KR101885158B1 - Carrier film with variable hardness - Google Patents

Abstract

The present invention relates to a hardness variable carrier film for controlling the depth of penetration of an element into a carrier film by controlling the hardness of the carrier film composed of a multilayer adhesive layer to transfer the element to the substrate.
To this end, the present invention comprises a base film, a first adhesive layer, and a second adhesive layer.
The first adhesive layer is formed on one surface of the base film, and a device to be transferred is attached and press-fitted. The second adhesive layer is formed between the base film and the first adhesive layer, and the hardness changes to control whether the device is pressed or not. The magnitude of the adhesive force formed between the device and the first adhesive layer or the second adhesive layer is proportional to the indentation depth at which the device is pressed into the first adhesive layer or the second adhesive layer, The element is pressed into the first adhesive layer when the first adhesive layer has a first hardness and the second hardness is weaker than the first hardness when the second adhesive layer has a second hardness lower than the first hardness, 2 adhesive layer.

Description

Carrier film with variable hardness < RTI ID = 0.0 >

The present invention relates to a hardness-variable carrier film, and more particularly, to a hardness-variable carrier film for controlling transfer of an element by controlling the depth of penetration of the carrier film by controlling the hardness of the carrier film composed of a multilayer adhesive layer will be.

In general, displays using micro LEDs are emerging as next-generation advanced displays to replace conventional displays. In order to produce such a micro LED display, the technology of transferring each LED to a modular circuit board is the key.

The adhesive strength of the adhesive carrier film used in the conventional transfer process can be controlled only by adjusting the chemical composition of the adhesive layer. In the case of the same chemical component, the adhesive force generally has the same adhesive force.

Therefore, in order to move the device using the difference in adhesion between the carrier film and the substrate, the carrier film and the substrate are pressed to move the device on the relatively weak adhesive side to the side having relatively strong adhesive force, It is impossible to move the device when it is placed on a substrate having a strong adhesive force.

Thus, by adjusting process conditions, physical properties, and thickness of the adhesive layer of the carrier film such as load, separation speed, and degree of curing, the adhesive layer has appropriate adhesive force according to the device to be transferred.

However, in the case of the above-mentioned pressure-sensitive adhesive layer, the range of the adjustable adhesive force is limited, and there is a problem in that the possibility of success of the transfer process is lowered depending on the type, shape and material of the device.

Korean Patent Laid-Open Publication No. 10-2016-0080265 (entitled "Transfer device of micro device, method of transferring micro device and method of manufacturing transfer device thereof, publication date: July 7, 2016)

The object of the present invention is to provide a hardness-variable carrier film for controlling the penetration depth of the carrier film to control the hardness of the carrier film composed of a multilayer pressure-sensitive adhesive layer to transfer the device.

In order to solve the above-mentioned problems, the present invention provides a base film, A first adhesive layer formed on one surface of the base film and having an element to be transferred adhered and press-fitted therein; And a second adhesive layer which is formed between the base film and the first adhesive layer and changes in hardness so as to control whether or not the device is pressed into the first adhesive layer and between the device and the first adhesive layer or between the second adhesive layer The depth of the adhesive force formed on the first adhesive layer is proportional to the depth of indentation in which the device is pressed into the first adhesive layer or the second adhesive layer and when the second adhesive layer has the first hardness, Wherein when the second adhesive layer has a second hardness lower than the first hardness, the element penetrates through the first adhesive layer and presses into the second adhesive layer. to provide.

Wherein the second adhesive layer has a first hardness when a first temperature is applied to the second adhesive layer and a second hardness of the second adhesive layer is greater than a hardness of the second adhesive layer, The second adhesive layer may have the second hardness when a second temperature higher than the first temperature is applied.

The hardness of the second adhesive layer may be changed to the first hardness or the second hardness according to the temperature of the external heater that heats the second adhesive layer.

The hardness of the second adhesive layer can be changed to the first hardness or the second hardness according to the temperature of the heater roller for heating and pressing the second adhesive layer.

Further comprising a first mask layer having a first opening formed on the other surface of the base film, wherein the hardness of the second adhesive layer region opened by the first opening depends on the intensity of the laser radiated to the first mask layer Can be changed to the first hardness or the second hardness.

Further comprising a built-in heater formed in a predetermined area between the base film and the second adhesive layer to heat the second adhesive layer, wherein the hardness of the second adhesive layer region is changed according to the temperature of the built- 1 hardness or the second hardness.

Wherein the second adhesive layer has a first hardness when light is irradiated to the second adhesive layer at a first wavelength, and the second adhesive layer has the first hardness, The second adhesive layer may have the second hardness when light is irradiated to the second adhesive layer at a second wavelength longer than the first wavelength.

The first wavelength may be an ultraviolet ray, and the second wavelength may be a visible ray.

