KR101954354B1

KR101954354B1 - Super abrasive element containing thermally stable polycrystalline diamond material and methods and assemblies for formation thereof

Info

Publication number: KR101954354B1
Application number: KR1020147000776A
Authority: KR
Inventors: 브라이언 앳킨스; 세트 지. 안들레; 로버트 더블유. 아르페레; 람 엘. 라디; 브랜든 파울 린포드; 제이슨 케이스 위긴스; 케빈 듀이 뉴옌; 지앙 첸; 케니스 유진 베르타놀리; 샨 캐시 스코트; 데브쿠마르 무코파디아이; 마이클 알렉산더 바일
Original assignee: 핼리버튼 에너지 서비시즈 인코퍼레이티드
Priority date: 2011-06-10
Filing date: 2012-06-09
Publication date: 2019-03-05
Also published as: EP2718474A2; WO2012170970A2; WO2012170970A3; AU2012267485A1; CA2838822C; KR20140074879A; AU2012267485B2; CN104185689B; CN104185689A; CA2838822A1

Abstract

The present invention relates to a thermally stable polycrystalline diamond (TSP) body having substantially a catalyst-member having pores and a contact surface, a base adjacent to the contact surface of the TSP body, and a base adjacent to the base and a pore of the TSP body The super abrasive member containing the infiltration material. The present invention additionally provides an excavating drill bit and other apparatus containing such a super abrasive member. The present invention further provides a method and mold assembly for forming such super abrasive members through infiltration and hot pressing methods.

Description

Technical Field The present invention relates to a super abrasive member containing a thermally stable polycrystalline diamond material and a method and an assembly for forming the super abrasive member.

The present invention relates to a super abrasive element comprising a super-abrasive body such as a thermally stable polycrystalline diamond (TSP) body bonded to a base through an infiltrant material. will be. In a more specific embodiment, the TSP body may be substantially free of infiltration material, and is present in minor amounts near the TSP body surface in contact with the base only. In some embodiments, the infiltrant material can also penetrate the base, if it can function as a binder. The present invention also relates to a method of forming a super abrasive member containing a TSP body bonded to a base using an infiltration material. In certain embodiments, the method can include forming a super abrasive member in the presence of an infiltration material and also forming a base in a mold containing the TSP.

Components of various industrial devices are often treated in extreme conditions such as high impact contact with the abrasive surface. For example, these extreme conditions are typically encountered during underground excavation for oil extraction or mining purposes. Unmatched wear resistance is the most effective material for earth drilling and similar activities that perform parts under extreme conditions. Diamonds are exceptionally rigid and can conduct heat away from the polishing surface and contact points and provide other benefits under these conditions.

The polycrystalline diamond has an added toughness compared to a single crystal diamond due to the random distribution of the diamond crystals, which prevents the specific plane of cleavage found in single diamond crystals. Accordingly, polycrystalline diamond is often the preferred diamond form in many excavation applications or other extreme conditions. Device elements have a longer usable time under these conditions when their surface layer is typically made of diamond, in the form of a polycrystalline diamond (PCD) compact, or other super abrasive material .

The members for use in harsh conditions may contain a PCD layer bonded to the substrate. The manufacturing process for traditional PCD is very tricky and expensive. This process is referred to as "growing " polycrystalline diamond directly on a carbide substrate to form a polycrystalline diamond composite compact. This process involves placing diamond grains mixed with a cemented carbide piece and a catalyst binder in a press vessel and treating it with a press cycle using very high pressure and temperature conditions. Very high temperatures and pressures are required for small diamond grains to form into integrated polycrystalline diamond bodies. The resulting polycrystalline diamond body is also firmly bonded to the carbide piece to form a composite compact in the form of a polycrystalline diamond layer tightly bonded to the carbide substrate.

The problem with PCD arises from the use of cobalt or other metal catalyst / binder systems to promote polycrystalline diamond growth. After the crystal growth is complete, the catalyst / binder remains in the pores of the polycrystalline diamond body. Because the cobalt or other metal catalyst / binder has a higher coefficient of thermal expansion than the diamond, when the composite compact is heated, for example during a brazing process to attach the carbide portion to another material, or during actual use, the metal catalyst / It expands at a higher rate than diamonds. As a result, when the PCD is treated at a temperature above the critical level, the expanding catalyst / binder causes fractures throughout the polycrystalline diamond structure. This fracture can weaken the PCD and ultimately cause damage or failure.

As a result of these or other effects, it is common to remove the catalyst from parts of the PCD layer, especially those near the work surface. The most common process for removing the catalyst is by using a strong acid bath, but there are also other processes using alternative acid or electrolysis and liquid metal techniques. Generally, catalyst removal from the PCD layer using an acid-based process is referred to as leaching. Acid-based leaching typically occurs first on the outer surface of the PCD layer and proceeds inward. Thus, traditional members containing leached PCD layers are often characterized as being leached from their surface to a certain depth. PCDs containing regions of the PCD layer in which a substantial portion of the catalyst has been leached are referred to as thermally stable PCD (TSP). Examples of commonly used leaching methods are described in U.S. Patent 4,224,380; U.S. Patent 7,712,553; U.S. Patent 6,544,308; US 20060060392 and related patents or applications.

The fresh-leached leach also must be controlled to prevent the interface between the substrates or the acid used for leaching with the substrate and diamond layer. Acids that are sufficient to leach polycrystalline diamond severely degrade substrates that are much less resistant. Damage to the substrate weakens the physical integrity of the PCD member and may cause cracking, breakage, or other physical failure during use, which may also cause other damage.

