KR101762059B1 - EUV pellicle structure, and method for manufacturing same - Google Patents

EUV pellicle structure, and method for manufacturing same Download PDF

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Publication number
KR101762059B1
KR101762059B1 KR1020160004118A KR20160004118A KR101762059B1 KR 101762059 B1 KR101762059 B1 KR 101762059B1 KR 1020160004118 A KR1020160004118 A KR 1020160004118A KR 20160004118 A KR20160004118 A KR 20160004118A KR 101762059 B1 KR101762059 B1 KR 101762059B1
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South Korea
Prior art keywords
cooling structure
pellicle
pellicle membrane
euv
heat
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KR1020160004118A
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Korean (ko)
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KR20170085161A (en
Inventor
안진호
김정환
홍성철
우동곤
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한양대학교 산학협력단
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Priority to KR1020160004118A priority Critical patent/KR101762059B1/en
Priority to PCT/KR2017/000262 priority patent/WO2017122975A1/en
Publication of KR20170085161A publication Critical patent/KR20170085161A/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Abstract

Preparing a pellicle membrane in which a plurality of EUV (Extreme Ultraviolet) permeable layers and a heat-releasing layer are alternately laminated, and heating the pellicle membrane from the pellicle membrane on an exposed sidewall of the heat- A method of manufacturing an EUV pellicle structure including the step of disposing an absorbing cooling structure can be provided.

Description

EUV pellicle structure, and method of manufacturing the same

The present invention relates to an EUV pellicle structure and a manufacturing method thereof, and more particularly to an EUV pellicle structure including a pellicle membrane having a heat-releasing layer inserted therein and a cooling structure for absorbing and dissipating heat from the heat- Lt; / RTI >

As the circuit line width of a semiconductor device is rapidly miniaturized, there is a limitation in forming a fine pattern with a liquid immersion ArF exposure apparatus using a light source of a 193 nm wavelength band currently used. In order to form a fine pattern without improving the light source and the exposure equipment, techniques such as double exposure or quadruple exposure have been applied. However, in the production of semiconductor devices where mass production is important, an increase in the number of processes, an increase in the process price, And a decrease in the number of sheets.

To solve these problems, a next-generation exposure apparatus using extreme ultraviolet lithography using an extreme ultraviolet ray having a wavelength of 13.5 nm is being developed. Reflective reticles, such as mirrors, are used instead of conventional transmissive reticles because light from a 13.5 nm wavelength used in extreme ultraviolet lithography techniques is absorbed by almost all materials. If impurities such as dust or foreign matter adhere to the reticle, light is absorbed or reflected due to the impurities, so that the transferred pattern is damaged, resulting in a problem that performance or yield of a semiconductor device, a liquid crystal display plate, etc. is lowered . Therefore, a method of attaching a pellicle to the surface of the reticle is carried out to prevent impurities from adhering to the surface of the reticle. For this reason, researches on the development of pellicles having high transmittance and thin thickness characteristics against extreme ultraviolet rays are actively conducted.

For example, Korean Patent Registration No. KR1552940B1 (Application No. KR20130157275A, Applicant: Samsung Electronics Co., Ltd.) discloses a method for producing a graphite-containing thin film having a high tensile strength with high EUV permeability with a pellicle film for extreme ultraviolet lithography .

In order to improve the process efficiency of the semiconductor manufacturing process, there is a continuing research to apply a high-power light source to extreme ultraviolet lithography exposure equipment. When a high-power light source is used, the temperature of the pellicle membrane rapidly increases, which causes bowing of the pellicle membrane, which may interfere with the pattern shape or destroy the pellicle membrane. Therefore, it is necessary to study a method of solving the thermal deformation problem of the pellicle membrane due to the increase of the temperature of the pellicle membrane.

Korean Patent Registration No. KR1552940B1

SUMMARY OF THE INVENTION The present invention provides a method of manufacturing an EUV pellicle structure having improved heat dissipation efficiency.

It is another object of the present invention to provide a method of manufacturing an EUV pellicle structure with improved permeability to EUV.

 It is another object of the present invention to provide a method of manufacturing an EUV pellicle structure with reduced processing time and process cost.

