KR101778057B1 - Apparatus and method and apparatus for packaging a battery integration using electrolyte substrate - Google Patents

Abstract

The present invention relates to a battery integrated packaging apparatus which is connected to an energy conversion device through at least one first input/output terminal and is connected to the outside through at least one second input/output terminal. The battery integrated packaging apparatus comprises: a first LTCC dielectric substrate including a positive current collector and a positive electrode on an upper portion thereof and having a plurality of vias connected to the second input/output terminal; a second LTCC dielectric substrate including an electrolyte cavity formed by removing a portion thereof, arranged and laminated on the first LTCC dielectric substrate to expose the positive electrode by the electrolyte cavity, and having a plurality of vias connected to the vias of the first LTCC dielectric substrate and the positive current collector; an electrolyte substrate including an electrolyte layer coupled to the electrolyte cavity, and seated on the inner side of the electrolyte cavity to be arranged and laminated on the second LTCC dielectric substrate; a third LTCC dielectric substrate including a negative current collector and a negative electrode on an upper portion thereof, arranged and laminated on the electrolyte substrate such that the negative electrode is seated on the electrolyte layer, and having a plurality of vias connected to the negative current collector and the vias of the second LTCC dielectric substrate; and a fourth LTCC dielectric substrate connected to a mounting cavity on which an inner chip is to be mounted, a circuit wire, and the via of the third LTCC dielectric substrate, and having a plurality of vias connected to the circuit wire.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an apparatus and a method for collecting and packaging a battery using an electrolyte substrate,

The present invention relates to a battery integrated packaging apparatus using an electrolyte substrate capable of forming a battery necessary for driving an internal chip such as a sensor or an integrated circuit using the multilayer circuit board technology and an electrolyte substrate and packaging the energy conversion element and the integrated circuit at the same time, And methods.

2. Description of the Related Art Recently, a slid state battery chip fabricated using a process similar to a semiconductor integrated circuit manufacturing technology has been developed to be packaged with electronic devices and components (integrated circuit chips) and used in a system.

Conventional battery chips are expensive to manufacture because they use semiconductor fabrication processes. In order to increase the capacity, the quality of the materials for solid-state batteries must be improved and the size of battery chips must be increased. Also, a method of integrating a plurality of battery chips in three dimensions can be considered, but additional wire bonding or interconnection such as BGA is required, which is a limitation in increasing the size of the packaging.

Korean Patent No. 10-1610572 (2014.04.01.)

The present invention relates to a method of forming a battery for driving a sensor and an integrated circuit using a low-temperature co-fired ceramic (LTCC) technique and an electrolyte substrate, forming an energy conversion element and an integrated circuit A battery pack packaging apparatus and method using an electrolyte substrate packaged at the same time are provided.

As a means for solving the problems of the present invention, an apparatus for accumulating and packaging a battery using an electrolyte substrate according to an embodiment of the present invention is connected to an energy conversion element through at least one first input / output terminal, A first LTCC dielectric substrate having a positive current collector and a positive electrode on an upper portion thereof and having a plurality of vias connected to the second input / output terminal; The first LTCC dielectric substrate and the positive current collector are arranged and stacked on the first LTCC dielectric substrate so that the positive electrode is exposed by the electrolyte cavity, And a plurality of vias connected to the second LTCC dielectric And an electrolyte layer coupled to the electrolyte cavity, the electrolyte substrate being seated inside the electrolyte cavity and aligned and stacked on the second LTCC dielectric substrate, and a negative current collector and a negative electrode on the upper portion, A third LTCC dielectric substrate aligned and stacked on the electrolyte substrate such that the negative electrode is seated on the electrolyte layer and having a plurality of vias connected to the vias of the negative current collector and the second LTCC dielectric substrate; , A mounting cavity for mounting the internal chip, a circuit wiring, and a fourth LTCC dielectric substrate connected to the vias of the third LTCC dielectric substrate, and a plurality of vias connected to the circuit wiring.

According to an embodiment of the present invention, the first dielectric substrate for LTCC includes first and second vias connected to two second input / output terminals, first and second vias formed on upper portions of the first and second vias, Pad may be further provided.

According to an embodiment of the present invention, the second LTCC dielectric substrate includes third and fourth vias connected to the first and second via pads in alignment and lamination with the first LTCC dielectric substrate, A fifth via connected to the positive current collector when aligned and laminated with the LTCC dielectric substrate, and third through fifth via pads formed on the third through fifth vias.

According to an embodiment of the present invention, the third dielectric substrate for LTCC includes sixth and seventh vias connected to the third and fourth via pads, an eighth via connected to the negative current collector, A ninth via connected to the via pad and connected to the positive current collector through the fifth via connected to the fifth via pad, and sixth and seventh via pads formed on top of the sixth and seventh vias can do.

According to an embodiment of the present invention, the fourth dielectric substrate for LTCC may further include a tenth via connected to the eighth via and an eleventh via connected to the ninth via.

According to an aspect of the present invention, there is provided a battery pack packaging method using an electrolyte substrate according to an embodiment of the present invention, which includes at least one first input / output terminal connected to an energy conversion element, A plurality of vias connected to the second input / output terminal are formed in a first LTCC dielectric substrate having a lower carrier film formed thereon, and the first and second input / Forming a positive current collector and a positive electrode on top of a dielectric substrate for an LTCC; forming an electrolyte cavity through removal of a portion of the dielectric substrate for a second LTCC; Forming a plurality of connected vias in the second LTCC dielectric substrate, And the second LTCC dielectric substrate is arranged so that a plurality of vias formed on the second LTCC dielectric substrate are connected to and correspond to a plurality of vias of the first LTCC dielectric substrate, Forming an electrolyte layer on the first LTCC dielectric substrate by removing a portion of the electrolyte substrate to form an electrolyte layer on the first LTCC dielectric substrate; Forming a negative current collector and a negative electrode on top of the third LTCC dielectric substrate and forming a plurality of vias connected to the vias of the negative current collector and the second LTCC dielectric substrate; Forming a third LTCC dielectric substrate so that the negative electrode is connected to the electrolyte layer; Aligning and stacking the substrate to be aligned on the aligned and laminated result, forming a mounting cavity in which the internal chip is to be mounted through removal of a portion of the fourth LTCC dielectric substrate, A plurality of vias connected to the vias of the third dielectric substrate for LTCC and connected to the circuit wiring are formed on the fourth dielectric substrate for LTCC, And aligning and laminating the dielectric substrate for the third LTCC dielectric substrate on the aligned and laminated result.

According to an embodiment of the present invention, the step of forming the positive current collector and the positive electrode includes the steps of: forming a carrier film under the first LTCC dielectric substrate; Comprising the steps of: forming two holes in a substrate; filling the two holes with a conductive metal material to form first and second vias connected to two second input / output terminals; And forming the positive current collector and the first and second via pads by printing a metal material on an upper portion of the first LTCC dielectric substrate.

According to an embodiment of the present invention, the step of forming the second LTCC dielectric substrate includes the steps of forming a carrier film under the second LTCC dielectric substrate, and forming a second LTCC using the laser or the puncher, And a third via hole connected to the first and second via pads and connected to the positive current collector, the method comprising the steps of: forming three holes in a dielectric substrate And forming third to fifth via pads by printing a metal material on top of the third to fifth vias.

According to an embodiment of the present invention, the step of aligning and laminating the first LTCC dielectric substrate may include removing the carrier film formed on the lower surface of the second LTCC dielectric substrate and aligning and laminating the carrier film on the first LTCC dielectric substrate .

According to an embodiment of the present invention, the step of forming a plurality of vias connected to vias of the second LTCC dielectric substrate includes the steps of: forming a carrier film under the third LTCC dielectric substrate; Forming a fourth hole in the third LTCC dielectric substrate by using a conductive metal material; filling sixth and seventh vias connected to the third and fourth via pads by filling the four holes with a conductive metal material; Forming an ninth via connected to the negative current collector and a ninth via connected to the fifth via pad and connected to the positive current collector through the fifth via connected to the fifth via pad; And printing a metal material on top of the sixth and seventh vias to form sixth and seventh via pads.

