KR101855943B1 - Wearable patch type hybrid substrate and a method for fabricating the same - Google Patents

Abstract

In the hybrid substrate and the method of manufacturing the hybrid substrate, the hybrid substrate includes a substrate portion, an element portion, a connection portion, and a mold portion. The first substrate and the second substrate, which are made of different materials, alternate with each other. The element portion is mounted on the second substrate. The connection portion is formed on the first substrate and electrically connects the element portion on the second substrate. The mold part seals the element part and the connection part at the upper part of the substrate part.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a wearable dry patch type hybrid substrate and a manufacturing method thereof,

The present invention relates to a hybrid substrate and a manufacturing method thereof, and more particularly, to a wearable dry type patch-type hybrid substrate which has improved flexibility and fairness to improve applicability to a wearable device and a manufacturing method thereof.

Wearable devices that are designed to be worn on the body are also being applied to accessories such as T-shirts, pants, glasses, bracelets, watches, and shoes, and their shapes and functions are being diversified accordingly.

In the case of the wearable device, in order to improve the activity and fit, it is necessary to form a structure in which devices that perform various functions are mounted on a flexible substrate having high flexibility. Generally, a flexible material has high flexibility, There is a disadvantage in that it is not good, and in order to improve the fairness, flexibility of the substrate must be lowered, and development of a wearable device capable of simultaneously improving the fairness and flexibility is required.

Accordingly, techniques for a substrate using a combination of a flexible material for improving the stretchability and a rigid material for improving the processability have been developed.

Korean Patent Laid-Open Publication No. 10-2014-0040460 discloses a magnetic substrate formed by stacking a flexible film and a rigid film and a manufacturing method thereof, and Korean Patent Registration No. 10-1267277 Discloses a process technique for forming a metal wiring on a flexible substrate by a technique relating to a metal wiring forming method of a flexible substrate.

However, in the case of a composite substrate developed up to now, there is a limited problem in that the manufacturing process is complicated and the wearable device is used in terms of elasticity.

Korean Patent Publication No. 10-2014-0040460 Korean Patent No. 10-1267277

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a wearable dry type patch-type hybrid substrate capable of improving usability or applicability to a wearable device and improving process efficiency with high processability .

Another object of the present invention is a manufacturing method of the hybrid substrate.

According to an aspect of the present invention, a hybrid substrate includes a substrate, an element, a connection, and a mold. The first substrate and the second substrate, which are made of different materials, alternate with each other. The element portion is mounted on the second substrate. The connection portion is formed on the first substrate and electrically connects the element portion on the second substrate. The mold part seals the element part and the connection part at the upper part of the substrate part.

In one embodiment, the first substrate is a flexible material, and the second substrate may be a rigid material.

In one embodiment, the first substrate comprises PDMS (polydimethylsiloxane), and the second substrate comprises PI (polyimide).

In one embodiment, the mold part may be a flexible material.

In one embodiment, the mold part may include a first mold part of a flexible material formed on the first substrate, and a second mold part of a rigid material formed on the second substrate.

In one embodiment, the upper surface of the first substrate and the upper surface of the second substrate may extend in the same plane.

In one embodiment, the height of the second substrate is smaller than the height of the first substrate, and the first substrates adjacent to each other through the second substrate may be connected to each other through the lower surface of the second substrate.

In one embodiment, the insulating portion is formed on the upper surface of the second substrate on which the element portion is formed, and the upper surface of the insulating portion and the upper surface of the first substrate may extend in the same plane.

In one embodiment, the connection portion may further include a vertical connection portion extending along the upper surface of the insulation portion and the upper surface of the first substrate, and penetrating the insulation portion and electrically connecting the connection portion and the element portion.

In one embodiment, the first substrate and the second substrate may further include a first protrusion and a second protrusion protruding from the lower surface of the first substrate and a lower cover layer formed on an outer surface of the first protrusion and the second protrusion, respectively .

In the method of manufacturing a hybrid substrate according to an embodiment for realizing another object of the present invention described above, a pattern portion is formed in a base portion. And a contact layer is applied on the base portion on which the pattern portion is formed. The first substrate and the second substrate having different materials are alternately extended on the base portion. And an element portion is mounted on the second substrate. And a connection portion for electrically connecting the element portion on the second substrate to the first substrate is formed. And a mold unit for sealing the device unit and the connection unit is formed on the first substrate and the second substrate. The base portion is removed from the first substrate and the second substrate.

