KR101792383B1

KR101792383B1 - Chip electronic component and method for manufacturing the same

Info

Publication number: KR101792383B1
Application number: KR1020160005569A
Authority: KR
Inventors: 신상호
Original assignee: 삼성전기주식회사
Priority date: 2016-01-15
Filing date: 2016-01-15
Publication date: 2017-11-01
Also published as: KR20170085881A

Abstract

The present invention includes a body, an inner coil embedded in the body, and an outer electrode electrically connected to the inner coil and disposed on an outer surface of the body, wherein the upper surface of the body includes at least one outer electrode growth suppressing portion Chip electronic component and a manufacturing method thereof.

Description

TECHNICAL FIELD [0001] The present invention relates to a chip electronic component,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip electronic component and a manufacturing method thereof, and more particularly, to a power inductor component and a manufacturing method thereof.

Generally, a power inductor forms an electrode by copper (Cu) plating on the outer surface of a body for connection between an inner coil and an outer electrode. In this case, the common electrode has a structure in which electrodes are formed on the upper and lower band portions, and the lower surface electrode has no electrode on the upper surface and electrodes on the side surface and lower surface. Such a bottom electrode has an advantage that there is no electrode on the top surface, and electrical short due to a shield or the like can be prevented. However, when the side is connected by plating, the plating has a problem that the plating is grown to an unintended top surface.

The following Patent Document 1 discloses a conductive paste composition for external electrodes of a chip inductor having suitable fluidity and adhesiveness, but does not disclose any efforts to prevent the external electrode plating layer from spreading to an undesired region.

Korean Patent Laid-Open Publication No. 2001-0038165

The present invention provides a chip electronic component having a structure that prevents external electrodes from growing to the top surface of a body, and a method of manufacturing the same.

According to an embodiment of the present invention, there is provided a chip electronic component including a body, an inner coil embedded in the body, and an outer electrode, wherein the upper surface of the body includes at least one outer electrode growth suppressing portion .

According to another aspect of the present invention, there is provided a method of manufacturing a magnetic recording medium, comprising: preparing a plurality of inner coils having at least one lead-out portion; disposing a magnetic sheet on the upper and lower surfaces of the inner coil, Forming a groove on a part of the upper surface of the lamination bar including a point extending from the boundary between the inner coils adjacent to each other; A step of disposing an insulating layer on an upper surface of the lamination bar having a plurality of grooves formed therein and cutting a region of the upper surface of the lamination bar including a part of the grooves, And disposing an external electrode on a partial area of a lower surface of the body and a partial area of a side surface of the body.

The present invention provides a chip electronic component having a structure for preventing external electrodes from growing to the top surface of a body, and a method of manufacturing the same.

The present invention provides a chip electronic component having a structure in which an external electrode is grown up to an upper surface of a body to completely prevent the formation of an external electrode protruding to the upper surface of the body beyond a chip thickness of the chip electronic component, and a manufacturing method thereof do.

The present invention provides a chip electronic component and a method of manufacturing the same, which ensure the reliability of the arrangement of the external electrodes only by a simplified process.

1 is a schematic perspective view of a chip electronic component according to an example of the present invention.
2 is a schematic cross-sectional view taken along line I-I 'of FIG.
Figure 3 is a schematic cross-sectional view according to one variant of Figure 2;
4 is a schematic flowchart of a method of manufacturing a chip electronic component according to another example of the present invention.
5 (a) to 5 (c) are individual process drawings of a method of manufacturing a chip electronic component according to a modification of Fig.

Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements.

It is to be understood that, although the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Will be described using the symbols.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

Hereinafter, a chip electronic component and a manufacturing method thereof according to an example of the present invention will be described, but the present invention is not limited thereto.

Chip electronic components

1 is a schematic perspective view of a chip electronic component according to an example of the present invention.

1, a chip electronic component 100 according to an exemplary embodiment of the present invention includes a body 1, an inner coil 2 embedded in the body, and an external electrode 3 disposed outside the body. .