And a second mask layer having a second opening formed on the other surface of the base film, wherein a hardness of the second adhesive layer area opened by the second opening is changed according to a wavelength of light irradiated to the second mask layer Can be changed to the first hardness or the second hardness.

A base film; A first adhesive layer formed on one surface of the base film and having an element to be transferred adhered and press-fitted therein; A second adhesive layer formed between the base film and the first adhesive layer and having a hardness varying to control whether the device is pressed or not; And a third adhesive layer which is formed between the base film and the second adhesive layer and whose hardness changes to control whether the device is pressed or not, and wherein the device, the first adhesive layer, the second adhesive layer, The size of the adhesive force formed between the third adhesive layers is proportional to the indentation depth at which the device is press-fitted into the first adhesive layer, the second adhesive layer or the third adhesive layer, The first adhesive layer is press-fitted to the first adhesive layer, and when the second adhesive layer is the same as the hardness of the first adhesive layer or is weaker than the hardness of the first adhesive layer When the third adhesive layer has a second hardness and has a third hardness that is stronger than the second hardness, the element penetrates through the first adhesive layer and is pressed into the second adhesive layer, Second When the third adhesive layer has a hardness and the fourth hardness is equal to or less than the second hardness, the element passes through the first adhesive layer and the second adhesive layer, Wherein the hardness variable carrier film is press-fitted into the hardness varying carrier film.

Wherein the second adhesive layer has the first hardness when the first temperature is applied to the second adhesive layer and the second adhesive layer has the second hardness when the first temperature is applied to the second adhesive layer, When the second temperature is higher than the first temperature, the second adhesive layer has the second hardness, and when the second temperature is applied to the third adhesive layer, And the third adhesive layer may have the fourth hardness when a third temperature higher than the second temperature is applied to the third adhesive layer.

Wherein at least one of the second adhesive layer and the third adhesive layer is made of a material whose hardness changes depending on an applied temperature and the other of the second adhesive layer and the third adhesive layer has a wavelength Wherein the hardness of the second adhesive layer is determined by the temperature applied to the second adhesive layer or the third adhesive layer and the wavelength of the irradiated light to the first hardness or the second hardness, And the hardness of the third adhesive layer may be varied by the third hardness or the fourth hardness.

The micro-element transfer method according to the present invention has the following effects.

First, there is an advantage in that a continuous process can be performed by combining rollers and flat plates on any desired substrate in a large amount of micro devices.

Secondly, there is an advantage in that the adhesive transfer layer is formed in a multilayer structure to have a more distinct adhesive force difference, thereby increasing the transfer yield of the device.

1 is a view showing a carrier film according to an embodiment of the present invention.
Fig. 2 is a view for explaining the temperature range in which the second adhesive layer is cured in the carrier film of Fig. 1;
Fig. 3 is a view showing a first embodiment of the second adhesive layer in the carrier film of Fig. 1. Fig.
Fig. 4 is a view showing a modified example of the first embodiment of the second adhesive layer in the carrier film of Fig. 1;
Fig. 5 is a view showing a second embodiment of the second adhesive layer in the carrier film of Fig. 1. Fig.
Fig. 6 is a view showing a modification of the second embodiment of the second adhesive layer in the carrier film of Fig. 1;
Fig. 7 is a view showing a third embodiment of the second adhesive layer in the carrier film of Fig. 1;
Fig. 8 is a view showing a modified example of the third embodiment of the second adhesive layer in the carrier film of Fig. 1;
Fig. 9 is a view showing a fourth embodiment of the second adhesive layer in the carrier film of Fig. 1;
10 is a view showing a modified example of the fourth embodiment of the second adhesive layer in the carrier film of Fig.
11 is a view showing a fifth embodiment of the second adhesive layer in the carrier film of Fig.
12 is a view showing a modified example of the fifth embodiment of the second adhesive layer in the carrier film of Fig.
13 is a view showing a sixth embodiment of the second adhesive layer in the carrier film of Fig.
14 is a view showing a modified example of the sixth embodiment of the second adhesive layer in the carrier film of Fig.
15 is a view showing a carrier film according to another embodiment of the present invention.
16 is a view showing a modified example of the carrier film of Fig.

Hereinafter, preferred embodiments of the present invention in which the above-mentioned problems to be solved can be specifically realized will be described with reference to the accompanying drawings. In describing the embodiments, the same names and the same symbols are used for the same configurations, and additional description thereof will be omitted in the following.

When an element such as a layer, a film, an area, a plate, or the like is referred to as being "on" another element throughout the specification, it includes not only the element "directly above" another element but also the element having another element in the middle. And "above" means located above or below the object portion, and does not necessarily mean that the object is located on the upper side with respect to the gravitational direction.