In one embodiment, the base portion is a silicon (Si) substrate, and the contact layer may be silicon oxide.

In one embodiment, in removing the base portion from the first substrate and the second substrate, the contact layer may be removed by etching to separate the base portion.

In one embodiment, in the step of forming the mold part, the first mold part may be formed to overlap with the first substrate, and the second mold part may be formed to overlap with the second substrate.

In one embodiment, the step of depositing a lower cover layer on the contact layer prior to forming the first substrate and the second substrate on the base after applying the contact layer on the base further comprises: .

In one embodiment, the step of removing the base portion from the first substrate and the second substrate may further include depositing a lower cover layer on the lower surface of the first substrate and the second substrate.

In one embodiment, the method may further include forming an insulating portion on the second substrate on which the device portion is formed, after the device portion is mounted on the second substrate and before the connecting portion is formed.

In one embodiment, in the step of forming the insulating portion, the upper surface of the insulating portion and the upper surface of the first substrate may be formed to extend in the same plane.

In one embodiment, in the step of forming the connection portion, the connection portion is formed on the upper surface of the first substrate and the insulation portion, and a vertical connection portion that electrically connects the element portion and the connection portion is formed through the insulation portion .

According to another embodiment of the present invention for realizing the above-described object of the present invention, a second substrate is formed on a base portion. A first substrate of a material different from that of the second substrate is formed so as to cover the upper portion of the second substrate on the base portion on which the second substrate is formed. A first protrusion is formed on the upper surface of the first substrate. The base portion is removed from the first substrate and the second substrate. And an element portion is mounted on the second substrate. And a connection portion for electrically connecting the element portion on the second substrate to the first substrate is formed. And a mold unit for sealing the device unit and the connection unit is formed on the first substrate and the second substrate.

In one embodiment, in the step of forming the first projections, the upper surface of the first substrate may be laser-processed to form the first projections.

In one embodiment, the method may further comprise depositing a lower cover layer on the first projection.

In one embodiment, the step of depositing the lower cover layer may be performed by an atomic layer deposition (ALD) process.

According to the embodiments of the present invention, the flexible substrate and the rigid material of the hybrid substrate are alternately extended from each other, so that flexibility and flexibility are improved. Since the second substrate on which the element unit is formed is formed of a rigid material, It is possible to improve the processability of formation, and it is excellent in suitability as a wearable device by satisfying both flexibility and processability.

In particular, the mold portion for sealing the upper portion may be made of a flexible material to improve the overall stretchability. Alternatively, the flexible mold and the rigid mold may be alternately formed so that the same materials as the material of the substrate portion are overlapped with each other, Durability can also be improved.

On the other hand, the upper surface of the first substrate and the surface of the second substrate may be formed to be flush with each other, or the upper surface of the second substrate and the upper surface of the first substrate may be formed to be flush with each other. It is possible.

Further, the first substrate made of a flexible material may be formed to cover the lower surface of the second substrate, thereby further improving the overall stretchability.

Further, by forming the dry packing structure through the protrusions formed on the lower surface, the fixing force of the wearable device can be improved, and the lower cover layer is formed on the upper surface of the protrusions by the atomic layer deposition process to protect the surface of the protrusions and improve the hermeticity .

In particular, since the lower cover layer is formed through the atomic layer deposition process, deposition with a relatively thin thickness is possible, and the hermeticity can be improved.

Meanwhile, the fabrication of the hybrid substrate can improve the processability by performing the process on the base portion, which is a silicon substrate.

Particularly, since the contact layer including silicon oxide is formed between the base portion and the protrusion portion, even if the contact layer is removed through the etching process, the super-hydrophobic lower cover layer formed on the upper surface of the protrusion is not removed, It can be easily separated.

Alternatively, the lower cover layer may be formed by vapor deposition even after separation from the base portion, and various processes may be selectively performed, thereby improving the convenience of the process.

Further, in the case of a hybrid substrate in which the first substrate extends to the bottom surface of the second substrate so as to further improve the stretchability, the protrusions can be formed through laser processing, thereby improving the processability of the entire hybrid substrate manufacturing process.

