KR101791868B1 - Reflow apparatus - Google Patents

Reflow apparatus Download PDF

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Publication number
KR101791868B1
KR101791868B1 KR1020160030538A KR20160030538A KR101791868B1 KR 101791868 B1 KR101791868 B1 KR 101791868B1 KR 1020160030538 A KR1020160030538 A KR 1020160030538A KR 20160030538 A KR20160030538 A KR 20160030538A KR 101791868 B1 KR101791868 B1 KR 101791868B1
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KR
South Korea
Prior art keywords
exhaust
gas
unit
substrate
pair
Prior art date
Application number
KR1020160030538A
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Korean (ko)
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KR20170107144A (en
Inventor
김동수
김도일
이영호
김중현
Original Assignee
주식회사 플스팩
주식회사 가이아에너지
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Priority to KR1020160030538A priority Critical patent/KR101791868B1/en
Publication of KR20170107144A publication Critical patent/KR20170107144A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494Heating methods for reflowing of solder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • H05K13/0465Surface mounting by soldering

Abstract

The present invention provides a reflow apparatus. The reflow apparatus includes a main body having a reflow region formed therein; A loading unit disposed at one side of the main body and loaded with the substrate; A heating unit installed in the main body and providing heat to perform a reflow process on the substrate positioned in the reflow region; A transfer unit installed in the main body to transfer the substrate; And a gas exhaust unit provided in the transfer unit, for sucking exhaust gas generated by the reflow process during the transfer of the substrate from both sides of the substrate and forcibly exhausting the exhaust gas to the outside.

Description

[0001] REFLOW APPARATUS [0002]

The present invention relates to a reflow apparatus, and more particularly, to a reflow apparatus capable of easily forming heat during a reflow process, preventing deformation of the apparatus due to heat, and efficiently discharging exhaust gas from both sides of the substrate To the reflow apparatus.

Usually, the substrate soldering apparatus is for mounting electronic components on a substrate, and soldering is performed by a reflow apparatus.

Such a reflow apparatus is divided into a preheating region, a reflow region, and a cooling region, which are mounted before the soldering process.

The preheating area and the reflow area are provided with a heater and a fan, respectively, though not shown in the drawings.

The preheating area and the reflow area are provided with conveyors passing through these areas.

Accordingly, the substrate is moved along the conveyor, and the electronic component is mounted through the heat source of the heater in the preheating area and the reflow area.

That is, the substrate is coated with solder at every position where the electronic component is mounted before entering the preheating area. The solder is soldered through the preheat region and the reflow region, and the electronic component is installed at the soldered location.

A conventional reflow apparatus uses solder coated on a substrate using hot air (hereinafter referred to as "hot air") generated by a heater, a fan, Soldering is carried out by heating to the temperature range and then cooling.

That is, the reflow apparatus conveys the generated hot air to the solder on the substrate by using a convection method, which is one of the heat transfer methods, to heat the solder to the solder melting temperature range above the melting point thereof, And solidifies the electronic component to solder the electronic component on the substrate.

However, when the solder is melted only by the convection method using the hot air as described above and the electronic parts are soldered through the solder, various problems may occur.

For example, when the solder is melted only by a convection method using hot air, and the electronic parts are soldered through the solder, a part of the solder or flux contained in the solder may be splashed by the convected hot air or the like .

In the conventional reflow apparatus, heaters are provided at the upper and lower portions of the conveyor in the reflow region, so that the heat of the heaters is transferred to the substrate through the blower to be soldered, There are problems that are easily damaged.

That is, the heat source generated by the heater is usually at a temperature of 240 to 250 ° C., while the non-heat resistant part of the power related part has a lower critical temperature. Accordingly, in the case of a non-heat-resistant component, if the heat of the heater on the conveyor is directly applied to the non-heat-resistant component, the component is damaged and defective products are generated.

Here, the support for supporting the process line in the reflow line having the above characteristics is usually provided with an aluminum profile.

The conventional profile is exposed to the high temperature environment generated during the reflow process.

Therefore, in the past, when thermal deformation occurs along the axial direction of the profile as described above, there is a problem that the conveying path of the conveyor is twisted and the rigidity itself is reduced, and the device itself is damaged due to frequent deformation.

Further, the substrate generates flux gas by melting the solder paste while passing through the reflow region where the heater is installed.

The high-temperature air containing the flux gas is circulated in the apparatus, and is discharged to the outside of the apparatus through a separate exhaust apparatus provided at both sides of the apparatus.

