KR101923621B1 - Conductive substrate and electronic apparatus comprising the same - Google Patents
Conductive substrate and electronic apparatus comprising the same Download PDFInfo
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- KR101923621B1 KR101923621B1 KR1020150135737A KR20150135737A KR101923621B1 KR 101923621 B1 KR101923621 B1 KR 101923621B1 KR 1020150135737 A KR1020150135737 A KR 1020150135737A KR 20150135737 A KR20150135737 A KR 20150135737A KR 101923621 B1 KR101923621 B1 KR 101923621B1
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- bonding pad
- conductive
- pad portion
- area
- contact
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Abstract
BACKGROUND 1. Technical Field The present disclosure relates to a conductive substrate and an electronic device including the conductive substrate.
Description
Generally, a display device refers to a TV or a monitor for a computer, and includes a display element for forming an image and a case for supporting the display element.
As the spread of smart phones, tablet PCs, IPTV, and the like is accelerated in connection with display devices, there is a growing need for a touch function in which a human hand becomes a direct input device without a separate input device such as a keyboard or a remote control.
Screen printing of insulation is accompanied by a robust design for enhancing the reliability of the bonding area in a high temperature and high humidity environment when manufacturing a touch screen module (touch screen module).
As a result, when the flexible printed circuit board (FPCB) bonding is inevitably carried out, portions where the insulation and the bonding area overlap each other are generated, and the resistance can be increased. Therefore, it is required to set the design value of the insulation printing so as not to interfere with the driving of the sensor .
The present specification intends to provide a conductive substrate and an electronic device including the conductive substrate.
In one embodiment of the present disclosure,
Board;
A conductive pattern layer provided on the substrate, the conductive pattern layer including an electrode pattern part and a bonding pad part electrically connected to the electrode pattern part and bonded to the printed circuit board;
A printed circuit board mounted on the bonding pad;
An insulation layer provided between an end of the printed circuit board and the bonding pad; And
And a resin layer which is provided to adhere the bonding pad portion and the printed circuit board on the side of the insulation layer closer to the end of the substrate and includes the pressed conductive balls,
Wherein an area of the upper surface of the bonding pad portion that is in contact with the insulation layer is greater than or equal to 10% and less than or equal to 30% of the sum of an area where the upper surface of the bonding pad portion contacts the resin layer and an upper surface of the bonding pad portion,
Wherein an area of the conductive ball included in the resin layer in contact with the bonding pad portion is 4% to 8.5% of an area in which the upper surface of the bonding pad portion is in contact with the resin layer and an area in contact with the bonding pad portion and the insulation layer And a conductive substrate.
Another embodiment of the present disclosure provides an electronic device comprising the above-described conductive substrate.
The conductive substrate according to some embodiments of the present specification can be formed by designing the contact area between the insulation layer and the bonding pad portion in the bonding region with the printed circuit board and the contact area between the bonding pad portion and the pressed conductive ball, The increase in contact resistance due to the insulation layer is minimized and the reliability under high temperature and high humidity is improved to prevent moisture from being absorbed in the bonding area with the printed circuit board.
1 is a schematic view of a part of a cross section of a conductive substrate according to one embodiment of the present application.
2 is a schematic view of a portion of an upper portion of a conductive substrate according to one embodiment of the present application.
3 is a top schematic view of a conductive substrate according to one embodiment of the present application, prior to attachment of the printed circuit board.
FIG. 4 is a graph showing reliability according to the embodiment and the comparative example of the present invention. FIG.
FIG. 5 is a graph showing the reliability according to the embodiment and the comparative example of the present invention.
Whenever a component is referred to as " comprising ", it is to be understood that the component may include other components as well, without departing from the scope of the present invention.
When an element is referred to herein as being " on " of another element, it is not intended that the two elements be physically tangential unless otherwise specifically stated, Quot; element ".
As used herein, the terms " upper " and " upper surface " refer to a portion relatively far from the substrate with respect to the position of the substrate, assuming that the substrate is located at the lowest position in the stacking order.
In the present specification, " transparent " means that the transmittance of visible light is 70% or more or 80% or more. Incidentally, the case where the entire area is not transparent and the aperture ratio is 60% or more may be included.
As used herein, the term " conductive " means electrical conductivity.
Hereinafter, the present invention will be described in more detail.
