KR101963593B1 - Photosensitive resin comopsition and photocurable pattern forming by the same - Google Patents
Photosensitive resin comopsition and photocurable pattern forming by the same Download PDFInfo
- Publication number
- KR101963593B1 KR101963593B1 KR1020160017862A KR20160017862A KR101963593B1 KR 101963593 B1 KR101963593 B1 KR 101963593B1 KR 1020160017862 A KR1020160017862 A KR 1020160017862A KR 20160017862 A KR20160017862 A KR 20160017862A KR 101963593 B1 KR101963593 B1 KR 101963593B1
- Authority
- KR
- South Korea
- Prior art keywords
- compound
- photosensitive resin
- acrylate
- pattern
- resin composition
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
Abstract
The photopolymerizable compound comprises an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent, wherein the photopolymerizable compound comprises a thiol compound having at least two carboxylic acid groups and an acrylate compound having at least three (meth) acryloyloxy groups, And a photocurable pattern formed therefrom, which can form a pattern having excellent micropatterns and straightness due to excellent developability and development resistance by including a polyfunctional acrylate compound as an addition reaction product.
Description
The present invention relates to a photosensitive resin composition and a photocurable pattern formed therefrom. More particularly, the present invention relates to a photosensitive resin composition capable of forming a pattern having excellent developability and having a fine pattern and excellent linearity, and a photocurable pattern .
In the display field, the photosensitive resin composition is used for forming various photo-curing patterns such as a photoresist, an insulating film, a protective film, a black matrix, and a column spacer. Specifically, the photosensitive resin composition is selectively exposed and developed by a photolithography process to form a desired photo-curable pattern. In order to improve the process yield and improve the physical properties of the application object in this process, a photosensitive resin having a high sensitivity A composition is required.
The pattern formation of the photosensitive resin composition is caused by photolithography, that is, a change in the polarity of the polymer caused by the photoreaction and a crosslinking reaction. Particularly, the change characteristics of the solubility in a solvent such as an aqueous alkali solution after exposure are utilized.
Pattern formation by the photosensitive resin composition is classified into a positive type and a negative type depending on the solubility of the photosensitive portion in development. In the positive type photoresist, the exposed portion is dissolved by the developing solution, and the negative type photoresist is a method in which the exposed portion is not dissolved in the developing solution and the unexposed portion is dissolved to form a pattern. In the positive type and negative type, A binder resin, a cross-linking agent, and the like.
Since the photosensitive resin composition is formed of a coating film having a thickness of 3 탆 or more and most of the coating film should be developed, a large amount of the photosensitive resin composition must be dissolved in the developing solution in a short time. In addition, if the development is not cleaned, it may cause not only a direct stain due to residues but also various display defects such as poor alignment of liquid crystals. Therefore, the photosensitive resin composition should have excellent developing properties.
In addition, if the portion to be formed in a pattern without being developed is dissolved in the developer, it is impossible to form a fine pattern, and thus excellent developing resistance is required.
Korean Patent Publication No. 2010-0063540 discloses a negative photosensitive resin composition.
An object of the present invention is to provide a photosensitive resin composition which is excellent in developability and development resistance and can form a pattern having excellent fine patterns and straightness.
It is an object of the present invention to provide a photo-curable pattern formed of the photosensitive resin composition having excellent linearity.
1. A photosensitive resin composition comprising an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator and a solvent,
Wherein said photopolymerizable compound comprises a polyfunctional acrylate compound which is a Michael addition reaction product of a thiol compound having at least two carboxylic acid groups and an acrylate compound having at least three (meth) acryloyloxy groups.
2. The photosensitive resin composition according to 1 above, wherein the polyfunctional acrylate compound is a compound represented by the following formula (1)
[Chemical Formula 1]
(Wherein R 1 is a hydrogen atom or a methyl group,
n is an integer of 2 to 8,
And L is an aliphatic or aromatic hydrocarbon group having 1 to 20 carbon atoms, which may further contain a hetero atom.
3. The photosensitive resin composition according to item 1, wherein the thiol compound having at least two carboxylic acid groups is a compound represented by formula (4)
[Chemical Formula 4]
4. The acrylate compound having at least three (meth) acryloyloxy groups as described in the above 1, wherein the acrylate compound having at least three (meth) acryloyloxy groups is at least one selected from the group consisting of pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol tri Wherein the photosensitive resin composition is at least one selected from the group consisting of dipentaerythritol hexa (meth) acrylate, dipentaerythritol tetra (metha) acrylate, dipentaerythritol penta (meth) acrylate and dipentaerythritol hexa .
5. The photosensitive resin composition according to 1 above, wherein the polyfunctional acrylate compound is at least one compound represented by the following general formula (2) and (3)
(2)
(3)
6. The photosensitive resin composition according to 1 above, wherein the polyfunctional acrylate compound is contained in an amount of 30 to 100 parts by weight per 100 parts by weight of the total photopolymerizable compound.
7. The photosensitive resin composition according to 1 above, wherein the photosensitive resin composition is a negative type.
8. A photocurable pattern formed from the photosensitive resin composition of any one of items 1 to 7 above.
9. The photocurable pattern according to the above 8, wherein the photocurable pattern is selected from the group consisting of an array planarizing film pattern, a protective film pattern, an insulating film pattern, a photoresist pattern, a black matrix pattern and a column spacer pattern.
10. An image display device comprising the photocuring pattern of the above 8.
INDUSTRIAL APPLICABILITY The present invention is capable of forming a pattern having excellent developability and development resistance and excellent in fine pattern and straightness.
The present invention can produce a photo-curable pattern formed of the above photosensitive resin composition and having excellent linearity.
1 is a 1 H-NMR spectrum of a polyfunctional acrylate compound according to the present invention.
The photopolymerizable compound comprises an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent, wherein the photopolymerizable compound comprises a thiol compound having at least two carboxylic acid groups and an acrylate compound having at least three (meth) acryloyloxy groups, And a photocurable pattern formed therefrom, which can form a pattern having excellent micropatterns and straightness due to excellent developability and development resistance by including a polyfunctional acrylate compound as an addition reaction product.
<Photosensitive resin composition>
The photosensitive resin composition of the present invention comprises an alkali-soluble resin, a polyfunctional acrylate compound which is a Michael addition product of a thiol compound having at least two carboxylic acid groups and an acrylate compound having at least three (meth) acryloyloxy groups, a photopolymerization initiator And a solvent.
Alkali-soluble resin
The alkali-soluble resin may be prepared by copolymerizing an ethylenically unsaturated monomer having a carboxyl group as an essential component in order to have solubility in an alkali developing solution used in a developing process for forming a pattern.
In order to ensure compatibility and storage stability of the photosensitive resin composition, the acid value of the alkali-soluble resin may preferably be 30 to 150 mgKOH / g. When the acid value of the alkali-soluble resin is less than 30 mgKOH / g, it is difficult to secure a sufficient developing rate of the photosensitive resin composition. When the acid value is more than 150 mgKOH / g, the adhesion with the substrate is decreased to easily cause a short circuit, And the viscosity tends to rise.
Specific examples of the ethylenically unsaturated monomer having a carboxyl group include monocarboxylic acids such as acrylic acid, methacrylic acid and crotonic acid; Dicarboxylic acids such as fumaric acid, mesaconic acid and itaconic acid; And anhydrides of these dicarboxylic acids; (meth) acrylates of a polymer having a carboxyl group and a hydroxyl group at both terminals such as? -carboxypolycaprolactone mono (meth) acrylate, and acrylic acid and methacrylic acid are preferable.
In order to impart a hydroxyl group to the alkali-soluble resin, an ethylenically unsaturated monomer having a carboxyl group and an ethylenically unsaturated monomer having a hydroxyl group can be copolymerized, and a compound having a glycidyl group in a copolymer of an ethylenically unsaturated monomer having a carboxyl group Followed by further reaction. And further by reacting a copolymer of an ethylenically unsaturated monomer having a carboxyl group and an ethylenically unsaturated monomer having a hydroxyl group with a compound having a glycidyl group.
