KR101889939B1 - High efficiency Ceramic antenna and method of manufacturing the same - Google Patents

Abstract

The present invention relates to a ceramic structure having a semiconductor chip formed on one side thereof; An antenna pattern formed on at least a part of the ceramic structure; A first pad portion formed on the ceramic structure; And a second pad portion formed on the first pad portion, wherein the second pad portion has a higher content of conductive material than the first pad portion, and a method of manufacturing the same .

Description

TECHNICAL FIELD [0001] The present invention relates to a high-efficiency ceramic antenna and a manufacturing method thereof,

The present invention relates to a ceramic antenna and a method of manufacturing the same, and more particularly, to a high-efficiency ceramic antenna capable of covering short-range and medium-range bands and a method of manufacturing the same.

Generally, Bluetooth is a communication means that can replace mechanically weak and inconvenient wired cables between communication devices. This is expanding to a variety of devices such as digital cameras, digital camcorders and joysticks as well as mobile phones, wireless headsets and networks.

The Bluetooth module consists of an RF module, a baseband processor, a flash, a peripheral circuit, and an antenna. That is, on the main board of the Bluetooth, a printed circuit board (PCB) on which a semiconductor chip, a flash memory and various types of chip components are mounted on the upper surface and on which various printing patterns are printed, An RF module (Radio Frequency Module) composed of a cover that is assembled on the printed circuit board to protect harmful electromagnetic waves from being radiated to the outside, and an antenna for transmitting and receiving a broadband signal are provided.

A rectangular chip antenna is integrally assembled on a printed circuit board on which a semiconductor chip is mounted so as to facilitate electrical connection between the semiconductor chip mounted on the printed circuit board and the antenna mounted on the main board The RF module was used in the Bluetooth main board.

However, when designing the main board to miniaturize the Bluetooth, there is a problem that the area occupied by the antenna mounted on the main board and the area occupied by the chip antenna mounted on the printed circuit board are limited in downsizing the component.

In addition, the operation of assembling the cover on the printed circuit board in the line for assembling the RF module is performed by uniformly mixing the lead (Pb) powder, tin (Sn) powder and special flux (FLUX) However, the soldering operation is very cumbersome and complicated, resulting in a reduction in work productivity and an increase in manufacturing cost. In addition, there has been a problem that electronic components mounted on the front and rear edges, the left and right edges of the printed circuit board, and the printed circuit board during the soldering operation are damaged by the solder liquid or damaged by the heat source generated during the soldering.

In addition, since the chip antenna is made of ceramic-based materials, some or all of the ceramic material parts which are susceptible to impact when the mobile device is dropped or subjected to a strong external impact are damaged, There was a problem that was easy to occur.

(Prior Art 1) United States Patent Application Publication No. US2014 / 0145883 (Apr. (Prior Art 2) Korean Patent Publication No. 10-2010-0020289 (Feb. 22, 2010)

It is an object of the present invention to solve the various problems including the above problems, and it is an object of the present invention to simplify the antenna manufacturing process, to reduce the manufacturing cost, to prevent the occurrence of short circuit of the antenna pattern, to miniaturize the antenna pattern, And a method of manufacturing the same. The foregoing problems have been presented by way of example and the scope of the present invention is not limited by these problems.

According to one aspect of the present invention, a high-efficiency ceramic antenna is provided. The high-efficiency ceramic antenna includes a ceramic structure having a semiconductor chip formed on one side thereof; An antenna pattern formed on at least a part of the ceramic structure; A first pad portion formed on the ceramic structure; And a second pad portion formed on the first pad portion, wherein the second pad portion may have a relatively higher content of conductive material than the first pad portion.

In the high-efficiency ceramic antenna, the lower portion is divided into a first region and the upper portion is divided into a second region with respect to a half of the height of the second pad portion, and the first region has a larger diameter than the second region have.

In the high-efficiency ceramic antenna, the second pad portion may be divided into at least two layers, and an area of a layer located on a lower surface of the second pad portion may be the same as an area of an upper surface of the first pad portion.

In the high-efficiency ceramic antenna, a buffer layer composed of a nickel (Ni) component and a gold (Au) component may be sequentially formed between the first pad portion and the second pad portion.

In the high efficiency ceramic antenna, the ceramic structure includes a structure in which a plurality of ceramic sheets are stacked, and an antenna pattern may be formed in the ceramic structure.