According to an embodiment of the present invention, a conductive substrate includes a substrate; A conductive pattern layer provided on the substrate, the conductive pattern layer including an electrode pattern part and a bonding pad part electrically connected to the electrode pattern part and bonded to the printed circuit board; A printed circuit board mounted on the bonding pad; An insulation layer provided between an end of the printed circuit board and the bonding pad; And a resin layer which is provided to adhere the bonding pad portion and the printed circuit board on the side of the insulation layer near the end of the substrate, the resin layer including the pressed conductive balls.
1 shows a laminated structure of a substrate (PET), a bonding pad portion, an insulation layer, a resin layer (ACF) including a pressed conductive ball, and a printed circuit board (FPCB). The upper arrow in Fig. 1 indicates the direction in which pressure can be applied when the printed circuit board (FPCB) is bonded. FIG. 2 illustrates a superimposed structure of a bonding pad unit made of a metal sensor electrode and an insulation layer when the conductive substrate according to the above-described embodiment is used as a sensor electrode. Although the electrode pattern portion is not shown in Figs. 1 and 2, the electrode pattern portion is positioned on the (- electrode pattern portion) of Fig. 1 and the (- > screen portion) side of Fig. 3 is a schematic view of a top surface of a conductive substrate including an electrode pattern portion. 3 is a state before the printed circuit board is attached.
In addition, the conductive substrate may have an area where the upper surface of the bonding pad portion and the insulation layer contact with the upper surface of the bonding pad portion and an area of the upper surface of the bonding pad portion that is in contact with the insulation layer, And an area of the conductive ball included in the resin layer in contact with the bonding pad portion is equal to or greater than a sum of an area in which the upper surface of the bonding pad portion and the resin layer are in contact with an area in which the bonding pad portion and the insulation layer are in contact with each other 4% to 8.5%.
When the area of the upper surface of the bonding pad portion that is in contact with the insulation layer is more than 10% and less than 30% of the sum of the area of the upper surface of the bonding pad portion contacting the resin layer and the surface of the bonding pad portion contacting the insulation layer, Since the ratio of change in the contact resistance between the pad portion and the printed circuit board, that is, the ratio (R / R0) of the contact resistance R after reliability evaluation in a high temperature and high humidity environment to the initial contact resistance R0 does not exceed 2, So that the driving stability of an electronic device such as a sensor can be improved. In addition, the presence of the insulation layer within the above range is also excellent in durability in a high temperature and high humidity environment. The area can be obtained by actual measurement and calculation.
According to an embodiment of the present invention, an area where the upper surface of the bonding pad portion and the insulation layer contact with the upper surface of the bonding pad portion is greater than or equal to 12.5% % Or less.
According to an embodiment, the bonding pad portion comprises at least two stripe-shaped conductive patterns extending from the end of the printed circuit board located on the insulation layer to the end of the substrate closest to the end, The width of the insulation layer may be controlled to be more than 10% and less than 30% of the sum of the width of the region where the bonding pad contacts the insulation layer and the width of the region where the bonding pad contacts the resin layer.
Further, the area of the conductive ball included in the resin layer in contact with the bonding pad portion may be between 4% and 8.5% of the sum of an area in which the upper surface of the bonding pad portion contacts the resin layer and an area in contact with the bonding pad portion and the insulation layer. %, The bonding with the printed circuit board can be stably performed without excessively increasing the resistance, and at the same time, the occurrence of short circuit in the bonding pad due to the excessive amount of conductive balls can be prevented. The area where the pressed conductive ball contacts with the bonding pad portion can be obtained by actually measuring and calculating one side of the conductive ball.
According to an embodiment, an area of the conductive ball included in the resin layer in contact with the bonding pad portion is 4.7 times the sum of an area in which the upper surface of the bonding pad portion is in contact with the resin layer and an area in which the bonding pad portion and the insulation layer are in contact with each other. To 6.8%.
In this specification, the bonding pad portion may be formed of at least one conductive pattern, and if it can be electrically connected to the printed circuit board by bonding with the printed circuit board using the resin layer including the pressed conductive balls, . For example, the bonding pad portion may be formed of two or more stripe-shaped conductive patterns. In this case, the upper surface of the bonding pad portion means a surface opposite to the surface of each stripe contacting the substrate, and does not include a side surface.