When an element is referred to as "including" an element throughout the specification, it means that the element may further include other elements unless specifically stated otherwise. The sizes and thicknesses of the respective components shown in the drawings are arbitrarily shown for convenience of explanation, and the present invention is not limited to the illustrated ones.

One embodiment of the carrier film according to the present invention will be described with reference to FIGS. 1 to 14. FIG.

1, a carrier film according to the present invention is formed on one side of a base film 19 and a base film 19 and includes a first adhesive layer 11 And a second adhesive layer 12 which is formed between the base film 19 and the first adhesive layer 11 and whose hardness changes to control whether the device D is pressed or not.

Specifically, when the second adhesive layer 12 has a first hardness H1 that is higher than the hardness of the first adhesive layer 11 as shown in FIG. 1A, the element D is bonded to the first adhesive layer 11 And when the second adhesive layer 12 has the second hardness H2 equal to the hardness of the first adhesive layer 11 or weaker than the hardness of the first adhesive layer 11, The second adhesive layer 12 is pressed through the first adhesive layer 11.

That is, the indentation depth at which the element D is pressed into the adhesive layer is adjusted according to the hardness of the second adhesive layer 12, and the depth of the element D and the adhesive layer The magnitude of the adhesive force to be formed varies.

The larger the contact depth between the adhesive layer and the edge of the element D becomes, the larger the magnitude of the adhesive force formed between the element D and the adhesive layer becomes, as the depth of insertion of the element D into the adhesive layer becomes larger, The frictional force between the adhesive layer (D) and the adhesive layer is increased. Therefore, as the depth of indentation is increased, a greater frictional force is generated and the magnitude of the adhesive force formed between the device (D) and the adhesive layer is increased.

A second embodiment of the second adhesive layer 12 will be described with reference to FIGS. 2 to 4. FIG.

First, the first indentation depth d1 refers to the indentation depth at which one side of the element D is pressed into the first adhesive layer 11 according to the hardness of the second adhesive layer 12 by an external pressing force, The second indentation depth d2 means the indentation depth at which one side of the element D penetrates through the first adhesive layer 11 and is press-fitted into the second adhesive layer 12 by an externally applied pressing force, The first adhesive layer F1 and the second adhesive layer F2 refer to the adhesive force formed between the device D and the first adhesive layer 11 and the second adhesive force F2 corresponds to the adhesive force between the device D and the first adhesive layer 11 and the second adhesive layer 11, 12). ≪ / RTI >

The fifth adhesive force F5 is applied to the substrate 20 coated with the fifth adhesive layer 22 having a certain hardness on the other surface of the element D and the base surface 21 by an externally applied pressing force, Means the adhesive force formed between the other surface of the element D and the fifth adhesive layer 22.

Here, the portion in which the first adhesive force F1, the second adhesive force F2, and the fifth adhesive force F5 are mainly generated is a moiré pattern.

Before describing the first embodiment of the second adhesive layer 12, the temperature range at which the second adhesive layer 12 made of a material whose hardness changes according to the temperature applied through the FIG. 2 is cured will be described.

The second adhesive layer 12 may be composed of a liquid crystalline polymer material which is changed from an elastic body to a viscoelastic body due to a rapid phase change near a specific temperature. In this specification, as shown in FIG. 2, A fluorinated polymer causing abrupt phase change in the first adhesive layer 12 is used as a material for forming the second adhesive layer 12 and a second adhesive layer 12 is bonded to the first adhesive layer 12 at a first hardness H1 according to the properties of the fluorinated polymer. And the second temperature T2 forming the second adhesive layer 12 at the second hardness H2 means a temperature of 45 deg. C or higher .

3 (a), the second adhesive layer 12 is heated to the first temperature T1 by an external heater (not shown) which heats the second adhesive layer 12, so that the first hardness One surface of the element D is pressed into the first adhesive layer 11 at the first indentation depth d1 by the externally applied pressing force so that the distance between the element D and the first adhesive layer 11 And the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

At this time, the first adhesive force F1 is formed to be relatively smaller than the fifth adhesive force F5, so that the device D is subjected to the release process and the device D is attached to the fifth adhesive layer 22 as shown in FIG. The first adhesive layer 11 is released.

Such a process can be utilized in a flaking process in which devices attached to a carrier film in a general semiconductor process are transferred to a target substrate.

4, when the second adhesive layer 12 is heated to the second temperature T2 by the external heater for heating the second adhesive layer 12 to have the second hardness H2 , One side of the element D penetrates through the first adhesive layer 11 and is pressed into the second adhesive layer 12 at the second indentation depth d2 in accordance with the pressing force applied from the outside, A second adhesive force F2 is formed between the first adhesive layer 11 and the second adhesive layer 12.