Referring to FIG. 1, the body 1 fills the inside of the chip electronic component and determines the external shape of the chip electronic component, thereby filling the outside of the internal coil 2.

The body includes a first surface and a second surface facing each other in the direction of the length (L), a third surface and a fourth surface facing each other in the width (W) direction, However, the present invention is not limited thereto. In this case, the direction of the thickness T of the body may be a direction parallel to a direction in which the magnetic core of the inner coil embedded in the body is formed, and the upper surface and the lower surface of the magnetic body, As shown in Fig.

On the other hand, the inner coil 2 embedded in the body may be arranged at the center of the body, but may be arranged to be spaced apart from the center of the body by a certain degree according to design or manufacturing process. The inner coil 2 may have a spiral shape, but is not limited thereto. In addition, the inner coil may have a winding structure or a thin film structure, but the present invention is not limited thereto.

An outer electrode 3 is disposed on the outer surface of the body, and the outer electrode is disposed along a part of the side surface of the body from a part of the lower surface of the body to be electrically connected to the lead portion of the inner coil in the body . The outer electrode may be disposed on the entire area of the side surface of the body, in this case, on the entire area in the width direction of the end area of the lower surface of the body. It is of course possible to increase the area where the external electrode is disposed on the outer surface of the body to increase the connection area with the inner coil to lower the value of the DC resistance Rdc.

The outer electrode 3 may include at least one of copper (Cu) and nickel (Ni), and the present invention is not limited thereto. The outer electrode 3 may include a material that can be electrically connected to the inner coil There is no.

A metal having excellent electrical conductivity may be additionally disposed on the external electrode 3 and may be a metal such as nickel (Ni), copper (Cu), tin (Cu) An alloy thereof, or the like, or may include at least one of Ag-Epoxy and Cu-Epoxy.

Referring again to FIG. 1, the upper surface of the body 1 includes at least one outer electrode growth restraining portion 11a, 11b. According to the present invention, since the body of the chip electronic component includes at least one external electrode growth suppressing portion on the upper surface, the upper surface and the lower surface may have different shapes.

The outer electrode growth suppressing portions 11a and 11b may be a part of the upper surface of the body, but the specific shape thereof is not particularly limited and may be a distance from the outer electrode growth suppressing portion May be set to be smaller than the distance from the center of the upper surface of the body to the lower surface of the body. For example, the external electrode growth suppressing portions 11a and 11b may have a curved concave shape or an angular concave shape, but the present invention is not limited thereto.

The outer electrode growth suppressing portions 11a and 11b are formed on the outer surface of the body so that the outer electrode extends along the side surface from the bottom surface of the body and is prevented from growing to the upper surface of the body beyond the edge between the side surface and the upper surface. can do.

This is for completely eliminating the defect that the external electrode is formed to extend to the upper surface of the body even though the external electrode is disposed only on the side surface and the bottom surface excluding the upper surface of the body. The outer electrode can be extended to the upper surface of the body to completely prevent the chip thickness of the chip electronic component from exceeding the upper surface of the body so as to exceed the distance from the upper surface to the lower surface of the body.

Conventionally, although the outer electrode is disposed only on the side and bottom surface of the body and the outer electrode is not disposed on the upper surface, there is a problem that the plating liquid of the outer electrode is grown up to the upper surface. Further, The plating solution of the external electrode is grown on the insulating layer disposed on the upper surface of the body, thereby adversely affecting the reliability of the chip electronic component. According to the present invention, the problem can be completely solved.

According to an embodiment of the present invention, since the outer electrode growth suppressing portion is disposed on the upper surface of the body, the outer electrode plating solution is grown up to the upper surface of the body, even though the outer electrode is formed on the side surface of the body, The problem of weakening the reliability of the electronic component can be completely eliminated.

2 is a cross-sectional view taken along the line I-I 'of FIG.