The need to carefully control the leaching of the members containing the PCD layer adds considerably to the complexity, time and cost of PCD fabrication. Also, leaching is typically carried out on the arrangements of the PCD member. Tests to ensure adequate leaching are destructive and should be performed on representative components from each batch. This demand for destructive testing adds to the cost of producing PCD members.

Attempts have been made to prevent leaching problems of fully formed members by separately leaching the PCD layer and then attaching it to the substrate. However, these attempts have failed to form usable members. In particular, the methods of attaching the PCD layer to the substrate may fail during actual use, so that the PCD layer may slip or separate. In particular, U. S. Patent Nos. 4,850, 523; Members produced using brazing methods such as those described in U.S. Patent 7,487,849, and related patents or applications, or mechanical locking methods such as those described in U.S. Pat. No. 7,533,740 or U.S. Pat. No. 4,629,373, are prone to failure.

Other methods of bonding the PCD layer to the pre-formed substrate are described in U.S. Patent No. 7,845,438, but require melting of materials already present in the substrate and infiltration of the PCD layer by the material.

In yet another method, the leached PCD layer is attached directly to the gauge region of the bit by infiltrating the entire bit and at least a portion of the PCD layer with a binder material. If these methods are suitable for attaching the PCD to the gauge region, but not required to be removed during the lifetime of the bit, if replacement or rotation of the PCD is required to provide a normal bit life, Lt; RTI ID = 0.0 > PCD < / RTI >

Using another method, a PCD element, sometimes referred to as a geoset, is introduced into the outer portion of the drill bit. Geodesets are typically coated with a metal, for example nickel (Ni). Geoset coatings can provide a variety of advantages, such as the protection of diamonds at higher temperatures, and improved bonding to the drill bit matrix.

Thereby, a leached PCD layer, such as a TSP body, which is very well adhered to the base or substrate to use the member at high temperature conditions, such as being touched by cutting members of an earth-boring drill bit, There is a need for a member that includes a rotatable or interchangeable member having a < RTI ID = 0.0 >

According to one embodiment, the present invention provides a thermally stable polycrystalline diamond (TSP) body substantially of a catalyst-member having pores and a contact surface, a base adjacent the contact surface of the TSP body, And a superabrasive member containing infiltrating material that penetrates into the pores of the TSP body at the contact surface and into the base.

According to another embodiment, the present invention provides an excavating drill bit containing such a super abrasive member in the form of a cutter.

In another embodiment, the present invention provides a thermally stable, polycrystalline diamond (TSP) body having a bottomed mold, a thermally stable polycrystalline diamond (TSP) body located at the bottom of the mold with a contact surface, a matrix powder disposed on the TSP body and adjacent the contact surface a matrix powder, and an infiltrating material disposed on the matrix powder on the mold.

According to another embodiment, the present invention provides a thermally stable polycrystalline diamond (TSP) body comprising a mold, a thermally stable polycrystalline diamond (TSP) body disposed in the mold with a contact surface, a matrix powder disposed adjacent to the contact surface in the mold, There is provided an assembly for forming a super abrasive member comprising an infiltration material or a binder material.

The present invention also relates to a thermally stable polycrystalline diamond (TSP) body located at the bottom of the mold with a bottomed mold, pores and contact surface, a matrix powder disposed on the TSP body and adjacent to the contact surface in the mold, And a method of forming a super abrasive by assembling an assembly comprising a infiltrant material disposed on the matrix powder in a mold. The method further comprises heating the assembly for a time and for a time sufficient to cause the infiltrant material to infiltrate into the pores of the TSP body and the matrix powder, and cooling the assembly to form a super abrasive member.

The present invention also relates to a thermally stable polycrystalline diamond (TSP) body having a mold, pores and a contact surface, a thermally stable polycrystalline diamond (TSP) body disposed in the mold, a matrix powder disposed adjacent to the contact surface in the mold, Providing an additional method of forming a super abrasive member, comprising assembling an assembly comprising a binder material. The method also includes heating the assembly for a time and at a temperature and pressure sufficient to cause the infiltrant or binder material to infiltrate the matrix powder to form a base attached to the TSP body.

A more complete understanding of the present embodiments and advantages thereof may be acquired by reference to the following description, taken in conjunction with the accompanying drawings, which illustrate embodiments of the invention, wherein like numerals refer to like parts .
1 is a side cross-sectional view of an infiltration method assembly for forming a super abrasive member containing a TSP body bonded to a base through infiltration material.
2 is an enlarged cross-sectional view of the super abrasive member.
3 is a side cross-sectional view of a hot pressing method assembly for forming a super abrasive member containing a TSP body bonded to a base through infiltration material.
4 is a side view of a TSP body for use in one embodiment of the present invention.
5A and 5B are top and side views of the super abrasive member.
Figure 6 is a side view of carbide casting reinforcement for use in one embodiment of the present invention.
7 is a side view of a super abrasive member having a dovetail lock.
8 is a side view of a super abrasive member having a lateral lock.
Figure 9 is a side view of a super abrasive member having a combined board tail and side lock.

SUMMARY OF THE INVENTION The present invention is directed to a super abrasive member containing a super abrasive body such as a thermally stable polycrystalline diamond (TSP) body bonded to a base through an infiltration material. The present invention also relates to a tool containing such a super abrasive member, as well as to a method of manufacturing such a super abrasive member. In general, during the method of manufacturing the super abrasive member, the super abrasive properties of the super abrasive body, for example, the TSP body, may remain substantially unchanged or not deteriorated.

In the exemplary embodiments described herein, the super abrasive members are generally cylindrical in shape with a flat surface, but they may have any shape suitable for their end use, for example, in some embodiments, a conical shape , A cylinder-shaped deformation, or even an angle. Further, in some embodiments, the surface of the super abrasive member may be concave, convex, or irregular.