In addition, the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

The second indentation depth d2 is formed to be larger than the first indentation depth d1 so that the second adhesive force F2 is formed to be relatively larger than the first adhesive force F1 and the second adhesive force F2 is relatively larger than the fifth adhesive force F5 so that the device D is subjected to a release process so that the device D is adhered to the first adhesive layer 11 and the second adhesive layer 12, 22).

Such a process can be utilized in a picking process in which devices attached to a source substrate in a general semiconductor process are transferred to a carrier film.

 As a result, the depth of indentation of the element D can be controlled by controlling the hardness of the second adhesive layer 12 in accordance with the temperature of the external heater for heating the second adhesive layer 12, It is possible to determine the direction in which the light is incident.

A second embodiment of the second adhesive layer 12 will be described with reference to FIGS. 5 to 6. FIG.

A first roller R1 for heating the base film 19 toward the substrate 20 and heating the second adhesive layer 12 to the first temperature T1, as shown in Fig. 5 (a) And the second roller R2 pressurizing the substrate 20 from the outside toward the first adhesive layer 11 side so that the second adhesive layer 12 has the first hardness H1 One surface of the element D is pressed into the first adhesive layer 11 at the first indentation depth d1 to form the first adhesive force F1 between the element D and the first adhesive layer 11, The other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

At this time, the first adhesive force F1 is formed to be relatively smaller than the fifth adhesive force F5, so that the device D is subjected to the release process and the device D is attached to the fifth adhesive layer 22 as shown in FIG. The first adhesive layer 11 is released.

6, a first roller R1 for externally pressing the base film 19 toward the substrate 20 and heating the second adhesive layer 12 to the second temperature T2, The second adhesive layer 12 has the second hardness H2 by the heater roller including the second roller R2 that externally presses the substrate 20 toward the first adhesive layer 11, One surface of the element D penetrates through the first adhesive layer 11 and is pressed into the second adhesive layer 12 at the second indentation depth d2 in accordance with the pressing force applied by the roller, A second adhesive force F2 is formed between the first adhesive layer 11 and the second adhesive layer 12.

In addition, the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

The second indentation depth d2 is formed to be larger than the first indentation depth d1 so that the second adhesive force F2 is formed to be relatively larger than the first adhesive force F1 and the second adhesive force F2 Is relatively larger than the fifth adhesive force F5 and is subjected to a releasing process so that the device D is adhered to the first adhesive layer 11 and the second adhesive layer 12 to form the fifth adhesive layer 22 ).

 As a result, by controlling the hardness of the second adhesive layer 12 according to the temperature at which the second adhesive layer 12 is heated in the heater roller, it is possible to control the depth of indentation of the element D, It is possible to determine the direction in which the light is incident.

The base film 19, the first adhesive layer 11 and the second adhesive layer 12 are arranged so as to be surrounded by cylindrical rollers having a heating function, and the temperature of the base film 19, the first adhesive layer 11 and the second adhesive layer 12 By changing the hardness of the second adhesive layer 12, the transport direction of the element D may be determined.

A third embodiment of the second adhesive layer 12 will be described with reference to FIGS. 7 to 8. FIG.

7 to 8, the second adhesive layer 12 is made of a material whose hardness varies according to the intensity of the emitted laser. In this embodiment, the base film 19 is formed of a light transmitting material do.
The second adhesive layer 12 is heated to the first temperature T1 to have the first hardness H1 when the laser having the first intensity L1 is radiated to the second adhesive layer 12, The second adhesive layer 12 is heated to the second temperature T2 to produce the second hardness L2 when the laser is radiated to the layer 12 at a second intensity L2 relatively weaker than the first intensity L1 H2.

A first mask layer 15 having a first opening 15a formed on the other surface of the base film 19 and a first mask layer 15 as a first mask layer 15, The area 12a of the second adhesive layer 12 opened by the first opening 15a is heated to the first temperature T1 to change to the first hardness H1 do.

The element D is attached to one surface of the first adhesive layer 11 corresponding to the first opening 15a and is pressed against one surface of the element D by an external pressing force as shown in FIG. Is pressed into the first adhesive layer 11 at the first indentation depth d1 to form a first adhesive force F1 between the element D and the first adhesive layer 11, 5 adhesive layer 22 to form a fifth adhesive force F5.

At this time, the first adhesive force F1 is formed to be relatively smaller than the fifth adhesive force F5, so that the device D is subjected to the release process and the device D is transferred to the fifth adhesive layer 22 as shown in FIG. And is released from the first adhesive layer 11 in an attached state.

On the other hand, as shown in FIG. 8, by irradiating a laser having a second intensity (L2) weaker than the first intensity (L1) to the first mask layer (15) The hardness of the region 12b of the layer 12 changes to the second hardness H2.

The element D is attached to one surface of the fifth adhesive layer 22 corresponding to the first opening 15a and one side of the element D penetrates through the first adhesive layer 11 The second adhesive force F2 between the element D and the first adhesive layer 11 and the second adhesive layer 12 is applied to the second adhesive layer 12 at the second indentation depth d2 .

In addition, the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

The second indentation depth d2 is formed to be larger than the first indentation depth d1 so that the second adhesive force F2 is formed to be relatively larger than the first adhesive force F1 and the second adhesive force F2 Is relatively larger than the fifth adhesive force F5 and the device D is subjected to a release process so that the device D is adhered to the first adhesive layer 11 and the second adhesive layer 12, 22).

The fourth embodiment of the second adhesive layer 12 will be described with reference to FIGS. 9 to 10 as follows.

A built-in heater 30 for heating the second adhesive layer 12 in a predetermined area between the base film 19 and the second adhesive layer 12 as shown in FIGS. 9 to 10, The hardness of a certain region of the second adhesive layer 12 varies depending on the temperature of the first adhesive layer 30.

The area 12c of the second adhesive layer 12 corresponding to the built-in heater 30 is heated to the first temperature T1 by the built-in heater 30, as shown in Fig. 9 (a) One surface of the element D is pressed against the first adhesive layer 11 by the first pressing depth d1 by an external pressing force as shown in Figure 9 (b) The first adhesive force F1 is formed between the device D and the first adhesive layer 11 and the other surface of the device D is adhered to the fifth adhesive layer 22 so that the fifth adhesive force F5 .

At this time, the first adhesive force F1 is formed to be relatively smaller than the fifth adhesive force F5, so that the device D is subjected to the release process and the device D is adhered to the fifth adhesive layer 22 as shown in FIG. 9 (c) The first adhesive layer 11 is released.

10, the area 12d of the second adhesive layer 12 corresponding to the built-in heater 30 is heated by the built-in heater 30 heating the predetermined area of the second adhesive layer 12, One surface of the element D penetrates through the first adhesive layer 11 and is pressed against the second adhesive layer 12 by the pressing force externally applied to the second adhesive layer 12 when the second adhesive layer 12 is heated to the second temperature T2, The second adhesive force F2 is formed between the element D and the first adhesive layer 11 and the second adhesive layer 12. As a result,

In addition, the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

The second indentation depth d2 is formed to be larger than the first indentation depth d1 so that the second adhesive force F2 is formed to be relatively larger than the first adhesive force F1 and the second adhesive force F2 Is relatively larger than the fifth adhesive force F5 and is subjected to a releasing process so that the device D is adhered to the first adhesive layer 11 and the second adhesive layer 12 to form the fifth adhesive layer 22 ).

As a result, by controlling the hardness of the second adhesive layer 12 according to the temperature at which the second adhesive layer 12 is heated in the built-in heater 30, it is possible to adjust the indentation depth of the element D, ) Can be determined, and such a transfer process can be utilized for selective transfer, which selectively picks or flicks the micro LED device.

A fifth embodiment of the second adhesive layer 12 will be described with reference to FIGS. 11 to 12 as follows.

11 to 12, the second adhesive layer 12 is made of a material whose hardness changes depending on the wavelength of the applied light, and the second adhesive layer 12 is formed of a material having a first wavelength W1 The second adhesive layer 12 has the first hardness H1 and the second adhesive layer 12 is irradiated with the light having the second wavelength W2 whose wavelength is relatively longer than the first wavelength W1, The second adhesive layer 12 has the second hardness H2.

In the present specification, the second adhesive layer 12 is made of azobenzene-based polymer whose hardness changes according to a specific wavelength, and the first wavelength W1 means ultraviolet rays and the second wavelength (W2) means visible light.

The second adhesive layer 12 may be made of a material whose hardness changes according to a specific wavelength band other than the azobenzene-based polymer, and the material of the second adhesive layer 12 The first wavelength W1 may have a wavelength of a visible light ray and the second wavelength W2 may have a wavelength of infrared rays.

11A, when the second adhesive layer 12 has the first hardness H1 by irradiating light having the first wavelength W1 to the second adhesive layer 12, , One surface of the element D is pressed into the first adhesive layer 11 at the first indentation depth d1 by the externally applied pressing force to form a first adhesive force F1 (F1) between the element D and the first adhesive layer 11 And the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

At this time, the first adhesive force F1 is formed to be relatively smaller than the fifth adhesive force F5, so that the device D is subjected to the release process, and the device D is attached to the fifth adhesive layer 22 as shown in FIG. The first adhesive layer 11 is released.

12, when the second adhesive layer 12 is irradiated with light having the second wavelength W2 to the second adhesive layer 12 and the second adhesive layer 12 has the second hardness H2, One side of the element D penetrates through the first adhesive layer 11 and is pressed into the second adhesive layer 12 at the second indentation depth d2 in accordance with the pressing force applied by the first adhesive layer 12, A second adhesive force F2 is formed between the layer 11 and the second adhesive layer 12.

