KR101915407B1 - A composition of hot melt film - Google Patents

A composition of hot melt film Download PDF

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KR101915407B1
KR101915407B1 KR1020170100958A KR20170100958A KR101915407B1 KR 101915407 B1 KR101915407 B1 KR 101915407B1 KR 1020170100958 A KR1020170100958 A KR 1020170100958A KR 20170100958 A KR20170100958 A KR 20170100958A KR 101915407 B1 KR101915407 B1 KR 101915407B1
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hot
resin
melt
reaction
composition
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KR20180041561A (en
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박희대
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박희대
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Priority to PCT/KR2017/010126 priority Critical patent/WO2018070676A1/en
Priority to US15/945,825 priority patent/US11198799B2/en
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    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72Polyisocyanates or polyisothiocyanates
    • C08G18/80Masked polyisocyanates
    • C08G18/8061Masked polyisocyanates masked with compounds having only one group containing active hydrogen
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    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/10Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an adhesive surface
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    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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    • C08G18/72Polyisocyanates or polyisothiocyanates
    • C08G18/80Masked polyisocyanates
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    • C08G18/00Polymeric products of isocyanates or isothiocyanates
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    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • C09J7/405Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
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    • C08G2170/20Compositions for hot melt adhesives
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Abstract

본 발명에서 구현하고자 하는 반응성 핫멜트 수지의 조성물 및 상기 수지로 제조된 반응성 핫멜트 필름은 선형구조의 폴리우레탄, 다관능기의 이소시아네이트 블록화제, 반응촉매, 반응지연제 등으로 이루어지며, 바람직하게는 폴리우레탄 수지와 잠재경화제인 이소시아네이트 블록화제를 주성분으로 하면서 여기에 반응을 촉진하기 위한 촉매와 장기저장성을 확보하기 위한 반응지연제를 포함하여 이루어진다.
특히, 본 발명에 따른 반응성 핫멜트 수지의 조성물은 종래의 무재봉(No Sew) 프레스 작업시에 다 녹아서 무너지는 현상을 없애 접착력 유지에 도움을 줄 수 있는 성능을 가질 수 있도록 하는 내열증진제를, 바람직하게는 나노실리카를 더 포함하여 이루어진다.
The composition of the reactive hot-melt resin to be implemented in the present invention and the reactive hot-melt film made of the resin are composed of a linear polyurethane, an isocyanate blocking agent of a polyfunctional group, a reaction catalyst, a reaction retarder and the like, A catalyst for accelerating the reaction, and a reaction retarder for securing long-term shelf life while using a resin and an isocyanate blocking agent as a latent curing agent as a main component.
Particularly, the composition of the reactive hot-melt resin according to the present invention can be used as a heat resistance enhancer that can achieve a performance capable of helping to maintain adhesive strength by eliminating the phenomenon that melts and collapses at the time of a conventional no- And further comprising nanosilica.

Description

반응성 핫멜트 수지의 조성물{A composition of hot melt film}A composition of hot melt film < RTI ID = 0.0 >

본 발명은 반응성 핫멜트 수지의 조성물에 관한 것으로서 , 더욱 상세하게는 열 프레스(hot press) 작업 후 열가소성에서 열경화성으로 열적 특성이 변화하여 우수한 내열성을 구현할 수 있도록 하는 반응성 핫멜트 수지의 조성물에 관한 것이다 .The present invention relates to a composition of a reactive hot-melt resin , and more particularly, to a composition of a reactive hot-melt resin capable of realizing excellent heat resistance by changing thermal properties from thermoplastic to thermosetting after a hot press operation.

잘 알려진 진 바와 같이, 핫멜트 필름(Hot Melt Film)은 열가소성 특성을 가지는 필름으로서 통상의 이형지(release paper)에 핫멜트 수지를 코팅처리하여 제조된 것이다. 이러한 핫멜트 필름은 피착제와 피착제를 접착시키는 것으로, 피착제 사이에 핫멜트 필름을 놓은 후 가열 및 가압을 하면 핫멜트 필름이 열에 의해 녹으면서 피착제의 표면에 달라붙어 접착력을 발휘하는 원리이다.As is well known, a hot melt film is a film having a thermoplastic property and is produced by coating a release paper with a hot melt resin. Such a hot-melt film adheres the adherend and the adherend. When the hot-melt film is placed between the adherend and heated and pressed, the hot-melt film sticks to the surface of the adherend while being dissolved by heat.

이와 같은 용도로 사용되는 핫멜트 필름으로는 대표적으로 폴리우레탄, 폴리에틸렌, 폴리에틸렌비닐아세테이트, 폴리에스터, 폴리아미드 등의 고분자 물질들이 사용되며, 용제형 접착제나 수성 접착제 등의 액상 접착제를 사용하여 접착하거나 재봉을 통해 두 가지 원단을 결합시키는 방법보다 공정이 단순하고 공정 자동화에 유리할 뿐만 아니라 친환경적이어서 근래에는 여러 분야에 많이 사용되고 있다.As the hot melt film used for such a purpose, a polymer material such as polyurethane, polyethylene, polyethylene vinyl acetate, polyester, polyamide is used as a typical example, and a liquid adhesive such as a solvent type adhesive or an aqueous adhesive is used, The process is simpler than the method of joining two fabrics through the process, and it is advantageous for process automation as well as being eco-friendly, so that it is widely used in various fields in recent years.

상기와 같은 핫멜트 필름은 대부분 열가소성의 특성이 있기 때문에, 구체적으로는 가열 및 가압에 의해 피착제와 접착된 후에도 다시 열과 압력을 받게 되면 재용융될 수 있다. 이러한 특성은 재가공이 가능한 장점이 있는 반면에 원하지 않는 열변형이 발생할 수 있는 우려가 있다.Since the hot-melt film as described above is mostly thermoplastic, it may be remelted if it is subjected to heat and pressure again after being adhered to the adherend by heating and pressing. This property has the advantage of being reworkable, but there is a concern that undesired thermal deformation may occur.

한편, 열변형이 가능한 온도는 핫멜트의 선택에 있어 매우 중요한 요인으로서 최종 제품의 내열성을 결정하는 요인이 되기도 하는데, 이러한 경우 열가소성 핫멜트 이외에 반응성 핫멜트가 사용되는 경우도 있다.On the other hand, the temperature at which thermal deformation is possible is a very important factor in the selection of hot melt, which is a factor that determines the heat resistance of the final product. In this case, reactive hot melts may be used in addition to thermoplastic hot melts.