The conductive pattern constituting the bonding pad portion may include at least one of a metal, a metal oxide, a metal nitride, and a metal oxynitride, and may have a single layer or a laminated structure of two or more layers as necessary. For example, the bonding pad portion may have a metal pattern or a laminated structure of a metal pattern, a metal oxide, a metal nitride, or a metal oxynitride. Here, the metal is not limited as long as it can be used as an electrode material of an electronic device, and may be at least one selected from the group consisting of silver, copper, aluminum, gold, nickel, bismuth, palladium, .
In one embodiment of the present invention, the insulation layer may be provided to cross at least one of the conductive patterns constituting the bonding pad portion of the conductive pattern layer. For example, when an arbitrary pattern among the patterns constituting the bonding pad portion is A1 and another arbitrary pattern is B1, the insulation layer may cross the A1 and B1. According to an example, the bonding pad portion may be formed of a conductive pattern including A1 and B1 in a stripe form.
In this specification, the printed circuit board may have a configuration known in the art, for example, a flexible printed circuit board (FPCB) may be used.
In this specification, the insulation layer may be formed using an insulation paste, for example, but not limited to, a screen printing method.
The insulation layer in this specification may be present in an insulation paste state, but may mean a state in which the insulation paste is cured.
For example, the insulation layer may be formed using a thermosetting insulation material or a UV curing insulation material. As the thermosetting insulation material, a material containing xylene and an epoxy resin such as hexa (methoxymethyl) melamine may be used. As the UV curing insulation material, a material including an acrylic material and a photoinitiator such as Irgacure 651 may be used However, the present invention is not limited thereto, and an insulation material known in the art can be used.
In one embodiment of the present invention, the thickness of the insulation layer may be in the order of micrometers and may be 4 to 13 micrometers, and the thickness of the insulation layer may be 5 to 10 micrometers. When the thickness of the insulation layer is within the above range, it is possible to manufacture a conductive substrate having excellent durability and high reliability in a high temperature and high humidity environment, but also an advantage of electric current flow by minimizing the rise of sheet resistance.
When the printed circuit board is bonded, the insulation layer is present on the resin layer including the bonding pad portion, the pressed conductive balls, and the printed circuit board, so that the insulation layer can act as an element that interrupts the current flow. However, the conductive substrate according to the embodiments of the present invention maintains the durability by designing the size of the insulation layer and the pressed conductive ball content in the above-described range, and by reducing the contact area between the insulation layer and the bonding pad portion, There is an advantage that it prevents rise and prevents unstable driving of an electronic device such as a touch sensor.
The resin layer including the pressed conductive balls in this specification can be formed by an anisotropic conductive film (ACF) used in the art to bond a printed circuit board. ACF means a film in which conductive balls, that is, conductive particles dispersed in a resin, exhibit electrical conductivity in the z-axis direction in the thickness direction of the film and exhibit insulation in the xy direction which is the plane direction of the film. In this specification, the resin layer containing the pressed conductive balls can be formed using an anisotropic conductive film as well as an anisotropic conductive connecting agent including conductive balls. It could be a generic term. As the ACF or anisotropic conductive connection agent, those used in the art for bonding a printed circuit board to a conductive substrate may be used.
In one embodiment of the present invention, the resin layer including the pressed conductive balls is formed by applying a film or a connecting agent containing conductive balls having an average diameter of 10 to 30 탆 to the bonding pad portion described above, And then pressing the conductive balls. According to one example, the conductive balls may have an average diameter of 20 mu m. When the average diameter of the conductive balls is within the above range, there is an advantage that the contact area can be minimized while maintaining normal driving of an electronic device such as a touch sensor. The average diameter may mean an average of values obtained by checking the shape of the conductive balls through a Scanning Electron Microscope (SEM) and measuring the diameters of the conductive balls.
A ratio of an area of the bonding pad portion that is in contact with the resin layer and an area of the bonding pad portion that is in contact with the insulation layer to an area of the conductive ball in contact with the bonding pad portion in the resin layer, Can be designed from the diameter of the conductive ball using the following equation (1). The average surface area of the following conductive balls can be calculated according to a formula for obtaining the surface area of the sphere from the diameter of the conductive balls. a / 2 is an area where the conductive ball contacts with the bonding pad portion when the conductive ball is ideally 100% pressed.
[Formula 1]
[{(a / 2) * c} * d / b] / b * 100
In
Wherein a is the average surface area of the conductive balls,
B is the sum of the contact area between the upper surface of the bonding pad part and the resin layer including the pressed conductive ball and the contact area between the bonding pad part and the insulation layer,
The number c of the contact conductive balls is, for example, an integer of 60 or more and 80 or less,
D is an area in contact with the resin layer including the bonding pad portion and the pressed conductive ball.
