CN112551475B - Chip packaging structure, manufacturing method thereof and electronic equipment - Google Patents
Chip packaging structure, manufacturing method thereof and electronic equipment Download PDFInfo
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- CN112551475B CN112551475B CN202110190855.5A CN202110190855A CN112551475B CN 112551475 B CN112551475 B CN 112551475B CN 202110190855 A CN202110190855 A CN 202110190855A CN 112551475 B CN112551475 B CN 112551475B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Transceivers (AREA)
Abstract
The invention provides a chip packaging structure, a manufacturing method thereof and electronic equipment, and relates to the field of semiconductors. The chip packaging structure comprises a substrate, a microphone chip and a processing chip which are arranged on the substrate, a protective cover which covers the microphone chip and the processing chip, a radio frequency chip which is arranged on the outer surface of the protective cover, a packaging body which wraps the protective cover and the radio frequency chip, and an antenna which is arranged on the surface of the packaging body. The antenna is arranged on the surface of the packaging body, the radio frequency chip is arranged outside the protective cover, and the radio frequency chip and the protective cover are connected through the first transmission line, so that the integration of the antenna structure, the microphone chip and the processing chip is realized, and the chip packaging structure is powerful in functionality and can meet more use requirements; and the structure is compact, which is beneficial to the miniaturization of electronic equipment. The manufacturing method provided by the invention is used for manufacturing the chip packaging structure. The electronic device provided by the embodiment of the invention comprises the chip packaging structure.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a chip packaging structure, a manufacturing method thereof and electronic equipment.
Background
With the rapid development of the semiconductor industry, microphones have been widely used in various electronic products in the consumer field, wherein silicon microphones have been widely used in mobile terminals due to their small size and strong stability. The chip package structure of the silicon microphone includes a MEMS (Micro Electro Mechanical System) chip and an ASIC (Application Specific Integrated Circuit) chip for receiving and processing an acoustic signal. With the application of electronic products to the iteration of high-frequency and low-frequency signals in the communication field, MEMS silicon microphone products are required to have antenna functions. However, the integration level of the chip packaging structure and the antenna structure of the existing silicon microphone is poor.
Disclosure of Invention
The invention aims to provide a chip packaging structure, a manufacturing method thereof and electronic equipment, which better integrate a chip for receiving and processing acoustic signals and an antenna structure, so that the chip packaging structure and the electronic equipment have better performance and compact structure.
Embodiments of the invention may be implemented as follows:
in a first aspect, the present invention provides a chip package structure, including:
the microphone chip is connected with a circuit on the substrate through the processing chip;
the protective cover is arranged on the substrate and covers the microphone chip and the processing chip;
the radio frequency chip is arranged on the outer surface of the protective cover and is electrically connected with the circuit on the substrate;
the packaging body is wrapped on the outer sides of the protective cover and the radio frequency chip and exposed out of the sound transmission hole;
the antenna is arranged on the surface of the packaging body and is electrically connected with the radio frequency chip through a first transmission line embedded in the packaging body;
the substrate and/or the protective cover form a sound transmission hole, and the sound transmission hole is communicated with the cavity of the protective cover and the outer side of the chip packaging structure.
In an alternative embodiment, the sound transmission holes are oriented parallel to the substrate.
In an alternative embodiment, the protective cover includes a cover body and a channel plate connected to the outer side of the cover body, the cover body covers the processing chip and the microphone chip therein, the edge of the cover body adjacent to the substrate has a notch, the channel plate is connected to the upper edge of the notch and is parallel to the substrate, and the channel plate and the substrate form a sound transmission hole therebetween.
In an optional embodiment, the cover body comprises a top plate and a side plate, the top plate and the side plate together form a cavity of the cover body, the top plate is located on one side of the cover body away from the base plate, the notch is formed in the side plate, and the radio frequency chip is arranged on the outer side of the top plate.
In an optional embodiment, a second transmission line is arranged on the protective cover, the second transmission line and the protective cover are separated by an insulating layer, and two ends of the second transmission line are respectively connected with the first transmission line and the radio frequency chip.
