KR101946793B1 - Composite for shielding electromagnetic wave - Google Patents

Composite for shielding electromagnetic wave Download PDF

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KR101946793B1
KR101946793B1 KR1020170149770A KR20170149770A KR101946793B1 KR 101946793 B1 KR101946793 B1 KR 101946793B1 KR 1020170149770 A KR1020170149770 A KR 1020170149770A KR 20170149770 A KR20170149770 A KR 20170149770A KR 101946793 B1 KR101946793 B1 KR 101946793B1
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carbon
electromagnetic wave
carbon filler
thermoplastic polymer
wave shielding
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이희윤
박성호
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주식회사 서연이화
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    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
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    • C08L3/04Starch derivatives, e.g. crosslinked derivatives
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Abstract

The present invention relates to an electromagnetic wave shielding composite capable of effectively shielding electromagnetic waves, wherein the electromagnetic wave shielding composite comprises 50 to 95 wt% of a polyamide (PA-6) resin and 5 to 50 wt% of a carbon filler which is surface-treated by a functional group having affinity with the thermoplastic polymer resin. Therefore, it is possible to shield an electromagnetic wave while achieving lightweight by mixing the carbon filler having excellent conductivity with the thermoplastic polymer resin, and thus can obtain an effect of improving an electromagnetic wave shielding performance by surface-treating the carbon filler by the functional group having affinity with the thermoplastic polymer resin.

Description

전자파 차폐용 복합체{COMPOSITE FOR SHIELDING ELECTROMAGNETIC WAVE}TECHNICAL FIELD [0001] The present invention relates to a composite composition for shielding electromagnetic wave shielding,

본 발명은 전자파 차폐용 복합체에 관한 것으로서, 보다 상세하게는 전자파를 효과적으로 차폐할 수 있는 전자파 차폐용 복합체에 관한 것이다.TECHNICAL FIELD The present invention relates to an electromagnetic wave shielding composite, and more particularly, to a electromagnetic wave shielding composite capable of effectively shielding electromagnetic waves.

전자파의 유해성은 정보통신 기술의 발달 및 전자, 통신기기의 대량 보급과 더불어 날로 심각해지고 있다. 불필요한 전자파 발생에 따라 전파통신장치와 전자기기 간의 오작동이 발생하여 전자장치 자체의 안전과 사용자의 안전에 심각한 위험을 초래할 수 있다. The harmfulness of electromagnetic waves is getting worse with the development of information and communication technology and the mass spread of electronic and communication devices. A malfunction between the radio communication device and the electronic device occurs due to the generation of unnecessary electromagnetic waves, which may cause a serious risk to the safety of the electronic device itself and the safety of the user.

일반적으로 널리 사용되고 있는 전자장치의 하우징 소재는 대부분 금속으로 이루어져 있어 전자파 차폐 기능을 수행하고 있고, 또한 금속은 열전도도가 높아 사용하는 부품에서는 열전달에 의한 방열 문제를 해소할 수 있다.Generally, housing materials of widely used electronic devices are mostly made of metal, so that electromagnetic wave shielding function is performed. Also, since metals have high thermal conductivity, heat dissipation due to heat transfer can be solved in parts to be used.

하지만, 최근 자동차에 전자장치가 확대 설치되고 모바일 디스플레이가 급속히 보급됨에 따라 많은 전자부품들의 경량화 및 다양한 디자인에 대한 수요가 증가되고 있으며, 이에 부응하기 위해 금속 소재가 아닌 플라스틱 부품으로의 변화가 지속적으로 요구되고 있다.However, recently, as electronic devices are widely installed in automobiles and mobile displays are rapidly spreading, the demand for lightweight and various designs of many electronic parts is increasing, and in order to meet this demand, Is required.

플라스틱은 가볍고 다양한 형태로의 디자인이 용이한 이점을 가지고 있으나, 금속이 가진 전도성을 띄지 못하기 때문에 전자파 차폐를 위한 전자부품의 케이스 소재로 사용이 불가능하다.Although plastic has advantages of being light and easy to design in various forms, it can not be used as case material of electronic parts for shielding electromagnetic waves because the metal does not have conductivity.

