KR101767730B1 - Wearable smart device having flexible semiconductor package on a band - Google Patents

Wearable smart device having flexible semiconductor package on a band Download PDF

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Publication number
KR101767730B1
KR101767730B1 KR1020150108806A KR20150108806A KR101767730B1 KR 101767730 B1 KR101767730 B1 KR 101767730B1 KR 1020150108806 A KR1020150108806 A KR 1020150108806A KR 20150108806 A KR20150108806 A KR 20150108806A KR 101767730 B1 KR101767730 B1 KR 101767730B1
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KR
South Korea
Prior art keywords
soft
module
band
flexible
semiconductor die
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KR1020150108806A
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Korean (ko)
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KR20170014847A (en
Inventor
송영희
이혁
송기홍
정준희
윤성식
Original Assignee
송영희
이혁
송기홍
정준희
윤성식
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Application filed by 송영희, 이혁, 송기홍, 정준희, 윤성식 filed Critical 송영희
Priority to KR1020150108806A priority Critical patent/KR101767730B1/en
Priority to PCT/KR2016/008431 priority patent/WO2017023058A2/en
Priority to CN201680042399.7A priority patent/CN108027589B/en
Priority to US15/746,098 priority patent/US10474192B2/en
Publication of KR20170014847A publication Critical patent/KR20170014847A/en
Application granted granted Critical
Publication of KR101767730B1 publication Critical patent/KR101767730B1/en

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    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B37/00—Cases
    • G04B37/14—Suspending devices, supports or stands for time-pieces insofar as they form part of the case
    • G04B37/1486—Arrangements for fixing to a bracelet
    • A—HUMAN NECESSITIES
    • A44—HABERDASHERY; JEWELLERY
    • A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
    • A44C5/00—Bracelets; Wrist-watch straps; Fastenings for bracelets or wrist-watch straps
    • A44C5/14—Bracelets; Wrist-watch straps; Fastenings for bracelets or wrist-watch straps characterised by the way of fastening to a wrist-watch or the like
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/08—Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H02J17/00—

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Telephone Set Structure (AREA)

Abstract

The wearable smart device of the present invention includes a main body on which a basic module is mounted, a bendable band formed by molding a polymer material or a rubber material, which is selectively detachably attached to the main body, on which at least one auxiliary module is mounted, And a coupler for physically connecting the body and the band. According to the configuration of the present invention as described above, it is possible to realize a high-capacity, high-performance smart device.

Description

TECHNICAL FIELD [0001] The present invention relates to a high-capacity multifunctional wearable smart device in which a flexible semiconductor package is mounted on a band,

The present invention relates to a wearable smart device in which a flexible semiconductor package is mounted on a band for realizing a high capacity and high-performance function. More specifically, in a smart watch or smart computer system worn on the wrist for ensuring mobility, However, it is designed to be able to exchange each auxiliary module into a band and exchange it in the band. However, according to the use purpose of the user, it is possible to use health care, fitness, The present invention relates to a wearable smart device in which extensibility is greatly improved by being selectively arranged in a customized manner in accordance with a use, a study, a life, an office, a game, or a music.

In recent years, smart watches have come on the market that can be worn in accessible places such as wrists and the end of sleeves of wrists.

This smart watch has the advantage of providing mobility and convenience. However, since the display area is small and the body volume is very small, it is possible to simply check the time or perform simple telephone and other data communication, and there is a problem that the function and the capacity are considerably restricted.

On the other hand, a device required for a smart watch may include various electronic circuit elements. These electronic circuit elements may be integrated into a semiconductor substrate called a semiconductor chip or die. Semiconductor chip packages are employed in electronic products such as computers, mobile devices or data storage.

However, as the demand for the mobility of electronic products such as a smart watch increases, interest in a stack package structure which can be bent or widened is increasing.

As interest in wearable electronics worn on the face, such as a form of eyeglasses requiring mobility, or on the wrist in the form of a watch or bracelet, has increased, Flexible characteristics that can be obtained are required.

KR Patent No. 10-2015-0025507

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a wearable smart device having a semiconductor package structure that does not interfere with functions even when bent or bent, .

Another object of the present invention is to provide a wearable smart device in which various modules having different functions according to the purpose of a user can be selectively packaged in units of a unit.