In an optional embodiment, a connection channel is embedded between the inner side surface and the outer side surface of the protection cover, two ends of the connection channel penetrate through the outer side surface of the protection cover, the second transmission line is embedded in the connection channel and separated from the inner wall of the connection channel through an insulating layer, and two ends of the second transmission line are exposed out of two ends of the connection channel respectively.
In an alternative embodiment, the protective cover comprises a cover body and a channel plate connected to the outer side of the cover body, the cover body covers the processing chip and the microphone chip therein, the edge of the cover body adjacent to the substrate is provided with a notch, the channel plate is connected to the upper edge of the notch and is parallel to the substrate, and a sound transmission hole is formed between the channel plate and the substrate; the second transmission line is arranged on the channel plate, and the radio frequency chip is connected to one end of the second transmission line in a routing mode.
In a second aspect, the present invention provides a method for manufacturing a chip package structure, including:
arranging a processing chip and a microphone chip on the substrate, wherein the microphone chip is connected with a circuit on the substrate through the processing chip;
manufacturing a protective cover to cover the microphone chip and the processing chip, wherein the substrate and/or the protective cover are/is provided with a sound transmission hole;
arranging a radio frequency chip on the protective cover;
manufacturing a packaging body to wrap the protective cover and the radio frequency chip;
a first transmission line is buried in the packaging body, and an antenna is arranged on the outer side of the packaging body so as to be connected with the radio frequency chip through the first transmission line.
In an optional embodiment, a second transmission line is arranged on the protective cover, and the radio frequency chip is electrically connected with the second transmission line; set up and bury the first transmission line in the packaging body underground to set up the antenna outside the packaging body, so that the antenna passes through first transmission line and connects radio frequency chip, specifically include:
a connecting hole is formed from the outer side of the packaging body to the inner side, and the bottom of the connecting hole extends to a second transmission line on the protective cover;
filling a conductive material in the connecting hole to form a first transmission line;
an antenna is arranged outside the packaging body so as to be connected with the first transmission line.
In a third aspect, the present invention provides an electronic device including the chip packaging structure according to any one of the foregoing embodiments.
The embodiment of the invention has the beneficial effects that:
the chip packaging structure comprises a substrate, a microphone chip and a processing chip which are arranged on the substrate, a protective cover for covering the microphone chip and the processing chip, a radio frequency chip arranged on the outer surface of the protective cover, a packaging body for wrapping the protective cover and the radio frequency chip and an antenna arranged on the surface of the packaging body. The antenna is arranged on the surface of the packaging body, the radio frequency chip is arranged outside the protective cover and connected with the protective cover through the first transmission line, so that the integration of the antenna structure, the microphone chip and the processing chip is realized, the chip packaging structure can receive and process acoustic signals and can transmit signals through the antenna, and the chip packaging structure is powerful in functionality and can meet more use requirements; and the structure is compact, which is beneficial to the miniaturization of electronic equipment.
The manufacturing method provided by the embodiment of the invention is used for manufacturing the chip packaging structure. The electronic equipment provided by the embodiment of the invention comprises the chip packaging structure, so that the electronic equipment has the advantages of more functions and compact structure.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a diagram illustrating a chip package structure according to an embodiment of the present invention;
FIG. 2 is a diagram illustrating a chip package structure according to another embodiment of the present invention;
FIG. 3 is an enlarged view of a portion III of FIG. 1;
FIG. 4 is a flow chart illustrating a method for fabricating a chip package structure according to an embodiment of the present invention;
fig. 5 to 9 are schematic views illustrating a chip package structure in a manufacturing process according to an embodiment of the invention.
Icon: 010-chip package structure; 100-a substrate; 110-solder ball; 200-a microphone chip; 210-a processing chip; 300-a protective cover; 310-a cover body; 311-side plate; 312-a top plate; 320-channel plate; 322-second transmission line; 324-an insulating layer; 330-sound transmission hole; 400-a package body; 500-an antenna; 510-a first transmission line; 520-radio frequency chip.