통상의 반응성 핫멜트는 고분자 구조 내에 열 및 습도 등에 의해 반응할 수 있는 작용기를 남겨두어서, 소재에 도포 후 점진적으로 반응이 진행되어 경화되는 방식을 사용한다. 특히 폴리우레탄계 핫멜트의 경우는 이소시아네이트 작용기를 남겨 두어서 소재에 도포된 후 수분이나 소재와 직접 반응함으로써 경화되는 원리를 이용한다. 하지만, 이러한 반응성 핫멜트 는 필름 형태로 제조할 수 없을 뿐더러 저장 중에 변질의 우려가 매우 큰 근본적인 문제점이 있다.A conventional reactive hot melt uses a method in which a functional group capable of reacting with heat, humidity, etc. is left in the polymer structure, and the reaction proceeds gradually after application to the material and cures. Particularly, in the case of a polyurethane hot melt, the isocyanate functional group is left to be applied to the material, and then the material is cured by directly reacting with water or the material. However, such a reactive hot melt can not be produced in the form of a film, and there is a fundamental problem that the possibility of deterioration during storage is very great.

공개특허공보 공개번호 제10-2012-0081094호(발명의 명칭: 반응성 핫멜트 접착제 조성물. 공개일자: 2012년 07월 18일)Open No. 10-2012-0081094 (the name of the invention: reactive hot-melt adhesive composition publication date: July 18, 2012) 등록특허공보 등록번호 제10-1075373호(발명의 명칭: 반응성 폴리우레탄 우레아 핫멜트 접착제. 공고일자: 2011년 10월 24일)Registered Patent Publication No. 10-1075373 (Name of the invention: reactive polyurethane-urea hot melt adhesive) Date of issue: October 24, 2011 공개특허공보 공개번호 제10-2007-0051894호(발명의 명칭: 반응성 핫멜트 수지 조성물 및 반응성 핫멜트 접착제. 공개일자: 2007년 05월 18일)Disclosure of the Invention Problems to be Solved by the Invention Disclosure of the Invention Problems to be Solved by the Invention Disclosure of the Invention Problems to be Solved by the Invention Disclosure of the Invention Problems to be Solved by the Invention Disclosure of the Invention Problems to be Solved by the Invention Disclosure 공개특허공보 공개번호 제10-2006-0049309호(발명의 명칭: 반응성 핫멜트 접착제의 제조 시스템 및 제조 방법. 공개일자: 2006년 05월 18일)No. 10-2006-0049309 (Title of the Invention: System and Method for Manufacturing Reactive Hot-Melt Adhesive Published Date: May 18, 2006)

본 발명은 열 프레스 작업 후 열가소성에서 열경화성으로 열적 특성이 변화하여 우수한 내열성을 갖도록 하는 반응성 핫멜트 수지의 조성물을 제공하는데 그 목적이 있다 .
본 발명의 다른 목적은 상기 반응성 핫멜트 수지를 이형지에 코팅처리하여 반응성 핫멜트 필름을 제조함으로써 필름 형태로 취급이 용이하고 장기적으로 저장성이 우수한 반응성 핫멜트 필름을 제공함에 있다.
An object of the present invention is to provide a composition of a reactive hot-melt resin which is thermoplastic to thermoset and which has a thermal property changed to have excellent heat resistance.
Another object of the present invention is to provide a reactive hot-melt film which is easy to handle in the form of a film and excellent in long-term storage property by producing the reactive hot-melt film by coating the reactive hot-melt resin on a release paper.

삭제delete

본 발명에 따른 반응성 핫멜트 수지의 조성물은 폴리우레탄 수지와 잠재경화제인 이소시아네이트 블록화제를 주성분으로 하며, 여기에 반응을 촉진하기 위한 촉매와 장기 저장성을 확보하기 위한 반응지연제, 그리고 종래의 무재봉(No Sew) 프레스 작업시 다 녹아서 무너지는 현상을 방지하여 접착력 유지에 도움을 줄 수 있는 성능을 가지게 하는 내열증진제(바람직하게는, 나노실리카)를 포함하여 이루어지는 것을 특징으로 한다.The composition of the reactive hot-melt resin according to the present invention comprises a polyurethane resin and an isocyanate blocking agent as a latent curing agent as main components, a catalyst for promoting the reaction therefrom, a reaction retarder for ensuring long-term storage stability, No Sew) is characterized by comprising a heat resistance enhancer (preferably, nanosilica) which has a performance capable of preventing adhesion of the adhesive strength by preventing the phenomenon of collapse during press work.

바람직하게는, 상기 잠재경화제인 이소시아네이트 블록화제는 40℃ 미만의 일반적인 저장조건에서는 비활성 상태로서 폴리우레탄과 반응을 하지 않아 우수한 저장성을 보이고, 열 프레스 시에는 고온에 노출되면서 활성화되어 반응을 시작하는 것을 특징으로 한다.Preferably, the isocyanate blocking agent, which is a latent curing agent, is inactive under a typical storage condition of less than 40 ° C and does not react with polyurethane, exhibiting excellent storability, and is activated while being exposed to high temperatures during hot pressing to start the reaction .

특히, 본 발명은 내열증진제(바람직하게는, 나노실리카)를 사용함으로써 무재봉(no sew) 온도에서의 점도를 크게 향상시켜 무재봉 후 소재의 경계면에 충분한 양의 폴리우레탄 수지를 잔류시킬 수 있도록 하여 소재에 과침투되는 것을 방지할 수 있는 것을 특징으로 한다.Particularly, the present invention can improve the viscosity at a no sewing temperature by using a heat resistance enhancer (preferably, nano silica) so that a sufficient amount of the polyurethane resin can remain at the interface of the material after no- So that it can be prevented from being infiltrated into the work.

또한, 본 발명은 상기와 같은 조성물(바람직하게는, 이소시아네이트 블록화제와 나노실리카)로 이루어진 반응성 핫멜트 수지를 통상의 이형지에 코팅처리하여 제조된 반응성 핫멜트 필름을 기술적 특징으로 한다.The present invention also has a technical feature of a reactive hot-melt film produced by coating a reactive hot-melt resin composed of such a composition (preferably an isocyanate blocking agent and nano-silica) on a conventional release paper.

본 발명은 열 프레스(hot press) 작업 후 열가소성에서 열경화성으로 열적 특성이 변화하여 우수한 내열성을 지니게 되며, 또한 우수한 내열성으로 인해 고온에서 형태 안정성 및 접착력이 우수할 뿐만 아니라 가수분해 저항성도 우수한 장점이 있다. 그리고 본 발명은 반응촉매의 사용으로 인해 비교적 짧은 열 프레스 작업시간에도 충분한 경화 반응을 보이는 효과가 있다.The present invention is advantageous in that it has an excellent heat resistance due to a change in thermal properties from thermoplastic to thermosetting after a hot press operation and also has excellent shape stability and adhesion at high temperature as well as excellent hydrolysis resistance due to excellent heat resistance . Further, the present invention has the effect of exhibiting sufficient curing reaction even during a relatively short hot press working time due to the use of the reaction catalyst.

