KR101767485B1 - Infrared rays radiator using generate heat of led - Google Patents

Abstract

The present invention relates to a far-infrared ray radiator using generated heat of an LED, and specifically, to a far-infrared ray radiator using generated heat of an LED which emits far-infrared rays by coupling a plurality of LEDs disposed in a matrix or an array form in a pair and receiving the heat. Disclosed is the far-infrared ray radiator using generated heat of the LED, which comprises a flexible circuit board having a plurality of LEDs for emitting light of at least one wavelength band to the skin, and a far-infrared ray emitting body for emitting the far-infrared rays by the generated heat of a plurality of LEDs.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an infrared ray radiator,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to a far-infrared ray irradiating apparatus using LEDs, and more particularly, to a far-infrared ray irradiating apparatus using a heat generated from LEDs, which emit far infrared rays by receiving a heat by bundling a plurality of LEDs arranged in a matrix- And an irradiation device.

Recently, a large number of therapeutic instruments and therapeutic apparatuses using an LED have been developed. LED is a new technology that can replace general lighting with low power and high efficiency, and it is expected to be applied to various fields in the future. Unlike other light sources, these LEDs can extract their intrinsic wavelengths and can be used only at desired wavelengths. These features are being applied to the illumination for plant growth and the illumination for the pick-up, and in recent years, a method has been sought for extracting only useful wavelengths for the human body.

When the results of the research are cited, the early 400nm wavelength band is useful for the treatment of inflammation, and it is advantageous in the red wavelength band of 600nm ~ 660nm band to improve wrinkles and prevent aging, and it is advantageous to improve the diseases such as muscular pain in the far infrared wavelength band of 800nm or more. Recently, a variety of products have been introduced and used based on the results of domestic and foreign researches.

However, the treatment of such phototherapy is confined to the medical device, and it is a reality that the selection and experiment result of the LED is insufficient to be applied to the home-use irradiator.

Korean Patent Laid-Open Publication No. 10-2014-0134165 (entitled: Prostate far infrared ray heating apparatus) Korean Utility Model Registration No. 20-0241163 (entitled: Belt type massage device)

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a flexible circuit board in which LEDs having one or more wavelengths are mounted on a flexible circuit board to emit far-infrared rays using heat generated by LEDs It is an object of the present invention to provide a personal LED illumination apparatus capable of simultaneously providing a vibration treatment method by arranging vibration elements at the same time.

However, the objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

It is an object of the present invention to provide a flexible circuit board comprising a plurality of LEDs irradiated with light of at least one wavelength band to the skin and a far infrared ray emitting body for emitting far infrared rays by the heat of the plurality of LEDs Infrared ray irradiating device using the generated heat of LEDs.

The flexible circuit board is also provided with a thermally conductive pad for transmitting heat generated by a plurality of LEDs to the far-infrared ray emitting body.

Further, the thermally conductive pad is patterned to connect the plurality of LEDs and the far-infrared ray emitting body.

In addition, the far-infrared ray emitters are arranged in the central region of the four pairs of LEDs, and the heat generated by the four LEDs is transmitted to the far-infrared ray emitter through the thermally conductive pad to emit the far-infrared rays.

Further, the flexible circuit board includes an LED sheet in which LEDs are arranged in an array or a matrix, a heat conductive sheet disposed under the LED sheet, and a heat-radiating sheet disposed under the heat conductive sheet and made of flame retardant fiber.

In addition, the thermally conductive pad is patterned on the lower surface of the LED sheet.

In addition, the fixing portion for fixing the far-infrared ray emitting body is provided on the upper portion of the LED sheet, and is fixed by press bonding through heat sealing by a film or a silicon cover.

Further, a vibrating part for imparting a vibration stimulus to the skin is further included.

In addition, the vibrating portion is interlocked with the far-infrared ray emitting body.

A heat dissipation pad for transmitting the heat generated by the LED is formed on the lower portion of the LED sheet. A via hole is formed in the LED sheet at a position where the LED is disposed. Heat generated by the LED is transmitted to the heat dissipation pad through the via hole.

According to the present invention, since the far-infrared rays are emitted using the generated heat of the LED, independent heating parts for transmitting heat to the far-infrared rays are not required, so that the structure is simple and the energy saving effect is obtained.

Further, according to the present invention, by using a flexible circuit board, various shapes can be deformed and the shape can be preserved as it is.

