated in the second heat generating component P2 is transmitted to the second Portion 2862 and the collected heat may be diffused to the first and third portions 2861 and 2863, respectively, other than the heat pipe 2850, which is a relatively low temperature.

Depending on the operating mode of the electronic device, i.e., the temperature difference between the first to third heat generating components P1-P3, the first to third portions 2861-2863 of each heat collecting / Collecting, and spreading information.

29 is an exemplary view showing the arrangement of heat pipes to which heat collecting / diffusing devices according to various embodiments of the present invention are combined, respectively.

29, the heat pipe 2950 according to various embodiments is combined with a plurality of heat collecting / diffusing members 2960-2963, respectively, to form a heat transfer structure of the first to third heat generating parts P1-P3 Can be configured. The heat pipe 2950 according to various embodiments may be at least partially the same heat pipe as the heat pipe 450 shown in Figs. The heat transfer structure of the heat generating component according to various embodiments may be at least partially or wholly applicable to the shielding structure of the electronic device shown in Figs. 9 to 14.

The heat collecting / diffusing apparatus according to various embodiments includes first to third heat collecting / diffusing members 2960-2962 (first heat collecting / diffusing member) May be disposed. The heat collecting / diffusing device includes a first heat collecting / diffusing member 2960 disposed adjacent to the first heat generating component P1 and a second heat collecting / diffusing member 2960 disposed adjacent to the second heat generating component P2 2961 and a third heat collecting / diffusing member 2962 disposed adjacent to the third heat generating component P3. First, second and third heat collecting / diffusing members 2960-2962 may be manufactured and spaced along the heat pipe 2950, respectively. For convenience of explanation, it is assumed that the PAM or the IF PMIC is referred to as a first heat generating component P1, the AP is referred to as a second heat generating component P2, and the memory is referred to as a third heat generating component P3.

In the communication mode of the electronic device, since the first heat-generating component P1 is the hot-zone having the highest temperature, the heat generated in the first heat-generating component P1 is collected by the first heat collecting / diffusing member 2960 , And the collected heat may be transferred to a relatively low temperature heat pipe 2950. The heat transferred by the second and third heat collecting / diffusing members 2961 and 2962 to the peripheral region, which is relatively low temperature, can then be diffused.

The heat generated in the second heat generating part P2 is transmitted to the second heat collecting / diffusing part (P2) because the second heat generating part P2 is the hot zone area having the highest temperature in the camera operation mode of the electronic device, 2961, and the collected heat can be diffused by the respective first and third heat collecting / diffusing members 2960, 2962 via the relatively low temperature heat pipe 2950.

Depending on the operating mode of the electronic device, i.e., the temperature difference between the first to third heat generating components P1 to P3, each of the first to third heat collecting / diffusing members 2960 to 2962 collects heat It can play a role of spreading.

As used in this document, the term " module " may refer to a unit comprising, for example, one or more combinations of hardware, software or firmware. A " module " may be interchangeably used with terms such as, for example, unit, logic, logical block, component, or circuit. A " module " may be a minimum unit or a portion of an integrally constructed component. A " module " may be a minimum unit or a portion thereof that performs one or more functions. May be implemented mechanically or electronically. For example, a "module" may be an application-specific integrated circuit (ASIC) chip, field-programmable gate arrays (FPGAs) or programmable-logic devices And may include at least one.

According to various embodiments, at least some of the devices (e.g., modules or functions thereof) or methods (e.g., operations) according to the present disclosure may be stored in a computer readable storage medium -readable storage media). The instructions, when executed by one or more processors (e.g., the processor 210), may cause the one or more processors to perform functions corresponding to the instructions. At least some of the programming modules may be implemented (e.g., executed) by, for example, a processor. At least some of the programming modules may include, for example, modules, programs, routines, sets of instructions or processes, etc. to perform one or more functions.

The computer-readable recording medium includes a magnetic medium such as a hard disk, a floppy disk and a magnetic tape, an optical recording medium such as a CD-ROM (Compact Disc Read Only Memory), a DVD (Digital Versatile Disc) A magneto-optical medium such as a floppy disk, and a program command such as a read only memory (ROM), a random access memory (RAM), a flash memory, Module) that is configured to store and perform the functions described herein. The program instructions may also include machine language code such as those generated by a compiler, as well as high-level language code that may be executed by a computer using an interpreter or the like. The hardware devices described above may be configured to operate as one or more software modules to perform the operations of this disclosure, and vice versa.

A module or programming module according to the present disclosure may include at least one or more of the elements described above, some of which may be omitted, or may further include other additional elements. Operations performed by modules, programming modules, or other components in accordance with the present disclosure may be performed in a sequential, parallel, iterative, or heuristic manner. Also, some operations may be performed in a different order, omitted, or other operations may be added.

It is to be understood that the various embodiments of the present disclosure disclosed in this specification and the drawings are only illustrative of specific examples in order to facilitate describing the subject matter of the disclosure and to facilitate understanding of the disclosure, and are not intended to limit the scope of the disclosure. Accordingly, the scope of the present disclosure should be construed as being included within the scope of the present disclosure in addition to the embodiments disclosed herein, all changes or modifications derived from the technical idea of the present disclosure.