또한, 대부분의 플라스틱은 본질적으로 전기 절연체이므로 전자파는 플라스틱에 어떠한 손실도 주지 않고 쉽게 통과하게 된다. 이를 해소하기 위하여, 종래에는 플라스틱 하우징의 표면에 전도성 도료를 코팅하거나 무전해 방법으로 전도성 물질을 도금하는 방법으로 전자파에 대한 문제를 해결하고 있으나, 이러한 방법은 코팅된 도료의 탈착 문제와 전해 용액 사용시 환경문제 발생이 지적되고 있다. Also, since most plastics are essentially electrical insulators, the electromagnetic waves are easily passed through without any loss to the plastics. In order to solve this problem, conventionally, a problem of electromagnetic waves has been solved by coating a conductive paint on the surface of a plastic housing or plating a conductive material by an electroless method. However, this method has problems in desorption of a coated paint and use of an electrolytic solution Environmental problems have been pointed out.

또한, 플라스틱 소재는 열전도성이 낮으므로 전자부품에서 발생된 열을 외부로 방출하기 위하여 전자파 차폐의 전도성 재료와 별개로 열전도 재료를 사용하거나, 플라스틱의 일면에 금속 등을 덧붙여 방열 문제를 해결하고 있지만, 이러한 방법은 자동차에서 전자장치의 확대로 인해 많은 전자부품들의 경량화 및 다양한 디자인에 대한 수요를 만족하지 못하는 문제가 있다.In addition, plastic materials have low thermal conductivity, so heat dissipation is solved by using heat conduction materials apart from conductive materials for electromagnetic shielding or by adding metals to one side of plastic in order to release heat generated from electronic components to the outside , This method has a problem in that the expansion of electronic devices in automobiles can not meet the demand for light weight and various designs of many electronic parts.

이러한 플라스틱 소재의 문제점을 해결하기 위해, 전도성이 우수한 필러를 첨가한 복합체 제조에 많은 연구가 진행되고 있다.In order to solve the problems of such a plastic material, much research has been conducted on the manufacture of composites containing a filler with excellent conductivity.

대한민국 등록특허 제1337959호(2013.12.02)Korean Patent No. 1337959 (Dec. 2, 2013)

본 발명은 상기와 같은 문제점을 해결하기 위해 창안된 것으로서, 경량화를 달성하면서 전자파를 효과적으로 차폐할 수 있는 전자파 차폐용 복합체를 제공하는 데에 그 목적이 있다. It is an object of the present invention to provide a composite for shielding electromagnetic waves that can effectively shield electromagnetic waves while achieving weight reduction.

상기와 같은 목적을 달성하기 위하여 본 발명의 바람직한 실시예에 따른 탄소소재 복합체는, 폴리아마이드(PA-6) 수지 50~95wt%; 및 상기 폴리아마이드(PA-6) 수지와 친화력을 갖는 작용기로 표면처리된 탄소 필러 50~5wt%;를 포함한다.In order to achieve the above object, a carbon material composite according to a preferred embodiment of the present invention comprises 50 to 95 wt% of a polyamide (PA-6) resin; And 50 to 5 wt% of a carbon filler surface-treated with a functional group having affinity with the polyamide (PA-6) resin.

그리고, 상기 탄소 필러는, 판상입자, 원통형 입자, 섬유상 입자 형태로 마련된 탄소 소재 중 적어도 둘 이상을 혼합하여 마련될 수 있다.The carbon filler may be prepared by mixing at least two of carbon materials provided in the form of plate-like particles, cylindrical particles, and fibrous particles.

즉, 상기 탄소 필러는, 흑연, 탄소나노튜브, 탄소섬유 중 적어도 둘 이상을 혼합하여 마련될 수 있다. That is, the carbon filler may be prepared by mixing at least two of graphite, carbon nanotube, and carbon fiber.