According to an embodiment of the present invention, the step of aligning and laminating the electrolyte substrate on the aligned and laminated resultant may be performed by rotating the third dielectric substrate for LTCC so that the carrier film is on top, Aligning and stacking the electrolyte substrate on the aligned and laminated result, and removing the carrier film formed under the third LTCC dielectric substrate.

According to an embodiment of the present invention, the step of aligning and stacking the third LTCC dielectric substrate on the aligned and laminated resultant includes: forming a carrier film under the fourth LTCC dielectric substrate; Forming two holes in the fourth LTCC dielectric substrate by using a punching machine; filling the two holes with a conductive metal material to form the tenth and eleventh via pads; Forming a circuit wiring to be connected to each of the tenth and eleventh vias by printing a metal material on an upper surface of the dielectric substrate for the fourth LTCC, removing the carrier film formed under the fourth LTCC dielectric substrate, And aligning and laminating the dielectric substrate for LTCC on the aligned and laminated resultant.

According to the embodiments of the present invention described above, a battery packaging apparatus and method for forming a battery necessary for driving a sensor and an integrated circuit chip in a multilayer circuit board by using an LTCC technique, packaging the energy conversion element and the integrated circuit chip at the same time The size of the battery can be minimized. In addition, it is possible to provide a packaging device in which a battery can be used for a sensor and communication module for Internet, which must be used independently without external power supply.

1 is a cross-sectional view illustrating the overall structure of a battery packaged and packaged device using an electrolyte substrate according to an embodiment of the present invention.
2A to 2E are cross-sectional views illustrating the structure of a substrate to be integrated in a battery integrated packaging apparatus according to an embodiment of the present invention.
3 is a cross-sectional view illustrating a process of aligning and laminating the first and second LTCC dielectric substrates and the electrolyte substrate.
4 is a cross-sectional view for explaining the process of aligning and stacking the third LTCC dielectric substrate in the state of FIG.
5 is a cross-sectional view for explaining the process of aligning and stacking the fourth LTCC dielectric substrate in the state of FIG.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. The following detailed description is provided to provide a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, this is merely an example and the present invention is not limited thereto.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. The following terms are defined in consideration of the functions of the present invention, and may be changed according to the intention or custom of the user, the operator, and the like. Therefore, the definition should be based on the contents throughout this specification. The terms used in the detailed description are intended only to describe embodiments of the invention and should in no way be limiting.

FIG. 1 is a cross-sectional view showing the entire structure of a battery packaged and packaged apparatus using an electrolyte substrate according to an embodiment of the present invention. FIGS. 2a to 2e are views showing a structure of a substrate to be integrated in a battery integrated packaging apparatus according to an embodiment of the present invention. Fig.

1, the battery packaged and packaged device is configured to use the energy conversion element 10 to charge the battery with the generated power and to supply power to the internal chip 20, such as a sensor or an integrated circuit, The three-dimensional multilayer circuit technology can be used to package solid-state batteries in three-dimensionally integrated modules or components. Also, the battery integrated packaging apparatus can integrate the main board or the internal chip 20 of the system by using the input / output terminals 30 and 40.

2A to 2E, a battery pack packaging apparatus according to an embodiment of the present invention includes first through fourth LTCC dielectric substrates 100, 200, 400, and 500 and an electrolyte substrate 300 And carrier films 101, 201, 301, 401, and 501 are formed on the lower portions of the first to fourth LTCC dielectric substrates 100, 200, 400, and 500 and the electrolyte substrate 300, respectively.

