KR101848179B1 - Method for Manufacturing a Commemorative Coin and Apparatus for Manufacturing a Commemorative Coin - Google Patents

Abstract

The present invention relates to a method for manufacturing a commemorative coin, and an apparatus for manufacturing a commemorative coin used when manufacturing the commemorative coin using the method. According to the present invention, the method comprises the following steps of: forming a bar-shaped plating body; forming a plating layer in predetermined thickness by rotating the plating body to electroplate on the circumference of the plating body; and cutting the plating body having the plating layer in thickness of a coin.

Description

TECHNICAL FIELD The present invention relates to a commemorative coin manufacturing apparatus and a commemorative coin manufacturing apparatus,

The present invention relates to a commemorative coin manufacturing method and a commemorative coin manufacturing apparatus used for manufacturing commemorative coins having a different structure from that of the inside and the outside. More specifically, the present invention relates to a commemorative coin manufacturing apparatus, By rapidly forming a plated layer of a certain thickness and then cutting a plurality of coin thicknesses, it is possible to prevent a gap defect between the inner and outer surfaces of the coin, A commemorative coin manufacturing method and a commemorative coin manufacturing apparatus capable of manufacturing a commemorative coin.

There are commemorative coins (proofs) used for decoration and collecting in various commemorative events and sightseeing places. Such a commemorative coin can be formed into a double structure different from the inside and outside materials to improve the sense of aesthetics. Conventionally, in order to manufacture such a dual-structure commemorative coin, the inner material is processed into a circle, the outer material is processed into a band shape corresponding to the shape of the inner material, and then the inner material and the outer material are hammered After physically inserting it, the gap between the two was chemically treated.

However, according to the above manufacturing method, there is a slight gap between the inner material and the outer material, which is a direct cause of deteriorating the quality of the product and the quality of the product.

In order to solve this problem, a method of manufacturing a commemorative coin using plating can be considered. However, in the case of electroplating, since the plating layer is formed at a very thin thickness around the plating body and the time taken until completion of the plating is very long, when the coin is manufactured in the form of a commemorative coin requiring a thick plating layer, Product failure and quality deterioration of coin may occur.

Japanese Patent Application Laid-Open No. 2000-017495

It is an object of the present invention to provide a coin coin of a structure having a different structure from that of the inside and the outside of the coin coin and to prevent a gap defect between the inner and outer materials of the coin coin, The present invention also provides a commemorative coin manufacturing method capable of shortening the processing time while improving the plating quality.

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: preparing a rod-like plated body; Rotating the plating body and performing high-speed electroplating around the plating body to form a plating layer having a predetermined thickness; And cutting the plated body formed with the plating layer into a coin thickness; The present invention provides a commemorative coin manufacturing method comprising:

According to a preferred aspect of the present invention, the electroplating may include: electrically connecting the first connection member to the cathode bar, which is horizontally installed in the plating vessel; Rotatably coupling a second linking member having a propeller on a circumferential surface thereof to the first linking member; Fixing the plating member to the lower end of the second connection member; And rotating the second linking member by a flow of a plating liquid by supplying air to the vicinity of the propeller; And the plating member is rotated according to the rotation of the second linking member to cause a swirling phenomenon of the plating liquid. In this state, electricity is applied to the cathode bar to rapidly and uniformly coat the plating layer around the plating member .

According to an embodiment of the present invention, the step of fixing the plated body to the second connection member may include forming a groove around the upper end of the plated body, attaching the plated body to the lower end of the second connection member, The fixing ring may be engaged with the groove of the plating body after the plurality of fixing rings protruded and bent inward are formed.

According to another embodiment of the present invention, the step of fixing the plating member to the second connection member may include forming a groove around the upper end of the plating member and fixing the plating member fixing unit provided at the lower end of the second connection member, A plurality of housings each having a gear structure that operates in conjunction with the rotation of the second body included in the first and second connecting members, and a fixing ring is formed on a shaft of the horizontal rotary gear provided in the plurality of housings, Can be engaged with the grooves of the plurality of plated bodies, respectively.