이하 본 발명의 바람직한 실시 예를 구체적으로 설명하면 다음과 같다. 후술 될 상세한 설명에서는 상술한 기술적 과제를 이루기 위해 본 발명에 있어 대표적인 실시 예를 제시할 것이다. 그리고 본 발명으로 제시될 수 있는 다른 실시 예들은 본 발명의 구성에서 설명으로 대체한다.Hereinafter, preferred embodiments of the present invention will be described in detail. In the following detailed description, exemplary embodiments of the present invention will be described in order to accomplish the above-mentioned technical problems. And other embodiments which may be presented by the present invention are replaced by descriptions in the constitution of the present invention.

본 발명에서 구현하고자 하는 반응성 핫멜트 수지의 조성물 및 상기 수지로 제조된 반응성 핫멜트 필름은 선형구조의 폴리우레탄, 다관능기의 이소시아네이트 블록화제, 반응촉매, 반응지연제 등으로 이루어지며, 바람직하게는 폴리우레탄 수지와 잠재경화제인 이소시아네이트 블록화제를 주성분으로 하면서 여기에 반응을 촉진하기 위한 촉매와 장기저장성을 확보하기 위한 반응지연제를 포함하여 이루어진다.The composition of the reactive hot-melt resin to be implemented in the present invention and the reactive hot-melt film made of the resin are composed of a linear polyurethane, an isocyanate blocking agent of a polyfunctional group, a reaction catalyst, a reaction retarder and the like, A catalyst for accelerating the reaction, and a reaction retarder for securing long-term shelf life while using a resin and an isocyanate blocking agent as a latent curing agent as a main component.

특히, 본 발명에 따른 반응성 핫멜트 수지의 조성물은 종래의 무재봉(No Sew) 프레스 작업시에 다 녹아서 무너지는 현상을 없애 접착력 유지에 도움을 줄 수 있는 성능을 가질 수 있도록 하는 내열증진제를, 바람직하게는 나노실리카를 더 포함하여 이루어진다. Particularly, the composition of the reactive hot-melt resin according to the present invention can be used as a heat resistance enhancer that can achieve a performance capable of helping to maintain adhesive strength by eliminating the phenomenon that melts and collapses at the time of a conventional no- And further comprising nanosilica.

이와 같은 조성물(구체적으로는, 이소시아네이트 블록화제와 나노실리카)로 이루어진 본 발명의 반응성 핫멜트 수지와 상기 수지를 통상의 이형지에 코팅 처리하여 제조된 본 발명의 반응성 핫멜트 필름은 열 프레스 작업 전에는 열가소성으로, 열 프레스 작업 후에는 열경화성으로, 즉 열 프레스 작업 후에는 재가열되어도 재용융되지 않는 특징이 있다.The reactive hot-melt resin of the present invention, which is made of such a composition (specifically, an isocyanate blocking agent and nanosilica) and the resin of the present invention, which is prepared by coating the release paper with a conventional release paper, is thermoplastic before heat- And is characterized by being thermosetting after hot pressing, that is, not re-melting even after reheating after hot pressing.

한편, 본 발명에 따른 반응성 핫멜트 수지의 조성물로 사용되는 이소시아네이트 블록화제의 종류는 아래의 표 1과 같다.Meanwhile, the types of isocyanate blocking agents used in the composition of the reactive hot-melt resin according to the present invention are shown in Table 1 below.

종류Kinds 해리온도Dissociation temperature 융점Melting point 비점Boiling point 특징Characteristic Methylethylketoxime(MEKO)Methylethylketoxime (MEKO) 140~160℃140-160 ° C -30℃-30 ° C 150℃150 ℃ 메탈처럼 딱딱한 피착제에 접착하는 용도로 사용Used to adhere to hard adhesives like metal Dimethylpyrazole(DMP)Dimethylpyrazole (DMP) 110~120℃110 ~ 120 ℃ 218℃218 ° C 218℃218 ° C 원단처럼 부드러운 파착제에 접착하는 용도로 사용하며, 수용성 제품에 주로 사용It is used to adhere to soft detergent like fabric and mainly used in water-soluble products Diethylmalonate(DEM)Diethylmalonate (DEM) 100~120℃100 to 120 ° C 199℃199 ℃ 199℃199 ℃ 낮은 온도에 해리되나 그만큼 보관시 해리되기 쉬움Disassociated at low temperature but easily dissociated when stored Diisopropylamine(DIPA)Diisopropylamine (DIPA) 140~150℃140 to 150 ° C 249℃249 ° C 249℃249 ° C Caprolactam(E-CAP)Caprolactam (E-CAP) 160~180℃160 to 180 ° C 138℃138 DEG C 138℃138 DEG C

상기 표 1에서 보는 바와 같이, 이소시아네이트 블록화제는 그 종류에 따라서 활성화되는 온도가 각기 다른데, MEKO형의 경우는 150℃ 전후의 온도가 필요로 하여 고온에 안정한 소재에 사용되며, DMP형의 경우는 110℃ 전후에서 활성화될 수 있어서 열에 약한 원단소재에 사용 가능하다. 신발용 소재와 같은 내열성이 높지 않은 자재들에는 DMP(Dimethylpyrazole, 디메틸피라졸)형 이소시아네이트 블록화제가 가장 적절한 잠재경화제이다.As shown in Table 1, the isocyanate blocking agent is activated at different temperatures depending on the type thereof. In the case of the MEKO type, a temperature of about 150 ° C. is required, which is used for a material stable at high temperatures. It can be activated around 110 ℃, so it can be used for material with weak heat. DMP (dimethylpyrazole) isocyanate blocking agents are the most suitable latent curing agents for materials with low heat resistance such as shoe materials.

상기 이소시아네이트 블록화제의 활성화 온도는 가장 해리가 활발하게 일어나는 온도를 지칭하며, 이보다 20~30℃ 이상 낮은 온도에서도 해리는 일어나기 시작하는데 이 온도는 최종 핫멜트 필름의 저장안정성에 큰 영향을 미친다. 즉, DMP형 이소시아네이트 블록화제를 사용하여 제조한 핫멜트 수지를 통상의 이형지에 코팅처리하여 제조된 핫멜트 필름을 50℃ 이상의 고온에 장시간 저장할 경우, 해리반응과 경화반응이 점진적으로 진행되어 핫멜트 필름이 사용 불가한 상태가 된다. 특히 경화반응을 촉진하기 위한 촉매를 사용한 경우에는 더욱 반응이 빨라져 일반적으로 하루 이상 저장이 힘든 문제점이 있다.The activation temperature of the isocyanate blocking agent refers to a temperature at which most dissociation occurs actively. At a temperature lower than 20 to 30 캜, dissociation starts to occur, which has a great influence on the storage stability of the final hot melt film. That is, when a hot-melt film prepared by coating a hot-melt resin prepared by using a DMP-type isocyanate blocking agent on a conventional release paper is stored at a high temperature of 50 ° C or higher for a long time, dissociation reaction and curing reaction progress gradually, It becomes impossible. In particular, when a catalyst for accelerating the curing reaction is used, the reaction proceeds more rapidly, which generally results in difficulty in storage for more than one day.