The first to fourth LTCC dielectric substrates 100, 200, 400, and 500 and the electrolyte substrate 300 are each provided with at least one guide hole 102, 202, 302, 402, 502 are formed. The guide holes 102, 202, 302, 402, and 502 may be used for alignment when the first to fourth LTCC dielectric substrates 100, 200, 400, and 500 and the electrolyte substrate 300 are laminated. The first to fourth LTCC dielectric substrates 100, 200, 400, and 500, the electrolyte substrate 300, and the carrier films 101, 201, 301, 401, and 501 at the lower portion thereof are connected through a laser or mechanical punching process. As shown in FIG.

2A, the first LTCC dielectric substrate 100 includes a guide hole 102, first and second vias 111 and 112, first and second via pads 120 and 121, And a positive electrode 123 and a positive current collector 122 for collecting the current of the positive electrode of the battery. After the carrier film 101 is attached to the lower part of the first LTCC dielectric substrate 100, a first LTCC dielectric substrate 100 and a part of both sides of the carrier film 101 are covered with a laser or a mechanical punching machine The first LTCC dielectric substrate 100 is punched by using a laser or a mechanical punching machine to form a hole and a conductive hole is formed in the hole, The material is buried to form the first and second vias 111 and 112. The first and second via pads 120 and 121 are formed on top of the first and second vias 111 and 112 through a screen printing and drying process. A positive current collector 122 is formed on the first LTCC dielectric substrate 100.

A positive electrode 123 having the same shape and area as the positive current collector 122 is formed on the positive current collector 122 through a screen printing and drying process.

The first and second vias 111 and 112 formed on the first LTCC dielectric substrate 100 are connected to the internal chips 20 in the package or to external signal transmission pads or input / And when the first LTCC dielectric substrate 100 and the second LTCC dielectric substrate 200 are aligned and laminated, the third and fourth vias 211 and 211 are connected through the first and second via pads 120 and 121, 212, respectively.

On the other hand, as shown in FIG. 2B, the second LTCC dielectric substrate 200 includes a guide hole 202, third, fourth and fifth vias 211, 212 and 213, third, And a cavity 210 for an electrolyte formed at a position where the electrolyte layers (310 of FIG. 2C) of the battery are to be coupled.

After the carrier film 201 is attached to the lower part of the second LTCC dielectric substrate 200, a part of both sides of the second LTCC dielectric substrate 200 and the carrier film 201 are covered with a laser or a mechanical punching machine A via hole is formed by punching a second LTCC dielectric substrate 200 of a part of both sides of the guide hole 202 with a laser or a mechanical punching machine.

A portion of the second LTCC dielectric substrate 200 between the third and fifth vias 211 and 213 is punched out so that the carrier film 201 is exposed using the laser or mechanical punching machine to form the electrolyte cavity 210, . At this time, the electrolyte cavity 210 may have a certain area such as a circular shape or a square shape, that is, a shape having an area where the electrolyte layer 310 of the battery can be coupled.

Then, third, fourth, and fifth vias 211, 212, and 213 are formed by filling the via hole with a conductive metal material to form third, fourth, and fifth vias 211, 212, and 213 through a screen printing and drying process. Third, fourth, and fifth via pads 221, 222, and 223 are formed on top of the first, second, and third via pads 221, 222, and 223, respectively. Here, the fifth vias 213 are for connection of the electrodes of the battery to be integrated and may be connected to the energy conversion element 10 for charging and discharging or to a sensor or integrated circuit 200 integrated in the package, And the four vias 211 and 212 may be connected to a pad or an input / output terminal 30 for connection between the internal chips 20 in the package or external signal transmission. When the first LTCC dielectric substrate 100 and the second LTCC dielectric substrate 200 are stacked through the alignment of the guide holes 102 and 202, the fifth vias 213 are connected to the first LTCC dielectric substrate 200, The third LTCC dielectric substrate 400 and the ninth and eleventh via holes (not shown) formed in the fourth LTCC dielectric substrate 500 are connected to the positive current collector 122 formed on the upper portion of the substrate 100, And the third and fourth vias 211 and 212 are connected to the energy conversion element 10 through the first and second via pads 121 and 122 through the first and second vias 111 and 111 And 112 and may be connected to the input / output terminal 30.