In addition, the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

The second indentation depth d2 is formed to be larger than the first indentation depth d1 so that the second adhesive force F2 is formed to be relatively larger than the first adhesive force F1 and the second adhesive force F2 Is relatively larger than the fifth adhesive force F5 and is subjected to a releasing process so that the device D is adhered to the first adhesive layer 11 and the second adhesive layer 12 to form the fifth adhesive layer 22 ).

 As a result, by controlling the hardness of the second adhesive layer 12 in accordance with the wavelength of the light applied to the second adhesive layer 12, the depth of insertion of the element D can be controlled, The direction can be determined.

The sixth embodiment of the second adhesive layer 12 will be described with reference to FIGS. 13 to 14 as follows.

The base film 19 includes a second mask layer 16 having a second opening 16a formed on the other surface of the base film 19 as shown in Figure 13 (a). In this embodiment, And is formed of a permeable material.
The hardness of the region 12e of the second adhesive layer 12 opened by the second opening portion 16a by irradiating the second mask layer 16 with the light having the first wavelength W1 is set to the first hardness H1 ).

The element D is attached to one surface of the first adhesive layer 11 corresponding to the second opening 16a and the element D is pressed by an externally applied pressing force as shown in Figure 13 (b) The first adhesive layer 11 is pressed into the first adhesive layer 11 at the first indentation depth d1 to form a first adhesive force F1 between the element D and the first adhesive layer 11, Is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

At this time, the first adhesive force F1 is formed to be relatively smaller than the fifth adhesive force F5, so that the device D is subjected to a release process and the device D is attached to the fifth adhesive layer 22 as shown in FIG. The first adhesive layer 11 is released.

On the other hand, as shown in Fig. 14, by irradiating light having the second wavelength W2 to the second mask layer 16, the region 12f (Fig. 14) of the second adhesive layer 12 opened by the second opening portion 16a ) Changes to the second hardness H2.

The element D is attached to one surface of the fifth adhesive layer 22 corresponding to the second opening 16a and one surface of the element D penetrates through the first adhesive layer 11 The second adhesive force F2 between the element D and the first adhesive layer 11 and the second adhesive layer 12 is applied to the second adhesive layer 12 at the second indentation depth d2 .

In addition, the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

The second indentation depth d2 is formed to be larger than the first indentation depth d1 so that the second adhesive force F2 is formed to be relatively larger than the first adhesive force F1 and the second adhesive force F2 Is relatively larger than the fifth adhesive force F5 and the device D is subjected to a release process so that the device D is adhered to the first adhesive layer 11 and the second adhesive layer 12, 22).

Another embodiment of the carrier film according to the present invention will be described with reference to FIGS. 15 to 16. FIG.

The structure in which the first adhesive layer 11 and the second adhesive layer 12 varying in hardness according to temperature or light wavelength are formed on one surface of the base substrate according to the present embodiment is substantially the same as the above- The detailed description thereof will be omitted.

15 to 16, the carrier film according to the present embodiment is formed between the base film 19 and the second adhesive layer 12, and the hardness changes to determine whether the device D is press- And a third adhesive layer (13) in which the second adhesive layer (13) is controlled.

15 to 16, when the second adhesive layer 12 has a first hardness H1 which is higher than the hardness of the first adhesive layer 11, The second adhesive layer 12 is pressed into the first adhesive layer 11 and has the second hardness H2 equal to or less than the hardness of the first adhesive layer 11, The element D penetrates through the first adhesive layer 11 and is pressed into the second adhesive layer 12 when the first adhesive layer 13 has a third hardness H3 that is stronger than the second hardness H2, When the layer 12 has the second hardness H2 and the third adhesive layer 13 has the fourth hardness H4 which is equal to the second hardness H2 or less than the second hardness H2, Is pushed through the first adhesive layer 11 and the second adhesive layer 12 to the third adhesive layer 13.

As shown in FIG. 15, the third adhesive layer 13 is made of a material whose hardness varies according to the applied temperature, and the first adhesive layer 13 has a first temperature T1 or a second temperature T2 The third adhesive layer 13 has the third hardness H3 and when the third temperature T3 which is relatively higher than the second temperature T2 is applied to the third adhesive layer 13, And a fourth hardness H4.

When the third temperature T3 is applied to the second adhesive layer 12, the second adhesive layer 12 has the second hardness H2.

15 (a), when the second adhesive layer 12 and the third adhesive layer 13 are heated to the first temperature T1, the second adhesive layer 12 has the first hardness And the third adhesive layer 13 has the third hardness H3 and one surface of the element D is pressed against the first adhesive layer 11 by the first pressing depth d1 The first adhesive force F1 is formed between the element D and the first adhesive layer 11 and the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5, .