According to another aspect of the present invention, there is provided a plating apparatus comprising: a cathode bar provided in a plating bath; A first connection member coupled to the cathode bar; A second connecting member having an upper end rotatably coupled to the first connecting member, a propeller formed on a circumferential surface thereof, and a plating member fixing unit at a lower end; And an air blowing member for supplying air to the propeller and rotating the second linking member by a flow of the plating liquid; The coinage coin making device comprising:

In one embodiment of the present invention, the first connecting member includes a first body having a through hole formed in a lower surface thereof, a ball bearing provided in the first body, and a second body extending upward from the first body to be coupled to the cathode bar. Wherein the second connecting member includes a second body having a rod shape and a head portion formed at an upper end of the second body and rotatably coupled to the inside of the first body, Wherein the plated body is formed in a rod shape and the upper periphery thereof is coupled to the grip portion so that the plated body rotates together when the second body of the second connection member rotates, have.

According to another embodiment of the present invention, the first connecting member may include a first body having a through hole formed in a lower surface thereof, a ball bearing disposed in the first body, and a second body coupled to the first body, Wherein the second connecting member includes a second body having a rod shape and a head portion formed at an upper end of the second body and rotatably coupled to the inside of the first body, A first gear housing provided at a lower end between the first links, a plurality of second links extended in a shape of an umbrella horizontally in the first connection pipe and bent downward, A second gear housing of a carpenter provided at a lower end of the second connecting pipe, and a plurality of third connecting pipes connecting the first gear housing and the second gear housing, A second gear disposed at the lower end of the second body, a second gear disposed at the third coupling tube and being rotatably engaged with the first gear in a direction perpendicular to the first gear, And a third gear located at the other end of the second gear housing is provided. The fourth gear is rotatably engaged with the third gear in a direction perpendicular to the third gear and is horizontally rotated and exposed to the lower side of the second gear housing. And a fixing ring provided on a shaft of the fourth gear, wherein the plated body is formed into a rod shape and a groove is formed around the upper end to engage the fixing ring, The first gear, the second gear, the connecting shaft, the third gear, and the fourth gear are interlockingly rotated, and the plating body coupled to the shaft of the fourth gear is rotated Before and can be rotated separately.

According to a preferred feature of the present invention, a second electric wire is provided, one end of which is connected to a connection portion provided in the second gear housing and the other end is in contact with the surface of the first body of the first connection pipe through the second connection pipe; And a third wire having one end connected to the connection portion and the other end connected to a position eccentric from the center of the upper surface of the fourth gear, the third wire having a predetermined length.

According to the method of manufacturing a commemorative coin according to an embodiment of the present invention, a plated layer of a certain thickness is formed around a plated body formed into a bar shape by electroplating, then a plurality of pieces are cut at a coin thickness, It is possible to manufacture a commemorative coin without any gap defect between the interfaces.

At this time, the second connecting member and the plated body are rotated by supplying wind to the propeller of the second connecting member supporting the plated body, thereby causing a vortex phenomenon to occur in the plating liquid, thereby speeding circulation of the plating liquid, Plating can be performed. Therefore, a plating layer having a required thickness can be formed in a short time, and the formed plating layer can properly realize the original shape of the coin.

It is possible to prevent a gap defect between the inner and outer materials.

Further, according to the commemorative coin manufacturing apparatus and manufacturing method of this embodiment, the productivity of commemorative coin can be improved by shortening the plating processing time.

1 is a front view schematically showing a commemorative coin manufacturing apparatus according to an embodiment of the present invention.
2 is a plan view of Fig.
Fig. 3 is a view showing the first and second connecting members and the plated body in Fig. 1. Fig.
4 is a perspective view showing the main part of Fig.
5 is a perspective view schematically showing a commemorative coin manufacturing apparatus according to another embodiment of the present invention.
6 is a front view of Fig. 5. Fig.
FIG. 7 is an enlarged perspective view of the coupling structure of the first linking member and the second linking member in FIG. 5; FIG.
FIG. 8 is an enlarged perspective view of the gear structure of the second linking member in FIG. 5; FIG.
FIG. 9 is a cross-sectional view showing a gear structure and a wire connection structure of the second link member in FIG.
10 is a plan view showing a commemorative coin manufactured by the present invention.
11 is a plan view showing another embodiment of a commemorative coin manufactured by the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below.

The embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements. In the drawings, like reference numerals are used throughout the drawings.

In addition, to include an element throughout the specification does not exclude other elements unless specifically stated otherwise, but may include other elements.

The present invention is to manufacture a commemorative coin 10 having a structure different from that of the inside and the outside as shown in FIG. 10 and having a structure divided into an inside material 11 and an outside material 12 by plating.

Plating is a method of thinly coating another metal on the surface of a metal or a nonmetal. A typical plating apparatus includes a plating bath containing a plating solution and a plurality of electrode bars provided on the plating bath such that the anode and the cathode are alternately arranged.

Specifically, when a rack is hooked on the cathode bar of the electrode bar of the plating apparatus and the current is supplied to the electrode bar in a state of being dipped in the plating solution in the plating bath for a certain period of time, the plating solution is thinly coated on the surface of the plating member connected to the cathode bar will be.

However, in the conventional plating method, since the progress of plating is slow and it is difficult to secure a thick thickness in a short period of time, it is difficult to secure the thickness of the plating layer when it is applied to manufacturing a commemorative coin requiring a thick plating layer, Can not be properly implemented, resulting in product defects or degradation of product quality.

In order to solve this problem, in order to solve this problem, first, a plating body in the form of a rod is provided, and then a high-speed electroplating is performed on the surface of the plating body to form a plating layer having a predetermined thickness. A plurality of pieces are cut in thickness to produce commemorative coins.

At this time, the following methods can be used to perform the high-speed electroplating. The first is to alternately adjust the intensity of the current applied during the electroplating to the high current and the low current to speed up the plating. The second is to accelerate the plating rate by using a high concentration of plating solution when electroplating. The third is to accelerate the plating rate by causing eddy current in the plating liquid.

Commemorative coin manufacturing equipment

Hereinafter, with reference to FIG. 1 to FIG. 4, a commemorative coin manufacturing apparatus applied to a method of rotating a plated body contained in a plating liquid as a method of causing a vortex phenomenon in a plating liquid in the high-speed plating method will be described in detail.

FIG. 1 is a front view schematically showing a commemorative coin manufacturing apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a cross- And Fig. 4 is a perspective view showing the main part of Fig.

1 to 4, the commemorative coin manufacturing apparatus of the present embodiment includes a cathode bar 200, a first connection member 310 coupled to the cathode bar 200, a first connection member 310 coupled to the first connection member 310, And a second connecting member 330 and an air blowing member 500 which are coupled to each other.

The cathode bar 200 is provided in the plating vessel and is plated around the periphery of the plating body 410 which is connected to the cathode bar 200 when the electric power is applied and is formed into a bar shape that is an inner base portion of the commemorative coin, To form a plating layer.

The first connecting member 310 includes a first body 320, a ball bearing 340, and a hooking ring 311. The first body 320 has a receiving space 321 in which a ball bearing 340 is disposed, and an upper surface thereof is opened and a through hole is formed in a lower surface thereof. The latching ring 311 is extended from the upper end of the first body 320 to the upper side and is bent at the upper end in the shape of ∩ and hooked to the cathode bar 200. The hooking ring 311 is electrically connected to the cathode bar 200 . At this time, in order to increase the supporting force, the hooking ring 311 can be fixed to the cathode bar 200 using a bolt if necessary.

The second linking member 330 includes a second body 332 formed in a bar shape and a head portion 335 formed in a flange shape at an upper end of the second body 332. The second linking member 330 includes a second body 332, A plating body fixing part 333 is provided to fix the plating body 410 on the lower part. The head portion 335 is rotatably coupled to the receiving space 321 of the first body 320. A propeller 331 is formed on the circumference of the second body 332. The plating body fixing portion 333 includes a plurality of grip portions protruding downward. The grip portion may include a fixing ring 334 formed to be bent inward.

