KR101898122B1 - Vacuum Device and Manufacturing Process Of The Same Which Comprises Vacuum Brazing - Google Patents

Abstract

According to one aspect of the present invention, a vacuum device increasing efficiency of a manufacturing process comprises: a first base material having a first bonding surface disposed around an inner space forming a vacuum state; a second base material having a second bonding surface facing and bonded to the first bonding surface; a bonding material layer sealing the inner space with respect to the outer space between the first bonding surface and the second bonding surface and formed by melting and solidifying a paste filler material; and a residual accommodating unit formed at a portion of a plane constituting the first bonding surface to be lower than the plane and accommodating a residual solidified since a filler material is melted.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a vacuum device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum device and a process for manufacturing the vacuum device, and more particularly, to a vacuum brazing process using a paste filler and a vacuum device to which the process is applied.

The vacuum element generally includes a ceramic material that forms an electrode, an insulating housing, a spacer, or the like. Glass, sapphire, or the like. In order to miniaturize the vacuum element and improve reliability, it is very important to secure a high vacuum withstand pressure at the junction of the non-metallic material and the metallic material such as the substrate and the housing.

Vacuum brazing has been applied to manufacture vacuum devices. Brazing is a widely used joining technique because it has the advantage of melting only joining materials without damaging the base material. Vacuum brazing is a brazing process in a vacuum chamber. By forming the inside of the vacuum device with a desired degree of vacuum, It is useful because the airtightness can be ensured through the bonding.

However, it is not simple to secure the airtightness at the joint portion of the dissimilar materials such as the joint between the ceramic material and the metal material. In this case, the surface of the ceramic material must be metalized before brazing with the metal material. For example, in order to braze an alumina ceramic material to a metal material, a molybdenum (Mo) -manganese (Mn) layer is first formed on the surface of the alumina ceramic material, and then nickel (Ni) Metalization process should be carried out. Moreover, it is practically impossible to join the brazing material, which is difficult to metallize itself, such as a sapphire substrate.

Recently, an active brazing filler (active brazing filler) capable of brazing with a metal material without metalizing the ceramic material has been developed. However, in the case of commercially available solid active ingredients, the sealing performance is poor and is not suitable for vacuum brazing. Most of the active ingredients in the industry that have been tested to some degree of sealing performance are provided in paste form, which is also difficult to apply to vacuum brazing. For example, when a paste-like filler is applied between the first base material constituting the body of the vacuum element and the second base material constituting the body of the vacuum element in the vacuum brazing preparation step and the superficial materials are superimposed thereon, So that the degree of vacuum inside the device can no longer be increased.

The present invention proposes a manufacturing method and a structure of a vacuum device suitable for the vacuum device, which can increase the degree of vacuum inside the device while securing the sealing performance by utilizing the paste-like filler material in the vacuum brazing of different materials It has its purpose.

In order to solve the above-mentioned problems, a vacuum device according to an aspect of the present invention includes: a first base material having a first bonding surface disposed around an inner space forming a vacuum state; A second base material having a second bonding surface bonded to the first bonding surface in a face-to-face manner; A bonding material layer sealing the inner space between the first bonding surface and the second bonding surface with respect to the outer space and formed by melting and solidifying the paste fusing material; And a residue accommodating portion formed at a portion of a plane constituting the first joint surface, the accommodating portion being formed lower than the flat surface and containing the solidified solidified material in a molten state.

The residue accommodating portion may be disposed on the opposite side of the inner space with respect to the portion to which the paste material is applied on the first joint surface.

The volume of the residue accommodating portion may be formed to be equal to or larger than the volume of the solid consumable material so that the residue does not overflow the first joint surface.

The residue receiving portion may be disposed along two or more of the first joint surfaces.

Either one of the first base material and the second base material may be made of a metal material and the other one may be made of ceramic or sapphire material.

In the vacuum device, the first base material may be made of a metal material, the second base material may include a sapphire substrate, and an electron emission source disposed in the inner space.

According to an aspect of the present invention, there is provided a method of manufacturing a vacuum device, the method including: forming a first base material having a first bonding surface disposed around an inner space and a second base material having a second bonding surface bonded to the first bonding surface, 2 base material preparing step for preparing the base material; A paste material is applied to the first bonding surface so as to surround the periphery of the inner space and a solid adhesive material is applied to at least one portion of the first bonding surface so as to support the second bonding surface at a height higher than the height at which the paste- A brazing preparation step of forming a gap through which air escapes from the inner space to the outside; And a vacuum joining step of cooling the inner space in a sealed state by heating the mixture to a temperature equal to or higher than a melting point of the solid filler and the paste filler in a vacuum chamber while increasing the degree of vacuum; .

