KR101791643B1 - Manufacture method of substrate layer and tape - Google Patents
Manufacture method of substrate layer and tape Download PDFInfo
- Publication number
- KR101791643B1 KR101791643B1 KR1020160002811A KR20160002811A KR101791643B1 KR 101791643 B1 KR101791643 B1 KR 101791643B1 KR 1020160002811 A KR1020160002811 A KR 1020160002811A KR 20160002811 A KR20160002811 A KR 20160002811A KR 101791643 B1 KR101791643 B1 KR 101791643B1
- Authority
- KR
- South Korea
- Prior art keywords
- base layer
- thermally expandable
- expandable microspheres
- composition
- heating
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 239000010410 layer Substances 0.000 claims description 87
- 229920000103 Expandable microsphere Polymers 0.000 claims description 51
- 239000000203 mixture Substances 0.000 claims description 46
- 238000010438 heat treatment Methods 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 238000005187 foaming Methods 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 239000011230 binding agent Substances 0.000 claims description 12
- 239000003431 cross linking reagent Substances 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 11
- 239000006260 foam Substances 0.000 claims description 11
- 239000003086 colorant Substances 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 229930195733 hydrocarbon Natural products 0.000 claims description 8
- 150000002430 hydrocarbons Chemical class 0.000 claims description 8
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000004005 microsphere Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000004088 foaming agent Substances 0.000 claims description 5
- 150000004820 halides Chemical class 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 238000009835 boiling Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 11
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- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- QNILTEGFHQSKFF-UHFFFAOYSA-N n-propan-2-ylprop-2-enamide Chemical compound CC(C)NC(=O)C=C QNILTEGFHQSKFF-UHFFFAOYSA-N 0.000 description 1
- XFHJDMUEHUHAJW-UHFFFAOYSA-N n-tert-butylprop-2-enamide Chemical compound CC(C)(C)NC(=O)C=C XFHJDMUEHUHAJW-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- UOMUPDCRXJLVGR-UHFFFAOYSA-N propane-1,2,2-triol Chemical compound CC(O)(O)CO UOMUPDCRXJLVGR-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N sec-butylidene Natural products CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- ZMANZCXQSJIPKH-UHFFFAOYSA-N triethylamine Natural products CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 1
- 238000004260 weight control Methods 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; CARE OF BIRDS, FISHES, INSECTS; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K63/00—Receptacles for live fish, e.g. aquaria; Terraria
- A01K63/04—Arrangements for treating water specially adapted to receptacles for live fish
- A01K63/045—Filters for aquaria
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/22—After-treatment of expandable particles; Forming foamed products
- C08J9/228—Forming foamed products
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; CARE OF BIRDS, FISHES, INSECTS; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K63/00—Receptacles for live fish, e.g. aquaria; Terraria
- A01K63/003—Aquaria; Terraria
- A01K63/006—Accessories for aquaria or terraria
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
- B01D35/02—Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/001—Processes for the treatment of water whereby the filtration technique is of importance
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
- C08J9/101—Agents modifying the decomposition temperature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/12—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
- C08J9/14—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic
- C08J9/143—Halogen containing compounds
-
- C09J7/0225—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/02—Permanent magnets [PM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2325/00—Details relating to properties of membranes
- B01D2325/02—Details relating to pores or porosity of the membranes
- B01D2325/026—Sponge structure
-
- C09J2201/122—
-
- C09J2201/128—
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Polymers & Plastics (AREA)
- Environmental Sciences (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Marine Sciences & Fisheries (AREA)
- Manufacturing & Machinery (AREA)
- Biodiversity & Conservation Biology (AREA)
- Animal Husbandry (AREA)
- Water Supply & Treatment (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
본 발명은 기재층을 포함하는 테이프의 제조방법에 관한 것이다. 본 발명의 방법에 따라 제조된 기재층을 포함하는 테이프는, 기재층 제조용 조성물을 기재층으로서 포함함에 따라, 내한성, 내열성, 내구성, 충격흡수성, 방수성, 내반발성 등의 물성이 향상되면서도 피착제와의 간극밀착성이 우수하게 유지되는 것이 특징이다.The present invention relates to a method of producing a tape comprising a substrate layer. The tape comprising the substrate layer produced according to the method of the present invention has improved properties such as cold resistance, heat resistance, durability, impact absorbability, water resistance and resistance to repulsion, The gap adhesion between the substrate and the substrate is excellent.
Description
본 발명은 기재층 제조방법 및 테이프 제조방법에 관한 것이다.The present invention relates to a substrate layer production method and a tape manufacturing method.
휴대전화, 휴대형 게임기 등의 휴대 전자 기기나, 텔레비전, 퍼스널 컴퓨터용 디스플레이 등의 전자기기에 있어서, 기재층을 갖는 아크릴폼 테이프가 사용되고 있다. 일례로서, 대한민국 공개특허 2008-0060544호에서는 소정 두께의 아크릴폼층, 상기 아크릴폼층의 양면 중 일면에 형성되는 기재층, 상기 기재층의 일면에 형성되는 감압형 점착제층, 및 상기 감압형 점착제층에 형성되는 이형지로 구성도는 것을 특징으로 하는 기재층을 갖는 양면 아크릴폼 테이프를 제시하고 있다.BACKGROUND ART An acrylic foam tape having a substrate layer is used in portable electronic devices such as mobile phones and portable game machines and electronic devices such as televisions and displays for personal computers. For example, in Korean Patent Laid-Open Publication No. 2008-0060544, an acrylic pressure-sensitive adhesive layer formed on one side of an acrylic foam layer having a predetermined thickness, a base layer formed on one side of both sides of the acrylic foam layer, a pressure- The present invention also provides a double-faced acrylic foam tape having a substrate layer, which is constituted by a releasing paper to be formed.
그러나, 상기 선행문헌을 포함하여 종래 아크릴폼층을 기초로 한 기재층의 경우 충격흡수성, 내반발성, 피착제와의 간극밀착성에서 당해 기술분야의 요구에 부응하지 못하였다. 또한, 종래 기재층을 포함하는 테이프를 저온 또는 고온에 두었을 경우 테이프의 물성이 저하되는 경우가 발생하는 것을 비롯하여 다변화된 조건에 대응하지 못하는 문제점을 보였다. 그로 인해 내한성, 내열성, 방수성, 충격흡수성 및 내구성 향상에 대한 필요성이 대두되었고, 이를 개선시키고자 하는 연구가 활발히 진행되고 있으나, 이를 해결한 기술을 아직까지 제시되지 못하고 있다.However, in the case of the base layer based on the conventional acrylic foam layer including the above-mentioned prior art documents, it has not been able to meet the requirements of the related art in terms of shock absorbing property, anti-rebound property, and gap adhesion with the adherend. In addition, when the tape including the conventional base layer is placed at a low temperature or a high temperature, the physical properties of the tape may be lowered, and the tape can not cope with the diversified conditions. As a result, there has been a need for improvement of cold resistance, heat resistance, waterproofness, impact absorbability and durability, and studies have been actively carried out to improve these properties.
본 발명은 전술한 문제점을 해결하기 위하여 안출된 것으로서, 내한성, 내열성, 내구성, 충격흡수성, 방수성, 내반발성 등의 물성이 향상되면서도 피착제와의 간극밀착성이 우수하게 유지되는 기재층 제조방법 및 테이프 제조방법을 제공함에 목적이 있다.Disclosure of Invention Technical Problem [8] The present invention has been made to solve the above-mentioned problems and it is an object of the present invention to provide a base layer production method in which physical properties such as cold resistance, heat resistance, durability, impact absorbability, water resistance and resistance to repulsion are improved and gap- It is an object of the present invention to provide a tape manufacturing method.