It is another object of the present invention to provide a method of manufacturing an EUV pellicle structure that is easy to mass-produce an EUV mask or a reticle.

It is another object of the present invention to provide a method of manufacturing an EUV pellicle structure that is easy to produce in full-size.

The technical problem to be solved by the present invention is not limited to the above.

In order to solve the above-mentioned technical problems, the present invention provides a method of manufacturing an EUV pellicle structure.

According to one embodiment, the method of manufacturing an EUV pellicle structure includes the steps of preparing a pellicle membrane in which a plurality of EUV (Extreme Ultraviolet) permeable layers and a heat release layer are alternately laminated, and the heat releasing layer of the pellicle membrane And disposing a cooling structure that absorbs heat from the pellicle membrane on the exposed sidewall.

According to one embodiment, the cooling structure comprises: first and second portions extending opposite each other in a first direction; and third and fourth portions extending in opposing directions in a second direction intersecting the first direction, Wherein the first to fourth portions are comprised of one body and the step of disposing the cooling structure may include inserting the pellicle membrane into the integral cooling structure.

According to one embodiment, the cooling structure further includes an inwardly protruding receiving portion surrounded by the first to fourth portions, and the step of disposing the cooling structure includes disposing the cooling structure on the receiving portion of the cooling structure, And inserting the pellicle membrane into the cooling structure so that the membrane is disposed.

According to one embodiment, the cooling structure comprises first and second segments extending in opposition to each other in a first direction, and third and fourth segments extending opposite each other in a second direction intersecting the first direction, And wherein the step of disposing the cooling structure may include attaching the first through fourth segments independently to the pellicle membrane.

According to one embodiment, the cooling structure further includes an inwardly protruding receiving portion surrounded by the first through fourth segments, and the step of disposing the cooling structure includes disposing the cooling structure on the receiving portion of the cooling structure, And inserting the pellicle membrane into the cooling structure so that the membrane is disposed.

According to one embodiment, the heat-releasing layer transfers heat absorbed from the EUV transmissive layer to the cooling structure, and the cooling structure absorbs heat absorbed from the EUV transmissive layer and the heat- Lt; / RTI >

According to one embodiment, the method of manufacturing the EUV pellicle structure may further comprise preparing a pellicle frame before placing the cooling structure, and attaching the pellicle membrane on the pellicle frame .

According to one embodiment, the method of manufacturing the EUV pellicle structure may include covering the outer surface of the pellicle frame.

In order to solve the above-described technical problem, the present invention provides an EUV pellicle structure.

According to one embodiment, the EUV pellicle structure comprises a pellicle membrane in which a plurality of EUV (Extreme Ultraviolet) permeable layers and a heat release layer are alternately laminated, and a sidewall on which the heat release layer of the pellicle membrane is exposed, And a cooling structure surrounding the pellicle membrane and absorbing heat from the pellicle membrane.

According to one embodiment, the cooling structure may include an inner surface receiving heat from the heat releasing layer in direct contact with the heat releasing layer of the pellicle membrane, and an outer surface releasing heat to the outside have.

According to one embodiment, the outer surface of the cooling structure may include one having a protruded pattern shape.

According to one embodiment, the cooling structure may further comprise a receiving portion led to the inside of the cooling structure in which the pellicle membrane is disposed, and the pellicle membrane may be disposed on the receiving portion.

According to one embodiment, the EUV pellicle structure may further include a pellicle frame supporting the pellicle membrane and surrounded by the cooling structure.

According to an embodiment of the present invention, there is provided a method of manufacturing a pellicle membrane, comprising the steps of: preparing a pellicle membrane in which a plurality of EUV permeable layers and a heat releasing layer are alternately laminated; And a method of manufacturing the EUV pellicle structure.

First, when the EUV transmissive layer including a substance with a low extinction coefficient is used, since the absorptivity of the EUV transmissive layer with respect to EUV is small, it is possible to manufacture the EUV transmissive layer having a relatively high transmissivity even though it has a relatively thick thickness . In addition, when the heat-releasing layer including a material having a high thermal conductivity is used, it is possible to manufacture the pellicle membrane in which the thermal stress concentrated on the EUV exposed portion of the pellicle membrane is reduced and the thermal durability is improved. Thus, according to the embodiment of the present invention, a method for producing the pellicle membrane excellent in permeability to EUV, mechanical strength, and thermal stability can be provided.