The electrolyte substrate 300 may have a carrier film 301, a guide hole 302, and an electrolyte layer 310 formed thereunder as shown in FIG. 2C.

Specifically, a portion of the electrolyte substrate 300 is removed by using a cutter for sheet cutting, a laser, or a mechanical punching machine to form the electrolyte layer 310 so that the carrier film 301 is exposed. At this time, the electrolyte layer 310 may have a predetermined area such as a circle or a square which can be coupled to the electrolyte cavity 210.

Then, a guide hole 302 is formed by punching a part of both sides of the carrier film 301 using a laser or a mechanical punching machine.

The third LTCC dielectric substrate 400 includes a carrier film 401, a guide hole 402, sixth, seventh, eighth, and ninth vias 411, 412, 413, 414 and a negative current collector 421 and a negative electrode 422.

After the carrier film 401 is attached to the lower portion of the third LTCC dielectric substrate 400, a part of both sides of the third LTCC dielectric substrate 400 and the carrier film 401 are covered with a laser or a mechanical punching machine A plurality of via holes are formed by punching the third LTCC dielectric substrate 400 on both sides of the guide hole 402 with a laser or a mechanical punching machine.

Then, a plurality of via holes are filled with a conductive metal material to form sixth, seventh, eighth, and ninth vias 411, 412, 413, and 414, and then connected to the ninth via 414 through a screen printing and drying process And a negative current collector 421 is formed on the third LTCC dielectric substrate 400 spaced apart from the eighth via 413 by a predetermined distance.

A negative electrode 422 having the same shape and area as the negative current collector 421 is formed on the negative current collector 421 through a screen printing and drying process. At this time, the negative electrode 422 is connected to the electrolyte layer 310 when the third LTCC dielectric substrate 400 is aligned and laminated with the electrolyte substrate 300, and the sixth and seventh vias 411 and 412 are connected to the electrolyte layer 310 Third and fourth via pads 221 and 222 and the ninth via 413 may be connected to the fifth via pad 223.

The eighth and ninth vias 413 and 414 connect the electrodes of the battery to be integrated and may be connected to the energy conversion element 10 for charging and discharging or to the internal chip 20 integrated in the package. The sixth and seventh vias 411 and 412 may be connected to each other or to an external signal transmitting pad or the input / output terminal 30, respectively. Specifically, the eighth and ninth vias 413 and 414 are connected to the energy conversion element 10 through the tenth and eleventh vias 511 and 512 formed in the fourth LTCC dielectric substrate 500, And the sixth and seventh vias 411 and 412 may be connected to the input / output terminal 30 through vias and via pads formed in the first and second LTCC dielectric substrates 100 and 200.

2E, the fourth LTCC dielectric substrate 500 includes a carrier film 501, a guide hole 502, a mounting cavity 510, tenth and eleven vias 511 and 512 And a circuit wiring 512, as shown in FIG.

After the carrier film 501 is attached to the lower portion of the fourth LTCC dielectric substrate 500, a part of both sides of the fourth LTCC dielectric substrate 500 and the carrier film 501 are covered with a laser or a mechanical punching machine And the fifth LTCC dielectric substrate 500 is punched using a laser or a mechanical punching machine to form a via hole and then the inner chip 20 Are to be integrated with each other to form a mounting cavity 510. The mounting cavity 510 is formed by punching a fourth LTCC dielectric substrate 500 at a position where the mounting cavity 510 is to be integrated.

Then, a conductive metal material is embedded in the via hole to form tenth and eleventh vias 511 and 512, and then, through a screen printing and drying process using a metal material, a circuit wiring (not shown) is formed on the fourth LTCC dielectric substrate 500, (521). At this time, the circuit wiring 521 may be connected to the energy conversion element 10 and an electrode of the battery to be integrated.