전술한 본 발명의 목적은 바인더 수지 및 열팽창성 미소구를 혼합하여 기재층 제조용 조성물을 제조하는 단계 및 상기 기재층 제조용 조성물을 가열하여 열팽창성 미소구를 발포시키는 단계를 포함하는 기재층 제조방법을 제공함에 따라 달성할 수 있다. The object of the present invention described above is achieved by a method for producing a substrate layer comprising mixing a binder resin and a thermally expandable microsphere to prepare a composition for producing a base layer and heating the composition for preparing a base layer to foam the thermally expandable microspheres Can be achieved.
본 발명의 다른 바람직한 특징에 의하면, 상기 열팽창성 미소구를 발포시키기 전에 기재의 일면 또는 양면에 상기 기재층 제조용 조성물을 적층시키는 단계를 더 포함할 수 있다. According to another preferred feature of the present invention, it is possible to further include a step of laminating the composition for preparing a substrate layer on one side or both sides of the substrate before foaming the thermally expandable microspheres.
본 발명의 또 다른 바람직한 특징에 의하면, 상기 열팽창성 미소구를 발포시키는 단계는 상기 열팽창성 미소구가 100 내지 170 ℃가 되도록 상기 기재층 제조용 조성물을 가열할 수 있다. According to another preferred aspect of the present invention, the step of foaming the thermally expandable microspheres may heat the composition for preparing a substrate layer such that the thermally expandable microspheres have a temperature of 100 to 170 ° C.
본 발명의 또 다른 바람직한 특징에 의하면, 상기 열팽창성 미소구는 열가소성 수지로 이루어지는 외각과, 상기 외각에 내포되며 열가소성 수지의 연화점 이하의 비등점을 갖는 발포제로 구성되며, 상기 발포제는 탄소수 1 내지 12의 탄화수소, 탄소수 1 내지 12의 탄화수소의 할로겐화물 및 가열에 의해 열분해하여 가스를 생성하는 화합물로 이루어진 군으로부터 선택되는 1종을 포함할 수 있다. According to another preferred feature of the present invention, the thermally expandable microspheres are composed of an outer shell made of a thermoplastic resin and a blowing agent contained in the outer shell and having a boiling point lower than the softening point of the thermoplastic resin, wherein the blowing agent is a hydrocarbon having 1 to 12 carbon atoms , Halides of hydrocarbons having 1 to 12 carbon atoms, and compounds capable of pyrolyzing by heating to produce a gas.
본 발명의 또 다른 바람직한 특징에 의하면, 상기 기재층 제조용 조성물을 제조하는 단계는 상기 바인더 수지 및 상기 열팽창성 미소구에 가교제와 착색제 중 적어도 하나를 첨가하는 단계를 포함할 수 있다. According to another preferred feature of the present invention, the step of preparing the base layer composition may include adding at least one of a crosslinking agent and a coloring agent to the binder resin and the thermally expandable microspheres.
본 발명의 또 다른 바람직한 특징에 의하면, 상기 열팽창성 미소구의 평균 입자 지름은 5~50㎛일 수 있다. According to another preferred aspect of the present invention, the average particle diameter of the thermally expandable microspheres may be 5 to 50 탆.
본 발명의 또 다른 바람직한 특징에 의하면, 상기 열팽창성 미소구의 발포율은 자기체적 대비 2 내지 20일 수 있다. According to another preferred feature of the present invention, the expansion ratio of the thermally expandable microspheres may be 2 to 20 times the magnetic volume.
본 발명의 또 다른 바람직한 특징에 의하면, 상기 열팽창성 미소구는 가열에 의해 밀도가 감소할 수 있다. According to another preferred feature of the present invention, the thermally expandable microspheres can be reduced in density by heating.
한편, 전술한 본 발명의 목적은 이형필름의 일면에 점착층을 형성하는 단계 및 본 발명에 따른 제조방법에 의해 제조된 기재층의 일면 또는 양면에 상기 점착층이 형성된 이형필름을 합지하는 단계를 포함하는 테이프 제조방법을 제공함에 의해 달성될 수 있다. It is another object of the present invention to provide a method for manufacturing a pressure-sensitive adhesive tape, which comprises the steps of forming a pressure-sensitive adhesive layer on one side of a release film, and laminating a release film having the pressure-sensitive adhesive layer on one side or both sides of the base layer produced by the manufacturing method according to the present invention The present invention provides a method of manufacturing a tape.
본 발명에 따른 기재층 제조방법 및 테이프 제조방법에 의하면, 기재층 및 테이프가 기재층 제조용 조성물을 포함하기 때문에 내한성, 내열성, 내구성, 충격흡수성, 방수성, 내반발성 등의 물성이 향상되면서도 피착제와의 간극밀착성이 우수하게 유지될 수 있다. According to the method for producing a base layer and the method for producing a tape according to the present invention, since the base layer and the tape comprise the base layer composition, the physical properties such as cold resistance, heat resistance, durability, impact absorbability, water resistance and anti- Can be kept excellent.
이하에서는 본 발명의 바람직한 실시예에 관하여 첨부도면을 참조하여 상세하게 설명하기로 한다. 다만, 이하에서 설명되는 실시예는 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 발명을 쉽게 실시할 수 있을 정도로 상세하게 설명하기 위한 것에 불과하며, 이로 인해 본 발명의 보호범위가 한정되는 것을 의미하지는 않는다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It is to be understood, however, that the embodiments described below are only for explanation of the embodiments of the present invention so that those skilled in the art can easily carry out the invention, It does not mean anything.
본 발명은 기재층 제조방법 및 테이프 제조방법에 관한 것이다. 먼저 기재층 제조방법에 대하여 상세하게 설명한 후 테이프 제조방법에 대해 설명하기로 한다. The present invention relates to a substrate layer production method and a tape manufacturing method. First, the method for manufacturing a base layer will be described in detail and then the tape manufacturing method will be described.
이하, 본 발명에 따른 기재층 제조방법을 상세히 설명한다.Hereinafter, a method for producing a substrate layer according to the present invention will be described in detail.
본 발명에 따른 기재층 제조방법은 바인더 수지 및 열팽창성 미소구를 혼합하여 기재층 제조용 조성물을 형성하는 단계와, 기재층 제조용 조성물을 가열하여 열팽창성 미소구를 발포시키는 단계를 포함하는 기재층 제조방법을 제공한다.The method for producing a base layer according to the present invention comprises the steps of forming a composition for preparing a base layer by mixing a binder resin and a thermally expandable microspheres, and heating the composition for base layer formation to foam the thermally expandable microspheres. ≪ / RTI >
바인더 수지는 아크릴계 모노머로 중합된 공중합체 수지로서, 메틸(메타)아크릴레이트, 에틸아크릴레이트, 부틸아크릴레이트, 2-에틸헥실아크릴레이트 및 라우릴아크릴레이트로 이루어진 군으로부터 선택되는 1종 이상을 중합하여 얻어지는 것일 수 있다.The binder resin is a copolymer resin polymerized with an acrylic monomer and at least one selected from the group consisting of methyl (meth) acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate and lauryl acrylate is polymerized . ≪ / RTI >
또한 히드록시기를 갖는 모노머, 아미드기를 갖는 모노머, 3차 아민기를 갖는 모노머, 및 카르복실기를 갖는 모노머 중 선택되는 모노머 1종 이상을 중합하여 얻어지는 것일 수 있다. 이때, 모노머는 전체 조성물 기준으로 0.1 내지 50중량% 포함될 수 있게, 바람직하게는 1 내지 20중량%가 포함될 수 있게 혼합될 수 있다.And may be obtained by polymerizing at least one monomer selected from a monomer having a hydroxyl group, a monomer having an amide group, a monomer having a tertiary amine group, and a monomer having a carboxyl group. At this time, the monomer may be mixed so as to include 0.1 to 50 wt%, preferably 1 to 20 wt%, based on the total composition.
히드록시기를 갖는 단량체로는 2-히드록시에틸(메타)아크릴레이트, 2-히드록시프로필(메타)아크릴레이트, 2-드록시부틸(메타)아크릴레이트, 4-히드록시부틸(메타)아크릴레이트, 6-히드록시헥실(메타)아크릴레이트, 2-히드록시에틸렌글리콜(메타), 아크릴레이트, 2-히드록시프로필렌글리콜(메타)아크릴레이트, 알킬렌기의 탄소수가 2-4인 히드록시알킬렌글리콜(메타)아크릴레이트, 4-히드록시부틸비닐에테르, 5-히드록시펜틸비닐에테르, 6-히드록시헥실비닐에테르, 7-히드록시헵틸비닐에테르, 8-히드록시옥틸비닐에테르, 9-히드록시노닐비닐에테르, 10-히드록시데실비닐에테르 등을 들 수 있다.Examples of the monomer having a hydroxy group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-deoxybutyl (meth) acrylate, 4-hydroxybutyl Acrylate, 2-hydroxypropyleneglycol (meth) acrylate, hydroxyalkylene glycol (meth) acrylate having 2 to 4 carbon atoms in the alkylene group, (Meth) acrylate, 4-hydroxybutyl vinyl ether, 5-hydroxypentyl vinyl ether, 6-hydroxyhexyl vinyl ether, 7-hydroxyheptyl vinyl ether, 8-hydroxyoctyl vinyl ether, Nonyl vinyl ether, 10-hydroxydecyl vinyl ether, and the like.
아미드기를 갖는 단량체로는 (메타)아크릴아미드, N-이소프로필아크릴아미드, N-3차부틸아크릴아미드, 3-히드록시프로필(메타)아크릴아미드, 4-히드록시부틸(메타)아크릴아미드, 6-히드록시헥실(메타)아크릴아미드, 8-히드록시옥틸(메타)아크릴아미드, 2-히드록시에틸헥실(메타)아크릴아미드 등을 들 수 있으며, 이들중에서 (메타)아크릴아미드가 바람직하다.Examples of the monomer having an amide group include (meth) acrylamide, N-isopropyl acrylamide, N-tertiary butyl acrylamide, 3-hydroxypropyl (meth) acrylamide, 4-hydroxybutyl (Meth) acrylamide, 8-hydroxyoctyl (meth) acrylamide and 2-hydroxyethylhexyl (meth) acrylamide. Of these, (meth) acrylamide is preferable.
3차 아민기를 갖는 단량체로는 N,N-(디메틸아미노)에틸(메타)아크릴레이트, N,N-(디에틸아미노)에틸(메타)아크릴레이트, N,N-(디메틸아미노)프로필(메타)아크릴레이트 등을 들 수 있다.Examples of the monomer having a tertiary amine group include N, N- (dimethylamino) ethyl (meth) acrylate, N, N- (diethylamino) ethyl (meth) ) Acrylate, and the like.
카르복실기를 갖는 단량체로는 아크릴 산, 메타크릴 산, 이타콘 산, 무수 말레인산 등이 바람직하다.As the monomer having a carboxyl group, acrylic acid, methacrylic acid, itaconic acid, maleic anhydride and the like are preferable.
공중합체의 제조방법은 특별히 한정되지 않으며, 당 분야에서 통상적으로 사용되는 괴상중합, 용액중합, 유화중합 또는 현탁중합 등의 방법을 이용하여 제조할 수 있으며, 용액중합이 바람직하다. 또한, 중합 시 통상 사용되는 용매, 중합개시제, 분자량 제어를 위한 연쇄이동제 등을 사용할 수 있다.The method for producing the copolymer is not particularly limited and can be produced by methods such as bulk polymerization, solution polymerization, emulsion polymerization or suspension polymerization, which are commonly used in the art, and solution polymerization is preferable. In addition, a solvent, a polymerization initiator, a chain transfer agent for molecular weight control and the like which are usually used in polymerization can be used.
본 발명에 있어 열팽창성 미소구는 열가소성 수지를 외각으로 하고, 그 내부에 발포제가 봉입된 구조를 갖는다. 구체적으로 상기 열팽창성 미소구는 밀폐기포 (Closed-cell) 형태를 갖는다.In the present invention, the thermally expandable microspheres have a structure in which the thermoplastic resin is outer shell and the foaming agent is enclosed therein. Specifically, the thermally expandable microspheres have a closed-cell shape.
열가소성 수지는 니트릴계 단량체, 카르복실기를 함유하는 단량체, 염화 비닐리덴, 초산비닐, (메타)아크릴산 에스테르계 단량체, 스티렌계 단량체, 아크릴아미드계 단량체 및 말레이미드계 단량체로부터 선택되는 1종 이상을 포함하는 것으로부터 중합하여 얻어지는 것일 수 있으며, 바람직하게는 니트릴계 단량체로부터 중합하여 얻어지는 것일 수 있다.The thermoplastic resin includes at least one selected from a nitrile monomer, a carboxyl group-containing monomer, vinylidene chloride, vinyl acetate, a (meth) acrylic acid ester monomer, a styrene monomer, an acrylamide monomer and a maleimide monomer , And preferably one obtained by polymerization from a nitrile-based monomer.
발포제는 외각에 내포되어 열가소성 수지의 연화점 이하의 비등점을 가지며, 가열 시 발포됨에 따라 기재층 제조용 조성물의 내충격성, 내반발성, 피착제와 간극 밀착성을 향상시킬 수 있는 것이 특징이다.The foaming agent is contained in the outer shell and has a boiling point of not higher than the softening point of the thermoplastic resin and is characterized by being able to improve impact resistance, anti-repulsion property, adhesion agent and gap adhesion property of the base layer composition as it is foamed upon heating.
발포제는 탄소수 1 내지 12의 탄화수소, 탄소수 1 내지 12의 탄화수소의 할로겐화물 및 가열에 의해 열분해하여 가스를 생성하는 화합물로 이루어진 군으로부터 선택되는 1종을 포함할 수 있다. The foaming agent may include one selected from the group consisting of hydrocarbons having 1 to 12 carbon atoms, halides of hydrocarbons having 1 to 12 carbon atoms, and compounds capable of pyrolyzing by heating to produce a gas.