1 is a cross-sectional view illustrating a hybrid substrate according to an embodiment of the present invention.
FIGS. 2A to 2H are process diagrams illustrating a manufacturing method according to an embodiment of the hybrid substrate of FIG.
3A to 3G are process drawings showing a manufacturing method according to another embodiment of the hybrid substrate of FIG.
4 is a cross-sectional view illustrating a hybrid substrate according to another embodiment of the present invention.
5 is a cross-sectional view illustrating a hybrid substrate according to another embodiment of the present invention.
6 is a cross-sectional view illustrating a hybrid substrate according to another embodiment of the present invention.
Figs. 7A to 7E are process drawings showing a manufacturing method of the hybrid substrate of Fig.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms.

The terms are used only for the purpose of distinguishing one component from another. The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present application, the term "comprises" or "comprising ", etc. is intended to specify that there is a stated feature, figure, step, operation, component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view illustrating a hybrid substrate according to an embodiment of the present invention.

Referring to FIG. 1, a hybrid substrate 10 according to the present embodiment includes a substrate 100, a lower cover layer 200, an element unit 300, a connection unit 310, a mold unit 400, (410).

The substrate unit 100 includes a first substrate 110 and a second substrate 120. The first substrate 110 and the second substrate 120 alternate with each other. That is, the first substrate 110 and the second substrate 120 are alternately arranged to form the substrate unit 10.

In this case, the first substrate 110 includes a flexible material, and the second substrate 120 includes a rigid material. For example, the first substrate 110 may include polydimethylsiloxane (PDMS), and the second substrate may include polyimide (PI).

Meanwhile, the first substrate 110 and the second substrate 120 may be formed such that the upper surfaces of the first substrate 110 and the second substrate 120 form the same plane.

The first protrusions 111 protrude downward from the lower surface of the first substrate 110 at regular intervals and the second protrusions 121 protrude from the lower surface of the second substrate 120 at a uniform interval And protrudes downward.

In this case, each of the first and second protrusions 111 and 121 may have a pointed end as shown in FIG.

The lower cover layer 200 is uniformly formed on the upper surfaces of the first and second protrusions 111 and 121 and may include, for example, aluminum oxide (Al ₂ O ₃ ). Thus, the first and second protrusions 111 and 121 are more effectively protected, and the durability of the hybrid substrate improves as well as the liquid material and the vapor material can not pass through.

The device unit 300 is mounted on the second substrate 120, and may be a variety of electronic devices such as a sensor, a driving unit, and a light emitting unit in a wearable device.

Since the device unit 300 is mounted on the second substrate 120 of a rigid material, the process for mounting the device unit 300 is relatively easy. The device unit 300 is mounted on a rigid material, The problem can be minimized and the durability is improved.

In this embodiment, since the element units 300 are mounted only on the second substrate 120, which are alternately disposed, the connection unit 310 for electrically connecting the element units 300 is required.

Thus, the connection part 310 is formed on the first substrate 110 and electrically connects the element parts 300. In this case, since the first substrate 110 includes a flexible material and can be expanded and contracted, the connection portion 310 may include an electrically conductive material capable of expanding and contracting.

The mold part 400 is formed on the upper part of the substrate part 100 and seals the element part 300 and the connection part 310.

That is, in the present embodiment, since the hybrid substrate 10 can be used as a wearable device, it is necessary to seal the element unit 300 and the connection unit 310, (100).

Meanwhile, the mold part 400 may be formed of a flexible material, for example, PDMS (polydimethylsiloxane) which is the same as the first substrate 110.

An upper cover layer 410 is further formed on the upper part of the mold part 400 to prevent damage or immersion of the mold part 400 and to more effectively protect the mold part 400, Not only the material but also the vapor phase material can not be passed, and the durability of the hybrid substrate is improved.

FIGS. 2A to 2H are process diagrams illustrating a manufacturing method according to an embodiment of the hybrid substrate of FIG.

Referring to FIG. 2A, in the manufacturing method of the hybrid substrate 10, the pattern unit 510 is first formed on the base unit 500.

The pattern unit 510 may be formed by various processes such as an etching process, a nanoimprint process, and a photolithography process. The first and second protrusions 111 and 121 are formed by the pattern unit 510 The pattern unit 510 may have a concave pattern and a sharp end with an end.