보다 구체적으로, 상기 탄소 필러는, 흑연 1~10wt%, 탄소나노튜브 2~20wt%, 탄소섬유 2~20wt%를 혼합하여 마련될 수 있다.More specifically, the carbon filler may be prepared by mixing 1 to 10 wt% of graphite, 2 to 20 wt% of carbon nanotubes, and 2 to 20 wt% of carbon fibers.

그리고, 상기 작용기는, 상기 탄소 필러의 중량 대비 0.05~0.5wt%의 지방산이 표면 처리될 수 있다. The functional group may be surface-treated with 0.05 to 0.5 wt% of fatty acid based on the weight of the carbon filler.

또한, 상기 작용기는, 스테아르산(stearic acid), 올레산(oleic acid), 리놀레산(linoleic acid) 중 어느 하나인 지방산으로 마련될 수 있다.In addition, the functional group may be a fatty acid which is any one of stearic acid, oleic acid and linoleic acid.

본 발명에 의한 전자파 차폐용 복합체에 따르면, 열가소성 고분자 수지에 전도성이 우수한 탄소 필러를 혼합하여 경량성을 달성하면서 전자파를 차폐할 수 있는 효과를 얻을 수 있다.According to the electromagnetic wave shielding composite of the present invention, it is possible to obtain an effect of shielding electromagnetic waves while achieving light weight by mixing a carbon filler having excellent conductivity with the thermoplastic polymer resin.

그리고, 본 발명에 의하면, 고분자 수지와 친화력을 갖는 작용기로 탄소 필러를 표면처리하여 전자파 차폐 성능을 향상시킬 수 있는 효과를 얻을 수 있다. According to the present invention, it is possible to obtain an effect of improving the electromagnetic wave shielding performance by surface-treating a carbon filler with a functional group having affinity with a polymer resin.

도 1은 본 발명의 실시예에 의한 전자파 차폐용 복합체의 입자간 연결 상태를 개략적으로 도시해 보인 도면이다.BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram schematically showing intergranular connection states of an electromagnetic wave shielding composite according to an embodiment of the present invention. FIG.

본 발명의 특징들에 대한 이해를 돕기 위하여, 이하 본 발명의 실시예와 관련된 전자파 차폐용 복합체에 대하여 보다 상세하게 설명하기로 한다. In order to facilitate understanding of the features of the present invention, the electromagnetic wave shielding composite according to the embodiment of the present invention will be described in more detail.

이하 설명되는 실시예의 이해를 돕기 위하여 첨부된 각 도면의 구성요소들에 참조부호를 부가함에 있어서, 동일한 구성요소들에 대해서는 비록 다른 도면상에 표시되더라도 가능한 한 동일한 부호를 가지도록 하고 있음에 유의한다. 또한, 본 발명을 설명함에 있어, 관련된 공지 구성 또는 기능에 대한 구체적인 설명이 본 발명의 요지를 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명은 생략한다.It should be noted that, in order to facilitate understanding of the embodiments described below, reference numerals are added to the components of the accompanying drawings, so that the same components are denoted by the same reference numerals even though they are shown in different drawings . In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

본 발명의 실시예에 의한 전자파 차폐용 복합체는 열가소성 고분자 수지에 탄소 필러를 혼합하여 제작한다. 특히, 상기 탄소 필러는 상기 열가소성 고분자 수지와 친화력을 갖는 작용기로 표면처리된 후 상기 열가소성 고분자 수지와 혼합된다. The electromagnetic wave shielding composite according to the embodiment of the present invention is produced by mixing a thermoplastic polymer resin with a carbon filler. In particular, the carbon filler is surface-treated with a functional group having affinity with the thermoplastic polymer resin, and then mixed with the thermoplastic polymer resin.