Referring to FIG. 2, an upper surface 11 of the body according to an embodiment of the present invention includes outer electrode growth suppressing portions 11a and 11b. The distance from any one of the external electrode growth suppressing portions 11a and 11b to the lower surface of the body is shorter than the distance from the center of the upper surface of the body to the lower surface of the body. Here, the central part of the upper surface of the body has a broad meaning, and may mean a part of the magnetic core of the inner coil 2 buried in the body and extending to meet the upper surface of the body.

According to an embodiment of the present invention, the outer electrode growth suppressing portions 11a and 11b are formed so that the plating liquid of the external electrode applied on the side surface of the body is prevented from extending to the upper surface of the body, that is, Can act as an obstacle.

FIG. 2 shows that the outer electrode growth suppressing portions 11a and 11b have a round shape. However, the shape of the outer electrode growth suppressing portion may be various without limitation. And the surface roughness on the surface of the outer electrode growth suppressing portion is appropriately controlled in accordance with the design change in the manufacturing process so that the adhesion with the insulating layer on the upper surface of the body having the outer electrode growth suppressing portion May be improved.

On the other hand, the surface of the outer electrode growth suppressing portion may coincide with the cut surface of the particle having the magnetic property contained in the body. This is because, after the outer electrode growth suppressing portion forms the body, mechanical or chemical processing May be introduced to provide an external electrode growth suppressing portion at a later time.

Next, FIG. 3 shows a schematic cross-sectional view of a chip electronic component in which an insulating layer 4 is additionally disposed on the upper and lower surface portions of the body in FIG.

The insulating layer 4 may be disposed over the entire area of the bottom surface of the body where the external electrodes 3 are not disposed. In addition, the top surface of the body may include the outer electrode growth suppressing portions 11a and 11b, and may be disposed over the entire upper surface of the body.

The insulating material constituting the insulating layer may be appropriately selected in consideration of the insulating property, the heat resistance, the moisture resistance, and the like. Examples of the material of the polymer include epoxy resin, phenol resin, urethane resin, silicone resin, polyimide resin A thermosetting resin and a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a polyacetal resin and a polypropylene resin can be selected, but the present invention is not limited thereto.

The thickness of the insulating layer 4 may be suitably set in consideration of process conditions, design changes, etc., and is not particularly limited. When the thickness of the insulating layer is uniformly formed, Can be matched with the shape of the upper surface of the body.

The insulating layer 4 is for preventing the plating solution forming the external electrode from penetrating into the inside of the body or degrading the moisture resistance and corrosion resistance from the surrounding environment. The insulating layer 4 is formed on the upper surface and the side surface And the end of the insulating layer may be disposed so as to be in contact with the end of the external electrode 3 extending to the side of the body.

The chip electronic component of the present invention provides a structure that prevents the external electrodes from growing to the top surface of the body.

The chip electronic component of the present invention provides a structure for securing the reliability of the external electrode arrangement by a simplified process.

Method of manufacturing chip electronic components

4 is a flowchart schematically showing a method of manufacturing a chip electronic component according to an example of the present invention.

Referring to FIG. 4, first, a body for laying an inner coil having at least one lead-out portion is prepared. The body may have a hexahedral shape having six faces facing each other in the direction of the thickness (T), the direction of the length (L), and the direction of the width (W) But is not limited thereto.

On the other hand, the body may be filled with a magnetic material on the outer surface of the inner coil, and there is no limitation in concrete methods such as a molding method and a sheet lamination method.

Next, a groove having a predetermined shape is formed on both ends of the upper surface of the body extending in the length L direction. The shape of the groove may be a concave portion having a curved line, a concave portion having an angle, and the like, but the present invention is not limited thereto. In this case, the groove functions as an external electrode growth suppressing unit for preventing the plating liquid of the external electrode extending on the side surface of the body from growing to the upper surface of the body.

Thereafter, an insulating layer for insulating the body may be disposed on the upper surface of the body including the external electrode growth suppressing portion of the body. The method of disposing the insulating layer may be to apply an insulating resin paste, but is not limited thereto.