The assembly 10 may be provided for use in forming a super abrasive member through the infiltration method, as shown in Fig. The assembly 10 may include a mold 20 intended to contain the components of the super abrasive member while forming the super abrasive member. The TSP body 30 may be disposed within the mold 20. The TSP body 30 may be substantially free of catalyst used to form the body. For example, at least 85% of the catalyst can be removed from the body. The matrix powder 40 may also be placed on top of the TSP body 30 within the mold. Lastly, the infiltrant material 50 may be disposed on top of the matrix powder 40 within the mold 20.

In order to form the super abrasive member, the assembly 10 can be treated in a forming process, during which the matrix powder 40 is impregnated with the infiltrating material 50, which functions as a binder, do. The infiltrant material 50 moistens the surface of the TSP body 30 in contact with the matrix powder 40 and fills the pores in the TSP body 30 at the surface to attach the TSP body 30 to the base. Fig. 2 shows an enlarged image of a cross section of the super abrasive member 60 that can be formed. The super abrasive member 60 includes a TSP body 30 coupled to a base 70 formed from a matrix powder 40. In certain embodiments, the infiltrant material 50 can be dispersed as a binder in the base 70 and the pores can also be disposed at a depth D of the contact surface 100 of the TSP body 30 in contact with the base 70 To form the infiltrant material-containing region 80. The infiltrant material- The remainder of the TSP body 30 may be substantially free of binding agents and infiltrant-free regions 90 may be formed. The pores can be machined to enable the formation of a micromechanical bond between the base and the TSP rather than just a metallurgical bond.

According to another embodiment (not shown), the infiltrant material 50 may be mixed with the matrix powder 40 prior to the forming process. In one such embodiment, the infiltrant material nonetheless infiltrates the matrix powder 40 and also moistens the surface of the TSP body 30 and also fills the pores on such surface, The base 70 formed from the base 40 can be attached.

According to another embodiment shown in Fig. 3, a super abrasive member 60 of the type shown in Fig. 2 may be formed using the assembly 10a and the hot press method. The assembly 10a may include a mold 20a intended to contain the components of the super abrasive member during its formation. The TSP body 30 may be disposed within the mold 20a. The matrix powder 40a may also be disposed within the mold 20a. Typically, when using the hot press method, the infiltrant is mixed with the matrix powder prior to hot pressing. Accordingly, the matrix powder 40a may additionally contain a binder material mixed therein. The binder material may be an infiltrant material, or it may be a material that can not infiltrate the TSP body 30. The TSP body 30 may be used primarily to remove the binder material from the use of the hot press method, if the binder material may not be sufficient to infiltrate the TSP body 30 or to attach it to the base 70 after formation of the super abrasive member. And can be attached to the base 70 by the resulting mechanical force. In other high temperature press embodiments, a disk of infiltrant material 50 may be disposed on the matrix powder 40 and used to infiltrate the matrix powder, for example, under low pressure.

In alternative embodiments, other infiltration methods, such as hot isostatic pressing, can be used to infiltrate the matrix powder with the infiltrant material.

The mold 20 used in the assembly 10 can be made of any material suitable to withstand the forming process and to enable the removal of the super abrasive member formed. According to a particular embodiment, the mold 20 may contain a ceramic material. In a particular embodiment (not shown), it may be configured to allow infiltration material 50 to flow around the side of the TSP body 30 so that the base 70 To facilitate the mechanical attachment of the TSP body 30. The mold 20a may be any mold suitable to withstand a hot press cycle.

The TSP body 30 may be in any shape suitable for use in the super abrasive member 60. In some embodiments, this may be in the form of a disc, as shown in FIG. The TSP body 30 may have a substantially planar contact surface (not shown). However, as shown in FIG. 4, the TSP body 30 may have features for mechanically enhancing its attachment to the base 70 at the super abrasive member 60. In particular, the TSP body 30 may have a non-planar contact surface 100 as shown in FIG. The non-planar contact surface 100 may contain a non-planar feature, for example a groove 110. The grooves 110 may help prevent the TSP body 30 from slipping from the base 70 in response to forces applied at right angles to the grooves. The non-planar contact surface 100 may have an angled region, for example an angled wall 120 of a groove 110. This angled wall 120 can improve the mechanical connection between the TSP body 30 and the base 70 by mutual locking of the two parts.

Additional configurations for increasing the mechanical attachment of the TSP body 30 to the base 70 may also be used. Two examples of such a configuration are shown in Figures 5A and 5B. Additional mechanical attachment mechanisms may include conventional mechanical TSP attachment mechanisms that have proven to be suitable when combined with attachment through the infiltrating material 50, The overall attachment of the TSP body 30 can be improved. Examples of mechanisms include those identified in U.S. Pat. No. 7,533,740 or U.S. Pat. No. 4,629,373, which are incorporated herein by reference. Other configurations that can increase the mechanical attachment of the TSP body 30 to the base 70 are shown in Figs. 7, 8, and 9. Fig. Some such configurations may apply a compressive force to the TSP body, especially during use, as shown in Fig.

The specific mechanical configuration of the TSP body 30 may be used when mechanically attached to the base 70 via a hot press forming method rather than through infiltration material.

The features of the contact surface 100 may also be used to form the matrix powder 40 prior to formation of the super abrasive member 60. In addition to or in addition to mechanically enhancing the attachment of the TSP body 30 to the base 70, Or to increase the contact surface area in contact with the base 70 after formation of the super abrasive member 60. In particular, the non-planar contact surface 100 can increase the contact surface area. A larger contact surface area may be provided to the base 70 by providing more pores adjacent to the matrix powder 40 to be infiltrated by the infiltrant material 50 or otherwise increasing the wetted surface by the infiltrant material 50 during the forming process. The coupling of the TSP body 30 can be improved.