Such an exhaust apparatus generally comprises an exhaust fan which is exposed to the top of the apparatus and driven to rotate, and a bellows-type exhaust pipe which connects the exhaust port on the upper portion and the upper nozzle top of the heater to the lower portion of the exhaust fan.

Subsequently, the flux gas in the apparatus is sucked into the exhaust pipe by the exhaust fan rotationally driven at the top of the apparatus and discharged to the outside through the exhaust port.

However, in the conventional exhaust system, the exhaust fan, which rotates at a high speed by the high-temperature air containing the flux gas, is easily overheated, shortening the lifespan of the exhaust fan. When the flux gas sticks to the wing of the exhaust fan, There is a problem in that the operation of the fan is stopped when the amount of sticking increases as well as the rotation is difficult.

Further, in the case of miniaturizing the reflow apparatus, there is a problem that it is difficult to miniaturize the apparatus because the apparatus is enlarged because it is necessary to further install an exhaust apparatus having a different configuration as described above.

A prior art related to the present invention is Korean Patent Laid-Open Publication No. 10-2006-0049599 (published on May 19, 2006), and the prior art discloses a reflow apparatus.

It is an object of the present invention to provide a reflow apparatus capable of easily forming heat during a reflow process, preventing deformation of the apparatus due to heat, and efficiently discharging exhaust gas from both sides of the substrate in a reflow process, .

In a preferred embodiment, the present invention provides a reflow apparatus.

The reflow apparatus includes a main body having a reflow region formed therein; A loading unit disposed at one side of the main body and loaded with the substrate; A heating unit installed in the main body and providing heat to perform a reflow process on the substrate positioned in the reflow region; A transfer unit installed in the main body to transfer the substrate; And a gas exhaust unit provided in the transfer unit, for sucking exhaust gas generated by the reflow process during the transfer of the substrate from both sides of the substrate and forcibly exhausting the exhaust gas to the outside.

The heating unit includes a base portion having a plurality of gas injection holes through which process gas supplied from the outside is injected, the base portion being formed of a metal; A heat radiation part laminated on the base part and having a plurality of through holes communicating with the plurality of gas injection holes and having surface increase grooves formed on the outer surface part; And a heating unit installed in the base unit and heating the base unit.

A plurality of gas supply pipes are formed at the lower end of the base to uniformly form gas supply holes, and both ends of the plurality of gas supply pipes are fixed to both ends of the base.

Wherein the heat radiation portion includes a heat radiation body which is stacked to be in close contact with an upper end of the base portion and the surface increase increasing grooves formed in a lattice shape on an outer surface portion of the heat radiation body, And is formed at the center of each of the surface-increasing grooves.

Preferably, each of the surface-increasing grooves has an inclined surface inclined upwards along four sides along an outer side with respect to the through-hole.

Wherein the transfer unit comprises: a pair of support portions arranged in pairs so as to face each other to transfer the substrate, the support portions being exposed in the reflow region and disposed at intervals; A conveyance body having opposite ends connected to the pair of supports and having a predetermined length; A tension shaft portion passing through the conveyance body and having both ends supported by the pair of supports; And an elastic portion provided on the pair of supporting portions and elastically supporting both ends of the tension shaft portion.

Wherein the support portion includes a pair of support members, wherein each of the pair of support members is provided with a cutout groove that is cut so as to be exposed upward, and the cutout groove is formed at a boundary of the rotation hole And the elastic portion is preferably disposed in the cutout groove.

The elastic portion may include an elastic spring disposed in the cutout groove in a state of being fitted to both ends of the tension shaft portion and having both side portions elastically supported on both side walls of the cutout groove.

Preferably, the elastic spring further comprises a spacing member, wherein the spacing member is disposed between the elastic spring and one side wall of both side walls of the cutout groove.

The gas exhaust unit may include a gas exhaust unit provided in the transfer unit and exhausting the exhaust gas including the smoke generated during the soldering to the outside through both sides of the substrate.

The gas discharging unit includes a plurality of exhaust holes formed in the pair of conveying unit bodies at intervals along the longitudinal direction and forming a discharging passage of the exhaust gas, a plurality of exhaust holes arranged at a lower end of the pair of conveying unit bodies, An exhaust line connected to the plurality of exhaust holes and connected to exhaust the exhaust gas to the outside, and an exhaust pump connected to the exhaust line to exhaust the exhaust gas to the outside.

Preferably, the exhaust line is disposed in each of the pair of conveyance body bodies and communicates with a plurality of exhaust holes formed in the conveyance body body.

The exhaust line is preferably provided with a trap for filtering foreign substances contained in the discharged exhaust gas.

The present invention provides radiant heat to a substrate transferred to a heating region to stably melt the solder, and has an effect of increasing the heat efficiency by increasing the heating area provided to the substrate.

1 is a perspective view showing a reflow apparatus of the present invention.
FIG. 2 is a schematic view showing the configuration of the reflow apparatus of the present invention. FIG.
3 is a perspective view showing a state in which a plurality of heating units for a reflow apparatus of the present invention are arranged.
4 is a perspective view showing a single heating unit for a reflow apparatus of the present invention.
5 is a perspective view schematically showing a configuration of a heating unit for a reflow apparatus of the present invention.
6 is a perspective view showing the configuration of the lower end portion of the base portion according to the present invention.
7 is a perspective view showing a heat radiation part according to the present invention.
8 is a plan view showing a heat radiation unit according to the present invention.
9 is a view showing a surface area increasing groove according to the present invention.
10 is a cross-sectional view showing a surface area increasing groove according to the present invention.
11 is a perspective view showing the transfer unit of the present invention.
12 is a perspective view showing a support according to the present invention.
13 is a partially cutaway perspective view showing a tension shaft and a transferring body according to the present invention.
14 is a view showing another example in which the tension shaft according to the present invention is installed.
15 is a view showing another example of the elastic portion according to the present invention.
16 is a perspective view showing a configuration of a gas exhaust apparatus for a reflow apparatus of the present invention.
17 is a perspective view showing the width-adjusted state of the gas exhaust apparatus for a reflow apparatus of the present invention.
18 is a perspective view showing a gas discharge portion according to the present invention.
19 is a view showing a plurality of exhaust holes according to the present invention.
20 is a perspective view showing another example of the gas discharge portion according to the present invention.
FIG. 21 is a view showing a state in which the exhaust block of FIG. 20 is rotatable.
22 is a view showing a configuration in which an exhaust hole according to the present invention is formed so as to face an upper end side portion and a lower end side portion of the conveyance body.
23 is a view showing a configuration in which an exhaust hole according to the present invention is inclined upward.

Hereinafter, a reflow apparatus of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a reflow apparatus of the present invention, and FIG. 2 is a view schematically showing a configuration of a reflow apparatus of the present invention.

Referring to FIG. 1, the reflow apparatus of the present invention includes a main body 100 having a reflow area formed therein, a loading unit 110 disposed at one side of the main body 100, A heating unit 200 installed in the main body 100 for providing heat to perform a reflow process on the substrate positioned in the reflow area; a heating unit 200 mounted on the main body 100, And a gas exhausting unit 300 installed in the transfer unit 300 for exhausting the exhaust gas generated by the reflow process while the substrate is being transferred to both sides of the substrate and forcibly exhausting the exhaust gas to the outside. Unit 400 shown in Fig.

Each of the above configurations will be described.

In the heating unit 200,

FIG. 3 is a perspective view showing a state where a plurality of heating units for a reflow apparatus of the present invention are arranged, and FIG. 4 is a perspective view showing a single heating unit for a reflow apparatus of the present invention.

3 and 4, the heating unit 200 for a reflow apparatus of the present invention includes a base unit 210, a heat radiation unit 220, and a heating unit 230.

The heating unit 200 'for a reflow apparatus of the present invention may be configured for each unit unit as shown in FIG.

That is, the heat dissipation area can be adjusted according to the number of unit units connected.

Next, each configuration of the present invention will be described.

The base 210,

Referring to FIGS. 5 and 6, the base 210 according to the present invention is formed of a metal and formed into a plate.

A plurality of gas injection holes 211 are formed in the base 210.

The plurality of gas injection holes 211 are formed to pass through the upper and lower portions at predetermined intervals.

Although not shown in the drawings, the gas injection holes 211 may be formed to have different sizes of holes depending on the puncturing positions.

Gas supply pipes 240 are disposed at the lower end of the base 210.

The gas supply pipes 240 are spaced apart from each other at the lower end of the base 210, and both ends of the gas supply pipes 240 are fixed to both ends of the base 210.

Both ends of the gas supply pipes 240 may be disposed to penetrate both ends of the base portion 210.

Although not shown in the drawing, the gas supply pipes 240 may be rotated by a separate motor to adjust the rotational position.

The gas supply pipes 240 are formed with a plurality of gas supply holes (not shown) for injecting nitrogen gas, which is a process gas supplied from the outside.