In the high-efficiency ceramic antenna, the antenna pattern may include a via hole provided in the ceramic structure.

In the high-efficiency ceramic antenna, the first pad portion and the second pad portion may include an array structure in which antenna pads containing silver (Ag) elements are arranged at regular intervals.

In the high-efficiency ceramic antenna, the semiconductor chip of the ceramic structure may be bonded to a printed circuit board (PCB) so as to output or receive a signal.

According to another aspect of the present invention, a method of manufacturing a high-efficiency ceramic antenna is provided. The method for manufacturing a high-efficiency ceramic antenna includes: forming an antenna pattern on a ceramic sheet; Forming a ceramic structure by laminating a plurality of ceramic sheets having the antenna pattern; Forming a first pad portion on the ceramic structure; And forming a second pad portion on the first pad portion, wherein the second pad portion may have a relatively higher content of conductive material than the first pad portion.

In the method of manufacturing a high-efficiency ceramic antenna, the first pad portion is formed on the upper surface of the ceramic structure using a screen printing method so as to have an array structure in which antenna pads containing silver (Ag) The second pad portion is formed by using a printing method, and the thickness of the second pad portion is controlled by repetitively performing a printing process and a drying process. After forming the second pad portion, May be bonded on the first pad portion.

The step of forming the second pad part may include forming a buffer layer on the first pad part, disposing the second pad part on the buffer layer, and bonding the first pad part and the second pad part by a soldering method. have.

The method of manufacturing a high-efficiency ceramic antenna according to claim 1, wherein the buffer layer is divided into a first buffer layer and a second buffer layer, the first buffer layer is formed on the first pad portion, And the second pad portion may be bonded onto the second buffer layer.

The manufacturing method of the high efficiency ceramic antenna may include a structure in which at least one via hole is formed in a part of the ceramic sheet to electrically connect the antenna pattern to the semiconductor chip.

In the method of manufacturing a high-efficiency ceramic antenna, a semiconductor chip is formed on a lower surface of the ceramic structure, and after forming the second pad portion on the first pad portion, As shown in FIG.

According to the embodiment of the present invention as described above, it is possible to simplify the antenna manufacturing process, reduce manufacturing cost, prevent shorting of the antenna pattern, manufacture in a desired shape and small size, A high efficiency ceramic antenna which can cover the antenna and protect it from external impact, and a manufacturing method thereof can be realized. Of course, the scope of the present invention is not limited by these effects.

1 is a perspective view schematically illustrating a structure of a high-efficiency ceramic antenna according to an embodiment of the present invention.
2 is a cross-sectional view schematically illustrating a structure of a high-efficiency ceramic antenna according to embodiments of the present invention.
FIG. 3 is a flowchart illustrating a method of manufacturing a high-efficiency ceramic antenna according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, Is provided to fully inform the user. Also, for convenience of explanation, the components may be exaggerated or reduced in size.

The high efficiency ceramic antenna according to an embodiment of the present invention can secure a fifth-generation frequency band which is several tens times larger than LTE, and is a large-capacity antenna having a data transmission speed of about 7 Gbps or more utilizing a vast spectrum of frequencies. Can be covered.

In addition, the high efficiency ceramic antenna according to an embodiment of the present invention uses a laminate of a plurality of ceramic sheets, and the ceramic sheet means a dielectric ceramic using low temperature cofired ceramics (LTCC). The dielectric ceramic uses a metallic material such as silver (Ag) or copper (Cu) having a small resistance loss and excellent electrical characteristics as a pad or an antenna pattern. Hereinafter, the high-efficiency ceramic antenna of the present invention will be described in detail with reference to FIGS. 1 to 3. FIG.

FIG. 1 is a perspective view schematically illustrating a structure of a high-efficiency ceramic antenna according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view illustrating a structure of a high-efficiency ceramic antenna according to an embodiment of the present invention.

1, a high-efficiency ceramic antenna 100 according to an embodiment of the present invention includes a ceramic structure 10 having a semiconductor chip 50 formed on one side thereof, an antenna pattern (not shown) formed on at least a part of the ceramic structure 10 20, and a pad portion 30 formed on the ceramic structure 10. Here, the pad portion 30 may include a first pad portion 32 and a second pad portion 34, and the second pad portion 34 may have a conductive material content greater than that of the first pad portion 32 Can be relatively high.

