KR101852954B1 - Donor substrate for organic light-emitting device and its manufacturing method - Google Patents

Abstract

The present invention provides a donor substrate for an organic light emitting device, which can deposit an organic material to a target object by using a Joule heating method, comprising: an insulation substrate composed of an electrically insulation material and having a flat upper surface; heat generation layers composed of a conductive material to be Joule-heated if an electric field is applied, formed on an upper surface of the insulation substrate to have first thickness and formed to have a pattern of being spaced from each other at a first interval; a buffer layer formed with a zigzag shaped cross section on an upper surface of the insulation substrate, side surfaces of the heat generation layers and upper surfaces of the heat generation layers to partially induce the heat, generated from the heating generation layers, toward the insulation substrate by covering all of exposed surfaces of the insulation substrate and the heat generation layers; and a partition layer formed on a concave portion of the buffer layer except an organic material holding space to form the organic material holding space perpendicularly above the heat generation layers.

Description

[0001] The present invention relates to a donor substrate for organic light emitting devices,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a donor substrate for an organic light emitting device and a method of manufacturing the same, and more particularly, to a donor substrate for an organic light emitting device capable of depositing an organic material on a target using a line heating and a method of manufacturing the same.

An organic light emitting device is an organic light emitting diode (OLED), which is an organic light emitting diode (OLED) that can emit light by itself to overcome the problem of the light receiving type that requires external light in flat panel display technology.

Such organic EL displays can be driven at a low voltage by making use of three organic phosphor compounds of red, yellow, and blue having self-emission function to produce a display flat panel, thereby achieving an ultra-thin design of the product. It is advantageous in that the configuration of the backlight (backlight device) for dropping the light is not necessary.

Accordingly, such organic EL displays are being applied to various industries as well as electric and electronic fields due to convenience in use and efficiency of produced products. Various methods for producing such organic EL displays have been proposed and used will be.

In the conventional method of manufacturing an organic light emitting device, it is difficult to easily perform deposition of organic materials on a target substrate (target substrate), and it is difficult to form a thin film in a desired pattern. Recently, A method of conveniently depositing an organic material on a target has been proposed.

However, in the conventional donor substrate for organic light emitting devices, the heat generated in the heat generating layer is easily transferred to the barrier ribs formed to form the pattern, so that the barrier ribs are easily damaged. As a result, The organic material and the object are contaminated, resulting in a decrease in luminous efficiency and a defect phenomenon.

The buffer layer is formed on the inner surface of the barrier rib layer to prevent the heat generated in the heating layer from being transferred to the inner surface of the barrier rib layer, It is possible to prevent thermal damage and to protect the barrier rib layer by forming a protective layer on the outer surface of the barrier rib layer to improve the accuracy of the deposition pattern and to form a zigzag shape in cross section as a whole, It is possible to prevent an interlayer separation phenomenon and a breakage phenomenon of a barrier rib layer to be described later, to prevent contamination due to broken barrier rib components, to thereby improve the luminous efficiency, A donor substrate for an organic light emitting device capable of producing a high-quality product, and a method of manufacturing the same All. However, these problems are illustrative, and thus the scope of the present invention is not limited thereto.

According to an aspect of the present invention, there is provided a donor substrate for an organic light emitting device, which is capable of depositing an organic material on a target using a line heating method, An insulating substrate having an upper surface formed flat; A heating layer formed on the upper surface of the insulating substrate to have a first thickness and spaced apart from each other at a first interval, the heating layer being made of an electrothermal material so as to be heated by applying an electric field; The upper surface of the insulating substrate, the side surfaces of the heating layer, and the upper surface of the heating layer may be formed on the upper surface of the insulating substrate so as to partially guide the heat generated in the heating layer toward the insulating substrate by covering the exposed surfaces of the insulating substrate and the heating layer. A buffer layer formed in a zigzag shape in cross section; And a partition wall layer formed on the concave portion of the buffer layer excluding the organic material receiving space so that an organic material receiving space is formed vertically above the heating layer.

Further, according to the present invention, the buffer layer may include an aluminum oxide component.

