KR101953784B1 - Structure for preventing counterfet, falsification or resue, and method for discriminating counterfet, falsification or resue using the same - Google Patents

Abstract

The present invention relates to a metal layer; A photo-conversion pattern layer comprising a plurality of up-converting nanoparticles formed on a metal layer; A metal pattern layer disposed on the metal layer and the photo-conversion pattern layer; And a tacky film disposed on the metal pattern layer. [0002] The present invention relates to a structure for preventing falsification, modulation, or reuse. Accordingly, the structure for preventing falsification, modulation, or re-use of the present invention can easily confirm a pattern for displaying an authentic product with the naked eye through infrared irradiation, and can not be reassembled after the structure is deformed due to disassembly of the packaging container Falsification, modulation, or reuse.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a structure for preventing falsification, modulation, or reuse, and a falsification, modulation, or reuse authenticity determination method using the same,

The present invention relates to a structure for preventing forgery, modulation, or re-use, a method for manufacturing the same, and a falsification, modulation, or reuse authenticity determination method using the same, and more particularly, The present invention relates to a structure for preventing falsification, modulation, or reuse, a method of manufacturing the same, and a method for identifying falsification, modulation, or reuse using the apparatus.

Currently, sales of counterfeits are increasing day by day throughout the business. Various anti-counterfeiting and anti-tamper technologies have been developed that use a dot, hologram, or special ink to prevent and prevent reuse.

However, these technologies are still being falsified or tampered with by counterfeit professionals and it is difficult to eradicate them because it is difficult for the user to distinguish between falsification or alteration. In addition, the problem of reusing products such as these points, holograms or packaging boxes and containers with the holograms and reusing them has also become a problem, making it more difficult to eradicate counterfeits.

Accordingly, anti-falsification structures using plasmonic amplification phenomenon by locating an up-conversion (UC) material absorbing infrared rays and emitting visible light between metal nanowires and metal films have been proactively announced (Adv. Funct Meter, 2016, 26, 7836). However, there is a structural method for preventing reuse of such a structure, but there is a problem in that it requires the use of a separate pollutant and there is a problem that reproducible attempts can be made because there is no separate encryption.

Therefore, in consideration of the above-mentioned problems, it is possible to prevent the reuse and prevent the reuse by preventing the reuse attempt by encrypting the pattern while preventing the reuse, and it is possible to easily identify the reuse, Development is required.

Korean Patent Laid-Open No. 10-2012-0116635 Korean Patent Publication No. 10-2011-0045194

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a structure for preventing forgery, modulation, or reuse, which can easily confirm a pattern for displaying an authentic product with naked eyes through infrared irradiation.

Another object of the present invention is to provide a structure for preventing forgery, modulation, or reuse, which prevents forgery, alteration or reuse after the deformation of the structure can not be originally reassembled.

According to an aspect of the present invention,

A metal layer; A photo-conversion pattern layer comprising a plurality of up-converting nanoparticles formed on the metal layer; A metal pattern layer disposed on the metal layer and the photo-conversion pattern layer; And a tacky film disposed on the metal pattern layer. The structure for preventing falsification, modulation, or reuse is provided.

The metal pattern layer may be formed by islanded metal nanoparticles.

A gap plasmon polariton phenomenon may occur between the metal layer and the metal pattern layer.

Wherein the photo-conversion pattern layer forms a second encryption pattern, the metal pattern layer forms a first encryption pattern, and a photo-conversion amplification phenomenon caused by the application of infrared rays at the overlapping portion of the first encryption pattern and the second encryption pattern A visible visible pattern region can be formed.

The metal layer and the metal pattern layer may be formed of a metal such as gold, silver, copper, aluminum, titanium, chromium, indium tin oxide, -doped zinc oxide, and FTO (fluorine-doped tin oxide).

The average diameter of the up-converting nanoparticles may be between 5 and 100 nm.

Wherein the upconverting nanoparticles are selected from the group consisting of halides, chalcogenides and metal oxides doped with ytterbium (Yb), erbium (Er), thulium (Tm), yttrium (Y) It can be one.

The viscous film may be separated from the metal pattern layer by external force or heat.

The viscous film of step (b) may be an adhesive tape or a thermal release tape.