Claims (20)

In an electronic device,
A housing including a first surface facing the first direction and a second surface facing the second direction opposite to the first direction;
A display exposed through at least a portion of the first surface;
A printed circuit board disposed between the first surface and the second surface;
An electronic component disposed on the printed circuit board;
A shield structure mounted on the printed circuit board, the shield structure comprising a conductive structure at least partially surrounding the electronic component, the shield structure comprising: a shield frame surrounding a side surface of the electronic component; and a shield frame surrounding the top surface of the electronic component, And a shield cover disposed to close a space accommodated in the electronic component;
A heat pipe including a first end and a second end, the first end being thermally coupled to a portion of the shielding structure, the first end being disposed closer to the shielding structure than the second end;
A first heat transfer material disposed between the electronic component and the shield cover; And
And a second heat transfer material disposed between the first end of the heat pipe and the shield cover,
And a heat collecting member that is thermally coupled to the electronic component and collects heat generated in the electronic component and transfers the collected heat to at least one end of the heat pipe. delete 2. The electronic device according to claim 1, wherein the heat collecting member comprises a copper sheet. The method of claim 1, wherein the first heat transfer material
And a liquid heat transfer material contacting the electronic part,
The second heat transfer material
And a solid phase heat transfer material laminated on the liquid heat transfer material. The electronic device according to claim 1, wherein the electronic device
Further comprising a plate interposed between the second surface and the printed circuit board,
Wherein at least a portion of the heat pipe extends between the printed circuit board and the plate. In an electronic device,
A housing including a first surface facing the first direction and a second surface facing the second direction opposite to the first direction;
A display exposed through at least a portion of the first surface;
A printed circuit board disposed between the first surface and the second surface;
A plurality of heating elements disposed on the printed circuit board;
A shielding structure mounted on the printed circuit board, the shielding structure including a conductive structure at least partially surrounding the plurality of heating elements, comprising: a shield frame surrounding at least a part of a side surface of the plurality of heating elements; And a shield cover disposed on the shield frame to close a space in which the plurality of heating elements are accommodated;
A heat pipe including a first end and a second end, the first end being thermally coupled to a portion of the shielding structure, the first end being disposed closer to the shielding structure than the second end;
A first heat transfer material disposed between the heat generating elements and the shield cover; And
And a second heat transfer material disposed between the first end of the heat pipe and the shield cover,
And a heat collecting member that is thermally coupled to the plurality of heat generating elements and collects heat generated in the heat generating elements and transfers the collected heat to at least the first end of the heat pipe. delete 7. The electronic device of claim 6, wherein the heat collecting member comprises a copper sheet. The electronic device according to claim 6, wherein the plurality of heating elements include at least two of a power amplifying module (PAM), an application processor (AP), or a memory. In an electronic device,
Support structure;
A printed circuit board comprising a first side facing the support structure and a second side opposite to the first side;
At least one heat source disposed on the first surface of the printed circuit board;
A shield structure mounted on the printed circuit board, the shield structure including a conductive structure at least partially surrounding the heat source, the shield frame surrounding a side surface of the heat source, and a shield frame surrounding the top surface of the heat source, A shielding structure including a shield cover closing a space in which the heat source is housed;
A heat pipe including a first end and a second end, the first end being thermally coupled to a portion of the shielding structure, the first end being disposed closer to the shielding structure than the second end;
A first heat transfer material disposed between the heat source and the shield cover;
A second heat transfer material disposed between the first end of the heat pipe and the shield cover; And
And a heat collecting member that is thermally coupled to the heat source and transfers heat generated in the heat source to at least the first end of the heat pipe. 11. The electronic device of claim 10, wherein the heat collecting member comprises a copper sheet. 11. The electronic device of claim 10, wherein the heat pipe is inserted into a recess formed in the support structure. In a portable communication device,
display;
A circuit board disposed below the display;
An electronic component disposed on a face of the circuit board facing the display;
A first heat transfer member disposed on the electronic component;
A shielding member surrounding at least a portion of the electronic component and at least a portion of the first heat transfer member so as to shield electromagnetic interference (EMI) associated with the electronic component;
A second heat transfer member disposed on the shielding member;
A heat pipe disposed over the shield member to receive at least a portion of the heat emitted from the electronic component through the first heat transfer member, the shield member, and the second heat transfer member; And
And a support member surrounding at least a portion of the heat pipe and supporting the display. 14. The portable communication device according to claim 13, wherein the shield member is configured to cover at least a part of at least one side surface of the electronic component and at least a part of an upper surface of the first heat transfer member. 14. The electronic component according to claim 13, wherein the shielding member comprises a frame portion positioned substantially perpendicular to the circuit board and a cover portion located substantially horizontally on the circuit board, And an inner region of the cover portion is configured to contact the first heat transfer member. 16. The portable communication device according to claim 15, wherein at least a part of an outer region surrounding an inner region of the cover portion is configured to contact the frame portion. 14. The portable communication device of claim 13, wherein the first heat transfer member or the second heat transfer member comprises an interface material (TIM). 14. The portable communication device of claim 13, wherein the first heat transfer member comprises at least one liquid thermal interface material (TIM). 14. The portable communication device of claim 13, wherein the second heat transfer member comprises at least one TIM. 14. The heat exchanger according to claim 13, further comprising a metal plate disposed between the second heat transfer member and the heat pipe,
Wherein the first portion of the upper surface of the metal plate is in contact with the heat pipe, the second portion of the upper surface is in contact with the support member, and at least a portion of the lower surface is in contact with the second heat transfer member.

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