The solid filler may have a melting point temperature lower than the melting point temperature of the paste filler.

The first base material may be formed so as to include a residue accommodating portion formed in at least a portion of the first abutting surface to be lower than a plane constituting the first abutting surface and configured to receive the molten solid abutting material.

The first base material may be made of a metal material, and the second base material may be formed to include a sapphire substrate.

According to the present invention, there is provided a vacuum element having a sealing performance and a high degree of vacuum, and a manufacturing method capable of effectively manufacturing the same. More specifically, the present invention enables a vacuum brazing bonding of a ceramic, sapphire, and a different material such as metal using metallurgy, without using metallization, by using a paste-like filler material having a sealing performance, thereby improving the manufacturing process efficiency and reliability .

1 shows a junction of a vacuum device according to an embodiment of the present invention.
2 is a sectional view taken along line II-II 'of FIG.
FIG. 3 shows a vacuum brazing process of the joint of FIG.
4 shows a portion of a junction of a vacuum device according to an embodiment of the present invention.
FIG. 5 shows a section V-V 'before and after melting the solid filler in FIG.
6 shows a junction of a vacuum device according to an embodiment of the present invention.
Fig. 7 shows various examples of solid fillers applicable to the practice of the present invention.
Figure 8 shows a junction of a vacuum element according to various embodiments of the present invention.
FIG. 9 shows a vacuum degree test result for an electron emission source (vacuum element) to which the present invention is applied.

Hereinafter, various embodiments of the present invention will be described with reference to the drawings. The technical idea of the present invention can be understood more clearly by way of examples. Furthermore, the present invention is not limited to the embodiments described below, but may be modified into various forms within the scope of the technical idea.

1 shows a junction of a vacuum device according to an embodiment of the present invention. 2 is a sectional view taken along line II-II 'of FIG.

This figure shows a portion of a vacuum element according to one embodiment. The vacuum device according to the present embodiment includes a first base material 11 forming at least a part of the inner space 110 and a second base material 21 functioning as a cover structurally, Respectively. As a more specific example, the first base material 11 may be a metal electrode member formed to surround the opening of the upper portion of the inner space 110. A first bonding surface 111 is formed on the first base material 11. The second base material 21 may be made of a non-metallic material such as a ceramic or a semiconductor material, and may be, for example, a sapphire substrate. A portion of the bottom surface of the second base material 21 that is close to the outer periphery thereof forms a second bonding surface 211 to be bonded to the first bonding surface 111 in facing relation. In the illustrated embodiment, the first joining face 111 is located at the upper end of the first base material 11 so that the main components of the present invention are conspicuous, but the position of the first joining face 111 is And may be deformed into another shape, such as being disposed with a stepped portion inside the upper surface.

In the preparation step of bonding and sealing the first base material 11 and the second base material 21 during the manufacturing process of the vacuum device according to the present invention, the inner space 110 is formed on the first bonding surface 111, A paste-like material 31 is applied so as to surround the periphery of the opening. The paste-like material 31 may be an active brazing filler material capable of brazing a sapphire substrate with a metal material without metalizing, and may be a paste-like filler whose sealing performance is confirmed.

On the other hand, a solid filler material 32 is disposed on a part of a plane constituting the first bonding surface 111. The solid filler material 32 is disposed so as to protrude from the upper surface of the paste fountain material 31 applied as described above so as to support the second bonding surface 211, that is, the bottom surface of the sapphire substrate. The solid filler material 32 may be disposed in the residue receiving portion 112 provided at one side of the first bonding surface 111. [ The residue accommodating portion 112 is formed at a portion of a plane constituting the first joint surface 111 to be lower than the plane, and in terms of shape and volume, the solid accommodating portion 32 is in a molten state, So as to accommodate the residue.

FIG. 3 shows a vacuum brazing process of the joint of FIG.