따라서, 본 발명에서는 이러한 저장성 문제를 개선하기 위하여 반응지연제를 사용하며, 상기 반응지연제는 반응촉매와 함께 사용되어져 저장 중에는 촉매의 활성을 최대한 억제시켜 이소시아네이트 블록화제와 폴리우레탄 수지 간의 반응을 최대한 지연하고, 고온의 사용 조건에서는 스스로 휘발함으로써 촉매의 활성을 다시 회복시키고 이소시아네이트 블록화제와 폴리우레탄 수지 간의 반응이 촉진되도록 한다.Therefore, in the present invention, a reaction retarder is used to improve the storage stability, and the reaction retarder is used together with the reaction catalyst to maximize the activity of the catalyst during storage to maximize the reaction between the isocyanate blocking agent and the polyurethane resin And is volatilized by itself under high temperature use conditions, thereby restoring the activity of the catalyst and promoting the reaction between the isocyanate blocking agent and the polyurethane resin.

한편, 원단에 열 프레스 시험을 통해 이소시아네이트 블록화제를 사용하지 않는 경우보다 접착력이 향상된 결과를 얻었다. 이는 이소시아네이트 블록화제가 열 프레스의 환경에서 활성화되어 폴리우레탄 수지와 경화반응이 진행된 것임을 증명한다. 접착소재의 내열성 평가(Dead load test)를 통해 이소시아네이트 블록화제를 사용하지 않은 수지에 비해 내열성이 비약적으로 향상됨을 확인하였다. 즉, 열가소성 수지에서 열 프레스 작업 후 열경화성 수지로 변화되었음을 확인했다. 짧은 시간의 열 프레스 공정을 통해 이러한 이소시아네이트 블록화제의 신속한 반응을 이끌어내기 위해서는 반응촉매의 역할이 매우 중요하며, 상기 반응지연제의 사용을 통해 고온 저장성이 크게 개선되는 것을 확인하였다. On the other hand, the adhesive strength was improved by the hot press test on the fabric, as compared with the case where the isocyanate blocking agent was not used. This proves that the isocyanate blocking agent is activated in the hot press environment and the curing reaction proceeds with the polyurethane resin. It was confirmed that heat resistance was remarkably improved by the dead load test of the adhesive material compared with the resin not using the isocyanate blocking agent. In other words, it was confirmed that the thermoplastic resin changed into a thermosetting resin after the thermal press working. The role of the reaction catalyst is very important for the quick reaction of the isocyanate blocking agent through a short time hot pressing process and it has been confirmed that the high temperature storage stability is improved by using the reaction retarder.

특히, 본 발명에서는 반응성 핫멜트 수지를 제조할 때 내열증진제를 사용하는데, 이는 종래의 무재봉(No Sew) 프레스 작업시 다 녹아 무너지지 않고 접착력 유지에 도움을 줄 수 있도록 하기 위함인데, 구체적으로는 무재봉(no sew) 온도에서의 점도를 크게 향상시켜 무재봉 후 소재의 경계면에 충분한 양의 폴리우레탄 수지를 잔류시킬 수 있도록 하여 소재에 과침투되는 것을 방지할 수 있도록 하기 위함이다. 이때, 상기 내열증진제로는 나노실리카를 사용하는 것이 바람직하다.Particularly, in the present invention, a heat resistance enhancer is used in producing a reactive hot-melt resin. This is to prevent adhesion of the adhesive layer to the adhesive layer, The viscosity at the no sewing temperature is greatly improved so that a sufficient amount of the polyurethane resin can remain on the boundary surface of the material after the non-sewing so as to prevent penetration of the material. At this time, it is preferable to use nano silica as the heat resistance enhancer.

한편, 아래의 표 2에서는 본 발명에 따른 반응성 핫멜트 수지의 조성물 및 상기 수지를 통상의 이형지에 코팅처리하여 제조된 반응성 핫멜트 필름의 검증방법을 구체적으로 제시하고 있다.On the other hand, in Table 2 below, the composition of the reactive hot-melt resin according to the present invention and a method for verifying a reactive hot-melt film produced by coating the resin on a conventional release paper are specifically shown.

TPU
핫멜트
TPU
Hot melt
배합 1Formulation 1 배합 2Formulation 2 배합 3Formulation 3 배합 4Formulation 4 배합 5Formulation 5 배합 6Formulation 6 배합 7Formulation 7 배합 8Formulation 8 배합 9Formulation 9
수분산폴리우레탄1Water-dispersed polyurethane 1




100

100

100

100

100

100

50

50

100

100

100

100
수분산폴리우레탄2Water-dispersed polyurethane 2
100

100

100

100

100

100

50

50
DMPDMP 2.52.5 55 1010 55 55 55 55 촉매catalyst 1One 1One 1One 1One 1One 1One 1One 지연제Retarder 1One 1One 1One 1One 1One 1One 1One 내열
증진제
Heat resistance
Enhancer
55 88
접착력(평균값,kgf/cm)Adhesion (average, kgf / cm)
1.5

1.5

1.5

1.5

1.1

1.1

3

3

3.1

3.1

2.6

2.6

2.2

2.2

2.5

2.5

3.2

3.2

3.1

3.1
내열성(초)Heat resistance (sec) 5555 <10<10 <6<6 4545 4444 4747 1515 2525 8282 9595 유동
시작온도(℃)
Flow
Starting temperature (℃)

116

116

82

82

60

60

69

69

73

73

71

71

56

56

65

65

80

80

85

85
점도
(cps @ 130℃)
Viscosity
(cps @ 130 &lt; 0 &gt; C)

100,000

100,000

60,000

60,000

<20,000

<20,000

50,000

50,000

40,000

40,000

30,000

30,000

<20,000

<20,000

28,000

28,000

76,000

76,000

300,000

300,000

1. 접착력 시험 1. Adhesion test

가. 시험목적: 종래의 열가소성 폴리우레탄 핫멜트 대비 접착력이 향상되는 정도를 평하기 위함이다.end. Purpose: To evaluate the degree of improvement of adhesive strength compared to conventional thermoplastic polyurethane hotmelt.

나. 사용 원단: 폴리에스터 자카드 원단I. Fabric used: polyester jacquard fabric

다. 열 프레스 조건All. Heat press condition

(1) 조건 1: 35kgf, 130℃, 30초(저압 프레스 조건)(1) Condition 1: 35 kgf, 130 캜, 30 seconds (under a low-pressure press condition)

(2) 조건 2: 70kgf, 130℃, 30초(기존 No Sew 프레스 조건)(2) Condition 2: 70 kgf, 130 캜, 30 seconds (existing No Sew press condition)

라. 적용배합: 내열증진제를 사용하지 않은 배합 1~배합 7la. Application: Mixing without heat resistance enhancer 1 ~ Mixing 7

마. 적용배합: 내열증진제를 사용한 배합 8, 배합 9, 기존 TPU 핫멜트hemp. Application Formulation: Formulation 8 with Heat Resistance Enhancer, Formulation 9, Conventional TPU Hot Melt

바. 접착력 평가: 핫멜트 필름은 모두 두께 100㎛을 사용하였고, 열 프레스 1일 경과 후 폭 1인치로 절단하여 인장시험기로 평가하였다.bar. Adhesion Evaluation: All of the hot melt films were 100 탆 thick, and after 1 day of hot pressing, they were cut into 1 inch wide and evaluated by a tensile tester.

삭제delete

사. 결과: 종래의 열가소성 핫멜트 필름 대비 배합 3~배합 9 모두 우수한 접착력을 보였다. 또한, 내열증진제를 사용하지 않은 배합 1~배합 7을 조건 2(기존 No Sew 프레스 조건)로 프레스하였을 때는 핫멜트가 다 녹아 원단에 과침투되어 접착강도가 1kgf/cm 미만으로 매우 낮게 나왔다 .four. Results: Compared with conventional thermoplastic hot melt films, compounding 3 to compounding 9 showed excellent adhesion. Further, when the compounding formulation 1 and 7 did not use a heat-resistant improving agents hayeoteul press in Condition 2 (No Sew existing press conditions) the hot melt is melted and penetrates the fabric came very low, the adhesive strength is less than 1kgf / cm.

2. 내열성 시험 2. Heat resistance test

가. 시험목적: 반응성 핫멜트 필름이 열 프레스에 의해 반응이 시작되어 경화반응이 일어나면 수지의 내열성이 상승하게 되는데, 이를 평가하기 위해 고온의 오븐에서 접착한 원단의 한쪽에 1kg의 하중을 가해서 박리되는 시간을 평가한다.end. The purpose of this test is to evaluate the heat resistance of the resin when the reactive hot-melt film starts to react with the hot press and the curing reaction takes place. To evaluate this, the time to peel off by applying a load of 1 kg to one side of the fabric adhered in a high- .

나. 열 프레스 작업을 수행한 원단을 폭 1인치, 길이 15cm로 자른 후 한쪽 끝에 1kg의 추를 매달아 130℃의 오븐에 넣어 완전히 박리되는 시간을 측정한다.I. After cutting the fabric with 1 inch wide and 15 cm long, put 1 kg of weight on one end and put it in the oven at 130 ° C to measure the time of complete peeling.

다. 결과: 배합 8, 배합 9에서 종래의 열가소성 폴리우레탄 핫멜트보다 우수한 내열성을 보였다.All. Results: Formulations 8 and 9 showed better heat resistance than conventional thermoplastic polyurethane hotmelt.

3. 유동시작온도(Temperature of flow beginning) 시험 3. Temperature of flow beginning test

가. 시험목적: 열 프레스 가능 온도를 판단하기 위해 측정하고, 일정 하중에서 온도를 올려가면서 수지가 유동하기 시작하는 온도를 측정한다.end. Purpose: To determine the temperature at which a hot press can be made, measure the temperature at which the resin begins to flow while increasing the temperature at a constant load.

나. 케필러리 레오미터를 이용해 핫멜트 필름이 유동하기 시작하는 온도를 측정한다.I. Use a capillary rheometer to measure the temperature at which the hot melt film begins to flow.

4. 점도 4. Viscosity

가. 통상 열 프레스 온도인 130℃에서 종래의 열가소성 폴리우레탄 핫멜트 필름과 유사한 점도의 핫멜트 필름 배합을 찾는 것이 중요하다. 이는 유사한 점도를 가져야만 통상의 열 프레스 조건을 변경없이 사용할 수 있어 사용의 편의성이 커진다.end. It is important to find a hot-melt film composition having a viscosity similar to that of a conventional thermoplastic polyurethane hot-melt film at a heat press temperature of 130 占 폚. This has the similar viscosity, so that the normal heat press condition can be used without change, which increases the usability.

나. 결과: 내열증진제를 사용하여 무재봉(No Sew) 조건인 130℃에서의 점도를 크게 향상시킬 수 있었고, 이로 인해 종래의 열가소성 폴리우레탄 핫멜트 필름과 동일 조건에서 무재봉(No Sew) 후 우수한 접착력을 확보하였다.I. RESULTS: Using the heat resistance enhancer, it was possible to greatly improve the viscosity at 130 ° C under no sewing condition. As a result, the adhesive strength after the no sewing under the same condition as that of the conventional thermoplastic polyurethane hot melt film Respectively.

한편, 일반적으로 신발 갑피(Upper) 자재로 많이 사용하는 폼 패키지(즉, 폼의 양측으로 원단이 접착된 소재: 이하 "폼 패키지"라 함) 자재의 경우 폼 자재의 앞/뒤로 원단을 접착한 형상이며, 펀칭 가공 등을 통해 일정한 패턴을 부여하고 이를 재단하여 신발용 갑피 등의 자재로 사용한다. 이러한 폼 패키지 자재의 경우 가장 중요시하게 다루는 부분이 원단에 접착된 폼 패키지 자재 자체의 통기성과 원단과의 접착력이다. 종래의 일반적인 열가소성 핫멜트 필름을 사용한 폼 패키지 자재의 경우 통기성이 부여되지 않는 문제와 신발 디자인에서 요구하는 3D 엠보 표면을 위해 양면에 접착된 폼 패키지 자재를 무재봉(No Sew)프레스하게 되면 무재봉(No Sew) 프레스 직후에는 3D 엠보 효과를 가질 수 있으나 상기 폼 패키지 자재 위에 로고나 다른 패턴을 접착하기 위해 무재봉(No Sew) 프레스를 다시 진행하게 되면 열가소성 핫멜트 필름이 다시 멜팅(melting)되어 3D 효과가 없어지는 단점이 있다.On the other hand, in the case of a foam package commonly used as a shoe upper material (that is, a material having a fabric adhered to both sides of the foam: hereinafter referred to as a "foam package"), Shape, and it is given a certain pattern through punching process, etc., and is cut and used as a material such as a shoe upper. The most important part of this foam package material is the breathability of the foam package material itself bonded to the fabric and the adhesion to the fabric. In the case of foam packaging materials using conventional thermoplastic hot melt films, no ventilation is imparted, and foam packaging materials adhered to both sides of the 3D embossing surface required in shoe design are subjected to no sewing (no sewing) No Sew) Immediately after the press, a 3D embossing effect may be obtained, but if the No Sew press is repeated to bond a logo or other pattern on the foam package material, the thermoplastic hot melt film is melted again, There is a disadvantage that it disappears.