When the fourth LTCC dielectric substrate 500 is aligned and laminated with the third LTCC dielectric substrate 400, the tenth vias 511 are connected to the eighth vias 413 and the eleventh vias 512, May be connected to the ninth via 414. The energy conversion element 10 connected to the circuit wiring 521 is connected to the negative current collector 421 through the eighth and tenth vias 413 and 511 and the ninth and eleventh vias 414 and 512 To the positive current collector 122. [0031]

3 to 5 illustrate a process of forming and packageing the first to fourth LTCC dielectric substrates 100, 200, 400, and 500 and the electrolyte substrate 300 having the above-described structure by aligning and laminating the same. .

 3 is a cross-sectional view illustrating a process of aligning and laminating the first and second LTCC dielectric substrates 100 and 200 and the electrolyte substrate 300. FIG. 4 is a cross- FIG. 5 is a cross-sectional view illustrating a process of aligning and stacking the fourth LTCC dielectric substrate 500 in the state of FIG. 4. Referring to FIG.

First, a process of aligning and laminating the first LTCC dielectric substrate 100 and the second LTCC dielectric substrate 200 will be described. A metal plate or a container is heated to a predetermined temperature The guide holes 102 and 202 are aligned and aligned with each other, and a certain pressure is applied by a pressure press to seat the second LTCC dielectric substrate 200 on the first LTCC dielectric substrate 100. At this time, the second LTCC dielectric substrate 200 is placed on the first LTCC dielectric substrate 100 with the carrier film 201 formed on the lower part of the second LTCC dielectric substrate 200 removed.

On the other hand, in the practice of the present invention, the pressure applied through the pressure press can be about 10% of the pressure applied to form the entire stacked stack.

The entire electrolyte substrate 300 is then turned over to bond the electrolyte layer 310 of the electrolyte substrate 300 to the electrolyte cavity 210 of the second LTCC dielectric substrate 200. At this time, the electrolyte substrate 300 may be rotated with respect to the horizontal axis on the plane according to the design, or the electrolyte substrate 300 may be rotated around the vertical axis to be reversed. Further, the guide holes 102, 202, and 302 are aligned with each other by aligning the guide holes 102, 202, and 302 with respect to the horizontal and the longitudinal axes, and applying a predetermined pressure to the pressure plate, thereby pressing the electrolyte layer 310 to the second LTCC dielectric substrate 200 And is placed inside the electrolyte cavity 210. 3, the first and second LTCC dielectric substrates 100 and 200 and the electrolyte substrate 300 are aligned (aligned) by removing the carrier film 301 formed on the lower portion of the electrolyte substrate 300, And a laminated state.

The entirety of the third LTCC dielectric substrate 400 is inverted to place the negative electrode 422 formed on the third LTCC dielectric substrate 400 on the electrolyte layer 310 of the electrolyte substrate 300. At this time, the third LTCC dielectric substrate 400 may be rotated with respect to the horizontal axis on the plane, or the third LTCC dielectric substrate 400 may be rotated with respect to the vertical axis. The third LTCC dielectric substrate 400 is rotated with respect to the transverse and longitudinal axes to align the guide holes 102, 202, 302, 402 with each other in the vertical direction and apply a constant pressure to the negative electrode 422 ) Is placed on the electrolyte layer 310 of the electrolyte substrate 300. 4, the first and second LTCC dielectric substrates 100 and 200, the electrolyte substrate 300, and the first and second LTCC dielectric substrates 400 and 400 are removed by removing the carrier film 401 of the third LTCC dielectric substrate 400. Thereafter, 3 LTCC dielectric substrate 400 may be sequentially aligned and laminated.

Then, the carrier film 501 of the fourth LTCC dielectric substrate 500 is removed and the guide holes 102, 202, 302, 402, and 502 are aligned and aligned with each other and a constant pressure is applied by a pressure press 4 LTCC dielectric substrate 500 can be seated.

The first to fourth LTCC dielectric substrates 100, 200, 400, and 500 and the electrolyte substrate 300, which are aligned and placed, are subjected to a constant pressure to form a stack and a heat treatment process. After the heat treatment, the internal chip 20 and the energy conversion element 10 are mounted to form the input and output terminals 30 of the module.