In this case, the base unit 500 may be a silicon (Si) substrate such as a silicon wafer. Thus, since all of the processes described below are performed on a silicon wafer, the processability can be improved.

Referring to FIG. 2B, the contact layer 520 is formed on the base 500. The contact layer 520 is also formed in the pattern portion 510 and is formed on the upper surface of the base portion 500 with a uniform thickness as a whole.

For example, the contact layer 520 may include silicon oxide, and may be formed on the base portion 500 through a coating process or the like.

Meanwhile, the contact layer 520 is removed by an etchant in the separation process between the base unit 500 and the substrate unit 100, which will be described later.

Referring to FIG. 2C, a lower cover layer 200 is formed on the base 500 on which the contact layer 520 is formed.

In this case, the lower cover layer 200 may be deposited through an atomic layer deposition (ALD) process. Thus, the lower cover layer 200 can be uniformly formed with a relatively thin thickness.

The lower cover layer 200 includes, for example, aluminum oxide (Al ₂ O ₃ ), and the aluminum oxide has a higher density than the silicon oxide, And is left unetched by the etchant.

2D and 2E, a first substrate 110 and a second substrate 120 are formed on the base portion 500 on which the contact layer 520 and the lower cover layer 200 are formed, They are alternately formed.

In this case, the upper surfaces of the first and second substrates 110 and 120 may be formed to have the same plane.

The first and second substrates 110 and 120 may be coated by a coating process. Since the first and second substrates 110 and 120 are formed of different materials, Can be applied.

The first and second substrates 110 and 120 are formed on the pattern unit 510 so that the first and second substrates 110 and 120 are formed to include the pattern of the pattern unit 510, 111, and 121, respectively.

2F, the element unit 300 is mounted on the upper surface of the second substrate 120 and the connection unit 310 is formed on the upper surface of the first substrate 110, 310 are electrically connected to each other.

2G, a mold part 400 is formed on the substrate part 100 formed with the element part 300 and the connection part 310 so that the element part 300 and the connection part 310 And an upper cover layer 410 is further formed on the mold part 400.

Referring to FIG. 2H, the base portion 500 is removed from the substrate 100.

In this case, the etching solution is supplied to the base part 500 and the substrate part 100 adhered to each other, and the contact layer 520 is removed according to the provision of the etching solution.

That is, when the contact layer 520 is removed, the base 500 is separated from the substrate 100, and the lower cover layer 200 is separated from the first and second protrusions 111 and 121, The hybrid substrate 10 is manufactured in a state of being deposited on the outer surface of the substrate 10.

In this case, since the material of the contact layer 520 is lower in density than the material of the lower cover layer 200, the time for providing the etchant is controlled so that the lower cover layer 200 is not removed, 520 may be removed to separate the base unit 500 from the substrate unit 100.

3A to 3G are process drawings showing a manufacturing method according to another embodiment of the hybrid substrate of FIG.

Referring to FIG. 3A, in the manufacturing of the hybrid substrate 10 according to the present embodiment, the base portion 500 having the pattern portion 510 is fabricated in the same manner as described with reference to FIG. 2A.

Referring to FIG. 3B, the contact layer 520 is formed on the base 500. In this case, the formation of the contact layer 520 is the same as that described with reference to FIG. 2B.

Referring to FIGS. 3C and 3D, the substrate 100 is formed directly on the contact layer 520 in this embodiment.

That is, the first substrate 110 and the second substrate 120 are alternately formed on the base unit 500 on which the contact layer 520 is formed, and the first and second substrates 110, 120 may be formed so as to form the same plane.

3E and 3F, an element unit 300 and a connection unit 310 are formed on the first and second substrates 110 and 120, respectively, and the element unit 300, A mold part 400 and an upper cover layer 410 sealing the connection part 310 are formed.

In this case, the processes of FIGS. 3E and 3F are the same as those of FIG. 2F and FIG. 2E, and thus duplicate descriptions are omitted.

3G, the base part 500 is removed from the substrate part 100. Next, as shown in FIG. To this end, an etchant is provided to the base portion 500 and the substrate portion 100 adhered to each other, and the contact layer 520 is removed according to the provision of the etchant.

That is, as the contact layer 520 is removed, the base part 500 is separated from the substrate part 100, and the first and second protrusions 111 and 121 are exposed to the outside.