In some embodiments, the number or volume of pores in the contact surface 100 also provides a greater surface area for the infiltrating material 50 to wet and attach it to the TSP body 30 relative to the base 70, Lt; RTI ID = 0.0 > adhesion. &Lt; / RTI >

The TSP body 30 may be any PCD sufficiently leached to be thermally stable. The remaining catalyst in the PCD material that is not fully leached at a temperature suitable for wetting and wetting the contact surface 100, or for some hot pressing techniques, is such that the matrix powder 40 is impregnated with the infiltrant material 50 The material will be graphitized to carbon, which will weaken or perhaps even decompose it to a point not suitable for use in a super abrasive member. Leaching of the TSP body may be performed prior to its placement in the assembly 10 or 10a and prior to formation of the super abrasive member 60. The TSP body 30 may be formed using standard techniques for creating a PCD layer. In particular, it can be formed by combining the grains of natural or synthetic diamond crystals with a catalyst and treating the mixture at high temperatures and pressures to form PCDs that are attached to or separated from any substrate. The PCD may contain an interstitial matrix containing a diamond body matrix and a catalyst. According to certain embodiments, the catalyst may comprise a Group VIII metal, especially cobalt (Co).

The PCD can then be leached by any process capable of removing the catalyst from the interstitial matrix. The leaching process may also remove the substrate if any are present. In some embodiments, at least a portion of the substrate may be removed by, for example, grinding prior to leaching. In certain embodiments, the PCD can be leached using an acid. The leaching process may be different from a traditional leaching process in that it does not need to protect any substrate or boundary regions from leaching. For example, it may be possible to simply place a PCD or PCD / substrate combination in an acid bath, without having any protective parts commonly used. Even the design of acid baths can be different from traditional acid baths. In various processes for use with the present invention, a simple vat acid can be used.

Alternative leaching methods using Lewis acid-based leaching agents can also be used. In this way, the PCD containing catalyst can be placed in a Lewis acid-based leach until the desired amount of catalyst is removed. This method can be performed at lower temperatures and pressures than conventional leaching methods. Lewis acid-based leaching is ferric chloride (FeCl _3), cupric chloride (CuCl _2), and optionally hydrochloric acid (HCl), or nitric acid (HNO _3), its solution, and comprise a combination thereof . Examples of such leaching methods can be found in US 13 / 168,733 (Ram Ladi et al.), Filed June 24, 2011, entitled " CHEMICAL AGENTS FOR LEACHING POLYCRYSTALLINE DIAMOND ELEMENTS, " The disclosure of which is incorporated herein by reference.

When the catalyst is removed from the interstitial matrix, the pores are present where the catalyst used is located. Percent leaching of PCD can be characterized as the total percentage of catalysts that have been removed to form pores. As noted above, the gradient of leachability can be inward from the surface of the PCD, but nevertheless the average amount of leaching to the PCD can be determined. According to certain embodiments of the present invention, the TSP body 30 may comprise a PCD that is substantially free of catalyst. More specifically, the TSP body may comprise PCD on average at least 85%, at least 90%, at least 95%, or at least 99% of the catalyst leached.

In certain embodiments, the TSP body 30 may have a uniform diamond grain size, but in other embodiments, the grain size may be within the TSP body. For example, in some embodiments, the TSP body 30 may contain larger diamond grains near the contact surface 100 to form more pores, or larger volume pores, Lt; RTI ID = 0.0 > 50 < / RTI > In certain embodiments, such larger diamond grains may form an attachment layer (not shown) in the TSP body 30. In other embodiments, the diamond density may be lower in the adhesion layer. The difficulty in wetting the diamond often has a difficulty in attaching the TSP body 30 to the base 70 and thus a lower diamond density will promote adhesion by improving the wetting of the contact surface 100 .

In another embodiment, the TSP body 30 may contain an adhesion layer formed by a different material, such as a material containing only a small amount of diamond as compared to a carbide forming agent, particularly W ₂ C, or TSP body. have. In one embodiment, such an attachment layer may be disposed on the TSP body prior to formation of the super abrasive member. Due to the destructive tendency of leaching, this adhesion layer can be placed on the TSP body 30 after leaching it. In other embodiments, an attachment layer may be formed during formation of the super abrasive member by a separate layer of material between the matrix powder 40 and the TSP body 30. In each embodiment, the attachment layer may be attached to the TSP body sufficiently to remain intact during use of the super abrasive member, but may provide improved attachment to the base 70. For example, the adherent layer may be more easily wetted by the infiltrant material 50, or may form a more robust attachment to the infiltrant material 50 relative to the TSP.

The matrix powder 40 or 40a may be a powder or any other material suitable for forming the base 70 after infiltration into the infiltrant material 50 that may serve as a binder. In certain embodiments, the matrix powder 40 or 40a may be a material conventionally used to form substrates of conventional PCD members. The matrix powder 40 or 40a may also provide beneficial properties to the base 70, such as rigidity, corrosion resistance, toughness, and adhesion to each TSP body 30. For example, it may be a carbide-containing or carbide-forming powder. The base 70 will have a higher content of infiltrant material 50 than a conventional PCD member substrate typically having a similar material. As a result, the base 70 may be less corrosion-resistant than conventional substrates. Certain powder blends can be used as the matrix powder 40 to improve the corrosion resistance of the base 70. In certain embodiments, the powder blends are carbide, tungsten (W), tungsten carbide (WC or W ₂ C), synthetic diamond, natural diamond, chromium (Cr), iron (Fe), nickel (Ni), or the base (70 Lt; RTI ID = 0.0 > corrosion resistance. &Lt; / RTI > Powder blends may also be made of copper, manganese, phosphorus, oxygen, zinc, tin, cadmium, lead, bismuth, And tellurium (Te). The matrix powder may contain any combination or mixture of materials as described above.