Meanwhile, in the embodiment of the present invention, the electrolyte substrate 300 is manufactured by molding a pure ion conductive powder into a sheet form including a binder, and converting it into a solid state in a glass ceramic form after the heat treatment process . Here, the pure ion conductor is made of an oxide compound composed of Li, P, S, or Ag.

The material for the positive electrode 123 is an oxide of a metal containing Li and contains a conductive additive and a binder to improve the conductivity, and is made into a paste form easily for screen printing.

The material for the negative electrode 422 may be formed using a material containing an In compound and a binder, containing Sn, S, P compounds and a binder, containing carbon and a binder, or containing a graphite material and a binder Screen printing is easily made into a paste form.

The metal material for the positive current collector 122 and the negative current collector 421 is made of Ag or Cu as a basic element in the form of a paste by screen printing using a conductive additive, a binder, or an alloy of a positive or negative electrode material .

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

10: Energy conversion element
20: Internal chip
100: a first LTCC dielectric substrate
200: second LTCC dielectric substrate
300: electrolyte substrate
400: Third dielectric substrate for LTCC
500: Fourth LTCC dielectric substrate

Claims (12)

A battery pack packaging apparatus connected to an energy conversion element through at least one first input / output terminal and connected to the outside through at least one second input / output terminal,
A first LTCC dielectric substrate having a positive current collector and a positive electrode on its upper portion and having a plurality of vias connected to the second input / output terminal,
The first LTCC dielectric substrate and the positive current collector are arranged and stacked on the first LTCC dielectric substrate so that the positive electrode is exposed by the electrolyte cavity, A second LTCC dielectric substrate having a plurality of vias connected to the first LTCC dielectric substrate,
And an electrolyte layer which is bonded to the electrolyte cavity, the electrolyte substrate being seated in the electrolyte cavity and aligned and stacked on the second LTCC dielectric substrate,
A negative current collector and a negative electrode on the top and arranged and stacked on the electrolyte substrate such that the negative electrode is seated on the electrolyte layer and a plurality of negative current collectors and a plurality of A third LTCC dielectric substrate having a via,
And a fourth LTCC dielectric substrate having a plurality of vias connected to vias of the third LTCC dielectric substrate, and a plurality of vias connected to the circuit wirings. Packaging device.
The method according to claim 1,
Wherein the first LTCC dielectric substrate comprises:
First and second vias connected to the two second input / output terminals,
Further comprising first and second via pads formed on top of the first and second vias.
3. The method of claim 2,
Wherein the second LTCC dielectric substrate comprises:
Third and fourth vias connected to the first and second via pads when aligned and laminated with the first LTCC dielectric substrate,
A fifth via connected to the positive current collector when aligned and laminated with the first LTCC dielectric substrate,
And third through fifth via pads formed on top of the third through fifth vias.
The method of claim 3,
The third dielectric substrate for LTCC includes:
Sixth and seventh vias connected to the third and fourth via pads,
An eighth via connected to the negative current collector,
A ninth via connected to the fifth via pad and connected to the positive current collector through the fifth via connected to the fifth via pad,
And sixth and seventh via pads formed on top of the sixth and seventh vias.
5. The method of claim 4,
The fourth dielectric substrate for LTCC includes:
A tenth via connected to the eighth via,
And an eleventh via connected to the ninth via.
A battery pack packaging method in which a battery pack is connected to an energy conversion element through at least one first input / output terminal and connected to the outside through at least one second input / output terminal,
Forming a plurality of vias connected to the second input / output terminal in a first LTCC dielectric substrate having a lower carrier film formed thereon, and forming a positive current collector and a positive electrode on the first LTCC dielectric substrate; Wow,
Forming a plurality of vias in the second LTCC dielectric substrate after forming an electrolyte cavity through removal of a portion of the dielectric substrate for a second LTCC and connecting the plurality of vias of the first LTCC dielectric substrate; ,