At this time, the first adhesive force F1 is formed to be relatively smaller than the fifth adhesive force F5 so that the device D is adhered to the fifth adhesive layer 22, and the first adhesive layer 11, Is released.

15 (b), when the second adhesive layer 12 and the third adhesive layer 13 are heated to the second temperature T2, the second adhesive layer 12 is heated to the second temperature T2, The first adhesive layer 11 has a hardness H2 and the third adhesive layer 13 has a third hardness H3 and one surface of the device D is pressed by the external force to penetrate the first adhesive layer 11, The second adhesive force F2 is formed between the element D and the first adhesive layer 11 and the second adhesive layer 12 so as to be pressed into the adhesive layer 12 at the second indentation depth d2.

The other side of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5 and the transfer direction of the element D is the second adhesive force F2 and the fifth adhesive force F5, As shown in Fig.

15 (c), when the second adhesive layer 12 and the third adhesive layer 13 are heated to the third temperature T3, the second adhesive layer 12 is heated to the second temperature T3, The first adhesive layer 11 and the second adhesive layer 13 have the hardness H2 and the third adhesive layer 13 have the fourth hardness H4. The first adhesive layer 11, the second adhesive layer 12 and the third adhesive layer 13 are pressed into the third adhesive layer 13 through the second adhesive layer 12 at the third indentation depth d3, A third adhesive force F3 is formed between the adhesive layers 13.

The other side of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5 and the transfer direction of the element D is the third adhesive force F3 and the fifth adhesive force F5, As shown in Fig.

On the other hand, as shown in FIG. 16, the second adhesive layer 12 may be made of a material whose hardness varies depending on the applied temperature, and the third adhesive layer 13 may have a hardness varying with the wavelength of light When the first wavelength W1 is applied to the third adhesive layer 13, the third adhesive layer 13 has the third hardness H3 and the third adhesive layer 13 has the third wavelength When the two wavelengths W2 are applied, the third adhesive layer 13 has the fourth hardness H4.

16 (a), the second adhesive layer 12 is made of a material whose hardness changes according to the temperature to be heated, and is heated to the first temperature T1 to have the first hardness H1 The one surface of the element D is pressed into the first adhesive layer 11 by the first pressing depth d1 by the pressing force externally applied to the first adhesive layer 11 so that the first adhesive strength 11 between the element D and the first adhesive layer 11 And the other surface of the element D is adhered to the fifth adhesive layer 22 to form the fifth adhesive force F5.

The transfer direction of the element D is determined by the relative difference between the first adhesive force F1 and the fifth adhesive force F5.

16 (b), the second adhesive layer 12 is heated to the second temperature T2 to have the second hardness H2, and the third adhesive layer 13 has the second hardness H2, One side of the element D penetrates through the first adhesive layer 11 to the second adhesive layer 12 in accordance with the pressing force externally applied to the second adhesive layer 12 and is irradiated with the wavelength W1 to have the third hardness H3, The second adhesive force F2 is formed between the element D and the first adhesive layer 11 and the second adhesive layer 12 and the other adhesive force F2 is formed between the element D and the second adhesive layer 12, 5 adhesive layer 22 to form a fifth adhesive force F5.

The transfer direction of the element D is determined by the relative difference between the second adhesive force F2 and the fifth adhesive force F5.

16 (c), the second adhesive layer 12 is heated to the second temperature T2 to have the second hardness H2, and the third adhesive layer 13 has the second hardness H2, One surface of the element D penetrates through the first adhesive layer 11 and the second adhesive layer 12 in accordance with the pressing force externally applied to the third adhesive layer 12 and is irradiated with the wavelength W2 to have the fourth hardness H4, The first adhesive layer 11, the second adhesive layer 12 and the third adhesive layer 13 are pressed into the adhesive layer 13 at the third indentation depth d3, An adhesive force F3 is formed.

The transfer direction of the element D is determined by the relative difference between the third adhesive force F3 and the fifth adhesive force F5.

The number of the adhesive layers deposited on one surface of the base film 19 can be freely changed according to the size, shape and material of the device D to be transferred.

As described above, the present invention is not limited to the above-described specific preferred embodiments, and various changes and modifications may be made by those skilled in the art without departing from the scope of the present invention as claimed in the claims. And such variations are within the scope of the present invention.