The air blowing member 500 includes a blower 510 and a blowing pipe 520 extending long from the blower 510. The blowing pipe 520 is disposed at a position adjacent to the propeller 331 of the second connecting member 330 . At the position corresponding to the propeller 331 in the blowing pipe 520, a blowing hole 530 for blowing out wind is formed. The wind blown out through the air blowing hole 530 serves to rotate the propeller 331 through the plating solution flowing along the direction of wind blowing and to rotate the second connecting member 3330 formed with the propeller 331 .

The plating member 410 has a long body 410 and a groove 420 is formed around the upper end of the body 410 so that the fixing ring 334 of the second connection member 330 is caught . Therefore, when the flow of the wind and plating liquid is transmitted to the propeller 331 formed on the second body 332 by the blowing member 500, the second body 332 rotates, and the plating of the second body 332 It is possible to rotate the plating member 410 coupled to the holding member 333 and the fixing ring 334 so that the plating solution in the plating tank swirls and vortices are generated.

The second connecting member 330 and the second connecting member 330 having the propeller 331 are supplied with wind through the air blowing hole when the air blowing member 500 is operated, The vortexing phenomenon occurs in the plating liquid. As the plating speed is increased, the plating layer can be formed quickly with a required thickness in a short time, and the plating body 410 is rotated to form a plating layer having a uniform thickness around the plating body 410, When cutting to thickness, the circle shape of the coin can be realized properly. Further, if the plating time is shortened by the vortex phenomenon, the productivity of the product (commemorative coin) can be improved.

Variation example

FIG. 5 is a perspective view schematically showing a commemorative coin manufacturing apparatus according to another embodiment of the present invention, FIG. 6 is a front view of FIG. 5, and FIG. 7 is a perspective view showing a combined structure of a first connecting member and a second connecting member FIG. 8 is an enlarged perspective view of the gear structure of the second linking member in FIG. 5, and FIG. 9 is a cross-sectional view illustrating a gear structure and a wire connecting structure of the second linking member in FIG.

Here, the structure of the cathode bar and the first connection member is similar to that of the first embodiment described above, so a detailed description of the same contents will be omitted in order to avoid duplication, and a second connection member and a gear structure having a structure different from the above- And will be specifically described on the basis thereof.

5 to 9, the second linking member of the present embodiment includes a second body 360 formed in a bar shape and a head portion 335 'formed in a flange shape on an upper portion of the second body 360 And a plating body fixing portion is provided at a lower portion of the second body 360. The head portion 335 'is rotatably coupled to the receiving space of the first body 320. A propeller 331 is formed on the circumference of the second body 360.

The plating unit fixing unit includes a first connection pipe 611 formed vertically long and a plurality of second connection pipes 612 extended horizontally like an umbrella in the first connection pipe 611. A first gear housing 620 is provided at the lower end of the first connection pipe 611 and a second body 360 is inserted through the first connection pipe 611 and the lower end thereof is connected to the inside of the first gear housing 620 . At this time, a first gear 710 is provided at the lower end of the second body 360. The second connecting pipe 612 has a bent portion 613 bent downward and a second gear housing 630 is provided at a lower end of the bent portion 613. At this time, the first gear housing 620 and the second gear housing 630 are located at substantially the same height. The plated body fixing unit further includes a plurality of third connection pipes 615 connecting the first gear housing 620 and the plurality of second gear housings 630, And a connection shaft 750 is disposed therein.

In addition, a second body 360 is installed inside the first connection pipe 611. At this time, a bearing 360a is provided around the second body 360 so that the second body 360 rotates itself and rotates the plating body fixing unit including the first connection tube 611.

The connecting shaft 750 is provided with second and third gears 720 and 730 at both ends thereof, respectively. The second gear 720 is located in the interior of the first gear housing 620 so as to vertically intersect with the first gear 710 so as to rotate and the third gear 730 rotates inside the second gear housing 630 . The second gear housing 630 is provided with a fourth gear 740 through which a shaft 741 is drawn through the lower surface of the second gear housing 630. The fourth gear 740 meshes with the third gear 730 in a perpendicular direction and is rotated in the horizontal direction. The fixing ring 640 is provided on the shaft 741 of the fourth gear 740 exposed to the lower side of the second gear housing 630.

