KR101835855B1 - Microchannel lapping apparatus and mold lapping method using the same - Google Patents

Abstract

The present invention relates to a micro-channel lapping apparatus, and a mold lapping method using the same. The apparatus is for lapping micro-channel formed on a mold, comprising: a first mapping paper formed in a plate shape; a second mapping paper facing the first mapping paper and formed to be spaced a predetermined distance from the first mapping paper; a distance controlling hole disposed between the first mapping paper and the second mapping paper. One surface of the first mapping paper and the second mapping paper can be attached on lateral surfaces of the distance controlling hole. Moreover, a lap can be formed on at least one surface of the other surface of the first mapping paper and the second mapping paper. Therefore, a micro-channel, which has been hardly treated, can be lapped so as to improve a quality of a product. Therefore, the micro-channel palling apparatus and the mold lapping method using the same are provided to automatize the lapping work with respect to the micro-channel formed in the various directions.

Description

[0001] The present invention relates to a microchannel lapping apparatus and a mold lapping method using the microchannel lapping apparatus,

The present invention relates to a microchannel lapping apparatus and a mold lapping method using the same, and is a lapping apparatus and a lapping method for removing resin, burr, and the like, which are remained on a microchannel of a mold.

In general, lapping refers to smoothing the surface of a workpiece using a finishing tool called a lap, wherein the lap can be made of a non-metallic material such as soft metal such as cast iron or copper or hardwood and charcoal. And the lapping can be used with a lapping compound, which is a mixture of hard and lapping oil, so that the planarity of the workpiece can be further lowered to have a smooth surface. Wrapping is also called finishing, polishing, lapping, etc. depending on the floor plan of the workpiece or the type of worksite required, and may be classified as wet lapping and dry lapping depending on the method of using the lapping agent.

With this lapping, field workers can smooth the surface of the workpiece and furthermore grind the workpiece as well as the surface of the mold to mold the product. Such a device is disclosed in Korean Patent Registration No. 1600018 ("Fixing device for fixture for fixing mold for mold polishing") and Korean Registered Utility Model No. 0469755 ("Mounting of grinding stone for mold remover").

At this time, the apparatus described above is a device for polishing the surface of a mold as a finishing process at the time of producing a mold, and it is possible to smooth the surface of the mold, but it is very difficult to lap the fine channel when the microchannel is formed in the mold. In the case where a plurality of microchannels are formed in a mold, unreduced resin remains in each of the microchannels in many cases. Since the resin solidifies with time, there is a possibility that defects may occur during the subsequent molding .

Korean Patent Registration No. 1600018 ("Fixture for Fixture Fixing Machine for Mold Polishing ", issued Feb. 26, 2016) Korean Registered Utility Model No.0469755 ("Grinding Stones for Molding Machines", June 26, 2012)

The present invention relates to a microchannel lapping apparatus and a mold lapping method using the microchannel lapping apparatus. More particularly, the present invention relates to a microchannel lapping apparatus, Thereby enabling the microchannel to be wrapped, and a lapping method using the same.

According to an aspect of the present invention, there is provided an apparatus for wrapping a microchannel formed in a metal mold, the apparatus comprising: a first ground pad having a plate shape; A second map paper (220) facing the first map paper (210) and spaced apart by a predetermined distance; And a gap adjuster 230 disposed between the first and second maps 220 and 220. The first and second maps 220 and 230 are formed on both sides of the gap adjuster 230, 210 and one surface of the second ground sheet 220 are attached to one surface of the first ground sheet 210 and at least one surface of the second ground sheet 220 and the other surface of the first ground sheet 210, .

In this case, the fine channel lapping apparatus is arranged such that the lengthwise directions of the first maple 210, the second maple 220, and the gap adjuster 230 are parallel to each other, 210, 220 and the gap adjusting member 230 so that the first grounding pad 210, the second grounding pad 220 and the gap adjusting member 230 can be fixed to each other. And a pair of fixing members 240 disposed at both ends.

The microchannel lapping apparatus further includes a driving unit 300 coupled to the pair of fixing members 240 to transfer the first ground, the second ground, and the gap adjusting unit 230, ; ≪ / RTI >

In addition, the gap adjusting member 230 may have a waveform in cross section.

In addition, the gap adjusting member 230 may have a shape of an embossed pattern with a width of a cross section.