In some embodiments, the matrix powder 40 or 40a may have a substantially uniform particle size. However, in other embodiments, the particle size of the matrix powder (40 or 40a) can be adjusted by varying the particle size of the base (70) relative to the TSP body (30), either by invasion or mechanical means, May be varied to facilitate adhesion. For example, an infiltration method, such as using the assembly 10, a layer of a matrix powder 40 having a smaller particle size, may be disposed adjacent the TSP body 30. A smaller particle size can cause the infiltrant material 50 to form a stronger attachment by allowing more infiltrant material 50 to reach the contact surface 100. Typically, the particles of the matrix powder 40 or 40a will be on the micrometer or nanometer scale. For example, the average particle diameter may be equal to or greater than 5 mu m, for example, from 5 to 6 mu m. Which may be higher, such as 100 [mu] m. This particle size represents the average diameter of the particles found in the portion of the base 70 that extends half the full length of the base 70 from the TSP body 30. [ Overall, the particle size of the matrix powder 40 or 40a may be substantially larger than the allowable particle size in the pre-formed substrate.

In some embodiments, the matrix powder 40 or 40a may be formed of a material that is impregnated with the infiltrant material 50 to form the base 70 and to be in contact with the contact surface of the TSP body 30 100, as long as it is sufficient to substantially conform to the non-powder material.

The infiltrant material 50 may comprise any material capable of infiltrating the matrix powder 40 or 40a to form the base 70. In a hot press method such as using assembly 10a, the infiltrant material 50 may be mixed with the matrix powder 40a prior to hot pressing. In the infiltration method, such as using the assembly 10 and potentially also not essential in some hot press methods, the infiltrant material 50 may also wet the contact surface 100 and contact the TSP body 30 May infiltrate at least a sufficient number of pores located in surface 100 to cause the binding of TSP body 30 to base 70 via infiltrant material 50. [ In certain embodiments, the infiltrant material 50 is a material having an affinity for diamond, such as to easily wet the contact surface 100 or to easily enter the pores through capillary action or a similar attractive effect. . In a more specific embodiment, the infiltrant material 50 may comprise a material suitable for use as a catalyst in PCD formation, for example, a Group VIII metal, such as manganese (Mn) or chromium (Cr) . The infiltrant material 50 may also comprise a carbide or material used in the formation of carbide, for example titanium (Ti) alloyed with copper (Cu) or silver (Ag). In certain embodiments, the infiltrant material 50 may be a different material than that used as a catalyst during the formation of a PCD that is subsequently leached to form the TSP body. This enables easy detection of the catalyst separated from the binder. However, in other embodiments, the infiltrant material and catalyst may be the same.

In certain embodiments, the infiltrant material 50 may be an alloy, such as a nickel (Ni) alloy or other metal alloy, such as a Group VIII metal alloy. Advantages at the melting temperature can make alloys suitable as infiltration materials, even when these alloys are not suitable as catalyst materials in PCD formation.

After formation of the super abrasive member 60, the infiltrant material 50 can be found in the base 70, where it can function as a binder. The infiltrant material 50 may also be found in the pores filled in the TSP body 30 near the contact surface 100. In some embodiments, the infiltrant material 50 can be substantially defined by the contact surface 100, and pores opening to such surface. However, in other embodiments, the infiltrant material 50 may also enter pores near the contact surface 100. The portion of the TSP body 30 containing the infiltrant material 50 may form the infiltrant material-containing region 80 and the remaining portion of the TSP body 30 substantially lacking the binder may form the infiltrant material- (90) can be formed. The depth D at which the infiltrant material 50 penetrates the TSP body 30 from the contact surface 100 is, on average, the ability to bond the TSP body 30 to the base 70, Lt; / RTI > In certain embodiments, this may be less than or equal to 100 microns. In other particular embodiments, it may be a grain size of 4 or less, a grain size of 2 or less, a grain size of 1 or less, a grain size of 0.5 or less, or a grain size of 1/4 or less, 100 < / RTI > or near diamond grains. In another embodiment, the infiltrant material 50 may only penetrate the exposed pore space on the contact surface 100.

The infiltrant material 50 may impart properties on the TSP body 30 similar to properties imparted on the PCD by the catalyst. In particular, the infiltrant material 50 can reduce wear and thermal stability of the region of the TSP body that is found. In an exemplary embodiment, the depth D of the infiltrating material-containing region 80 can be adjusted to the TSP body 30 in the base 70 to minimize the negative effects of the infiltrating material 50 on abrasion resistance and thermal stability. It may be advantageous to reduce or minimize it to an amount sufficient to bind it.

The manner in which the infiltrant material 50 couples the TSP body 30 to the base 70 is not limited to the bonding mechanism of the TSP body 30 and the base 70 Lt; RTI ID = 0.0 > of a < / RTI > infiltration material.

The matrix powder 40 or 40a may be formed in the base 70 using any suitable forming process. In certain embodiments, the forming process may provide one-step base formation and attachment, instead of requiring separate formation and attachment steps as desired, similar to some conventional processes.