And a plurality of vias formed on the second LTCC dielectric substrate are connected to a plurality of vias of the first LTCC dielectric substrate so that the positive electrode is exposed by the electrolyte cavity, Aligning and laminating the first LTCC dielectric substrate on the first LTCC dielectric substrate,
Aligning and laminating the electrolyte substrate on the second LTCC dielectric substrate so that the electrolyte layer is seated inside the electrolyte cavity, removing the portion of the electrolyte substrate to form an electrolyte layer,
Forming a negative current collector and a negative electrode on top of the third LTCC dielectric substrate and forming a plurality of vias connected to the vias of the negative current collector and the second LTCC dielectric substrate;
Aligning and stacking the third LTCC dielectric substrate on the aligned and laminated resultant of the electrolyte substrate such that the negative electrode is connected to the electrolyte layer;
Forming a mounting cavity in which the internal chip is to be mounted through removal of a part of the fourth LTCC dielectric substrate, forming a circuit wiring on the fourth LTCC dielectric substrate exposed by the mounting cavity, A plurality of vias connected to the circuit wiring are formed on the fourth LTCC dielectric substrate, and the fourth LTCC dielectric substrate is connected to the vias of the dielectric substrate for the third LTCC dielectric substrate, And stacking and stacking the plurality of battery cells on the electrolyte substrate.
The method according to claim 6,
Wherein forming the positive current collector and the positive electrode comprises:
Forming a carrier film on a lower portion of the first LTCC dielectric substrate,
Forming two holes in the first LTCC dielectric substrate by using a laser or a punching machine;
Filling the two holes with a conductive metal material to form first and second vias connected to the two second input / output terminals,
And forming a positive current collector and first and second via pads by printing a metal material on an upper portion of the first LTCC dielectric substrate on which the first and second vias are formed, Packaging method.
8. The method of claim 7,
Forming a first dielectric layer on the second LTCC dielectric substrate,
Forming a carrier film on a lower portion of the second LTCC dielectric substrate,
Forming three holes in the second LTCC dielectric substrate by using the laser or the punching machine;
Filling the three holes with a conductive metal material to form third through fifth vias connected to the first and second via pads and connected to the positive current collector,
And printing the metal material on top of the third through fifth vias to form third through fifth via pads.
9. The method of claim 8,
The step of aligning and stacking the first LTCC dielectric substrate includes:
And removing the carrier film formed on the lower portion of the second LTCC dielectric substrate, and aligning and laminating the carrier film on the first LTCC dielectric substrate.
9. The method of claim 8,
Forming a plurality of vias connected to the vias of the second LTCC dielectric substrate,
Forming a carrier film on a lower portion of the third LTCC dielectric substrate,
Forming four holes in the third LTCC dielectric substrate by using the laser or the punching machine;
Sixth and seventh vias connected to the third and fourth via pads by embedding a conductive metal material in the four holes, an eighth via connected to the negative current collector, and an eighth via connected to the fifth via pad Forming a ninth via connected to the positive current collector through the fifth via connected to the fifth via pad;
And printing a metal material on top of the sixth and seventh vias to form sixth and seventh via pads.
11. The method of claim 10,
The step of aligning and laminating the electrolyte substrate on the aligned and laminated product comprises:
Aligning and stacking the third LTTC dielectric substrate on the aligned and laminated resultant of the electrolyte substrate after the third LTCC dielectric substrate is rotated so that the carrier film is on top,
And removing the carrier film formed under the third LTCC dielectric substrate.
9. The method of claim 8,
The step of aligning and laminating the third LTCC dielectric substrate on the aligned and laminated product comprises:
Forming a carrier film on a lower portion of the fourth LTCC dielectric substrate,
Forming two holes in the fourth LTCC dielectric substrate by using the laser or the punching machine;
Filling the two holes with a conductive metal material to form tenth and eleventh vias,
Printing a metal material on top of the fourth LTCC dielectric substrate to form circuit interconnections respectively connected to the tenth and eleventh vias,
Removing the carrier film formed on the lower portion of the fourth LTCC dielectric substrate, and aligning and stacking the third LTCC dielectric substrate on the aligned and stacked resultant.

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