Further, according to the present invention, the partition wall layer may be a resin-based organic film.

The donor substrate for an organic light emitting diode according to the present invention may have a cross-sectional surface on the upper surface of the barrier rib layer, the side surface of the barrier rib layer, and the upper surface of the exposed buffer layer so as to cover both the barrier rib layer and the exposed surface of the buffer layer. And a protective layer formed in the shape of a sphere.

Further, according to the present invention, the protective layer may include an aluminum oxide component.

According to another aspect of the present invention, there is provided a method of manufacturing a donor substrate for an organic light emitting device, An insulating substrate preparation step of preparing an insulating substrate made of an electrically insulating material and having an upper surface formed flat; Forming a heating layer on the upper surface of the insulating substrate so as to be spaced apart from each other by a first thickness and a first spacing to form a heating layer, the heating layer being heat- The upper surface of the insulating substrate, the side surfaces of the heating layer, and the upper surface of the heating layer may be formed on the upper surface of the insulating substrate so as to partially guide the heat generated in the heating layer toward the insulating substrate by covering the exposed surfaces of the insulating substrate and the heating layer. A buffer layer forming step of forming a buffer layer in a zigzag shape in cross section; And forming a barrier rib layer on a concave portion of the buffer layer excluding the organic material receiving space so that an organic material receiving space is formed vertically above the heating layer.

In addition, according to the present invention, after the step of forming the barrier rib layer, the upper surface and the side surface of the partition wall layer and the upper surface of the exposed buffer layer are covered in a zigzag shape so as to cover both the barrier rib layer and the exposed surface of the buffer layer. And a protective layer forming step of forming a protective layer.

According to some embodiments of the present invention as described above, a buffer layer is formed on the inner surface of the barrier rib layer to prevent the heat generated in the heating layer from being transmitted to the inner surface of the barrier rib layer, The protection layer can be formed on the outer surface of the barrier rib layer to double protect the barrier rib layer to improve the accuracy of the deposition pattern and to have a zigzag shape in cross section as a whole, It is possible to prevent an interlayer separation phenomenon and a breakage phenomenon of a barrier rib layer to be described later and to prevent contamination due to broken barrier rib components and thereby to improve the luminous efficiency, , It is possible to produce a high-quality product. Of course, the scope of the present invention is not limited by these effects.

1 is a cross-sectional view illustrating a donor substrate for an organic light emitting device according to some embodiments of the present invention.
2 is a cross-sectional view showing a donor substrate for an organic light emitting device according to some other embodiments of the present invention.
FIGS. 3 to 6 are cross-sectional views showing steps of manufacturing the donor substrate for the organic light emitting device of FIG. 1. FIG.
7 is a cross-sectional view showing a manufacturing process of the donor substrate for the organic light emitting device of FIG.
8 is a flowchart showing a method of manufacturing a donor substrate for an organic light emitting device according to some embodiments of the present invention.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

Hereinafter, a method of depositing an organic material for an organic light emitting device and an organic light emitting device according to some embodiments of the present invention will be described in detail with reference to the drawings.

1 is a cross-sectional view showing a donor substrate 100 for an organic light emitting device according to some embodiments of the present invention.

1, a donor substrate 100 for an organic light emitting device according to some embodiments of the present invention may be formed by depositing an organic material 2 on a target object 1 using a line heating method A donor substrate 100 for an organic light emitting device may include an insulating substrate 10, a heat generating layer 20, a buffer layer 30 and a partition wall layer 40.

For example, as shown in FIG. 1, the insulating substrate 10 may be a substrate-type structure formed of an electrically insulating material such as quartz, glass, ceramics, and plastic, and having a flat upper surface. However, the material of the insulating substrate 10 is not limited thereto.

The insulating substrate 10 can be made of a material having a low thermal expansion and a high thermal conductivity and can sufficiently support the heating layer 20 and the buffer layer 30 and the partition wall layer 40 And may be a support having strength and durability capable of carrying out various processes for forming these.