Therefore, nitrogen gas can be supplied from the gas supply pipes 240 to the lower end region of the base 210.

A heat conductive layer 210a (see FIG. 4) formed of an insulating material is formed on the lower end surface of the base 210.

The heating unit 230,

Referring to FIG. 5, the heating unit 230 according to the present invention is installed at the lower end of the base unit 210.

The heating unit 230 includes a plurality of coupling terminals 231, a power supply 232, and a controller 233.

The plurality of fastening terminals 231 are fastened to the ends of the base 210 and are electrically connected to the base 210.

The power supply 232 supplies power to a plurality of coupling terminals 231 through a power supply line (not shown).

Accordingly, the base portion 210 connected to the fastening terminals 231 can be heated to a predetermined temperature.

Also, although not shown in the drawing, the mounting position of the fastening terminals 231 can be variably adjusted according to the fastening position, and the outer surface thereof may be further coated with an insulating material.

The heat-

FIG. 7 is a perspective view showing a heat radiation unit according to the present invention, and FIG. 8 is a plan view showing a heat radiation unit according to the present invention.

7 and 8, the heat radiation part 220 according to the present invention is installed to be stacked on the upper part of the base part 210.

The heat radiating part 220 may be formed of a ceramic material to facilitate the formation of radiant heat.

The heat radiating part 220 is composed of a plate heat radiating body 221 and surface area increasing grooves 222.

The heat radiation body 221 is coupled to the upper portion of the base 210 in a stacked manner.

The coupling may be coupled through a separate fastening member (not shown).

Further, a heat conduction layer may be further formed between the heat radiation body 221 and the upper end of the base 210.

The surface increase grooves 222 are formed in a lattice shape on the outer surface of the heat radiation body 221.

Here, a plurality of through holes 220a are formed in the heat radiation body 221.

The plurality of through holes 220a serve to inject nitrogen gas injected from the gas injection holes 211 of the base 210 into the heating region.

The plurality of through holes 220a may be formed in the heat radiation body 221 in the area between the surface area increasing grooves 222 and may be formed in the center of the surface area increasing grooves 222 have.

FIG. 9 is a view showing a surface area increasing groove according to the present invention, and FIG. 10 is a sectional view showing a surface area increasing groove according to the present invention.

In particular, each of the surface-increasing grooves 222 may form an inclined surface S that slopes upward along four sides along the outer side from the center thereof.

When the center of each of the surface increase grooves 222 is formed in the through hole 220a, the inclined surface S may be inclined upwards along four directions along the through hole 220a.

That is, since the inclined surface is formed in each of the surface increase grooves 222, the heat radiation area can be increased.

Therefore, the inclined plane S in the present invention may be formed of either a straight inclined plane or a curved inclined plane.

Of course, although not shown in the drawing, the slope S may be further provided with projections and protrusions for increasing the heat radiation area.

In addition, a planar area F having a set width can be formed at the boundary of each of the surface increasing grooves 222 according to the present invention.

In addition, the flat area F may be formed so that the width gradually narrows along the edge from the center of the heat radiation body 221.

Thus, by providing more radiant heat to the edge region of the substrate located in the heating region, defective soldering due to heat loss in the edge region can be efficiently improved.

In addition, although not shown in the drawings, the through holes 220a according to the present invention may be formed as a vortex hole that guides the injection of the process gas.

As described above, since it is formed in a vortex shape, the injected nitrogen gas can be injected into the heating region in a shorter time, thereby improving the process efficiency.

Through the above-described configuration, the embodiment according to the present invention increases the heat efficiency by using the radiation heating method in which the substrate is heated, diffuses the heated heat through the heat radiation portion, The power consumption can be reduced and the volume of the facility can be miniaturized.

Meanwhile, although not shown in the drawings, the base part 210 according to the present invention may be composed of a plurality of units and may be configured to be coupled or separated to be adjacent to each other.

The power supply 232 according to the present invention may be configured to be independently connected to each of the plurality of base units 210.

The plurality of power supplies 232 are electrically connected to the controller 233.

Here, the controller 233 may control each of the plurality of power supplies 232.

Accordingly, in the present invention, by controlling the driving of each of the power supply units 232 through the controller 233, the heating temperature in the corresponding base unit 210 can be adjusted to be different from each other.

Accordingly, in the present invention, the heating temperature can be controlled differently in each of the divided regions in the heating region where the substrate is located.