According to another aspect of the present invention,

(a) forming a metal pattern on a substrate; (b) transferring the metal pattern to a pressure-sensitive adhesive film to produce a pressure-sensitive adhesive film having a metal pattern layer; (c) preparing a metal substrate; (d) forming a photo-conversion pattern including up-converting nanoparticles on the metal substrate to produce a substrate having the photo-conversion pattern layer; And (e) forming a visible pattern region which is an overlapping portion of the photo-conversion pattern layer and the metal pattern layer by disposing an adhesive film having the metal pattern layer formed on the substrate on which the photo-conversion pattern layer is formed, , A method of manufacturing a structure for preventing modulation or reuse is provided.

A gap plasmon polariton phenomenon may occur between the metal substrate and the metal pattern.

The photo-conversion amplification phenomenon may occur due to the application of infrared rays in the visible pattern region of step (e).

The substrate of step (a) may be a substrate on which any one layer selected from graphene, transition metal dichalcogenide materials (TMDCs), graphite, SiC, SiNx, AlN and diamond is formed.

The metal pattern of step (a) may be formed according to any one of the methods selected from photolithography, electron beam lithography, x-ray lithography, ion beam lithography and soft lithography.

In step (a), the metal pattern may form an align key separately at a predetermined position, and a pattern corresponding to the alignment key may be transferred to the adhesive film in step (b).

The metal substrate of step (c) may be stamped corresponding to the alignment key formed on the adhesive film.

The light conversion pattern of step (d) may be formed by overlapping with the metal pattern by patterning according to the imprint corresponding to the alignment key.

The step of removing the pattern transferred portion corresponding to the alignment key of the adhesive film after the overlapping of the adhesive metal pattern and the metal pattern in accordance with the mark corresponding to the alignment key in the step (e) have.

The photoconversion pattern may be formed by any one of photolithography, electron beam lithography, x-ray lithography, ion beam lithography, and soft lithography.

The metal pattern of step (a) may be formed to a thickness of 2 to 15 nm.

After step (a), the metal pattern may be formed by islanded metal nanoparticles by performing a dewetting process of heating to 200 to 1000 ° C.

After step (b), the step of removing the graphene transferred to the adhesive film on which the metal pattern layer is formed may be further performed.

According to another aspect of the present invention,

There is provided a packaging box or container for preventing falsification, modulation, or reuse including the above structure.

The structure may be mounted on the surface of the packaging box or container or an opening / closing port.

According to another aspect of the present invention,

(1) applying infrared rays to the structure of any one of claims 1 to 8 in a state of blocking external light; And (2) confirming whether the structure is falsified, altered, or reused by confirming a light emission pattern appearing in the structure to which the infrared ray is applied, and then determining whether the structure is falsified, altered, or reused.

Step (2) can confirm the light emission pattern with the naked eye or the visible light detection device.

The structure for preventing falsification, modulation, or reuse of the present invention can easily identify a pattern for displaying an authentic product with naked eyes through infrared irradiation.

In addition, the structure for preventing forgery, modulation, or reuse of the present invention can not be reassembled after the structure is deformed due to disassembly of the packaging container, thereby preventing forgery, modulation, or reuse.

1 shows an example of an encryption pattern for applying the plasmonic film of the present invention to anti-counterfeiting.
2 is a process diagram showing a manufacturing method of a structure for preventing falsification, modulation, or reuse of the present invention.
Figure 3 shows that the structure can not be reused due to pattern mismatches upon reattachment after artificially separating the completed falsification, modulation or reuse prevention structure.
FIG. 4 shows a process of manufacturing a film having plasmonic characteristics and a process of applying the film to a device.
5 is an SEM image of the surface of the graphene substrate after transferring the Ag nanoparticles formed on the graphene substrate and the adhesive tape.
FIG. 6 shows a process for manufacturing a pressure-sensitive adhesive film having a metal pattern layer made of metal nanoparticles and a method for applying the pressure-sensitive adhesive film to a device.
7 schematically shows a metal pattern, a light conversion pattern, and a visible pattern according to Example 1 of the present invention.
8 is a photograph of the structure for preventing forgery-inhibition produced according to Example 1 before and after irradiation with infrared rays.
FIG. 9 is a graph showing a result of measurement of luminescence intensity when infrared rays are applied to each of the structures manufactured according to Example 1 and Comparative Examples 1 to 3. FIG.