In the
The resin layer including the pressed conductive balls is located on the side of the insulation layer closer to the end of the substrate, and may be located on the side of the insulation layer, although it is not essential.
In this specification, the electrode pattern portion may be formed of a conductive pattern. The electrode pattern portion may be an electrode portion existing in an effective screen portion exposed to a user's view in the case of a display device or a touch sensor. According to an example embodiment, the electrode pattern portion may include an electrode pattern portion of an effective screen portion and a wiring portion that electrically connects the electrode pattern portion of the effective screen portion to the bonding pad portion.
The conductive pattern constituting the electrode pattern portion may be composed of conductive lines, and these conductive lines may be regular or irregular patterns. Specifically, the pattern may be in the form of a stripe, a mesh, or a wavy pattern. The pattern eye of the mesh pattern may be a polygon such as a triangle, a rectangle, etc., a circle, an ellipse, or an amorphous form. The triangle may be an equilateral triangle or a right triangle, and the rectangle may be a square, a rectangle, a trapezoid, or the like. Also, the pattern may be composed of lines, curves, or a combination thereof.
As the regular pattern, a pattern form of the related art such as a mesh pattern can be used. The irregular pattern is not particularly limited, but may be a boundary line shape of the Voronoi diagram.
When the pattern shape is an irregular pattern, it is possible to remove the diffraction pattern of the reflected light due to the illumination having the directivity by the irregular pattern, and the influence of light scattering can be minimized by the light reflection reduction pattern layer, Can be minimized.
The line width of the conductive pattern constituting the electrode pattern portion may be 0.1 탆 or more and 100 탆 or less. Specifically, the line width of the pattern of the screen portion may be 0.1 탆 or more and 50 탆 or less, 0.1 탆 or more and 30 탆 or less, or 0.1 탆 or more and 10 탆 or less, but is not limited thereto. If the line width is less than 0.1 탆, the pattern may be difficult to realize. If the line width is more than 100 탆, the visibility may be deteriorated. The conductive pattern constituting the electrode pattern portion may include one or two of metals, metal oxides, metal nitrides and metal oxynitrides Or more. For example, the conductive pattern constituting the electrode pattern portion may be formed by depositing a transparent conductive oxide or metal on a substrate, and materials and methods commonly used in the art may be used.
The transparent conductive material is not limited as long as it is transparent and excellent in electrical conductivity. For example, ITO, IZO, IGZO, AZO, FTO and tin oxide commonly used in the art can be used.
The metal may be at least one selected from the group consisting of silver, copper, aluminum, gold, nickel, bismuth, palladium, and alloys thereof, although it is not limited to metal having high electrical conductivity.
In the present specification, the substrate may be a glass substrate or a transparent plastic substrate having excellent transparency, surface smoothness, ease of handling, and waterproofness, but is not limited thereto and may be any material conventionally used in the art.
In one embodiment of the present disclosure, the conductive substrate may be a touch sensor electrode, a display driving electrode, a display pixel electrode, or a camera module.
One embodiment of the present disclosure provides an electronic device including the above-described conductive substrate.
According to one embodiment of the present disclosure, the electronic device may be a touch sensor, a display, or a camera. Other configurations other than the above-described conductive substrate may employ a configuration known in the field of the electronic device.
Hereinafter, the present invention will be described in detail by way of examples with reference to the drawings. However, the embodiments according to the present disclosure can be modified in various other forms, and the scope of the present specification is not construed as being limited to the embodiments described below. Embodiments of the present disclosure are provided to more fully describe the present disclosure to those of ordinary skill in the art.
[Examples and Comparative Examples]
A resist pattern was printed by a reverse off-set process on a substrate having a metal layer formed thereon, and a conductive pattern layer including a stripe bonding pad portion and an electrode pattern portion was formed through a wet process. Then, an insulation layer was screen-printed on the bonding pad portion of the conductive pattern layer, and FPCB was bonded using an ACF including conductive balls to produce a conductive substrate.
Specifically, in accordance with Examples 1 to 5 and Comparative Examples 1 to 4 according to the overlapping length of the bonding pattern portions of the insulation layer and the conductive pattern layer and the contact area of the conductive pattern of the ACF with the bonding pattern of the conductive pattern layer, A conductive substrate was produced. Thereafter, the reliability evaluation was carried out under the same conditions of high temperature and high humidity (temperature 85 ° C, humidity 85%, and 120 hours), and the rate of change in the connection resistance of each sample was measured. The resulting data was shown in Tables 1, Respectively.