The plating member 400 'is long in a bar shape. A groove 420 'is formed around the upper end of the plating member 400' so that the fixing ring 640 provided on the shaft 741 of the fourth gear 740 is engaged. The second body 360 is rotated by the fan 510 and the first gear 710 of the second body 360 is rotated by the second body 360 when the air is supplied to the vibrator 331 of the second body 360. [ The third gear 730 of the connecting shaft 750 rotates to rotate the fourth gear 740 engaged with the second gear 720, The plurality of plating members 400 'coupled to the fixing ring 640 may rotate separately from the rotation of the plating member fixing unit while the fixing ring 640 coupled to the fixing member 740 rotates.

Hereinafter, the electrical connection structure of the present invention will be described. The electric wire of this embodiment includes the first to third electric wires 361-363. The first electric wire 361 has one end connected to the engagement ring 311 of the first connection member and the other end connected to the first gear 710 provided at one end of the second body 360 through the first connection pipe 611, So that the first gear 710 is rotated.

A plurality of second wires 612 are provided in each second connection tube 612. One end of the second electric wire 612 is connected to a connection portion 364 provided in the second gear housing 630 and the other end is connected to the first connection pipe 611 through a portion of the second connection pipe 612 connected to the first connection pipe 611 And is electrically connected to the surface of the second body 360.

A connecting portion 362a having a relatively thinner thickness than the main portion may be formed at the other end of the second wire 612. have. A portion of the second connection pipe 612 exposed through the first connection pipe 611 may be provided with a fixing wall 612a for fixing the main end portion of the second electric wire 362. [ The connection portion 362a is protruded into the first connection pipe 611 while the main portion of the second wire 362 is fixed to the fixing wall 612a so that the end portion of the connection portion 362a is connected to the second body 360, In a non-fixed state. Accordingly, even if the second body 360 rotates, the connection portion 362a can maintain the connected state while rubbing against the surface of the second body 360, so that the third electric wire, which will be described later, Can be applied.

The third electric wire 363 is located inside the second gear housing 620 and has one end connected to the connection portion 364 and the other end connected to the upper surface of the fourth gear 740. At this time, the other end of the third wire 363 is connected to a position eccentric from the center of the upper surface of the fourth gear 740. Thus, the third wire 363 should be of sufficient length to prevent one end of the third wire 363 from separating from the connection 364 when the fourth gear 740 rotates. 9, it is shown that the third wire 363 has a predetermined length in a serpentine form. With this structure, the first body 360, the connecting portion 362a of the second electric wire 362, the main portion of the second electric wire 362, the connecting portion 364, the third electric wire 363, the fourth gear 740 ) To rotate the fourth gear 740 so that each of the conductors 400 'coupled to the fourth gear 740 can be individually rotated.

The opposite ends of the second body 360 are connected to the respective fourth gears 640 through the first connecting pipe 611, the second connecting pipe 612 and the second housing 630. [ Thus, the electrical connection between the cathode member 200 and the plating member 400 'is maintained.

According to the present embodiment, the second linking member having the propeller 331 and the second body 360 of the second linking member are coupled with each other by the blowing device, and the fourth gear 740 Is rotated to rotate each of the plating members 400 'so as to improve the swirling phenomenon of the plating liquid contained in the plating tank and the circulation of the plating liquid, thereby improving the plating speed and making the thickness of the plating layer more uniform .

In addition, since a plurality of plating bodies 400 'can be mounted and a large amount of plating can be performed at one time, there is an effect that the productivity can be further improved while improving the plating quality of the commemorative coin.

Commemorative coin manufacturing method

Hereinafter, a method for increasing the plating rate by causing a vortex phenomenon in the plating liquid among the methods for manufacturing the commemorative coin of the present invention will be described in detail based on examples.

In order to manufacture a commemorative coin according to the present embodiment, a plated metal body is first prepared using a raw material of metal. At this time, impurities on the surface can be removed by pretreatment of the surface of the plated body using a method such as ultrasonic degreasing or electrolytic degreasing prior to the plating process.