In the following, various aspects and various embodiments of the present invention will be described in more detail.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention.

However, the following description does not limit the present invention to specific embodiments. In the following description of the present invention, detailed description of related arts will be omitted if it is determined that the gist of the present invention may be blurred .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises ",or" having ", and the like, specify that the presence of stated features, integers, steps, operations, elements, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, or combinations thereof.

Fig. 1 shows an example of an encryption pattern for applying the plasmonic film of the present invention to anti-counterfeiting. Hereinafter, a structure for preventing falsification, modulation, or reuse of the present invention will be described with reference to FIG. The structure of the present invention includes a metal layer; A light conversion pattern layer; A metal pattern layer; And an adhesive film.

The metal layer may be in the form of a two-dimensional metal thin film, and may include at least one metal selected from gold (Au), silver (Ag), and copper (Cu) (Al), titanium (Ti), chromium (Cr), indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), FTO Fluorine-doped tin oxide) can be applied.

The thickness of the metal layer is preferably 50 nm or more, more preferably 100 nm or more, which can prevent transmission of visible light while obtaining a sufficient gap-plasmon polariton effect.

The photo-conversion pattern layer may be formed of a plurality of up-converting nanoparticles formed on the metal layer.

Wherein the upconverting nanoparticles are selected from the group consisting of halides, chalcogenides and metal oxides doped with ytterbium (Yb), erbium (Er), thulium (Tm), yttrium (Y) But the scope of the present invention is not limited thereto, and all the nanoparticles capable of causing up-conversion can be applied.

The average diameter of the up-converting nanoparticles is closely related to the spacing distance between the metal layer and the metal pattern layer, and the spacing distance required for the gap plasmon polariton effect depends on the metal type of the metal layer and the metal pattern layer May be appropriately selected, preferably from 5 to 100 nm, and when the lower limit and the upper limit are exceeded, the gap plasmon polariton effect may not be exhibited. Thus, the average diameter of the up-converting nanoparticles is preferably 5 to 100 nm.

For example, when the material of the metal layer and the metal pattern layer is silver (Ag), the average diameter of the up-converting nanoparticles is preferably 5 to 100 nm. When the average diameter of the up-converting nanoparticles is less than 5 nm, the gap plasmon polariton effect does not appear. When the average diameter of the up-converting nanoparticles exceeds 100 nm, the gap distance between the metal layer and the metal pattern layer increases, Visible light may not be generated even when infrared rays are irradiated. In other words, when the average diameter of the up-converting nanoparticles is less than 5 nm or exceeds 100 nm, the distance away from the effective distance for generating a gap plasmon polariton effect for infrared rays of 780-2000 nm wavelength is deviated.

Thus, the thickness of the photo-conversion pattern layer can be controlled according to the average diameter of the coated up-converting nanoparticles.

The metal pattern layer is disposed on the metal layer and the photoconversion pattern layer. Accordingly, a superimposed portion overlapping the photo-conversion pattern layer and the metal pattern layer is formed, and this portion can form a visible pattern region in accordance with the gap plasmon polariton effect.

The metal pattern layer may be formed by isolated metal nanoparticles according to a dewetting process.

The adhesive film may be disposed on the metal pattern layer.

The tacky film may be easily separated from the metal pattern layer by external force or heat, and may be an adhesive tape or a thermal release tape. The adhesive film may itself cap the structure and may be detached to form a separate capping structure.

The metal pattern layer is preferably an alloy containing at least one metal selected from the group consisting of gold (Au), silver (Ag), and copper (Cu) The scope of the present invention is not limited thereto and aluminum, aluminum, titanium, chromium, indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), fluorine-doped tin oxide Any material capable of exciting plasmons can be applied.

Thus, in the structure for preventing forgery, modulation, or reuse of the present invention, the metal pattern layer forms a first encryption pattern (corresponding to the pattern A), and the light conversion pattern layer forms a second encryption pattern (corresponding to the pattern B) And a visible pattern region in which a photo-conversion amplification phenomenon occurs when an infrared ray is applied in an overlapped portion in which the first encryption pattern and the second encryption pattern are aligned in a micro or nano level region may be formed.