Subsequently, a lower cover layer 200 is further deposited on the upper surfaces of the first and second protrusions 111 and 121, and the lower cover layer 200 is subjected to atomic layer deposition (ALD) . ≪ / RTI >

That is, the hybrid substrate 10 of the present embodiment is formed after the base portion 500 is separated from the lower cover layer 200 by a separate deposition process.

4 is a cross-sectional view illustrating a hybrid substrate according to another embodiment of the present invention.

The hybrid substrate 20 according to the present embodiment is substantially the same as the hybrid substrate 10 described with reference to Fig. 1, except that the first mold part and the second mold part are formed of different materials, The description is omitted.

4, the hybrid substrate 20 includes a substrate portion 100, a lower cover layer 200, an element portion 300, a connection portion 310, a first mold portion 450, a second mold portion 460 and an upper cover layer 410.

In this case, the structure, material, forming method, and the like of the substrate 100, the lower cover layer 200, the element portion 300, the connecting portion 310, and the upper cover layer 410 are shown in FIG. Are the same as those described with reference to FIG.

The first mold part 450 is formed to seal the connection part 310 at the upper part of the first substrate 110 and the second mold part 460 is formed at the upper part of the second substrate 120, And is formed to seal the element portion 300.

That is, the first mold part 450 is formed of a flexible material so as to be aligned with the first substrate 110, and the second mold part 460 is formed of a rigid material so as to be aligned with the second substrate 120 do.

In this case, the first mold part 450 may be made of the same material as the first substrate 110, for example, PDMS (polydimethylsiloxane), and the second mold part 460 may be formed of a material, For example, polyimide (PI).

Accordingly, the hybrid substrate 20 according to the present embodiment can solve the problem of uniformity in durability and stretchability because the lower portion is a rigid material and the upper portion is a flexible material in the hybrid substrate 10 described with reference to Fig. 1 , It is possible to maintain uniform overall stretchability.

The first mold part 450 and the second mold part 460 may be formed of different materials, that is, the first mold part 450 may be formed on the first substrate 450 The second mold part 460 may be formed of the same material as the first substrate 110 and the second mold part 460 may be formed of the same material as that of the second substrate 120, The manufacturing method of the present invention is substantially the same as that of the first embodiment.

5 is a cross-sectional view illustrating a hybrid substrate according to another embodiment of the present invention.

5, the hybrid substrate 30 includes a substrate portion 101, a lower cover layer 200, an element portion 300, a connection portion 311, a mold portion 400, and an upper cover layer 410 .

The substrate 101 includes a first substrate 115 and a second substrate 125. A first protrusion 111 is formed on the lower surface of the first substrate 115, The second protrusion 121 is formed on the lower surface of the second protrusion 121.

In this case, the first and second protrusions 111 and 121 are as described with reference to FIG.

The first substrate 115 is formed to have a height higher than that of the second substrate 125.

An element portion 300 is formed on the second substrate 125 and an insulating portion 600 is further formed in a space corresponding to the height difference from the first substrate 115.

Thus, the first substrate 115 and the insulating portion 600 are formed so that their upper surfaces extend in the same plane.

As the upper surfaces of the first substrate 115 and the insulating portion 600 are extended in a planar manner, the connecting portions 311 formed on the first substrate 115 and the insulating portion 600, The formation of the portion 400 can be performed more easily, and the process efficiency is improved.

Since the connection part 311 is insulated from the element part 300 by the insulation part 600, the vertical connection part 312 passing through the insulation part 600 is formed, The connection part 311 and the element part 300 are electrically connected to each other.

The mold part 400 and the upper cover layer 410 may be formed on the connection part 311 at a uniform height.

5, the mold part 400 may be formed on the first substrate 115 such that the first mold part 400, which is the same as the first substrate 115, And a second mold part identical to the second substrate 125 may be formed on the second substrate 125.

In addition, in the method of manufacturing the hybrid substrate 30, the first substrate 115 is formed to have a height higher than that of the second substrate 125, and after the formation of the device unit 300, The connection part 311 and the upper cover layer 410 are formed on the second substrate 125 and the vertical connection part 312 is further formed to penetrate the insulation part 600. [ The manufacturing method of the hybrid substrate 10 described above with reference to FIGS. 2A to 3G is substantially the same as the manufacturing method of the hybrid substrate 10 except for the forming process.