Specific examples of the glycidyl group-containing compounds include butyl glycidyl ether, glycidyl propyl ether, glycidylphenyl ether, 2-ethylhexyl glycidyl ether, glycidyl butyrate, glycidyl methyl ether, Benzyl glycidyl ether, glycidyl 4-t-butyl benzoate, glycidyl stearate, aryl glycidyl ether, glycidyl methacrylate, glycidyl glycidyl ether, Epoxycyclohexanedicarboxylic acid ester, and the like, and butyl glycidyl ether, aryl glycidyl ether, and methacrylic acid glycidyl ester are preferable, and two or more kinds thereof can be used in combination.
The unsaturated monomers copolymerizable in the preparation of the alkali-soluble resin are exemplified below, but are not limited thereto.
Specific examples of the polymerizable monomer having an unsaturated bond capable of copolymerization include aromatic vinyl compounds such as styrene and vinyl toluene; N-substituted maleimide-based compounds such as N-cyclohexylmaleimide and N-benzylmaleimide; Alkyl (meth) acrylates such as methyl (meth) acrylate and ethyl (meth) acrylate; Alicyclic (meth) acrylates such as cyclopentyl (meth) acrylate and cyclohexyl (meth) acrylate; Hydroxyethyl (meth) acrylates such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate; Aryl (meth) acrylates such as phenyl (meth) acrylate and benzyl (meth) acrylate; And unsaturated oxetane compounds such as 3- (methacryloyloxymethyl) oxetane and 3- (methacryloyloxymethyl) -3-ethyloxetane.
The above monomers may be used alone or in combination of two or more.
The content of the alkali-soluble resin may be 10 to 90 parts by weight, preferably 30 to 70 parts by weight, based on 100 parts by weight of the total solid content of the photosensitive resin composition. When the above range is satisfied, the solubility in a developing solution is sufficient, and pattern formation is easy.
Photopolymerizable compound
The photopolymerizable compound according to the present invention comprises a polyfunctional acrylate-based photopolymerizable compound which is a Michael addition product of a thiol compound having at least two carboxylic acid groups and an acrylate compound having at least three (meth) acryloyloxy groups, Acrylate equivalents are high, and the resistance to development is excellent. At the same time, by having two or more carboxylic acid groups excellent in alkali solubility, excellent developability can be exhibited.
When a pattern is formed by photolithography using the photosensitive resin composition of the present invention, the cured portion for pattern formation has excellent developing resistance and is not well dissolved in the developer, and the uncured portion has excellent developing properties It is well dissolved by developer and easy to remove.
In this respect, the photosensitive resin composition of the present invention may be a negative type photosensitive resin composition. Accordingly, the portion cured by exposure does not dissolve in the developer, exhibits excellent developing resistance, and the unexposed portion exhibits high developability and can be dissolved in the developer.
The polyfunctional acrylate compound according to the present invention may be, for example, a compound represented by the following formula (1)
[Chemical Formula 1]
Wherein R 1 is a hydrogen atom or a methyl group,
n is an integer of 2 to 8,
And L is an aliphatic or aromatic hydrocarbon group having 1 to 20 carbon atoms, which may further contain a hetero atom.
The polyfunctional acrylate compound according to the present invention may be obtained, for example, by Michael addition reaction of a thiol compound having at least two carboxylic acid groups and a compound having at least three (meth) acryloyloxy groups.
The thiol compound having at least two carboxylic acid groups may be, for example, a compound represented by the following formula (4)
[Chemical Formula 4]
Examples of the acrylate compound having at least three (meth) acryloyloxy groups include pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol tri (Meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate and dipentaerythritol hexa (meth) acrylate.
The polyfunctional acrylate compound according to the present invention may be used alone or in combination.
Specific examples of the polyfunctional acrylate compound according to the present invention may be at least one of the compounds represented by the following general formulas (2) and (3).
(2)
(3)
The content of the polyfunctional acrylate compound according to the present invention is not particularly limited, but may be, for example, 30 to 100 parts by weight based on 100 parts by weight of the photopolymerizable compound. Or the polyfunctional acrylate compound according to the present invention may be mixed with other polyfunctional compounds in an amount of, for example, 30 to 80 parts by weight per 100 parts by weight of the photopolymerizable compound.
If the content of the polyfunctional acrylate compound is 30 parts by weight or less, the effect of improving developability and developing resistance may be insignificant.