FIG. 2 is a cross-sectional view taken along line AA of the high-efficiency ceramic antenna 100 shown in FIG. 1. Referring first to FIG. 2 (a), a high-efficiency ceramic antenna 100 according to an embodiment of the present invention The ceramic structure 10 can form the antenna pattern 20 inside the ceramic structure 10 in order to secure a desired frequency and exchange signals. The ceramic structural body 10 may include a plurality of ceramic sheets stacked in a multi-layer form. For example, the ceramic structure 10 includes a structure in which the first ceramic sheet 12, the second ceramic sheet 14, the third ceramic sheet 16, and the fourth ceramic sheet 18 are laminated in order . An antenna pattern 20 may be formed on at least a portion of each ceramic sheet 12, 14, 16, 18.

For example, the antenna pattern 20 may be formed on the upper and lower surfaces of the first ceramic sheet 12, the second ceramic sheet 14, the third ceramic sheet 16, and the fourth ceramic sheet 18, Each antenna pattern 20 may be electrically connected through a via hole provided in each of the ceramic sheets 12, 14, 16, and 18. The antenna pattern 20 may be formed using a material having excellent electrical conductivity such as silver (Ag) and a method such as silk screen printing so as to have a constant thickness in consideration of resistance.

In addition, the inside of the via hole may be filled with the silver (Ag) to a thickness of about 50 탆 to 100 탆 in diameter. The antenna pattern 20 formed on each of the ceramic sheets 12, 14, 16 and 18 plays a role of controlling ground, power, and signal, Can be performed. Here, the ceramic sheet is divided into four layers, but the number and size of the ceramic sheets can be controlled differently depending on the use of the ceramic antenna.

The pad portion 30 may be formed on the upper surface of the ceramic structure 10. The pad portion 30 is divided into a first pad portion 32 and a second pad portion 34 depending on the formed position and the pad portion 30 formed on the upper surface of the ceramic structure body 10 is divided into a first pad portion 32, (32). The first pad portion 32 is formed on the upper surface of the ceramic structural body 10 (the upper surface of the ceramic sheet disposed at the outermost periphery), that is, on the upper surface of the fourth ceramic sheet 18, . The first pad portion 32 may protrude from the upper surface of the ceramic structure 10.

The first pad portion 32 may use the same material as the material used for the antenna pattern 20. The first pad portion 32 may be formed into a cylindrical shape with a thickness of about 10 탆 using silver (Ag). As seen from the top surface of the high-efficiency ceramic antenna 100, the first pad portion 32 may include an array structure in which circular pads are arranged at regular intervals. However, the shape of the first pad portion 32 is not limited to the circular shape but may be formed to have various shapes such as a cube, a rectangular parallelepiped, and a prism. Here, the printing method is a known technique, and a detailed description thereof will be omitted.

On the other hand, although not shown in the drawing, the first pad portion 32 may be formed on the side surface of the ceramic structure 10 to amplify the intensity of the antenna signal. The first pad portion 32 may have a shape embedded in a side surface of the ceramic structure 10. For example, the first pad portion 32 formed on the side surface of the ceramic structure 10 removes at least a part of the side surface of the ceramic structure 10 using a via punching process. The first pad portion 32 is formed on the side surface of the ceramic structure body 10 by filling a via with a paste containing silver (Ag) .

In addition, the second pad portion 34 formed on the first pad portion 32 may have a higher content of the conductive material than the first pad portion 32. For example, if the first pad portion 32 contains about 70% by weight of silver (Ag) and about 30% of other glass components by weight, the second pad portion 34 is in weight percent , About 85% to 70% silver (Ag), and about 10% to 15% other glass components.

The second pad portion 34 is formed on the upper surface of the first pad portion 32 and may be formed to a thickness of about 40 탆 to 90 탆. Accordingly, the total thickness sum of the first pad portion 32 and the second pad portion 34 may be about 50 μm to 100 μm. The second pad portion 34 may be formed in the same shape as the first pad portion 32. However, in order to more effectively transmit and receive signals, for example, a dome shape, a hemispherical shape, a cylinder, a cone, And may include at least any one form.