In addition, the insulating layer may be further disposed on an area of the bottom surface of the body where the external electrodes are not desired to be disposed. In this case, the external electrode may be disposed on a region of the bottom surface of the body other than the region where the insulating layer is disposed.

Next, an external electrode is formed extending from a portion of the lower surface of the body to a portion between the upper surface and the side surface of the body through a portion of the side surface of the body. The method of forming the external electrode is not limited, and may be, for example, plating with a copper (Cu) plating solution, but the present invention is not limited thereto.

Meanwhile, FIG. 5 is a method of manufacturing a chip electronic component according to a modification of FIG. 4, wherein a plurality of chip electronic components according to the present invention can be collectively provided as compared with FIG. The process in the manufacturing method of the chip electronic component in FIG. 5 is substantially the same as that in FIG. 4, so a detailed description thereof will be omitted.

FIG. 5 is a view showing a process which is different from FIG. 4 in particular; FIG. 5A is a process for preparing a lamination bar in which an inner coil is buried, a plurality of grooves on an upper surface of the lamination bar, (B) of forming the laminate bar, and (c) cutting into individual bodies from the laminate bar.

First, referring to FIG. 5 (a), a lamination bar having a plurality of inner coils having at least one lead portion is prepared. The lamination bar may be formed by stacking a plurality of magnetic sheets on the upper and lower surfaces of the inner coil. The magnetic bar may be formed on the upper and lower surfaces of the inner coil after fixing the lead- Of course, be formed by filling. In this case, the outgoing portions of the plurality of inner coils adjacent to each other may be in contact with each other, but may be arranged to be spaced apart from each other in the thickness direction and the longitudinal direction of the lamination bar as shown in FIG. 5 (a) . If the lead portions of the coils are arranged so as to be spaced apart from each other by a predetermined distance, at least two cutting processes should be performed at least to expose the lead portion of the coil to the outside of the body.

Next, referring to FIG. 5 (b), a plurality of grooves are formed on the upper surface of the lamination bar. The grooves may be formed on a part of the upper surface of the lamination bar including a point extending from a boundary between adjacent coils. In this case, when forming an individual body in which at least one inner coil is embedded from the lamination bar, a part of the groove may be included in an upper surface of the body.

The method of forming the plurality of grooves is not limited to a specific method. It may be sufficient to form grooves having a predetermined depth on the upper surface. For example, slit dicing ) Method, but the present invention is not limited thereto.

Next, after the grooves are formed on the upper surface of the lamination bar, an insulating layer may be disposed over the entire upper surface of the lamination bar. The material and the thickness of the insulating layer can be appropriately selected on the basis of process conditions and design changes. When the thickness of the insulating layer is made uniform, the shape of the upper surface of the laminated bar on which the groove is formed, Layer will be substantially the same as the shape of the layer. The method of disposing the insulating layer may be, for example, printing a paste containing a resin having an insulating property or adding an insulating film, but the present invention is not limited thereto.

5 (c), a process of cutting the laminated bar into individual bodies is shown.

The cutting process is performed from the upper surface to the lower surface of the lamination bar. It is preferable that the upper surface of the lamination bar is cut to the lower surface by setting the area including a part of the grooves as the cutting surface. In this case, when the lead portions of the inner coils are disposed apart from each other as shown in FIG. 5 (a), the lead portions of the inner coils must be exposed to the outer surface of the body, At least two cutting planes will be set within the area.

Thereafter, an insulating layer may be additionally disposed on the lower surface of the individual body, and external electrodes may be disposed along the side surface from the lower surface of the body. This overlap with the contents described in FIG. 4, The description will be omitted.

The method of manufacturing a chip electronic component according to the present invention is a method of manufacturing a chip electronic component having a structure for preventing external electrodes from growing up to the top surface of a body and capable of ensuring the reliability of external electrode placement by a simplified process .

Except for the above description, a description overlapping with the features of the chip electronic component according to the example of the present invention described above will be omitted here.