이러한 문제점을 해결하기 위하여 종래에는 필름 형태의 핫멜트를 사용하지 않고 습기 경화형 폴리우레탄 핫멜트 수지인 폴리우레탄 리엑티브(polyurethane reactive: 이하 "PUR"이라 함)를 원단 또는 폼에 롤(roll)을 사용하여 다이렉트 코팅한 후 접착하는 경우도 있지만, 이 역시 습기 경화 수지의 사용 안정성이 좋지 않고 3D 효과를 내기 어려운 단점이 있다.In order to solve such a problem, conventionally, polyurethane reactive (hereinafter referred to as " PUR "), which is a moisture-curable polyurethane hot melt resin, is used as a raw material or a roll There is a case that the moisture-curing resin is not stable in use and it is difficult to achieve a 3D effect.

이와 같은 종래기술의 문제점들을 해소하기 위해 본 발명에서는 반응성 핫멜트 수지를 필름 형상으로 만들지 않고 수지 단독으로 1차로 원단에 다이렉트 코팅한 후 2차로 무재봉(No sew) 프레스를 진행하였다. 본 발명은 필름을 사용하지 않고 수지를 코팅한 원단을 폼과 접착함으로서 통기성을 가지게 하는 장점이 있고, 무재봉(No Sew) 프레스 접착시 반응성 핫멜트 수지 조성물에 포함되어 있는 이소시아네이트 블록화제의 영향으로 프레스 후 추가되는 여러 공정에서도 다시 멜팅(melting)되지 않는 열경화성 수지의 성질을 가지게 하여 3D 엠보 효과를 계속 유지하게 할 수 있는 장점이 있었다.In order to solve the problems of the prior art, in the present invention, the reactive hot-melt resin is not directly formed into a film, but is directly coated on the fabric with the resin alone and then subjected to the second-stage non-sewing press. The present invention is advantageous in that a fabric coated with a resin is adhered to a foam without using a film to have a breathability. In the case of a No Sew press bonding, an isocyanate blocking agent contained in a reactive hot- It is possible to maintain the 3D embossing effect by having the properties of the thermosetting resin which is not melted again in various subsequent processes.

또한, 상기 반응성 핫멜트 수지에 사용한 내열증진제, 바람직하게는 나노실리카로 인해 무재봉(No Sew) 프레스 접착시 수지가 높은 압력(30kgf 이상)에서도 원단 및 폼 쪽으로 과침투되어 접착을 불안정하게 하는 현상을 막아주어 우수한 접착력을 가지게 되는 것을 확인할 수 있었다. 아래의 표 3 및 표 4는 이와 관련된 시험 검증 내용을 구체적으로 제시하고 있다.Further, due to the heat resistance enhancer used for the reactive hot-melt resin, preferably nanosilica, the resin penetrates into the fabric and the foam even at a high pressure (30 kgf or more) during the No Sew press bonding, And it was confirmed that they had excellent adhesion. Tables 3 and 4 below show specific test verifications related to this.

종래기술Conventional technology
- 재 멜팅되어 풀려버린 3D 엠보 -- 3D embo that remelted and released -
본 발명Invention
- 선명하게 살아나는 3D 엠보 -- 3D Embo surviving vividly -

Figure 112017076725739-pat00001

Figure 112017076725739-pat00001

Figure 112017076725739-pat00002
Figure 112017076725739-pat00002

상기 표 3의 사진에서 보는 바와 같이, 종래의 폴리우레탄 핫멜트 필름이나 폴리우레탄 핫멜트 수지를 사용한 경우에는 무재봉(No Sew) 프레스 작업을 다시 진행시 필름이 재 멜팅(melting)되거나 습식 경화 수지의 사용 안정성이 좋지 않아 결국에는 3D 효과를 구현할 수 없었다. 하지만, 본 발명과 같이 반응성 핫멜트 수지를 제조할 때 내열증진제인 나노실리카를 사용함으로써 사진에서 보는 바와 같이 3D 엠보가 선명하게 살아나는 효과를 구현할 수 있었다.As shown in the photograph of Table 3, when a conventional polyurethane hot melt film or polyurethane hot melt resin is used, the film is remelted when the No Sew press operation is repeated, or the use of the wet cured resin The stability was not good and 3D effect could not be realized in the end. However, by using nano silica as a heat resistance enhancer in the production of a reactive hot-melt resin as in the present invention, the 3D embossing can be realized clearly as shown in the photograph.

TPU 핫멜트TPU hot melt PUR 핫멜트PUR hot melt 배합 5Formulation 5 배합 6Formulation 6 배합 8Formulation 8 배합 9Formulation 9 수분산폴리우레탄1Water-dispersed polyurethane 1

100


100


100


100
100100 100100 100100
수분산폴리우레탄2Water-dispersed polyurethane 2 100100 DMPDMP 1010 55 55 55 촉매catalyst 1One 1One 1One 1One 지연제Retarder 1One 1One 1One 1One 내열증진제Heat resistance enhancer 55 88 내열성(초)Heat resistance (sec) 5555 <10<10 4747 1515 8282 9595 유동 시작온도(℃)Flow starting temperature (캜) 116116 7474 7171 5656 8080 8585 점도(cps@130℃)Viscosity (cps @ 130 ℃) 100,000100,000 10,00010,000 30,00030,000 <20,000<20,000 76,00076,000 300,000300,000 두께(㎛)Thickness (㎛) 5050 3030 3030 3030 3030 3030 통기 여부Ventilation 통기 안됨No ventilation 통기Ventilation 통기Ventilation 통기Ventilation 통기Ventilation 통기Ventilation 3D 엠보(no sew 프레스 직후)3D embossing (just after no sew press) 양호Good 몰딩 안됨No Molding 양호Good 양호Good 양호Good 양호Good 3D 엠보(2,3차 no sew 프레스 후)3D embossing (after 2,3 no sew press) 효과없음no effect 몰딩 안됨No Molding 양호Good 양호Good 양호Good 양호Good 접착강도(kgf/cm)Adhesive strength (kgf / cm) 0.80.8 1.21.2 0.70.7 0.90.9 3.13.1 3.83.8

상기 표 4에서 제시하고 있는 본 발명의 반응성 핫멜트 수지의 조성물에 대한 물리적 특성을 입증하기 위한, 바람직하게는 반응성 핫멜트 수지를 제조할 때 조성물로 내열증진제(즉, 나노실리카)를 사용했을 때의 물리적 특성을 확인하기 위한 구체적인 검증방법 및 시험 결과값은 아래와 같다.In order to demonstrate the physical properties of the composition of the reactive hot-melt resin of the present invention shown in Table 4, preferably when the reactive hot melt resin is prepared, the physical properties of the thermosensitive material (i.e., nanosilica) Specific verification methods and test result values for identifying the characteristics are as follows.

1. 접착력 시험 1. Adhesion test

가. 시험목적: 종래의 열가소성 폴리우레탄 핫멜트 대비 접착력이 향상되는 정도를 평가하기 위함이다.end. Test purpose: To evaluate the degree of improvement in adhesion relative to conventional thermoplastic polyurethane hotmelt.