In addition, the diameter of the second pad portion 34 may be gradually decreased from the bottom to the top of the lower surface of the second pad portion 34. Alternatively, it may be divided into two layers based on half the height of the second pad portion 34. In this case, the lower portion may be divided into a first region and the upper portion may be divided into a second region. At this time, the first region may have a larger diameter than the second region. When the second pad portion 34 is divided into at least two layers, the area of the lower surface of the second pad portion 34 may be the same as that of the upper surface of the first pad portion 32.

Referring to FIG. 2 (a), in the enlarged portion of the region where the first pad portion 32 and the second pad portion 34 are joined to each other, the first pad portion 32 and the second pad portion 34 may include a buffer layer 60. The buffer layer 60 is formed on the first pad portion 32 to improve the adhesion of the second pad portion 34. The buffer layer 60 may be formed of a material that minimizes noise reduction of the antenna signal, (Ni) and gold (Au). The buffer layer 60 may include a first buffer layer 62 and a second buffer layer 64 depending on the position. The first buffer layer 62 may contain the nickel (Ni) component and the second buffer layer 64 may contain the gold (Au) component. The content of nickel (Ni) and gold (Au) in the first buffer layer 62 and the second buffer layer 64 may be varied according to the composition of the first pad portion 32 and the second pad portion 34 .

The semiconductor chip 50 may be formed on the lower surface of the ceramic structure 10. The semiconductor chip 50 may be bonded to a printed circuit board (PCB) 40 to output or receive signals. The printed circuit board 40 and the semiconductor chip 50 are bonded together by the solder ball 45, thereby simplifying the antenna manufacturing process, reducing the manufacturing cost, and realizing the compact and highly efficient ceramic antenna 100.

On the other hand, there is a relation with the length of the antenna pattern 20 according to the frequency band. For example, as the length of the antenna pattern 20 increases, the frequency band may increase in proportion to the increased length. In this case, the length of the antenna pattern 20 can be increased depending on the size of the ceramic structure 10. [ The length of the antenna pattern 20 can be controlled by dividing the ceramic sheets constituting the ceramic structure 10 into a plurality of ceramic sheets to increase the surface area of the ceramic sheets.

Also, the strength of the antenna signal is related to the number and size of the first pads 32. For example, when the number of the first pad portions 32 is increased or the size of the first pad portion 32 is increased, in proportion to an increase in the size and number of the first pad portions 32, Can be increased. If approximately 30 pieces of the first pad portion 32 are disposed in the vicinity of about 20 pieces, the strength of the antenna in which the first pad portion 32 is disposed is approximately 30 It can have a larger value. Alternatively, assuming that the thickness of the first pad portion 32 is the same, when the area of the first pad portion 32 increases, the intensity of the antenna may have a larger value. Therefore, the high-efficiency ceramic antenna 100 according to an embodiment of the present invention can be manufactured by forming the first pad portion 32 on both the upper surface of the ceramic structure 10 or the upper surface and the side surface of the ceramic structure 10, An antenna having a relatively higher intensity can be realized.

Although not shown in the drawing, the high-efficiency ceramic antenna 100 may include an impact protection layer (not shown) formed on a side surface or a side surface and an upper surface of the ceramic structure 10. The impact protection layer (not shown) may be made of, for example, a polymer material. The impact protection layer (not shown) may have a structure surrounding the side surface of the ceramic structure 10. The impact protection layer (not shown) may be formed of one polymer layer, but a plurality of polymer layers of a thin polymer material may be stacked on top of each other.

The thickness of the impact protection layer (not shown) may satisfy 0.1 mm to 1.0 mm. If the thickness of the impact protection layer (not shown) is less than 0.1 mm, the ceramic structural body 10 can not be protected from an external impact. On the other hand, if the thickness of the impact protection layer (not shown) exceeds 1.0 mm, the antenna can withstand the external impact, but the strength of the antenna signal is reduced and the antenna can not function as the ceramic antenna 100.

In addition to the polymer material, a metal or a composite material may be used for the impact protection layer (not shown). In this case, the side surface of the ceramic structural body 10 may not be surrounded by a side surface, but may be arranged to be spaced apart by a predetermined distance. At this time, the upper surface of the ceramic structure 10 should be exposed to the outside so as not to disturb the sensitivity of the antenna signal, and among the metal components, a material which does not disturb the sensitivity of the antenna signal should be used.