6 is a cross-sectional view illustrating a hybrid substrate according to another embodiment of the present invention.

The hybrid substrate 40 according to the present embodiment is substantially the same as the hybrid substrate 10 described with reference to FIG. 1 except that the first substrate passes through the lower portion of the second substrate and is connected to each other, Duplicate description is omitted.

6, the hybrid substrate 40 includes a substrate portion 102, a lower cover layer 200, an element portion 300, a connection portion 310, a mold portion 400, and an upper cover layer 410 .

In this case, the structure, material, forming method, and the like of the device unit 300, the connection unit 310, the mold unit 400, and the upper cover layer 410 are the same as those described with reference to FIG.

The structure and the method of forming the first and second mold parts so as to be aligned and overlapped with the first and second substrates, respectively, in place of the mold part 400 are the same as those described with reference to FIG. 4 Do.

In this embodiment, the substrate unit 102 includes a first substrate 116 and a second substrate 126. The first substrate 116 passes through a lower surface of the second substrate 126 So that they can be connected to each other.

That is, in the first and second substrates 116 and 126 which are alternately arranged and extended, the first substrates 116 spaced apart from each other with the second substrate 126 therebetween, (Not shown).

Thus, as shown in FIG. 6, the first substrate 116 may be formed as a 'C' shape as a whole.

Since the first substrate 116 is connected to the hybrid substrate 40 through the lower surface of the second substrate 126, the first protrusions 111 protruded from the first substrate 116 are formed on the lower surface of the hybrid substrate 40, And the lower surface of the second substrate 126 is formed in a uniform plane.

In this case, the first substrate 116 may be made of a flexible material, for example, polydimethylsiloxane (PDMS), and the second substrate 126 may be made of a rigid material such as polyimide .

That is, the element part 300 is formed on the second substrate 126, which is a relatively rigid material, so that the processability in forming the element part 300 can be improved. However, since elasticity or flexibility is more important in a wearable device, The flexibility or stretchability of the hybrid substrate 40 can be further improved by a structure in which the first substrate 116, which is a flexible material, is connected to the second substrate 126 through a lower portion of the second substrate 126.

The lower cover layer 200 is formed only on the first protrusion 111, and the specific shape, material, and the like are as described with reference to FIG.

Figs. 7A to 7E are process drawings showing a manufacturing method of the hybrid substrate of Fig.

Referring to FIG. 7A, in the production of the hybrid substrate 40 according to the present embodiment, the second substrate 126 is first formed on the base portion 501.

In this case, only one of the second substrates 126 is illustrated for convenience sake, and a plurality of the second substrates 126 may be formed on the base unit 501 at predetermined intervals.

The second substrate 126 may be formed by a process such as coating using a mask, or may be formed by various other processes.

The base 501 may be a silicon (Si) substrate such as a silicon wafer. Thus, since all of the processes described below are performed on a silicon wafer, the processability can be improved.

Although not shown, a contact layer may be formed on the base 501 in order to improve process convenience in a separation process described later. In this case, the second substrate 126 may be formed on the contact layer do.

7B, the first substrate 116 (not shown) is formed on the base portion 501 on which the second substrate 126 is formed so as to cover the upper portion of the second substrate 126 ).

That is, the first substrate 116 is formed in a 'C' shape as a whole.

Referring to FIG. 7C, a first protrusion 111 is formed on the upper surface of the first substrate 116.

The first protrusion 111 may have a pointed shape toward the upper side and may be formed in a conical shape or a polygonal shape.

In the present embodiment, the first projecting portion 111 can be formed by laser processing, for example, through the processing unit 700.

7D, a lower cover layer 200 is deposited on the upper surface of the first protrusion 111, and the lower cover layer 200 is formed by an atomic layer deposition (ALD) process .

7E, the base portion 501 is separated from the first substrate 116 and the second substrate 126 and removed. When the substrate portion 102 is turned upside down, The connection part 310, the mold part 400, and the upper cover layer 410 are sequentially formed on the substrate 300.

In this case, when the base part 501 is separated from the substrate part 102 as described above, the etching solution can be supplied and separated. Although not shown, the substrate part 102 and the base part 501 are removed by the etching liquid, the base portion 501 can be separated naturally.