Also, a protruding pattern may be formed on the outer surface of the cooling structure including the material having a high emissivity, so that the heat absorbed from the pellicle membrane through the cooling structure may be easily radiated.

In addition, according to an embodiment of the present invention, the cooling structure may include a receiving portion replacing the role of the pellicle frame supporting the pellicle membrane. Accordingly, the step of attaching the pellicle membrane on the pellicle frame can be omitted, so that the processing time and the process cost can be reduced.

In addition, when the cooling structure includes the first to fourth segments of the separated structure including the accommodation portion, and the first to fourth segments are independently attached to the pellicle membrane, the edge portion of the pellicle membrane The cooling structure can be attached more closely to the cooling structure and the contact efficiency between the cooling structure and the pellicle membrane can be improved. Accordingly, the heat release efficiency of heat accumulated inside the pellicle membrane through the cooling structure to the outside can be improved, and the EUV pellicle structure improved in thermal stability can be provided.

1 is a perspective view of an EUV pellicle structure according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of the EUV pellicle structure according to the first embodiment of the present invention taken along line A-B in FIG. 1;
3 is a flowchart illustrating a method of manufacturing an EUV pellicle structure according to a first embodiment of the present invention.
4 is a view for explaining a method of manufacturing an EUV pellicle structure according to a first embodiment of the present invention.
5 is a perspective view illustrating an EUV pellicle structure according to a second embodiment of the present invention.
6 is a view for explaining a method of manufacturing an EUV pellicle structure according to a second embodiment of the present invention.
7 is a perspective view of an EUV pellicle structure according to a third embodiment of the present invention.
8 is a cross-sectional view of an EUV pellicle structure according to a third embodiment of the present invention.
9 is a view for explaining a method of manufacturing an EUV pellicle structure according to a third embodiment of the present invention.
10 is a perspective view illustrating an EUV pellicle structure according to a fourth embodiment of the present invention.
11 is a view for explaining a method of manufacturing an EUV pellicle structure according to a fourth embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical spirit of the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

In this specification, when an element is referred to as being on another element, it may be directly formed on another element, or a third element may be interposed therebetween. Further, in the drawings, the thicknesses of the films and regions are exaggerated for an effective explanation of the technical content.

Also, while the terms first, second, third, etc. in the various embodiments of the present disclosure are used to describe various components, these components should not be limited by these terms. These terms have only been used to distinguish one component from another. Thus, what is referred to as a first component in any one embodiment may be referred to as a second component in another embodiment. Each embodiment described and exemplified herein also includes its complementary embodiment. Also, in this specification, 'and / or' are used to include at least one of the front and rear components.

The singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. It is also to be understood that the terms such as " comprises "or" having "are intended to specify the presence of stated features, integers, Should not be understood to exclude the presence or addition of one or more other elements, elements, or combinations thereof.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

FIG. 1 is a perspective view of an EUV pellicle structure according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the EUV pellicle structure according to the first embodiment of the present invention, taken along line A-B in FIG.

Referring to FIGS. 1 and 2, an EUV pellicle structure 100 according to a first embodiment of the present invention may include a pellicle membrane 20, a cooling structure 10, and a pellicle frame 40.

The pellicle membrane 20 may have a structure in which a plurality of EUV (Extreme Ultraviolet) transmission layers 23 and a heat-releasing layer 25 are alternately stacked. According to one embodiment, the EUV transmissive layer 23 may comprise a stabilized compound of a material having an extinction coefficient for EUV of 0.01 or less, or a extinction coefficient for the EUV of 0.01 or less. For example, the EUV transmissive layer 23 may include beryllium (Be), boron (B), carbon (C), silicon / silicon (Si), phosphorus (P) , Sulfur (S), potassium (K), calcium (Ca), scandium (Sc), bromine (Br), rubidium (Rb), strontium (Sr), yttrium (Y), zirconium Nb), molybdenum (Mo), barium (Ba), lanthanum (La), cerium (Ce), praseodymium (Pr) and uranium (U). Alternatively, the EUV transmissive layer 23 includes an oxide, a nitride, a carbide, and a boride of a substance having a extinction coefficient for the EUV described above that is a stabilized compound of a substance having an extinction coefficient for the EUV of 0.01 or less . The EUV transmissive layer 23 may be required to have a thin thickness to improve the transmission of the pellicle membrane 20 to the EUV. As described above, in the case of the EUV transmissive layer 23 including a material with a low extinction coefficient, since the absorptivity of the EUV transmissive layer 23 with respect to EUV is small, it is possible to have a high transmissivity characteristic even with a relatively thick thickness . According to one embodiment, the thickness of the EUV transmissive layer 23 may be 100 nm or less.