Another object of the present invention is to provide a wearable smart device that can compensate for such a high-capacity smart device such as a memory module or a battery module by using wireless data communication or wireless charging technology.

According to an aspect of the present invention, there is provided a wearable smart device including a main body on which a basic module is mounted, at least one auxiliary module mounted thereon, and selectively detachably attached to the main body, A bendable band formed of a material, a connector electrically connecting the body and the band, and a coupler physically connecting the body and the band.

According to another aspect of the present invention, a wearable smart device of the present invention includes a main body on which a basic module is mounted, a bendable band electrically connected to the main body, and auxiliary modules of respective functions selectively mounted on the bend .

According to another aspect of the present invention, a wearable smart device of the present invention comprises a main body on which a basic module is mounted, a band integrally connected to the main body and bent, and a soft semiconductor package so as to be embedded in the band, Wherein the flexible semiconductor package comprises: a flexible PCB including a flexible wiring pattern; a semiconductor die stacked on the flexible PCB and connected to the flexible PCB by wire bonding or flip chip bonding; and And a soft mold for protecting the soft semiconductor die.

As described above, according to the configuration of the present invention, the following effects can be expected.

First, the conventional wearable band is manufactured by inserting all the modules and memories in the main body. However, since there is a space limitation, there is a definite limitation in realizing a multifunctional high capacity. However, in the present invention, It is possible to expand the conventional functions by using more modules to suit the purpose and characteristics of the user.

For example, in addition to the basic battery of the main body, a supplementary battery is installed in the band, so that the battery can be expanded. Therefore, even if the basic battery is exhausted, the wearable band can be operated using the battery in the band. This allows charging via a wireless charger without a separate charging cable.

Second, if a flexible substrate is used instead of a rigid substrate to perform the packaging process, the flexible substrate can be wound around the supply roll, and the flexible substrate can be wound around the supply roll, Since a wiring pattern can be formed on a substrate, mass production by a roll-to-roll process is possible.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A and FIG. 1B are perspective views each showing a configuration of a wearable smart device of a band replaceable type according to the present invention; FIG.
2 is a sectional view showing a configuration of a soft semiconductor package according to the present invention;
3 is a perspective view showing a flexible band connected in a multiple block type according to the present invention;
Fig. 4 is an exemplary view showing an example of a band for gaming, an office band, and a music band according to the present invention; Fig.
FIG. 5 is a perspective view showing a configuration of a wearable smart device of the module replacement type according to the present invention. FIG.
FIG. 6 is a perspective view showing the configuration of a band-independent wearable smart device according to the present invention; FIG.

Brief Description of the Drawings The advantages and features of the present invention, and how to achieve them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.

Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific types of regions of the elements and are not intended to limit the scope of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a wearable smart device in which a flexible semiconductor package is mounted on a band according to the present invention having the above-described structure will be described in detail with reference to the accompanying drawings.

The present invention relates to a semiconductor package which is modularized and mounted on a band in a state where it is detachably attached to a main body, a semiconductor package is packaged in a rubber pack and selectively mounted on a band integrally connected to the main body, .

In this case, when the semiconductor package is bent, tensile stress or compressive stress locally acts on the PCB and the semiconductor die, thereby damaging the wiring pattern included in the PCB or separating the semiconductor die. Therefore, the semiconductor package includes a flexible PCB, a flexible PCB One or more flexible semiconductor dies stacked on the flexible PCB and wire bonded or flip chip bonded to the flexible PCB, and a soft mold protecting the flexible semiconductor die.

< First Embodiment >

FIGS. 1A and 1B are conceptual diagrams of a configuration of a wearable smart device of the band replaceable type according to the present invention. FIG. 1A shows a configuration in which a main body and a band are separated, and FIG. 1B shows a configuration in which a main body and a band are electrically connected and then physically connected.

1A and 1B, a band replaceable wearable smart device 100 according to an embodiment of the present invention includes a band 120 itself which can be exchanged from a main body 110, The module can be mounted. Therefore, the band 120 on which the module of each function is mounted can be detachably attached to the main body 110. That is, each function band 120 can be selectively coupled to the main body 110.