In one embodiment, the forming process may be a one-step infiltration process. Generally, in this process (and in any hot press process following infiltration of the TSP body 30 by the infiltrating material 50 to adhere to the base 70), an optional on the contact surface 100 other than diamond The material may not impede wetting and attachment by the infiltrant material 50 so that prior to introduction into the assembly 10 the contact surface 100 of the TSP body 30, in certain embodiments, . The assembly 10 can be assembled as described above and then placed in the furnace and infiltrated with the infiltrating material 50 and the matrix powder 40 and the TSP body 30 and the matrix powder 40 Lt; RTI ID = 0.0 > and / or < / RTI > In particular, the furnace may be heated to a temperature at or above the infiltration temperature of the infiltrant material (50). The minimum temperature at which infiltration of infiltrant material 50 is possible may be referred to as infiltration temperature. The time spent at or above the infiltration temperature is the minimum number of days required to enable the infiltration of the matrix powder 40 to form the base 70 and the attachment of the base 70 to the TSP body 30. [ have. In certain embodiments, the time spent at or above the infiltration temperature may be 60 seconds or less. This process occurs under vacuum or in the presence of an oxygen-free atmosphere, such as a reducing or inert atmosphere, to prevent oxidation reaction or contamination of the infiltrant material 50 or the matrix powder 40 during the forming process.

According to certain embodiments, the infiltrant material 50 may move through the matrix powder 40 due to attraction, e.g., capillary action. Upon reaching the contact surface 100 of the TSP body 30, the infiltrant material 50 can wet and bond the surface. In certain embodiments, the infiltrant material 50 enters the open pores and fills them to form filled pores. Infiltration material 50 may enter pores through attraction, e. G. Capillary action. This is especially true where the infiltrant material 50 is selected to have an affinity for diamond.

After heating, the assembly 10 may be removed from the furnace and cooled to a temperature below the infiltration temperature. Cooling can be carefully adjusted to reduce or minimize any weakening of adhesion between the base 70 and the TSP body 30, in certain embodiments. For example, it can be managed to reduce or minimize any residual stress. Finally, the super abrasive member 60 can be removed from the mold 20.

According to another embodiment, the assembly 10a can be used to form the super abrasive member 60 through a one-step hot press method. As noted above, in some embodiments, the force generated by the hot pressing methods is sufficient for the TSP body 30 relative to the base 70 where attachment through the infiltration material is not required or has minimal effect Mechanical attachment can be provided. In this embodiment, the TSP body 30 may be shaped to facilitate such mechanical attachment. For example, it may have the shape shown in Figures 4 and 5. In other embodiments, attachment of the TSP body 30 to the base 70 may be partially or substantially dependent on the infiltration of the TSP body 30 into the infiltrant material 50, even when a hot pressing method is used . In this embodiment, any material on the contact surface 100 other than diamond can be immersed in the infiltrant material 50 so that the contact surface 100 of the TSP body 300 can be cleaned prior to introduction into the assembly 10a. Lt; RTI ID = 0.0 > and / or < / RTI >

After cleaning, the TSP body 30 can be packed into the matrix powder 40a after being loaded into the hot press mold 20a, which powder contains both the matrix material and the infiltrant material or binder . The mold may then be closed, treated with hot pressing at a temperature and pressure sufficient to melt the infiltrant or binder and form the substrate 70 therein. In embodiments in which the infiltrating material infiltrates the TSP body 30, temperature and pressure may also be sufficient to allow such infiltration to occur. In certain embodiments, the hot pressing may comprise a cycle of varying temperature and pressure over time.

According to a particular embodiment, the hot pressing may be performed under an inert or reducing atmosphere to prevent or reduce damage to the TSP body 30. Alternatively, the temperature can be carefully adjusted to prevent oxidation of the TSP body 30.

The hot pressing may be used to form a single super abrasive member 60, or multiple assemblies 10a may be processed simultaneously to form multiple super abrasive members 60 at the same time. In each case, each super abrasive member can be removed from the mold 20a after completion of the hot pressing.

In each infiltration process, the temperatures and pressures used may deviate from conventional diamond-stable areas. The temperature and pressure at which PCD decomposes into graphite are known in the art and are described in the literature. For example, a diamond-stable region is described by Bundy et al., Diamond-Graphite Equilibrium Line from Growth and Graphitization of Diamond, J. of Chemical Physics, 35 (2): 383-391 (1961), Kennedy and Kennedy, "The Equilibrium Boundary Between Graphite and Diamond," J. of Geophysical Res., 81 (14): 2467-2470 (1976), and Bundy, et al., "The Pressure-Temperature Phase and Transformation Diagram for Carbon; Updated through 1994, "Carbon 34 (2): 141-153 (1996)], each of which is incorporated herein by reference. The highly stable TSP characteristics can withstand temperatures and pressures out of the diamond-stable region for the time required to form the super abrasive member 60. For example, at pressures used in infiltration processes, the temperature can reach as high as 1100 ° C or as high as 1200 ° C.

In general, when the pressure is carefully controlled, infiltrating agents with higher melting temperatures can be used, reducing the likelihood of infiltrant melting during downhole or other harsh conditions.

While temperatures and pressures outside of the diamond stability range are possible, in various embodiments such as some hot press methods, the temperature and pressure may be within a diamond stable zone. For example, some hot press techniques can use temperatures from 850 캜 to 900 캜, particularly 870 캜.

In addition to reducing the corrosion resistance as noted above, the presence of additional infiltrant material 50 in base 70 as compared to a similar amount of catalyst or binder in conventional PCD member substrates may result in a reduction in substrate 70 compared to conventional substrates, Less stiff. This can cause increased bending stress on the TSP body 30 when the super abrasive member 60 is used. In order to increase the rigidity of the base 70, a carbide insert 140 as shown in FIG. 6 may be included in the base 70. The carbide insert 140 may be formed of a binderless or nearly free-bonding carbide and may be resistant to penetration by the infiltrant material 50. The carbide insert 140 may be disposed within the matrix powder 40 in the assembly 10. After formation of the super abrasive member 60, the carbide insert 140 may be present in the base 70 in essentially the same configuration as that disposed in the matrix powder 40. In addition to increasing the rigidity of the base 70, the carbide insert 140 may be exposed on the non-TSP body end of the super abrasive member 60 after grinding, As a guide for rotation or disposition. In alternative embodiments, the inserts may be formed for other suitable materials other than carbide, such as ceramics.