구체적으로, 상기 탄소수 1 내지 12의 탄화수소는 프로판, 시클로 프로판, 프로필렌, 노멀부탄, 이소부탄, 시클로부탄, 노멀펜탄, 시클로펜탄, 이소펜탄, 네오페탄, 노멀헥산, 이소헥산, 시클로헥산, 헵탄, 시클로헵탄, 옥탄, 이소옥탄, 시클로옥탄, 2-메틸 펜탄, 2,2-디메틸 부탄, 석유 에테르 등이 있다.Specifically, the hydrocarbon having 1 to 12 carbon atoms is preferably selected from the group consisting of propane, cyclopropane, propylene, normal butane, isobutane, cyclobutane, normal pentane, cyclopentane, isopentane, neopentane, normal hexane, isohexane, cyclohexane, Cycloheptane, octane, isooctane, cyclooctane, 2-methylpentane, 2,2-dimethylbutane, petroleum ether and the like.
탄소수 1 내지 12의 탄화수소의 할로겐화물은 염화 메틸, 염화메틸렌, 클로로포름, 4염화 탄소 등이 있다.Halides of hydrocarbons having 1 to 12 carbon atoms include methyl chloride, methylene chloride, chloroform, carbon tetrachloride, and the like.
가열에 의해 열분해하여 가스를 생성하는 화합물로는 아조디카르본아미드, N,N`-디니트로소펜타메틸렌테트라민, 4,4`-옥시비스(벤젠술포닐하이드라이드)등 이 있다.Examples of the compound which pyrolyzes by heating to generate a gas include azodicarbonamide, N, N'-dinitrosopentamethylenetetramine, 4,4'-oxybis (benzenesulfonylhydride) and the like.
기재층 제조용 조성물을 가열하면 열팽창성 미소구가 발포될 수 있다. 즉, 열팽창성 미소구는 가열에 의해 발포될 수 있다. 열팽창성 미소구는 발포온도에서 발포될 수 있다. 열팽창성 미소구의 발포 온도는 100 내지 170℃, 바람직하게는 100 내지 150℃ 일 수 있다. 따라서 열팽창성 미소구의 발포를 위해 기재층 제조용 조성물을 100 내지 170℃, 바람직하게는 100 내지 150℃가 되도록 가열할 수 있다. When the composition for making the base layer is heated, the thermally expandable microspheres can be foamed. That is, the thermally expandable microspheres can be foamed by heating. The thermally expandable microspheres can be foamed at the foaming temperature. The foaming temperature of the thermally expandable microspheres may be 100-170 캜, preferably 100-150 캜. Therefore, for the foaming of the thermally expandable microspheres, the composition for preparing the base layer may be heated to 100 to 170 占 폚, preferably 100 to 150 占 폚.
본 발명은 발포되기 전 열팽창성 미소구와 바인더 수지를 함유하는 기재층 제조용 조성물을 특정 온도가 되도록 가열함으로써, 열팽창성 미소구의 발포를 유발함에 따라 기재층의 점착력 등의 물성을 개선시킨 것이다. 즉, 기재층의 물성을 개선하기 위해 기재층 제조용 조성물을 상기 범위의 온도가 되도록 가열할 수 있다.The present invention improves the physical properties such as the adhesive strength of the substrate layer as the thermally expandable microspheres are foamed by heating the composition for preparing the base layer containing the thermally expandable microspheres and the binder resin to a specific temperature before foaming. That is, in order to improve the physical properties of the base layer, the base layer composition may be heated to the above-mentioned range of temperatures.
열팽창성 미소구는 가열에 의해 밀도가 감소될 수 있으며, 가열 후의 열팽창성 미소구의 밀도는 가열 전 대비 0.01 내지 0.5 g/cm3 정도 감소될 수 있다.The density of the thermally expandable microspheres can be reduced by heating, and the density of the heat-expandable microspheres after heating can be reduced by about 0.01 to 0.5 g / cm 3 compared to before heating.
열팽창성 미소구의 발포율은 자기체적 대비 2 내지 50, 바람직하게는 2 내지 20인 것일 수 있다.The expansion ratio of the thermally expanding microspheres may be from 2 to 50, preferably from 2 to 20, based on the magnetic volume.
열팽창성 미소구의 입자크기는 1 내지 100㎛, 바람직하게는 5 내지 50㎛일 수 있다.The particle size of the thermally expandable microspheres may be 1 to 100 탆, preferably 5 to 50 탆.
열팽창성 미소구는 바인더 수지 100중량부에 대하여 1 내지 15중량부로 혼합될 수 있으며, 바람직하게는 2 내지 7중량부로 혼합될 수 있다. 상기 기준으로 열팽창성 미소구가 혼합되어 기재층 제조용 조성물에 포함되는 경우 점착력, 내열성, 내한성 등의 면에서 더 우수한 효과를 나타낸다.The thermally expandable microspheres may be mixed in an amount of 1 to 15 parts by weight, preferably 2 to 7 parts by weight, based on 100 parts by weight of the binder resin. When the thermally expandable microspheres are mixed according to the above-mentioned criteria and are included in the composition for preparing a base layer, they exert more excellent effects in terms of adhesion, heat resistance and cold resistance.
기재층 제조용 조성물을 제조하는 단계는 바인더 수지 및 열팽창성 미소구에 가교제를 첨가하는 단계를 포함할 수 있다. 또한 바인더 수지 및 열팽창성 미소구에 착색제를 혼합하는 단계를 포함할 수 있다. 가장 바람직하게는 기재층 제조용 조성물을 제조하는 단계는 바인더 수지 및 열팽창성 미소구에 가교제 및 착색제를 첨가하는 단계를 포함할 수 있다. The step of preparing the composition for making the base layer may include adding a crosslinking agent to the binder resin and the thermally expandable microspheres. And mixing the binder resin and the thermally expandable microspheres with the colorant. Most preferably, the step of preparing the composition for making a base layer may include the step of adding a crosslinking agent and a coloring agent to the binder resin and the thermally expansible microspheres.
가교제는 화학 결합에 의해 기재층 제조용 조성물의 응집력 또는 점착 강도를 보강하여 내구성을 부여하기 위한 성분이다. 가교제로 이소시아네이트계 화합물, 에폭시계 화합물 등이 포함될 수 있으며, 이들은 단독 또는 2종 이상 혼합하여 사용할 수 있다. 이소시아네이트계 화합물 등이 포함됨에 따라 내열성을 향상시킬 수 있다.The crosslinking agent is a component for imparting durability by reinforcing the cohesive strength or the adhesive strength of the composition for the base layer formation by chemical bonding. The crosslinking agent may include an isocyanate compound, an epoxy compound, and the like, and these may be used alone or in combination of two or more. An isocyanate-based compound, and the like, the heat resistance can be improved.
이소시아네이트계 화합물로는 톨릴렌디이소시아네이트, 자일렌디이소시아네이트, 2,4-디페닐메탄디이소시아네트, 4,4-디페닐메탄디이소시아네트, 헥사메틸렌디이소시아네이트, 이소포론디이소시아네이트, 테트라메틸자일렌디이소시아네이트, 나프탈렌디이소시아네이트 등의 디이소시아네이트화합물, 트리메틸올프로판 등의 다가 알콜계 화합물 1몰에 디이소시아네이트 화합물 3몰을 반응시킨 부가체, 디이소시아네이트 화합물 3몰을 자기 축합시킨 이소시아누레이트체, 디이소시아네이트 화합물 3몰 중 2몰로부터 얻어지는 디이소시아네이트 우레아에 나머지 1몰의 디이소시아네이트가 축합된 뷰렛체, 트리페닐메탄트리이소시아네이트, 메틸렌비스트리이소시아네이트 등의 3개의 관능기를 함유하는 다관능 이소시아네이트 화합물 등을 들 수 있다.Examples of the isocyanate compound include tolylene diisocyanate, xylene diisocyanate, 2,4-diphenylmethane diisocyanate, 4,4-diphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, tetramethyl xylene diisocyanate , Diisocyanate compounds such as naphthalene diisocyanate, adducts obtained by reacting 1 mole of a polyhydric alcohol compound such as trimethylolpropane with 3 moles of a diisocyanate compound, isocyanurate compounds in which 3 moles of a diisocyanate compound is self-condensed, diisocyanate Polyfunctional isocyanate compounds containing three functional groups such as burette, triphenylmethane triisocyanate and methylene bistriisocyanate, in which the remaining one mole of diisocyanate is condensed with diisocyanate urea obtained from 2 moles of 3 moles of the compound have.