Detailed Description
With the wide application of IC rf antenna structures in the semiconductor industry and the application of electronic products in the iteration of high-frequency and low-frequency signals in the communication field, electronic products (such as microphones and mobile communication devices) are required to have the function of MEMS silicon microphone products and also have the function of antennas to meet the requirements of high/low frequency signal transmission. However, in the design of the existing electronic device, the MEMS silicon microphone product and the antenna structure for receiving and processing the acoustic signal are two independent products, and there is no technology for combining the radio frequency antenna structure and the MEMS silicon microphone structure. This results in a low integration level and limited miniaturization of electronic devices having multiple functions. In addition, in the manufacturing method of the IC radio frequency antenna structure in the prior art, the antenna layer ground pad is manufactured on the substrate, and when laser grooving is adopted, the substrate pad is easily broken down, so that antenna pattern transmission is affected.
In order to solve the problem that the integration level of the silicon microphone and the antenna is not high in the prior art, the embodiment of the invention provides a chip packaging structure which combines the silicon microphone and the antenna together. And under this kind of structure, can avoid the risk of puncturing the base plate pad when the preparation antenna.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
Fig. 1 is a schematic diagram of a chip package structure 010 according to an embodiment of the invention. As shown in fig. 1, the chip package structure 010 provided in this embodiment includes:
the microphone comprises a substrate 100, wherein a processing chip 210 and a microphone chip 200 are arranged on the substrate 100, and the microphone chip 200 is connected with a circuit on the substrate 100 through the processing chip 210;
a protective cover 300 disposed on the substrate 100, the protective cover 300 covering the microphone chip 200 and the processing chip 210;
the radio frequency chip 520 is arranged on the outer surface of the protective cover 300, and the radio frequency chip 520 is electrically connected with the circuit on the substrate 100;
the package 400, wherein the package 400 is wrapped outside the protective cover 300 and the rf chip 520, and exposes the sound transmission hole 330;
an antenna 500 disposed on the surface of the package 400, wherein the antenna 500 is electrically connected to the rf chip 520 through a first transmission line 510 embedded in the package 400;
the substrate 100 and/or the protection cover 300 form a sound transmission hole 330, and the sound transmission hole 330 communicates the cavity of the protection cover 300 and the outer side of the chip packaging structure 010.
It can be seen that in the chip package structure 010 of the present invention, the microphone chip 200 and the processing chip 210 are covered in the protective cover 300, and the sound transmission hole 330 is formed, so as to meet the requirements of sound receiving and processing. In the present embodiment, the sound transmission hole 330 may be formed on the substrate 100 or the protection cover 300, or may be formed by the substrate 100 and the protection cover 300 together (as shown in fig. 1). The radio frequency chip 520 is arranged outside the protective cover 300, the whole protective cover 300 and the radio frequency chip 520 are wrapped by the packaging body 400, and the antenna 500 is arranged outside the packaging body 400, so that the antenna 500, the microphone chip 200 and the processing chip 210 are integrated, and the whole packaging structure has more functions and compact structure. In addition, the antenna 500 is formed on the package 400, avoiding the risk of breaking through the pads that may be present when forming the antenna 500 on the substrate 100.
In the embodiment of the present invention, the microphone chip 200 is a MEMS chip, which includes a silicon diaphragm and a silicon back plate. The silicon vibrating diaphragm is deformed due to sound pressure interference by utilizing pressure gradient generated by sound change, and then the capacitance value between the silicon vibrating diaphragm and the silicon back plate is changed, so that an acoustic signal is converted into an electric signal. The processing chip 210 in the embodiment of the present invention is an ASIC chip, and is used for processing (such as amplifying) the electrical signal transmitted from the microphone chip 200. In an alternative embodiment, the processing chip 210 is connected to the circuit on the substrate 100 by wire bonding, and is connected to the microphone chip 200 by wire bonding.