The band replaceable wearable smart device 100 includes a main body 110 on which the base module 102 is mounted, and auxiliary modules 112a, 112b, 112c, 112d and 112e mounted thereon and selectively detachably attached to the main body 110 A bendable or stretchable band 120, a connector 130 for electrically connecting the body 110 and the band 120 and a coupler 140 for physically connecting the body 110 and the band 120 .

The base module 102 includes a conventional semiconductor package that operates a display or other smart device. Thus, the base module 102 of the main body may include any module that enables a smart device, a personal digital assistant (PDA), a handheld PC, a mobile phone, or the like, .

Each of the auxiliary modules 112a through 112e cooperates with the base module 102 to enhance the functionality of the base module 102. [ For example, the auxiliary modules 112a through 112e may include memory devices or non-memory devices. And may include a battery. And may include a camera. And may include a speaker. LED or laser illumination.

In addition, it may further include an ECG other sensor module, a GPS receiving module, a micro SD slot, a secondary display module for further extending the display of the base module 102, and the like. For example, an electrocardiograph sensor can be used for biometrics technology by using an electrocardiogram (ECG) in biological signals. For this purpose, an electrocardiogram measuring sensor composed of a bioelectrode may be installed in the band 120.

2 is a cross-sectional view of the configuration of the soft semiconductor package. Referring to the drawings, the auxiliary modules 112a to 112e may be formed of a soft semiconductor package 10.

The flexible semiconductor package 10 is stacked on the flexible PCB 14 using the flexible PCB 14 including the flexible wiring pattern 12 and the adhesive member 16 and the conductive member 18 One or more flexible semiconductor dies 20 that are wire bonded or flip chip bonded using a flexible die 22 and a soft mold 22 that protects the flexible semiconductor die 20.

The flexible PCB 14 may be bent or bent. You can even fold it. For this purpose, the flexible substrate 14 may be formed of a polymer material. For example, the flexible substrate is typically formed of a material selected from the group consisting of polyimide (PI), polyester, polyethylene naphthalate (PEN), Teflon, polyethylene terephthalate (PET) ).

On the flexible PCB 14, a flexible wiring pattern 12 electrically connected to the conductive member 18 is formed. The flexible wiring pattern 12 can include a flexible conductive film made of copper (Cu), titanium (Ti), aluminum (Al), or a metal alloy.

The flexible wiring pattern 12 may include a conductive metal wiring formed through a deposition process and an etching process by a lithography process. However, for the sake of more flexibility, the flexible wiring pattern 12 may be formed by printing a conductive ink by a printing process Conductive metal lines.

Alternatively, the flexible wiring pattern may be formed by repeating vapor deposition and etching when a part of the substrate is removed by laser etching (scribing or cutting) on a polyimide (PI) substrate and then a wiring pattern is formed by depositing a conductive metal Since a metal wiring is first formed on a rigid substrate, a hardening polymer is coated and cured on the metal wiring, and then a rigid substrate is physically removed to form a polyimide ) A flexible substrate on which wiring patterns are formed on a substrate can be manufactured.

The flexible semiconductor die 20 may include memory devices or logic devices. Such devices are integrated on a silicon substrate, but the thickness of the silicon substrate is not more than several tens of micrometers so that it can be bent. The flexible semiconductor die 20 may have a structure in which one or more chips are stacked using the adhesive member 16. [

The adhesive member 16 may include a polymer material having excellent adhesion. Compared with a rigid substrate so that the flexible PCB 14 can bend or bend so that separation or separation does not occur between the flexible PCB 14 and the flexible semiconductor die 20, A substance having strong adhesion is required.

The soft mold 22 may be formed of a material bent or bent. For example, the soft mold 22 may comprise a material capable of providing stress. And may include a polymer, a rubber, or an elastomer. Or polyimide (polyimide).

For example, even if the flexible semiconductor die 20 or the flexible semiconductor package 10 is bent or bent arbitrarily, it is possible to expand and contract, and damage due to stress should be prevented even if stress occurs due to expansion and contraction. When the flexible wiring pattern 12 formed on the flexible PCB 14 is cut off or peeled from the flexible PCB 14 when the flexible semiconductor package 10 is bent or stretched, This is because it can not function as a semiconductor element.

