KR101894744B1 - Trap apparatus - Google Patents

Abstract

The present invention relates to a trap apparatus, and more particularly, to a trap apparatus having a redundancy trap for switching a trap apparatus. To this end, a plurality of branching portions for branching reaction byproducts including unreacted process gas supplied from the process chamber into multiple paths, a plurality of trapping portions for trapping reaction byproducts including unreacted process gases, and a plurality of trapping portions And a path switching unit that sets a path so that reaction byproducts including unreacted process gases are supplied to either one of the plurality of trap units.

Description

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a trap apparatus, and more particularly, to a trap apparatus having a redundancy trap for switching a trap apparatus.

Generally, during the semiconductor manufacturing process using the semiconductor device manufacturing apparatus, the process chamber does not react during the process, and residual unreacted gases and reaction by-products generated incidentally as the reaction progresses are present in large quantities. The reaction by-products containing such unreacted gases are exhausted to the outside by an exhaust system formed at one side of the process chamber. Briefly, a predetermined reaction gas is introduced into the reaction chamber to perform a predetermined reaction process, and then the unreacted gas and the reaction by-products are exhausted through the exhaust pipe. However, when the unreacted gas in the high-temperature reaction chamber is exhausted to the exhaust pipe at a low temperature, the gaseous unreacted gas becomes solid particles. Particles and reaction byproducts due to the unreacted gas are accumulated in the pump, and the lifetime of the pump is rapidly shortened.

In order to solve this problem, a collecting device (or trap device) for collecting unreacted gas and reaction byproducts is provided between the reaction chamber and the pump to prevent damage to the pump due to unreacted gas and reactive impurities. However, the conventional collecting device system has a problem that the manufacturing process itself can not be stopped at the time of maintenance of the collecting device. In addition, the conventional trapping apparatus can not perfectly capture unreacted byproducts, and some unreacted by-products obstruct the operation of the pump, thereby causing a change in the pressure inside the chamber or causing a failure of the chamber.

Korean Registered Patent No. 10-1126604 (entitled "Collecting Apparatus") Korean Patent Laid-Open No. 10-2004-0074271 (entitled " Semiconductor Production Equipment Having a Cooling Trap) Korean Patent Registration No. 10-1362437 (entitled: Trapping Device for Semiconductor Manufacturing)

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a duplication trap apparatus which can continuously operate a semiconductor manufacturing process by switching to another trap apparatus during maintenance of one trap apparatus, By collecting by hot trap first and collecting by cooling traps secondarily, it is possible to maximize the collection efficiency and to solidify uncoloured unreacted byproducts by cooling so that unreacted byproducts etc. are introduced into the pump Thereby preventing the pressure inside the chamber from being changed due to failure of the pump or the failure of the pump.

However, the objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

It is an object of the present invention described above to provide a process for the production of a process gas comprising a plurality of branch portions for multiplying reaction byproducts including unreacted process gases supplied from the process chamber, And a path switching unit for setting the path so that reaction byproducts including unreacted process gases are supplied to either one of the plurality of trapping portions by controlling the path direction of the branching portion of the trapping portion .

The plurality of branching units may include an input side branching unit for supplying reaction byproducts including the unreacted process gas supplied from the process chamber to one of the plurality of trapping units in accordance with path switching of the path switching unit, And an output side branching part which is supplied with reaction byproducts or particles which have not been collected from any one of the trapping parts of the plurality of trapping parts and sends the collected byproducts or particles to the pump side and operates in cooperation with the input side branching part.

The plurality of trapping portions may include a first and a second trap that receive reaction byproducts including unreacted process gases from the input side branching portion in accordance with path switching of the path switching portion and collect the trapped byproducts and discharge the uncollected reaction byproducts or particles through the output side branching portion, .

During normal operation, either one of the first and second trapping portions is activated and collected in accordance with the path switching of the first and second trapping portions. During the maintenance of the trapping portion, the trapping portion other than the trapping portion, So that the first and second trap portions can be switched to each other to continuously operate the process without stopping the process.