Photopolymerization initiator
The photopolymerization initiator according to the present invention is not particularly limited as long as it can polymerize the polymerizable compound, and examples thereof include acetophenone-based compounds, benzophenone-based compounds, triazine-based compounds, At least one compound selected from the group consisting of a sol-based compound, a thioxanthone compound, and an oxime ester compound can be used.
The photopolymerization initiator may further include a photopolymerization initiator to improve the sensitivity of the photosensitive resin composition of the present invention. Since the photosensitive resin composition according to the present invention contains a photopolymerization initiator, the sensitivity can be further increased and the productivity can be improved.
Examples of the photopolymerization initiator include at least one compound selected from the group consisting of an amine compound, a carboxylic acid compound, and an organic sulfur compound having a thiol group.
The content of the photopolymerization initiator is not particularly limited and may be, for example, 0.1 to 10 parts by weight, preferably 0.1 to 5 parts by weight, based on 100 parts by weight of the total solid content of the photosensitive resin composition. When the above range is satisfied, the sensitivity of the photosensitive resin composition is increased and the exposure time is shortened, so that the productivity is improved and high resolution can be maintained, and the strength of the formed pattern and the smoothness of the pattern surface can be improved.
menstruum
The solvent may be any solvent as long as it is commonly used in the art.
Specific examples of the solvent include ethylene glycol monoalkyl ethers, diethylene glycol dialkyl ethers, ethylene glycol alkyl ether acetates, alkylene glycol alkyl ether acetates, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, Propylene glycol alkyl ether propionates, butyldiol monoalkyl ethers, butanediol monoalkyl ether acetates, butanediol monoalkyl ether propionates, dipropylene glycol dialkyl ethers, aromatic hydrocarbons, ketones, alcohols, esters And cyclic esters. The solvents exemplified herein may be used alone or in combination of two or more.
The solvent may be selected from alkylene glycol alkyl ether acetates, ketones, butanediol alkyl ether acetates, butanediol monoalkyl ethers and esters, and more preferably propylene glycol monomethyl Ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, methoxybutyl acetate, methoxybutanol, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate and the like can be used.
The solvent content may be included in the photosensitive resin composition in an amount of 40 to 95 parts by weight, preferably 45 to 85 parts by weight based on 100 parts by weight of the total amount. When the above-mentioned range is satisfied, it is preferable because the coating property is improved when applied by a spin coater, a slit & spin coater, a slit coater (sometimes called a die coater, a curtain flow coater), an ink jet or the like.
additive
The photosensitive resin composition according to the present invention may further contain additives such as polyfunctional thiol compounds, fillers, other polymer compounds, curing agents, leveling agents, adhesion promoters, antioxidants, ultraviolet absorbers, .
<Photocuring pattern and image display device>
An object of the present invention is to provide an image display device including the photo-curable pattern made of the photosensitive resin composition and the photo-curable pattern.
The photocurable pattern prepared from the photosensitive resin composition is excellent in chemical resistance and peeling resistance. As a result, it can be used in various patterns such as an adhesive layer, an array flattening film, a protective film, an insulating film pattern, etc. in an image display apparatus, and can be used as a photoresist, a black matrix, a column spacer pattern, And is particularly suitable as a photoresist pattern.
The image display device having the light curing pattern or using the pattern during the manufacturing process may include a liquid crystal display device, an OLED, a flexible display, and the like. However, the present invention is not limited thereto, Can be exemplified.
The photo-curing pattern can be produced by applying the above-described photosensitive resin composition of the present invention onto a substrate and forming a photo-curable pattern (after the development step if necessary).
It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to be illustrative of the invention and are not intended to limit the scope of the claims. It will be apparent to those skilled in the art that such variations and modifications are within the scope of the appended claims.
Manufacturing example One
Propylene glycol at room temperature monomethyl ether (PGME), and 138g of pentaerythritol tetraacrylate (PETA) was added 90g (0.26mol) in 500mL reactor and, C 4 H 6 O 4 S ( mercaptopropionic acid) 38.4g (0.26mol , 10.1 g (0.1 equivalent) of triethylamine (TEA) was added as a reaction catalyst and the temperature was raised to 60 DEG C and stirred for 48 hours to obtain a polyfunctional acrylate (2), which is a rate-based compound, was obtained, and NMR analysis was performed as shown in Fig. 1 to confirm the product dissolved in PGME.