에폭시계 화합물로는 에틸렌글리콜디글리시딜에테르, 디에틸렌글리콜디글리시딜에테르, 폴리에틸렌글리콜디글리시딜에테르, 프로필렌글리콜디글리시딜에테르, 트리프로필렌글리콜디글리시딜에테르, 폴리프로필렌글리콜디글리시딜에테르, 네오펜틸글리콜디글리시딜에테르, 1,6-헥산디올디글리시딜에테르, 폴리테트라메틸렌글리콜디글리시딜에테르, 글리세롤디글리시딜에테르, 글리세롤트리글리시딜에테르, 디글리세롤폴리글리시딜에테르, 폴리글리세롤폴리글리시딜에테르, 레졸신디글리시딜에테르, 2,2-디브로모네오펜틸글리콜디글리시딜에테르, 트리메틸올프로판트리글리시딜에테르, 펜타에리트리톨폴리글리시딜에테르, 소르비톨폴리글리시딜에테르, 아디핀산디글리시딜에스테르, 프탈산디글리시딜에스테르, 트리스(글리시딜)이소시아누레이트, 트리스(글리시독시에틸)이소시아누레이트, 1,3-비스(N,N-글리시딜아미노메틸)시클로헥산, N,N,N',N'-테트라글리시딜-m-자일릴렌디아민 등을 들 수 있다.Examples of the epoxy compound include ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, polypropylene glycol Hexanediol diglycidyl ether, polytetramethylene glycol diglycidyl ether, glycerol diglycidyl ether, glycerol triglycidyl ether, glycerol diglycidyl ether, glycerol diglycidyl ether, Diglycerol polyglycidyl ether, polyglycerol polyglycidyl ether, resorcinol diglycidyl ether, 2,2-dibromoneopentyl glycol diglycidyl ether, trimethylol propane triglycidyl ether, pentaerythritol Polyglycidyl ether, sorbitol polyglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, tris (glycidyl) isocyanurate N, N ', N'-tetraglycidyl-m-glycidoxyethyl isocyanurate, 1,3-bis (N, N-glycidylaminomethyl) cyclohexane, Xylylenediamine, and the like.
또한, 이소시아네이트계 화합물, 에폭시계 화합물과 함께 멜라민계 화합물을 단독 또는 2종 이상 혼합하여 추가로 사용할 수 있다. 멜리민계 화합물로는 헥사메틸올멜라민, 헥사메톡시메틸멜라민, 헥사부톡시메틸멜라민 등을 들 수 있다.In addition, an isocyanate compound, an epoxy compound, and a melamine compound may be used alone or in admixture of two or more. Examples of the melamine-based compound include hexamethylol melamine, hexamethoxymethyl melamine, and hexabutoxymethyl melamine.
가교제는 전체 조성물 기준으로 0.1 내지 10중량% 포함될 수 있게, 바람직하게는 0.3 내지 3중량%로 포함될 수 있게 혼합될 수 있다.The crosslinking agent may be contained in an amount of 0.1 to 10 wt%, preferably 0.3 to 3 wt%, based on the total composition.
착색제는 차광효과를 위해 첨가되는 성분으로서, 착색제의 색으로는 특별히 제한되지 않으나, 바람직하게는 블랙 착색제일 수 있다. The colorant is a component to be added for the shading effect and is not particularly limited to the color of the colorant, but may preferably be a black colorant.
블랙 착색제로는 블랙 안료 또는 블랙 염료가 사용될 수 있다. 블랙 안료로는 당해 분야에서 일반적으로 사용되는 유기 안료 또는 무기 안료를 사용할 수 있다. 안료는 인쇄 잉크, 잉크젯 잉크 등에 사용되는 각종의 안료를 사용할 수 있으며, 무기 안료로서는 금속 산화물이나 금속 착염 등의 금속 화합물을 들 수 있다. 블랙 염료는 유기용매에 대한 용해성을 가지는 것이라면 제한 없이 사용할 수 있다.As the black colorant, a black pigment or a black dye can be used. As the black pigment, organic pigments or inorganic pigments generally used in the art can be used. As the pigment, various pigments used for printing ink, ink-jet ink and the like can be used, and examples of the inorganic pigment include metal compounds such as metal oxides and metal complex salts. The black dye can be used without limitation as long as it has solubility in an organic solvent.
또한 기재층 제조용 조성물을 제조하는 단계는 상기 기술한 성분 이외에, 용도에 따라 요구되는 점착력, 응집력, 점성, 탄성률 등을 조절하기 위하여, 충전제, 대전방지제, 산화방지제, 실란커플링제 등의 첨가제를 추가로 첨가하는 단계를 포함할 수도 있다. In addition to the above-described components, the step of preparing the composition for preparing a substrate layer may further include additives such as fillers, antistatic agents, antioxidants, and silane coupling agents in order to control the adhesion, cohesion, viscosity, Lt; / RTI >
기재층 제조용 조성물을 제조하는 단계 후 목적에 따라 점도를 조절하기 위해, 건조하는 단계를 더 포함할 수 있다. 건조 조건은 특별히 제한되지 않으며, 건조는 당업계에 공지된 방법에 따라 수행될 수 있다.The step of preparing the composition for forming a base layer may further include a step of drying to adjust the viscosity according to the purpose. The drying conditions are not particularly limited, and drying can be carried out according to methods known in the art.
기재층 제조용 조성물을 가열하여 열팽창성 미소구를 발포시키 단계는 열팽창성 미소구가 100 내지 170℃, 바람직하게는 100 내지 150℃가 되도록 기재층 제조용 조성물을 가열할 수 있다. The step of heating the composition for preparing a base layer to foam the thermally expandable microspheres may heat the composition for preparing a base layer such that the thermally expandable microspheres have a temperature of 100 to 170 ° C, preferably 100 to 150 ° C.
기재층 제조용 조성물을 발포 온도까지 가열함에 따라 열팽창성 미소구가 발포되어 기재층의 내한성, 내열성, 내구성, 충격흡수성, 내반발성 등의 물성이 향상되면서도 피착제와의 간극밀착성이 우수하게 유지될 수 있다. When the composition for the base layer is heated to the foaming temperature, the thermally expandable microspheres are foamed to improve physical properties such as cold resistance, heat resistance, durability, impact absorbability, and resilience of the substrate layer and maintain excellent gap adhesion with the adherend .
또한, 본 발명은 기재의 일면 또는 양면에 기재층 제조용 조성물을 적층시키는 단계를 더 포함할 수 있다. 기재의 일면에 기재층 제조용 조성물이 적층될 수도 있고, 기재의 양면에 기재층 제조용 조성물이 적층될 수도 있다. In addition, the present invention may further include a step of laminating a composition for forming a base layer on one surface or both surfaces of the substrate. A composition for making a base layer may be laminated on one side of the base material, or a composition for producing a base layer may be laminated on both sides of the base material.