보다 구체적으로, 상기 열가소성 고분자 수지는 폴리프로필렌(PP) 수지 또는 폴리아마이드(PA-6) 수지가 분말 형태로 마련되어 전체 중량 대비 50~95wt%로 혼합된다. 물론, 상기 열가소성 고분자 수지가 이에 한정되는 것은 아니고, 폴리에틸렌, 폴리스틸렌, 폴리알킬렌테레프탈레이트, 폴리아세탈, 폴리술폰, 폴리이미드, 폴리카보네이트 중 선택된 어느 하나 또는 둘 이상이 혼합된 혼합물로 마련될 수도 있다.More specifically, the thermoplastic polymer resin is prepared by mixing a polypropylene (PP) resin or a polyamide (PA-6) resin in powder form at a content of 50 to 95 wt% based on the total weight of the thermoplastic polymer resin. Of course, the thermoplastic polymer resin is not limited thereto, but may be a mixture of any one selected from polyethylene, polystyrene, polyalkylene terephthalate, polyacetal, polysulfone, polyimide and polycarbonate or a mixture of two or more thereof .

상기 탄소 필러는 전기 전도성 및 열 전도성 향상을 위하여 입자의 형태가 다른 탄소 소재를 혼합하여 마련된다. 즉, 도 1에 도시된 바와 같이, 판상 입자(10), 원통형 입자(20), 섬유상 입자(30) 형태로 마련되는 탄소 소재를 혼합하여 마련될 수 있다. 서로 다른 형태의 입자를 혼합하는 경우에는 하나의 입자만으로 제작된 복합체와 비교하여 입자간 네트워크가 원활하게 형성되어 전자들의 이동이 원활한 통로역할을 함으로써 전자파 차폐 성능을 보다 향상시킬 수 있다.The carbon filler is prepared by mixing carbon materials having different particle shapes to improve electrical conductivity and thermal conductivity. That is, as shown in FIG. 1, the carbon material may be prepared by mixing the carbon material in the form of the plate-like particles 10, the cylindrical particles 20, and the fibrous particles 30. In the case of mixing different types of particles, the intermolecular network is smoothly formed as compared with the composite made of only one particle, and the electromagnetic wave shielding performance can be further improved by acting as a smooth passage of electrons.

일 예로, 판상 입자의 탄소 소재는 흑연을 사용하고, 원통형 입자의 탄소 소재는 탄소나노튜브를 사용하고, 섬유상 입자의 탄소 소재는 탄소섬유를 사용할 수 있다. 따라서, 본 발명의 탄소 필러는 흑연, 탄소나노튜브, 탄소섬유 중 적어도 둘 이상을 혼합하여 마련된다. For example, graphite may be used as the carbon material of the plate-like particles, carbon nanotubes may be used as the carbon material of the cylindrical particles, and carbon fibers may be used as the carbon material of the fibrous particles. Accordingly, the carbon filler of the present invention is prepared by mixing at least two of graphite, carbon nanotube, and carbon fiber.

보다 구체적으로, 상기 탄소 필러는 전체 중량대비 흑연 1~10wt%, 탄소나노튜브 2~20wt%, 탄소섬유 2~20wt%를 혼합하여 마련될 수 있다. More specifically, the carbon filler may be prepared by mixing 1 to 10 wt% of graphite, 2 to 20 wt% of carbon nanotubes, and 2 to 20 wt% of carbon fibers with respect to the total weight.

그리고, 상기 탄소 필러는 상기 열가소성 고분자 수지와 친화력을 갖는 작용기로 표면 처리된 후 상기 열가소성 고분자 수지와 혼합된다. 표면 처리된 탄소 필러는 상기 열가소성 고분자 수지 내에서 분산성이 향상되므로, 네트워크를 용이하게 형성하여 복합체의 전기 전도성 및 열 전도성을 향상시킬 수 있다.The carbon filler is surface-treated with a functional group having affinity with the thermoplastic polymer resin and then mixed with the thermoplastic polymer resin. Since the surface-treated carbon filler has improved dispersibility in the thermoplastic polymer resin, the network can be easily formed to improve the electrical conductivity and thermal conductivity of the composite.

여기서, 상기 작용기는 스테아르산(stearic acid), 올레산(oleic acid), 리놀레산(linoleic acid) 중 어느 하나인 지방산으로 마련될 수 있다.Here, the functional group may be a fatty acid which is any one of stearic acid, oleic acid and linoleic acid.