According to one embodiment, the heat-releasing layer 25 may include a material having a thermal conductivity of 10 W / mK or more at a temperature of 300K. For example, the heat-releasing layer 25 may include metals or carbon nanostructures.

In the case of the heat-releasing layer 25 including a material having a high thermal conductivity as described above, the thermal stress generated in the pellicle membrane 20 is conducted and dispersed to the periphery, so that the pellicle membrane 20 is concentrated in the EUV- Thermal stress can be minimized. Accordingly, thermal deformation and physical destruction of the pellicle membrane 20 due to the thermal stress can be minimized. Specifically, the heat-releasing layer 25 absorbs heat from the EUV-permeable layer 23 and radiates heat to the cooling structure 10, which will be described later, to be accumulated in the EUV-permeable layer 23 by continuous EUV irradiation Thermal deformation of the EUV transmissive layer 23 caused by heat can be minimized.

In addition, the heat-emitting layer 25 may serve to support the EUV-permeable layer 23. As described above, the EUV transmissive layer 23 may be required to have a thin thickness to improve the transmission of the pellicle membrane 20 to the EUV. The plurality of heat-emitting layers 25 are arranged so as to be alternately stacked with the plurality of the EUV transmissive layers 23, thereby completing the physical characteristics of the EUV transmissive layer 23 having a low mechanical strength due to its thin thickness can do. According to one embodiment, the thickness of the heat-releasing layer 25 may be 100 nm or less.

As described above, when the EUV transmissive layer 23 including a substance having a low extinction coefficient is alternately stacked and the heat release layer 25 including a substance having a high heat conductivity are alternately stacked, the transmittance to EUV, The EUV pellicle membrane 20 having excellent mechanical strength and thermal stability can be provided.

According to one embodiment, the pellicle membrane 20 in which the EUV transmissive layer 23 including a plurality of silicon nitride (SiN x ) and the heat-releasing layer 25 including a graphene single thin film are alternately stacked, , The transmittance of the pellicle membrane 20 to EUV may be 90% or more.

The cooling structure (10) comprises a first portion (11) and a second portion (12) extending opposite to each other in a first direction, and extending in a second direction intersecting the first direction A third portion 13, and a fourth portion 14. [ The first to fourth portions 11, 12, 13, and 14 of the cooling structure 10 may be one body. According to one embodiment, the cooling structure 10 may comprise a material having an emissivity of 0.5 or greater at a temperature of 300K. For example, the cooling structure 10 may include metal oxides, or ceramics materials.

According to one embodiment the cooling structure 10 comprises a structure in which the pellicle membrane 20 is disposed on an exposed sidewall of the heat release layer 25, Lt; / RTI > Accordingly, the cooling structure 10 has an inner surface that receives heat from the heat-releasing layer 25 by directly contacting the heat-releasing layer 25 of the pellicle membrane 20, And may include an outer surface that radiates heat to the exterior.

According to one embodiment, the outer surface of the cooling structure 10 may include a protruding pattern shape. Due to the pattern formed on the outer surface of the cooling structure 10, the heat absorbed from the pellicle membrane 20 into the cooling structure 10 can be easily radiated to increase the cooling rate of the pellicle membrane 20 . According to one embodiment, the pattern included on the outer surface of the cooling structure 10 may be micro or nano sized.