2 is a process diagram showing a manufacturing method of a structure for preventing falsification, modulation, or reuse of the present invention. Hereinafter, a method of manufacturing a structure for preventing falsification, modulation, or reuse of the present invention will be described with reference to FIG.

first, On the substrate  To form a metal pattern (step a).

The substrate is preferably a substrate having a graphene layer formed thereon, and the metal pattern (corresponding to the pattern A) is preferably formed on the graphene layer. However, the scope of the present invention is not limited to the graphene layer. It is also possible to use a two-dimensional material such as transition metal dichalcogenide materials (TMDCs) capable of forming a layer with a thickness of 100 nm or less on the substrate, SiC, SiNx, AlN, diamond, or the like is formed on the substrate.

The metal pattern may be formed by a method such as photolithography, electron beam lithography, x-ray lithography, ion beam lithography, or soft lithography, but the scope of the present invention is not limited thereto.

The metal pattern may be formed by islanded metal nanoparticles by performing a dewetting process in which a metal thin film is deposited to a thickness of 2 to 15 nm and then heated to 200 to 1000 ° C. have.

The deposition may be performed by a method such as spin coating, spray coating, dipping coating, or drop coating.

The metal pattern may have an align key separately formed at a predetermined position in addition to the encryption pattern so as to facilitate alignment with the light conversion pattern to be formed thereafter.

Next, the metal pattern is transferred to a pressure-sensitive adhesive film, The pattern layer  To form a formed tacky film (step b).

The tacky film may be easily separated from the metal pattern layer by external force or heat, and may be an adhesive tape or a thermal release tape. The adhesive film may itself cap the structure and may be detached to form a separate capping structure.

A pattern corresponding to the align key formed in step (a) may be transferred to the adhesive film so that alignment with the light conversion pattern to be formed thereafter can be facilitated.

The step of removing the graphene transferred to the adhesive film on which the metal pattern layer is formed may be further performed.

The adhesive film on which the metal pattern layer is formed can be used as an adhesive film having a plasmonic effect as such. Therefore, it is also possible to transfer the metal pattern layer to a device which needs to be applied, and to peel off only the adhesive film as necessary.

Thereafter, a metal substrate is prepared (step c).

The metal substrate may have a stamp corresponding to an alignment key formed on the adhesive film.

The metal substrate may be in the form of a two-dimensional metal thin film, and may be formed of at least one metal selected from gold (Au), silver (Ag) and copper (Cu) Containing alloy.

It is preferable that the thickness of the metal substrate is 100 nm or more, which can prevent transmission of visible light while obtaining a sufficient gap-plasmon polariton effect.

Next, on the metal substrate, Converting  Containing nanoparticles Photoconversion  By forming a pattern Photoconversion The pattern layer  To form a formed substrate (step d).

The light conversion pattern (corresponding to the pattern B) may be patterned according to an imprint corresponding to the alignment key on the metal substrate, thereby forming an overlapped portion with the metal pattern.

The light conversion pattern may be formed by photolithography, electron beam lithography, x-ray lithography, ion beam lithography, soft lithography, etc., but the scope of the present invention is not limited thereto.

A gap plasmon polariton phenomenon may occur between the metal substrate and the metal pattern.

Finally, Photoconversion The pattern layer  Formed On the substrate  The metal The pattern layer  By disposing the formed pressure sensitive adhesive film, Photoconversion Pattern layer  metal Pattern layer  (Corresponding to the pattern C) (step e).

A photoconversion amplification phenomenon may occur due to the application of infrared rays in the visible pattern region.

Thereafter, it is preferable to further perform a step of removing the transferred portion corresponding to the alignment key of the adhesive film. If the alignment key is removed, reformation of the structure can be practically impossible and reuse of the structure can be prevented.

Figure 3 shows that the structure can not be reused due to pattern mismatches upon reattachment after artificially separating the completed falsification, modulation or reuse prevention structure.

The present invention provides a packaging box or container for preventing forgery, modulation, or reuse comprising the structure.