이러한 작용기를 상기 탄소 필러에 표면 처리하는 방법은 염산, 아세트산, 황산, 질산, 포름산 등과 같은 산을 이용하여 탄소 필러가 양전하를 갖도록 산 처리하고, 산 처리된 탄소 필러를 수용성 및 유기 용매와 혼합하여 상기 탄소 필러에 수산화기(-OH)를 형성한다. 그리고, 수산화기가 형성된 탄소 필러를 상기 지방산과 혼합한다. 이때, 상기 탄소 필러의 수산화기가 유기 리간드를 포함하는 지방산과 결합하여 탄소 필러를 표면처리 하게 된다. 이때, 상기 탄소 필러의 중량 대비 0.05~0.5wt%의 지방산이 상기 탄소 필러에 표면 처리된다.The surface treatment of such a functional group with the carbon filler is carried out by an acid treatment such that the carbon filler has a positive charge by using an acid such as hydrochloric acid, acetic acid, sulfuric acid, nitric acid, formic acid, etc., and the acid-treated carbon filler is mixed with water- A hydroxyl group (-OH) is formed on the carbon filler. Then, a carbon filler formed with a hydroxyl group is mixed with the fatty acid. At this time, the hydroxyl group of the carbon filler is combined with the fatty acid including the organic ligand to surface the carbon filler. At this time, 0.05 to 0.5 wt% of fatty acid based on the weight of the carbon filler is surface-treated on the carbon filler.

실시예Example

이하에서는 본 발명의 실시예에 의한 전자파 차폐용 복합체(실시예 1, 2, 3)를 종래 한 종류의 탄소 소재만을 혼합한 복합체(비교예 1, 2, 3)와 비교하여 설명한다. 여기서, 실시예 1 내지 3에 사용된 탄소 필러는 수지와 친화력을 갖는 작용기로 표면처리 되었다.Hereinafter, the electromagnetic wave shielding composites (Examples 1, 2 and 3) according to the embodiment of the present invention will be described in comparison with the composites (Comparative Examples 1, 2 and 3) in which only conventional types of carbon materials are mixed. Here, the carbon filler used in Examples 1 to 3 was surface-treated with a functional group having affinity with resin.

실시예 1 내지 3은 열가소성 고분자 수지에 흑연, 탄소나노튜브, 탄소섬유를 일정 비율로 혼합하여 제작한 복합체이다. 이와 비교하여, 비교예 1은 열가소성 고분자 수지에 흑연만 혼합하여 제작한 복합체이고, 비교예 2는 열가소성 고분자 수지에 탄소나노튜브만 혼합하여 제작한 복합체이며, 비교예 3은 열가소성 고분자 수지에 탄소섬유만을 혼합하여 제작한 복합체이다. 여기서, 각 혼합물의 중량비 및 제작된 복합체의 전자파 차폐 성능(1.0GHz)은 아래 표 1에 나타내었다.Examples 1 to 3 are composites produced by mixing graphite, carbon nanotubes, and carbon fibers in a certain ratio with a thermoplastic polymer resin. Comparative Example 1 was a composite prepared by mixing graphite alone with a thermoplastic polymer resin, Comparative Example 2 was a composite prepared by mixing only a carbon nanotube with a thermoplastic polymer resin, Comparative Example 3 was a composite obtained by mixing carbon fiber . Here, the weight ratio of each mixture and the electromagnetic wave shielding performance (1.0 GHz) of the prepared composite are shown in Table 1 below.

그리고, 상기 실시예 및 비교예에서는 열가소성 고분자 수지로 밀도가 약 1.0~1.2g/cm3이고 인장강도가 65~75MPa이고 열변형온도가 160~180℃인 폴리아마이드(PA-6) 수지가 사용되었다.In the above Examples and Comparative Examples, polyamide (PA-6) resin having a density of about 1.0 to 1.2 g / cm 3 , a tensile strength of 65 to 75 MPa and a heat distortion temperature of 160 to 180 ° C was used as the thermoplastic polymer resin .