The band 120 is replaceable. The coupler 140 connecting the main body 110 and the band 120 is disassembled and the band 130 can be removed by separating the connector 130. [

Referring to FIG. 3, a plurality of rigid bands of the band 120 may be coupled through a hinge pin, a hinge, or the like, and may be bent. The rigid bands are connected in a block-type manner, and the bending band can be realized by designing that each block band can be rotated at a certain angle. That is, the band 120 can be bent or bent at any time even if it is not ductile.

Referring again to FIG. 1A, the band 120 may exhibit elasticity through an integral flexible band.

The bending or folding band 120 may be formed of a flexible polymeric material or rubber. May be formed of polyimide in the polymer. When the flexible band is formed of such a material, tensile stress or compressive stress is applied to the semiconductor package or the semiconductor die so that it is not damaged even if the flexible band is bent.

Fig. 4 shows band configurations for various purposes according to the present invention. Referring to the drawings, each band 120 may be prepared for use according to the needs of the user. It can be used for health care, fitness, learning, life, office, game, music, etc. according to the purpose of the user.

As shown in FIG. 4 (a), in the case of a gaming band, a plurality of battery modules, a memory module, a camera module, and a speaker module may be included in consideration of a battery consumption.

As shown in FIG. 4 (b), the office band may include a battery module, a memory module, a laser point module, a power point button module, and an LED module.

As shown in FIG. 4, since the music band requires a large memory capacity, it may include a plurality of memory modules, a battery module, an LED module, and a speaker module.

1A and 1B, the connector 130 includes a first connector installed at one side of the band 120 and a second connector installed at one side of the body 110 so that the band 120 is electrically connected to the main body 110 And the second connector. For example, it can be classified into 4-pin male type and female type.

The base module 102 of the main body 110 and the auxiliary modules 112a to 112e of the band 120 can communicate with each other by wire using the connector 130. [ However, the communication between the base module 102 and the auxiliary modules 112a to 112e may be performed through wireless communication by omitting the connector or in parallel with the connector. .

At this time, the connection depth of the connector can be deepened for stable connection, and silicone or rubber molding can be applied to the joint portion of the connector 130 for waterproofing.

The coupler 140 includes a first coupler installed at one side of the band 120 and a second coupler installed at one side of the body so that the band 120 is not arbitrarily separated from the main body 110. For example, the ring can be fixed by hooking it to the ring. Or it can be designed to be detachably attached using a stopper or a spring. There are no restrictions on the type of combination.

< Second Embodiment >

In the wearable smart device according to another embodiment of the present invention, the band is fixedly coupled to the main body, but various functional modules may be replaceably mounted on the band. Therefore, the module of each function can be detached and attached to the band.

FIG. 5 shows a configuration of a wearable smart device of the module replacement type according to the present invention.

5, the module replaceable wearable smart device 200 includes a main body 210 on which a base module 202 is mounted, a bending band 220 electrically connected to the main body 210, and a band 220, 212b, 212c, 212d, and 212e, which are selectively installed in the main module 200a.

The auxiliary modules 212a, 212b, 212c, 212d, and 212e are unit packaged in a polymer pack or a rubber pack (not shown), and the band is provided with a mounting groove (not shown) on which the rubber pack is mounted. At this time, it is possible to deepen the depth of the mounting groove for stable mounting and to perform silicone or rubber molding processing so that water does not penetrate the area around the mounting groove. The seating groove may include a plurality of connection terminals (not shown) for electrically connecting the auxiliary modules 212a, 212b, 212c, 212d, and 212e to the base module 202. [

Here, the functions of the basic module 202 and the auxiliary modules 212a, 212b, 212c, 212d, and 212e are the same as those of the above-described embodiment, and thus description thereof is omitted.

However, the rubber pack may be formed of a flexible polymer, rubber, or other elastomer. May be formed of polyimide in the polymer. When the rubber pack is molded with such a material, even if the rubber pack is bent, tensile stress or compressive stress is applied to the built-in chip of the semiconductor package, so that it is not damaged.

< Third Embodiment >

The wearable smart device according to the third embodiment of the present invention is provided with an independent band separate from the main device, and the independent band can perform wireless data transmission and wireless power transmission through short-range communication with the main body of the main device.