In addition, according to the present invention, far-infrared rays and a vibration element are combined with the LED, thereby maximizing the therapeutic effect, so that the user can easily purchase the device at an economical price.

According to the present invention, it is possible to combine a medical adjuvant or a health treatment agent (such as a hot pack as an example) with the present invention, thereby maximizing the effect of treatment.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate preferred embodiments of the invention and, together with the description, serve to further the understanding of the technical idea of the invention, It should not be construed as limited.
1 is a view illustrating a configuration of a flexible circuit board according to an embodiment of the present invention,
FIG. 2 is a view showing the arrangement of LEDs and composite elements (far-infrared ray emitters and vibration elements) of an LED sheet according to an embodiment of the present invention,
3 is a view illustrating a thermally conductive pad according to an embodiment of the present invention,
4 is a view showing the arrangement of a far-infrared ray emitter and a vibration element according to an embodiment of the present invention,
5 is a diagram showing the configuration and control of a composite device (piezo actuator and LED chip) according to an embodiment of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. In addition, the embodiment described below does not unduly limit the content of the present invention described in the claims, and the entire structure described in this embodiment is not necessarily essential as the solution means of the present invention.

The far-infrared ray irradiating apparatus using the generated heat of the LED according to an embodiment of the present invention is directed to irradiate the skin with light of a specific wavelength band and at the same time emitting far-infrared rays by using the heat generated by the LED .

Hereinafter, a Far-Infrared Ray Irradiation Apparatus using LED heat generated according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.

As shown in FIG. 1, the Far-Infrared Ray Irradiation Apparatus using LED's generated heat according to an embodiment of the present invention includes a flexible circuit board 100. The flexible circuit board 100 is composed of the LED sheet 110, the heat conduction sheet 120, and the heat radiation sheet 130 in sequence. However, additional sheets may be added within a range not departing from the technical idea of the present invention. As an example, a diffusion sheet (not shown) provided on the upper surface of the LED sheet 110 allows the light source of the LED to change from the directivity to the diffusion type. At this time, the diffusion sheet and the LED sheet 110 may be bonded together by a vacuum deposition method to prevent foreign matter from penetrating.

The LED sheet 110 according to an embodiment of the present invention is composed of a double-sided film substrate, and the upper portion of the film substrate is marked with white solder to prevent the color from changing. As shown in FIGS. 1 and 2, the LED chips 210 of the LED unit 200 are sequentially arranged in an array or a matrix on the upper surface of the LED sheet 110. Since the LED sheet 110 is flexible and flexible, it is free to be curled or folded. A pattern for solder connection with the LED chip 210 is formed on the upper surface of the LED sheet 110. A via hole 230 is formed on the upper and lower surfaces of the LED sheet 110 as shown in FIG. The copper foil 220 is formed on the lower surface of the via hole 230 to emit heat generated by the LED chip 210 and to increase the surface area of the heat dissipation. Further, a heat conductive pad 240, which will be described later, is connected from the copper foil 220 to transmit heat to the far infrared ray emitting body 300. The heat generated from the LED chip 210 is discharged to the lower surface of the LED sheet 110 via the via hole 230 and the heat of the LED chip 210 is transferred to the copper foil 220, As shown in the figure, heat generated by the LED chip is transferred to the thermally conductive pad 240 connected to the respective copper foils 220 of the four LED chips, and heat is finally transferred to the far-infrared ray emitters 300. The generated heat of the LED chip 210 generates far-infrared rays from the far-infrared ray emitting body. 3, the heat generated by the four LED chips 210 may be collected. However, if necessary, the heat generated by the two LED chips 210 may be collected. Alternatively, when the power consumption of the LED chips 210 is high, The heat generated by the LED chip 210 may be used. Of course, the heat generated by four or more LED chips 210 may be used.

The via hole 230 is formed in a substantially central region of the position where the LED chip 210 is placed and the via hole 230 is formed in the LED chip 210 so that the generated heat of the LED chip 210 can be well discharged to the lower surface of the LED sheet 210. [ And the LED chip 210 is disposed on the via hole 230. The size of the via hole 230 is set to be within a range of 0.1 to 0.5 mm so that foreign substances are prevented from penetrating. In addition, it is preferable that the size of the via hole 230 is minimized and the heat is transferred to the copper foil 220 as much as possible, thereby transferring much heat to the far-infrared ray emitting body 300. The copper foil 220 may be formed only on the lower surface of the LED sheet 110 or may be formed to penetrate the upper surface and the lower surface of the LED sheet 110. The heat generated from the LED chip 210 can be transmitted to the thermally conductive pad 240 more efficiently than when the upper surface and the lower surface of the LED sheet 110 are formed.