As described above, the heat absorbed from the EUV transmissive layer 23 into the heat-releasing layer 25 can be transferred to the cooling structure 10. The cooling structure 10 can dissipate the heat absorbed from the EUV-permeable layer 23 and the heat-releasing layer 25 to the outside. Accordingly, a temperature gradient is continuously generated between the exposed portion of the pellicle membrane 20 and the edge of the pellicle membrane 20 to minimize the thermal stress generated in the pellicle membrane 20 .

The pellicle frame 40 may be attached to the lower side of the pellicle membrane 20. 2, the pellicle frame 40 may be configured to surround the lower edge surface of the pellicle membrane 20. [ In addition, the outer surface of the pellicle frame 40 may be covered with the cooling structure 10. The pellicle frame 40 may be attached to the lower edge surface of the pellicle membrane 20 to support the pellicle membrane 20, as described above.

Hereinafter, a method of manufacturing an EUV pellicle structure according to a first embodiment of the present invention will be described.

FIG. 3 is a flow chart for explaining a method of manufacturing an EUV pellicle structure according to a first embodiment of the present invention, and FIG. 4 is a view for explaining a method of manufacturing an EUV pellicle structure according to the first embodiment of the present invention.

Referring to FIGS. 3 and 4, the pellicle membrane 20 in which a plurality of the EUV transmissive layers 23 and the heat-releasing layer 25 are alternately stacked may be prepared (S100). As described with reference to FIGS. 1 and 2, according to one embodiment, the EUV transmissive layer 23 may be formed of a material having an extinction coefficient for EUV of 0.01 or less, or a material having an extinction coefficient for the EUV of 0.01 or less Stabilized < / RTI > compounds. In addition, according to one embodiment, the heat-releasing layer 25 may include a material having a thermal conductivity of 10 W / mK or more at a temperature of 300K.

As described above, when the EUV transmissive layer 23 including a substance with a low extinction coefficient is used, since the absorptivity of the EUV transmissive layer 23 with respect to EUV is small, even if it has a relatively thick thickness, The production of the EUV transmissive layer 23 may be possible. When the heat-releasing layer 25 including a material having a high thermal conductivity is used, the thermal stress generated in the pellicle membrane 20 is conducted and dispersed to the periphery, so that the pellicle membrane 20 is exposed to the EUV- The concentrated thermal stress can be minimized. Thus, the pellicle membrane 20 having a structure in which the EUV transmissive layer 23 including a substance having a low extinction coefficient is low and the heat release layer 25 including a substance having a high heat conductivity are alternately laminated is manufactured , It is possible to provide a method for producing the pellicle membrane 20 having excellent permeability to EUV, mechanical strength, and thermal stability.

The pellicle frame 40 may be attached to the edge surface under the pellicle membrane 20 before the cooling structure 10 is disposed at the edge of the pellicle membrane 20. In other words, the pellicle membrane 20 can be attached on the pellicle frame 40. As described above, the pellicle frame 40 may be attached to the lower side of the pellicle membrane 20 to support the pellicle membrane 20.

The cooling structure 10 that absorbs heat from the pellicle membrane 20 may be disposed on the edge side of the pellicle membrane 20 on which the heat release layer 25 is exposed S200. 1 and 2, the cooling structure 10 includes the first to fourth parts 11, 12, 13 and 14, and the first to fourth parts 11 , 12, 13, 14) may be integral. In addition, the pattern protruding on the outer surface of the cooling structure 10 may be formed to facilitate radiation radiation from the pellicle membrane 20 to the cooling structure 10.

4, the pellicle membrane 20 to which the pellicle frame 40 is attached can be inserted into the cooling structure 10, which is integrally formed, on the lower edge surface. Thus, the cooling structure 10 may cover the edge side of the pellicle membrane 20, and the outer surface of the pellicle frame 40.

As described above, the heat absorbed from the EUV transmissive layer 23 into the heat-releasing layer 25 can be transferred to the cooling structure 10. The cooling structure 10 can dissipate the heat absorbed from the EUV-permeable layer 23 and the heat-releasing layer 25 to the outside. Accordingly, the thermal durability of the pellicle membrane 20 can be improved.

Hereinafter, an EUV pellicle structure according to a second embodiment of the present invention will be described.