1, the heating layer 20 is formed of an electrothermal material so that resistance heat can be generated when the electric field is applied thereto, and the first insulating layer 20 is formed on the upper surface of the insulating substrate 10, May be formed in a thin film having a thickness t and formed by patterning to be spaced apart from each other by a first distance d.

More specifically, for example, the heating layer 20 may be made of a metal or a metal alloy having high electrical resistance, such as molybdenum (Mo), titanium (Ti), chrome (Cr) or molybdenum tungsten (MoW) However, the material of the heating layer 20 is not limited in the present invention.

Although not shown, the current-spreading layer or the electrode layer may be electrically connected to the heat-generating layer 20 so that electric current can be applied to the heat-generating layer 20 and the current can be uniformly dispersed. The current spreading layer or the electrode layer may be formed of various metals and metal alloys such as copper, aluminum, gold, platinum, zinc, and tin. However, such a current-spreading layer and an electrode layer may be omitted as needed.

1, when an electric field is applied to the heat generating layer 20, string heat may be generated, and the string of heat may instantaneously deposit the organic material 2 on the object 1 have.

1, the buffer layer 30 covers the exposed surfaces of the insulating substrate 10 and the heating layer 20 to remove heat generated in the heating layer 20, Wherein a top surface of the insulating substrate 10, a side surface of the heating layer 20, and a top surface of the heating layer 20 are formed in a zigzag shape in cross section so as to be partially guided toward the insulating substrate 10, .

Here, the buffer layer 30 may include an aluminum oxide material, which is an inorganic film material. However, the present invention is not limited thereto, and various inorganic film materials such as silicon oxide, titanium oxide, silicon, and silicon oxide can be applied.

Further, since the cross section is formed in a zigzag shape as a whole, it is possible to form an interlayer bonding force not only in horizontal stress but also in normal stress, thereby preventing delamination phenomenon and breakage layer breakage phenomenon to be described later.

1, the heat generated in the heating layer 20 may be partially introduced toward the insulating substrate 10 by using the buffer layer 30, The inner surface of the partition wall layer 40 can be protected.

1, the partition wall layer 40 is formed on the buffer layer 40 except for the organic material accommodating space A so that the organic material accommodating space A is formed vertically above the heat generating layer 20, May be formed in a thin film shape formed on a concave portion of the substrate 30.

Here, the barrier layer 40 may be formed of a resin-based organic film in consideration of a process time, and the organic film may be formed of a polyacrylate resin, an epoxy resin, a phenolic resin, Polyamide resins, polyimides resins, unsaturated polyesters resins, poly (phenylenethers) resins, poly (phenylene sulfide) resins, phenylenesulfides resin, benzocyclobutene (BCB), and combinations thereof. However, it is not necessarily limited thereto.

Accordingly, the partition wall layer 40 may serve as a kind of mask for depositing the organic material 2 at a desired place of the target object 1 by patterning together with the heating layer 20.

Therefore, the buffer layer 30 is formed on the inner surface of the partition wall layer 40 to prevent the heat of the heat generated in the heating layer 20 from being transmitted to the inner surface of the partition wall layer 40, The barrier rib layer 40 can be prevented from being damaged by heat.

2 is a cross-sectional view showing a donor substrate 200 for an organic light emitting device according to some other embodiments of the present invention.

2, the donor substrate 200 for an organic light emitting device according to some embodiments of the present invention may include a transparent conductive layer (not shown) to cover both the barrier layer 40 and the exposed surface of the buffer layer 30, The protective layer 50 may be formed in a zigzag shape in cross section on the upper surface of the barrier layer 40, the side surface of the barrier layer 40, and the exposed upper surface of the buffer layer 30.

Here, the protective layer 50 may include an aluminum oxide component. However, the present invention is not limited thereto, and various inorganic film materials such as silicon oxide, titanium oxide, silicon, and silicon oxide can be applied.

Further, since the cross section is formed in a zigzag shape as a whole, it is possible to form an interlayer bonding force not only in horizontal stress but also in normal stress, thereby preventing delamination phenomenon and breakage layer breakage phenomenon to be described later.

