KR101791868B1 - Reflow apparatus - Google Patents
Reflow apparatus Download PDFInfo
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- KR101791868B1 KR101791868B1 KR1020160030538A KR20160030538A KR101791868B1 KR 101791868 B1 KR101791868 B1 KR 101791868B1 KR 1020160030538 A KR1020160030538 A KR 1020160030538A KR 20160030538 A KR20160030538 A KR 20160030538A KR 101791868 B1 KR101791868 B1 KR 101791868B1
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- South Korea
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- exhaust
- gas
- unit
- substrate
- pair
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-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
Abstract
The present invention provides a reflow apparatus. The reflow apparatus includes a main body having a reflow region formed therein; A loading unit disposed at one side of the main body and loaded with the substrate; A heating unit installed in the main body and providing heat to perform a reflow process on the substrate positioned in the reflow region; A transfer unit installed in the main body to transfer the substrate; And a gas exhaust unit provided in the transfer unit, for sucking exhaust gas generated by the reflow process during the transfer of the substrate from both sides of the substrate and forcibly exhausting the exhaust gas to the outside.
Description
The present invention relates to a reflow apparatus, and more particularly, to a reflow apparatus capable of easily forming heat during a reflow process, preventing deformation of the apparatus due to heat, and efficiently discharging exhaust gas from both sides of the substrate To the reflow apparatus.
Usually, the substrate soldering apparatus is for mounting electronic components on a substrate, and soldering is performed by a reflow apparatus.
Such a reflow apparatus is divided into a preheating region, a reflow region, and a cooling region, which are mounted before the soldering process.
The preheating area and the reflow area are provided with a heater and a fan, respectively, though not shown in the drawings.
The preheating area and the reflow area are provided with conveyors passing through these areas.
Accordingly, the substrate is moved along the conveyor, and the electronic component is mounted through the heat source of the heater in the preheating area and the reflow area.
That is, the substrate is coated with solder at every position where the electronic component is mounted before entering the preheating area. The solder is soldered through the preheat region and the reflow region, and the electronic component is installed at the soldered location.
A conventional reflow apparatus uses solder coated on a substrate using hot air (hereinafter referred to as "hot air") generated by a heater, a fan, Soldering is carried out by heating to the temperature range and then cooling.
That is, the reflow apparatus conveys the generated hot air to the solder on the substrate by using a convection method, which is one of the heat transfer methods, to heat the solder to the solder melting temperature range above the melting point thereof, And solidifies the electronic component to solder the electronic component on the substrate.
However, when the solder is melted only by the convection method using the hot air as described above and the electronic parts are soldered through the solder, various problems may occur.
For example, when the solder is melted only by a convection method using hot air, and the electronic parts are soldered through the solder, a part of the solder or flux contained in the solder may be splashed by the convected hot air or the like .
In the conventional reflow apparatus, heaters are provided at the upper and lower portions of the conveyor in the reflow region, so that the heat of the heaters is transferred to the substrate through the blower to be soldered, There are problems that are easily damaged.
That is, the heat source generated by the heater is usually at a temperature of 240 to 250 ° C., while the non-heat resistant part of the power related part has a lower critical temperature. Accordingly, in the case of a non-heat-resistant component, if the heat of the heater on the conveyor is directly applied to the non-heat-resistant component, the component is damaged and defective products are generated.
Here, the support for supporting the process line in the reflow line having the above characteristics is usually provided with an aluminum profile.
The conventional profile is exposed to the high temperature environment generated during the reflow process.
Therefore, in the past, when thermal deformation occurs along the axial direction of the profile as described above, there is a problem that the conveying path of the conveyor is twisted and the rigidity itself is reduced, and the device itself is damaged due to frequent deformation.
Further, the substrate generates flux gas by melting the solder paste while passing through the reflow region where the heater is installed.
The high-temperature air containing the flux gas is circulated in the apparatus, and is discharged to the outside of the apparatus through a separate exhaust apparatus provided at both sides of the apparatus.
Such an exhaust apparatus generally comprises an exhaust fan which is exposed to the top of the apparatus and driven to rotate, and a bellows-type exhaust pipe which connects the exhaust port on the upper portion and the upper nozzle top of the heater to the lower portion of the exhaust fan.