It is another object of the present invention to provide a method for manufacturing a semiconductor device, in which first and second trap portions each include a hot trap portion for primarily collecting reaction byproducts including liquid particle generation and unreacted process gas by heating, Includes a cooling trap for solidifying and collecting liquid particles

In addition, some of the particles that are solidified by cooling in the cooling trap part accumulate in the region of the cooling trap, and the particles solidified by the remaining cooling are supplied to the pump side so that vaporization or reaction does not occur in the pump, .

Further, the hot trap portion is located on the upper side on the flow path of the unreacted process gas, and the cooling trap portion is located on the lower side of the hot trap portion.

The hot trap portion includes a heater portion heated by a hot wire, and a fin type heater having a fin portion provided in a corrugated shape in the circumferential direction of the heater portion to widen the contact area.

The cooling trap portion includes a cooling portion cooled by the cooling water, and a pin type cooler provided with a pin portion which is provided in a corrugated shape in the circumferential direction of the cooling portion to widen the contact area.

It is another object of the present invention to provide an apparatus and a method for manufacturing a semiconductor device, which comprises a hot trap part that receives reaction by-products including unreacted process gas supplied from a process chamber and primarily collects reaction by- And a cooling trap part for solidifying and collecting the liquid particles generated in the hot trap part by cooling the hot trap part and the cooling trap part.

In addition, some of the particles that are solidified by cooling in the cooling trap part accumulate in the region of the cooling trap, and the particles solidified by the remaining cooling are supplied to the pump side so that vaporization or reaction does not occur in the pump, .

Further, the hot trap portion is located on the upper side on the flow path of the unreacted process gas, and the cooling trap portion is located on the lower side of the hot trap portion.

The hot trap portion includes a heater portion heated by a hot wire, and a fin type heater having a fin portion provided in a corrugated shape in the circumferential direction of the heater portion to widen the contact area.

The cooling trap portion includes a cooling portion cooled by the cooling water, and a pin type cooler provided with a pin portion which is provided in a corrugated shape in the circumferential direction of the cooling portion to widen the contact area.

The width of the region where the hot trap portion and the cooling trap portion are connected to each other is about 100 to 700 mm.

As described above, according to the present invention, there is an effect that the semiconductor manufacturing process can be continuously performed by switching and operating another trap device at the time of repairing any trap device by providing the duplication trap device.

According to the present invention, it is possible to maximize the collection efficiency by primarily collecting by the hot trap and collecting by the cooling trap in the secondary, and by cooling the unreacted byproducts or the like to prevent reaction or deposition from occurring in the pump, Can be prevented.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate preferred embodiments of the invention and, together with the description, serve to further the understanding of the technical idea of the invention, It should not be construed as limited.
FIG. 1 and FIG. 2 are diagrams showing the overall configuration of a duplicated trap system according to an embodiment of the present invention,
3 is a view showing a hot trap part and a cooling trap part according to an embodiment of the present invention,
4 and 5 are views showing a fin type heater according to an embodiment of the present invention,
6 is a view showing a trapping region of unreacted by-products collected by the cooling trap unit according to an embodiment of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. In addition, the embodiment described below does not unduly limit the content of the present invention described in the claims, and the entire structure described in this embodiment is not necessarily essential as the solution means of the present invention. In addition, the description of the prior art and those obvious to those skilled in the art may be omitted, and the description of the omitted components and the function may be sufficiently referred to within the scope of the technical idea of the present invention.

The trap apparatus according to an embodiment of the present invention is a trap apparatus for trapping unreacted gas remaining unreacted during the process of manufacturing the semiconductor in the process chamber and reaction byproducts incidentally generated as the reaction progresses Device. Hereinafter, a trap device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIGS. 1 and 2, the process chamber 100 is a chamber through which a semiconductor manufacturing process is performed. In the process chamber, a reaction gas is supplied to manufacture a semiconductor. At this time, unreacted gases remaining unreacted and reaction byproducts generated as the reaction progresses while the semiconductor process proceeds in the process chamber are pumped by a pump 500 provided outside the process chamber 100, Exhausted. When the unreacted gas in the high-temperature process chamber 100 is exhausted to the outside of the chamber through the low-temperature exhaust pipe, the phase transition to the solid state particles occurs. Therefore, unreacted gas, reaction by-products, and particles (hereinafter referred to as reaction by-products) discharged to the outside through the exhaust pipe due to the pumping action of the pump 500 are collected by the trap device according to an embodiment of the present invention . Although the conventional trap device captures such reaction by-products and the like, the present invention maximizes the collection efficiency of reaction byproducts and also enables a duplication trap device (hereinafter, referred to as " trap trap device " Or a multi-trap device).