For example, when an impact protection layer (not shown) is disposed apart from the ceramic structure 10 by using a metal material, the outer circumference of the impact protection layer (not shown) made of the metal material is further wrapped with a polymer material . ≪ / RTI > In this case, the thickness can be made thinner than the thickness of the protective layer made only of a polymer material, and it is possible to prevent the sensitivity of the antenna signal from being deteriorated.

Referring to FIG. 2 (b), the high-efficiency ceramic antenna 200 according to another embodiment of the present invention may include the ceramic structure 10, the antenna pattern 20, and the pad portion 30. Here, the pad portion 30 may include a first pad portion 32 and a second pad portion 34. The pad portion 30 may be formed on the ceramic structure 10, the antenna pattern 20, and the first pad portion 32, The detailed description is the same as that described above with reference to Fig. 2 (a) and therefore will be omitted.

In addition, the second pad portion 34 may have a relatively higher content of the conductive material than the first pad portion 32. For example, if the first pad portion 32 contains about 70% by weight of silver (Ag) and about 30% of other glass components by weight, the second pad portion 34 is in weight percent , About 85% to 70% silver (Ag), and about 10% to 15% other glass components.

The second pad portion 34 is formed on the upper surface of the first pad portion 32 and may be formed to a thickness of about 40 탆 to 90 탆. Accordingly, the total thickness sum of the first pad portion 32 and the second pad portion 34 may be about 50 μm to 100 μm. The second pad portion 34 may have the same shape as the first pad portion 32. However, the second pad portion 34 may have a convex shape and a convex shape in order to more efficiently transmit and receive signals.

In order to maintain the adhesion between the first pad portion 32 and the second pad portion 34 when the second pad portion 34 is divided into at least two layers, The area of the top surface of the first pad portion 32 may be the same as the area of the surface. As shown in FIG. 2 (a), the diameter of the hemispherical shape may gradually decrease from the bottom to the bottom of the second pad portion 34.

As shown in FIG. 2 (b), it may be divided into two layers at a position which is about 10% of the height based on the lower surface of the second pad portion 34. At this time, the lower structure and the upper structure of the second pad portion 34 divided into layers may have, for example, a cylindrical shape and a shape with a long convex shape having different diameters. In this case, there is an advantage that the manufacturing cost and the process time can be shortened compared to the hemispherical second pad portion 34.

Meanwhile, a buffer layer 60 may be formed between the first pad portion 32 and the second pad portion 34. The buffer layer 60 is formed on the first pad portion 32 to improve the adhesion of the second pad portion 34. The buffer layer 60 may be formed of a material that minimizes noise reduction of the antenna signal, (Ni) and gold (Au). The buffer layer 60 may include a first buffer layer 62 and a second buffer layer 64 depending on the position. The first buffer layer 62 may contain the nickel (Ni) component and the second buffer layer 64 may contain the gold (Au) component. The content of nickel (Ni) and gold (Au) in the first buffer layer 62 and the second buffer layer 64 may be varied according to the composition of the first pad portion 32 and the second pad portion 34 .

FIG. 3 is a flowchart illustrating a method of manufacturing a high-efficiency ceramic antenna according to an embodiment of the present invention.

Referring to FIG. 3, a method of fabricating a high-efficiency ceramic antenna according to an embodiment of the present invention includes forming an antenna pattern on a ceramic sheet (S10), forming a ceramic structure by laminating a plurality of ceramic sheets having antenna patterns A step S30 of forming a first pad portion on the ceramic structure, and a step S40 of forming a second pad portion on the first pad portion.

Referring to FIGS. 1 and 2 again, a method of manufacturing a high-efficiency ceramic antenna 100 according to the present invention includes the steps of applying a silver (Ag) component to at least a portion of the first ceramic sheet 12 using a screen printing method or the like The antenna pattern 20 can be formed. The antenna pattern 20 can be formed on at least a part of the second ceramic sheet 14, the third ceramic sheet 16 and the fourth ceramic sheet 18 in the same manner.

Thereafter, the first ceramic sheet 12, the second ceramic sheet 14, the third ceramic sheet 16 and the fourth ceramic sheet 18 are successively laminated and then fired at the same time to form the ceramic structural body 10 . Each of the ceramic sheets 12, 14, 16, and 18 can control ground, power, and signal, respectively, depending on the position. Further, the position of the layer for controlling the power and the signal may be relatively different depending on the arrangement of the layers.