The super abrasive member of the present invention may be in any member form beneficial from the TSP surface. In certain embodiments, these may be cutters of drill bits, or parts of an industrial tool. Embodiments of the present invention also include a tool containing the super abrasive member of the present invention. Particular embodiments include industrial tools and excavating drill bits, such as stationary cutter drill bits. Other specific embodiments include nozzles for wear members, bearings, or high pressure fluid.

Because the ability to leach TSP body 30 more than the PCD layer can typically be leached when bonded to the substrate, the super abrasive members of the present invention can be used in conditions that are not more members with conventional leached PCD layers It can be possible. For example, super abrasive members can be used at higher temperatures compared to members similar to conventional leached PCD layers.

When the super abrasive members of the present invention are used as cutters on drilling bits, they can be used instead of any conventional leached PCD cutter. In various embodiments, these may be attached to the bit through the base 70. For example, the base 70 may be attached to the cavity in the bit via brazing.

When used in cutting portions of the bits, the work surface of the cutter will wear faster than other portions of the TSP body 30. [ When an annular cutter, such as that shown in FIG. 2, is used, the cutter can be rotated to move the worn TSP away from the work surface and move the unused TSP to the work surface. The annular cutter according to the present invention can be rotated at least twice and often three times in this manner before these are too worn for further use. Attachment and rotation methods may be any of the traditional leached PCD cutters or any other method used in other methods. Similarly, non-annular cutters can be indexable, replacing worn work surfaces without replacing their movement with the entire cutter.

In embodiments using inserts having the shapes shown in Figure 6 or other suitable shapes, the inserts may be used as guides for the alignment of the work surfaces, such that the work surfaces receive additional supports from the inserts during use of the super abrasive members have. For example, when using an insert of the shape shown in FIG. 6, the member may be aligned such that its working surface is substantially along one of the insert arms, rather than between the arms .

In addition to being rotatable, a conventional PCD cutter can also be removed from the beat. This makes it possible to replace worn or broken cutters or replace them with different cutters that are more optimal for forming rocks to be drilled. This ability to replace the cutter greatly extends the usable life of the entire drill bit and can be adapted for use in different rock formations. Cutters formed using the super abrasive members according to the present invention may also be removed and replaced using any of the methods used with conventional leaved PCD cutters.

In certain other embodiments, the super abrasive members of the present invention can be used for inducing fluid flow or for corrosion inhibition in drilling drill bits. For example, these are described in U.S. Patent Nos. 7,730,976; U.S. Patent 6,510,906; Or in place of the abrasive structure described in U.S. Patent No. 6,843,333, each of which is incorporated herein by reference in its material portion.

Although only exemplary embodiments of the invention have been described in detail, it will be appreciated that modifications and variations of such examples are possible without departing from the spirit and intended scope of the invention. For example, although super abrasive members have been discussed in detail, other members containing similar components, such as leached boron nitride nitrides, and similar methods of forming such members, are also possible.

Claims

A polycrystalline diamond body comprising polycrystalline diamond (PCD) having at least 85% of the catalyst removed to form pores with pores and a contact surface;
A base adjacent the contact surface of the polycrystalline diamond body; And
A super abrasive element, dispersed in a base as a binder for the matrix powder to form a base, and infiltrated into the pores of the polycrystalline diamond body at a contact surface.

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The super abrasive member of claim 1, wherein the polycrystalline diamond body comprises an acid-leached polycrystalline diamond body.

The method of claim 3 wherein the acid-leaching of the polycrystalline diamond body is FeCl _{3-acid-leaching} of the super abrasive member, comprising a polycrystalline diamond body.

2. The method of claim 1, wherein the polycrystalline diamond body contains diamond grains having an average grain size and wherein the infiltration material is infiltrated into the pores of the polycrystalline diamond body from the contact surface to a depth of twice or less the average grain size , Super abrasive member.

The super abrasive member of claim 1, wherein the contact surface is a non-planar surface.

The method of claim 1, wherein the base is selected from the group consisting of carbide, tungsten, tungsten carbide, synthetic diamond, natural diamond or a metal selected from the group consisting of nickel, chromium, iron, copper, manganese, phosphorus, oxygen, zinc, tin, cadmium, lead, And combinations thereof. &Lt; RTI ID = 0.0 > 11. < / RTI >

The super abrasive member of claim 1, wherein the super abrasive member further comprises a carbide insert disposed in the base.

The super abrasive article of claim 1, wherein the infiltrant material comprises a Group VIII metal alloy.

The super abrasive member according to claim 1, wherein the super abrasive member is in the form of a cutter for an earth-boring drill bit.

A polycrystalline diamond body (PCD) having pores, a contact surface, and diamond grains having an average grain size and wherein at least 85% of the catalyst is removed to form pores;
A base adjacent the contact surface of the polycrystalline diamond body; And
The infiltrating material being dispersed in the base as a binder for the matrix powder to form a base and infiltrating into the pores of the polycrystalline diamond body at the contact surface from the contact surface to a depth of twice or less than the average grain size. Super abrasive member.

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12. The super abrasive article of claim 11, wherein the polycrystalline diamond body comprises an acid-leached polycrystalline diamond body.