Subsequently, the flux gas in the apparatus is sucked into the exhaust pipe by the exhaust fan rotationally driven at the top of the apparatus and discharged to the outside through the exhaust port.
However, in the conventional exhaust system, the exhaust fan, which rotates at a high speed by the high-temperature air containing the flux gas, is easily overheated, shortening the lifespan of the exhaust fan. When the flux gas sticks to the wing of the exhaust fan, There is a problem in that the operation of the fan is stopped when the amount of sticking increases as well as the rotation is difficult.
Further, in the case of miniaturizing the reflow apparatus, there is a problem that it is difficult to miniaturize the apparatus because the apparatus is enlarged because it is necessary to further install an exhaust apparatus having a different configuration as described above.
A prior art related to the present invention is Korean Patent Laid-Open Publication No. 10-2006-0049599 (published on May 19, 2006), and the prior art discloses a reflow apparatus.
It is an object of the present invention to provide a reflow apparatus capable of easily forming heat during a reflow process, preventing deformation of the apparatus due to heat, and efficiently discharging exhaust gas from both sides of the substrate in a reflow process, .
In a preferred embodiment, the present invention provides a reflow apparatus.
The reflow apparatus includes a main body having a reflow region formed therein; A loading unit disposed at one side of the main body and loaded with the substrate; A heating unit installed in the main body and providing heat to perform a reflow process on the substrate positioned in the reflow region; A transfer unit installed in the main body to transfer the substrate; And a gas exhaust unit provided in the transfer unit, for sucking exhaust gas generated by the reflow process during the transfer of the substrate from both sides of the substrate and forcibly exhausting the exhaust gas to the outside.
The heating unit includes a base portion having a plurality of gas injection holes through which process gas supplied from the outside is injected, the base portion being formed of a metal; A heat radiation part laminated on the base part and having a plurality of through holes communicating with the plurality of gas injection holes and having surface increase grooves formed on the outer surface part; And a heating unit installed in the base unit and heating the base unit.
A plurality of gas supply pipes are formed at the lower end of the base to uniformly form gas supply holes, and both ends of the plurality of gas supply pipes are fixed to both ends of the base.
Wherein the heat radiation portion includes a heat radiation body which is stacked to be in close contact with an upper end of the base portion and the surface increase increasing grooves formed in a lattice shape on an outer surface portion of the heat radiation body, And is formed at the center of each of the surface-increasing grooves.
Preferably, each of the surface-increasing grooves has an inclined surface inclined upwards along four sides along an outer side with respect to the through-hole.
Wherein the transfer unit comprises: a pair of support portions arranged in pairs so as to face each other to transfer the substrate, the support portions being exposed in the reflow region and disposed at intervals; A conveyance body having opposite ends connected to the pair of supports and having a predetermined length; A tension shaft portion passing through the conveyance body and having both ends supported by the pair of supports; And an elastic portion provided on the pair of supporting portions and elastically supporting both ends of the tension shaft portion.
Wherein the support portion includes a pair of support members, wherein each of the pair of support members is provided with a cutout groove that is cut so as to be exposed upward, and the cutout groove is formed at a boundary of the rotation hole And the elastic portion is preferably disposed in the cutout groove.
The elastic portion may include an elastic spring disposed in the cutout groove in a state of being fitted to both ends of the tension shaft portion and having both side portions elastically supported on both side walls of the cutout groove.
Preferably, the elastic spring further comprises a spacing member, wherein the spacing member is disposed between the elastic spring and one side wall of both side walls of the cutout groove.
The gas exhaust unit may include a gas exhaust unit provided in the transfer unit and exhausting the exhaust gas including the smoke generated during the soldering to the outside through both sides of the substrate.
The gas discharging unit includes a plurality of exhaust holes formed in the pair of conveying unit bodies at intervals along the longitudinal direction and forming a discharging passage of the exhaust gas, a plurality of exhaust holes arranged at a lower end of the pair of conveying unit bodies, An exhaust line connected to the plurality of exhaust holes and connected to exhaust the exhaust gas to the outside, and an exhaust pump connected to the exhaust line to exhaust the exhaust gas to the outside.