Meanwhile, it is preferable that the LED chip 210 has an interval of approximately 10 mm to 15 mm, but the LED chip 210 may be spaced apart depending on the use environment. In order to prevent detachment of the LED chip due to the ductility characteristic in the adhesion of the LED chip 210, It is preferable to apply lead that melts at a melting point of 280 degrees or higher. However, the melting point of lead refers to the melting point of lead, which can be adhered at a high temperature because a flexible type is used when lead containing a large amount of Ag (silver) is used and the LED chip may drop during vibration. However, the melting point of about 280 degrees mentioned above may be lower than this depending on the use environment.

It is preferable to form a via hole 230 for fixing the upper and lower portions of the lead pattern to which the LED chip is attached. The LED chip 210 arranged in a matrix or an array form may be composed of LEDs that generate one wavelength band as a whole, or LEDs having a plurality of wavelengths. Accordingly, in the case of an LED having a plurality of wavelength ranges, it is possible to arrange LEDs having various wavelength ranges in each region of the LED sheet 110 appropriately. As an example, the LED sheet 110 may be divided into quarter regions and four different wavelength regions may be arranged in the respective regions. Such a layout principle can constitute various embodiments by various methods. A connection line between the LED chips is patterned on the upper surface of the LED sheet 110, and a thermally conductive pad 240 is patterned on the lower surface.

An LED chip for surface mounting is suitable for mounting the LED chip 210 on the LED sheet 110. The size of the LED is preferably 5050 or less in size, and it is preferable to use an LED having a size of less than 0.5W. The reason for limiting the size and power of the LED is to prevent the skin from being damaged due to heat when the LED touches or comes close to the skin. Since the LED used in one embodiment of the present invention is a surface light emitting body, it is possible to use a plurality of LEDs having a lower output than a high output LED.

On the other hand, it is preferable not to use the fluorescent material on the LED chip 210. That is, when a fluorescent material is used, there is a possibility that a color distribution is widened because a composite color is included instead of a color inherent to the LED, and the width of the therapeutic wavelength range is widened, and the therapeutic effect can not be maximized.

A heat radiation pad (not shown) for transmitting the heat generated by the LED chip 210 is formed on the LED sheet 110. Although the heat radiating pad is not shown in the drawing, a copper plate formed on the upper and lower surfaces of the LED sheet 110 may be embodied as a heat radiating pad, and the heat radiating pad serves as a heat radiating plate.

The heat generated in the four LED chips 210 is transferred to the copper foil 220 and the heat transferred to the copper foil 220 is transferred to the thermally conductive pad 240 as shown in FIGS. Heat is transferred to the thermally conductive pad 240 in a pair of four LED chips 210. The thermally conductive pad 240 is connected to the respective copper foils 220 of the four LED chips 210 by making an approximately "H " The far infrared ray emitting body 300 and the vibrating unit 400 are disposed in a substantially central region of the thermally conductive pad 240 or a central region of the pair of LED chips 210. [ Here, the pair of LED chips 210 means two or more LED chips 210 as required, and it is also possible to transmit heat to the thermally conductive pads 240 even by one pair of LED chips 210 Is as described above.

As shown in FIG. 4, the far-infrared ray emitting body 300 is placed on the upper surface or the lower surface of the LED sheet 110 in the space between the LED chips 210, and the thermally conductive pad 240 is heated And is formed in a copper pattern on the lower surface of the LED sheet 110 to transmit or emit light. Heat generated in the LED chip 210 is transferred from the copper foil 220 or the via hole of the copper foil to the thermally conductive pad 240 so that far infrared rays or anions are emitted. In addition, since the vibration unit 400 for imparting a vibration stimulus to the skin is embodied by the piezo actuator 410, the skin of the human body is irradiated with the LED light of a specific wavelength band and the far-infrared ray, . As described above, by transmitting the generated heat of the LED to the far-infrared ray emitting body 300, it is possible to simultaneously achieve the effect of emitting the far-infrared ray and the structure of dissipating the LED.

