KR101856556B1 - 취성 기판의 분단 방법 - Google Patents

취성 기판의 분단 방법 Download PDF

Info

Publication number
KR101856556B1
KR101856556B1 KR1020167033458A KR20167033458A KR101856556B1 KR 101856556 B1 KR101856556 B1 KR 101856556B1 KR 1020167033458 A KR1020167033458 A KR 1020167033458A KR 20167033458 A KR20167033458 A KR 20167033458A KR 101856556 B1 KR101856556 B1 KR 101856556B1
Authority
KR
South Korea
Prior art keywords
line
film
brittle substrate
trench line
crack
Prior art date
Application number
KR1020167033458A
Other languages
English (en)
Korean (ko)
Other versions
KR20160147981A (ko
Inventor
히로시 소야마
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20160147981A publication Critical patent/KR20160147981A/ko
Application granted granted Critical
Publication of KR101856556B1 publication Critical patent/KR101856556B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
KR1020167033458A 2014-05-30 2015-04-22 취성 기판의 분단 방법 KR101856556B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014112647 2014-05-30
JPJP-P-2014-112647 2014-05-30
PCT/JP2015/062200 WO2015182297A1 (ja) 2014-05-30 2015-04-22 脆性基板の分断方法

Publications (2)

Publication Number Publication Date
KR20160147981A KR20160147981A (ko) 2016-12-23
KR101856556B1 true KR101856556B1 (ko) 2018-05-10

Family

ID=54698638

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167033458A KR101856556B1 (ko) 2014-05-30 2015-04-22 취성 기판의 분단 방법

Country Status (5)

Country Link
JP (1) JP6288259B2 (zh)
KR (1) KR101856556B1 (zh)
CN (1) CN106458691B (zh)
TW (1) TWI647081B (zh)
WO (1) WO2015182297A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110665551B (zh) * 2019-09-05 2021-10-01 嘉兴博创智能传感科技有限公司 一种基于紫外激光掩模刻蚀的微流控芯片结构

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000280234A (ja) 1999-01-28 2000-10-10 Canon Inc 基板の切断方法
TWI261049B (en) * 2001-03-16 2006-09-01 Mitsuboshi Diamond Ind Co Ltd A scribing method, a cutter wheel, a scribing apparatus using the cutter wheel, and an apparatus for producing the cutter
KR100657197B1 (ko) * 2002-11-22 2006-12-14 미쓰보시 다이야몬도 고교 가부시키가이샤 기판절단방법 및 그 방법을 이용한 패널제조방법
JP2007331983A (ja) * 2006-06-15 2007-12-27 Sony Corp ガラスのスクライブ方法
JP2008201629A (ja) * 2007-02-21 2008-09-04 Epson Imaging Devices Corp 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置
KR101235617B1 (ko) * 2007-10-16 2013-02-28 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 ｕ자 형상 홈 가공 방법 및 이것을 사용한 제거 가공 방법 및 도려내기 가공 방법 및 모따기 방법
TWI494284B (zh) * 2010-03-19 2015-08-01 Corning Inc 強化玻璃之機械劃割及分離
KR101247571B1 (ko) * 2010-06-14 2013-03-26 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 스크라이브 방법
JP5210356B2 (ja) * 2010-06-14 2013-06-12 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
JP5244202B2 (ja) * 2011-01-27 2013-07-24 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
TWI498293B (zh) * 2011-05-31 2015-09-01 Mitsuboshi Diamond Ind Co Ltd 劃線方法、鑽石尖、劃線裝置
WO2013161849A1 (ja) * 2012-04-24 2013-10-31 株式会社東京精密 ダイシングブレード

Also Published As

Publication number Publication date
TWI647081B (zh) 2019-01-11
JPWO2015182297A1 (ja) 2017-04-20
CN106458691B (zh) 2020-01-14
KR20160147981A (ko) 2016-12-23
CN106458691A (zh) 2017-02-22
JP6288259B2 (ja) 2018-03-07
WO2015182297A1 (ja) 2015-12-03
TW201601890A (zh) 2016-01-16

Similar Documents

Publication Publication Date Title
KR101844312B1 (ko) 취성 기판의 분단 방법
KR101847921B1 (ko) 취성 재료 기판의 분단 방법
KR101856558B1 (ko) 취성 기판의 분단 방법
JP6555354B2 (ja) 脆性基板の分断方法
KR101856556B1 (ko) 취성 기판의 분단 방법
KR101901631B1 (ko) 취성 기판의 분단 방법
CN107108322B (zh) 脆性衬底的分断方法
JP2017065007A (ja) 脆性基板の分断方法
JP2017065006A (ja) 脆性基板の分断方法

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant