KR101793952B1 - Solar wafer carrier - Google Patents

Solar wafer carrier Download PDF

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Publication number
KR101793952B1
KR101793952B1 KR1020160027447A KR20160027447A KR101793952B1 KR 101793952 B1 KR101793952 B1 KR 101793952B1 KR 1020160027447 A KR1020160027447 A KR 1020160027447A KR 20160027447 A KR20160027447 A KR 20160027447A KR 101793952 B1 KR101793952 B1 KR 101793952B1
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KR
South Korea
Prior art keywords
plate
engaging
coupling
groove
bar
Prior art date
Application number
KR1020160027447A
Other languages
Korean (ko)
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KR20170104729A (en
Inventor
장건우
Original Assignee
위아코퍼레이션 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to KR1020160027447A priority Critical patent/KR101793952B1/en
Publication of KR20170104729A publication Critical patent/KR20170104729A/en
Application granted granted Critical
Publication of KR101793952B1 publication Critical patent/KR101793952B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
    • H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si

Abstract

A solar wafer carrier is disclosed. A solar wafer carrier according to an aspect of the present invention includes a pair of opposing plates and a bar positioned between the plates and coupled with the plate, And the engaging projection has a center projection having a polygonal shape and an indicating projection protruding from all sides of the center projection. The plate has a shape corresponding to the engaging projection, Groove.

Description

Solar wafer carrier {SOLAR WAFER CARRIER}

The present invention relates to a solar wafer carrier capable of inserting and storing a plurality of solar wafers.

Photovoltaic wafers used in solar power generation are made by growing or casting polysilicon into a single-crystal cylindrical cylinder or polycrystalline block, and then cutting it into thin slices. Photovoltaic wafers are equipped with solar cell circuits.

Photovoltaic wafers are inserted and transported and stored on wafer carriers by collecting sheets as they move between each piece after cutting.

The carrier of the photovoltaic wafer is composed of two mutually opposing plates and a plurality of bars which interconnect the plates and into which the wafer is inserted. A plurality of projections are formed on the bar, and a solar wafer is inserted or guided into the projections, thereby positioning the solar wafer. However, the carrier of the conventional solar photovoltaic wafer causes a problem that the bar is shaken or spaced even after the bar is coupled to the plate.

Korean Patent Publication No. 1061153

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a solar wafer carrier capable of preventing a swinging and a gap of a bar coupled to a plate.

Other objects of the present invention will become more apparent through the embodiments described below.

A solar wafer carrier according to an aspect of the present invention includes a pair of opposing plates and a bar positioned between the plates and coupled with the plate, And the engaging projection has a center projection having a polygonal shape and an indicating projection protruding from all sides of the center projection. The plate has a shape corresponding to the engaging projection, Groove.

The solar wafer carrier according to the present invention may have one or more of the following embodiments. For example, the center projection may have a rectangular shape.

The coupling portion has a coupling head, and the plate may have a head insertion groove into which the coupling head is inserted. And a direction indicating groove may be formed on one side of the head insertion groove.

The bars may be side-by-side, and the side bars may have a plurality of guide projections arranged in the direction of the direction indicating grooves.

The coupling portion has a coupling groove into which a screw is inserted, and the screw can be screwed to the plate and the plate.

The present invention can provide a photovoltaic wafer carrier capable of preventing shaking and clearance of a bar coupled to a plate.

1 is a diagram illustrating a photovoltaic wafer carrier according to one embodiment of the present invention.
2 is a top view of the photovoltaic wafer carrier illustrated in FIG.
3 is a front view of the photovoltaic wafer carrier illustrated in FIG.
4 is a plan view illustrating a sidebar of a solar wafer carrier according to an embodiment of the invention.
5 is a front view of the side bar illustrated in Fig.
FIG. 6 is a perspective view of the coupling portion of the side bar illustrated in FIG. 4; FIG.
Fig. 7 is a front view of the coupling portion of the side bar illustrated in Fig. 6;
8 is a top plan view illustrating a bottom bar of a solar wafer carrier according to an embodiment of the present invention.
9 is a front view of the lower bar illustrated in Fig.
10 is a front view of the engaging portion of the lower bar illustrated in Fig.
11 is a diagram illustrating a first plate of a solar wafer carrier according to an embodiment of the present invention.
12 is a diagram illustrating a second plate of a solar wafer carrier according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and will be described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

The terms first, second and top, bottom, and side, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout the specification and claims. The description will be omitted.

1 is a diagram illustrating a solar wafer carrier 100 according to one embodiment of the present invention. And FIGS. 2 and 3 are a plan view and a front view of the solar wafer carrier 100 illustrated in FIG.

Referring to FIGS. 1 to 3, the solar wafer carrier 100 according to the present embodiment includes a first plate 110 and a second plate 120 corresponding to two mutually opposing plates. The solar wafer carrier 100 according to the present embodiment includes a side bar 130 and a lower bar 150 corresponding to a bar that is coupled between the first plate 110 and the second plate 120 .

The solar wafer carrier 100 according to this embodiment includes two opposing plates 110 and 120 and four side bars 130 and two lower bars 150 ). The plurality of bars 130 and 150 serve to support a wafer (not shown).

It can be seen that the ends of the bars 130 and 150 are inserted into the plates 110 and 120 and then fastened by the screws 170. The bars 130 and 150 and the plates 110 and 120 are screwed so that the bars 130 and 150 are firmly engaged with the plates 110 and 120 to prevent clearance and wobbling.

A total of four side bars 130 are provided for each pair of left and right sides. On both sides of the plates 110 and 120, two side bars 130 are arranged symmetrically with a constant height interval. The lower bars 150 are disposed at the lower ends of the plates 110 and 120 at regular intervals. The side bar 130 and the lower bar 150 all have the same length.

4 and 5 are a top view and a front view, respectively, illustrating a side bar 130 of a solar wafer carrier 100 in accordance with an embodiment of the present invention. 6 is a perspective view illustrating an engaging portion 136 of the side bar 130 illustrated in FIG. 4. FIG. 7 is a front view of the engaging portion 136 of the side bar 130. FIG.

4 to 7, the side bar 130 of the solar wafer carrier 100 includes a bar body 132 and a coupling portion 136 formed at both ends of the body portion 132 . 1, two side bars 130 are disposed on both sides of the plates 110 and 120 to support wafers (not shown).

The body portion 132 is a rod having a cross section such as a circular or elliptical shape and has a certain length. The body part 132 is provided with a plurality of guide protrusions 134 at regular intervals. The guide projections 134 all have the same size and the same spacing. The guide protrusion 134 serves to guide the wafer. 1 and 3, the guide protrusions 134 are arranged to face the interior of the solar wafer carrier 100. As shown in FIG.

The engaging portions 136 are formed at both ends of the body portion 132 and have the same shape. The engaging portion 136 is coupled to the plates 110 and 130 to couple the side bars 130 to the plates 110 and 120. The engaging portion 136 has the engaging head 138, the engaging projection 140, and the engaging groove 146.

The coupling head 138 is a portion having a larger diameter than the body portion 132 and projects further outward than the body portion 132. The joining head 138 has an asymmetrical elliptical shape so that when joining the side bar 130 to the plates 110 and 130, its joining direction can be easily confirmed. 1 to 3, the coupling head 138 is not inserted into the plates 110 and 130 but is inserted into the head insertion groove 114 when the head insertion groove 114 is a groove having a predetermined depth .

A coupling protrusion 140 is formed on the upper surface of the coupling head 138. The coupling protrusions 140 are inserted into the first side insertion slots 112 and the second side insertion slots 122 formed in the plates 110 and 130 to prevent the side bars 130 from swinging, do. The engaging projection 140 has a center projection 142 and an indicating projection 144.

The center protrusion 142 is a protrusion protruding at a constant height from the upper surface of the coupling head 138, and has a smaller cross sectional area than the coupling head 138. The center protuberance 142 has a rectangular shape and four side surfaces, and each side surface is provided with an indicating protrusion 144 vertically. The center protrusion 142 and the indicating protrusion 144 may have the same height.

Although the side bar 130 according to the present embodiment has been described as having the square protrusion 142, the present invention is not limited by the sectional shape of the center protrusion. Therefore, the side bar according to another embodiment of the present invention may include a center protrusion 142 having a polygonal cross-sectional shape such as a triangular or pentagonal shape.

Since the center projection 142 has a polygonal shape other than a circular shape, it can be inserted into the first side insertion groove 112 and the second side insertion groove 122 to prevent its rotation. It is also possible to more reliably prevent rotation and clearance of the side groove 130 by forming the indicating protrusion 144 having a width smaller than that of the center protrusion 142 on all the side surfaces of the center protrusion 142. [

The indicating protrusion 144 corresponds to a protrusion having a smaller width than the center protrusion 142. The length of the indicating projection 144 can be made to reach the edge of the joining head 138 at the end thereof, thereby making it possible to more reliably prevent the clearance and wobbling of the side bar 130. [ And the indicating protrusions 144 are all illustrated as having the same length.

Of course, the lengths of the indicating protrusions 144 may be different from each other, so that the user can easily grasp the joining direction of the joining portion 136. In addition, the indicator protrusion 144 may not be formed on a part of the circumferential surface of the center protrusion 142.

A coupling groove 146 is formed at the center of the center projection 142. The coupling groove 146 has a predetermined depth from the upper surface of the center projection 142 and is formed in the direction of the body portion 132. A thread (not shown) have. The screw 170 passes through the first plate 110 or the second plate 120 and is inserted into the fastening groove 146 to be screwed. Thus, the side bar 130 is more firmly coupled to the first plate 110 and the second plate 120 by screwing the side bar 130.

8 and 9 are a top view and a front view, respectively, illustrating a bottom bar 150 of a solar wafer carrier 100, in accordance with an embodiment of the present invention. And FIG. 10 is a front view illustrating the engaging portion 156 of the lower bar 150 illustrated in FIG.

8 to 10, the lower bar 150 has the same shape as the side bar 130 but has a stopper 154 instead of the guide protrusion 134 of the side bar 130 do.

The lower bar 150 is symmetrically disposed below the first plate 110 and the second plate 120 as illustrated in FIGS. The lower bar 150 has a bar body 152 having a rod shape and a coupling part 156 formed at both ends of the body part 152, respectively.

The body portion 152 has the same length and cross-sectional shape as the body portion 132 of the side bar 130. However, a stopper 154 is formed on the outer surface of the body portion 152 in place of the guide protrusion 134. Referring to FIG. 8, it can be seen that the stoppers 154 are arranged in a zigzag shape. A wafer (not shown) is inserted between the stoppers 154.

The engaging portion 156 of the lower bar 150 has the engaging head 158 and the engaging protrusion 160. This causes the engaging portion 138 of the engaging portion 136 of the side bar 130 and the engaging protrusion 160 140, the detailed description thereof will be omitted. The coupling protrusion 160 of the lower bar 150 has the center protrusion 162 and the indicating protrusion 164 which are formed by the center protrusion 142 provided on the coupling protrusion 140 of the side bar 130, And therefore the detailed description thereof will be omitted.

A coupling groove 166 is formed in the center of the coupling head 158 of the lower bar 150 in the longitudinal direction of the body portion 152. This is the same as the coupling groove 146 formed in the side bar 130 A detailed description thereof will be omitted.

The lower bar 150 is firmly coupled to the first plate 110 and the second plate 120 by the coupling protrusion 160 and the coupling groove 166 like the side bar 130, Play can be prevented.

11 is a diagram illustrating a first plate 110 of a solar wafer carrier 100 according to one embodiment of the present invention.

Referring to FIGS. 1 and 11, the first plate 110 has a generally rectangular shape and supports the side plate 130 and the lower bar 150 in combination with the second plate 120 . The first plate 110 has a first side insertion groove 112, a first lower insertion groove 118, and a first screw coupling hole 111.

The first side insertion grooves 112 correspond to the two grooves formed on the opposite sides of the first plate 110 in a bilaterally symmetrical manner. Therefore, the first plate 110 has four first side insertion grooves 112 all. The first side insertion groove 112 corresponds to a groove having the same size and shape as the engagement portion 136 of the side bar 130 having the center projection 142 and the indicating projection 144. [ The engaging portion 136 of the side bar 130 is inserted into the first side insertion groove 112 by press fitting to prevent the side bar 130 from being spaced apart.

The first side insertion groove 112 can communicate with the first screw engagement hole 111. The first screw connection hole 111 corresponds to a hole formed at the same position as the first side insertion groove 112 of the first plate 110 and communicating with each other. The screw 170 is inserted into the first screw coupling hole 111 and screwed into the coupling groove 146 of the side bar 130. The first screw tightening hole 111 is formed in communication with all the first side insertion grooves 112.

A head insertion groove 114 and a direction indicating groove 116 may be formed around the first side insertion groove 112. The coupling head 138 of the side bar 130 can be inserted into the head insertion groove 114. [ The head insertion groove 114 corresponds to a groove having the same shape and size as the coupling head 138 having an asymmetric elliptical shape.

The length of the coupling head 138 inserted into the head insertion groove 114 can be made very small. Thus, the engaging head 138 may not be substantially inserted into the head insertion groove 114, and the head insertion groove 114 may indicate only the direction in which the engaging head 138 engages.

A direction indicating groove 116 is formed around the head insertion groove 114. The direction indicating groove 116 corresponds to a groove formed inwardly in the circumference of the head insertion groove 114. This is because when the side bar 130 is engaged with the first plate 110, As shown in Fig.

Two first lower insertion grooves 118 are formed in the lower portion of the first plate 110 at regular intervals. The engaging portion 156 of the lower bar 150 can be inserted into the first lower insertion groove 118 by interference fit. The first lower insertion groove 118 has the same shape as the first side insertion groove 112.

The first lower insertion groove 118 communicates with the first screw coupling hole 111. That is, in the first plate 110, the first screw connection hole 111 is also formed at the position where the first lower insertion slot 118 is formed, and is also communicated with the first lower insertion slot 118. The screw 170 inserted in the first screw coupling hole 111 is screwed into the coupling groove 166 of the lower bar 150 after passing through the first lower insertion groove 118. Thus, the lower bar 150 can be firmly coupled to the first plate 110 by the screw 170.

12 is a view illustrating a second plate 120 of a solar wafer carrier 100 according to an embodiment of the present invention.

1 and 12, the second plate 120 has a generally rectangular shape similar to the first plate 110 and includes a side plate 130 and a lower plate 150 ) To support them. The second plate 120 has a second side insert groove 122, a second lower insert groove 128, and a second screw hole 121.

Since the second side insertion groove 122 has the same shape and structure as the first side insertion groove 112, a detailed description thereof will be omitted. The coupling protrusion 140 of the side bar 130 is inserted into the second side insertion groove 122 by interference fit.

And the second side insertion groove 122 is communicated with the second screw tightening hole 121. The screw 170 inserted into the second screw tightening hole 121 is screwed into the fastening groove 146 of the side bar 130 after passing through the second side insertion groove 122.

Unlike the first side insertion groove 112, the second side insertion groove 122 is not provided with the head insertion groove 114 and the direction indicating groove 116.

Since the second lower insertion groove 128 corresponds to the first lower insertion groove 118, a detailed description thereof will be omitted. And the second lower insertion groove 128 also communicates with the second screw connection hole 121. The screw 170 inserted into the second screw tightening hole 121 passes through the second lower insertion groove 128 and is screwed into the fastening groove 166 of the lower bar 150.

The solar wafer carrier 100 according to the present embodiment may have both ends of the side bar 130 and the lower bar 150 symmetrically coupled to the first plate 110 and the second plate 120. That is, one end and the other end of the side bar 130 and the bottom bar 150 are coupled by the same method by the engaging projections 140, 160 and the screw 170.

When the side bar 130 and the lower bar 150 are coupled to the first plate 110 and the second plate 120 by using the screw 170, the engaging projections 140 and 160 are engaged with the side bars 130, And the rotation of the lower bar 150 can be prevented, so that the screw 170 can be easily fastened. Since the side bar 130 and the lower bar 150 are coupled to the first plate 110 and the second plate 120 by means of the screws 170, a separate joining member is not required, And can be assembled easily.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. It will be understood that the invention may be varied and varied without departing from the scope of the invention.

100: Photovoltaic wafer carrier
110: first plate
120: second plate
130: Sidebar
150:
170: Screw

Claims (6)

A pair of mutually opposing plates;
And a bar positioned between the plates and engaging with the plates, respectively,
Wherein the engaging portion includes a coupling head and a coupling protrusion formed on one surface of the coupling head,
Said coupling head having an asymmetrical elliptical shape,
Wherein the engaging projection includes a center projection having a polygonal shape and an indicating protrusion protruding from all sides of the center protrusion and having a width and an equal height as compared with the center protrusion,
Wherein the plate has a shape corresponding to the engaging projection and the engaging head and has an engaging groove into which the engaging projection and the engaging head are inserted by interference fit. The method according to claim 1,
Wherein the center protrusion has a rectangular shape. delete The method according to claim 1,
And a direction indicating groove is formed on one side of the insertion groove. 5. The method of claim 4,
Wherein the bars are side-by-side, and the side bars include a plurality of guide protrusions arranged in the direction of the direction indicating grooves. The method according to claim 1,
Wherein the coupling portion has a coupling groove into which a screw is inserted, and the screw is screwed to the plate and the plate.
KR1020160027447A 2016-03-08 2016-03-08 Solar wafer carrier KR101793952B1 (en)

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KR1020160027447A KR101793952B1 (en) 2016-03-08 2016-03-08 Solar wafer carrier

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Application Number Priority Date Filing Date Title
KR1020160027447A KR101793952B1 (en) 2016-03-08 2016-03-08 Solar wafer carrier

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KR101793952B1 true KR101793952B1 (en) 2017-11-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102249027B1 (en) 2019-11-01 2021-05-07 위아코퍼레이션 주식회사 Wafer boat plate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109335245A (en) * 2018-10-17 2019-02-15 安徽柏昂新材料有限公司 A kind of automotive trim panel holding structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006520249A (en) 2003-03-13 2006-09-07 ヨン−グ ホ Screw / cement maintenance type prosthesis treatment method, screw / cement maintenance type prosthesis abutment and implant
KR101509173B1 (en) * 2014-04-17 2015-04-09 구인모 Carrier for manufacturing a solar cell

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006520249A (en) 2003-03-13 2006-09-07 ヨン−グ ホ Screw / cement maintenance type prosthesis treatment method, screw / cement maintenance type prosthesis abutment and implant
KR101509173B1 (en) * 2014-04-17 2015-04-09 구인모 Carrier for manufacturing a solar cell

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102249027B1 (en) 2019-11-01 2021-05-07 위아코퍼레이션 주식회사 Wafer boat plate

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