기재의 일면 또는 양면에 기재층 제조용 조성물을 적층시키는 단계는 열팽창성 미소구를 발포하기 전에 이루어질 수 있다. 즉, 기재의 일면 또는 양면에 기재층 제조용 조성물을 적층한 후에 기재층 제조용 조성물을 가열하여 열팽창성 미소구를 발포시킬 수 있다. The step of laminating the composition for making a base layer on one side or both sides of the substrate may be carried out before foaming the thermally expandable microspheres. That is, it is possible to foam the thermally expandable microspheres by heating the composition for the base layer formation after laminating the composition for the base layer on one side or both sides of the base.
기재는 특별히 한정되지 않으며, 종이, 직물, 박막 금속, PET, 유리 등 당업계에 공지된 모든 기재 타입을 포함한다. 기재는 통상적으로 사용되는 투명성 플라스틱 수지 기재일 수 있다. 예를 들어 기재는 폴리에틸렌테레프탈레이트(polyethyleneterephtalate, PET)와 같은 폴리에스테르(polyester), 에틸렌 비닐 아세테이트(ethylene vinyl acetate, EVA)와 같은 폴리에틸렌(polyethylene), 사이클릭 올레핀 중합체(cyclic olefinpolymer, COP), 사이클릭 올레핀 공중합체(cyclic olefin copolymer, COC), 폴리아크릴레이트(polyacrylate,PAC), 폴리카보네이트(polycarbonate, PC), 폴리에틸렌(polyethylene, PE), 폴리메틸메타크릴레이트(polymethylmethacrylate, PMMA), 폴리에테르에테르케톤(polyetheretherketon, PEEK), 폴리에틸렌나프탈레이트(polyethylenenaphthalate, PEN), 폴리에테르이미드(polyetherimide, PEI), 폴리이미드(polyimide, PI), 트리아세틸셀룰로오스(triacetylcellulose, TAC), MMA(methyl methacrylate), 또는 불소계 수지 등을 포함하는 필름일 수 있다. 기재는 단층 또는 서로 같거나 다른 물질로 이루어진 2개 이상의 기재를 포함하는 다층 구조일 수 있으며 특별히 제한되지는 않는다.The substrate is not particularly limited and includes all types of substrates known in the art such as paper, fabric, thin metal, PET, glass, and the like. The substrate may be a commonly used transparent plastic resin substrate. For example, the substrate may be made of a material selected from the group consisting of polyesters such as polyethylene terephthalate (PET), polyethylene such as ethylene vinyl acetate (EVA), cyclic olefin polymer (COP) But are not limited to, cyclic olefin copolymers (COC), polyacrylate (PAC), polycarbonate (PC), polyethylene (PE), polymethylmethacrylate (PMMA) (PEEK), polyimide (PI), triacetylcellulose (TAC), methyl methacrylate (MMA), or fluorine-based polymers such as polyetheretherketone (PEEK), polyethylene naphthalate (PEN), polyetherimide Resin or the like. The substrate may be a single layer or a multilayer structure including two or more substrates made of the same or different materials, and is not particularly limited.
또한, 본 발명은 기재에 기재층 제조용 조성물을 적층하지 않고 기재층을 제조할 수도 있다. 이와 같은 기재층을 이용하여 제조된 테이프는 무기재 타입의 테이프라 한다. 이 경우 제조된 기재층 제조용 조성물을 이형필름의 일면에 적층하고, 이형필름에 적층된 기재층 제조용 조성물을 가열하여 열팽창성 미소구를 발포시킬 수 있다. Further, the present invention can also produce a base layer without laminating the base layer composition on the base material. A tape manufactured using such a base layer is referred to as an inorganic material type tape. In this case, the thermally expandable microspheres can be foamed by laminating the prepared composition for the base layer production on one side of the release film and heating the composition for the base layer lamination laminated on the release film.
여기서 이형필름은 기재층이 오염되는 것을 방지하기 위한 것이다. 따라서 이형필름은 테이프 제조과정에서 기재층에서 제거될 수 있다. 이형필름은 기재층과 점착층이 합지될 때 기재층에서 제거될 수 있다. The release film is for preventing the substrate layer from being contaminated. Thus, the release film can be removed from the substrate layer during tape manufacturing. The release film may be removed from the substrate layer when the substrate layer and the adhesive layer are laminated.
이형필름은 실리콘 이형처리된 폴리에스터 필름 또는 실리콘 이형처리된 종이 재질의 이형지일 수 있다. 다만 이형필름은 이제 한정되지 않는다. The release film may be a silicone release film or a release paper of a silicone release treated paper. The release film is not limited anymore.
이하, 본 발명에 따른 테이프 제조방법을 상세히 설명한다.Hereinafter, a tape manufacturing method according to the present invention will be described in detail.
본 발명은 점착 이형필름의 일면에 점착층을 형성하는 단계와, 본 발명에 따른 기재층 제조방법에 의해 제조된 기재층의 일면 또는 양면에 점착층이 형성된 이형필름을 합지하는 단계를 포함하는 기재층 제조방법을 제공한다. The present invention relates to a process for producing a base film, which comprises the steps of forming an adhesive layer on one side of a release film and joining a release film having an adhesive layer on one or both sides of the base layer produced by the base layer production method according to the present invention Lt; / RTI >
기재층의 제조방법에 대해서는 앞서 설명한 기재층 제조방법에 대해서는 중복되는 부분에서 생략하기로 한다. The manufacturing method of the base layer will not be described in the overlapping portions of the base layer manufacturing method described above.
점착층이 형성된 이형필름은 점착층의 표면이 오염되는 것을 방지한다. 이형필름은 본 발명에 따른 테이프 제조방법에 의한 테이프가 사용될 때 제거될 수 있다. The release film on which the adhesive layer is formed prevents the surface of the adhesive layer from being contaminated. The release film can be removed when a tape by the tape manufacturing method according to the present invention is used.
이형필름은 실리콘 이형처리된 폴리에스터 필름 또는 실리콘 이형처리된 종이 재질의 이형지일 수 있다. 다만 점착 이형필름은 이제 한정되지 않는다. The release film may be a silicone release film or a release paper of a silicone release treated paper. However, the adhesive release film is not limited any more.
점착층은 아크릴계 감압성 점착제(PSA, Pressure Sensitive Adhesive)로 형성될 수 있다. The adhesive layer may be formed of an acrylic pressure sensitive adhesive (PSA, Pressure Sensitive Adhesive).
점착층은 아크릴 모노머를 포함할 수 있다. 아크릴 모노머는 메틸(메타)아크릴레이트, 에틸아크릴레이트, 부틸아크릴레이트, 2-에틸헥실아크릴레이트 및 라우릴아크릴레이트로 이루어진 군으로부터 선택되는 1종 이상을 포함할 수 있다. The adhesive layer may comprise an acrylic monomer. The acrylic monomer may include at least one member selected from the group consisting of methyl (meth) acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate and lauryl acrylate.