Next, the surface of the plated body is plated by using the commemorative coin manufacturing apparatus to form a plated layer with a desired thickness around the plated body. At this time, at least one of metals such as copper, nickel, gold, silver, brass and the like may be selected according to characteristics of the product and user's preference, and the present invention is not limited thereto .

In order to proceed with the plating process, the plating member is first fixed to the second connection member connected to the cathode bar. Specifically, the first connection member is electrically connected to the cathode bar provided in the horizontal direction in the plating vessel containing the plating solution, and then the second connection member, on which the propeller is formed, is rotated to the first connection member The plating member is fixed to the lower end of the second connecting member.

Next, the air is blown to the propeller of the second connecting member to supply the wind to the second connecting member so that the second connecting member is rotated by the flow of the plating liquid generated by the wind, and electricity is applied to the cathode bar, A plating layer is formed to a predetermined thickness. At this time, the second connecting member and the plating member rotate, and the plating solution in the plating tank swirls and vortexing phenomenon occurs. As a result, the plating speed is increased, and the plating layer can be formed in a required thickness in a short time. Further, since the plated body rotates at the time of plating and the plating is uniformly performed around the plated body, the thickness of the plated layer is entirely similar, so that the original shape of the coin can be properly realized when cutting the plated body to be described later.

At this time, when the plating is copper plating, plating may proceed as follows. 90 to 110 ml of a main component of copper sulfate (CuSO ₄ ), 3 to 9 ml of a complexing agent, 10 to 20 g of 98% sodium hydroxide (NaOH) as a pH adjusting agent, 5 to 30 g of 30 to 40% formaldehyde (HCHO) Plating is carried out in the plating bath containing the plating solution containing 10 ml of the plating solution. Here, the complexing agent acts to prevent the precipitation of metal ions and suppress the change in the concentration of metal ions, thereby suppressing the reduction rate, thereby inducing precipitation of copper. The reducing agent plays a role of giving electrons to metal ions and reducing and precipitating them with metal. The pH adjuster adjusts the pH and adjusts the plating rate so that a suitable reducing reaction environment is established.

In this embodiment, the precipitation reaction of copper is represented by Chemical Formula 1, and Chemical Formula 2 represents a self-decomposition reaction of copper. Referring to Formula 2, it can be seen that copper nuclei are precipitated in the liquid due to nucleation of Cu in the plating solution. With reference to Formula 3, a complexing agent can be used to inhibit the formation of such insoluble Cu ₂ O, and the insoluble Cu ₂ O can be oxidized to soluble Cu ^{2 +} by air agitation. In addition, the decomposition reaction of formaldehyde is caused by Cannizaro reaction as shown in Chemical Formula (4).

Cu ²⁺ + 2HCHO + 4OH ^- ? Cu + 2HCOO ^- ???????? H _2? + H ₂ O ????? (1)

(Formula ^{2) 2Cu 2 + + HCHO +} 5OH - → Cu 2 O + HCOO - + 3H 2 O, Cu 2 O + H2O → Cu + Cu 2 + + 2OH -

(3) Cu ₂ O + (1/2) O ₂ → ₂ Cu ²⁺ + 4 OH

(Formula 4) 2HCHO + NaOH → HCOONa + CH 3 OH

At this time, preferably, the temperature of the first plating bath in which the plating proceeds is maintained at 35 to 50 DEG C, and the plating may be performed for 2 to 10 minutes.

When the plating is nickel plating, plating may proceed as follows. Electricity of a current density of 2 to 10 A / dm 2 was applied to the electrode bar in a plating bath containing 150 to 250 g of nickel sulfate (NiSO ₄ ) and 5 to 30 g of boric acid (H ₂ BO ₃ ) in 1 L of water, Lt; / RTI > At this time, the temperature of the plating bath in which the plating progresses is preferably maintained at 40 to 60 ° C, and the plating may be performed for about 20 minutes.