In an alternative embodiment of the present invention, the sound transmission holes 330 are oriented parallel to the substrate 100. In general, the silicon diaphragm on the microphone chip 200 is oriented away from the substrate 100, and the orientation of the sound transmission hole 330 is set to be parallel to the substrate 100, so that the sound transmitted from the sound transmission hole 330 is not directly opposite to the silicon diaphragm of the microphone chip 200, and the silicon diaphragm is prevented from being broken due to high-strength sound pressure impact. Since the protection cover 300 forms a cavity, the sound is diffused in the cavity and received by the microphone chip 200 after entering the protection cover 300 through the sound transmission hole 330. In this embodiment, the sound transmission hole 330 is located on the side of the protection cover 300, and a part of the sidewall thereof is formed by the protection cover 300, and another part is formed by the substrate 100, in an alternative embodiment, the laterally opened sound transmission hole 330 may also be located inside the substrate 100, and one end thereof extends from the side edge of the substrate 100, and the other end thereof extends out from the surface of the substrate 100 and into the protection cover 300. In other embodiments, the sound transmission hole 330 may also penetrate the substrate 100 from the back surface of the substrate 100 to communicate with the protection cover 300.
Fig. 2 is a schematic diagram of a chip package structure 010 according to another embodiment of the invention. As shown in fig. 2, in an alternative embodiment, the sound transmission holes 330 may have two or more than two sound transmission holes 330, and different sound transmission holes 330 are oriented differently, so that sound signals in different directions can be better received, and the sensitivity is improved. Of course, in alternative embodiments, the orientation of the sound transmission holes 330 can be adjusted according to the requirement, and is not limited to being parallel to the substrate 100, such as being perpendicular to the substrate 100.
In this embodiment, the protective cover 300 includes a cover 310 and a channel plate 320 connected to the outer side of the cover 310, the cover 310 covers the processing chip 210 and the microphone chip 200 therein, the edge of the cover 310 adjacent to the substrate 100 has a notch, the channel plate 320 is connected to the upper edge of the notch and is parallel to the substrate 100, and a sound transmission hole 330 is formed between the channel plate 320 and the substrate 100. In this embodiment, the material of the protection cover 300 may be ceramic or metal, and when it is metal, it can play a role of electromagnetic shielding.
Further, as shown in FIG. 1, the enclosure 310 may be selected to be a rectangular enclosure 310. In an alternative embodiment, the enclosure 310 includes a top plate 312 and a side plate 311, the top plate 312 and the side plate 311 together form a cavity of the enclosure 310, the top plate 312 is located on a side of the enclosure 310 away from the substrate 100, the notch is formed in the side plate 311, and the rf chip 520 is disposed on an outer side of the top plate 312. In the embodiment, because the channel plate 320 is provided, the channel plate 320 encloses a sound transmission hole 330 having a certain length, one end (inner end) of the sound transmission hole 330 is connected to the notch on the side plate 311, and the other end (outer end) is connected to the outer side of the chip packaging structure 010 for transmitting sound.
It should be understood that, in an alternative embodiment, the structure of the channel plate 320 may not be provided, and only the notch on the side plate 311 is used as the sound transmission hole 330. Alternatively, the side plate 311 may be provided with a through hole (instead of the above-mentioned notch), and the through hole is connected to a tubular channel structure (instead of the above-mentioned channel plate 320), and the tubular channel structure forms the sound transmission hole 330 having a certain length.
In the present embodiment, one of the advantages of forming the sound transmission hole 330 with a certain length through the channel plate 320 is to facilitate forming the outer end of the sound transmission hole 330 exposed outside the chip packaging structure 010 by cutting in the manufacturing process. It can be understood that, during the manufacturing process of the chip package structure 010, a plurality of chip package structures 010 may be formed on a large substrate 100 together, and finally, a single chip package structure 010 is formed by cutting. The encapsulation 400 and the protection covers 300 of the different chip package structures 010 may be connected together before dicing, and in an alternative embodiment, the protection covers 300 are connected by respective channel plates 320. When the two channel plates 320 (which are integrated before cutting) are cut, the outer ends of the sound transmission holes 330 are formed at the cut (for example, the right side of the embodiment of fig. 1). The protective covers 300 of the two chip package structures 010 are separated by cutting the channel plate 320, so that the cutting surface is small, and the cutting difficulty is reduced.