These main devices and independent bands can be placed on the same wrist, or the main device can be installed on the left hand and independent bands on the right hand respectively.

FIG. 6 shows a configuration of a band-independent wearable smart device according to the present invention.

6, the band-independent wearable smart device 300 includes main units 110 and 120, main units 100 and 200 including main bands 210 and 220, and main units 100 and 200, And an independent band 320 capable of wireless data transmission through short-range communication and charging the battery through wireless power transmission.

Independent band 320 includes independent modules 312a, 312b, 312c, 312d, and 312e. The independent band 320 may be a flexible, retractable closed ring type. The independent band 320 may be made of a polyimide material as described above.

To this end, the independent modules 312a to 312e of the independent band 320 are equipped with a Bluetooth module, an infrared communication module, a ZigBee module, and the like, which have various communication functions such as communication via a network, And can perform real-time data communication with the base modules 102 and 202 or the auxiliary modules 112a to 112e of the main bodies 110 and 120 having the wireless communication module. Or wireless power transmission.

It is possible to perform data and battery transmission with the main devices 100 and 200 which are separated using the independent band 320 by using the Wireless Power Consortium (WPC) technology and the Near Field Communication (NFC) technology. For example, NFC coils are installed in each module for short-range communication, and data can be transmitted and received. In addition, a WPC coil is installed in each module for wireless power transmission, and wireless charging is possible.

In the present invention, if a WPC or other wireless charging module is installed in any one of the auxiliary modules 112a and 212a or the independent module 312a, it can be charged through a wireless charger without a separate charging cable.

< Fourth Embodiment >

Although not shown in the drawings, the band-integrated wearable smart device of the present invention can be integrally formed with a body to ensure watertightness or waterproofness without band replacement.

The band integrated type or fixed type wearable smart device may include a main body on which the basic module is mounted, a flexible band integrally connected to the main body, and an auxiliary module built in the band and electrically connected to the basic module.

In this way, the flexible band is integrally connected to the main body, and is electrically connected through the connector, but can be permanently connected without detachment.

As described above, according to the present invention, when the flexible semiconductor package is mounted on the band, the flexible semiconductor package can be modularized by mounting the flexible semiconductor package on the band, It can be seen that the technical idea is that the band is integrally connected to the main body by being detachably attached or detached from the main body or separated from the main body by independent bands. Many other modifications will be possible to those skilled in the art, within the scope of the basic technical idea of the present invention.

10: Flexible semiconductor package 12: Flexible wiring pattern
14: flexible PCB 16: adhesive member
18: conductive member 20: flexible semiconductor die
22: soft mold
100, 200, 300: Wearable smart device
102, 202: basic module 110, 210:
112a, 212a: auxiliary module 120, 220: band
130: connector 140: coupler
312a: independent module 320: independent band

Claims (10)