The structure may be mounted on the surface of the packaging box or container or an opening / closing port.

The present invention provides a method for determining whether or not a counterfeit, modulated, or reused authenticity is true.

Specifically, first, infrared rays are applied to the structure for preventing falsification, modulation, or reuse of the present invention in a state where external light is blocked (step 1).

Next, a light emission pattern appearing in the structure to which the infrared ray is applied is checked to confirm whether the structure is forged, modulated or reused (Step 2).

The confirmation of the authenticity may be made by confirming a light emission pattern (corresponding to the pattern C in Fig. 1) with a naked eye or a visible light detection device.

The method for discriminating the authenticity of forgery, modulation or reuse according to the present invention should be selectively used depending on the use. That is, in order to more precisely discriminate whether or not the authenticity of the forgery modulation and the reuse is true, a method of analyzing the visible light emission intensity and the appearance of the spectrum by using the visible light detection apparatus can be used.

Hereinafter, the present invention will be described in more detail with reference to Examples and the like, but the scope and content of the present invention can not be construed to be limited or limited by the following Examples. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the present invention as set forth in the following claims. It is natural that it belongs to the claims.

In addition, the experimental results presented below only show representative experimental results of the embodiments and the comparative examples, and the respective effects of various embodiments of the present invention which are not explicitly described below will be specifically described in the corresponding part.

[Example]

Manufacturing example  One: Plasmonics  Production of film

FIG. 4 shows a process of manufacturing a film having plasmonic characteristics and a process of applying the film to a device. According to this, an SiO ₂ substrate on which graphene was transferred was first prepared, and then an (Ag) thin film was deposited to a thickness of about 10 nm. The deposited Ag thin films were annealed at 450 ° C in furnace equipment to allow the formation of dewetted Aged islanded nanoparticles on the graphene layer. The Ag nanoparticles thus formed were adhered with an adhesive tape. The adhesive tape thus adhered was pressed so as not to bubble. Then, the tape is peeled off from the substrate without any chemical treatment, and the Ag nanoparticles are adhered to the tape adhering surface together with the graphene. By itself, the tape can act as an adhesive film having a high haze and plasmonic effect. An SEM image of the surface of the graphene substrate after transferring the Ag nanoparticles formed on the graphene substrate and the adhesive tape is shown in Fig.

At this time, in order to prevent the adverse effect of the device by graphene, graphene can be removed by performing O ₂ plasma surface treatment on graphene in a few seconds. In addition, when a thermal release tape is used in place of the adhesive tape, only the Ag nanoparticles can be transferred to the device to be applied. The normal application temperature of the heat separation tape is about 100 占 폚. If this transfer method is used, it is advantageous to apply it to a polymer device which must avoid chemical treatment or is difficult to treat at high temperature.

Manufacturing example  2: Metal The pattern layer  Preparation of formed adhesive film

FIG. 6 shows a process for manufacturing a pressure-sensitive adhesive film having a metal pattern layer made of metal nanoparticles and a method for applying the pressure-sensitive adhesive film to a device. According to this, in the polymer nano patterning method, an array like the imprinting technique has been actively researched, and many successful cases have been made. In order to form the device electrode, patterning of the lower electrode is performed to avoid contact with chemical and oxygen There are limited factors to choose from. However, when the device is formed through the patterning transfer method, such a limiting factor can be solved.

First, a graft-transferred SiO ₂ substrate was prepared, and then a metal electrode pattern was formed on the graphene through an e-beam lithography method. A thermal release tape was attached to the formed metal pattern, and then the metal pattern was transferred to the tape surface. At this time, unnecessary graphene portions were removed by performing O ₂ plasma surface treatment for several seconds. Thereafter, alignment was performed on the polymer array to be applied, and then attached to the desired position. In this case, capping can be performed with a thermal release tape. In this case, a separate sealing process can be omitted. Or if necessary, weak heat may be applied to separate the heat separation tape and perform a separate sealing process.

Example  1: Fabrication of structures for preventing forgery, modulation or reuse

Fig. 7 is a schematic view showing a metal pattern, a light conversion pattern and a visible pattern of Example 1 of the present invention, and Fig. 8 is a photograph of a structure for preventing forgery-inhibition produced according to Example 1 before and after irradiation with infrared rays. Hereinafter, the first embodiment will be described with reference to FIG. 7 and FIG.

