KR101826413B1 - Three dimensional hybrid nanostructures based materials for efficient photochemical or photoelectrochemical reaction and manufacturing method thereof - Google Patents

Three dimensional hybrid nanostructures based materials for efficient photochemical or photoelectrochemical reaction and manufacturing method thereof Download PDF

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KR101826413B1
KR101826413B1 KR1020160035394A KR20160035394A KR101826413B1 KR 101826413 B1 KR101826413 B1 KR 101826413B1 KR 1020160035394 A KR1020160035394 A KR 1020160035394A KR 20160035394 A KR20160035394 A KR 20160035394A KR 101826413 B1 KR101826413 B1 KR 101826413B1
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nano
substrate
dimensional
nanostructured
nanostructured portion
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KR20170110943A (en
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최일용
김종규
김동영
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포항공과대학교 산학협력단
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82BNANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B82B3/0009Forming specific nanostructures
    • B82B3/0038Manufacturing processes for forming specific nanostructures not provided for in groups B82B3/0014 - B82B3/0033
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0216Coatings
    • H01L31/02161Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02167Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Abstract

The present invention relates to a three-dimensional hybrid nano-structured element for an effective photochemical or photoelectrochemical reaction and a method of manufacturing the same. According to an embodiment of the present invention, there is provided a three-dimensional hybrid nano-structured element including a substrate and a plurality of three-dimensional nanostructures arranged on the substrate.

Description

TECHNICAL FIELD [0001] The present invention relates to a three-dimensional hybrid nano-structured element for effective photochemical or photoelectrochemical reaction, and a manufacturing method thereof. BACKGROUND ART < RTI ID = 0.0 > [0002] < / RTI &

The present invention relates to a three-dimensional hybrid nano-structured element for effective photochemistry or photoelectrochemical reaction and a method for manufacturing the same. More particularly, the present invention relates to a three-dimensional hybrid nano-structured element for maximizing photon absorption in a long wavelength region, And a device for improving the light conversion efficiency by optimizing the reaction and a manufacturing method thereof.

Since the Industrial Revolution, fossil fuels have been used extensively for a short period of time, and environmental problems such as air pollution, water pollution, global warming, and energy shortages due to fossil fuel reserves have received global attention.

Each government, institution, and research institute is devising and developing various methods to solve the environmental problem and energy shortage problem. Among these methods, the technology that solves problems by using the most abundant resource There is a lot of focus on. When solar light is incident on an element made of a semiconductor or a metal, an electron-hole pair is generated in a device that has absorbed the photon, and each of the electrons and holes separated from the generated electron-hole pairs is separated from the external environment such as air, water, Perform photoelectrochemical reactions to purify the atmosphere, purify the water, or produce energy resources such as hydrogen and hydrocarbon compounds. The most widely used material that absorbs sunlight to perform photochemical or photoelectrochemical reactions is titanium dioxide (TiO 2 ), which performs relatively photochemical or photoelectrochemical reactions with external environments such as air and water It is known to give. However, titanium dioxide has a bandgap that is large enough to absorb the photons and is limited to the ultraviolet region, which limits the effective absorption of sunlight. In addition, the present technology has a limitation in a technology for stably coating an element that performs photochemical or photoelectrochemical reaction by receiving sunlight such as titanium dioxide on a substrate, so that the element is not effectively used for a long period of time.

In order to solve the environmental problem and energy shortage problem by using solar light, the device should absorb photons of a wide wavelength range including visible light and infrared light, efficiently split the generated electron-hole pairs by absorbing photons , And each of the separated electrons and holes must perform a photochemical or photoelectrochemical reaction effectively with an external environment such as air or water. Further, in order for these devices to perform photochemical or photoelectrochemical reactions in various environments over a long period of time, a technique capable of stably coating the substrate is essential.

In order to overcome these limitations simultaneously, a three-dimensional hybrid nano-structured element made of at least two or more materials is proposed, and a manufacturing method capable of stably coating the three-dimensional hybrid nano-structured element on any substrate is proposed.

Patent Document 1: Korean Published Patent Application No. 10-2012-0121511 (2012.11.06)

The present invention aims at providing a device for maximizing photon absorption in a long wavelength region and optimizing photochemical or photoelectrochemical reaction by using a three-dimensional hybrid nano-structured element made of two or more materials to improve the light conversion efficiency do.

Another object of the present invention is to provide a manufacturing method capable of stably coating a three-dimensional hybrid nano-structured element on any substrate.

According to an embodiment of the present invention, there is provided a three-dimensional hybrid nano-structured element including a substrate and a plurality of three-dimensional nanostructures arranged on the substrate.

According to another embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a pre-patterned layer on a substrate; And forming a three-dimensional nanostructure on the free-pattern layer. The present invention also provides a method of fabricating a three-dimensional hybrid nano-structured element.

The present invention can maximize photon absorption by a plasmon resonance effect using a metal material by forming a three-dimensional nanostructure from a semiconductor material having a different band gap, thereby absorbing photons in a long wavelength region.

In addition, the present invention improves photon absorption efficiency by confining light with a strong scattering effect of light through a three-dimensional nanostructure, and is capable of rapidly separating electrons and holes from electron-hole pairs and having a wide surface area to optimize photochemical or photoelectrochemical reactions The light conversion efficiency can be improved.

In addition, the present invention can stably coat a three-dimensional hybrid nano-structured element on any substrate, thereby improving durability and long-term stability of the device.

1 is a view showing a configuration of a three-dimensional hybrid nano-structured element according to an embodiment of the present invention.
2 is a view showing a cross-sectional structure of the pre-patterned layer shown in FIG.
3 is a view showing a cross-sectional structure of a three-dimensional nanostructure on a substrate without a pre-patterned layer.
4 is a view showing a cross-sectional structure of a three-dimensional nanostructure on a substrate having a pre-patterned layer.
5 is a view showing a cross-sectional structure of a three-dimensional nanostructure made of two semiconductor materials.
FIG. 6 is a view showing a configuration of a three-dimensional hybrid nano-structured element according to another embodiment of the present invention.
7 is a view showing a configuration of a three-dimensional hybrid nano structured element according to another embodiment of the present invention.
8 is a view for explaining the scattering effect of incident light of the three-dimensional nanostructure.
FIG. 9 is a diagram showing measurement results of light scattering effect in a three-dimensional nanostructure. FIG.
10 is a flowchart illustrating a method of fabricating a three-dimensional hybrid nano-structured element according to an embodiment of the present invention.
11 is a view for explaining an inclination angle deposition method in a method of forming a three-dimensional nanostructure in a method of manufacturing a three-dimensional hybrid nano-structured element.

Hereinafter, the present invention will be described more specifically based on preferred embodiments of the present invention. However, the following embodiments are merely examples for helping understanding of the present invention, and thus the scope of the present invention is not limited or limited.

1 is a view showing a configuration of a three-dimensional hybrid nano-structured element according to an embodiment of the present invention.

Referring to FIG. 1, a three-dimensional hybrid nano-structured device according to an embodiment of the present invention may include a substrate 10, a pre-patterned layer 11, and a three-dimensional nanostructure 15.

The substrate 10 may be a substrate for making the pre-patterned layer 11 and for growing the three-dimensional nanostructures 15. The substrate 10 may be any one of an insulating substrate such as glass and sapphire, a flexible insulating substrate, a metal substrate, a flexible metal substrate, a transparent conductive oxide substrate, a transparent conductive flexible oxide substrate, a conductive polymer substrate, a conductive flexible polymer substrate, .

The free pattern layer 11 is formed on the substrate 10 and may include a pattern 12 supporting the three-dimensional nanostructure as shown in FIG. The pattern 12 of the pre-pattern layer 11 may be set to arrange the three-dimensional nanostructure 15.

Here, the pre-patterned layer 11 may include a conductive material. For example, the free pattern layer 11 may be formed of a metal such as Ag, Au, Cu, Al, Pt, Pd, Ti, Co, Ni, Si, Fe, Cr, Ru, Rh, Ir, Mg, may include in, Ta, Pb, V, W, Zr, ITO, FTO, SnO 2, AZO, GZO, IZO, ZnO, and at least one conductive polymer.

The three-dimensional nanostructure 15 may be disposed on the pre-pattern layer 11. Alternatively, according to another embodiment, the three-dimensional nanostructure 15 may be disposed on the substrate 10. [ However, the three-dimensional nanostructure 15 may require the pre-pattern layer 11 as a part for controlling the density and stability.

At this time, the three-dimensional nanostructure 15 may be a nano dot, a nano rod, a slanted nano rod, a zigzag nano rod, a nano helix, And may be formed of at least one nanostructure of a nano wire, a nano ribbon, a nano spring, and a nano cone.

For example, the three-dimensional nanostructure may be formed in a nano-helix structure on a substrate without a pre-patterned layer as shown in FIG.

In addition, the three-dimensional nanostructure may be formed in a nanorix structure periodically arranged on a substrate having a pre-patterned layer as shown in FIG.

In addition, the three-dimensional nanostructure 15 may include two or more different materials. At this time, the three-dimensional nanostructure 15 may include two or more semiconductor materials having different band gaps.

In addition, the three-dimensional nanostructure 15 may include a plurality of nanostructure portions 20, 30, and 40.

Specifically, the three-dimensional nanostructure 15 may be divided into at least two portions according to the embodiment.

In one embodiment, the three-dimensional nanostructure 15 includes a first nanostructured portion 20 disposed on the pre-patterned layer 11 and a second nanostructured portion 30 connected to the first nanostructured portion 20 .

At this time, the first nanostructure portion 20 may include any one of a semiconductor material and a metal material, and the second nanostructure portion 30 may include the other nanostructured portion. Alternatively, as shown in FIG. 5, the first nanostructured portion 20 may include a semiconductor material, and the second nanostructured portion 30 may include a semiconductor material different from the first nanostructured portion 20.

In another embodiment, the three-dimensional nanostructure 15 includes a first nanostructured portion 20 disposed on the pre-patterned layer 11, a second nanostructured portion 30 connected to the first nanostructured portion 20, And a third nanostructure 40 connected to the nanostructure 30.

3, the three-dimensional nanostructure 15 includes a first nanostructured portion 20, a second nanostructured portion 30, and a third nanostructured portion 30, 40 may comprise a semiconductor material different from the first nanostructured portion 20.

Alternatively, the three-dimensional nanostructure 15 may have a structure in which the first nanostructured portion 20 includes a semiconductor material as shown in FIG. 6 and the second nanostructured portion 30 includes a semiconductor material different from the first nanostructured portion 20 And the third nanostructured portion 40 may comprise a metallic material.

Herein, the semiconductor material may include at least one of an inorganic material, an inorganic mixture, and a compound, and the inorganic material may include SnO 2 , TiO 2 , WO 3 , BiVO 4 , Fe 2 O 3 , ITO, FTO, Cu 2 O, 2 , SrTiO 3 , MoS 2 , WS 2 , CdS, CdSe, GaN, InGaN, GaAs, InGaAs, GaP, InGaP, Si, SiC, ZnO, ZnS, ZrO 2 , In 2 O 3 and KTaO 3 can do.

The metal material may be at least one selected from the group consisting of Ag, Au, Cu, Al, Pt, Pd, Ti, Co, Ni, Si, Fe, Cr, Ru, Rh, Ir, Mg, Mo, Mn, Sn, , V, W, and Zr.

The three-dimensional nanostructure 15 may include a metal material to exhibit a plasmon resonance effect and further improve photon absorption in the plasmon resonance wavelength region.

Meanwhile, as shown in FIG. 7, the three-dimensional nanostructure 15 may be formed in a core-shell structure according to an embodiment.

Here, the three-dimensional nanostructure 15 includes a first nanostructured portion 20 and a second nanostructured portion 30, and a second nanostructured portion 30 surrounds the surface of the first nanostructured portion 20, . The three-dimensional nanostructure 15 increases the interface between the first nanostructured portion 20 and the second nanostructured portion 30 to improve the separation effect of electrons and holes from the electron-hole pairs.

In the three-dimensional hybrid nano-structured element according to an embodiment of the present invention, the three-dimensional nanostructure 15 can induce the scattering effect of incident light as shown in FIG.

In addition, the three-dimensional hybrid nano-structured element according to an embodiment of the present invention can be measured as shown in FIG. 9 when the light scattering effect is measured. 9 (a) shows the concept of specular reflectance and diffuse reflectance of incident light, and FIG. 9 (b) shows the concept of light reflected from the three-dimensional nanostructure in a predetermined angle range 45 degrees, 30 degrees). In this case, in FIG. 9 (b), the results (A) measured on the FTO (Fluorine-doped Tin Oxide) layer and the results (B) measured on the 3D nanostructures fabricated on the FTO . 9 (b), the three-dimensional nanostructures can improve the photon absorption efficiency by lowering the specular reflectance and increasing the diffuse reflectance, thereby enhancing the scattering effect of strong light.

A three-dimensional hybrid nano structure element according to an embodiment of the present invention has a three-dimensional nanostructure formed of a semiconductor material having a different band gap, absorbs photons in a long wavelength region, and maximizes photon absorption by a plasmon resonance effect using a metal material can do.

In addition, the three-dimensional hybrid nano-structured element according to an embodiment of the present invention improves photon absorption efficiency by confining light with a strong scattering effect of light through a three-dimensional nanostructure, and separates electrons and holes from electron- It is fast and has a wide surface area to optimize photochemical or photoelectrochemical reactions to improve the light conversion efficiency.

10 is a flowchart illustrating a method of fabricating a three-dimensional hybrid nano-structured element according to an embodiment of the present invention.

10, a method of fabricating a three-dimensional hybrid nano-structured element according to an embodiment of the present invention includes forming a free pattern layer on a substrate (S100) and forming a three-dimensional nanostructure on the free pattern layer Step S200.

Referring to FIG. 10, in step S100, a pattern formed on a nanoimprint mold may be transferred to a substrate by imprinting to form a pre-patterned layer.

Here, the substrate may be a non-conductive substrate such as glass and sapphire, a flexible non-conductive substrate, a metal substrate, a flexible metal substrate, a transparent and highly conductive oxide substrate, a transparent and highly conductive flexible oxide substrate, a conductive high polymer substrate, Can be used.

Also, the pre-patterned layer may be formed of a conductive material. For example, the free-pattern layer may be formed of a metal such as Ag, Au, Cu, Al, Pt, Pd, Ti, Co, Ni, Si, Fe, Cr, Ru, Rh, Ir, Mg, Mo, Mn, of Ta, Pb, V, W, Zr, ITO, FTO, SnO 2, AZO, GZO, IZO, ZnO , and conductive polymer can be formed by at least one.

Alternatively, in step S100, the metal plate of one of aluminum, titanium, and tantalum may be anodized to form a pre-patterned layer.

Next, in step S200, a three-dimensional nanostructure can be formed on the pre-patterned layer. At this time, the three-dimensional nanostructure can be formed of two or more different materials.

At step S200, at least one of an inclined angle deposition method, an electron beam deposition method, a thermal deposition method, a chemical vapor deposition method, a sputtering deposition method, a flame gas phase synthesis method, a hydrothermal synthesis method, a drop casting method, a light deposition method, an electrodeposition deposition method, an atomic layer deposition method, A three-dimensional nanostructure can be formed.

Specifically, in step S200, as shown in FIG. 11, the three-dimensional nanostructures 15 are formed in a state in which the flux lines of the substance to be deposited and the water lines on the upper surface of the substrate 10 are inclined at a predetermined angle of inclination using a tilt angle deposition method can do.

In this process, the island-shaped initial deposition material formed on the upper surface of the substrate initially forms a shadow region on the backside, and then the deposited material is deposited only on the initial deposition material without being deposited in the shadow region, Dimensional nanostructure can be formed.

When forming a three-dimensional nanostructure, a nano dot, a nano rod, a slanted nano rod, a zigzag nano rod, a nano helix dimensional nanostructure can be formed by at least one of nano structure of nano wire, nano helix, nano wire, nano ribbon, nano spring, and nano cone.

Meanwhile, in step S200, according to an embodiment, a step of forming a first nanostructured part on the substrate or the pre-patterned layer and a step of forming a second nanostructured part connected to the first nanostructured part may be included. At this time, the first nanostructured portion may be formed of one of a semiconductor material and a metal material, and the second nanostructured portion may be formed of the remaining one. Here, the first nanostructure may be stably formed on a substrate or a free layer using an inclination angle evaporation method, so that long-term stability and durability can be excellent. Also, the second nanostructured portion and the third nanostructured portion can be formed using one of various methods of forming the three-dimensional nanostructure described above. Such a three-dimensional nanostructure is formed by the inclination angle deposition method, thereby overcoming the limitations of the conventional technique of not stably coating the device on the substrate, thereby improving durability and long-term stability.

In step S200, a step of forming a first nanostructured portion on the substrate or the pre-patterned layer, forming a second nanostructured portion connected to the first nanostructured portion, and forming a second nanostructured portion connected to the second nanostructured portion, 3 < / RTI > nanostructure. At this time, the first nanostructured portion may be formed of a semiconductor material, the second nanostructured portion may be formed of a metal material, and the third nanostructured portion may be formed of a semiconductor material different from the first nanostructured portion. Alternatively, the first nanostructured portion may be formed of a semiconductor metal material, the second nanostructured portion may be formed of a semiconductor material different from the first nanostructured portion, and the third nanostructured portion may be formed of a metallic material. Here, the first nanostructured portion can be stably formed on a substrate or a pre-patterned layer by using a tilt angle deposition method, so that durability and long-term stability can be excellent. Also, the second nanostructured portion and the third nanostructured portion can be formed using one of various methods of forming the three-dimensional nanostructure described above. Such a three-dimensional nanostructure is formed by the inclination angle deposition method, thereby overcoming the limitations of the conventional technique of not stably coating the device on the substrate, thereby improving durability and long-term stability.

Also, in step S200, the first nanostructured portion and the second nanostructured portion may be formed in a core-shell structure according to another embodiment. At this time, the second nanostructured portion may be formed so as to surround the surface of the first nanostructured portion.

Herein, the semiconductor material may include at least one of an inorganic material, an inorganic mixture, and a compound, and the inorganic material may include SnO 2 , TiO 2 , WO 3 , BiVO 4 , Fe 2 O 3 , ITO, FTO, Cu 2 O, 2 , SrTiO 3 , MoS 2 , WS 2 , CdS, CdSe, GaN, InGaN, GaAs, InGaAs, GaP, InGaP, Si, SiC, ZnO, ZnS, ZrO 2 , In 2 O 3 and KTaO 3 can do.

The metal material may be at least one selected from the group consisting of Ag, Au, Cu, Al, Pt, Pd, Ti, Co, Ni, Si, Fe, Cr, Ru, Rh, Ir, Mg, Mo, Mn, Sn, , V, W, and Zr.

A method for fabricating a three-dimensional hybrid nano-structured element according to an embodiment of the present invention can stably coat a three-dimensional hybrid nano-structured element on a substrate in order to perform a photochemical or photoelectrochemical reaction in a variety of environments for a long period of time.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. In addition, it is a matter of course that various modifications and variations are possible without departing from the scope of the technical idea of the present invention by anyone having ordinary skill in the art.

10: substrate
11: free pattern layer
15: Three-dimensional nanostructures
20: First nano structure
30: second nano structure
40: third nano structure

Claims (32)

Board; And
And a plurality of three-dimensional nanostructures arranged on the substrate,
The three-dimensional nanostructure includes a first nanostructured portion extending in one direction on the substrate, a second nanostructured portion connected to the longitudinal end of the first nanostructured portion and a second nanostructured portion connected to the second nanostructured portion, And a third nanostructured portion extending in the longitudinal direction of the first nanostructured portion to enlarge the surface area to increase photon absorption efficiency,
Wherein the first nanostructured portion comprises a semiconductor material, the second nanostructured portion comprises a metallic material, and the third nanostructured portion comprises a semiconductor material different from the first nanostructured portion,
The three-dimensional nanostructure may be formed of a semiconductor material having a different band gap to absorb photons in a long wavelength region and induce photon absorption due to a plasmon resonance effect using a metal material of the second nanostructure portion. A three-dimensional hybrid nano-structured element that improves photo-conversion efficiency through photochemical or photoelectron conjugation reaction by rapidly separating electrons and holes and expanding the surface area.
delete delete delete delete delete delete The method according to claim 1,
Wherein the semiconductor material comprises at least one of an inorganic material, an inorganic mixture, and a compound.
9. The method of claim 8,
The inorganic material may be selected from the group consisting of SnO 2 , TiO 2 , WO 3 , BiVO 4 , Fe 2 O 3 , ITO, FTO, Cu 2 O, CuO, SiO 2 , SrTiO 3 , MoS 2 , WS 2 , CdS, CdSe, GaN, InGaN, 3D hybrid nanostructured elements, comprising a GaAs, InGaAs, GaP, InGaP, Si, SiC, ZnO, ZnS, ZrO 2, in 2 O 3 and any one of KTaO 3.
The method according to claim 1,
The metal material may be at least one selected from the group consisting of Ag, Au, Cu, Al, Pt, Pd, Ti, Co, Ni, Si, Fe, Cr, Ru, Rh, Ir, Mg, Mo, Mn, Sn, Zn, V, W, and Zr.
The method according to claim 1,
The three-dimensional nanostructure may be a nano dot, a nano rod, a slanted nano rod, a zigzag nano rod, a nano helix, a nano wire, ), A nano ribbon, a nano spring, and a nano cone. The three-dimensional hybrid nano-structured element is formed of at least one of nano structure, nano ribbon, nano spring, and nano cone.
The method according to claim 1,
Wherein the three-dimensional nanostructure is formed in a core-shell structure.
The method according to claim 1,
And a pre-patterned layer formed on the substrate, the pre-patterned layer including a pattern supporting the three-dimensional nanostructure.
14. The method of claim 13,
Wherein the pre-patterned layer comprises a conductive material.
15. The method of claim 14,
The free-pattern layer may include at least one of Ag, Au, Cu, Al, Pt, Pd, Ti, Co, Ni, Si, Fe, Cr, Ru, Rh, Ir, Mg, Mo, Mn, Sn, Zn, , At least one of V, W, Zr, ITO, FTO, SnO 2 , AZO, GZO, IZO, ZnO and a conductive polymer.
The method according to claim 1,
Wherein the substrate comprises any one of a nonconductive substrate such as glass and sapphire, a flexible nonconductive substrate, a metal substrate, a flexible metal substrate, a transparent conductive oxide substrate, a transparent conductive flexible oxide substrate, a conductive polymer substrate, a conductive flexible polymer substrate, Three - dimensional hybrid nano - structured device.
Forming a free pattern layer on the substrate; And
And forming a three-dimensional nanostructure on the pre-patterned layer,
In the step of forming the three-dimensional nanostructure, a first nanostructured portion extending in one direction is formed on the substrate, a second nanostructured portion is coupled in a longitudinal direction of the first nanostructured portion, To form a third nanostructured portion extending in the longitudinal direction of the first nanostructured portion,
Wherein the first nanostructured portion is formed of a semiconductor material, the second nanostructured portion is formed of a metal material, and the third nanostructured portion is formed of a semiconductor material different from the first nanostructured portion,
The three-dimensional nanostructure may be formed of a semiconductor material having a different band gap to absorb photons in a long wavelength region and induce photon absorption due to a plasmon resonance effect using a metal material of the second nanostructure portion. A method for fabricating a three-dimensional hybrid nano-structured element, wherein the separation of electrons and holes is rapid and the surface area is enlarged to improve the photoconversion efficiency through photochemical or photoelectron conjugation reaction.
delete delete delete delete delete delete 18. The method of claim 17,
Wherein the semiconductor material comprises at least one of an inorganic material, an inorganic mixture, and a compound.
25. The method of claim 24,
The inorganic material may be selected from the group consisting of SnO 2 , TiO 2 , WO 3 , BiVO 4 , Fe 2 O 3 , ITO, FTO, Cu 2 O, CuO, SiO 2 , SrTiO 3 , MoS 2 , WS 2 , CdS, CdSe, GaN, InGaN, method of producing a three-dimensional hybrid nanostructured elements, comprising a GaAs, InGaAs, GaP, InGaP, Si, SiC, ZnO, ZnS, ZrO 2, in 2 O 3 and any one of KTaO 3.
18. The method of claim 17,
The three-dimensional nanostructure may be at least one of an inclined angle deposition method, an electron beam deposition method, a thermal deposition method, a chemical vapor deposition method, a sputtering deposition method, a flame gas phase synthesis method, a hydrothermal synthesis method, a drop casting method, a light deposition method, an electrodeposition deposition method, an atomic layer deposition method, Wherein the three-dimensional hybrid nanostructured device is formed by one method.
18. The method of claim 17,
The three-dimensional nanostructure may be a nano dot, a nano rod, a slanted nano rod, a zigzag nano rod, a nano helix, a nano wire, ), A nano ribbon, a nano spring, and a nano cone. The method of manufacturing a three-dimensional hybrid nano-structured element according to claim 1,
18. The method of claim 17,
Wherein the step of forming the pre-patterned layer comprises transferring a pattern formed on the nanoimprint mold to the substrate by an imprinting method to form the pre-patterned layer.
29. The method of claim 28,
Wherein the pre-patterned layer comprises a conductive material.
30. The method of claim 29,
The free-pattern layer may include at least one of Ag, Au, Cu, Al, Pt, Pd, Ti, Co, Ni, Si, Fe, Cr, Ru, Rh, Ir, Mg, Mo, Mn, Sn, Zn, , V, W, Zr, ITO, FTO, SnO 2, AZO, GZO, IZO, ZnO and the method for producing a conductive polymer of the at least one three-dimensional hybrid nano-containing structure element.
18. The method of claim 17,
Wherein the pre-patterned layer is formed by anodizing one of the metal plates of aluminum, titanium and tantalum to form the pre-patterned layer.
18. The method of claim 17,
Wherein the substrate is one of an insulating substrate such as glass and sapphire, a flexible insulating substrate, a metal substrate, a flexible metal substrate, a transparent conductive oxide substrate, a transparent conductive flexible oxide substrate, a conductive polymer substrate, a conductive flexible polymer substrate, A method for manufacturing a three - dimensional hybrid nano - structured element.
KR1020160035394A 2016-03-24 2016-03-24 Three dimensional hybrid nanostructures based materials for efficient photochemical or photoelectrochemical reaction and manufacturing method thereof KR101826413B1 (en)

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KR20220014565A (en) 2020-07-29 2022-02-07 고려대학교 세종산학협력단 Silicon Nanowires-Transition Metal Sulfide Nanosheets and Preparation Method Thereof
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KR20220014564A (en) 2020-07-29 2022-02-07 고려대학교 세종산학협력단 Silicon Nanowires-Transition Metal Selenide Nanosheets and Preparation Method Thereof
KR20220014565A (en) 2020-07-29 2022-02-07 고려대학교 세종산학협력단 Silicon Nanowires-Transition Metal Sulfide Nanosheets and Preparation Method Thereof
KR20230016434A (en) * 2021-07-26 2023-02-02 고려대학교 산학협력단 Method for fabricating nano structure and photocatalyst device using oblique angle deposition and photocatalyst device using the same method
KR102536110B1 (en) 2021-07-26 2023-05-26 고려대학교 산학협력단 Method for fabricating nano structure and photocatalyst device using oblique angle deposition and photocatalyst device using the same method

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