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited only by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

In the meantime, the expression "an example" used in this disclosure does not mean the same embodiment but is provided for emphasizing and explaining different unique features. However, the above-mentioned examples do not exclude that they are implemented in combination with the features of other examples. For example, although a matter described in a particular example is not described in another example, it may be understood as an explanation related to another example, unless otherwise stated or contradicted by that example in another example.

On the other hand, the terms used in this disclosure are used only to illustrate an example and are not intended to limit the present disclosure. Wherein the singular expressions include plural expressions unless the context clearly dictates otherwise.

100: Chip electronic components
1: Body
2: inner coil
11a, 11b: outer electrode growth suppressing portion
4: insulating layer

Claims

body;
An inner coil embedded in the body; And
And an outer electrode electrically connected to the inner coil and disposed on an outer surface of the body,
Wherein the upper surface of the body includes at least one outer electrode growth suppressing portion,
Wherein an insulating layer is disposed on an upper surface of the body, and the insulating layer is disposed to have the same shape as an upper surface of the body including the external electrode growth suppressing portion,
Chip electronic components.

The method according to claim 1,
Wherein the external electrode growth restraining portion is disposed at both ends of the upper surface of the body,
Chip electronic components.

The method according to claim 1,
Wherein the upper surface of the body and the lower surface of the body have different shapes,
Chip electronic components.

The method according to claim 1,
Wherein the distance from the outer electrode growth suppressing portion to the lower surface of the body is smaller than the distance from the center of the upper surface of the body to the lower surface of the body,
Chip electronic components.

delete

The method according to claim 1,
Wherein an insulating layer is disposed on a lower surface of the body and the insulating layer is disposed entirely between regions of the lower surface of the body where the external electrodes are disposed,
Chip electronic components.

The method according to claim 1,
Wherein the outer electrode extends only from a part of the lower surface of the body to a corner between the upper surface and the side surface of the body along a part of the side surface of the body,
Chip electronic components.

The method according to claim 1,
The outer electrode growth suppressing portion on the upper surface of the body has a groove shape,
Chip electronic components.

The method according to claim 1,
Wherein the external electrode growth suppressing portion on the upper surface of the body has an angular shape,
Chip electronic components.

The method according to claim 1,
Wherein the surface of the outer electrode growth suppressing portion on the upper surface of the body coincides with the cut surface of the particles contained in the body,
Chip electronic components.

Preparing a plurality of inner coils having at least one lead-out portion;
Disposing a magnetic sheet on the upper and lower surfaces of the inner coil so as to simultaneously embed inner coils adjacent to each other to form a lamination bar;
Forming a groove on a part of the upper surface of the lamination bar including a point extending from a boundary between adjacent inner coils;
Disposing an insulating layer on an upper surface of the lamination bar including the grooves;
Providing a body including an inner coil by cutting an area of the upper surface of the lamination bar including a part of the groove; And
Disposing an external electrode on a partial area of the lower surface of the body and on a partial area of the side surface; / RTI >
A method of manufacturing a chip electronic component.

13. The method of claim 12,
Wherein the outer electrode is plated so as to extend only from a part of the lower surface of the body to a corner between the upper surface and the side surface of the body along a part of the side surface of the body,
A method of manufacturing a chip electronic component.

13. The method of claim 12,
Further comprising disposing an insulating layer on an entire surface of the bottom surface of the body excluding an area where the external electrode is to be disposed, before placing the external electrode on a partial area of the bottom surface of the body and a partial area of the side surface,
A method of manufacturing a chip electronic component.

13. The method of claim 12,
The step of disposing the insulating layer on the upper surface of the lamination bar including the grooves may include printing a paste having an insulating property or applying an insulating film.
A method of manufacturing a chip electronic component.

13. The method of claim 12,
The step of preparing a plurality of inner coils includes:
And arranging the lead portions of the adjacent coils so as to be spaced apart from each other by a predetermined distance.
A method of manufacturing a chip electronic component.