Pattern A was formed by patterning graphene / SiO _{2 on a} graphene / SiO ₂ film to form a 10-nm-thick silver (Ag) pattern film, followed by dewetting as in Production Example 1, The finished silver (Ag) nanoparticle pattern was transferred with an adhesive tape to produce an adhesive film having a silver pattern formed thereon.

Pattern B was prepared with an Ag thin film substrate having an engraved shape with an align key (not shown). The Ag thin film was formed on the silicon substrate to a Ti thickness of 20 nm as an adhesive layer, and then Ag was deposited to prevent the Ag thin film from being separated from the substrate. Converting nanoparticles (β-NaYF ₄ : Yb ^{3 +} / Er ^{3 +)} having an average diameter of 20 nm were patterned by patterning an intaglio photoresist (PR (SU-8) ), And spin-coated at 3000 rpm for 30 seconds to prepare a pattern layer composed of a single layer of an up-converted nano-particle having a constant thickness. At this time, chloroform, which is a solvent used in the process of applying the upconversion nanoparticles, was not volatilized during the spin coating process, so that no drying process was performed.

Once the lift-off process is complete, the pattern B of the upconverting material of about 20 nm in size can not be visually identified, and it is very difficult to identify the pattern even microscopically.

When the alignment mark is aligned with the transfer tape on which the pattern A having the prepared pattern A is formed and the silver substrate on which the up-converting pattern formed with the pattern B is formed, only the metal particle-up conversion The up-converting light emission is amplified due to the plasmonic structure of the material-metal film. Otherwise, the up-converting-metal film structure is deteriorated in luminescence or the metal particle-metal film structure is formed, .

At this time, if the alignment key on the tape is removed, the alignment becomes difficult even after the structure is broken and reattached. Also, if detachment is repeatedly performed in the process of attempting reattachment, the upconverting material may be secondarily damaged by the adhesive of the tape, thereby making recovery more difficult.

Comparative Example  One: AgNP / UC / glass

A structure was prepared in the same manner as in Example 1 except that a glass substrate was used instead of the silver (Ag) thin film as the metal substrate.

Comparative Example  2: UC / glass

A metal substrate was formed in the same manner as in Example 1, except that an up-converting pattern was formed using a glass substrate instead of a silver (Ag) thin film, and the process of adhering the silver nano patterned adhesive tape was omitted, .

Comparative Example  3: UC / Ag film

A structure was prepared in the same manner as in Example 1, except that the process of adhering the adhesive tape on which the nanopattern was formed was omitted.

 [Test Example]

Near infrared (980 nm ) Up- Converting ( Photoconversion ) Emission spectrum ( PL spectra ) analysis

FIG. 9 is a graph showing a result of measurement of luminescence intensity when infrared rays are applied to each of the structures manufactured according to Example 1 and Comparative Examples 1 to 3. FIG.

9, it was confirmed that the structure prepared according to Example 1 exhibited a luminescence intensity 30 to 40 times higher than that of the structure of Comparative Example 1 in the 520-560 nm and 640-680 nm wavelength regions.

In addition, it can be confirmed that the light emitting intensity of the structure of Comparative Example 3 is reduced by the quenching effect.

In addition, although the structure of Comparative Example 2 has a surface plasmon effect due to the presence of the metal pattern layer, the metal substrate is omitted, so that the luminescence intensity is similar to that of the structure of Comparative Example 3.

That is, when the infrared ray is applied to the structure according to the present invention, visible light is visible to the naked eye because of the gap plasmon polariton effect caused by the interval between the metal pattern layer and the metal substrate.

As a result, the structure according to the present invention shows that when the two encrypted patterns are separated, the intensity of the visible light emitted is remarkably low, so that the visible pattern of the structure is not visually recognized, And whether it has been reused.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, many modifications and changes may be made by those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims. The present invention can be variously modified and changed by those skilled in the art, and it is also within the scope of the present invention.