(2)
Manufacturing example 2
(3) dissolved in the following 50% PGME solution was obtained in the same manner as in Preparation Example 1, except that 196 g of PGME and 148 g (0.256 mol) of dipentaerythritol hexaacrylate (DPHA) instead of PETA were used.
(3)
Example And Comparative Example
A photosensitive resin composition having the composition and content shown in Table 1 below was prepared.
(Solid content)
(Solid content)
(Solid content)
50
B-3
75
A-1: Benzyl methacrylate / methacrylic acid (70:30 molar ratio) copolymer (weight average molecular weight 16000)
B-1: The polyfunctional acrylate prepared in Preparation Example 1
B-2: The polyfunctional acrylate prepared in Preparation Example 2
B-3:
B-4:
B-5:
C-1: I-184
D-1: Propylene glycol monoethyl ether acetate (PGMEA)
Experimental Example
1. Developability Evaluation
The sample thus prepared as described above was immersed in a KOH aqueous solution prepared by dissolving KOH in distilled water and having a pH of 14 for 1 minute, taking out a sample, immersing it in distilled water for 1 minute and removing it. After drying for a minute, the surface state was confirmed.
<Criteria>
Haze is not visible on the surface at all: ◎
Haze is locally slightly visible on the surface: ○
Haze on the surface is slightly visible from the front: △
Haze visually observed on the surface: x
2. Phenotypic resistance evaluation
A glass substrate (Eagle 2000; Corning) having an aspect ratio of 2 inches was sequentially washed with a neutral detergent, water and alcohol, and then dried. The photosensitive resin compositions prepared in the above Examples and Comparative Examples were respectively spin-coated on the glass substrate and then pre-baked at 90 DEG C for 125 seconds using a hot plate. After the substrate was cooled to room temperature, light was irradiated at an exposure dose of 60 mJ / cm 2 (based on 365 nm) using an exposure apparatus (UX-1100SM; Ushio Co., Ltd.) with an interval of 150 μm from the quartz glass photomask. At this time, the photomask used was a photomask in which the following pattern was formed on the same plane.
The samples after the exposure were immersed in a KOH aqueous solution prepared by dissolving KOH in distilled water to make PH = 14 for 10 minutes, taken out of the sample, immersed in distilled water for 1 minute, taken out and dried in a 100 ° C drying oven for 1 minute, And the surface state of the sample was confirmed.
<Criteria>
Haze is not visible on the surface at all: ○
Surface haze is visible, but slightly visible: △
Surface haze visually observed: x
Referring to Table 2 above, it can be confirmed that the photosensitive resin composition of the examples is excellent in developing property and the produced pattern has excellent developing resistance.
However, in the comparative example, it can be confirmed that the developing property is poor.
In Examples 2 and 4 (mixture of strongly soluble monomer and weakly soluble monomer), the total content of carboxylic acid contained in the photopolymerizable compound may be smaller than that of Comparative Example 2 (medium soluble monomer), but the strongly soluble monomer rapidly dissolves And thus the dissolution of the weakly soluble monomer is facilitated. Thus, it is judged that Examples 2 and 4 are more improved in developing performance than Comparative Example 2.
Claims (10)
Wherein said photopolymerizable compound comprises a polyfunctional acrylate compound which is a Michael addition reaction product of a thiol compound having at least two carboxylic acid groups and an acrylate compound having at least three (meth) acryloyloxy groups.
[Chemical Formula 1]
(Wherein R 1 is a hydrogen atom or a methyl group,
n is an integer of 2 to 8,
And L is an aliphatic or aromatic hydrocarbon group having 1 to 20 carbon atoms, which may further contain a hetero atom.