Preferably, the exhaust line is disposed in each of the pair of conveyance body bodies and communicates with a plurality of exhaust holes formed in the conveyance body body.
The exhaust line is preferably provided with a trap for filtering foreign substances contained in the discharged exhaust gas.
The present invention provides radiant heat to a substrate transferred to a heating region to stably melt the solder, and has an effect of increasing the heat efficiency by increasing the heating area provided to the substrate.
1 is a perspective view showing a reflow apparatus of the present invention.
FIG. 2 is a schematic view showing the configuration of the reflow apparatus of the present invention. FIG.
3 is a perspective view showing a state in which a plurality of heating units for a reflow apparatus of the present invention are arranged.
4 is a perspective view showing a single heating unit for a reflow apparatus of the present invention.
5 is a perspective view schematically showing a configuration of a heating unit for a reflow apparatus of the present invention.
6 is a perspective view showing the configuration of the lower end portion of the base portion according to the present invention.
7 is a perspective view showing a heat radiation part according to the present invention.
8 is a plan view showing a heat radiation unit according to the present invention.
9 is a view showing a surface area increasing groove according to the present invention.
10 is a cross-sectional view showing a surface area increasing groove according to the present invention.
11 is a perspective view showing the transfer unit of the present invention.
12 is a perspective view showing a support according to the present invention.
13 is a partially cutaway perspective view showing a tension shaft and a transferring body according to the present invention.
14 is a view showing another example in which the tension shaft according to the present invention is installed.
15 is a view showing another example of the elastic portion according to the present invention.
16 is a perspective view showing a configuration of a gas exhaust apparatus for a reflow apparatus of the present invention.
17 is a perspective view showing the width-adjusted state of the gas exhaust apparatus for a reflow apparatus of the present invention.
18 is a perspective view showing a gas discharge portion according to the present invention.
19 is a view showing a plurality of exhaust holes according to the present invention.
20 is a perspective view showing another example of the gas discharge portion according to the present invention.
FIG. 21 is a view showing a state in which the exhaust block of FIG. 20 is rotatable.
22 is a view showing a configuration in which an exhaust hole according to the present invention is formed so as to face an upper end side portion and a lower end side portion of the conveyance body.
23 is a view showing a configuration in which an exhaust hole according to the present invention is inclined upward.
Hereinafter, a reflow apparatus of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a perspective view showing a reflow apparatus of the present invention, and FIG. 2 is a view schematically showing a configuration of a reflow apparatus of the present invention.
Referring to FIG. 1, the reflow apparatus of the present invention includes a
Each of the above configurations will be described.
In the
FIG. 3 is a perspective view showing a state where a plurality of heating units for a reflow apparatus of the present invention are arranged, and FIG. 4 is a perspective view showing a single heating unit for a reflow apparatus of the present invention.
3 and 4, the
The heating unit 200 'for a reflow apparatus of the present invention may be configured for each unit unit as shown in FIG.
That is, the heat dissipation area can be adjusted according to the number of unit units connected.
Next, each configuration of the present invention will be described.
The
Referring to FIGS. 5 and 6, the base 210 according to the present invention is formed of a metal and formed into a plate.
A plurality of gas injection holes 211 are formed in the
The plurality of gas injection holes 211 are formed to pass through the upper and lower portions at predetermined intervals.
Although not shown in the drawings, the gas injection holes 211 may be formed to have different sizes of holes depending on the puncturing positions.
The
Both ends of the
Although not shown in the drawing, the
The
Therefore, nitrogen gas can be supplied from the
A
The
Referring to FIG. 5, the
The
The plurality of
The
Accordingly, the
Also, although not shown in the drawing, the mounting position of the
The heat-
FIG. 7 is a perspective view showing a heat radiation unit according to the present invention, and FIG. 8 is a plan view showing a heat radiation unit according to the present invention.
7 and 8, the
The
The
The
The coupling may be coupled through a separate fastening member (not shown).
Further, a heat conduction layer may be further formed between the
The
Here, a plurality of through
The plurality of through
The plurality of through
FIG. 9 is a view showing a surface area increasing groove according to the present invention, and FIG. 10 is a sectional view showing a surface area increasing groove according to the present invention.
In particular, each of the surface-increasing
When the center of each of the
That is, since the inclined surface is formed in each of the
Therefore, the inclined plane S in the present invention may be formed of either a straight inclined plane or a curved inclined plane.
Of course, although not shown in the drawing, the slope S may be further provided with projections and protrusions for increasing the heat radiation area.
In addition, a planar area F having a set width can be formed at the boundary of each of the
In addition, the flat area F may be formed so that the width gradually narrows along the edge from the center of the
Thus, by providing more radiant heat to the edge region of the substrate located in the heating region, defective soldering due to heat loss in the edge region can be efficiently improved.
In addition, although not shown in the drawings, the through
As described above, since it is formed in a vortex shape, the injected nitrogen gas can be injected into the heating region in a shorter time, thereby improving the process efficiency.
Through the above-described configuration, the embodiment according to the present invention increases the heat efficiency by using the radiation heating method in which the substrate is heated, diffuses the heated heat through the heat radiation portion, The power consumption can be reduced and the volume of the facility can be miniaturized.
Meanwhile, although not shown in the drawings, the
The
The plurality of
Here, the
Accordingly, in the present invention, by controlling the driving of each of the
Accordingly, in the present invention, the heating temperature can be controlled differently in each of the divided regions in the heating region where the substrate is located.
The embodiment according to the present invention has an advantage that it is possible to easily solve the problem that the heating temperature difference in the entire area of the substrate is generated by controlling the driving of the power supply units by setting the heating temperature for each area or area of the substrate.
In the
11 is a perspective view showing the transfer unit of the present invention.
Referring to FIG. 11, the conveying
Each configuration will be described.
The
The pair of
The pair of
Each of the pair of
The supporting
The
The supporting
The through
The through
Both ends of the
FIG. 12 is a perspective view showing a support according to the present invention, and FIG. 13 is a partially cutaway perspective view showing a tension shaft and a conveyance body according to the present invention.
The
12 and 13, the
The
Both ends of the
The
Although not shown in the drawing, the
The vent holes may be formed by venting the pressure formed in the hollow in accordance with the external heat to prevent deformation.
Further, a reinforcing
The reinforcing
The tension shaft portion (330)
13 and 14, the
In the present invention, it is preferable that the tension shaft comprises two pieces.
Each of the tension shafts is installed so as to pass through the
Both ends of the tension shaft are projected to the outside through both ends of the conveying
Both ends of the tension shaft projecting through both ends of the conveying
The tension shaft according to the present invention comprises two tension shafts and is installed to penetrate the upper and lower ends of the
Therefore, a pair of through
Here, the pair of through
The
The
The
In addition, the elastic spring further includes a spacing
The spacing
Here, the spacing
The spacing
According to the above configuration, the spacing
In addition, the interval at which the holding
Referring to the above configuration, the transferring
In addition, the
Accordingly, the
At this time, the
Since the two tension shafts are installed to penetrate the upper and lower ends of the conveying
In addition, since both ends of the tension shaft are turnably supported by the pair of elastic springs in the present invention, there is an advantage that the length of the conveying
That is, the embodiment according to the present invention can maintain the rigidity above a certain level and reduce the volume by installing the tension shafts.
Therefore, there is an advantage that the reflow apparatus itself can be downsized.
14 is a view showing another example in which the tension shaft according to the present invention is installed.
Referring to FIG. 14, the
Further, the
Accordingly, rigidity at a plurality of positions of the
In addition, although not shown in the drawing, the
Accordingly, it is possible to increase the fastening force between the conveying
The elastic force of the elastic spring according to the present invention is preferably designed to be proportional to the diameter of the tension shaft.
15 is a view showing another example of the elastic portion according to the present invention.
The elastic part according to the present invention may use an elastic spring as described above, but an
In this case, the
Accordingly, in the present invention, when both ends of the
In addition, there is an advantage that the elastic force can be variably controlled by forming a certain pressure in the
According to the above construction and operation, in the embodiment according to the present invention, when the conveyor profile is cut by a required length by providing two or more tension shafts based on the pair of supports, It is possible to improve the responsiveness according to the deformation and the natural deformation according to the size of the profile, and to reduce the profile size itself, thereby achieving compactness of the apparatus.
The
FIG. 16 is a perspective view showing the structure of a gas exhaust apparatus for a reflow apparatus of the present invention, FIG. 17 is a perspective view showing a state of the gas exhaust apparatus for a reflow apparatus of the present invention in a width- FIG. 19 is a view showing a plurality of exhaust holes according to the present invention. FIG.
Referring to FIG. 16, the
Each of the above configurations will be described.
The
The
The
The pair of
The pair of conveying
In addition, the pair of
The width of the pair of conveying
Although not shown in the drawing, the width adjusting unit may include a cylinder shaft connected to the pair of conveying
Accordingly, the width of the pair of
Here, the width may be variably set according to the width of the substrate.
The
18 and 19, the
The
The plurality of
When the soldering is performed on the substrate, the
The
The
Particularly, the
Accordingly, the
In addition, on the
Next, the operation of the gas exhaust unit of the present invention having the above-described structure will be described.
Referring to Figs. 16-19, the substrate may be transferred and placed into the reflow region by the
Therefore, the substrate is exposed to a high temperature atmosphere, and soldering is performed in the high temperature atmosphere.
As the soldering is performed in this way, that is, smoke due to soldering is generated.
At this time, the
By the vacuum suction force, the exhaust gas including the smoke generated as described above is forcibly introduced into the plurality of
Then, the forcedly flowing exhaust gas flows along the
The foreign substances contained in the exhaust gas flowing are trapped by the
The exhaust gas filtered by the foreign matter can be discharged to the outside while being moved along the
According to the configuration and operation of the exhaust gas purifier, the embodiment of the present invention can advance the reflow process and the generated exhaust gas quickly to the outside through the transfer unit located on both sides of the substrate.
Therefore, in the present invention, when the exhaust gas is exhausted, it is possible to reduce the size of the device by enlarging the size of the device by installing a separate exhaust device.
20 is a perspective view showing another example of the gas discharge portion according to the present invention.
Referring to FIG. 20, the
The
For example, the
Accordingly, the
FIG. 21 is a view showing a state in which the exhaust block of FIG. 20 is rotatable.
Referring to FIG. 21, the
Of course, the hinge stage H is connected to the rotary shaft of the
Accordingly, in the present invention, by vertically adjusting the up-and-down rotational position of the
In addition, although not shown in the drawings, the exhaust holes according to the present invention may be formed as holes in the vortex pattern so as to increase the flow velocity upon inflow of the exhaust gas so as to be discharged quickly.
22 is a view showing a configuration in which an exhaust hole according to the present invention is formed so as to face an upper end side portion and a lower end side portion of the conveyance body.
22, the exhaust holes 421 according to the present invention may be formed at the upper and lower ends of the
Accordingly, in the present invention, the exhaust gas generated during the reflow process can be simultaneously discharged from the upper and lower portions of the substrate, and the gas remaining in the lower portion of the substrate can be easily discharged to the outside without being discharged.
23 is a view showing a configuration in which an exhaust hole according to the present invention is inclined upward.
Referring to FIG. 23, the exhaust holes 421 'according to the present invention may be formed to be inclined upward from the upper end side of the
According to this configuration, the smoke generated by the soldering flows to the upper portion, and at this time, the smoke flowing upward can more easily be forcedly introduced and discharged efficiently to the outside.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.
Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by the scope of the appended claims and equivalents thereof.
It is to be understood that the foregoing embodiments are illustrative and not restrictive in all respects and that the scope of the present invention is indicated by the appended claims rather than the foregoing description, It is intended that all changes and modifications derived from the equivalent concept be included within the scope of the present invention.