D: element
19: base film
11: first adhesive layer
12: Second adhesive layer
13: Third adhesive layer
20: substrate
21:
22: Fifth adhesive layer
15: first mask layer
15a: a first opening
16: second mask layer
16a: a second opening
R1: first roller
R2: second roller
30: Built-in heater

Claims (11)

A base film;
A first adhesive layer formed on one surface of the base film and having an element to be transferred adhered and press-fitted therein;
And a second adhesive layer which is formed between the base film and the first adhesive layer and whose hardness changes to control whether the device is pressed or not,
The magnitude of the adhesive force formed between the element and the first adhesive layer or the second adhesive layer is proportional to the indentation depth at which the element is press-fitted into the first adhesive layer or the second adhesive layer,
And the second adhesive layer is pressed into the first adhesive layer when the second adhesive layer has a first hardness that is higher than the hardness of the first adhesive layer and the second adhesive layer is the same as the hardness of the first adhesive layer, And the second hardness is weaker than the hardness of the first adhesive layer, the element penetrates through the first adhesive layer and presses into the second adhesive layer. The method according to claim 1,
The second adhesive layer is made of a material whose hardness changes depending on the applied temperature,
Wherein the second adhesive layer has the first hardness when the first temperature is applied to the second adhesive layer and the second temperature when the second adhesive layer has a second temperature relatively higher than the first temperature, And the pressure-sensitive adhesive layer has the second hardness. 3. The method of claim 2,
Wherein the hardness of the second adhesive layer is changed by the first hardness or the second hardness according to the temperature of the external heater for heating the second adhesive layer. 3. The method of claim 2,
Wherein the hardness of the second adhesive layer is changed by the first hardness or the second hardness according to the temperature of the heater roller for heating and pressing the second adhesive layer. 3. The method of claim 2,
Wherein the base film is formed of a light transmitting material,
Further comprising a first mask layer disposed on the other surface of the base film and having a first opening formed therein,
Wherein the hardness of the second adhesive layer region opened by the first opening varies with the first hardness or the second hardness according to the intensity of the laser radiated to the first mask layer film. 3. The method of claim 2,
And a built-in heater formed in a predetermined region between the base film and the second adhesive layer to heat the second adhesive layer,
Wherein the hardness of the second adhesive layer region varies with the first hardness or the second hardness according to the temperature of the built-in heater. The method according to claim 1,
The second adhesive layer is made of a material whose hardness changes according to the wavelength of the applied light,
Wherein the second adhesive layer has the first hardness when light is irradiated to the second adhesive layer at a first wavelength and irradiates light to the second adhesive layer at a second wavelength longer than the first wavelength Wherein the second adhesive layer has the second hardness. 8. The method of claim 7,
Wherein the base film is formed of a light transmitting material,
And a second mask layer disposed on the other surface of the base film and having a second opening,
Wherein the hardness of the second adhesive layer region opened by the second opening varies with the first hardness or the second hardness according to the wavelength of light irradiated to the second mask layer film. A base film;
A first adhesive layer formed on one surface of the base film and having an element to be transferred adhered and press-fitted therein;
A second adhesive layer formed between the base film and the first adhesive layer and having a hardness varying to control whether the device is pressed or not; And
And a third adhesive layer which is formed between the base film and the second adhesive layer and whose hardness changes to control whether the device is pressed or not,
Wherein the size of the adhesive force formed between the device and the first adhesive layer, the second adhesive layer, or the third adhesive layer is such that the device presses the first adhesive layer, the second adhesive layer, Which is proportional to the indentation depth,
And the second adhesive layer is pressed into the first adhesive layer when the second adhesive layer has a first hardness that is higher than the hardness of the first adhesive layer and the second adhesive layer is the same as the hardness of the first adhesive layer, When the third adhesive layer has a third hardness that is weaker than the hardness of the first adhesive layer and the third adhesive layer has a third hardness that is stronger than the second hardness, the element penetrates through the first adhesive layer to be pressed into the second adhesive layer And the second adhesive layer has the second hardness and the third adhesive layer has the fourth hardness equal to or less than the second hardness, the device further comprises a first adhesive layer and a second adhesive layer, Wherein the hardness-variable carrier film is press-fitted into the third adhesive layer through the adhesive layer. 10. The method of claim 9,
Wherein the second adhesive layer and the third adhesive layer are made of a material whose hardness changes according to an applied temperature,
Wherein the second adhesive layer has the first hardness when a first temperature is applied to the second adhesive layer and the second adhesive layer has a second hardness when a second temperature higher than the first temperature is applied to the second adhesive layer, Having a second hardness,
And the third adhesive layer has the third hardness when the second temperature is applied to the third adhesive layer, and when a third temperature higher than the second temperature is applied to the third adhesive layer, And the fourth hardness. 10. The method of claim 9,
Wherein at least one of the second adhesive layer and the third adhesive layer is made of a material whose hardness changes depending on an applied temperature and the other of the second adhesive layer and the third adhesive layer has a wavelength And is made of a material whose hardness changes,
The hardness of the second adhesive layer is varied by the first hardness or the second hardness by the temperature applied to the second adhesive layer or the third adhesive layer and the wavelength of the irradiated light, Wherein the hardness of the hardness-varying carrier film is varied by the third hardness or the fourth hardness.

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