Claims (19)

A metal layer;
A photo-conversion pattern layer comprising a plurality of up-converting nanoparticles formed on the metal layer;
A metal pattern layer disposed on the metal layer and the photo-conversion pattern layer; And
And a pressure-sensitive adhesive film disposed on the metal pattern layer,
Wherein the photo-conversion pattern layer forms a second encryption pattern,
Wherein the metal pattern layer forms a first encryption pattern,
Wherein a visible pattern region is formed in the overlapping portion of the first encryption pattern and the second encryption pattern in which a photo-conversion amplification phenomenon occurs due to the application of infrared rays. The method according to claim 1,
Wherein the metal pattern layer is formed by isolated metal nanoparticles. ≪ RTI ID = 0.0 > 11. < / RTI > The method according to claim 1,
Wherein a gap plasmon polariton phenomenon occurs between the metal layer and the metal pattern layer. delete The method according to claim 1,
The metal layer and the metal pattern layer may be formed of a metal such as gold, silver, copper, aluminum, titanium, chromium, indium tin oxide, -doped zinc oxide, and FTO (fluorine-doped tin oxide). The method according to claim 1,
Wherein the average diameter of the up-converting nanoparticles is 5 to 100 nm. The method according to claim 1,
Wherein the upconverting nanoparticles are selected from the group consisting of halides, chalcogenides and metal oxides doped with ytterbium (Yb), erbium (Er), thulium (Tm), yttrium (Y) Wherein the structure for preventing forgery, modulation, or reuse is one. (a) forming a metal pattern on a substrate;
(b) transferring the metal pattern to a pressure-sensitive adhesive film to produce a pressure-sensitive adhesive film having a metal pattern layer;
(c) preparing a metal substrate;
(d) forming a photo-conversion pattern including up-converting nanoparticles on the metal substrate to produce a substrate having the photo-conversion pattern layer; And
(e) forming a visible pattern region, which is an overlapping portion of the photo-conversion pattern layer and the metal pattern layer, by disposing an adhesive film on which the metal pattern layer is formed on the substrate on which the photo-conversion pattern layer is formed,
Wherein the photo-conversion pattern layer forms a second encryption pattern,
Wherein the metal pattern layer forms a first encryption pattern,
The method of claim 1, wherein the visible pattern region has a photo-conversion amplification phenomenon caused by application of infrared rays at an overlapping portion of the first encryption pattern and the second encryption pattern. 9. The method of claim 8,
Wherein the substrate of step (a) is a substrate on which any one layer selected from graphene, transition metal dichalcogenide materials (TMDCs), graphite, SiC, SiNx, AlN and diamond is formed. A method for manufacturing a structure for preventing modulation or reuse. 9. The method of claim 8,
Wherein the metal pattern is separately formed in a predetermined position in step (a), and a pattern corresponding to the alignment key is transferred to the adhesive film in step (b) A method for manufacturing a structure for preventing modulation or reuse. 11. The method of claim 10,
Wherein the metallic substrate of step (c) is formed with a stamp corresponding to an alignment key formed on the adhesive film. 12. The method of claim 11,
Further comprising the step of, after step (e), removing the transferred portion of the pattern corresponding to the alignment key of the adhesive film. 12. The method of claim 11,
Wherein the light conversion pattern of step (d) is patterned according to an imprint corresponding to the alignment key to form an overlapping part with the metal pattern. 9. The method of claim 8,
Wherein the metal pattern of step (a) is formed to a thickness of 2 to 15 nm. 9. The method of claim 8,
After step (a)
Wherein the metal pattern is formed by islanded metal nanoparticles by performing a dewetting process of heating the metal pattern to 200 to 1000 ° C. . 9. The method of claim 8,
Wherein the step (b) further comprises the step of removing the graphene transferred to the adhesive film on which the metal pattern layer is formed. A packaging box for preventing forgery, alteration or reuse, which comprises any one structure selected from the group consisting of the items 1 to 3, and 5 to 7. (1) applying infrared rays to the structure of any one of claims 1 to 3 and 5 to 7 while blocking external light; And
(2) confirming whether the structure is falsified, modulated or reused by confirming a light emission pattern appearing in the infrared ray applied structure, and determining whether the structure is falsified, modulated or reused. 19. The method of claim 18,
And the step (2) identifies the light emission pattern with a naked eye or a visible light detection device.

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