점착층은 관능기(functional group)를 갖는 모노머를 포함할 수 있다. 관능기를 갖는 모노머는 아크릴산(acrylic acid), 메타크릴산(methacrylic acid), 이타콘산(itaconic acid), 말레산무수물(maleic anhydride), 2-하이드록시에틸(메타)아크릴레이트(2-hydroxyethyl(meth)acrylate), 2-하이드록시프로필(메타)아크릴레이트(2-hydroxypropyl(meth)acrylate), 4-하이트록시부틸(메타)아크릴레이트(4-hydroxybutyl(meth)acrylate), 하이드록시에틸아크릴레이트(hydroxyethylacrylate) 및 하이드록시부틸아크릴레이트(hydroxybutylacrylate)로부터 선택되는 1종 이상을 포함할 수 있다. The adhesive layer may comprise a monomer having a functional group. The monomer having a functional group may be selected from the group consisting of acrylic acid, methacrylic acid, itaconic acid, maleic anhydride, 2-hydroxyethyl (meth) acrylate acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, hydroxyethyl acrylate hydroxyethylacrylate, hydroxybutylacrylate and hydroxybutylacrylate.
점착층은 점착 부여제를 포함할 수 있다. 점착 부여제는 로진계 수지, 테르펜계 수지 및 페놀 수지 중 적어도 하나를 포함할 수 있다.The adhesive layer may include a tackifier. The tackifier may comprise at least one of a rosin-based resin, a terpene-based resin and a phenolic resin.
점착층은 내열성 향상을 위한 가교제를 포함할 수 있다. 내열성 향상을 위한 가교제는 이소시아네이트계 가교제, 에폭시계 가교제 및 멜라민계 가교제 중 적어도 하나를 포함할 수 있다. The adhesive layer may include a crosslinking agent for improving heat resistance. The crosslinking agent for improving heat resistance may include at least one of an isocyanate crosslinking agent, an epoxy crosslinking agent and a melamine crosslinking agent.
기재층이 무기재 타입인 경우, 기재층의 이형필름은 제거한 후 기재층의 일면 또는 양면에 점착층이 형성된 이형필름을 합지할 수 있다. When the base layer is of an inorganic type, the release film of the base layer may be removed and a release film having an adhesive layer formed on one side or both sides of the base layer may be laminated.
이하, 본 발명을 실시예, 비교예 및 실험예를 이용하여 더욱 상세하게 설명한다. 그러나 하기 실시예, 비교예 및 실험예는 본 발명을 예시하기 위한 것으로서, 본 발명은 하기 실시예, 비교예 및 실험예에 의해 한정되지 않고 다양하게 수정 및 변경될 수 있다. Hereinafter, the present invention will be described in more detail with reference to Examples, Comparative Examples and Experimental Examples. However, the following examples, comparative examples and experimental examples are for illustrating the present invention, and the present invention is not limited by the following examples, comparative examples and experimental examples, and can be variously modified and changed.
제조예Manufacturing example 1. 바인더 수지의 합성 1. Synthesis of binder resin
질소가스가 환류되고 온도조절이 용이하도록 냉각장치를 설치한 1 L의 반응기에 n-부틸아크릴레이트(BA) 45중량부, 2-에틸헥실아크릴레이트 45중량부, 아크릴산 10중량부를 투입한 후, 용제로 에틸아세테이트 100 중량부를 투입하였다. 그 다음 산소를 제거하기 위하여 질소가스를 1 시간 동안 퍼징한 후, 80 ℃로 유지하였다. 상기 혼합물을 균일하게 한 후, 반응개시제로 아조비 스이소부티로니트릴(AIBN) 0.07 중량부를 투입하고, 6시간 동안 반응시켜 아크릴계 바인더 수지를 제조하였다.45 parts by weight of n-butyl acrylate (BA), 45 parts by weight of 2-ethylhexyl acrylate, and 10 parts by weight of acrylic acid were added to a 1 L reactor equipped with a cooling device for regulating the temperature of the nitrogen gas, 100 parts by weight of ethyl acetate was added as a solvent. Nitrogen gas was then purged for 1 hour to remove oxygen and then maintained at 80 ° C. After the mixture was homogenized, 0.07 part by weight of azobisisobutyronitrile (AIBN) was added as a reaction initiator and reacted for 6 hours to prepare an acrylic binder resin.
제조예Manufacturing example 2. 블랙 착색제의 제조 2. Preparation of black colorant
C.I 피그먼트 블랙 1 12중량부, 안료분산제로서 BYK-2001 4.0중량부를 유기용매에 혼합하고, 비드밀을 이용하여 안료를 충분히 분산시켜 블랙 착색제를 제조하였다.12 parts by weight of C.I. Pigment Black 1 and 4.0 parts by weight of BYK-2001 as a pigment dispersant were mixed in an organic solvent and the pigment was sufficiently dispersed using a bead mill to prepare a black colorant.
실시예Example 1 One
(1) 기재층 제조용 조성물(1) Composition for producing a base layer
고형분 함량을 기준으로, 제조예 1의 아크릴계 공중합체 100중량부, 열팽창성 미소구로서 F-50D(평균 입자지름: 15㎛) 5중량부, 기타 첨가물 10중량부를 혼합한 후 코팅성을 고려하여 유기용매에 희석하여 기재층 제조용 조성물을 제조하였다.On the basis of the solid content, 100 parts by weight of the acrylic copolymer of Production Example 1, 5 parts by weight of F-50D (average particle diameter: 15 mu m) as thermally expandable microspheres and 10 parts by weight of other additives were mixed, And then diluted with an organic solvent to prepare a composition for preparing a base layer.
(2) 기재층 (2)
상기 (1)에서 제조된 기재층 제조용 조성물을 상온에서 약 30분간 방치하여 기포를 제거한 후 PET 필름(50um, 기재에 대응) 상에 도포하였으며, 하기 표 1에 기재된 바와 같은 조건으로 건조시켜(열에 의해 열팽창성 미소구는 발포됨) 기재층을 형성하였다. 그 위에 다른 한 층의 이형필름을 라미네이션 하였다.The base layer composition prepared in the above step (1) was allowed to stand at room temperature for about 30 minutes to remove bubbles, and was then applied onto a PET film (50um, corresponding to the substrate) and dried under the conditions shown in Table 1 The thermally expandable microspheres were foamed) to form a base layer. And another layer of a release film was laminated thereon.
표 1에 있어서, 발포율은 하기 수학식 1에 따라 계산하였다.In Table 1, the foaming rate was calculated according to the following equation (1).
<수학식 1>&Quot; (1) "
발포율={발포 후 도포량 - (미발포 도포량(30㎛)-열팽창성 미소구의 크기(15㎛)} ÷ 열팽창성 미소구의 크기(15㎛)(15 占 퐉) of the thermally expandable microspheres (15 占 퐉) of the thermally expandable microspheres;
상기 표 1에 나타난 바와 같이, 열팽창성 미소구(F-50D)는 약 100℃에서 발포를 시작하여 145℃ 전후의 온도에서 최대 발포를 하였으며, 약 150℃ 이상부터는 온도가 상승함에 따라 발포율이 감소하는 현상을 나타내었다.As shown in Table 1, the thermally expandable microspheres (F-50D) started foaming at about 100 ° C. and reached maximum foaming at about 145 ° C., and from about 150 ° C. or higher, the foaming rate Respectively.