Fig. 3 is an enlarged view of a portion III of fig. 1. As shown in fig. 3, in an alternative embodiment, a second transmission line 322 is disposed on the protective cover 300, the second transmission line 322 is separated from the protective cover 300 by an insulating layer 324, and two ends of the second transmission line 322 are respectively connected to the first transmission line 510 and the rf chip 520. In the present embodiment, the second transmission line 322 is disposed on the channel board 320, and therefore, in the present embodiment, the second transmission line 322 may be disposed on the channel board 320 to connect the rf chip 520 and the antenna 500. The rf chip 520 is connected to one end of the second transmission line 322 and the circuit on the substrate 100 by wire bonding. In the embodiment, the protection cover 300 is made of a metal material, and in order to avoid short circuit, an insulating layer 324 is required to separate the second transmission line 322 from the protection cover 300. When the material of the protective cover 300 is an insulating material such as ceramic, the insulating layer 324 may not be provided.
In this embodiment, a connection channel is embedded between the inner side surface and the outer side surface of the protection cover 300 (specifically, the channel plate 320), both ends of the connection channel penetrate through the outer side surface of the protection cover 300, the second transmission line 322 is embedded in the connection channel and separated from the inner wall of the connection channel by an insulating layer 324, and both ends of the second transmission line 322 are respectively exposed from both ends of the connection channel. Of course, in other alternative embodiments, the connection channel may be replaced by a groove body disposed on the outer surface of the protection cover 300, and the second transmission line 322 is directly disposed on the surface of the protection cover 300 without disposing the connection channel, as long as the insulation between the second transmission line and the protection cover 300 is ensured. In addition, the second transmission line 322 may not be provided on the channel plate 320, and may be provided at another position of the protective cover 300, as required.
In order to reduce the volume of the whole package, a slot may be formed on the top plate 312 of the housing 310 to accommodate at least a portion of the rf chip 520.
In the present embodiment, the package 400 is also substantially rectangular, and the antenna 500 is formed on the surface of the package 400 away from the substrate 100. The first transmission line 510 vertically penetrates the package 400, and the upper and lower ends thereof are respectively connected to the antenna 500 and the second transmission line 322, so as to be electrically connected to the rf chip 520.
In the embodiment of the present invention, the first transmission line 510, the second transmission line 322, and the antenna 500 may be formed by silver paste, copper paste, aluminum paste, conductive ink, and the like, so as to implement the function of transmitting electrical signals.
In this embodiment, solder balls 110 are further arranged on the back surface (the surface where no chip is arranged) of the substrate 100 in an array.
In the chip package structure 010 provided by the embodiment of the present invention, the rf chip 520 is disposed on the protective cover 300, the antenna 500 is disposed on the surface of the package 400, and the first transmission line 510 and the second transmission line 322 are connected together, so that the integration of the sound receiving and processing function and the signal transmitting function is realized, and more usage scenarios are satisfied. And the structure is compact and stable, which is beneficial to the miniaturization of the equipment.
FIG. 4 is a flow chart illustrating a method for fabricating a chip package structure according to an embodiment of the present invention; fig. 5 to 9 are schematic views illustrating a chip package structure 010 during a manufacturing process according to an embodiment of the invention. As shown in fig. 4 to fig. 9, the method for manufacturing a chip package structure according to an embodiment of the present invention may be used to manufacture the chip package structure 010 according to the above embodiment of the present invention, and the steps include:
and step S100, arranging a processing chip and a microphone chip on the substrate, wherein the microphone chip is connected with a circuit on the substrate through the processing chip.
In this embodiment, a plurality of processing chips 210 and microphone chips 200 of the chip package structure 010 to be manufactured may be arranged on a large substrate 100, which may greatly improve manufacturing efficiency. Taking the example of manufacturing two chip package structures 010 at the same time, as shown in fig. 5, two sets of processing chips 210 and microphone chips 200 are disposed on the substrate 100, the microphone chips 200 are connected to the processing chips 210 by wire bonding, and the processing chips 210 are connected to the chips on the substrate 100 by wire bonding, as shown in fig. 5, so as to implement signal transmission.
And step S200, manufacturing a protective cover to cover the microphone chip and the processing chip, wherein the substrate and/or the protective cover are/is provided with sound transmission holes.