나. 사용 원단: 폴리에스터 원단과 PU 폼(앞, 뒷면)I. Fabric used: Polyester fabric and PU foam (front and back)

다. 열 프레스 조건: 60kgf, 130℃, 30초All. Heat press condition: 60 kgf, 130 캜, 30 seconds

라. 적용배합: 상기 표 4 참조la. Application formulations: see Table 4 above

마. 접착력 평가: 핫멜트 필름은 모두 두께 50㎛을 사용하였고, 열 프레스 1일 경과 후 폭 1인치로 절단하여 인장시험기로 평가하였다.hemp. Adhesion Evaluation: All of the hot melt films were 50 탆 thick, and after 1 day of hot pressing, they were cut into 1 inch wide and evaluated by a tensile tester.

바.결과: 종래의 열가소성 핫멜트 필름 및 PUR 핫멜트 접착제 대비 배합 8~배합 9 모두 우수한 접착력을 보였다. 이때, 내열증진제를 사용하지 않은 배합 5와 배합 6을 프레스하였을 때는 핫멜트가 다 녹아 원단에 과침투되어 접착강도가 1kgf/cm 미만으로 매우 낮게 나왔다.Results: Compared to conventional thermoplastic hot melt film and PUR hot melt adhesive, compounding 8 to compound 9 showed excellent adhesion. At this time, when Compound 5 and Compound 6 without the use of the heat resistance enhancer were pressed, the hot melt melted and penetrated into the fabric, resulting in a very low adhesive strength of less than 1 kgf / cm.

2. 내열성 시험 2. Heat resistance test

가. 시험목적: 반응성 핫멜트 필름이 열 프레스에 의해 반응시 시작되어 경화반응이 일어나면 수지의 내열성이 상승하게 된다. 이를 평가하기 위해 고온의 오븐에서 접착한 원단의 한쪽에 1kg의 하중을 가해서 박리되는 시간을 평가하였다.end. Purpose of Test: When a reactive hot melt film starts to react with a hot press to cause a curing reaction, the heat resistance of the resin is increased. In order to evaluate this, a time of peeling was evaluated by applying a load of 1 kg to one side of the bonded fabric in a high-temperature oven.

나. 열 프레스 작업을 수행한 원단을 폭 1인지, 길이 15cm로 자른 후 한쪽 끝에 1kg의 추를 매달아 130℃의 오븐에 넣어 완전히 박리되는 시간을 측정하였다.I. The heat-pressed fabric was cut to a width of 1 cm and a length of 15 cm. Then, a weight of 1 kg was hung on one end and put in an oven at 130 ° C to measure the time of complete peeling.

다. 결과: 배합 8과 배합 9에서 종래의 열가소성 폴리우레탄 핫멜트 보다 우수한 내열성을 보였다.All. Results: Formulations 8 and 9 showed better heat resistance than conventional thermoplastic polyurethane hotmelt.

3. 유동시작온도(Temperature of beginning) 시험 3. Temperature of beginning test

가. 시험목적: 열 프레스 가능 온도를 판단하기 위해 측정하였고, 일정 하중에서 온도를 올려가며 수지가 유동하기 시작하는 온도를 측정한다.end. Purpose: To measure the temperature at which hot press is possible, measure the temperature at which the resin begins to flow by increasing the temperature at a constant load.

나. 케필러리 레오미터를 이용해 핫멜트 필름이 유동하기 시작하는 온도를 측정한다.I. Use a capillary rheometer to measure the temperature at which the hot melt film begins to flow.

4. 점도 4. Viscosity

가. 통상적인 열 프레스 온도인 130℃에서 종래의 열가소성 폴리우레탄 핫멜트 필름과 유사한 점도의 핫멜트 필름 배합을 찾는 것이 중요하다. 이는 유사한 점도를 가져야만 통상의 열 프레스 조건을 변경없이 사용할 수 있어 사용의 편의성이 커진다.end. It is important to find a hot-melt film composition having a viscosity similar to that of a conventional thermoplastic polyurethane hot-melt film at a typical hot-press temperature of 130 ° C. This has the similar viscosity, so that the normal heat press condition can be used without change, which increases the usability.

나. 결과: 내열증진제를 사용하여 무재봉(No Sew) 조건인 130℃에서의 점도를 크게 향상시킬 수 있었고, 이로 인해 종래의 열가소성 폴리우레탄 핫멜트 필름과 동일 조건에서 무재봉(No Sew) 후 우수한 접착력을 확보하였다.I. RESULTS: Using the heat resistance enhancer, it was possible to greatly improve the viscosity at 130 ° C under no sewing condition. As a result, the adhesive strength after the no sewing under the same condition as that of the conventional thermoplastic polyurethane hot melt film Respectively.

이상과 같이, 본 발명에 따른 반응성 핫멜트 수지 및 상기 수지를 통상의 이형지에 코팅처리하여 제조된 반응성 핫멜트 필름은 종래의 열가소성 폴리우레탄 핫멜트 필름이나 폴리우레탄 리엑티브(PUR) 수지에 비해 접착력, 내열성, 점도 등에 있어서 우수하다는 것을 실험을 통해 확인할 수 있었으며, 아래에서는 본 발명에서 제시하는 조성물과 그 역할에 대해서 구체적으로 기술한다.As described above, the reactive hot-melt resin according to the present invention and the reactive hot-melt film produced by coating the resin on a conventional release paper have adhesive strength, heat resistance, heat resistance, and heat resistance as compared with the conventional thermoplastic polyurethane hot melt film or polyurethane reactive (PUR) Viscosity and the like, and the composition and the role of the composition of the present invention will be described in detail below.

1. 수분산 폴리우레탄 1 : 폴리에스터계 폴리우레탄으로서 접착용 수지로 녹는점(melting point)이 45~55℃이며, GPC를 이용한 분자량 측정결과 중량평균분자량 약 15만이고, 130도 점도 및 약 6만cps이다.1. Water-dispersed polyurethane 1: Polyester-based polyurethane having a melting point of 45 to 55 ° C as an adhesive resin and having a weight average molecular weight of about 150,000 as measured by GPC, 60,000 cps.

2. 수분산 폴리우레탄 2 : 폴리에스터계 폴리우레탄으로서 접착용 수지로 ㄴ녹는점(lting point)이 45~55℃이며, GPC를 이용한 분자량 측정결과 중량평균분자량 약 10만이고, 130도 점도 및 2만cps 미만이다.2. Water-dispersed polyurethane 2: Polyester-based polyurethane having a melting point of 45 to 55 ° C as an adhesive resin and having a weight average molecular weight of about 100,000, a viscosity of 130 ° C Less than 20,000 cps.

3. DMP 블록 잠재경화제 : HDI trimer, IPDI trimer에 Dimethyl pyrazole로 isocyanate group을 block 시킨 무황변 경화제이다.3. DMP Block Potential Hardener: HDI trimer, IPDI trimer, dimethylacrylate block, isocyanate group.