When the plating is gold plating, plating may proceed as follows. Electricity at a current density of 0.5 to 2.0 A / dm ² was applied to a plating bath containing 1 to 5 g of potassium cyanide (KAu (CN ₂ )) and 40 to 120 g of citric acid, To the electrode bar. At this time, the temperature of the plating bath in which the plating progresses is preferably maintained at 30 to 40 ° C, and the plating may be performed for about 5 minutes.

When the plating is silver plating, plating may proceed as follows. In a plating bath containing a plating solution containing 1 to 5 g of silver cyanide (KAg (CN ₂ )), 35 to 45 g of sodium cyanide (NaCN) and 10 to 20 g of sodium carbonate (Na ₂ CO ₃ ) And electricity of 0.5 to 1.2 A / dm ² is applied to the electrode bar. At this time, the temperature of the plating bath in which the plating progresses is preferably maintained at 15 to 25 ° C, and the plating may be performed for about 2 minutes.

When the plating is brass plating, plating may proceed as follows. A plating bath containing a plating solution containing 30 to 50 g of copper cyanide (CuCN), 5 to 11 g of zinc cyanide (ZnCN) and 40 to 70 g of sodium cyanide (NaCN) was added to 1 L of water to prepare a plating solution containing electric power of 1 to 5 A / May be applied to the electrode bar. At this time, the temperature of the plating bath in which the plating progresses is preferably maintained at 35 to 40 DEG C, and the plating may be performed for 10 minutes or more.

Next, the plated body with the plated layer formed thereon is separated from the second connecting member, and then cut to a thickness of, for example, about the thickness of a coin to complete a commemorative coin having a different structure from that of the inside and the outside. According to this embodiment, since the plating member is rotated while the plating member is rotated in the plating step, and the plating layer is formed with a uniform thickness around the plating member, the shape of the coin to be cut into the coin thickness can properly realize the original shape of the coin.

As shown in FIG. 11, if necessary, the commemorative coin 10 'can be formed so as to have three zones separated from the center by the copper 11, the nickel 12 and the gold 13, The plating process may be repeatedly performed with the corresponding material. At this time, between the respective plating processes, a plating process, which is a plating material or a polishing process using a magnetic field, and a water washing process may be further performed to improve the plating quality. However, the present invention is not limited thereto. The commemorative coin of the present invention may be formed to have four or more zones having different materials when necessary.

Meanwhile, in order to fix the plated body to the second connecting member, a groove is formed around the upper end of the plated body first, and protruded downward from the plated body holding portion provided at the lower end of the second connecting member, Thereby forming a plurality of fixing rings. Then, the fixing ring can be engaged with the groove of the plating member, thereby fixing the plating member to the second connection member.

According to another embodiment, in order to fix the plating member to the second connection member, a groove is first formed around the upper end of the plating member, and a plating member fixing unit provided at the lower end of the second connection member is fixed to the second connection member And a plurality of housings having a gear structure that operates in accordance with the rotation of the two bodies. At this time, the gear structure may be applied to the second embodiment of the commemorative coin manufacturing apparatus described above. After the fixing rings are respectively formed in the plurality of housings, the plurality of fixing rings are engaged with the grooves of the plurality of plated bodies, respectively, and a plurality of plated bodies are fixed to the one second connecting member to improve the productivity have.

The present invention is not limited by the above-described embodiment and the accompanying drawings, but is intended to be limited by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

10, 10 ': Commemorative coins
200: cathode bar
310: first connecting member
311: Clasp ring
320: 1st body
330: second connecting member
331: Propeller
332, 360: second body
333: Plating member fixing unit
334: Retaining ring
335:
340: Ball bearing
361, 361 ': Wires
400, 400 ': Plated body
420, 420 ': Home
500: air blowing member
510: blower
520:
530: air blower
611: first connector
612: second connector
613:
620: first gear housing
630: Second gear housing
640: Retaining ring
710: First gear
720: Second gear
730: Third gear
740: Fourth gear
741: Axis

Claims (8)