The embodiment according to the present invention has an advantage that it is possible to easily solve the problem that the heating temperature difference in the entire area of the substrate is generated by controlling the driving of the power supply units by setting the heating temperature for each area or area of the substrate.

In the transport unit 300,

11 is a perspective view showing the transfer unit of the present invention.

Referring to FIG. 11, the conveying unit 300 of the present invention includes a pair of supports 310, a conveying body 320, a tension shaft 330, and an elastic portion 340.

Each configuration will be described.

The transfer unit 300 according to the present invention is installed in the apparatus in a plurality of spaced intervals along the width direction.

The pair of supports 310 according to the present invention are arranged to face each other at intervals.

The pair of supports 310 are formed to have the same structure.

Each of the pair of supports 310 includes a support member 311.

The supporting member 311 is formed with a cutting groove 311a which is cut so that an upper end thereof is exposed upward.

The incision groove 311a is formed in a '

Figure 112016024536292-pat00001
'Shape.

The supporting member 311 is formed with a through hole 311b.

The through holes 311b are formed on both sides of the boundary of the cutout groove.

The through hole 311b is perforated so as to be exposed to the outside of the support member 311. [

Both ends of the tension shaft portion 330 are engaged with the through hole 311b formed in the pair of support members 311 in the present invention.

FIG. 12 is a perspective view showing a support according to the present invention, and FIG. 13 is a partially cutaway perspective view showing a tension shaft and a conveyance body according to the present invention.

The feeder body 320,

12 and 13, the transfer part body 320 according to the present invention may be formed of an aluminum material.

The feeder body 320 has a predetermined length.

Both ends of the feeder body 320 may be connected to a pair of supports 310.

The feeder body 320 may have a rectangular hollow 321.

Although not shown in the drawing, the transfer unit body 320 may have a plurality of vent holes communicating with the outside.

The vent holes may be formed by venting the pressure formed in the hollow in accordance with the external heat to prevent deformation.

Further, a reinforcing rib 322 may be formed at one side of the conveying body 320 so as to protrude at intervals to maintain rigidity.

The reinforcing ribs 322 are formed along the longitudinal direction of the conveyance body 320 and protrude to one side.

The tension shaft portion (330)

13 and 14, the tension shaft portion 330 according to the present invention has tension shafts having lengths.

In the present invention, it is preferable that the tension shaft comprises two pieces.

Each of the tension shafts is installed so as to pass through the conveyance body 320.

Both ends of the tension shaft are projected to the outside through both ends of the conveying body 320.

Both ends of the tension shaft projecting through both ends of the conveying member body 320 are arranged to be inserted into the through holes 311b formed in the pair of support members 311. [

The tension shaft according to the present invention comprises two tension shafts and is installed to penetrate the upper and lower ends of the conveyance body 320.

Therefore, a pair of through holes 311b are formed in the pair of support members 311 so as to correspond thereto.

Here, the pair of through holes 311b are formed so as to be exposed to the outside, and do not regulate both ends of the respective tension shafts.

The elastic portion 340,

The elastic portion 340 according to the present invention is disposed in the cutout groove 311a in such a state that it is fitted to both ends of the tension axis.

The elastic portion 340 includes elastic springs whose both side portions are elastically supported on both side walls of the cutout groove 311a.

In addition, the elastic spring further includes a spacing member 341. [

The spacing member 341 may be disposed between one side wall of the side walls of the elastic spring and the cutout groove 311a.

Here, the spacing members 341 may be arranged to be adjacent to each other.

The spacing member 341 is disposed to be sandwiched between both ends of the tension shaft.

According to the above configuration, the spacing member 341 according to the present invention can maintain a space between the elastic spring and one side wall of the cutout groove 311a.

In addition, the interval at which the holding member 341 is held can be variably controlled according to the number of the spacing members 341 installed.

Referring to the above configuration, the transferring body 320 according to the present invention is installed in the reflow apparatus, and is exposed to a high temperature or higher during the reflow process.

In addition, the transfer part body 320 located in the cooling area outside the reflow area can be exposed to a certain cooling temperature.

Accordingly, the transfer chamber body 320 according to the present invention is different in temperature atmospheres exposed according to the installation position.

At this time, the conveyance body 320 according to the present invention is elongated or contracted along the longitudinal direction to generate a variable amount of length.

Since the two tension shafts are installed to penetrate the upper and lower ends of the conveying portion body 320 according to the present invention to maintain rigidity and are elastically supported by the respective elastic springs at both ends thereof, Lt; / RTI >

In addition, since both ends of the tension shaft are turnably supported by the pair of elastic springs in the present invention, there is an advantage that the length of the conveying unit body 320 itself can be reduced to a certain value or less.