The heat dissipation of the LEDs is achieved by forming upper or lower portions (or upper and lower portions) of the copper plate to enhance the bonding force and to facilitate heat dissipation and minimize the thickness of the copper plate on the side of the far infrared ray emitting body 300 or the vibration unit 400, So as to have a generally flexible characteristic.

The far-infrared ray emitting body 300 is fixed on the upper surface or the lower surface of the LED sheet 110 by the fixing portion 310. The fixing portion 310 prevents the far-infrared ray emitting body 300 from being separated from the LED sheet 110, and various fixing means can be employed. The fixing portion 310 is not limited to the technical idea of the present invention It can be variously adopted.

The piezo actuator 410 may be inserted into the far infrared ray emitter 300 or may be coupled outside the far infrared ray emitter 300. As shown in FIG. 4, a groove having a size enough to allow the piezo actuator 410 to be inserted into the far-infrared ray emitter 300 is formed inside the far-infrared ray emitter 300, and the piezo actuator 410 An elastic means such as a spring may be disposed in a space between the far-infrared ray emitters 300 in the circumferential direction. Therefore, the far-infrared ray emitter 300 emits far-infrared rays by the generated heat of the LED chip 210, and can give a slight vibration stimulus to the skin by the vibration of the piezo actuator 410. At this time, when the temperature of the far-infrared ray emitting body 300 is high, the temperature to be delivered to the skin can be lowered by covering a cover (not shown) or the like for preventing skin burns.

When the piezo actuator 410 is coupled to the outside of the far-infrared ray emitter 300, the piezo actuator 410 is coupled to the upper side of the far-infrared ray emitter 300, A transmission medium for transmitting a stimulus to skin can be coupled with the piezo actuator 410 to transmit a fine vibration stimulus to the skin. The transmission medium (not shown) may be a cover made of a plastic material that can wrap the piezo actuator 410, or any medium that can effectively transmit a vibration stimulus may be employed in the present invention. In addition, the piezo actuator 410 may be independently disposed in the LED sheet 110 without being coupled to the inside or the outside of the far-infrared ray emitting body 300.

The far-infrared ray emitting body 300 may be made of a ceramic material, a carbon element, a carbon element having a molecular structure, a jade or germanium element, or the like, but a ceramic material may be preferable. The far infrared ray emitting body 300 has a substantially cylindrical shape, and the inside of the circular structure is formed into an empty coin shape so that the piezo actuator 410 can be inserted therein. The piezo actuator 410 is preferably a device having a vibrating force of at least 100 times per second, but a device having a lower frequency may also be used.

The portion surrounding the far infrared ray emitting body 300 or the piezo actuator 410 is formed of a rubber material or a silicone material so as to prevent it from being detached from the flexible circuit board 100 due to elasticity during vibration. Infrared light emitting body 300 and the LED chip 210 to be mounted on the upper portion of the LED sheet 110 by using a film or a silicon cover.

The projected height of the far-infrared ray emitting body 300 or the piezo actuator 410 can prevent the light of the LED from being irradiated directly on the skin of the human body.

5, a control unit 500 for controlling the piezo actuator 410 and the LED chip 210 is shown. The control unit 500 has a structure in which the flexible circuit board 100 is easily detachable. The control unit 500 controls the brightness, wavelength, and irradiation time of the LED, and also controls the oscillation period and the oscillation frequency of the oscillation unit 400. The irradiation time periodically or non-periodically operates according to the user's selection. In addition, the controller 500 senses heat from the thermally conductive pad 240 and alerts the user when the temperature is higher than the predetermined temperature. At this time, a sensor for detecting heat may be added, and a buzzer or a warning light emitting device may be further added to warn the user. In addition, the controller 500 may sense the heat from the thermally conductive pad 240 and display the emission amount of the far-infrared rays to the user. A display portion may be added for displaying the emission amount. The display unit informs the user in real time about the amount of emission, the state of the current product, and the amount of LED light.

The heat conductive sheet or adhesive sheet 120 (hereinafter, referred to as a heat conductive sheet) according to an embodiment of the present invention bonds the upper flexible sheet 110 and the lower heat dissipation sheet 130 to each other, So that the heat generated in the heat exchanger can be easily transmitted. In addition, the heat conductive sheet 120 is configured to have an interval of 10 mm so as to be attached on the connection line between the LED and the LED.