Effective area (%)
(Poor appearance - metal oxidation)
(Visual defects)
In Table 1, R is the connection resistance after the reliability evaluation, and Ro is the initial connection resistance. In the bonding reliability, & cir & is very excellent, & cir & is excellent, &
In Table 1, the overlapping length ratio (%) is the ratio of the width of the insulation layer contacting the bonding pad to the sum of the width of the region where the bonding pad is in contact with the insulation layer and the width of the region where the bonding pad is in contact with the resin layer Expressed as a percentage.
In Table 1, the conductive ball connection effective area (%) was calculated based on the following
[Formula 1]
[{(a / 2) * c} * d / b] / b * 100
In
B is the sum of the contact area between the upper surface of the bonding pad part and the resin layer including the pressed conductive ball and the contact area between the bonding pad part and the insulation layer,
The number c of the contact conductive balls is, for example, an integer of 60 or more and 80 or less,
D is an area in contact with the resin layer including the bonding pad portion and the pressed conductive ball.
As shown in Table 1 and FIG. 4, as the overlap length ratio of insulation increased from 0% to 75%, it was not confirmed that the connection resistance change rate of the FPCB bonding before and after the reliability change. Particularly, in the case of 0% without overlapping between the insulation and the metal pattern layer, corrosion of the metal occurs and the bonding reliability is lowered.
It was confirmed that the rate of change of the connection resistance did not exceed 2 times, but the rate of change of resistance sharply increased when the area where the metal pattern layer and the insulation overlapped exceeded 10%, specifically from 12.5% to 30%.
The increase in the connection resistance measurement value and the rate of change depending on the overlapping area of the insulation layer and the metal pattern layer can be considered to be affected by the reduction of the overall contact area of the conductive balls included in the ACF stably contacting the metal pattern layer.
FIG. 5 shows the relationship between the rate of change in resistance and the rate of change in contact area in the case of a conductive ball having an average diameter of 20 占 퐉. As can be seen from FIG. 5, the range in which the FPCB bonding state and the connection resistance value can be stably maintained is not less than 4% and not more than 8.5% of the bonding pad area, more specifically not less than 4.7% and not more than 6.8% If the area is small, the resistance change rate becomes large and the bonding state can not be maintained. If the area is 8.5% or more, the possibility of a short between the bonding pad portions due to an excessive amount of conductive balls is increased.
Claims (9)
A conductive pattern layer provided on the substrate, the conductive pattern layer including an electrode pattern part and a bonding pad part electrically connected to the electrode pattern part and bonded to the printed circuit board;
A printed circuit board mounted on the bonding pad;
An insulation layer provided between an end of the printed circuit board and the bonding pad; And
And a resin layer which is provided to adhere the bonding pad portion and the printed circuit board on the side of the insulation layer closer to the end of the substrate and includes the pressed conductive balls,
Wherein an area of the upper surface of the bonding pad portion that is in contact with the insulation layer is greater than or equal to 10% and less than or equal to 30% of the sum of an area where the upper surface of the bonding pad portion contacts the resin layer and an upper surface of the bonding pad portion,
Wherein an area of the conductive ball included in the resin layer in contact with the bonding pad portion is 4% to 8.5% of an area in which the upper surface of the bonding pad portion is in contact with the resin layer and an area in contact with the bonding pad portion and the insulation layer ≪ / RTI >
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| KR1020150135737A KR101923621B1 (en) | 2015-09-24 | 2015-09-24 | Conductive substrate and electronic apparatus comprising the same |
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| KR1020150135737A KR101923621B1 (en) | 2015-09-24 | 2015-09-24 | Conductive substrate and electronic apparatus comprising the same |
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| KR101923621B1 true KR101923621B1 (en) | 2018-11-29 |
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| KR20190092972A (en) * | 2018-01-31 | 2019-08-08 | 엘지전자 주식회사 | Display device |
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| KR102035005B1 (en) | 2012-12-24 | 2019-10-22 | 엘지디스플레이 주식회사 | Touch display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190092972A (en) * | 2018-01-31 | 2019-08-08 | 엘지전자 주식회사 | Display device |
| KR102420355B1 (en) | 2018-01-31 | 2022-07-13 | 엘지전자 주식회사 | Display device |
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