According to another aspect of the present invention, there is provided a mold lapping method using a microchannel lapping apparatus, comprising the steps of: preparing an interval adjuster (230) according to a width of a microchannel to be lapped; A step (S200) of attaching a first ground pad 210 and a second ground pad 220 to both sides of the gap adjusting element 230; A step (S300) of fixing the first map sheet 210, the second map sheet 220 and the gap adjusting member 230; And removing the workpiece by inserting the first globular land 210, the second globular land 220, and the gap adjuster 230 into the microchannel (S400).

In addition, the step of removing the work (S400) may include the step of removing the work (step S400) from the lapping tool 200 including the first ground, the second ground, And is inserted into the microchannel, and the lapping tool 200 reciprocates to lap the microchannel.

The step (S400) of removing the workpiece may include a step of removing the workpiece from the workpiece when the microchannel is formed in a plurality of directions including the first maple 210, the second maple 220, The lapping tool 200 is first inserted into a microchannel formed lengthwise in one direction to perform lapping, and the lapping tool 200 is wrapped by rotating the lapping tool 200 to lap the microchannel formed in the other direction .

The microchannel lapping apparatus and the mold lapping method using the microchannel lapping apparatus according to the present invention as described above can insert the microchannel between the protrusions forming the microchannel to remove the solidified resin by lapping, The flatness is lowered.

Further, the present invention is advantageous in that the interval adjusting member is inserted between a pair of imaginary planes and is easily adjustable according to the shape and structure of the fine channels. Furthermore, since the pair of false gaps are disposed so that the gap control gaps correspond to the widths of the fine channels, it is possible to press the gap gaps in the width direction to provide a smoother lapping operation.

The present invention is advantageous in that the lapping tool can be used in combination with the driving part, so that the microchannel can be wrapped in many directions. In other words, according to the present invention, while the microchannel formed in the transverse direction is wrapped, the lapping can be performed in the vertical direction and the rotation can be performed to lap the wide upper surface. Thus, To the advantage of.

1 is a schematic view of an extrusion molding according to an embodiment of the microchannel wrapping apparatus of the present invention
FIG. 2 is a perspective view of a microchannel-wrapping apparatus according to an embodiment of the present invention.
3 is an exploded perspective view of a wrapping tool according to one embodiment of the present invention.
4 is a plan view of a wrapping tool according to an embodiment of the microchannel wrapping apparatus of the present invention
Figure 5 is a side cross-sectional view illustrating the wrapping tool according to one embodiment of the microchannel wrapping apparatus of the present invention being inserted into the microchannel;
Figs. 6 and 7 illustrate an overall perspective view according to another embodiment of the microchannel-
Figs. 8 and 9 are top and cross-sectional views of a wrapping tool according to another embodiment of the microchannel-
10 is a flowchart of a mold lapping method using a microchannel lapping apparatus according to the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which: FIG. The following drawings are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the following drawings, but may be embodied in other forms. Also, throughout the specification, like reference numerals designate like elements.

In the following description and drawings, unless otherwise indicated, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. A description of the known function and configuration that can be blurred is omitted.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view for explaining a product group before describing a microchannel-wrapping apparatus according to the present invention. FIG. 1 shows a schematic diagram of extrusion molding. Referring to FIG. 1, an object to be wrapped by the present invention includes a mold 100 mounted on a molding apparatus 10, and may be a product having a microchannel. In particular, as shown in FIG. 1, since the mold used in the extrusion molding is continuously discharged, the quality of the molded product 20 may deteriorate if a solidified resin remains on the discharged mold line. In addition, the microchannel-wrapping apparatus of the present invention can be applied not only to extrusion but also to molds or products having microchannels formed therein.

[Microchannel Wrapping Device]

≪ Example 1 >

Fig. 2 shows an embodiment of a microchannel-wrapping apparatus according to the present invention, and Fig. 2 shows an entire perspective view. Referring to FIG. 2, the microchannel-lapping apparatus of the present invention may include a lapping tool 200 that wraps microchannels formed between protrusions 110 of a mold 100. In order to further explain the present invention, a rectangular coordinate system will be described in the perspective view.