The EUV pellicle structure 100 according to the first embodiment of the present invention includes all of the cooling structures 10 while the EUV pellicle structure 100a according to the second embodiment of the present invention has a separate structure of cooling Structure 10a. Specifically, the cooling structure 10a according to the second embodiment of the present invention includes the first, second, third, and fourth portions of the cooling structure 100 according to the first embodiment of the present invention. Second, third, and fourth segments 11s, 12s, 13s, and 14s, which are separate structures of the first, second, third, and fourth embodiments 11, 12, 13,

5 is a perspective view illustrating an EUV pellicle structure according to a second embodiment of the present invention. 5 and 5, the overlapping portions of the EUV pellicle structure according to the first embodiment of the present invention shown in FIGS. 1 and 2 will be described with reference to FIGS. 1 and 2 . Sectional view of the EUV pellicle structure according to the second embodiment of the present invention is the same as the sectional view of the EUV pellicle structure according to the first embodiment of the present invention,

Referring to FIG. 5, the EUV pellicle structure 100a according to the second embodiment of the present invention may include a pellicle membrane 20, a cooling structure 10, and a pellicle frame 40.

The pellicle membrane 20 may include a plurality of EUV transmissive layers 23 including a plurality of low extinction coefficient materials and a plurality of low thermal conductivity layers 23, The heat releasing layer 25 including the high material may be alternately laminated. Thus, the pellicle membrane 20 having excellent permeability to EUV, mechanical strength, and thermal stability can be provided.

The cooling structure 10a may be a separate structure, unlike the cooling structure 10, which is an integral part of the EUV pellicle structure 100 according to the first embodiment of the present invention. Specifically, the cooling structure 10a includes the first segment 11s and the second segment 12s that extend opposite to each other in the first direction, and the second segment 12s extending in the second direction intersecting the first direction And may include the third segment 13s and the fourth segment 14s which extend opposite to each other.

According to one embodiment, the first to fourth segments 11s, 12s, 13s, 14s of the cooling structure 10a are formed on the edge of the pellicle membrane 20, on which the heat-releasing layer 25 is exposed, And can be independently arranged on the side surface to surround the pellicle membrane 20. Accordingly, the cooling structure 10a is in contact with the heat-releasing layer 25 of the pellicle membrane 20 so that the inner surface receives heat from the heat-releasing layer 25, And the outer surface to emit. Also, as described above, according to one embodiment, the outer surface of the cooling structure 10a is protruded to facilitate radiative emission of heat absorbed from the pellicle membrane 20 to the cooling structure 10a And may include the pattern shape.

As described above, when the first to fourth segments 11s, 12s, 13s, 14s of the cooling structure 10a are independently disposed on the edge side of the pellicle membrane 20, the cooling structure 10a may be disposed more closely depending on the shape of the edge side of the pellicle membrane 20. [ Accordingly, the contact efficiency between the cooling structure 10a and the pellicle membrane 20 is improved, and the heat dissipation efficiency from the pellicle membrane 20 to the cooling structure 10a can be maximized. The heat dissipation efficiency of the heat accumulated in the pellicle membrane 20 through the cooling structure 10a is improved as described above so that the thermal stress generated inside the pellicle membrane 20 is minimized .

The pellicle frame 40 may be attached in a structure that surrounds the lower edge surface of the pellicle membrane 20, as described with reference to the EUV pellicle structure 100 according to the first embodiment of the present invention. have. Further, the outer surface of the pellicle frame 40 may be covered with the cooling structure 10a. The pellicle frame 40 may be attached to the lower side of the pellicle membrane 20 to support the pellicle membrane 20, as described above.

Hereinafter, a method of manufacturing the EUV pellicle structure according to the second embodiment of the present invention will be described.

6 is a view for explaining a method of manufacturing an EUV pellicle structure according to a second embodiment of the present invention. In the description of the EUV pellicle structure according to the second embodiment of the present invention shown in FIG. 6, the overlapping portions of the first embodiment of the present invention shown in FIGS. 1 to 4 will be described with reference to FIGS. 1 to 4 . The flow chart for explaining the method of manufacturing the EUV pellicle structure according to the second embodiment of the present invention is the same as the flow chart of the EUV pellicle structure according to the first embodiment of the present invention, and therefore, reference is made to FIG.