The antenna pattern 20 formed on a part of each of the ceramic sheets 12, 14, 16 and 18 can be electrically connected to the semiconductor chip 60 by a via hole formed in each ceramic sheet. Although the ceramic structure 10 is divided into four layers for convenience of explanation, the ceramic structure 10 may be formed as a single layer or five or more layers depending on the strength of the antenna signal and the range of the frequency band.

The pad portion 30 may be formed on the ceramic structure 10. The pad portion 30 may include a first pad portion 32 and a second pad portion 34. The first pad portion 32 may be formed by arranging antenna pads containing a silver (Ag) component at regular intervals. The first pad portion 32 is formed to have a protruding shape on the upper surface of the ceramic structure 10 using the same process as the screen printing method. Here, the printing method is a known technique, and a detailed description thereof will be omitted.

Although the first pad portion 32 may be formed on the side surface of the ceramic structure 10, the end portions of the ceramic sheets constituting the ceramic structure 10 may not be smoothly processed, so that the bonding strength may be somewhat poor. In order to solve this problem, in the present invention, at least a part of the side surface of the ceramic structure 10 is removed by using a via punching process. Vias can then be filled with a paste containing the silver (Ag) component via a via filling process in the removed region.

The first pad portions 32 formed on the upper surface and the side surfaces may have the same size. That is, the side surface of the ceramic structure 10 can be etched and removed by the thickness of the first pad portion 32 formed on the upper surface, and the side surface of the ceramic structure 10 can be etched by the diameter of the first pad portion 32 Can be removed. The first pad portion 32 formed on the side surface may be formed on only one side of the ceramic structure 10 or may be formed over the entire side surface of the ceramic structure 10 to control the strength of the antenna signal.

The second pad portion 34 may be formed on the first pad portion 32 after the first pad portion 32 is formed. The first pad portion 32 and the second pad portion 34 may each contain silver (Ag), and the second pad portion 34 may include a conductive material, (Ag) component.

The second pad portion 34 can be formed by stacking silver metal by a printing method, for example. The second pad portion 34 may be directly formed on the first pad portion 32. However, in order to improve the efficiency of the signal processing, the second pad portion 34 may be separately formed, The second pad portion 34 can be bonded onto the one pad portion 32. [ The material used in the soldering method may contain tin (Sn) and lead (Pb) components, and the content of tin (Sn) and lead (Pb) may be appropriately controlled depending on the characteristics of the bonding surface.

The buffer layer 60 may be formed between the first pad portion 32 and the second pad portion 34 to improve the bonding strength between the first pad portion 32 and the second pad portion 34. [ The buffer layer 60 may include a first buffer layer 62 and a second buffer layer 64. The first buffer layer 62 may contain a nickel (Ni) component and the second buffer layer 64 may contain a gold (Au) component. The buffer layer 60 is formed on the first pad portion 32. If the second pad portion 34 is directly formed on the ceramic structure 10 without the first pad portion 32, When the buffer layer 60 is used, its adhesion is very weak. Therefore, the first buffer layer 62 and the second buffer layer 64 must be sequentially formed on the first pad portion 32 after the first pad portion 32 is formed.

The first buffer layer 62 may be formed on the first pad portion 32 and may be formed only on the upper surface of the first pad portion 32. The first buffer layer 62 may surround all the protruded surfaces of the first pad portion 32 . The second buffer layer 64 may be formed so as to surround all the protruded surfaces of the first buffer layer 62 in the same manner as the first buffer layer 62. In this case, the second buffer layer 64 has a function of widening the bonding area with the second pad portion 34 and controlling the bonding to be stably performed. Therefore, at this time, the bottom area of the second pad portion 34 may be wider than the top area of the first pad portion 32.

The shape of the second pad portion 34 may be variously formed as a dome shape, a cylinder, a cone, a prism, a pyramid or the like as described above with reference to FIGS. 1 and 2. However, The area of the lower surface of the second pad portion 34 may be equal to the area of the upper surface of the first pad portion 32 to maintain the bonding force with the first pad portion 32. The above-described shape is exemplarily shown, and the scope of the present invention is not limited by such a shape.

The height or thickness of the second pad portion 34 can be controlled by repeatedly performing the printing process and the drying process. For example, if the second pad portion 34 is formed of at least two layers, a first printing process is performed on a separate substrate (not shown), and a first drying process is performed to form a first layer .