As shown in FIG. 2, the plurality of protrusions 110 of the mold 100 may be regularly arranged, and the plurality of protrusions 110 may have a space therebetween, The product corresponding to the shape of the mold can be continuously produced. The direction of the microchannel produced by the plurality of protrusions 110 may be a length in the X axis between the plurality of protrusions 110 arranged in the X axis direction and a plurality of protrusions 110 arranged in the Z axis direction ) Can have a length along the Z axis. In Fig. 2, one of them is shown for wrapping the fine channel in the X-axis direction. 3 to 5, the lapping tool 200 for lapping the mold 100 will be described in more detail.

3 is an embodiment of a microchannel-wrapping apparatus according to the present invention, and Fig. 3 shows an exploded perspective view of a lapping tool. Referring to FIG. 3, the lapping tool 200 of the present invention may include a pair of imaginary spots 210 and 220 and a gap adjuster 230 interposed therebetween.

The pair of the landmarks may be included as the first landmark 210 and the second landmark 220. The first maple 210 may have a plate shape and may have a wide side and a narrow width. The second further ground 220 faces the first furthest ground 210 and may be spaced apart from each other by a predetermined distance. Here, the rectangular shapes of the first and second ground patterns 210 and 220 are shown. However, the first and second ground patterns 210 and 220 may have various shapes depending on the shape of the microchannels It can be deformed. For example, since the first and second maps 220 and 220 have a rectangular parallelepiped shape in FIG. 3, the first and second maps 220 and 220 may have a rectangular cross- ) May be formed not only in the form of a rectangle, but also in a circle and a polygon. Further, the present invention can be made such that the width according to the length thereof changes, and the cross-section presented in the present invention is one embodiment for expressing the idea of the present invention in detail.

The gap adjuster 230 may be disposed between the first and second maps 210 and 220 so that the large faces thereof are in contact with each other. Here, the first and second maps 220 and 220 are convenient when they are machined, and if the spacer 230 can be attached, the first maplet 210 And the second imaginary land 220 may be different from each other. However, since the pair of fixing members 240 can be disposed at both ends in the longitudinal direction after the first and second ground motions 210 and 220 are attached, The distance control member 230 may be formed to have a length and an area so as to be able to engage with the first and second map paper 210 and 220.

The first ground plane 210, the second ground plane 220, and the space adjusting port 230 may be arranged to be parallel to each other in the longitudinal direction. The first ground plane 210, A pair of fixing members 240 may be formed at both ends in the longitudinal direction so that the first grounding member 220, the second grounding member 220 and the gap adjusting member 230 can be fixed to each other. The first and second maps 220 and 220 may be formed on opposite surfaces of the first and second maps 210 and 220 opposite to the first and second maps 230 and 230, It is preferable that a lap is formed on at least one of the other surface of the second ground paper 210 and the other surface of the second ground paper 220.

Fig. 4 is an embodiment of a microchannel-wrapping apparatus according to the present invention, and Fig. 4 is a plan sectional view taken along the line A-A 'of Fig. Referring to FIG. 4, the stacking structure of the first map sheet 210, the second map sheet 220, and the spacer 230 will be described more clearly. The first and second maps 220 and 220 may be formed with wraps on the other surface to process the microchannels, and the gap adjuster 230 may adjust the width of the first channel It is possible to adjust so that the imaginary ground 210 and the second imaginary ground 220 can be rubbed against the protruding portion. At this time, it may be provided so as to be coupled primarily between the first and second maps 210 and 230 and between the second and third maps 220 and 230 by separate adhesive means.

Figure 5 is an embodiment of a microchannel-wrapping apparatus of the present invention, and Figure 5 shows a side cross-sectional view illustrating the wrapping tool being inserted into the microchannel. Referring to FIG. 5, it can be clearly shown that the microchannel is processed using the lapping tool 200 having the laminated structure as shown in FIG. As shown in FIG. 5, the lapping tool 200 laminated with the first globe 210, the second globe 220, and the gap adjuster 230 is inserted into the microchannel parallel to the longitudinal direction thereof, To remove the workpiece. Here, the workpiece may be a solidified resin as described above, but may be any object that is subjected to conventional lapping processing such as burrs of various foreign materials or molds other than solidified resin. Preferably, the lapping tool 200 has a longitudinal direction parallel to the microchannel, and a width corresponding to the microchannel. In order to facilitate the lapping operation, the lapping tool 200 of the present invention may have a width slightly larger than the microchannel, and the lower portion may be inclined to facilitate insertion into the microchannel. At least one selected from among the first dead point 210, the second dead point 220 and the gap adjuster 230 is formed to have elasticity so that even if it is formed to be large in the width direction, So that the protruding portion 110 can be pressed.

≪ Example 2 >

Figs. 6 and 7 show another embodiment of the microchannel-wrapping apparatus of the present invention, wherein Figs. 6 and 7 show an overall perspective view for showing a wrapping tool rotated by a drive unit. Fig. Referring first to FIG. 6, the microchannel-lapping apparatus of the present invention may further include a driving unit 300 together with the lapping tool 200 described above. The driving unit 300 may be coupled to a pair of fixing members 240 of the lapping tool 200 to drive the lapping tool 200. This will be described in more detail as follows.

First, the driving unit 300 of the present invention may lower the lapping tool 200 in the Z-axis direction so that the lapping tool 200 is inserted into the microchannel. The driving unit 300 may cause the lapping tool 200 to reciprocate in the X-axis direction, or slightly reciprocate in the Z-axis direction so that the imaginary ground can trim the protruding member. When finishing the finishing operation, the same function can be performed by inserting into the microchannel having the length in the other X-axis. When the lapping operation for the microchannel having the length in the X-axis is completed, 300 may be configured to rotate the lapping tool 200.

Referring to FIG. 7, the lapping tool 200 having a length in the conventional X-axis direction can be rotated by the driving unit 300 to have a length in the Y-axis direction. The lapping tool 200 may be inserted into a fine channel having a length in the Y axis direction in the mold 100. Thereafter, the lapping operation can be performed according to the method described in Fig. Here, the lapping tool 200 and the driving unit 300 of the present invention may be operated by alternating a plurality of microchannels formed in one direction and a plurality of microchannels formed in another direction.

The driving unit 300 may include a first driving arm 310, a second driving arm 320, and a pivot 330. The first driving arms 310 are coupled to the pair of fixing members 240 so that the fixing member 240 can be rotated on the first driving arm 310, The direction may be a rotation on the XY plane. The first driving arm 310 may be connected to the second driving arm 320 through a second driving arm 320. The second driving arm 320 may be connected to a rotating shaft 330 at a center thereof, And can be connected to rotate on the XY plane. Also, the lower end of the rotary shaft 330 may be connected to the second driving arm 320, and the upper end thereof may be connected to a separate transfer means (not shown). The conveying means may cause the lapping tool 200 to be conveyed in the X, Y, and Z axes.

≪ Example 3 >

Figs. 8 and 9 show another embodiment of the microchannel-lapping apparatus of the present invention, wherein Figs. 8 and 9 show a top cross-sectional view of a lapping tool showing various configurations of the spacers. 8 shows that the gap adjusting part 230 of the present invention has an embossing pattern in its cross section, and FIG. 9 shows that the gap adjusting part 230 of the present invention has a cross- .

As shown in FIG. 8, if the width adjusting tool 230 is formed in an embossing pattern repeatedly increasing and decreasing in a predetermined pattern, if the lapping tool 200 of the present invention is driven after being inserted into the fine channel, It is possible to prevent the paper sheet 210 and the second further paper 220 from slipping with respect to the gap adjusting member 230 so that the fixed relationship is not released. Since it is repeated that the first and second ground planes 210 and 220 are pulled in and out of a narrow space, it is easy to insert the first and second ground planes 210 and 220 into the narrower channel than the lapping tool 200 And when the protruding portion of the metal mold comes into contact with the wide portion, the pressing force is momentarily strengthened, so that the lapping operation can be performed more finely. As shown in FIG. 9, if the width of the gap adjusting member 230 is a wave shape, a function similar to that of the embossing pattern may be performed. In the case where the other surface of the first ground sheet 210 and the other surface of the second ground sheet 220 The outer surfaces of the first and second maps 220 and 220 can be prevented from being peeled off even if a large pressure is generated at a predetermined point.

[Mold Wrapping Method]

FIG. 10 shows an embodiment of a mold lapping method using the microchannel lapping apparatus of the present invention, and FIG. 10 shows a flowchart. Referring to FIG. 10, in the mold lapping method using the microchannel lapping apparatus described above, a step (S100) of preparing a gap adjusting hole in accordance with the width of a microchannel to be wiped, (S200) of attaching a first ground, a second ground, and a second ground (S300); fixing the first ground, the second ground, And removing the workpiece by inserting it into the microchannel (S400).

The step of preparing the gap adjusting step (S100) is a step of selecting the gap adjusting gauge considering the shape and width of the microchannel to be wrapped, considering the frictional force between a pair of the ground and the protruding parts attached to the front and rear surfaces It is preferable to correspond to the width of the fine channel.

The step S200 of attaching a pair of grounds on both sides of the gap adjusting member may include selecting the use of the reagent depending on whether the both sides are wet or dry. In order to facilitate the work, there is an advantage that, when the single microchannel is processed, one side is wet and the other side is dry, both operations can be performed simultaneously.

When the pair of imaginary planes is attached to the spacer, the spacer and the pair of imaginary planes may be fixed through the fixing member (S300). In this step, the fixing member may be fixed to the driving member while fixing the fixing member. And, when the lapping tool is combined with the driving portion, the mold lapping method of the present invention may include a step (S400) of machining a plurality of microchannels by a method as previously described with reference to Figs. 6 and 7.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, And various modifications and changes may be made thereto by those skilled in the art to which the present invention pertains.

Therefore, it is to be understood that the subject matter of the present invention is not limited to the described embodiments, and all of the equivalents or equivalents of the claims are included in the scope of the present invention will be.

10: forming device 11: dispensing line
20: Molded product
100: mold 110: protrusion
200: Wrapping tool
210: first map 220: second map
230: gap adjusting member 240: fixing member
300:
310: first driving arm 320: second driving arm
330: Pivot shaft 331: Bearing motor

Claims (8)

A lapping apparatus for inserting a fine channel formed in a mold (100) to lap a side surface of a fine channel,
A first ground pad 210 having a rectangular plate shape;
A second map sheet 220 formed in a shape corresponding to the first map sheet 210 and spaced apart from the first map sheet 210 by a predetermined distance; And
An interval adjuster 230 disposed between the first and second maps 220 and 220;
And,
One surface of the first ground sheet 210 and one surface of the second ground sheet 220 are attached to both sides of the gap adjusting member 230,
A lap is formed on at least one surface of the other surface of the first furthaper 210 and the other surface of the second furthest pile 220,
The first ground pad 210, the second ground pad 220, and the spacing control gate 230 are arranged so that their longitudinal directions are parallel to each other so that they can be inserted into the microchannels.
Both longitudinal ends of the first dead point 210, the second dead point 220 and the gap adjusting member 230 are coupled to each other through the fixing member 240,
The first and second grounding sheets 210 and 220 may be coupled to the pair of fixing members 240 so that the wraps formed on the first grounding sheet 210 or the second grounding sheet 220 through the reciprocating motion can polish the side surfaces of the microchannels. (300) for transferring the imaginary ground (210), the second imaginary ground (220), and the gap adjusting part (230)
Wherein the gap adjuster (230) has a surface in the shape of a corrugated or embossed pattern.
delete delete delete delete The method for lapping a metal mold using the microchannel lapping apparatus according to claim 1,
Preparing a gap adjusting hole 230 in accordance with the width of the microchannel to be wrapsped (S100);
A step (S200) of attaching a first ground pad 210 and a second ground pad 220 to both sides of the gap adjusting element 230;
A step (S300) of fixing the first map sheet 210, the second map sheet 220 and the gap adjusting member 230; And
A step (S400) of inserting the first globe (210), the second globe (220), and the gap adjuster (230) into the microchannel to remove the workpiece;
≪ / RTI >
7. The method of claim 6, wherein the step of removing the workpiece (S400)
Is inserted into a microchannel formed lengthwise in a direction parallel to the lapping tool (200) including the first ground (210), the second ground (220) and the gap adjuster (230)
Wherein the lapping tool (200) reciprocates to lap the microchannel.
7. The method of claim 6, wherein the step of removing the workpiece (S400)
When the microchannels are formed in various directions,
The lapping tool 200 including the first dead ends 210, the second dead ends 220, and the spacing adjusters 230 is first inserted into the lengthwise microchannel formed in one direction to perform lapping,
Wherein the lapping tool (200) is rotated through a driving unit (300) connected to the lapping tool (200) to lap the microchannel having a length in the other direction.

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