Referring to FIGS. 3 and 5, the pellicle membrane 20 in which a plurality of the EUV transmissive layers 23 and the heat-releasing layer 25 are alternately stacked may be prepared (S100). As described above, when the pellicle membrane 20 is manufactured using the EUV transmissive layer 23 including a material with a low extinction coefficient and the heat release layer 25 including a material having a high thermal conductivity, The pellicle membrane 20 having excellent permeability to EUV, mechanical strength, and thermal stability can be provided.

The pellicle frame 40 may be attached to the lower edge surface of the pellicle membrane 20 before the cooling structure 10a is disposed on the edge side of the pellicle membrane 20. [ As described above, the pellicle frame 40 can be attached to the lower edge surface of the pellicle membrane 20 to support the pellicle membrane 20.

The cooling structure 10a that absorbs heat from the pellicle membrane 20 on the edge side of the pellicle membrane 20 exposed to the heat release layer 25 may be disposed S200. 6, the first through fourth segments 11s, 12s, 13s, and 14s of the cooling structure 10a may be independently attached to the pellicle membrane 20. As shown in FIG. As described above, when the first to fourth segments 11s, 12s, 13s, 14s of the cooling structure 10a are independently disposed on the edge side of the pellicle membrane 20, the cooling structure 10a may be disposed more closely depending on the shape of the edge side of the pellicle membrane 20 so that the efficiency of heat dissipation from the pellicle membrane 20 to the cooling structure 10a may be improved. Accordingly, the thermal stress generated inside the pellicle membrane 20 is reduced, thereby minimizing the thermal deformation and physical destruction of the pellicle membrane 20.

Hereinafter, an EUV pellicle structure according to a third embodiment of the present invention will be described.

In the EUV pellicle structure 200 according to the third embodiment of the present invention, the pellicle frame 40 of the EUV pellicle structure 100 according to the first embodiment of the present invention may be omitted. The pellicle frame 40 of the EUV pellicle structure 100 according to the first embodiment of the present invention is formed by stacking the EUV pellicle structure 200 according to the third embodiment of the present invention 18).

FIG. 7 is a perspective view of an EUV pellicle structure according to a third embodiment of the present invention, and FIG. 8 is a sectional view of an EUV pellicle structure according to a third embodiment of the present invention. 7 and 8, the overlapping portion of the EUV pellicle structure according to the third embodiment of the present invention, which is the same as the first embodiment of the present invention shown in FIGS. 1 and 2, 2 will be referred to.

7 and 8, an EUV pellicle structure 200 according to a third embodiment of the present invention may include a pellicle membrane 20, and a cooling structure 10.

The pellicle membrane 20 may include a plurality of EUV transmissive layers 23 including a plurality of low extinction coefficient materials and a plurality of low thermal conductivity layers 23, The heat releasing layer 25 including the high material may be alternately laminated. Thus, the pellicle membrane 20 having excellent permeability to EUV, mechanical strength, and thermal stability can be provided.

The cooling structure 10 includes the first to fourth portions 11, 12, 13 and 14 as described with reference to the EUV pellicle structure 100 according to the first embodiment of the present invention , The first to fourth portions 11, 12, 13, and 14 may be integral. However, the cooling structure 10 in the EUV pellicle structure 200 according to the third embodiment of the present invention may be configured such that the cooling structure 10 enclosed by the first to fourth parts 11, 12, 13, (18). ≪ / RTI > The receiving portion 18 can replace the pellicle frame 40 of the EUV pellicle structures 100 and 100a according to the first and second embodiments of the present invention as described above. Accordingly, the receiving portion 18 of the cooling structure 10 can serve to support the pellicle membrane 20, like the pellicle frame 40. As described above, in the case of the EUV pellicle structure 200 including the cooling structure 10 in which the receiving portion 18 is formed, the manufacturing and assembling steps of the pellicle frame 40 are omitted, and the process can be simplified have. Thus, the EUV pellicle structure 200 with reduced process time and process cost can be provided.