That is, the embodiment according to the present invention can maintain the rigidity above a certain level and reduce the volume by installing the tension shafts.

Therefore, there is an advantage that the reflow apparatus itself can be downsized.

14 is a view showing another example in which the tension shaft according to the present invention is installed.

Referring to FIG. 14, the tension shaft 330 according to the present invention may be provided in three or more than two.

Further, the tension shafts 330 according to the present invention may be formed so that their diameters are different from each other.

Accordingly, rigidity at a plurality of positions of the transfer unit body 320 may be different from each other, and a tension shaft having a larger diameter may be used at a portion relatively weak in rigidity.

In addition, although not shown in the drawing, the tension shaft 330 according to the present invention may be coupled through the feeder body 320 while being screwed.

Accordingly, it is possible to increase the fastening force between the conveying unit body 320 and the tension shaft 330 to prevent relative slip during the stiffness and elastic flow.

The elastic force of the elastic spring according to the present invention is preferably designed to be proportional to the diameter of the tension shaft.

15 is a view showing another example of the elastic portion according to the present invention.

The elastic part according to the present invention may use an elastic spring as described above, but an elastic cylinder 350 having an elastic force may also be used.

In this case, the cylinder 350 is fixed to the spacing member 341, and the shaft 351 elastically stretched and contracted from the cylinder 350 can be supported on one side wall of the incision groove.

Accordingly, in the present invention, when both ends of the tension shaft 330 are held constant by using the elastic cylinder 350, the problem caused by elastic deformation of the spring itself can be solved.

In addition, there is an advantage that the elastic force can be variably controlled by forming a certain pressure in the elastic cylinder 350 to maintain the elasticity, and varying the pressure through a pressure regulating device (not shown).

According to the above construction and operation, in the embodiment according to the present invention, when the conveyor profile is cut by a required length by providing two or more tension shafts based on the pair of supports, It is possible to improve the responsiveness according to the deformation and the natural deformation according to the size of the profile, and to reduce the profile size itself, thereby achieving compactness of the apparatus.

The gas exhaust unit 400,

FIG. 16 is a perspective view showing the structure of a gas exhaust apparatus for a reflow apparatus of the present invention, FIG. 17 is a perspective view showing a state of the gas exhaust apparatus for a reflow apparatus of the present invention in a width- FIG. 19 is a view showing a plurality of exhaust holes according to the present invention. FIG.

Referring to FIG. 16, the gas exhaust unit 400 for a reflow apparatus of the present invention largely includes a gas exhaust part 420.

Each of the above configurations will be described.

The feeder body 320,

The gas discharging unit 420 according to the present invention transfers and positions the substrate in a reflow region for soldering the component by providing the set heat to the substrate, and the width of the substrate can be adjusted according to the width of the substrate.

The transfer part bodies 320 are formed as a pair.

The pair of conveyance body bodies 320 are formed in a rail shape having a length and serve to guide both side portions of the substrate for movement of the substrate.

The pair of conveying unit bodies 320 are formed of aluminum.

In addition, the pair of conveyance body bodies 320 have a certain width.

The width of the pair of conveying unit bodies 320 can be adjusted through a width adjusting unit.

Although not shown in the drawing, the width adjusting unit may include a cylinder shaft connected to the pair of conveying unit bodies 320 and stretchable and contractible so that the width thereof can be adjusted.

Accordingly, the width of the pair of conveyance body bodies 320 can be adjusted by the expansion and contraction of the cylinder axis (not shown).

Here, the width may be variably set according to the width of the substrate.

The gas discharge portion 420,

18 and 19, the gas discharge unit 420 according to the present invention is provided in the transfer unit body 320 and discharges the exhaust gas including the smoke generated during the soldering to the outside through both sides of the substrate .

The gas discharge portion 420 according to the present invention is composed of a plurality of exhaust holes 421, an exhaust line 422, and an exhaust pump 423.

The plurality of exhaust holes 421 are formed at the upper end of the conveyance body 320, and both sides thereof are formed to pass through.

When the soldering is performed on the substrate, the exhaust hole 421 forms a discharge passage so that the exhaust gas including the generated lead smoke flows out to the outside.

The exhaust line 422 is disposed at the lower end of the pair of the conveyance body 411 and is connected to the plurality of exhaust holes 421 and connected to discharge the exhaust gas to the outside.

The exhaust pump 423 is connected to the exhaust line 422 to exhaust the exhaust gas.

Particularly, the exhaust line 422 is disposed in each of the pair of conveyance body bodies 411 and communicates with a plurality of exhaust holes 421 formed in the conveyance body 320.

Accordingly, the exhaust line 422 in the present invention is installed in each of the pair of conveyance body bodies 411, and the exhaust line 421 can be discharged to the outside through an exhaust pump 423 connected thereto.

In addition, on the exhaust line 422 according to the present invention, there is provided a trap 424 for filtering the foreign substances contained in the discharged exhaust gas.

Next, the operation of the gas exhaust unit of the present invention having the above-described structure will be described.

Referring to Figs. 16-19, the substrate may be transferred and placed into the reflow region by the transfer body 320 according to the present invention.

Therefore, the substrate is exposed to a high temperature atmosphere, and soldering is performed in the high temperature atmosphere.

As the soldering is performed in this way, that is, smoke due to soldering is generated.

At this time, the exhaust pump 423 according to the present invention is driven, so that a vacuum suction force is formed in the plurality of exhaust holes 421 formed in the exhaust line 422 and the respective transfer body 411.

By the vacuum suction force, the exhaust gas including the smoke generated as described above is forcibly introduced into the plurality of exhaust holes 421 at both sides of the substrate.

Then, the forcedly flowing exhaust gas flows along the exhaust line 422 connected to the exhaust holes 421.

The foreign substances contained in the exhaust gas flowing are trapped by the trap 424 installed on the exhaust line 422.

The exhaust gas filtered by the foreign matter can be discharged to the outside while being moved along the exhaust line 422 by driving the exhaust pump 423.

According to the configuration and operation of the exhaust gas purifier, the embodiment of the present invention can advance the reflow process and the generated exhaust gas quickly to the outside through the transfer unit located on both sides of the substrate.

Therefore, in the present invention, when the exhaust gas is exhausted, it is possible to reduce the size of the device by enlarging the size of the device by installing a separate exhaust device.

20 is a perspective view showing another example of the gas discharge portion according to the present invention.

Referring to FIG. 20, the gas exhaust part 420 according to the present invention may include an exhaust block 425 in which a plurality of exhaust holes 421 are formed.

The exhaust block 425 may be detachably installed at the upper end of the conveyance body 320.

For example, the exhaust block 425 may be fitted to the upper end of the feeder body 320 or may be slidably coupled at the side.

Accordingly, the exhaust block 425 according to the present invention can be easily replaced.

FIG. 21 is a view showing a state in which the exhaust block of FIG. 20 is rotatable.

Referring to FIG. 21, the exhaust block 425 according to the present invention can be installed to be rotatable up and down through the upper end of each of the conveyance body 320 and the hinge end H.

Of course, the hinge stage H is connected to the rotary shaft of the rotary motor 430, and is rotated up and down by the rotation of the rotary shaft.

Accordingly, in the present invention, by vertically adjusting the up-and-down rotational position of the exhaust block 425, it is possible to vary the vertical position of the exhaust hole and to efficiently change the exhaust position of the exhaust gas.

In addition, although not shown in the drawings, the exhaust holes according to the present invention may be formed as holes in the vortex pattern so as to increase the flow velocity upon inflow of the exhaust gas so as to be discharged quickly.

22 is a view showing a configuration in which an exhaust hole according to the present invention is formed so as to face an upper end side portion and a lower end side portion of the conveyance body.

22, the exhaust holes 421 according to the present invention may be formed at the upper and lower ends of the conveyance body 320, and may be formed to face the upper end side and the lower end side, respectively.

Accordingly, in the present invention, the exhaust gas generated during the reflow process can be simultaneously discharged from the upper and lower portions of the substrate, and the gas remaining in the lower portion of the substrate can be easily discharged to the outside without being discharged.

23 is a view showing a configuration in which an exhaust hole according to the present invention is inclined upward.

Referring to FIG. 23, the exhaust holes 421 'according to the present invention may be formed to be inclined upward from the upper end side of the conveyance body 320.

According to this configuration, the smoke generated by the soldering flows to the upper portion, and at this time, the smoke flowing upward can more easily be forcedly introduced and discharged efficiently to the outside.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by the scope of the appended claims and equivalents thereof.

It is to be understood that the foregoing embodiments are illustrative and not restrictive in all respects and that the scope of the present invention is indicated by the appended claims rather than the foregoing description, It is intended that all changes and modifications derived from the equivalent concept be included within the scope of the present invention.