Unreacted gas and reaction by-products exhausted by the pumping of the pump 500 in the process chamber 100 are exhausted through the input side exhaust pipe 210 and discharged to the pump 500 through the output side exhaust pipe 230. In the present invention, the input-side three-way valve unit 310 and the output-side 3-way valve unit 320 are provided, and the first and second trap units are provided in communication with the three-way valve unit. The input-side three-way valve unit 310 is in communication with the input-side exhaust pipe 210 and the first and third branch exhaust pipes 221 and 223, so that reaction by-products and the like can be exhausted to the duplication trap apparatus. The output side three-way valve unit 320 communicates with the output side exhaust pipe 230 and the second and fourth branch exhaust pipes 222 and 224 to separate particles and reaction byproducts solidified by the cooling which have not been collected in the duplex trap device, ). ≪ / RTI > As described above, the unreacted gas discharged from the high-temperature chamber to the low-temperature exhaust pipe becomes solid particles, and the particles and reaction by-products are exhausted to the pump 500 without being trapped by the trap device, . At this time, if the generated particles are discharged to the pump 500, the conventional trap device reacts to the pump 500 or deposits the particles on the pump 500, thereby causing the pump 500 to fail. However, according to the present invention, reaction by-products or particles not collected in the trap device are cooled and discharged, so that there is no possibility of reacting with the trap device or depositing on the trap device, and the failure rate of the pump 500 can be drastically reduced. Therefore, the conventional trap device discharges the reactive particles, but in the present invention, particles that fail to react are discharged by cooling the particles.

The input-side three-way valve unit 310 (input-side branching unit) and the output-side 3-way valve unit 320 (output-side branching unit) according to the embodiment of the present invention are branched in three directions. In other words, referring to an example of the input side branch 310 shown in FIG. 3, a first trap (not shown) communicates with the process chamber 100 in the first direction (Z axis) And is communicated with the second trap portion 420 in the third direction (-Y axis or X axis). At this time, either the second direction or the third direction is selected in accordance with the switching of the path switching unit 600, and the reaction gas and the reaction by-products supplied from the process chamber 100 are selected to pass through the selected path (the first path 10) Or the second path 20). The output side three-way valve unit 320 is also branched in three directions in the same manner as the input side three-way valve unit 310, communicates with the pump 500 in the first direction, And communicates with the trap portion.

On the other hand, when the path is selected in any one direction (e.g., the second direction), each of the three-way valve portions is closed in the other direction (for example, the third direction), the trap device in communication with the selected path is operated, The trap device stops operating. At this time, it is possible to perform the maintenance of the trap apparatus which stops the operation.

The path switching unit 600 controls to select the path of the 3-way valve unit 310 described above. That is, for example, in order to operate the first trap part 410, the path switching part 600 selects a path in a second direction of the input side 3-way valve part and the output side 3-way valve part, and closes the path in the third direction do. In order to operate the second trap part 420, the path switching part 600 selects the path in the third direction of the input side 3way valve part and the output side 3way valve part, and closes the path in the second direction. In this case, the path switching unit 600 is embodied as a microcontroller, and can automatically control the 3way valve unit from the remote control by the user. Further, the path switching unit 600 is embodied as a manual switch, The valve portion may be manually operated. Any path valve of the input side 3-way valve portion is opened (the other path valve is closed) according to the operation of the path switching portion 600, regardless of the implementation of the path switching portion 600, ) Or the second path 20, so that the trap device in communication with the selected path is operated. The 3way valve on the output side also operates in conjunction with the 3way valve on the input side, and the 3way valve on the output side is controlled so as to communicate with the trap device that is currently operating.

The duplication trap apparatuses 410 and 420 according to an embodiment of the present invention include a hot trap unit and a cooling trap unit (or a cooling trap unit), respectively, as shown in FIG. Since the hot trap portion and the cooling trap portion provided in the first trap portion 410 and the second trap portion 420 are identical to each other, only the hot trap portion and the cooling trap portion of the first trap portion 410 will be described The hot trap portion and the cooling trap portion of the second trap portion will be replaced with the description of the first trap portion.

First, the hot trap portion 411 is located on the upper side close to the process chamber 100 as shown in FIG. 3, and the cooling trap portion 412 is located on the lower side of the hot trap portion 411. The reaction byproducts and the like are moved along the movement path 30 in the hot trap portion 411 and the cooling trap portion 412. The hot trap portion 411 is primarily trapped and trapped in the hot trap portion 411, And secondarily, the cooling trap part 412 collects reaction by-products and the like.

The hot trap portion 411 collects reaction byproducts and the like by heating using the fin type heater 50. The pin-type heater 50 may be a straight type as shown in FIG. 4 and a curved type as shown in FIG. The pin-type heater 50 shown in Figs. 4 and 5 can be roughly constituted by the heater portion 51, the fin portion 52, and the first and second port portions 53 and 54. As shown in FIG. 3, the first and second ports are connected to the power source unit 700 to supply electricity to the heater unit 51. The heater section 51 may be embodied as a "sheath heater ". The fin portion 52 is formed as a corrugated pipe or a fin as a whole in order to increase the contact area (or reaction area) with reaction byproducts and the like. The cross-sectional shape of the fin portion 52 is preferably circular or elliptical, but the shape may be changed as necessary. And may be a rectangular shape as an example. On the other hand, the fin portion 52 is provided so as to surround the heater portion 51 in the circumferential direction. As shown in FIG. 3, the plurality of pin-type heaters 50 are sequentially spaced apart from each other by a predetermined distance, and are provided in the first trap portion 410.

The hot trap part 41 minimizes the size of particles or reaction byproducts by heating the temperature of the air inside the trap to minimize the reaction in the pump 500, thereby preventing the pump 500 from failing. In addition, by increasing the contact area by the fin portion 52, the collection efficiency can be maximized and the temperature can be increased more quickly. In the hot trap portion 41, particles generated by passing through a low-temperature exhaust pipe are converted into liquid particles by heating, and the liquid particles and reaction by-products are trapped.

The pin-type cooling trap unit 412 collects reaction by-products and the like by cooling air by cooling water. The pin-type cooler has the same structure as that of the pin-type heater 50 as shown in Fig. However, a structural difference is that a cooling line (61 or a cooling pipe) to which cooling water is supplied is provided instead of the heater unit (51). A pin portion is formed in the outer circumferential direction of the cooling line to increase the contact area. Therefore, the overall structure is the same as that of the pin type heater shown in Figs. 4 and 5 except that a cooling pipe is provided in place of the heater 51 and cooling water is supplied from the cooling water supply part.

The pin-type cooling trap unit 412 receives cooling water from the cooling water supply unit 800, and the supplied cooling water flows through the cooling line 61, thereby cooling the internal temperature of the cooling trap unit 412. Further, the contact surface area can be widened by the fin portion formed in the outer circumferential direction of the cooling line, so that the temperature of the air can be lowered more quickly and efficiently. However, the conventional cooling trap does not have a fin portion outside the cooling line. The cooling trap portion 412 solidifies and collects the liquid particles formed in the hot trap portion 411 by cooling them as soon as possible. At this time, particles and reaction byproducts not collected in the cooling trap portion 412 are supplied to the pump 500. In the conventional trap device, reactive (or vaporizable) particles are supplied to break the pumper. However, in the present invention, since the reactive particles and reaction by-products generated in the hot trap part are solidified by instant cooling in the cooling trap part, the possibility of deposition on the pump 500 is low, Can be prevented.

As shown in FIG. 6, the reaction by-products and the like move along the movement path 30 from the hot trap portion to the cooling trap portion. The width of the region 70 in which the hot trap portion and the cooling trap portion come into contact with each other (or meet each other) is approximately 100 to 700 mm so that reaction byproducts or the like easily pass from the hot trap portion to the cooling trap portion. At this time, in the present invention, the width size is made wider than that of the conventional trap apparatus. In other words, reaction byproducts collected in the fin type cooler are mostly accumulated in the trapping region 40. As the trapping amount increases, reaction byproducts or particles can not pass from the hot trap portion to the cooling trap portion. Therefore, this problem can be solved by making the width size wider than that of the conventional trap apparatus.

The configuration and functions of the above-described components have been described separately from each other for convenience of description, and any of the components and functions may be integrated with other components or may be further subdivided as needed.

Although the present invention has been described with reference to the embodiment thereof, the present invention is not limited thereto, and various modifications and applications are possible. In other words, those skilled in the art can easily understand that many variations are possible without departing from the gist of the present invention. In the following description, well-known functions or constructions relating to the present invention as well as specific combinations of the components of the present invention with respect to the present invention will be described in detail with reference to the accompanying drawings. something to do.

10: 1st pass
20: Second pass
30: Movement path
40: reaction by-product collection area
50: Pin type heater
51: heater part
52:
53: first port portion
54: second port portion
60: Pin type cooler
61: cooling piping (or cooling line)
70: contact area
100: Process chamber
210: Input side exhaust pipe
221: First quarter exhaust pipe
222: Second branch exhaust pipe
223: Third branch exhaust pipe
224: Fourth quarter exhaust pipe
230: Output side exhaust pipe
310: input side branch portion (input side 3-way valve portion)
320: Branch on the output side (3-way valve on the output side)
400: duplication trap part (or multi trap part)
410: first trap portion
411: Hot trap part
412: Cooling trap part (or cooling trap part)
420: second trap portion
421: Hot trap part
422: Cooling trap part (or cooling trap part)
500: pump
600: control unit (or path switching unit)
700:
800: Cooling water supply part

Claims (15)

delete delete delete delete delete delete delete delete delete An input side exhaust pipe connected to the one end region,
A hot trap part for receiving reaction byproducts including unreacted process gases supplied from the process chamber from the input side exhaust pipe and primarily collecting reaction byproducts including the unreacted process gas and liquid particle generation by heating;
A cooling trap portion for solidifying and collecting the liquid particles generated in the hot trap portion by secondary cooling, and
And an output side exhaust pipe connected to the other end region so as to face the input side exhaust pipe,
By combining the hot trap part and the cooling trap part in a " C "shape, the reaction byproduct including unreacted process gas moves from the hot trap part to the cooling trap part along the"
Wherein a contact area where the hot trap part and the cooling trap part are connected to each other is formed on the other side relative to the input side exhaust pipe and the output side exhaust pipe and the reaction byproduct moves from the hot trap part to the cooling trap part through the contact area,
The trap region of the cooling trap portion is formed below the contact region and the width of the contact region is set so that the particles trapped in the trap region flow well along the movement path from the hot trap portion to the cooling trap portion. And a cooling trap.
11. The method of claim 10,
Particles that have not been trapped in the solidified particles in the cooling trap part are accumulated in the cooling trap area and particles solidified by the remaining cooling are supplied to the pump side so that evaporation or reaction does not occur in the pump, And the cooling trap is prevented.
11. The method of claim 10,
Wherein the hot trap portion is located on the upper side of the flow path of the unreacted process gas and the cooling trap portion is located below the hot trap portion.
11. The method of claim 10,
The hot-
A heater portion heated by a hot wire, and
And a pin-type heater having a pin portion extending in a circumferential direction of the heater portion and having a bell-shaped shape and widening a contact area.
11. The method of claim 10,
The cooling trap unit includes:
A cooling part cooled by the cooling water, and
And a pin type cooler provided in the form of a bellows pipe in the circumferential direction of the cooling part and having a pin area for widening a contact area.
11. The method of claim 10,
The width of the contact area where the hot trap part and the cooling trap part are connected to each other is 100 to 700 mm so that the reaction byproduct including the unreacted process gas flows smoothly from the hot trap part to the cooling trap part by the particles accumulated in the trap area of the cooling trap part. Wherein the heat trap and the cooling trap are formed on the upper surface of the heat trap.

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