Thereafter, the second layer is formed on the first layer by performing a second drying process after continuously performing the second printing process without firing the first layer. The second pad portion 34 is formed in a suitable shape by repeatedly performing the printing process and the drying process without performing the baking process after each drying process and then the second pad portion 32 is formed on the first pad portion 32, The high-efficiency ceramic antenna 100 according to an embodiment of the present invention can be manufactured by firing the ceramic structure 10 after firing the ceramic structure body 34 and firing the ceramic structure body 10 at the same time. Alternatively, the pad portions 30 can be formed after the plurality of ceramic sheets 12, 14, 16, and 18 are stacked and fired at the same time.

Thereafter, in order to protect the ceramic structure 10 from an external impact, an impact protection layer (not shown) may be formed to surround the side surface of the ceramic structure 10. Alternatively, an impact protection layer (not shown) may be formed to cover the side surfaces of the ceramic structure 10 and the upper surface of the ceramic structure 10 on which the pad portions 30 are formed.

The thickness of the impact protection layer (not shown) may be set to satisfy 0.1 mm to 1.0 mm. If the thickness of the impact protection layer (not shown) is less than 0.1 mm, the ceramic structural body 10 can not be protected from external impact, so that the impact protection layer (not shown) can be formed thicker than 0.1 mm .

On the other hand, when the thickness of the impact protection layer (not shown) exceeds 1.0 mm, the antenna can withstand external impacts, but since the intensity of the antenna signal is reduced and can not function as the ceramic antenna 100, The protective layer (not shown) can be formed to be thinner than 1.0 mm.

For example, a thermoplastic resin can be used as the impact protection layer (not shown). Particularly, in order to prevent defects or breakage of the ceramic structural body 10 from external impacts, a solder resistor or a silicon-based polymer, such as a polymer having a foamed structure such as styrene, Can be used. The thermoplastic resin can be produced by blending, by polymerizing the polymer branches by using either a graft method or a graft blending method. The above method is merely illustrative and varies depending on the type and composition ratio of the plastic resin, the molecular weight of the resin, the change of additives, and the like.

The impact protection layer (not shown) does not merely serve as a safety function against an external impact, and various resins can be added according to required functions. For example, the electromagnetic wave shielding effect of the ceramic antenna 100 may be obtained by adding a part of the conductive polymer within a range that does not affect the sensitivity to the antenna signal, Function may be performed.

The thermoplastic resin can serve as a protective layer excellent in physical properties such as impact resistance even by the material itself. However, if the molding conditions of the thermoplastic resin are not suitable, it is somewhat difficult to exhibit its original properties. Therefore, the thermoplastic resin can be molded by using, for example, a dispenser using a fixed quantity dispenser, injection molding, extrusion molding, vacuum molding, blow molding, foam molding, cold forming and rotary molding have. Here, the molding method is a well-known technique, and a detailed description thereof will be omitted.

The semiconductor chip 50 is disposed on the lower surface of the ceramic structure body 10 and the semiconductor chip 50 and the printed circuit board 40 are joined to each other to manufacture the high efficiency ceramic antenna 100. [ The printed circuit board 40 and the semiconductor chip 50 can be bonded to each other through the solder ball 45 using a ball grid array (BGA) method, for example. have. Here, the process of bonding the printed circuit board 40 to the semiconductor chip 50 by the solder ball 45 is a well-known technique, and a detailed description thereof will be omitted.

As described above, the high-efficiency ceramic antenna 100 according to the embodiments of the present invention includes the ceramic structure 10, the antenna pattern 20, the first pad portion 32, and the second pad portion 34 And the shape of the second pad unit 34 is appropriately controlled, the intensity of the antenna signal can be made stronger so as to cover the near and middle range bands. In addition, according to the embodiments of the present invention, it is possible to provide a high-efficiency ceramic antenna 100 that can simplify the antenna manufacturing process, reduce the manufacturing cost, maintain the performance while reducing the size, Can be implemented.