Therefore, the heat generated in the heat generating layer 20 is blocked from being transmitted to the inner surface of the partition wall layer 40, and is guided toward the insulating substrate to prevent thermal damage to the partition wall layer 40, The protective layer 50 may be formed on the outer surface of the barrier rib layer 40 to protect the barrier rib layer 40 in a double manner to improve the accuracy of the deposition pattern and to prevent the buffer layer 30 and the protective layer 50 from being damaged, Since the cross section of the partition wall layer is formed in a zigzag shape as a whole, it is possible to form an interlayer bonding force not only in the horizontal stress but also in the normal stress, thereby preventing the delamination phenomenon and the breakage phenomenon of the partition wall layer, It is possible to increase the luminous efficiency and to produce a good quality product.

FIGS. 3 to 6 are cross-sectional views sequentially showing the manufacturing process of the donor substrate 100 for the organic light emitting device of FIG.

3 to 6, a manufacturing process of the donor substrate 100 for the organic light emitting device of FIG. 1 will be described. First, as shown in FIG. 3, the donor substrate 100 is made of an electrically insulating material, The insulating substrate 10 can be prepared.

As shown in FIG. 4, when the electric field is applied, the heating plate is made of an electrothermal material so as to be heated by a line, and is patterned on the upper surface of the insulating substrate 10 so as to be spaced apart from each other by a first thickness, (20) can be formed.

The heating layer 20 may be formed by a known deposition method such as a low pressure chemical vapor deposition method, an atmospheric pressure chemical vapor deposition method, a plasma enhanced chemical vapor deposition (PECVD) method, a sputtering method, or a vacuum evaporation method And the method of forming the heating layer 20 is not limited in the present invention.

5, the heat generated in the heating layer 20 is partially covered in the direction of the insulating substrate 10 by covering the exposed surfaces of the insulating substrate 10 and the heating layer 20, The buffer layer 30 may be formed in a zigzag shape in cross section on the upper surface of the insulating substrate 10, the side surface of the heating layer 20, and the upper surface of the heating layer 20.

The buffer layer 30 may be formed by a known deposition method such as an atomic layer deposition method, a low pressure chemical vapor deposition method, an atmospheric pressure chemical vapor deposition method, a plasma enhanced chemical vapor deposition (PECVD) method, a sputtering method, or a vacuum evaporation method And the method of forming the buffer layer 30 is not limited in the present invention.

6, on the concave portion of the buffer layer 30 excluding the organic material receiving space A, the organic material receiving space A is formed vertically above the heat generating layer 20, Layer 40 may be formed.

In this case, the barrier layer 40 may be formed of an inorganic film. However, in this case, since the deposition process or the sputtering process must be used to form the barrier layer 40 to a predetermined thickness or more, the process time becomes very long, . When an organic layer is used for the barrier rib layer 40, a deposition process or a wet process may be used.

7 is a cross-sectional view showing a manufacturing process of the donor substrate 200 for the organic light emitting device of FIG.

7, the fabrication process of the donor substrate 200 for the organic light emitting device of FIG. 2 will be described. In order to cover both the barrier layer 40 and the exposed surface of the buffer layer 30 in FIG. 6 The protective layer 50 may be formed in a zigzag shape in cross section on the upper surface of the partition wall layer 40, the side surface of the partition wall layer 40, and the upper surface of the exposed buffer layer 30.

8 is a flowchart showing a method of manufacturing a donor substrate for an organic light emitting device according to some embodiments of the present invention.