As shown in fig. 6, the microphone chip 200 and the processing chip 210 are covered by a protective cover 300, and optionally, the protective cover 300 and the substrate 100 may be connected by soldering. In the present embodiment, the protection covers 300 of the two chip packaging structures 010 are connected together, specifically, connected together through the channel plate 320, that is, the sound transmission holes 330 are connected, and the cutting position in the subsequent cutting is at the channel plate 320. Of course, in alternative embodiments, two protection covers 300 separated from each other may be provided to cover the two groups of chips respectively. It should be understood that in other embodiments, while the protective cover 300 may have a plurality of sound transmission holes 330, each differently oriented sound transmission hole 330 is connected to a different one of the protective covers 300. When the sound transmission hole 330 is opened on the protection cover 300, the protection cover 300 including the sound transmission hole 330 can be prefabricated; when the sound transmission hole 330 is opened in the substrate 100, a protective cover having the sound transmission hole 330 may be prepared.
Step S300, arranging a radio frequency chip on the protective cover.
Specifically, as shown in fig. 7, the rf chip 520 may be mounted on the protective cover 300. Alternatively, a groove may be provided on the outer side of the protective cover 300, and the rf chip 520 may be embedded therein to reduce the package volume. The RF chip 520 is preferably disposed on the outside of the top plate 312 of the enclosure 310, but may be disposed at other positions of the protective cover 300.
In this embodiment, the second transmission line 322 is pre-disposed on the protection cover 300, and the rf chip 520 is connected to the circuit on the substrate 100 and one end of the second transmission line 322 by wire bonding.
Step S400, a package body is manufactured to be wrapped on the protective cover and the radio frequency chip.
Specifically, as shown in fig. 8, the protective covers 300 and the rf chips 520 on the substrate 100 are all wrapped at one time by using a plastic package process. After the package 400 is formed, the two chip package structures 010 (in an unfinished state) may be separated by cutting, and one end of the sound transmission hole 330 may be exposed at the cut position; or cutting can be temporarily not carried out, and cutting is carried out after all the structures to be subsequently set are set. In the embodiment of fig. 8, the sound transmission holes 330 of the two protection covers 300 are still connected.
Step S500, a first transmission line is buried in the package, and an antenna is disposed outside the package, so that the antenna is connected to the rf chip through the first transmission line.
In this embodiment, a connection hole may be opened from the outside of the package 400 inward, the bottom of the connection hole extends to the second transmission line 322 on the protection cover 300, then a conductive material is filled in the connection hole to form a first transmission line 510, and then the antenna 500 is disposed outside the package 400 so that the antenna 500 is connected to the first transmission line 510, as shown in fig. 9. Specifically, the connection holes can be formed by laser, and the filled conductive material can be silver paste, copper paste and other metals, or conductive ink. After the first transmission line 510 is formed, the first transmission line 510 is connected to the second transmission line 322. After the antenna pattern is formed on the surface of the package 400 by using laser, the antenna pattern may be formed by printing/coating; the antenna pattern can also be filled after a groove is formed in one step by adopting a plastic package mold; the antenna pattern may be formed by forming the antenna pattern grooves together when the connection hole is opened by laser, and then coating/printing a conductive material. The antenna 500 is arranged on the package 400, so that the problem that the substrate bonding pad is easy to break down when the antenna grounding bonding pad is manufactured on the substrate by laser grooving can be avoided. The conductive material of the antenna 500 may be a material that can satisfy the purpose of transmission or reception, and has characteristics of low resistivity, stable signal, and the like. For example, conductive ink, aluminum paste, copper paste, silver paste, etc. can be selected. After that, the solder balls 110 may be disposed on the back surface of the substrate 100.
After the necessary components of the chip package structure 010 are manufactured, cutting may be performed at the channel plate 320 of the protection cover 300 to form a single chip of the chip package structure 010 by cutting, and the end of the sound transmission hole 330 is formed at the cut and exposed on the surface of the package structure, so as to form the chip package structure 010 shown in the embodiment of fig. 1 after cutting. The cutting operation is performed after the plastic encapsulation process, and the package 400 can play a role in protection: when the protective cover 300 is cut, cracks of a welding structure between the bottom of the protective cover 300 and the substrate 100 are prevented from being generated, and the welding reliability is improved.