A main body on which the basic module is mounted;
A band on which at least one auxiliary module is mounted and which is selectively detachably attached to the main body and is formed of a polymer material or a rubber material so as to be bent;
A connector for electrically connecting the body and the band; And
And a coupler for physically connecting the body and the band,
Wherein the auxiliary module comprises a soft semiconductor package,
Wherein the soft semiconductor package comprises:
A flexible PCB including a flexible wiring pattern;
A flexible semiconductor die stacked on the flexible PCB using an adhesive member and connected to the flexible PCB using wire bonding or flip chip bonding; And
A soft mold for protecting the soft semiconductor die; Lt; / RTI &gt;
The flexible PCB is made of polyimide,
The flexible semiconductor die does not exceed a few tens of micrometers,
The soft mold is composed of a polymer,
Even when the soft PCB and the soft semiconductor die are bent or bent, tensile stress or compressive stress is prevented from being applied to the soft PCB and the soft semiconductor die,
Wherein the adhesive member prevents the peeling or separation phenomenon between the soft PCB and the soft semiconductor die from occurring even if the soft PCB and the soft semiconductor die are bent or bent. The method according to claim 1,
The basic module is a module of smart phone or smart watch function,
The auxiliary module includes a memory module, a battery module, a camera module, a speaker module, an LED module, a sensor module, and a display module in order to enhance the function of the base module in cooperation with the base module Features a wearable smart device. 3. The method of claim 2,
The band is used for game, office, or music,
Wherein the auxiliary module comprises at least two memory modules, and a battery module. A main body on which the basic module is mounted;
A band that is electrically connected to the body and is bent; And
And an auxiliary module of each function selectively mounted on the band in a prefabricated manner,
Further comprising an independent band spaced apart from the band by a predetermined distance and capable of wireless data transmission through short-range communication with the base module or the auxiliary module,
The independent band is a flexible, shrinkable closed ring type comprising one or more independent modules,
Wherein the independent module includes Bluetooth capable of performing wireless data communication with the base module or the auxiliary module via short-range communication, thereby performing real-time data communication with the base module,
Wherein the independent module is composed of a soft semiconductor package,
Wherein the soft semiconductor package comprises:
A flexible PCB including a flexible wiring pattern;
A flexible semiconductor die stacked on the flexible PCB using an adhesive member and connected to the flexible PCB using wire bonding or flip chip bonding; And
A soft mold for protecting the soft semiconductor die; Lt; / RTI &gt;
The flexible PCB is made of polyimide,
The flexible semiconductor die does not exceed a few tens of micrometers,
The soft mold is composed of a polymer,
Even when the soft PCB and the soft semiconductor die are bent or bent, tensile stress or compressive stress is prevented from being applied to the soft PCB and the soft semiconductor die,
Wherein the adhesive member prevents the peeling or separation phenomenon between the soft PCB and the soft semiconductor die from occurring even if the soft PCB and the soft semiconductor die are bent or bent. 5. The method of claim 4,
Wherein the auxiliary module is unit-packed in a polymer material or a rubber material pack, and the band is formed with a mounting groove on which the pack is mounted. delete delete 5. The method of claim 4,
Wherein the independent module includes a WPC coil to wirelessly charge the base module or the auxiliary module through wireless power transmission. A main body on which the basic module is mounted;
A band integrally connected to the main body and bent;
And an auxiliary module that is formed of a soft semiconductor package and is embedded in the band and is electrically connected to the base module,
Wherein the soft semiconductor package comprises:
A flexible PCB including a flexible wiring pattern;
A flexible semiconductor die stacked on the flexible PCB using an adhesive member and connected to the flexible PCB using wire bonding or flip chip bonding; And
And a soft mold for protecting the soft semiconductor die,
The flexible PCB is made of polyimide,
The flexible semiconductor die is a memory element integrated on a silicon substrate not exceeding several tens of micrometers,
The soft mold is composed of a polymer,
Even when the soft PCB and the soft semiconductor die are bent or bent, tensile stress or compressive stress is prevented from being applied to the soft PCB and the soft semiconductor die,
Wherein the adhesive member prevents the peeling or separation phenomenon between the soft PCB and the soft semiconductor die from occurring even if the soft PCB and the soft semiconductor die are bent or bent.
delete
KR1020150108806A 2015-07-31 2015-07-31 Wearable smart device having flexible semiconductor package on a band KR101767730B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020150108806A KR101767730B1 (en) 2015-07-31 2015-07-31 Wearable smart device having flexible semiconductor package on a band
PCT/KR2016/008431 WO2017023058A2 (en) 2015-07-31 2016-08-01 Wearable smart device having flexible semiconductor package mounted on band
CN201680042399.7A CN108027589B (en) 2015-07-31 2016-08-01 Wearable smart device with flexible semiconductor package mounted on strap
US15/746,098 US10474192B2 (en) 2015-07-31 2016-08-01 Wearable smart device having flexible semiconductor package mounted on a band

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KR1020150108806A KR101767730B1 (en) 2015-07-31 2015-07-31 Wearable smart device having flexible semiconductor package on a band

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KR101767730B1 true KR101767730B1 (en) 2017-08-14

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EP3474084A1 (en) * 2017-10-20 2019-04-24 Montres Breguet S.A. Fixing device for a bracelet
KR20190116749A (en) * 2018-04-05 2019-10-15 삼성전자주식회사 Method for performing wireless communication using biometric sensor and electronic device therefor
WO2021145475A1 (en) * 2020-01-14 2021-07-22 위피크 주식회사 Sport entertainment theme park operation management system using smart band

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KR20150025507A (en) 2013-08-29 2015-03-10 이영재 Smart Watch

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