The heat-radiating sheet 130 according to an exemplary embodiment of the present invention is formed of a fiber to which a flame retardant is added to a polyester fiber so that the heat can be evenly diffused, and a carbon nanotube molecule is applied to the upper portion of the heat- Lt; / RTI > The heat-radiating sheet 130 may have a checkered structure, and preferably has a structure of two rows and two columns. Whereby the air flow path is formed in a zigzag shape inside the fiber. The structure of the air passage structure is such that the air can move smoothly while increasing the contact area between the air and the heat radiation fiber sheet.

The frame 140 according to an exemplary embodiment of the present invention may be configured to closely adhere to the LED sheet 110 using a rubber finishing agent, thereby enhancing waterproof and dustproof characteristics from the outside. The flexible circuit board 100 may be freely formed by inserting a wire such as aluminum or copper wire as a whole into the rim of the flexible circuit board 100. Accordingly, the flexible circuit board 100 itself is flexible, and the flexible circuit board 100 can be flexibly formed by inserting the flexible wire into the rim of the flexible circuit board 100, so that the shape of the flexible circuit board 100 can be maintained. Therefore, when the user uses the product, it is possible to form the shape of the desired shape and contact the skin. Further, since the Velcro tape is attached to the frame at the upper portion or the lower portion of the frame 140, the attachment to the external attachment is convenient. The Velcro tape attached to the upper part of the frame 140 can be attached to the therapeutic pack, and the Velcro tape attached to the lower part is for fixing to other attachments. However, the Velcro tape is only one embodiment for fixation with the attachment, and other fixing means can be adopted without departing from the technical idea of the present invention. On the other hand, the power supply line for supplying external power is installed at a lower portion of the flexible circuit board and prevents the power supply line from escaping through fixation with the heat-radiating sheet 130.

The configuration and functions of the above-described components have been described separately from each other for convenience of description, and any of the components and functions may be integrated with other components or may be further subdivided as needed.

Although the present invention has been described with reference to the embodiment thereof, the present invention is not limited thereto, and various modifications and applications are possible. In other words, those skilled in the art can easily understand that many variations are possible without departing from the gist of the present invention. In the following description, well-known functions or constructions relating to the present invention as well as specific combinations of the components of the present invention with respect to the present invention will be described in detail with reference to the accompanying drawings. something to do.

100: Flexible circuit board
110: LED sheet
120: Heat conduction sheet (adhesive sheet)
130: Heat-radiating sheet
140: frame
200:
210: LED chip
220: Copper foil
230: via hole
240: thermally conductive pad
300: far-infrared ray emitter
310:
400:
410: Piezo actuator
500:

Claims (10)

A flexible circuit board having a plurality of LEDs for emitting light of at least one wavelength band to the skin,
And a far-infrared ray emitting body for emitting far-infrared rays by the generated heat of the plurality of LEDs,
In the flexible circuit board,
A thermally conductive pad is formed to transmit the generated heat of the plurality of LEDs to the far-
Wherein the thermally conductive pad comprises:
And a plurality of LEDs patterned to connect the plurality of LEDs with the far-
The far-
Are arranged in the central region of the LEDs which are paired with each other,
And heat generated from the four LEDs is transmitted to the far-infrared ray emitter through the thermally conductive pad to emit the far-infrared rays.
delete delete delete The method according to claim 1 ,
The flexible circuit board includes:
An LED sheet in which the LEDs are arranged in an array or a matrix,
A heat conductive sheet disposed under the LED sheet, and
And a heat radiation sheet disposed below the heat conduction sheet and made of flame retardant fiber.
6. The method of claim 5,
Wherein the thermally conductive pad comprises:
Wherein the LED sheet is patterned on the lower surface of the LED sheet.
6. The method of claim 5,
The fixing unit for fixing the far-
Wherein the LED is provided on an upper portion of the LED sheet, and is press-fixed through heat welding by a film or a silicon cover.
The method according to claim 1,
Further comprising a vibration part for giving a vibration stimulus to the skin.
9. The method of claim 8,
The vibrating unit may include:
Infrared rays emitted from the far-infrared ray emitting body.
6. The method of claim 5,
And a heat dissipation pad for transmitting the heat generated by the LED to the lower portion of the LED sheet,
A via hole is formed in the LED sheet at a position where the LED is disposed,
And the generated heat of the LED is transmitted to the heat radiating pad through the via hole.

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