100:
200: Heating unit
210: Base portion
220: heat radiation part
221: heat radiation body
222: surface increase groove
230:
300: Feed unit
310: Support
311; Supporting member
320: feeder body
330: tension shaft part (tension shaft)
340: elastic part
341:
350: elastic cylinder
400: gas exhaust unit
420: gas discharge portion
421: Exhaust hole
Claims (13)
A loading unit disposed at one side of the main body, the loading unit loading the substrate;
A heating unit installed in the main body and providing heat to perform a reflow process on the substrate positioned in the reflow area;
A transfer unit installed in the main body to transfer the substrate; And
And a gas exhaust unit which is provided in the transfer unit and sucks exhaust gas generated by the reflow process during the transfer of the substrate from both sides of the substrate and forcibly exhausts the exhaust gas to the outside,
The transfer unit is disposed in a pair so as to face each other to transfer the substrate,
A pair of supporting portions exposed in the reflow region and disposed at intervals;
A conveyance body having opposite ends connected to the pair of supports and having a predetermined length;
A tension shaft portion passing through the conveyance body and having both ends supported by the pair of supports; And
And an elastic portion provided on the pair of supporting portions and elastically supporting both ends of the tension shaft portion.
In the heating unit,
A base portion having a plurality of gas injection holes through which a process gas supplied from the outside is injected, the base portion being formed of a metal;
A heat radiation part laminated on the base part and having a plurality of through holes communicating with the plurality of gas injection holes and having surface increase grooves formed on the outer surface part;
And a heating unit installed in the base unit and heating the base unit.
A plurality of gas supply pipes are formed at the lower end of the base to uniformly form gas supply holes,
Wherein both ends of the plurality of gas supply pipes are fixed to both ends of the base portion.
The heat-
A heat radiation body laminated to be in close contact with an upper end of the base,
And the surface increase grooves formed in a lattice shape on an outer surface portion of the heat radiation body,
And each of the plurality of through holes is formed at the center of each of the surface-increasing grooves.
Wherein each of the surface-
And a sloped surface inclined upwards along four sides along an outer side with respect to the through hole.
The support portion
And a pair of support members,
In each of the pair of support members,
A cutting groove is formed so as to be exposed upward,
A rotation hole through which the tension shaft is inserted is formed with the cutout groove as a boundary,
And the elastic portion is disposed in the cutout groove.
The elastic portion
And an elastic spring which is disposed in the cutout groove in a state of being fitted to both ends of the tension shaft and whose both sides are elastically supported on both side walls of the cutout groove.
The elastic spring
Further comprising a spacing member,
Wherein the spacing member is disposed between the elastic spring and one side wall of both side walls of the cutout groove.
The gas exhaust unit includes:
And a gas discharging unit provided in the transporting unit and discharging exhaust gas including smoke generated during soldering to the outside through both side portions of the substrate.
The gas-
A plurality of exhaust holes formed in the pair of conveyance unit bodies at intervals along the longitudinal direction and forming a discharge passage for the exhaust gas,
An exhaust line disposed at a lower end of the pair of conveyance body bodies and connected to the plurality of exhaust holes and connected to exhaust the exhaust gas to be exhausted;
And an exhaust pump connected to the exhaust line for discharging the exhaust gas to the outside.
The exhaust line
And a plurality of exhaust holes formed in the pair of conveyance body bodies and communicated with a plurality of exhaust holes formed in the conveyance body.
In the exhaust line,
Wherein a trap for filtering foreign matter contained in the exhaust gas is installed.
Priority Applications (1)
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KR1020160030538A KR101791868B1 (en) | 2016-03-14 | 2016-03-14 | Reflow apparatus |
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KR1020160030538A KR101791868B1 (en) | 2016-03-14 | 2016-03-14 | Reflow apparatus |
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KR101791868B1 true KR101791868B1 (en) | 2017-11-01 |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3229533B2 (en) * | 1995-12-28 | 2001-11-19 | 日本電熱計器株式会社 | Reflow soldering method and reflow soldering device |
KR101375920B1 (en) * | 2011-06-17 | 2014-03-18 | 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 | Apparatus and method for providing an inerting gas during soldering |
-
2016
- 2016-03-14 KR KR1020160030538A patent/KR101791868B1/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3229533B2 (en) * | 1995-12-28 | 2001-11-19 | 日本電熱計器株式会社 | Reflow soldering method and reflow soldering device |
KR101375920B1 (en) * | 2011-06-17 | 2014-03-18 | 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 | Apparatus and method for providing an inerting gas during soldering |
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