[Chemical Formula 4]
(2)
(3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160017862A KR101963593B1 (en) | 2016-02-16 | 2016-02-16 | Photosensitive resin comopsition and photocurable pattern forming by the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160017862A KR101963593B1 (en) | 2016-02-16 | 2016-02-16 | Photosensitive resin comopsition and photocurable pattern forming by the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170096458A KR20170096458A (en) | 2017-08-24 |
| KR101963593B1 true KR101963593B1 (en) | 2019-03-29 |
Family
ID=59758085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020160017862A KR101963593B1 (en) | 2016-02-16 | 2016-02-16 | Photosensitive resin comopsition and photocurable pattern forming by the same |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101963593B1 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006227224A (en) | 2005-02-16 | 2006-08-31 | Fuji Photo Film Co Ltd | Composition for pattern formation, and pattern forming material, apparatus, and method |
| JP2008083594A (en) | 2006-09-28 | 2008-04-10 | Fujifilm Corp | Colored photosensitive composition, color filter and method for producing the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101047703B1 (en) * | 2007-02-20 | 2011-07-08 | 동우 화인켐 주식회사 | Colored photosensitive resin composition and color filter |
| KR20100063540A (en) | 2008-12-03 | 2010-06-11 | 주식회사 동진쎄미켐 | Negative photosensitive resin composition |
| KR20150109106A (en) * | 2014-03-19 | 2015-10-01 | 동우 화인켐 주식회사 | A colored photosensitive resin composition for color filter, color filter and liquid crystal display device having the same |
-
2016
- 2016-02-16 KR KR1020160017862A patent/KR101963593B1/en active IP Right Grant
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006227224A (en) | 2005-02-16 | 2006-08-31 | Fuji Photo Film Co Ltd | Composition for pattern formation, and pattern forming material, apparatus, and method |
| JP2008083594A (en) | 2006-09-28 | 2008-04-10 | Fujifilm Corp | Colored photosensitive composition, color filter and method for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170096458A (en) | 2017-08-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106970504B (en) | Photosensitive resin composition, photocured pattern and image display device | |
| CN105988288B (en) | Photosensitive resin composition, photocured pattern and image display device | |
| TWI665518B (en) | Negative-type photosensitive resin composition, photo-curable pattern and image display device using the same | |
| KR20160029339A (en) | Photosensitive resin comopsition | |
| JP6506732B2 (en) | Negative photosensitive resin composition and photocurable pattern produced therefrom | |
| CN107817652B (en) | Photosensitive resin composition and photocured pattern produced therefrom | |
| KR101979980B1 (en) | Photosensitive Resin Composition | |
| KR101592849B1 (en) | Negative-type photosensitive resin comopsition | |
| KR20170112923A (en) | Negative-type Photosensitive Resin Composition | |
| KR20170018680A (en) | Negative-type photosensitive resin comopsition | |
| CN106483765B (en) | Photosensitive resin composition and photocured pattern formed by same | |
| KR101963593B1 (en) | Photosensitive resin comopsition and photocurable pattern forming by the same | |
| JP5280043B2 (en) | Liquid crystal alignment control protrusion and color filter | |
| KR20150011070A (en) | A photosensitive resin composition for spacer and a spacer using the same | |
| KR20120057677A (en) | Photosensitive resin composition for spacer, spacer using the same and liquid crystal display device including the spacer | |
| KR20170027501A (en) | Photosensitive resin comopsition and cured pattern formed from the same | |
| KR20140100755A (en) | Alkali soluble resin and photosensitive resin composition comprising the same | |
| KR20140104766A (en) | Alkali soluble resin and photosensitive resin composition comprising the same | |
| KR20170105244A (en) | Photosensitive resin composition, photocurable pattern formed from the same and image display comprising the pattern | |
| KR20170133063A (en) | Photosensitive resin composition and cured pattern formed from the same | |
| KR102607171B1 (en) | Photosensitive resin composition and photo-cured pattern prepared from the same | |
| KR20180031131A (en) | Photosensitive resin composition and photo-cured pattern prepared from the same | |
| CN107422603B (en) | Photosensitive resin composition and photocured pattern produced therefrom | |
| KR20170107661A (en) | Acrylamide Photopolymerizable Monomer and Photosensitive Resin Composition Comprising the Same | |
| KR102001683B1 (en) | Polyfunctional acrylate compounds, a photosensitive resin composition, color filter and display device comprising the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |