KR101822587B1 - Painting Composition having heat dissipation and LED Lamp Device having excellent heat-radiant property by employing the same - Google Patents
Painting Composition having heat dissipation and LED Lamp Device having excellent heat-radiant property by employing the same Download PDFInfo
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Abstract
Description
본 발명은 엘이디(LED) 조명등기구에서 외부 케이스를 통한 방열을 향상시키기 위해, 상기 외부 케이스에 코팅하는 방열 도료 조성물의 조성과 특성을 향상시키는 방열 도료 조성물에 관한 것으로, 효율적으로 열을 방출하거나 냉각용 부품으로 열을 전달시킬 수 있는 조명등기구용 방열 도료 조성물 및 이를 이용한 우수한 방열특성을 가지는 엘이디(LED) 조명등기구에 관한 것이다.The present invention relates to a heat dissipation coating composition which improves the composition and properties of a heat dissipation coating composition coated on an outer case to improve heat dissipation through an outer case in an LED lighting fixture, And to an LED light fixture having excellent heat dissipation characteristics using the same.
최근 전자기기의 고성능화, 소형화 및 고기능화에 따라 전자부품 회로에서 발열량이 증가함에 따라 기기의 내부온도가 상승하여 반도체 소자의 오작동, 저항체 부품의 특성변화 및 부품의 수명이 저하되는 문제를 수반한다. 이러한 문제점을 해결하기 위한 방열대책으로 다양한 기술이 적용되고 있다.Recently, with the increase in the performance, the miniaturization, and the high performance of electronic devices, the internal temperature of the device rises as the amount of heat generated by the electronic parts circuit increases, thereby causing malfunction of the semiconductor device, change of characteristics of the resistor component, and deterioration of component life. Various techniques have been applied to solve such a problem.
이러한 방열대책으로는 히트싱크(Heat sink)나 방열 시트를 설치하는 방법이 있다. 또한, 상기 열원과 히트싱크 사이에 방열그리스(Thermal grease), 방열 패드, 방열 테이프 등과 같은 열 전달물질을 삽입하는 방법이 있다.Such heat dissipation measures include a method of providing a heat sink or a heat radiation sheet. In addition, there is a method of inserting a heat transfer material such as a thermal grease, a heat radiation pad, a heat radiation tape or the like between the heat source and the heat sink.
그런데 상기와 같은 종래의 방열방법은 열원에서 발생하는 열을 단순히 히트씽크로 전달하는 기능만 할 뿐, 히트싱크에 축적된 열을 공기 중으로 방출하는 기능은 수행하지 못하였다. 더구나 전자제품의 열원이나 히트 싱크, 방열 시트 등을 보호하기 위하여 그 표면에다 종래의 액상도료를 코팅하게 되면, 그 피막이 피도체의 열 방출을 차단하여 오히려 상기 전자제품의 성능이나 수명에 악영향을 미치는 결과를 초래하기도 한다.However, the conventional heat dissipating method as described above merely serves to transfer the heat generated from the heat source to the heat sink, and fails to discharge the heat accumulated in the heat sink to the air. Furthermore, if a conventional liquid coating material is coated on the surface of a heat source, a heat sink, a heat-radiating sheet, or the like of an electronic product, the heat shielding of the coated object may adversely affect the performance or lifetime of the electronic device. Results.
본 발명의 목적은 자외선 경화로 코팅층을 용이하게 얻을 수 있으면서도, 방열 효과가 우수한 엘이디(LED) 조명등 기구용 방열 도료 및 방열효과가 우수한 LED 조명등 기구를 제공하는 것이다.An object of the present invention is to provide a heat radiating coating material for an LED illuminating lamp apparatus which is capable of easily obtaining a coating layer by ultraviolet curing but has excellent heat radiation effect and an LED illuminating lamp apparatus excellent in heat radiation effect.
본 발명의 목적을 달성하기 위하여, 본 발명은 질화붕소 분체, 및 상기 질화붕소 분체에 담지된 실란 커플링제를 포함하는 담지체; 에폭시 수지; 및 광개시제;를 포함하고,상기 질화붕소 분체는 상기 질화붕소 분체의 표면에 형성되는 2가 금속착체층을 포함하는 엘이디(LED) 조명등 기구용 방열 도료 조성물을 제공한다.In order to accomplish the object of the present invention, the present invention provides a support comprising a support comprising a boron nitride powder and a silane coupling agent supported on the boron nitride powder; Epoxy resin; And a photoinitiator, wherein the boron nitride powder includes a divalent metal complex layer formed on the surface of the boron nitride powder.
본 발명의 또 다른 목적을 달성하기 위하여, 본 발명은 본 발명에 따른 도료 조성물로 코팅된 엘이디 조명등 기구를 제공한다.In order to accomplish still another object of the present invention, the present invention provides an LED illumination device coated with a coating composition according to the present invention.
본 발명에 따른 방열 도료 조성물은 자외선 경화로 인하여 경화 시간을 단축하였으며, 빠른 경화에 의해 형성된 코팅층에도 불구하고 균일한 분산성으로 코팅층 막의 두께가 일정하면서도, 열전도율이 우수하여 전자기기 내부로부터 발생한 열을 외부로 빠르게 방출시킬 수 있다.The heat radiation coating composition according to the present invention shortens the curing time due to ultraviolet ray curing. The coating layer thickness is uniform due to the uniformly dispersed coating despite the coating layer formed by rapid curing, and the heat generated from the inside of the electronic equipment is excellent It can be quickly released to the outside.
따라서, 본 발명에 따른 도료 조성물로 이루어진 코팅층을 갖는 엘이디(LED) 조명등 기구용 도료 조성물은 복잡한 공정을 단순화하여 제조 단가는 낮추면서도, 전자 기기 등에 코팅시 빠른 코팅층 형성으로 전체 공정의 속도를 높일 수 있으면서도 방열 효과가 우수한 전자 제품을 제공할 수 있다.Accordingly, the coating composition for an LED light fixture having a coating layer made of the coating composition according to the present invention can simplify a complicated process, thereby lowering the manufacturing cost and speed up the entire process by forming a coating layer at a time of coating on electronic equipment It is possible to provide an electronic product excellent in heat radiation effect.
결과적으로 본 발명에 따른 LED 조명등 기구는 우수한 방열 효과를 갖는다.As a result, the LED illumination lamp apparatus according to the present invention has an excellent heat radiation effect.
도 1 내지 도 7은 본 발명에 따른 방열 도료 조성물이 도포된 예시적 실시형태의 LED 조명등 기구의 이미지이다.1 to 7 are images of an LED illumination lamp apparatus of an exemplary embodiment in which a heat radiation coating composition according to the present invention is applied.
이하 본 발명을 보다 상세히 설명한다.Hereinafter, the present invention will be described in more detail.
본 발명의 일 실시예에 의하면 본 발명은 질화붕소 분체, 및 상기 질화붕소 분체에 담지된 실란 커플링제를 포함하는 담지체; 에폭시 수지; 및 광개시제;를 포함하고, 상기 질화붕소 분체는 상기 질화붕소 분체의 표면에 형성되는 2가 금속착체층을 포함하는 엘이디(LED) 조명등기구용 방열 도료 조성물을 제공한다.According to one embodiment of the present invention, there is provided a method for producing a boron nitride powder, comprising: a carrier comprising a boron nitride powder and a silane coupling agent supported on the boron nitride powder; Epoxy resin; And a photoinitiator, wherein the boron nitride powder includes a divalent metal complex layer formed on the surface of the boron nitride powder.
상기 질화붕소 분체는 판상의 구조를 지닌 크기가 1~20㎛의 평균 입경을 갖는 것이 바람직하다. The boron nitride powder preferably has an average particle size of 1 to 20 mu m having a plate-like structure.
본 발명에서 사용한 무기 판상분체인 질화붕소(Boron Nitride)는 백색의 흑연이라고 불리는 신소재로 화학식은 BN이며, 흑연과 비슷한 육방정계 구조를 갖고 있어 화학적, 물리적 성질이 흑연과 비슷하다. 그러나 질화붕소 분체는 백색으로 전기적으로 뛰어난 절연체이지만 흑연은 전기적으로 도체이다. 또한, 질화붕소 분체는 열전도성, 내열성, 전기 전도성 윤활/이형성이 뛰어난 재료로서, 화장품, 코팅재, 윤활유, 도포재, 절연 방열재 필러 등에 사용된다. Boron nitride, which is the inorganic plate powder used in the present invention, is a new material called white graphite. Its chemical formula is BN. It has similar hexagonal structure to graphite, so its chemical and physical properties are similar to graphite. However, boron nitride powders are white and electrical insulators, while graphite is an electrically conductive material. Further, the boron nitride powder is excellent in heat conductivity, heat resistance, and electric conductivity lubrication / releasability, and is used for cosmetics, coating materials, lubricants, coating materials, insulating heat insulating material fillers and the like.
상기 질화붕소 분체는 바람직하게는 판상의 구조를 지닌 크기가 1 내지 20㎛, 바람직하게는 5 내지 20㎛의 평균입경을 갖는 것이다. 상기 질화붕소 분체의 평균입경이 5㎛ 미만이 되거나, 20㎛를 초과하는 것과 같이 상기한 범위를 벗어나는 경우, 전체 도료 조성물에서 적절한 분산이 이루어지지 않아서 방열 효과가 저하되거나 코팅층 두께가 불균일하게 형성될 수도 있다.The boron nitride powder preferably has an average grain size of 1 to 20 mu m, preferably 5 to 20 mu m, having a plate-like structure. When the average particle size of the boron nitride powder is less than 5 占 퐉 or exceeds 20 占 퐉, it is not properly dispersed in the entire coating composition and the heat radiation effect is lowered or the thickness of the coating layer is not uniform It is possible.
본 발명의 일 실시예에 의하면, 상기 질소붕소 분체는 2가 금속의 킬레이트제에 의해 표면개질될 수 있다. 상기 2가 금속은 마그네슘, 칼슘 또는 바륨이 사용될 수 있으며, 상기 2가 금속은 금속 그대로 사용되거나 또는 마그네슘, 칼슘 및 바륨으로 이루어진 어느 한 금속의 무수염화물, 황산염 또는 아세테이트를 사용할 수도 있다. According to an embodiment of the present invention, the nitrogen boron powder may be surface-modified by a chelating agent of a divalent metal. The bivalent metal may be magnesium, calcium, or barium. The bivalent metal may be used as the metal or an anhydrous chloride, sulfate, or acetate of any one metal of magnesium, calcium, and barium.
본 발명의 일 실시예에 의하면, 상기 실란 커플링제는 상기 실란 커플링제는, γ-(2-아미노에틸)아미노프로필트리메톡시실란, γ-아미노프로필트리에톡시실란, N-β(아미노에틸)γ-아미노프로필트리메톡시실란, N-β(아미노에틸)γ-아미노프로필메틸디메톡시실란, γ-글리시독시프로필트리메톡시실란, γ-글리시독시프로필메틸디메톡시실란, γ-메르캅토프로필트리메톡시실란, 비닐트리에톡시실란, 비닐트리메톡시실란, 비닐트리스(메톡시에톡시)실란, γ-(메타)아크릴로일옥시프로필트리메톡시실란, γ-(메타)아크릴로일옥시프로필트리에톡시실란, 및 γ-(메타)아크릴로일옥시프로필디메톡시메틸실란으로 이루어진 군으로부터 선택된 1 종 이상이 사용될 수 있다.According to an embodiment of the present invention, the silane coupling agent may be at least one selected from the group consisting of γ- (2-aminoethyl) aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N- ), γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ- Vinyltriethoxysilane, vinyltris (methoxyethoxy) silane,? - (meth) acryloyloxypropyltrimethoxysilane,? - (meth) acryloxypropyltrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, Acryloyloxypropyltrimethoxysilane, acryloyloxypropyltriethoxysilane, and? - (meth) acryloyloxypropyldimethoxymethylsilane can be used.
본 발명은 상기 질소붕소 분체에 상기 실란커플링제를 포함하는 조성물을 담지시킨 담지체를 포함하는 것을 특징으로 하고 있다.The present invention is characterized in that it comprises a carrier in which a composition containing the silane coupling agent is carried on the nitrogen boron powder.
피담지체에 실란 커플링제 조성물을 담지시키는 방법으로서는, 공지인 방법을 이용할 수 있다. 예를 들면, 기층 흡착, 액층 흡착 등의 방법을 이용할 수 있다. 한편, 액층 흡착의 예로서 실란커플링제를 용매에 용해하여 얻은 용액에 피담지체를 침지함으로써, 피담지체에 실란커플링제를 흡착시키는 방법을 들 수 있다.As a method for supporting the silane coupling agent composition on the concealed body, a known method can be used. For example, a method such as base layer adsorption and liquid layer adsorption can be used. On the other hand, as an example of liquid-phase adsorption, there can be mentioned a method in which a silane coupling agent is adsorbed on a concealed body by immersing the concealed body in a solution obtained by dissolving a silane coupling agent in a solvent.
도료는, 유기 용매를 함유하는 용제계의 것이어도, 수중(水中)에 수지가 용해 또는 분산한 수계의 것이어도 된다.The coating material may be a solvent-based material containing an organic solvent, or a water-based material in which a resin is dissolved or dispersed in water (water).
상기 유기 용매의 예로는 알코올류, 에테르류, 아세탈류, 케톤류, 에스테르류, 알코올 에스테르류, 케톤, 알코올류, 에테르 알코올류, 케톤 에테르류, 케톤 에스테르류, 에스테르에테르류, 방향족계 용제 등이 사용될 수 있다.Examples of the organic solvent include alcohols, ethers, acetals, ketones, esters, alcohol esters, ketones, alcohols, ether alcohols, ketone ethers, ketone esters, ester ethers, Can be used.
본 발명의 일 실시예에 의하면, 상기 에폭시 수지는 상기 에폭시계 수지는 비스페놀 A형 에폭시 수지, 비스페놀 F형 에폭시 수지, 비스 페놀 S형 에폭시 수지, 페놀 노볼락형 에폭시 수지, 크레졸 노블락형 에폭시 수지, 알킬페놀 노볼락형 에폭시 수지, 비스페놀형 에폭시 수지, 나프탈렌형 에폭시 수지, 디사이클로펜타디엔형 에폭시 수지, 트리글리시딜 이소시아네이트 에폭시 수지 및 비환식 에폭시 수지로 이루어진 군으로부터 선택된 하나 이상이 사용될 수 있다. According to an embodiment of the present invention, in the epoxy resin, the epoxy resin is at least one selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, cresol novolak epoxy resin, At least one selected from the group consisting of an alkylphenol novolak type epoxy resin, a bisphenol type epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene type epoxy resin, a triglycidyl isocyanate epoxy resin and an acyclic epoxy resin can be used.
본 발명의 일 실시예에 의하면, 상기 광개시제는 비스(2,4,6-트리메틸벤조일)페닐포스핀옥사이드, 2,4,6(트리메틸벤조일)디페닐포스핀옥사이드, 1-히드록시-시클로헥실페닐케톤 중의 1종 또는 임의의 2종 이상의 조합이 사용될 수 있다. According to one embodiment of the present invention, the photoinitiator is selected from the group consisting of bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, 2,4,6 (trimethylbenzoyl) diphenylphosphine oxide, 1 -hydroxy-cyclohexyl One or any combination of two or more of the phenyl ketones may be used.
본 발명의 일 실시예에 의하면 상기 방열 도료 조성물은 전도성 물질을 더 포함할 수 있으며, 상기 전도성 물질은 그래핀, 탄소나노튜브, 금, 은, 인듐 틴옥사이드, 안티모니틴옥사이드 및 희토류 금속으로 이루어진 군으로부터 선택된 하나 이상일 수 있다.According to an embodiment of the present invention, the heat dissipation coating composition may further include a conductive material, and the conductive material may include at least one of graphene, carbon nanotube, gold, silver, indium tin oxide, antimony tin oxide, Lt; / RTI >
상기 그래핀은 다층 구조를 갖는 것으로서, 상기 다층 구조의 그래핀 사이에 금속 입자가 분포된 것이 바람직하게 사용될 수 있다. 상기 금속 입자는 Pt, Au, Ag, Cu, 및 Ni 중 어느 하나를 포함할 수 있다. The graphene has a multi-layer structure, and it is preferable that metal particles are distributed between the graphenes of the multi-layer structure. The metal particles may include any one of Pt, Au, Ag, Cu, and Ni.
본 발명에 따르면, 상기 에폭시 수지 100 중량부에 대하여 상기 담지체 5~25 중량부, 상기 광개시제 1~10 중량부를 포함하는 것이 바람직하다. 상기 에폭시 수지에 대한 상기 담지체의 함량이 상기 범위를 벗어나면, 도료 조성물을 코팅시 두께가 불균일하게 형성될 수도 있고, 바람직한 최적 도포층을 구성하기 위해서는 상기 범위로 구성되는 것이 바람직하다. 또한 상기 광개시제는 상기 범위로 포함되도록 구성되는 것이 바람직하다. 상기 범위를 벗어나는 경우 코팅층의 경화가 지연되거나, 너무 빨리 경화되어 균일한 층 구성이 어려울 수 있다.According to the present invention, it is preferable that 5 to 25 parts by weight of the carrier and 1 to 10 parts by weight of the photoinitiator are contained relative to 100 parts by weight of the epoxy resin. When the content of the carrier to the epoxy resin is out of the above range, the coating composition may be formed to have a non-uniform thickness when coating the coating composition. It is also preferable that the photoinitiator is included in the above range. Outside of the above range, the curing of the coating layer may be delayed or may be hardened too quickly, thus making it difficult to form a uniform layer.
본 발명의 수지 조성물에는, 필요에 따라서 여러 가지의 첨가물을 첨가할 수 있다. 첨가물로서는, 천연 왁스류, 합성 왁스류, 장쇄 지방족산의 금속염류 등의 가소제；산아미드류, 에스테르류, 파라핀류 등의 이형제；니트릴 고무, 부타디엔 고무 등의 응력 완화제；삼산화 안티몬, 오산화안티몬, 산화주석, 수산화주석, 산화 몰리브덴, 붕산 아연, 메타붕산바륨, 적린, 수산화 알루미늄, 수산화마그네슘, 알루민산칼슘 등의 무기 난연제；테트라브로모 비스페놀 A, 테트라브로모 무수프탈산, 헥사브로모벤젠, 롬화 페놀 노볼락 등의 브롬계 난연제；인계 난연제；염료나 안료 등의 착색제；산화 안정제, 광안정제, 내습성 향상제, 틱소트로피 부여제, 희석제, 소포제, 다른 각종의 수지, 점착 부여제, 대전방지제, 윤활제, 자외선 흡수제 등을 들 수 있다. Various additives may be added to the resin composition of the present invention as necessary. Examples of the additives include plasticizers such as natural waxes, synthetic waxes and metal salts of long chain aliphatic acids, releasing agents such as acid amides, esters and paraffins, stress relieving agents such as nitrile rubber and butadiene rubber, antimony trioxide, antimony pentoxide, An inorganic flame retardant such as tin oxide, tin oxide, tin hydroxide, molybdenum oxide, zinc borate, barium metaborate, red phosphorus, aluminum hydroxide, magnesium hydroxide, calcium aluminate and the like; tetrabromobisphenol A, tetrabromophthalic anhydride, hexabromobenzene, Antioxidants, antioxidants, antioxidants, antioxidants, antioxidants, antioxidants, antioxidants, antioxidants, antioxidants, antioxidants, antioxidants, antioxidants, antioxidants, Lubricants, ultraviolet absorbers, and the like.
이하, 첨부된 도면을 참조하여 본 발명을 상세히 설명한다. 첨부된 도 1 내지 도 7는 본 발명의 예시적인 실시형태를 보인 것으로서, 본 발명에 따른 엘이디(LED) 조명등기구는 방열층을 포함한다. 본 발명에 따른 엘이디(LED) 조명등기구는, 적어도 1층 이상의 방열층이 형성된 것이면 특별히 제한되지 않는다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 to Fig. 7 show an exemplary embodiment of the present invention, wherein an LED light fixture according to the present invention includes a heat dissipation layer. The LED light fixture according to the present invention is not particularly limited as long as at least one heat dissipation layer is formed.
도 1 내지 도 7를 참조하면, 본 발명에 따른 엘이디(LED) 조명등기구는 당해 기술분야에서 통상적으로 사용되는 LED 조명기구 또는 부품 어느 것에나 적용가능하므로, 구체적인 설명은 생략한다.Referring to FIGS. 1 to 7, an LED illumination lamp according to the present invention is applicable to any LED lighting fixture or component commonly used in the related art, and thus a detailed description thereof will be omitted.
발생된 열은 어레이 기판을 통하여 본체로 열전달되고, 이후 방열층을 통하여 방출된다.The generated heat is transferred to the body through the array substrate and then discharged through the heat dissipation layer.
본 발명에 따른 엘이디(LED) 조명등기구는, 예를 들어 투광 조명등, 가로등, 보안등, 터널등, 다운라이트 및 면조명 등으로부터 선택될 수 있다.The LED light fixture according to the present invention can be selected from, for example, a flood light, a street light, a security light, a tunnel light, a down light, and a surface light.
상기 방열층은 위와 같은 엘이디 조명등기구의 외부 표면, 즉 본체의 외측면에 형성된다. 또한, 상기 방열층은 적어도 1층 이상의 프라이머층(primer layer)과, 적어도 1층 이상의 방열 코팅층(heat-radiant coating layer)을 포함한다. 이때, 상기 프라이머층은 엘이디(LED) 조명등기구를 구성하는 구성 부재에 코팅을 통해 형성된다. 상기 프라이머층은, 예를 들어 본체의 외부 표면에 코팅, 형성될 수 있다.The heat dissipation layer is formed on the outer surface of the LED illumination device, that is, the outer surface of the main body. The heat dissipation layer includes at least one primer layer and at least one heat-radiant coating layer. At this time, the primer layer is formed through a coating on a component constituting an LED illumination lamp apparatus. The primer layer may be formed, for example, on the outer surface of the body.
또한, 상기 방열 코팅층은 프라이머층 상에 코팅을 통해 형성된다.Also, the heat-radiating coating layer is formed on the primer layer through coating.
이하, 본 발명을 실시예에 의거하여 더 상세히 설명한다. 또, 본 발명의 범위는 이하의 실시예로 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail based on examples. The scope of the present invention is not limited to the following examples.
실시예Example 1 One
2가 금속 킬레이트로 표면 Surface with a divalent metal chelate 개질된Reformed 분체의Powdery 제조 Produce
염화마그네슘(magnesium chloride; MgCl2; 식량: 95.22, 미합중국 소재 시그마(Sigma)사의 제품)의 무수화물을 증류수에 투입하였으며, 각각 0.1M, 0.25M, 0.5M, 0.75M 및 1M의 용액을 제조하였다. 상기 각각의 용액에 입도 질화붕소(화학식: BN, 판상, 입경：5㎛) 분체 10g을 투입하여 5시간 동안 상온에서 교반시켰다. 그 다음, 증류수로 여과한 후에 상온에서 완전히 건조시켰다. 그 결과, 마그네슘-킬레이트된 질화붕소 분체를 얻었다.A solution of 0.1 M, 0.25 M, 0.5 M, 0.75 M and 1 M solutions of distilled water was prepared from magnesium chloride (MgCl 2 ; Food: 95.22, product of Sigma, USA) . 10 g of granular boron nitride (chemical formula: BN, plate-like, particle size: 5 탆) powder was added to each of the above solutions and stirred at room temperature for 5 hours. Then, it was filtered with distilled water and completely dried at room temperature. As a result, a magnesium-chelated boron nitride powder was obtained.
담지체의Carrier 제조 Produce
100㎖의 가지모양 플라스크(eggplant-shaped flask)에 상기 마그네슘-킬레이트된 질화붕소 분체 10.0g을 칭량하고, 여기에 γ-(2-아미노에틸)아미노프로필트리메톡시실란을 50.0㎎ 및 톨루엔 50㎖를 더하여 초음파 처리를 30분 행하였다. 그 후, 50℃의 진공 가열처리에 의해 용매를 증발시켰다. 100℃의 진공 가열처리를 2시간 더 행하고, 질화붕소 표면에 γ-(2-아미노에틸)아미노프로필트리메톡시실란를 고정화시킴으로써 담지체를 얻었다.10.0 g of the magnesium-chelated boron nitride powder was weighed into a 100-mL eggplant-shaped flask, and 50.0 mg of? - (2-aminoethyl) aminopropyltrimethoxysilane and 50 mL of toluene And ultrasonic treatment was performed for 30 minutes. Thereafter, the solvent was evaporated by a vacuum heat treatment at 50 캜. A vacuum heating treatment at 100 캜 was further performed for 2 hours to immobilize? - (2-aminoethyl) aminopropyltrimethoxysilane on the surface of boron nitride to obtain a carrier.
도료 조성물의 제조Preparation of Coating Composition
상기 담지체(0.1g)에, 비페닐 아랄킬형 에폭시수지(biphenyl aralkyl type epoxy resin)(상품명 「NC-3000H」, 닛뽄카야쿠(日本化藥)사 제) 15g를 메틸에틸케톤 10.5g에 용해한 용액, 및 광개시제(시코쿠카세이고교사 제) 0.1g을 더하고, 3개 롤 밀을 사용하여 분산시킴으로써, 도료 조성물을 얻었다.15 g of a biphenyl aralkyl type epoxy resin (trade name: NC-3000H, manufactured by Nippon Kayaku Co., Ltd.) was dissolved in 10.5 g of methyl ethyl ketone, And 0.1 g of a photoinitiator (manufactured by Shikoku Chemicals) were added and dispersed using a three roll mill to obtain a coating composition.
실시예Example 2 2
상기 질화붕소 분체의 평균 입경이 25㎛ 인 것을 사용한 것을 제외하고는 실시예 1과 동일한 방법으로 도료 조성물을 얻었다.A coating composition was obtained in the same manner as in Example 1, except that the boron nitride powder had an average particle diameter of 25 占 퐉.
실시예Example 3 3
실시예 1의 도료 조성물에 대하여, 전도성 물질로서 전도성 나노카본블랙(케첸블랙 300J)를 전체 도료 조성물의 5중량%로 혼합하고 고속 교반기로 4000RPM의 속도로 20분간 교반하여 도료 조성물을 얻었다.Conductive nano-carbon black (Ketjen Black 300J) as a conductive material was mixed with 5% by weight of the entire coating composition and stirred with a high speed stirrer at a speed of 4000 RPM for 20 minutes to obtain a coating composition.
실시예Example 4 4
실시예 1의 도료 조성물에 대하여 전도성 물질로서 다층 구조의 그래핀(구리 금속 입자 0.5 중량% 포함)을 5중량%로 혼합하고, 고속 교반기로 4000RPM 속도로 20분간 교반하여 도료 조성물을 얻었다.The coating composition of Example 1 was mixed with 5 wt% of graphene having a multilayer structure (containing 0.5 wt% of copper metal particles) as a conductive material and stirred at a speed of 4000 RPM for 20 minutes using a high speed stirrer to obtain a coating composition.
비교예Comparative Example 1 One
실시예 1에서 질화붕소 분체(화학식: BN, 판상, 입경：5㎛)를 사용한 것을 제외하고는 실시예 1과 동일한 방법으로 도료 조성물을 제조하였다.A coating composition was prepared in the same manner as in Example 1 except that boron nitride powder (chemical formula: BN, plate shape, particle size: 5 탆) was used in Example 1.
비교예Comparative Example 2 2
실시예 1에서 킬레이트된 질화붕소 분체에 실란커플링제를 담지시키지 않고 그대로 사용한 것을 제외하고는 실시예 1과 동일한 방법으로 도료 조성물을 제조하였다. A coating composition was prepared in the same manner as in Example 1, except that the chelated boron nitride powder in Example 1 was used without being supported with a silane coupling agent.
실험예Experimental Example
실시예 1 내지 4 및 비교예 1 내지 2의 도료 조성물을 이용하여, 콤마코팅 방식으로 40㎛ 두께의 알루미늄 박 외면에 20㎛ 두께로 코팅한 후, 150℃ 온도에서 7분간 소성 처리하였다. 내면에 아크릴계 점착제를 20㎛ 두께로 코팅한 후 이형지를 부착하여 방열 코팅 복합 시트를 제조하였다.Using the coating compositions of Examples 1 to 4 and Comparative Examples 1 and 2, aluminum foil having a thickness of 40 탆 was coated on the outer surface with a comma coating method to a thickness of 20 탆, followed by baking at 150 캜 for 7 minutes. An acrylic pressure-sensitive adhesive was coated on the inner surface to a thickness of 20 탆, and then a releasing paper was attached thereto to prepare a heat-radiating coating composite sheet.
상기 방열 코팅 복합 시트를 사용하여 하기 방법으로 기본 물성을 평가하고(표 1), 방열 특성을 평가하였다(표 2)Using the above-mentioned heat-radiating coating composite sheet, basic properties were evaluated by the following methods (Table 1), and heat radiation characteristics were evaluated (Table 2)
1)One) 기본 물성 평가Basic property evaluation
실시예 1~4 및 비교예 1-2에서와 같이 제작된 방열수지 조성물의 기본적인 물성을 평가하여 표 1에 나타내었다The basic physical properties of the heat-radiating resin composition prepared as in Examples 1 to 4 and Comparative Example 1-2 were evaluated and shown in Table 1
1. 도막두께: A456 BASIC(elcometer/영국) 측정 1. Film thickness : A456 BASIC (elcometer / UK) measurement
2. 도막외관 : 육안으로 측정시 크리에이터링,균열,색얼룩 등이 없어야 함. 2. Appearance of coating film : It should be free of creator ring, crack, color unevenness when measured with naked eyes.
3. 초기 부착성 : 시편에 코팅후 1mm간격으로 바둑판 형태의 눈금을 100개 만든 다음 스카치테이프로 도막을 박리시 테이프에 박리되어 나오는 도막의 개수로 초기 부착성을 평가하였다. 3. Initial Adhesion : 100 scales in the form of a checkerboard were formed at intervals of 1 mm after coating on the specimens, and the initial adhesion was evaluated by the number of coating films peeled off from the tape when the coating was peeled off with a scotch tape.
4. 내열성: 시편을 200℃ 챔버 안에서 1시간 동안 방치 후 4번의 방법으로 부착성 및 외관의 이상 유무를 평가하였다. 4. Heat resistance: The specimens were allowed to stand in a chamber at 200 ° C for 1 hour and evaluated for adhesion and appearance abnormality by four methods.
2)2) 발열특성 평가Evaluation of heat generation characteristics
12W의 LED 바를 실시예 1 내지 4 및 비교예 1 내지 2의 방열 시트 위에서 가동 후, OTR 센서를 이용하여 방열 시트와 LED 바의 온도변화를 측정하였다. 온도 측정은 처음 시작 시간의 온도와 2시간 후 온도를 30분 간격으로 측정하여 방열성능을 상대 비교 및 평가하였다. 방열성능의 해석은 시작 온도와 2시간 후의 온도의 차이가 적을수록, 또한 LED와 방열 시트의 온도 차가 적을수록 열전도성 및 방열성이 우수한 것으로 평가한다. 상기의 방열 측정은 항온 실에서 평가하며, 항온실 온도는 25℃를 유지한다. 그 평가 결과가 하기 표 1에 개시되어 있다. 온도측정 장비로는 Datapaq(Ver7.3) OTR(Oven Tracking Recorder)를 사용하였다.After the LED bar of 12W was operated on the heat radiation sheets of Examples 1 to 4 and Comparative Examples 1 and 2, temperature changes of the heat radiation sheet and the LED bar were measured using an OTR sensor. The temperature measurement was performed by measuring the temperature of the initial start time and the temperature after 2 hours at intervals of 30 minutes. The analysis of the heat radiation performance is evaluated as the smaller the difference between the starting temperature and the temperature after 2 hours, and the smaller the temperature difference between the LED and the heat radiation sheet, the better the thermal conductivity and the heat radiation. The heat radiation measurement is evaluated in a constant temperature chamber, and the temperature of the constant temperature room is maintained at 25 占 폚. The evaluation results are shown in Table 1 below. Datapaq (Ver7.3) OTR (Oven Tracking Recorder) was used as temperature measurement equipment.
(㎛)Film thickness
(탆)
100/100clear
100/100
100/100clear
100/100
100/100clear
100/100
100/100clear
100/100
100/100clear
100/100
100/100clear
100/100
위치temperature Senser
location
℃Initial temperature
℃
℃30 minutes
℃
℃60 minutes
℃
℃90 minutes
℃
℃120 minutes
℃
상기 표 1로부터 알 수 있는 바와 같이 도포 단계에서는 특별한 차이점이 없으나, 표 2로부터 알 수 있는 바와 같이 실시예 1 내지 4에 따라 제조된 방열 시트의 경우 비교예 1 및 2에 비하여 보다 낮은 온도차를 나타내고 있다. 또한 실시예 3 및 4의 경우 실시예 1 및 2에 비하여 보다 낮은 온도차를 나타내고 있으므로, 보다 우수한 방열 효과를 나타내는 것을 알 수 있다. As can be seen from Table 1, there is no particular difference in the application step, but as can be seen from Table 2, the heat radiation sheet produced according to Examples 1 to 4 exhibits a lower temperature difference than Comparative Examples 1 and 2 have. Further, in Examples 3 and 4, a lower temperature difference is exhibited as compared with Examples 1 and 2, and thus a superior heat radiation effect is obtained.
Claims (8)
에폭시 수지; 및
광개시제;를 포함하고,
상기 질화붕소 분체는 상기 질화붕소 분체의 표면에 형성되는 2가 금속착체층을 포함하는 엘이디(LED) 조명등기구용 방열 도료 조성물. A boron nitride powder, and a silane coupling agent supported on the boron nitride powder;
Epoxy resin; And
A photoinitiator,
Wherein the boron nitride powder includes a divalent metal complex layer formed on the surface of the boron nitride powder.
상기 질화붕소 분체는 판상의 구조를 지닌 크기가 1~20㎛의 평균 입경을 갖는 것을 특징으로 하는 엘이디(LED) 조명등기구용 방열 도료 조성물.The method according to claim 1,
Wherein the boron nitride powder has an average particle size of 1 to 20 mu m having a plate-like structure.
상기 실란 커플링제는, γ-(2-아미노에틸)아미노프로필트리메톡시실란, γ-아미노프로필트리에톡시실란, N-β(아미노에틸)γ-아미노프로필트리메톡시실란, N-β(아미노에틸)γ-아미노프로필메틸디메톡시실란, γ-글리시독시프로필트리메톡시실란, γ-글리시독시프로필메틸디메톡시실란, γ-메르캅토프로필트리메톡시실란, 비닐트리에톡시실란, 비닐트리메톡시실란, 비닐트리스(메톡시에톡시)실란, γ-(메타)아크릴로일옥시프로필트리메톡시실란, γ-(메타)아크릴로일옥시프로필트리에톡시실란, 및 γ-(메타)아크릴로일옥시프로필디메톡시메틸실란으로 이루어진 군으로부터 선택된 1 종 이상인 것을 특징으로 하는 엘이디(LED) 조명등기구용 방열 도료 조성물.The method according to claim 1,
The silane coupling agent may be at least one selected from the group consisting of γ- (2-aminoethyl) aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N- Aminoethyl)? -Aminopropylmethyldimethoxysilane,? -Glycidoxypropyltrimethoxysilane,? -Glycidoxypropylmethyldimethoxysilane,? -Mercaptopropyltrimethoxysilane, vinyltriethoxysilane, (Meth) acryloyloxypropyltrimethoxysilane, vinyltrimethoxysilane, vinyltris (methoxyethoxy) silane,? - (meth) acryloyloxypropyltrimethoxysilane,? - (Meth) acryloyloxypropyldimethoxymethylsilane. The heat-radiating coating composition for an LED illumination lamp apparatus according to claim 1,
상기 에폭시 수지는 비스페놀 A형 에폭시 수지, 비스페놀 F형 에폭시 수지, 비스 페놀 S형 에폭시 수지, 페놀 노볼락형 에폭시 수지, 크레졸 노블락형 에폭시 수지, 알킬페놀 노볼락형 에폭시 수지, 비스페놀형 에폭시 수지, 나프탈렌형 에폭시 수지, 디사이클로펜타디엔형 에폭시 수지, 트리글리시딜 이소시아네이트 에폭시 수지 및 비환식 에폭시 수지로 이루어진 군으로부터 선택된 하나 이상인 것을 특징으로 하는 엘이디(LED) 조명등기구용 방열 도료 조성물.The method according to claim 1,
Examples of the epoxy resin include bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, cresol novolak epoxy resin, alkylphenol novolak epoxy resin, bisphenol epoxy resin, naphthalene Wherein the epoxy resin is at least one selected from the group consisting of epoxy resins, dicyclopentadiene type epoxy resins, triglycidyl isocyanate epoxy resins and acyclic epoxy resins.
상기 광개시제는 비스(2,4,6-트리메틸벤조일)페닐포스핀옥사이드, 2,4,6(트리메틸벤조일)디페닐포스핀옥사이드, 1-히드록시-시클로헥실페닐케톤 중의 1종 또는 임의의 2종 이상의 조합인 것을 특징으로 하는 엘이디(LED) 조명등기구용 방열 도료 조성물.The method according to claim 1,
The photoinitiator may be at least one of bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, 2,4,6 (trimethylbenzoyl) diphenylphosphine oxide, 1-hydroxy-cyclohexylphenylketone, Wherein the composition is a combination of two or more kinds of thermosetting resins.
상기 방열 도료 조성물은 전도성 물질을 더 포함하며, 상기 전도성 물질은 그래핀, 탄소나노튜브, 금, 은, 인듐틴옥사이드, 안티모니틴옥사이드 및 희토류금속으로 이루어진 그룹으로부터 선택된 하나 이상인 것을 특징으로 하는 엘이디(LED) 조명등기구용 방열 도료 조성물.The method according to claim 1,
Wherein the heat dissipation coating composition further comprises a conductive material and the conductive material is at least one selected from the group consisting of graphene, carbon nanotube, gold, silver, indium tin oxide, antimony tin oxide and rare earth metals. (LED) for lighting fixtures.
상기 에폭시 수지 100 중량부에 대하여 상기 담지체 5~25 중량부, 상기 광개시제 1~10 중량부를 포함하는 것을 특징으로 하는 엘이디(LED) 조명등기구용 방열 도료 조성물.The method according to claim 1,
And 5 to 25 parts by weight of the support and 1 to 10 parts by weight of the photoinitiator relative to 100 parts by weight of the epoxy resin.
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| KR102015274B1 (en) | 2019-04-04 | 2019-10-21 | 주식회사 디엠엘이디 | Powder coating composition with air cleaning function and antimicrobial function, Powder coating containing the same, and LED lighting device |
| KR102123231B1 (en) * | 2019-12-17 | 2020-06-16 | 국방기술품질원 | Silanized silane boron nitride composite and method of preparing same |
| KR20200073010A (en) | 2018-12-13 | 2020-06-23 | 문규식 | LED Module for Lighting with Heat Dissipating PCB and LED Lighting Apparatus with It |
| KR102280280B1 (en) * | 2021-02-24 | 2021-07-21 | 레이져라이팅(주) | Painting Composition having heat dissipation and LED Lamp Device by employing the same |
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