실시예 2. 내충격성 시험Example 2. Impact resistance test
상기 실시예 1의 (1)에서 제조된 조성물을 상온에서 약 30분간 방치하여 기포를 제거한 후 PET 필름(50um) 상에 도포하였으며, 하기 표 1에 기재된 바와 같은 조건으로 건조시켜(열에 의해 열팽창성 미소구는 발포됨) 기재층을 형성하였다. 이때, PET 필름을 포함하는 기재층의 두께는 120um이다.The composition prepared in Example 1 (1) was allowed to stand at room temperature for about 30 minutes to remove air bubbles and then applied on a PET film (50um), and dried under the conditions shown in Table 1 (heat- The microspheres were foamed) to form a base layer. At this time, the thickness of the base layer including the PET film was 120 mu m.
상기 기재층 양면에 아크릴 점착제를 도포시켜 점착제 층을 형성한 후 60℃에서 2일간 방치하였다. 적층체를 15.5mm X 15.5mm 크기로 절단하였고, 피착제인 PC와 유리에 양쪽에 5kg/5sec의 힘으로 접착시켰으며, 상온에서 72시간 방치하여 시편을 준비하였다.An acrylic pressure-sensitive adhesive was coated on both sides of the base layer to form a pressure-sensitive adhesive layer, and then left at 60 DEG C for 2 days. The laminate was cut into a size of 15.5 mm X 15.5 mm and adhered to PC and glass adhered to both sides with a force of 5 kg / 5 sec. The sample was left standing at room temperature for 72 hours.
상기 시편을 높이 50mm부터 500mm까지 50mm 간격으로 높이를 높이면서 추를 낙하시켰으며, 이때 추는 무게 50g부터 10g 또는 50g씩 무게를 높이면서 측정하였고, 3회 반복하여 그 평균값을 계산하였고, 그 결과를 하기 표 2에 나타내었다.The weight of the specimen was dropped from 50 mm to 500 mm at an interval of 50 mm while the weight was dropped. The weights were measured while increasing the weight from 50 g to 10 g or 50 g, and the average value was calculated by repeating this experiment three times. The results are shown in Table 2 below.
대조군으로는 (PE 폼, 120um 두께) 양면에 아크릴계 점착제를 이용하여 점착제층을 형성시켰고, 60℃에서 2일간 방치한 후 동일하게 실험을 진행하였다.As a control, a pressure-sensitive adhesive layer was formed on both sides of a (PE foam, 120 μm thickness) acrylic adhesive, and the same test was conducted after standing at 60 ° C. for 2 days.
상기 표 2에 나타난 바와 같이, 열팽창성 미소구를 포함하는 기재층이 포함된 시편이 대조군보다 더 강한 충격에 견디는 것을 보였다. 이는 조성물에 포함된 열팽창성 미소구가 충격을 완화시켜 주는 역할을 한다는 것을 나타낸다.As shown in Table 2 above, it was shown that the specimen including the substrate layer including the thermally expandable microspheres was able to withstand a stronger impact than the control. This indicates that the thermoexpandable microspheres contained in the composition play a role in relieving the impact.
실시예Example 3. 3. 열팽창성Thermal expansion 미소구의Microchip 함량에 따른 내충격성 시험 Impact resistance test according to content
하기 표 3에 기재된 바와 같이, 열팽창성 미소구의 함량(단위: 중량부)을 달리하여 기재층 제조용 조성물을 제조하였으며, 상기 실시예 2의 방법과 동일한 방법으로 내충격성 시험을 하였다.As shown in the following Table 3, the composition for preparing the base layer was prepared by varying the content (unit: parts by weight) of thermally expandable microspheres, and the impact resistance test was carried out in the same manner as in Example 2.
상기 표 3에 기재된 바와 같이, 열팽창성 미소구는 아크릴계 공중합체 100중량부에 대하여 1 내지 15중량부로 포함되는 경우 우수한 내충격성을 나타내었다.As shown in Table 3, when the thermally expandable microspheres were contained in an amount of 1 to 15 parts by weight based on 100 parts by weight of the acrylic copolymer, excellent impact resistance was exhibited.
Claims (9)
기재의 일면 또는 양면에 상기 기재층 제조용 조성물을 적층시키는 단계; 및
상기 기재에 상기 기재층 제조용 조성물을 적층시킨 후 상기 기재층 제조용 조성물을 가열하여 열팽창성 미소구를 발포시키는 단계를 포함하는 기재층 제조방법.A binder resin and a thermally expansible microspheres to prepare a composition for producing a base layer;
Laminating the composition for making a base layer on one side or both sides of the base; And
And laminating the composition for forming a base layer on the base material and then heating the composition for base layer formation to foam the thermally expandable microspheres.
상기 열팽창성 미소구를 발포시키는 단계는 상기 열팽창성 미소구가 100 내지 170 ℃가 되도록 상기 기재층 제조용 조성물을 가열하는 것을 특징으로 하는 기재층 제조방법.The method according to claim 1,
Wherein the step of foaming the thermally expandable microspheres comprises heating the composition for preparing a substrate layer such that the thermally expandable microspheres have a temperature of 100 to 170 占 폚.
상기 열팽창성 미소구는 열가소성 수지로 이루어지는 외각과, 상기 외각에 내포되며 열가소성 수지의 연화점 이하의 비등점을 갖는 발포제를 포함하며,
상기 발포제는 탄소수 1 내지 12의 탄화수소, 탄소수 1 내지 12의 탄화수소의 할로겐화물 및 가열에 의해 열분해하여 가스를 생성하는 화합물로 이루어진 군으로부터 선택되는 1종을 포함하는 것을 특징으로 하는 기재층 제조방법.The method according to claim 1,
Wherein the thermally expandable microspheres comprise an outer periphery made of a thermoplastic resin and a foaming agent contained in the outer periphery and having a boiling point lower than the softening point of the thermoplastic resin,
Wherein the foaming agent comprises one selected from the group consisting of hydrocarbons having 1 to 12 carbon atoms, halides of hydrocarbons having 1 to 12 carbon atoms, and compounds decomposing by heating to produce a gas.
상기 기재층 제조용 조성물을 제조하는 단계는 상기 바인더 수지 및 상기 열팽창성 미소구에 가교제와 착색제 중 적어도 하나를 첨가하는 단계를 포함하는 것을 특징으로 하는 기재층 제조방법.The method according to claim 1,
Wherein the step of preparing the base layer composition comprises adding at least one of a crosslinking agent and a coloring agent to the binder resin and the thermally expansible microspheres.
상기 열팽창성 미소구의 평균 입자 지름은 5~50㎛인 것을 특징으로 하는 기재층 제조방법.The method according to claim 1,
Wherein the thermally expandable microspheres have an average particle diameter of 5 to 50 占 퐉.
상기 열팽창성 미소구의 발포율은 자기체적 대비 2 내지 20인 것을 특징으로 하는 기재층 제조방법.The method according to claim 1,
Wherein the expansion ratio of the thermally expandable microspheres is 2 to 20 relative to the magnetic volume.
상기 열팽창성 미소구는 가열에 의해 밀도가 감소하는 것을 특징으로 하는 기재층 제조방법.The method according to claim 1,
Wherein the thermally expandable microspheres have a reduced density by heating.
청구항 1, 청구항 3 내지 8 중 어느 하나의 제조방법에 의해 제조된 기재층의 일면 또는 양면에 상기 점착층이 형성된 이형필름을 합지하는 단계를 포함하는 테이프 제조방법.Forming an adhesive layer on one surface of the release film; And
A method for producing a tape, comprising the step of laminating a release film having the adhesive layer formed on one side or both sides of a base layer produced by the manufacturing method according to any one of claims 1 and 3 to 8.
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