1 to 8, a method of manufacturing a donor substrate for an organic light emitting device according to some embodiments of the present invention includes depositing an organic material 2 on a target object 1 using a line heating method A method of manufacturing a donor substrate for an organic light emitting device, comprising the steps of: (S1) preparing an insulating substrate (10) made of an electrically insulating material and having an upper surface formed flat; (S2) for forming a heat generating layer (20) by patterning on the upper surface of the insulating substrate (10) so as to be spaced apart from each other at a first thickness and a first spacing, The upper surface of the insulating substrate 10 is formed so as to partially cover the exposed surface of the substrate 10 and the heating layer 20 so as to partially induce the heat generated in the heating layer 20 toward the insulating substrate 10. [ A side surface of the heating layer 20, A buffer layer formation step S3 of forming a buffer layer in a zigzag shape in cross section on the upper surface of the base heating layer 20 and a step of forming a buffer layer on the upper surface of the base material 20 in such a manner that the organic material accommodation space A is formed vertically above the heating layer 20 Forming a barrier rib layer 40 on a concave portion of the buffer layer 30 excluding the barrier rib layer 40 and the buffer layer 30; Forming a protective layer 50 in a staggered cross-section on the upper surface of the barrier layer 40, the side surface of the barrier layer 40, and the exposed upper surface of the buffer layer 30, .

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

1: object
2: organic matter
10: Insulated substrate
20: heating layer
30: buffer layer
40: partition wall layer
50: Protective layer
S1: Insulation board preparation step
S2: heating layer formation step
S3: buffer layer forming step
S4: partition wall layer forming step
S5: Protective layer formation step
100, 200: donor substrate for organic light emitting device

Claims (7)

A donor substrate for an organic light emitting device capable of depositing an organic material on a target using a line heating method,
An insulating substrate made of an electrically insulating material and having an upper surface formed flat;
A heating layer formed on the upper surface of the insulating substrate to have a first thickness and spaced apart from each other at a first interval, the heating layer being made of an electrothermal material so as to be heated by applying an electric field;
The upper surface of the insulating substrate, the side surfaces of the heating layer, and the upper surface of the heating layer may be formed on the upper surface of the insulating substrate so as to partially guide the heat generated in the heating layer toward the insulating substrate, A buffer layer formed in a zigzag shape in cross section; And
And a partition wall layer formed on a concave portion of the buffer layer excluding the organic material receiving space so that an organic material receiving space is formed vertically above the heating layer,
Wherein at least a part of the zigzag shape of the buffer layer is formed between the side surface of the heating layer and the inner surface of the partition wall layer so as to increase the coupling force between the insulating substrate and the partition wall layer. The method according to claim 1,
Wherein the buffer layer comprises an aluminum oxide component. The method according to claim 1,
Wherein the partition wall layer is a resin-based organic film. The method according to claim 1,
A protective layer formed on the upper surface of the barrier rib layer, the side surface of the barrier rib layer, and the upper surface of the exposed buffer layer in a zigzag shape so as to cover both the barrier rib layer and the exposed surface of the buffer layer;
Wherein the donor substrate further comprises a donor substrate. 5. The method of claim 4,
Wherein the protective layer comprises an aluminum oxide component. A method of manufacturing a donor substrate for an organic light emitting device, which is capable of depositing an organic material on a target using a line heating method,
An insulating substrate preparation step of preparing an insulating substrate made of an electrically insulating material and having an upper surface formed flat;
Forming a heating layer on the upper surface of the insulating substrate so as to be spaced apart from each other by a first thickness and a first spacing to form a heating layer, the heating layer being heat-
The upper surface of the insulating substrate, the side surfaces of the heating layer, and the upper surface of the heating layer may be formed on the upper surface of the insulating substrate so as to partially guide the heat generated in the heating layer toward the insulating substrate, A buffer layer forming step of forming a buffer layer in a zigzag shape in cross section; And
Forming a barrier rib layer on a concave portion of the buffer layer excluding the organic material receiving space so that an organic material receiving space is formed vertically above the heating layer;
In the buffer layer forming step,
Wherein at least a part of the zigzag shape of the buffer layer is formed between the side surface of the heating layer and the inner surface of the partition wall layer so as to increase the binding force between the insulating substrate and the partition wall layer. Way. The method according to claim 6,
After the barrier layer formation step,
Forming a protective layer in a zigzag shape in cross section on the upper and side surfaces of the partition layer and the upper surface of the exposed buffer layer so as to cover both the barrier layer and the exposed surface of the buffer layer;
Further comprising a step of forming the donor substrate.

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