Further, the formation of the element part 300, the connection part 310, the mold part 400 and the upper cover layer 410 may be performed in the same process as described with reference to FIGS. 2F to 2G.

Alternatively, instead of forming the mold part 400, a first mold part may be formed on the first substrate 116, and a second mold part may be formed on the second substrate 126 As already explained.

By manufacturing the hybrid substrate 40 in the above-described process, the hybrid substrate 40 can be manufactured with relatively improved efficiency and processability while improving flexibility or flexibility.

According to the above-described embodiments of the present invention, since the flexible substrate and the rigid material are alternately extended from the substrate, the hybrid substrate is improved in flexibility and flexibility, and the second substrate on which the element is formed is formed of a rigid material It is possible to improve the processability of the element part formation, and it is excellent in suitability as a wearable device by satisfying both flexibility and processability.

In particular, the mold portion for sealing the upper portion may be made of a flexible material to improve the overall stretchability. Alternatively, the flexible mold and the rigid mold may be alternately formed so that the same materials as the material of the substrate portion are overlapped with each other, Durability can also be improved.

On the other hand, the upper surface of the first substrate and the surface of the second substrate may be formed to be flush with each other, or the upper surface of the second substrate and the upper surface of the first substrate may be formed to be flush with each other. It is possible.

Further, the first substrate made of a flexible material may be formed to cover the lower surface of the second substrate, thereby further improving the overall stretchability.

Further, by forming the dry packing structure through the protrusions formed on the lower surface, the fixing force of the wearable device can be improved, and the lower cover layer is formed on the upper surface of the protrusions by the atomic layer deposition process to protect the surface of the protrusions and improve the hermeticity .

In particular, since the lower cover layer is formed through the atomic layer deposition process, deposition with a relatively thin thickness is possible, and the hermeticity can be improved.

Meanwhile, the fabrication of the hybrid substrate can improve the processability by performing the process on the base portion, which is a silicon substrate.

Particularly, since the contact layer including silicon oxide is formed between the base portion and the protrusion portion, even if the contact layer is removed through the etching process, the super-hydrophobic lower cover layer formed on the upper surface of the protrusion is not removed, It can be easily separated.

Alternatively, the lower cover layer may be formed by vapor deposition even after separation from the base portion, and various processes may be selectively performed, thereby improving the convenience of the process.

Further, in the case of a hybrid substrate in which the first substrate extends to the bottom surface of the second substrate so as to further improve the stretchability, the protrusions can be formed through laser processing, thereby improving the processability of the entire hybrid substrate manufacturing process.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

The wearable dry patch type hybrid substrate and the manufacturing method thereof according to the present invention have industrial applicability that can be used for manufacturing a wearable device.

10, 20, 30, 40: hybrid substrate
100, 101, 102: substrate portions 110, 115, 116: first substrate
111: first protrusion 120, 125, 126: second substrate
121: second protrusion 200: lower cover layer
300: element part 310, 311: connection part
312: vertical connection part 400:
410: upper cover layer 450: first mold part
460: second mold part 500, 501: base part
510: pattern part 520: contact layer
600: insulation part 700: machining unit

Claims (7)

Forming a second substrate on the base portion;
Forming a first substrate of a material different from that of the second substrate so as to cover the upper portion of the second substrate on the base portion on which the second substrate is formed;
Forming a first projection on an upper surface of the first substrate;
Removing the base portion from the first substrate and the second substrate;
Mounting an element part on the second substrate;
Forming a connection portion electrically connecting an element portion on the second substrate to the first substrate; And
And forming a mold part for sealing the element part and the connection part on the first substrate and the second substrate. 2. The method of claim 1, wherein in forming the first protrusion,
Wherein the upper surface of the first substrate is laser-processed to form the first projecting portion. The method according to claim 1,
Further comprising depositing a lower cover layer on the first protrusion. 4. The method of claim 3, wherein depositing the lower cover layer comprises:
Wherein the annealing is performed by an atomic layer deposition (ALD) process. The method according to claim 1,
Wherein the first substrate is a flexible material and the second substrate is a rigid material. 6. The method of claim 5,
Wherein the first substrate comprises PDMS (Polydimethylsiloxane), and the second substrate comprises PI (polyimide). 6. The method of claim 5,
Wherein the mold part is made of a flexible material.

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