The vacuum brazing process includes a first base material 11 having a first bonding surface disposed around the inner space 110 and a second base material 11 having a second bonding surface bonded to the first bonding surface, 21); (31) is coated on the first bonding surface so as to surround the periphery of the inner space (110), and at least one portion of the first bonding surface is coated with the paste A brazing preparation step of disposing a solid filler material (32) so as to support the joint surface, thereby forming a gap to allow air to escape from the internal space (110) to the outside; And a vacuum joining step of cooling the internal space (110) in a sealed state by heating to a temperature equal to or higher than a melting point of the solid sticking material (32) and the paste sticking material (31) in a vacuum chamber while increasing the degree of vacuum. .

(A) shows a state in which the air in the inner space 110 is discharged to the outside of the first and second base materials 11 and 21 in the vacuum chamber in a state where the base material preparing step and the brazing preparation step are completed. (Av) to increase the degree of vacuum. At this time, since the solid filler material 32 supports at least a part of the second base material 21 in a state where it is raised higher than the height at which the paste filler material 31 is applied as described above, A gap is formed between the two base materials 11 and 21 so that the air can communicate with each other even though the liquid is close to a liquid having a high viscosity. Accordingly, the internal space 110 can be made to have a high degree of vacuum required for a vacuum device.

In the figure, (b) shows a state in which the internal temperature reaches the melting point of the solid filler in the vacuum chamber while the degree of vacuum is sufficiently raised. It is preferable that the melting temperature of the solid filler is lower than the melting point of the paste filler (31). When the temperature reaches the melting point of the solid filler material, the solid filler material melts and becomes solid in the above-mentioned residue accommodation section (see 32M). At this time, the portion where the second base material 21 is held is lowered and contacted with the paste filler material 31 .

In the drawing, (c) shows a state in which the temperature in the vacuum chamber is raised to the melting point temperature or higher of the paste fusing material, and then cooled to cool the paste fusing material between the two base materials 11 and 21 and then solidify again to form a bonding material layer 31M It shows.

Meanwhile, although not shown here, when the vacuum brazing joint according to the present invention is proceeded, the processes shown in the above (a) to (c) can be performed in a state where the weight is raised on the upper portion of the second base material 21 have. This can improve the sealing performance.

4 shows a portion of a junction of a vacuum device according to an embodiment of the present invention.

This figure is a more specific illustration of the shapes of the residue accommodating portion 112 and the solid consumable material 32 in the first base material 110, and the respective constituent elements are the same as those in the above-described embodiment . The residue accommodating portion 112 is formed in a concave groove shape to accommodate the solid support member 32 when the solid support member 32 is melted and also has a function of supporting the solid support member 32 so that it does not collapse until it is melted . Also, the solid filler material 32 may be formed in a conical shape or the like so that the solid filler material 32 can stand stably.

FIG. 5 shows a section V-V 'before and after melting the solid filler in FIG.

(a) is the same as described above before the solid filler metal 32 is melted. (b) shows a state (32M) in which the solid consumable material is melted and remains in the residue accommodating portion 112. For convenience, this is called residue 32M. At this time, it is preferable that the height of the residue 32M is equal to or lower than the height of the first joint surface 111. [ To prevent the sealing performance from being lowered by mixing with the paste fusing material (31) overflowing to the first bonding surface (111).

6 shows a junction of a vacuum device according to an embodiment of the present invention.

This figure is a view of the first base material 11, the paste base material 31 and the solid base material 32 as seen from above on the first bonding surface 111. As in this embodiment, the above- And the solid filler material 32 may be disposed at a plurality of positions along the first bonding surface 111. In this case, a sufficient clearance can be secured so that a large number of solid pourable materials 32 lift the second base material as a whole and the air can easily escape from the inner space.

Fig. 7 shows various examples of solid fillers applicable to the practice of the present invention.

As described above, there is no particular limitation on the shape of the solid filler as long as the solid filler has a shape, size and rigidity capable of supporting the load of the second base material by being raised higher than the height of the paste filler coated with the upper end. For example, various shapes of solid fillers such as a cylindrical solid filler 32a, a prismatic solid filler 32b, a conical solid filler 32c, or a conical solid filler 32d can be applied. However, cone shape or cone shape can be advantageous in terms of posture stability and structural rigidity.

On the other hand, in the embodiments described above with reference to Figs. 1 to 6, when the residue accommodating portion and the solid consumable material are located on the outer side of the paste material application position, that is, on the opposite side of the inner space, . This arrangement is advantageous in that no unnecessary residue is left in the internal space of the vacuum element. However, the present invention is not limited thereto.

Figure 8 shows a junction of a vacuum element according to various embodiments of the present invention.

(a) shows a case where the residue accommodating portion 112 and the solid filler material 32 are disposed inside the paste filler material 31 coated with the residue. The residue of the solid filler may not be a problem even if the residue of the solid filler is exposed to the inner space of the vacuum device and the paste filler 31 is melted so that the first joint surface 111 is completely wet, When the bonding material layer is formed so as to surround the periphery, the solid sticking residue may not be exposed to the inner space.

(b) shows an arrangement in which an outer paste reservoir 311 and an inner paste reservoir 312 are coated with the residue reservoir 112 and the solid reservoir 32 at the center. In this case as well, it is possible to prevent the solid resorbable material residue from being exposed to the inner space.

On the other hand, (c) shows the paste-like material 31 coated with the rod-shaped solid filler 32L as a base and arranged in a lean-like shape. Since the viscosity of the paste fusing material 31 is high, a part of the rod-shaped solid fusing material 32L may be supported while being slightly buried thereon to support the load of the second base material.

FIG. 9 shows a vacuum degree test result for an electron emission source (vacuum element) to which the present invention is applied.

Although it is not known how to directly measure the degree of vacuum after the completion of the vacuum element, a vacuum element having an electron emission source is indirectly manufactured, and by repeatedly observing the electron emission characteristic thereof about 3 to 4 times, The vacuum degree of the space can be confirmed. When the degree of vacuum is sufficiently high, the emission current does not substantially decrease after the electron emitter is aged. However, when the degree of vacuum is low, the emission current decreases according to the number of repetition of emission due to the influence of gas remaining in the internal space to be.

As shown in the graph, the vacuum device according to the present invention exhibits almost the same emission current value at the second and third time electron emission, and thus it can be confirmed that a sufficiently high degree of vacuum is secured.

11: First base material
110: inner space 112:
21: Second base material 31: Paste material
32: Solid matter

Claims (10)

A first base material having a first bonding surface disposed around an inner space forming a vacuum state;
A second base material having a second bonding surface bonded to the first bonding surface in a face-to-face manner;
A bonding material layer sealing the inner space between the first bonding surface and the second bonding surface with respect to the outer space and formed by melting and solidifying the paste fusing material; And
And a residue accommodating portion formed at a portion of a plane constituting the first joint surface to be lower than the flat surface and accommodating a residue solidified and solidified in a molten state of the solid consumable material,
Wherein one of the first base material and the second base material is a metal material and the other is a ceramic or sapphire material,
Vacuum element. The method according to claim 1,
Wherein the residue accommodating portion is disposed on the opposite side of the inner space with respect to the portion to which the paste-
Vacuum element. The method according to claim 1,
And the volume of the residue accommodating portion is formed to be equal to or larger than the volume of the solid consumable material, so that the residue does not overflow the first joint surface,
Vacuum element. The method according to claim 1,
Wherein the residue receiving portion is disposed at least two along the first abutment surface,
Vacuum element. delete The method according to claim 1,
Wherein the first base material is made of a metal material,
Wherein the second base material comprises a sapphire substrate,
Further comprising an electron emission source disposed in the inner space,
Vacuum element. A base material preparing step of preparing a first base material having a first bonding surface disposed around the inner space and a second base material having a second bonding surface facing the first bonding surface;
A paste material is applied to the first bonding surface so as to surround the periphery of the inner space and a solid adhesive material is applied to at least one portion of the first bonding surface so as to support the second bonding surface at a height higher than the height at which the paste- A brazing preparation step of forming a gap through which air escapes from the inner space to the outside; And
A vacuum joining step of cooling the inner space in a sealed state by heating to a temperature equal to or higher than a melting point of the solid filler and the paste filler in a vacuum chamber while the degree of vacuum is increased; Lt; / RTI >
In the base material preparation step, one of the first base material and the second base material is a metal material, and the other is a ceramic or sapphire material.
A method of manufacturing a vacuum device. 8. The method of claim 7,
The solid filler has a melting point lower than the melting point of the paste,
A method of manufacturing a vacuum device. 8. The method of claim 7,
Wherein the first base material is formed to include at least a part of the first bonding surface and a residue receiving portion formed to receive the molten solid filler metal lower than a plane constituting the first bonding surface,
A method of manufacturing a vacuum device. 8. The method of claim 7,
Wherein the first base material is made of a metal material,
Wherein the second base material comprises a sapphire substrate,
A method of manufacturing a vacuum device.

Images