It should be understood that, in the embodiment, a final cutting manner is adopted, so that the chip packaging structures 010 are manufactured at the same time, and the efficiency is improved. In other embodiments, the time point of the cutting may be changed, such as cutting the antenna 500 after the package 400 is completed and before the antenna is manufactured; even the single-chip package structure 010 can be fabricated independently, and the sound transmission hole 330 is exposed after the package 400 is completed.
The embodiment of the invention also provides electronic equipment comprising the chip packaging structure 010 provided by the embodiment of the invention. The electronic device may be a communication device.
To sum up, the chip package structure 010 of the embodiment of the invention includes a substrate 100, a microphone chip 200 and a processing chip 210 disposed on the substrate 100, a protection cover 300 covering the microphone chip 200 and the processing chip 210, a radio frequency chip 520 disposed on an outer surface of the protection cover 300, a package 400 wrapping the protection cover 300 and the radio frequency chip 520, and an antenna 500 disposed on a surface of the package 400. The antenna 500 is arranged on the surface of the package body 400, the radio frequency chip 520 is arranged outside the protective cover 300, and the antenna 500 structure, the microphone chip 200 and the processing chip 210 are connected through the first transmission line 510, so that the integration of the antenna 500 structure, the microphone chip 200 and the processing chip 210 is realized, the chip package structure 010 can receive and process acoustic signals and can transmit signals through the antenna 500, and the chip package structure is powerful in functionality and can meet more use requirements; and the structure is compact, which is beneficial to the miniaturization of electronic equipment.
The manufacturing method provided by the embodiment of the invention is used for manufacturing the chip packaging structure 010. The electronic device provided by the embodiment of the invention comprises the chip packaging structure 010, so that the electronic device has the advantages of more functions and compact structure.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A chip package structure, comprising:
the microphone chip is connected with a circuit on the substrate through the processing chip;
the protective cover is arranged on the substrate and covers the microphone chip and the processing chip;
the radio frequency chip is arranged on the outer surface of the protective cover and is electrically connected with the circuit on the substrate;
the packaging body is wrapped on the outer sides of the protective cover and the radio frequency chip and exposes out of the sound transmission hole;
the antenna is arranged on the surface of the packaging body and is electrically connected with the radio frequency chip through a first transmission line buried in the packaging body;
the substrate and/or the protective cover form the sound transmission hole, and the sound transmission hole is communicated with the cavity of the protective cover and the outer side of the chip packaging structure.
2. The chip package structure according to claim 1, wherein the sound transmission hole is oriented parallel to the substrate.
3. The chip package structure according to claim 2, wherein the protection cover includes a cover body and a channel plate connected to an outer side of the cover body, the cover body covers the processing chip and the microphone chip therein, an edge of the cover body adjacent to the substrate has a notch, the channel plate is connected to an upper edge of the notch and is parallel to the substrate, and the channel plate and the substrate form the sound transmission hole therebetween.
4. The chip package structure according to claim 3, wherein the cover body includes a top plate and a side plate, the top plate and the side plate together form a cavity of the cover body, the top plate is located on a side of the cover body away from the substrate, the notch is formed in the side plate, and the radio frequency chip is disposed on an outer side of the top plate.
5. The chip package structure according to claim 1, wherein a second transmission line is disposed on the protective cover, the second transmission line is separated from the protective cover by an insulating layer, and two ends of the second transmission line are respectively connected to the first transmission line and the rf chip.
6. The chip package structure according to claim 5, wherein a connection channel is buried between an inner side surface and an outer side surface of the protection cover, both ends of the connection channel penetrate through the outer side surface of the protection cover, the second transmission line is buried in the connection channel and separated from an inner wall of the connection channel by the insulating layer, and both ends of the second transmission line are exposed from both ends of the connection channel, respectively.
7. The chip package structure according to claim 5, wherein the protection cover comprises a cover body and a channel plate connected to an outer side of the cover body, the cover body covers the processing chip and the microphone chip therein, an edge of the cover body adjacent to the substrate has a notch, the channel plate is connected to an upper edge of the notch and is parallel to the substrate, and the channel plate and the substrate form the sound transmission hole therebetween; the second transmission line is arranged on the channel plate, and the radio frequency chip is connected to one end of the second transmission line in a routing mode.