또한, 상기 탄소 필러는 면방향 크기(lateral size)가 5~500㎛인 흑연과, 밀도가 1.4~1.6g/cm3이고 인장강도가 4800~5200MPa인 탄소섬유와, 밀도가 0.09~0.11g/cm3이고 직경이 8~12nm이고 길이가 40~60㎛인 탄소나노튜브로 마련된다.The carbon pillar is made of graphite having a lateral size of 5 to 500 μm, carbon fibers having a density of 1.4 to 1.6 g / cm 3 and a tensile strength of 4800 to 5200 MPa, a density of 0.09 to 0.11 g / cm < 3 >, a diameter of 8 to 12 nm and a length of 40 to 60 [mu] m.

구분division PA-6
[wt%]
PA-6
[wt%]
흑연
[wt%]
black smoke
[wt%]
탄소나노튜브
[wt%]
Carbon nanotube
[wt%]
탄소섬유
[wt%]
Carbon fiber
[wt%]
EMI 차폐 성능
(1.0GHz)[dB]
EMI shielding performance
(1.0 GHz) [dB]
실시예 1Example 1 8282 55 33 1010 2828 실시예 2Example 2 7979 55 66 1010 3131 실시예 3Example 3 7575 55 1010 1010 4141 비교예 1Comparative Example 1 9090 1010 -- -- 2020 비교예 2Comparative Example 2 9090 -- 1010 -- 3030 비교예 3Comparative Example 3 9090 -- -- 1010 1818

상기 표 1에 개시되어 있는 바와 같이, 본 발명의 실시예에 의한 전자파 차폐용 복합체는 폴리아마이드 수지에 하나의 탄소 소재만을 혼합하여 제작한 복합체와 비교하여 1.0GHz 영역에서 전자파 차폐 성능이 우수함을 확인할 수 있다.As shown in Table 1, the electromagnetic wave shielding composite according to the embodiment of the present invention shows excellent electromagnetic wave shielding performance in the 1.0 GHz region as compared with the composite made by mixing only one carbon material with the polyamide resin .

보다 구체적으로 살펴보면, 우선 탄소 소재로 흑연만 혼합한 비교예 1과 탄소 섬유만 혼합한 비교예 3은 전자파 차폐 성능이 18~20dB을 나타내지만, 흑연, 탄소나노튜브, 그리고 탄소섬유 모두를 혼합한 실시예 1 내지 3은 전자파 차폐 성능이 28~41dB을 나타내고 있어, 입자 형태가 다른 3가지 탄소 소재를 모두 혼합한 복합체가 전자파 차폐 성능이 향상됨을 확인할 수 있다. More specifically, in Comparative Example 1 in which only graphite was mixed with carbon material and Comparative Example 3 in which carbon fiber alone was mixed, the electromagnetic wave shielding performance was 18 to 20 dB. However, in the case of mixing graphite, carbon nanotubes, and carbon fibers In Examples 1 to 3, the electromagnetic wave shielding performance is 28 to 41 dB. Thus, it can be confirmed that the electromagnetic wave shielding performance is enhanced by the composite material obtained by mixing all three carbon materials having different particle shapes.

그리고, 탄소나노튜브 10wt%만 혼합한 비교예 2의 전자파 차폐 성능은 30dB로 비교적 우수한 전자파 차폐 성능을 나타내지만, 탄소나노튜브 10wt%에 흑연과 탄소섬유를 함께 혼합한 실시예 3은 전자파 차폐 성능이 41dB로 더 우수한 전자파 차폐 성능을 나타냄을 확인할 수 있다.The electromagnetic wave shielding performance of Comparative Example 2 in which only 10 wt% of the carbon nanotubes were mixed exhibited comparatively excellent electromagnetic wave shielding performance of 30 dB, but Example 3 in which graphite and carbon fibers were mixed together in 10 wt% It is possible to confirm that the electromagnetic wave shielding performance is better at 41 dB.