Providing a plated body in the form of a rod;
Rotating the plating body and performing high-speed electroplating around the plating body to form a plating layer having a predetermined thickness; And
Cutting the plating body having the plating layer formed thereon to a thickness of a coin; / RTI >
The electroplating forming the plating layer may include:
Coupling the first connection member to the cathode bar disposed in the horizontal direction in the plating vessel so as to be electrically connected;
Rotatably coupling a second linking member having a propeller on a circumferential surface thereof to the first linking member;
Fixing the plating member to the lower end of the second connection member; And
Rotating the second linking member by a flow of a plating liquid by supplying air to the vicinity of the propeller; Lt; / RTI >
The plated body rotates in accordance with the rotation of the second linking member to cause a swirling phenomenon of the plating liquid, and in this state, electricity is applied to the cathode bar to form a plating layer at a high speed and at a uniform thickness around the plated body Wherein the method comprises the steps of: delete The method according to claim 1, wherein the step of fixing the plating member to the second connection member comprises: forming a groove around the upper end of the plating member; projecting downwardly from the plating member fixing unit provided at the lower end of the second connection member Wherein a plurality of fixing rings formed to be bent inward are formed, and then the fixing ring is engaged with the grooves of the plating body. The method according to claim 1, wherein the step of fixing the plated body to the second connection member comprises: forming a groove around the upper end of the plated body, and attaching the plated body fixing part provided at the lower end of the second connection member to the second connection A plurality of housings each having a gear structure that operates in conjunction with the rotation of the second body included in the member, wherein after the fixing rings are formed on the shaft of the horizontal rotary gear provided in the plurality of housings, And the hooks are engaged with the grooves of the plurality of plated bodies, respectively. A cathode bar provided in the plating vessel;
A first connection member coupled to the cathode bar;
A second connecting member having an upper end rotatably coupled to the first connecting member, a propeller formed on a circumferential surface thereof, and a plating member fixing unit at a lower end; And
An air blowing member for supplying air to the propeller and rotating the second linking member by the flow of the plating liquid; Wherein the apparatus comprises: [6] The apparatus of claim 5, wherein the first connection member comprises: a first body having a through hole formed in a lower surface thereof; a ball bearing disposed inside the first body; and a hook extending upwardly from the first body to be coupled to the cathode bar Rings,
Wherein the second connecting member includes a rod-shaped second body and a head portion formed at an upper end of the second body and rotatably coupled to the inside of the first body, wherein the plated body fixing portion includes a plurality of And a grip portion,
Wherein the plated body is formed in a rod shape and an upper circumferential portion is coupled to the grip portion so that the plated body rotates together when the second body of the second connecting member rotates. [6] The apparatus of claim 5, wherein the first connection member comprises: a first body having a through hole formed in a lower surface thereof; a ball bearing disposed inside the first body; and a hook extending upwardly from the first body to be coupled to the cathode bar Rings,
The second connecting member includes a bar-shaped second body and a head portion formed on the second body and rotatably coupled to the first body,
The plated body fixing unit includes a first connection pipe formed vertically long, a first gear housing provided at a lower end of the first connection, a plurality of second gear housings extending in the form of an umbrella horizontally in the first connection pipe, A second gear housing of a carpenter provided at a lower end of the second connecting pipe, and a plurality of third connecting pipes connecting the first gear housing and the second gear housing, 2 When the body is rotated,
A second gear disposed at the lower end of the second body, a second gear disposed at the third coupling tube and meshed with the first gear in a direction perpendicular to the first gear, A fourth gear having a shaft that is vertically rotated to be engaged with the third gear in a direction perpendicular to the third gear and exposed to the lower side of the second gear housing, Further comprising an installed retaining ring,
The plated body is formed in a rod shape and a groove is formed so that the fixing ring is engaged with the upper end thereof. The first gear, the second gear, the connecting shaft, the third gear, Wherein the fourth gear is rotated to be interlocked so that the plated body coupled to the shaft of the fourth gear is rotated independently of the rotation of the plated body fixing portion. 6. The connector according to claim 5, further comprising: a second wire having one end connected to a connection portion provided in the second gear housing and the other end contacting the surface of the first body of the first connection pipe through the second connection pipe; And
A third wire having one end connected to the connection portion and the other end connected to a position eccentric from the center of the upper surface of the fourth gear, the third wire having a predetermined length; Further comprising the step of:

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