8. A method for manufacturing a chip packaging structure is characterized by comprising the following steps:
arranging a processing chip and a microphone chip on a substrate, wherein the microphone chip is connected with a circuit on the substrate through the processing chip;
manufacturing a protective cover to cover the microphone chip and the processing chip, wherein a sound transmission hole is formed in the substrate and/or the protective cover;
arranging a radio frequency chip on the protective cover;
manufacturing a packaging body to wrap the protective cover and the radio frequency chip;
and embedding a first transmission line in the packaging body, and arranging an antenna outside the packaging body so as to enable the antenna to be connected with the radio frequency chip through the first transmission line.
9. The method for manufacturing the chip package structure according to claim 8, wherein a second transmission line is disposed on the protective cover, and the rf chip is electrically connected to the second transmission line; the first transmission line that sets up to bury in the packaging body to set up the antenna outside the packaging body, so that the antenna passes through the first transmission line and connects the radio frequency chip, specifically include:
a connecting hole is formed from the outer side of the packaging body to the inner side, and the bottom of the connecting hole extends to the second transmission line on the protection cover;
filling a conductive material in the connecting hole to form the first transmission line;
and arranging the antenna outside the packaging body so as to connect the antenna to the first transmission line.
10. An electronic device comprising the chip packaging structure according to any one of claims 1 to 7.
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| CN202110190855.5A CN112551475B (en) | 2021-02-20 | 2021-02-20 | Chip packaging structure, manufacturing method thereof and electronic equipment |
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| CN113415781B (en) * | 2021-06-17 | 2023-05-23 | 甬矽电子(宁波)股份有限公司 | Double MEMS chip packaging structure and double MEMS chip packaging method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070041076A1 (en) * | 2005-08-19 | 2007-02-22 | Fan Zhong | MEMS device having support structures configured to minimize stress-related deformation and methods for fabricating same |
| US20080186247A1 (en) * | 2006-08-03 | 2008-08-07 | International Business Machines Corporation | VERSATILE Si-BASED PACKAGING WITH INTEGRATED PASSIVE COMPONENTS FOR mmWAVE APPLICATIONS |
| CN101301993A (en) * | 2007-05-11 | 2008-11-12 | 北京大学 | MEMS device vacuum encapsulation method |
| CN201321377Y (en) * | 2007-11-02 | 2009-10-07 | 宝星电子株式会社 | Micro electro mechanical system microphone package with PCB provided with sound holes |
| CN206118019U (en) * | 2016-09-06 | 2017-04-19 | 广东欧珀移动通信有限公司 | Packaging body of microphone, miniature microphone and mobile terminal |
| CN209562739U (en) * | 2019-03-25 | 2019-10-29 | 联想(北京)有限公司 | Microphone packaging scheme and electronic equipment |
| CN210340322U (en) * | 2018-12-31 | 2020-04-17 | 瑞声科技(新加坡)有限公司 | Packaging structure of electronic device |
-
2021
- 2021-02-20 CN CN202110190855.5A patent/CN112551475B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070041076A1 (en) * | 2005-08-19 | 2007-02-22 | Fan Zhong | MEMS device having support structures configured to minimize stress-related deformation and methods for fabricating same |
| US20080186247A1 (en) * | 2006-08-03 | 2008-08-07 | International Business Machines Corporation | VERSATILE Si-BASED PACKAGING WITH INTEGRATED PASSIVE COMPONENTS FOR mmWAVE APPLICATIONS |
| CN101301993A (en) * | 2007-05-11 | 2008-11-12 | 北京大学 | MEMS device vacuum encapsulation method |
| CN201321377Y (en) * | 2007-11-02 | 2009-10-07 | 宝星电子株式会社 | Micro electro mechanical system microphone package with PCB provided with sound holes |
| CN206118019U (en) * | 2016-09-06 | 2017-04-19 | 广东欧珀移动通信有限公司 | Packaging body of microphone, miniature microphone and mobile terminal |
| CN210340322U (en) * | 2018-12-31 | 2020-04-17 | 瑞声科技(新加坡)有限公司 | Packaging structure of electronic device |
| CN209562739U (en) * | 2019-03-25 | 2019-10-29 | 联想(北京)有限公司 | Microphone packaging scheme and electronic equipment |
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