14. The method of claim 13 wherein the acid-leaching of the polycrystalline diamond body is FeCl _{3-acid-leaching} of the super abrasive member, comprising a polycrystalline diamond body.

12. The super abrasive article of claim 11, wherein the contact surface is a non-planar surface.

The method of claim 11, wherein the base is selected from the group consisting of carbide, tungsten, tungsten carbide, synthetic diamond, natural diamond or a metal selected from the group consisting of nickel, chromium, iron, copper, manganese, phosphorus, oxygen, zinc, tin, cadmium, lead, And combinations thereof. &Lt; RTI ID = 0.0 > 11. < / RTI >

The super abrasive member of claim 11, wherein the super abrasive member further comprises a carbide insert disposed in the base.

12. The super abrasive article of claim 11, wherein the infiltrant material comprises a Group VIII metal.

The super abrasive member according to claim 11, wherein the super abrasive member is in the form of a cutter for a drill bit.

An excavating drill bit comprising a cutter,
A polycrystalline diamond body comprising polycrystalline diamond (PCD) having at least 85% of the catalyst removed to form pores with pores and a contact surface;
A base adjacent the contact surface of the polycrystalline diamond body; And
A super abrasive member comprising a penetrating material dispersed in the base as a binder for the matrix powder to form a base and infiltrated into the pores of the polycrystalline diamond body at the contact surface.

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21. The drill bit of claim 20, wherein the polycrystalline diamond body comprises an acid-leached polycrystalline diamond body.

23. The method of claim 22 wherein the acid-leached polycrystalline diamond body is FeCl _{3-acid-leached} it comprises a polycrystalline diamond body, the excavation drill bit.

21. The method of claim 20, wherein the polycrystalline diamond body comprises diamond grains having an average grain size, wherein the infiltrant material is impregnated into the pores of the polycrystalline diamond body from the contact surface to a depth of twice or less than the average grain size , Drilling bits.

21. The drill bit of claim 20, wherein the contact surface is a non-planar surface.

21. The method of claim 20 wherein the base is selected from the group consisting of carbide, tungsten, tungsten carbide, synthetic diamond, natural diamond or a metal selected from the group consisting of nickel, chromium, iron, copper, manganese, phosphorus, oxygen, zinc, tin, cadmium, lead, &Lt; / RTI > and any combination thereof.

21. The drill bit of claim 20, wherein the super abrasive member further comprises a carbide insert disposed in the base.

21. The excavating drill bit of claim 20, wherein the infiltrant material comprises a Group VIII metal alloy.

21. The drill bit of claim 20, wherein the bit is a fixed-cutter drill bit.

21. The drill bit of claim 20, wherein the cutter includes a rotatable and interchangeable cutter.

An excavating drill bit comprising a cutter,
A polycrystalline diamond body (PCD) having pores, a contact surface, and diamond grains having an average grain size and wherein at least 85% of the catalyst is removed to form pores;
A base adjacent the contact surface of the polycrystalline diamond body; And
The infiltrating material being dispersed in the base as a binder for the matrix powder to form a base and infiltrating into the pores of the polycrystalline diamond body at the contact surface from the contact surface to a depth of twice or less than the average grain size. A drill bit comprising a super abrasive member.

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32. The drill bit of claim 31, wherein the polycrystalline diamond body comprises an acid-leached polycrystalline diamond body.

34. The method of claim 33 wherein the acid-leached polycrystalline diamond body is FeCl _{3-acid-leached} it comprises a polycrystalline diamond body, the excavation drill bit.

32. The drill bit of claim 31, wherein the contact surface is a non-planar surface.

31. The method of claim 31, wherein the base is selected from the group consisting of carbide, tungsten, tungsten carbide, synthetic diamond, natural diamond or a metal selected from the group consisting of nickel, chromium, iron, copper, manganese, phosphorus, oxygen, zinc, tin, cadmium, lead, &Lt; / RTI > and any combination thereof.

32. The drill bit of claim 31, wherein the super abrasive member further comprises a carbide insert disposed in the base.

32. The excavating drill bit of claim 31, wherein the impregnating material comprises a Group VIII metal.

32. The drill bit of claim 31, wherein the bit is a fixed-cutter drill bit.

32. The drill bit of claim 31, wherein the cutter includes a rotatable and interchangeable cutter.

A mold having a bottom;
A polycrystalline diamond body positioned at the bottom of the mold with pores and a contact surface;
A matrix powder disposed on the polycrystalline diamond body adjacent to the contact surface and in the mold; And
Assembling an assembly comprising infiltration material disposed on the matrix powder in the mold;
Heating the assembly to cause the infiltrant material to infiltrate into the pores of the polycrystalline diamond body at the matrix powder and the contact surface to form the infiltrant material-containing region and the infiltrant material-material region in the polycrystalline diamond body;
And cooling the assembly to form a super abrasive member.

42. The method of claim 41, further comprising forming a polycrystalline diamond body prior to assembling the assembly.

42. The method of claim 41, wherein forming the polycrystalline diamond body comprises leaching a polycrystalline diamond compact (PCD) having an interstitial matrix containing a diamond matrix and a catalyst to remove the catalyst from the interstitial matrix and form pores How to.

Method which comprises based leaching agent leaching according to claim 43 wherein the acid leach containing FeCl _3.

44. The method of claim 43, further comprising removing at least 85% of the catalyst from the PCD.

42. The method of claim 41, further comprising infiltrating infiltration material into at least the pores exposed on the contact surface.

42. The method of claim 41, wherein the assembling further comprises placing a carbide insert in the matrix powder.

42. The method of claim 41, further comprising cleaning the contact surface of the polycrystalline diamond body prior to assembling the assembly.

42. The method of claim 41, further comprising cooling the assembly from the bottom.

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