In addition, since the impact protection layer (not shown) is formed on the side surface of the ceramic structure 10 or the side surface and the top surface of the ceramic structure 10, respectively, Defects of the ceramic structural body 10 can be prevented by an impact or the like generated.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: Ceramic structure
12: first ceramic sheet
14: second ceramic sheet
16: Third ceramic sheet
18: fourth ceramic sheet
20: Antenna pattern
30: pad portion
32: first pad portion
34: second pad portion
40: printed circuit board
45: solder ball
50: semiconductor chip
60: buffer layer
62: first buffer layer
64: second buffer layer
100, 200: high efficiency ceramic antenna

Claims (14)

A ceramic structure having a semiconductor chip formed on one side thereof;
An antenna pattern formed on at least a part of the ceramic structure;
A first pad portion formed on the ceramic structure; And
A second pad portion formed on the first pad portion;
Lt; / RTI >
The second pad portion has a relatively higher content of conductive material than the first pad portion,
Wherein the second region is divided into a first region and a second region with respect to a half of the height of the second pad portion and the first region has a larger diameter than the second region.
High efficiency ceramic antenna. delete A ceramic structure having a semiconductor chip formed on one side thereof;
An antenna pattern formed on at least a part of the ceramic structure;
A first pad portion formed on the ceramic structure; And
A second pad portion formed on the first pad portion;
Lt; / RTI >
The second pad portion has a relatively higher content of conductive material than the first pad portion,
The second pad portion is divided into at least two layers,
Wherein an area of a layer located on a lower surface of the second pad portion is equal to an area of an upper surface of the first pad portion.
High efficiency ceramic antenna. The method according to claim 1,
Wherein a buffer layer made of a nickel (Ni) component and a gold (Au) component is sequentially formed between the first pad portion and the second pad portion.
High efficiency ceramic antenna. The method according to claim 1,
Wherein the ceramic structure includes a structure in which a plurality of ceramic sheets are stacked, and an antenna pattern is formed in the ceramic structure.
High efficiency ceramic antenna. The method according to claim 1,
Wherein the antenna pattern includes a via hole provided in the ceramic structure.
High efficiency ceramic antenna. A ceramic structure having a semiconductor chip formed on one side thereof;
An antenna pattern formed on at least a part of the ceramic structure;
A first pad portion formed on the ceramic structure; And
A second pad portion formed on the first pad portion;
Lt; / RTI >
The second pad portion has a relatively higher content of conductive material than the first pad portion,
Wherein the first pad portion and the second pad portion include an array structure in which antenna pads containing silver (Ag) components are arranged at regular intervals.
High efficiency ceramic antenna. The method according to claim 1,
Characterized in that the semiconductor chip of the ceramic structure is bonded to a printed circuit board (PCB) so that a signal can be output or received.
High efficiency ceramic antenna. A method of manufacturing a high-efficiency ceramic antenna,
Forming an antenna pattern on the ceramic sheet;
Forming a ceramic structure by laminating a plurality of ceramic sheets having the antenna pattern;
Forming a first pad portion on the ceramic structure; And
Forming a second pad portion on the first pad portion;
Lt; / RTI >
The second pad portion has a relatively higher content of conductive material than the first pad portion,
Wherein the first pad portion is formed on the upper surface of the ceramic structure using a screen printing method so that antenna pads containing silver (Ag) components are arrayed at regular intervals,
The second pad portion is formed by using a printing method, and the thickness of the second pad portion is controlled by repetitively performing a printing process and a drying process. After forming the second pad portion, The method of claim 1, further comprising:
Method of manufacturing high efficiency ceramic antenna. delete 10. The method of claim 9,
Wherein forming the second pad portion comprises:
Wherein a buffer layer is formed on the first pad portion, and the second pad portion is disposed on the buffer layer, and then bonded by a soldering method.
Method of manufacturing high efficiency ceramic antenna. 12. The method of claim 11,
The buffer layer is divided into a first buffer layer and a second buffer layer,
Wherein the first buffer layer is formed on the first pad portion, a second buffer layer is formed on the first buffer layer, and the second pad portion is bonded on the second buffer layer.
Method of manufacturing high efficiency ceramic antenna. 10. The method of claim 9,
And a structure for electrically connecting the antenna pattern to the semiconductor chip by forming at least one via hole in a part of the ceramic sheet.
Method of manufacturing high efficiency ceramic antenna. 10. The method of claim 9,
A semiconductor chip is formed on a lower surface of the ceramic structure,
And bonding the semiconductor chip to a printed circuit board (PCB) after the step of forming the second pad portion on the first pad portion.
Method of manufacturing high efficiency ceramic antenna.

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