4. 촉매 : 주석계, 티타늄계, 비스무스계 등의 금속계 촉매 사용 가능하나 이 실험에서는 반응속도가 빠르고 규제 대상이 아닌 비스무스계를 사용한다.
5. 반응지연제 : 2,4-펜탄디온(2,4-Pentanedione) . 금속계 촉매와 상호작용하여 저온에서의 촉매활성을 지연시키며, 통상적인 우레탄 반응 지연제는 acid계열 물질들로써 저온에서의 우레탄 반응시작을 지연할 수 있지만, 적절한 반응속도를 보여야 하는 고온에서도 전체적인 반응속도를 늦추는 단점이 있다. 상기 2,4-펜탄디온(2,4-Pentanedione) 은 상온에서의 지연성능이 우수할 뿐 아니라 무재봉(No Sew) 조건에서 금속계 촉매의 활성을 충분히 회복시켜주는 장점이 있다.

4. Catalyst: It is possible to use metal-based catalysts such as tin, titanium, and bismuth. However, in this experiment, a bismuth system is used which has a high reaction rate and is not regulated.
5. Reaction retardant : 2,4-pentanedione . The reaction of the catalyst with the metal catalyst is delayed and catalytic activity at low temperature is delayed. The urethane reaction retardant is an acid-based material and can delay the initiation of the urethane reaction at low temperature. However, even at a high reaction temperature, There is a drawback to slowing down. The 2,4-pentanedione has an advantage of being excellent in the retardation performance at room temperature and sufficiently restoring the activity of the metal-based catalyst under no -saw condition.

6. 내열증진제 : 나노실리카를 사용하는 것이 바람직하며, 사용한 수성폴리우레탄 1과 수성폴리우레탄 2는 기존의 무재봉(No Sew) 조건인 130℃, 압력 70kgf에서 종래의 열가소성 핫멜트보다 점도가 낮아서 동일 조건으로 무재봉(No Sew) 작업을 할 경우 낮은 점도로 인해 소재에 과침투될 수 있다. 이러한 과침투는 접착력의 저하를 초래할 수 있으며, 과침투를 막기 위해서는 온도나 압력을 낮추어야 해서 사용의 편의성이 현격히 떨어지게 된다. 본 발명의 나노실리카 첨가제는 수성폴리우레탄 수지의 무재봉(No Sew) 온도에서의 점도를 크게 향상시켜 주어서 무재봉(No Sew) 후 소재의 경계면에 충분한 양의 수지를 잔류시킬 수 있게 한다. 종래의 열가소성 핫멜트 수지와 동일 조건의 무재봉(No Sew)에 바로 적용할 수 있어 편의성을 확보한다. 본 발명에서 내열증진제로 사용하는 나노실리카의 사이즈는 5~50nm 정도가 바람직하다.6. Heat resistance enhancer: It is preferable to use nano silica. The aqueous polyurethane 1 and the aqueous polyurethane 2 used have viscosity lower than conventional thermoplastic hot melts at 130 ° C. and 70 kgf, which is a no sew condition, If no sewing is performed under conditions, the material may be infiltrated due to low viscosity. Such penetration may cause deterioration of adhesive strength, and in order to prevent over-penetration, the temperature and pressure must be lowered so that the convenience of use is significantly reduced. The nanosilica additive of the present invention greatly improves the viscosity of the aqueous polyurethane resin at the No Sew temperature and allows a sufficient amount of resin to remain on the interface of the material after no sewing. It can be immediately applied to the non-sewing (No Sew) under the same conditions as those of the conventional thermoplastic hot-melt resin, thereby ensuring convenience. The size of the nanosilica used as the heat resistant promoter in the present invention is preferably about 5 to 50 nm.

삭제delete

Claims (4)

반응성 핫멜트 수지의 조성물에 있어서,
폴리우레탄 수지 ;
DMP(Dimethylpyrazole, 디메틸피라졸)형 이소시아네이트 블록화제 ;
2,4-펜탄디온(2,4-Pentanedione) ;
나노실리카 를 포함하여 이루어지는 것을 특징으로 하는 반응성 핫멜트 수지의 조성물.
In the composition of the reactive hot-melt resin,
Polyurethane resin ;
A DMP (dimethylpyrazole, dimethylpyrazole) type isocyanate blocking agent ;
2,4-pentanedione ;
The composition of claim 1, wherein the reactive hot-melt resin comprises nano-silica .
삭제delete 삭제delete 삭제delete
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102131606B1 (en) 2020-02-19 2020-07-08 박희대 Dot-laminated shoe insole used adhesive resin mixed with hydrophobic nano silica and manufacturing process thereof
US11286373B2 (en) 2019-10-04 2022-03-29 Heedae Park Hydrophobic nano silica mixed thermoplastic hot-melt film with excellent adhesive strength
KR102440469B1 (en) 2021-11-29 2022-09-06 삼부정밀화학 주식회사 Hot-melt film comprising biomass-base thermoplastic polyurethane resin
KR20240033840A (en) * 2022-09-06 2024-03-13 주식회사 대동농기계 Non-pneumatic tire with improved tread and spoke part bonding process efficiency and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190118345A (en) 2018-04-10 2019-10-18 주식회사 엘지화학 Method for preparing metal complex catalyst and metal complex catalyst prepared thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101760166A (en) * 2009-12-22 2010-06-30 广州鹿山新材料股份有限公司 Non-yellowing thermoplastic polyurethane hot melt adhesive and preparation method thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101760166A (en) * 2009-12-22 2010-06-30 广州鹿山新材料股份有限公司 Non-yellowing thermoplastic polyurethane hot melt adhesive and preparation method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11286373B2 (en) 2019-10-04 2022-03-29 Heedae Park Hydrophobic nano silica mixed thermoplastic hot-melt film with excellent adhesive strength
KR102131606B1 (en) 2020-02-19 2020-07-08 박희대 Dot-laminated shoe insole used adhesive resin mixed with hydrophobic nano silica and manufacturing process thereof
US11882900B2 (en) 2020-02-19 2024-01-30 Heedae Park Dot bonding shoe insole using adhesive resin mixed with hydrophobic nano-silica and manufacturing thereof
KR102440469B1 (en) 2021-11-29 2022-09-06 삼부정밀화학 주식회사 Hot-melt film comprising biomass-base thermoplastic polyurethane resin
US11912839B2 (en) 2021-11-29 2024-02-27 Sam Bu Fine Chemical Co., Ltd. Hot melt film containing biomass-based thermoplastic polyurethane resin
KR20240033840A (en) * 2022-09-06 2024-03-13 주식회사 대동농기계 Non-pneumatic tire with improved tread and spoke part bonding process efficiency and manufacturing method thereof
KR102677597B1 (en) 2022-09-06 2024-06-21 주식회사 대동농기계 Non-pneumatic tire with improved tread and spoke part bonding process efficiency and manufacturing method thereof

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