본 발명의 실시예에 의한 전자파 차폐용 복합체는 열가소성 고분자 수지에 입자 형태가 서로 다른 흑연, 탄소나노튜브, 탄소섬유를 적정한 비율로 혼합하여 네트워크를 원활하게 형성하여 전자파 차폐 성능을 향상시킬 수 있다.The electromagnetic wave shielding composite according to an embodiment of the present invention can smoothly form a network by mixing graphite, carbon nanotubes, and carbon fibers having different particle shapes into the thermoplastic polymer resin at an appropriate ratio, thereby improving electromagnetic shielding performance.

이상과 같이, 본 발명은 비록 한정된 실시예와 도면에 의해 설명되었으나, 본 발명은 이것에 의해 한정되지 않으며 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 본 발명의 기술사상과 아래에 기재될 특허청구범위의 균등범위 내에서 다양한 수정 및 변형 가능함은 물론이다.While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It is to be understood that various changes and modifications may be made without departing from the scope of the appended claims.

10 : 판상 입자
20 : 원통형 입자
30 : 섬유상 입자
10: Plate-shaped particles
20: Cylindrical particle
30: fibrous particles

Claims (6)

폴리아마이드(PA-6) 수지 50~95wt%; 및
열가소성 고분자 수지와 친화력을 갖는 작용기로 표면처리된 탄소 필러 50~5wt%;를 포함하고,
상기 탄소 필러는,
판상 입자 형태이고 면방향 크기(lateral size)가 5~500㎛인 흑연 1~9wt%, 원통형 입자 형태이고 밀도가 0.09~0.11g/cm3이고 직경이 8~12nm이고 길이가 40~60㎛인 탄소나노튜브 2~20wt%, 섬유상 입자 형태이고 밀도가 1.4~1.6g/cm3이고 인장강도가 4800~5200MPa인 탄소섬유 2~20wt%를 혼합하여 마련되고,
상기 작용기는,
올레산(oleic acid), 리놀레산(linoleic acid) 중 어느 하나인 지방산으로 마련되고, 상기 탄소 필러의 중량 대비 0.05~0.5wt%로 표면 처리된 전자파 차폐용 복합체.
50 to 95 wt% polyamide (PA-6) resin; And
And 50 to 5 wt% of a carbon filler surface-treated with a functional group having affinity with the thermoplastic polymer resin,
Wherein the carbon filler comprises:
1 to 9 wt% of graphite having a plate size of 5 to 500 μm in lateral size and a cylindrical particle shape having a density of 0.09 to 0.11 g / cm 3 , a diameter of 8 to 12 nm and a length of 40 to 60 μm 2 to 20 wt% of carbon nanotubes, 2 to 20 wt% of carbon fibers having a fibrous particle shape and a density of 1.4 to 1.6 g / cm 3 and a tensile strength of 4800 to 5200 MPa,
The functional group
Oleic acid or linoleic acid, and is surface-treated with 0.05 to 0.5 wt% based on the weight of the carbon filler.
삭제delete 삭제delete 삭제delete 삭제delete 삭제delete
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KR20220105186A (en) * 2021-01-18 2022-07-27 한국재료연구원 Composite material for shielding electromagnetic waves and its manufacturing method

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KR20120074108A (en) * 2010-12-27 2012-07-05 제일모직주식회사 Bracket for protecting lcd of portable display device
KR101337959B1 (en) 2012-03-19 2013-12-09 현대자동차주식회사 Composite for shielding electromagnetic wave
WO2015190324A1 (en) * 2014-06-10 2015-12-17 株式会社カネカ Heat-conductive resin composition
JP2016147919A (en) * 2015-02-10 2016-08-18 東レ株式会社 Polyamide resin composition and molded article obtained by molding same

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KR20120074108A (en) * 2010-12-27 2012-07-05 제일모직주식회사 Bracket for protecting lcd of portable display device
KR101337959B1 (en) 2012-03-19 2013-12-09 현대자동차주식회사 Composite for shielding electromagnetic wave
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