100:
200: Heating unit
210: Base portion
220: heat radiation part
221: heat radiation body
222: surface increase groove
230:
300: Feed unit
310: Support
311; Supporting member
320: feeder body
330: tension shaft part (tension shaft)
340: elastic part
341:
350: elastic cylinder
400: gas exhaust unit
420: gas discharge portion
421: Exhaust hole

Claims (13)

A main body portion in which a reflow region is formed;
A loading unit disposed at one side of the main body, the loading unit loading the substrate;
A heating unit installed in the main body and providing heat to perform a reflow process on the substrate positioned in the reflow area;
A transfer unit installed in the main body to transfer the substrate; And
And a gas exhaust unit which is provided in the transfer unit and sucks exhaust gas generated by the reflow process during the transfer of the substrate from both sides of the substrate and forcibly exhausts the exhaust gas to the outside,
The transfer unit is disposed in a pair so as to face each other to transfer the substrate,
A pair of supporting portions exposed in the reflow region and disposed at intervals;
A conveyance body having opposite ends connected to the pair of supports and having a predetermined length;
A tension shaft portion passing through the conveyance body and having both ends supported by the pair of supports; And
And an elastic portion provided on the pair of supporting portions and elastically supporting both ends of the tension shaft portion.
The method according to claim 1,
In the heating unit,
A base portion having a plurality of gas injection holes through which a process gas supplied from the outside is injected, the base portion being formed of a metal;
A heat radiation part laminated on the base part and having a plurality of through holes communicating with the plurality of gas injection holes and having surface increase grooves formed on the outer surface part;
And a heating unit installed in the base unit and heating the base unit.
3. The method of claim 2,
A plurality of gas supply pipes are formed at the lower end of the base to uniformly form gas supply holes,
Wherein both ends of the plurality of gas supply pipes are fixed to both ends of the base portion.
3. The method of claim 2,
The heat-
A heat radiation body laminated to be in close contact with an upper end of the base,
And the surface increase grooves formed in a lattice shape on an outer surface portion of the heat radiation body,
And each of the plurality of through holes is formed at the center of each of the surface-increasing grooves.
5. The method of claim 4,
Wherein each of the surface-
And a sloped surface inclined upwards along four sides along an outer side with respect to the through hole.
delete The method according to claim 1,
The support portion
And a pair of support members,
In each of the pair of support members,
A cutting groove is formed so as to be exposed upward,
A rotation hole through which the tension shaft is inserted is formed with the cutout groove as a boundary,
And the elastic portion is disposed in the cutout groove.
8. The method of claim 7,
The elastic portion
And an elastic spring which is disposed in the cutout groove in a state of being fitted to both ends of the tension shaft and whose both sides are elastically supported on both side walls of the cutout groove.
9. The method of claim 8,
The elastic spring
Further comprising a spacing member,
Wherein the spacing member is disposed between the elastic spring and one side wall of both side walls of the cutout groove.
The method according to claim 1,
The gas exhaust unit includes:
And a gas discharging unit provided in the transporting unit and discharging exhaust gas including smoke generated during soldering to the outside through both side portions of the substrate.
11. The method of claim 10,
The gas-
A plurality of exhaust holes formed in the pair of conveyance unit bodies at intervals along the longitudinal direction and forming a discharge passage for the exhaust gas,
An exhaust line disposed at a lower end of the pair of conveyance body bodies and connected to the plurality of exhaust holes and connected to exhaust the exhaust gas to be exhausted;
And an exhaust pump connected to the exhaust line for discharging the exhaust gas to the outside.
12. The method of claim 11,
The exhaust line
And a plurality of exhaust holes formed in the pair of conveyance body bodies and communicated with a plurality of exhaust holes formed in the conveyance body.
13. The method of claim 12,
In the exhaust line,
Wherein a trap for filtering foreign matter contained in the exhaust gas is installed.


KR1020160030538A 2016-03-14 2016-03-14 Reflow apparatus KR101791868B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3229533B2 (en) * 1995-12-28 2001-11-19 日本電熱計器株式会社 Reflow soldering method and reflow soldering device
KR101375920B1 (en) * 2011-06-17 2014-03-18 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 Apparatus and method for providing an inerting gas during soldering

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3229533B2 (en) * 1995-12-28 2001-11-19 日本電熱計器株式会社 Reflow soldering method and reflow soldering device
KR101375920B1 (en) * 2011-06-17 2014-03-18 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 Apparatus and method for providing an inerting gas during soldering

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