In addition, according to one embodiment, the cooling structure 10 may include a cooling structure (not shown) for facilitating radiant emission of heat absorbed from the pellicle membrane 20 to the cooling structure 10, The pattern protruding on the outer surface of the substrate 10 may be formed. Accordingly, the cooling rate of the pellicle membrane 20 is increased to minimize thermal deformation and physical destruction of the pellicle membrane 20.

Hereinafter, a method of manufacturing the EUV pellicle structure according to the third embodiment of the present invention will be described.

9 is a view for explaining a method of manufacturing an EUV pellicle structure according to a third embodiment of the present invention. The method of manufacturing the EUV pellicle structure according to the third embodiment of the present invention shown in FIG. 9 will now be described with reference to FIGS. 3 and 4 for the parts overlapping with the first embodiment of the present invention shown in FIGS. Referring to FIG. 3 is a flowchart of a method of manufacturing an EUV pellicle structure according to a third embodiment of the present invention, which is the same as the flow chart of the EUV pellicle structure according to the first embodiment of the present invention.

Referring to FIG. 9, the pellicle membrane 20 in which a plurality of the EUV transmissive layers 23 and the heat-releasing layer 25 are alternately stacked may be prepared (S100). As described above, when the pellicle membrane 20 is manufactured using the EUV transmissive layer 23 including a material with a low extinction coefficient and the heat release layer 25 including a material having a high thermal conductivity, The pellicle membrane 20 having excellent permeability to EUV, mechanical strength, and thermal stability can be provided.

The cooling structure 10 that absorbs heat from the pellicle membrane 20 may be disposed on the edge side of the pellicle membrane 20 on which the heat release layer 25 is exposed S200. 1 and 2, the cooling structure 10 includes the first to fourth parts 11, 12, 13 and 14, and the first to fourth parts 11 , 12, 13, 14) may be integral. The pattern protruding on the outer surface of the cooling structure 10 may be included to facilitate radiation radiation from the pellicle membrane 20 to the cooling structure 10.

According to a third embodiment of the present invention, as described with reference to FIGS. 7 and 8, the cooling structure 10 is divided into the first to fourth parts 11, 12, 13 and 14 And the accommodating portion 18 protruding into the enclosed space. According to a third embodiment of the present invention, the pellicle membrane 20 may be disposed on the receiving portion 18 of the cooling structure 10. The receiving portion 18 of the cooling structure 10 may replace the pellicle frame 40 in the EUV pellicle structures 100 and 100a according to the first and second embodiments of the present invention. Accordingly, the receiving portion 18 of the cooling structure 10 can serve to support the pellicle membrane 20. [

When the pellicle membrane 20 is inserted into the cooling structure 10 in which the receiving portion 18 is formed as described above, the pellicle membranes 20 of the EUV pellicle structures 100 and 100a according to the first and second embodiments of the present invention, The step of attaching the pellicle membrane 20 onto the pellicle frame 40 may be omitted before the cooling structure 10a is placed on the edge side of the pellicle membrane 20, have. Thus, the process can be simplified and the process time and process cost can be reduced.

In addition, according to the first and second embodiments of the present invention, the cooling structure 10, 10a of the EUV pellicle structure 100, 100a is formed on the edge side of the pellicle membrane 20, 40 may be attached to the outer surface of the pellicle membrane 20, the pellicle frame 40, and the cooling structure 10, 10a. According to a third embodiment of the present invention, the cooling structure 10, 10a of the EUV pellicle structure 100, 100a is positioned at the edge side of the pellicle membrane 20 and the lower side of the membrane 20 And a contact surface may be formed between the pellicle membrane 20 and the cooling structure 10. As described above, according to the third embodiment of the present invention, the components of the EUV pellicle structure 200 are simplified, and the number of contact surfaces due to the separated structure can be reduced. Accordingly, the pellicle membrane 20 according to the third embodiment of the present invention is more closely attached to the cooling structure 10, thereby improving the contact efficiency between the cooling structure 10 and the pellicle membrane 20 . Accordingly, the heat dissipation efficiency by which the heat accumulated in the pellicle membrane 20 is radiated to the outside through the cooling structure 10a is improved, and the thermal durability of the pellicle membrane 20 can be improved.

Hereinafter, an EUV pellicle structure according to a fourth embodiment of the present invention will be described.

Like the EUV pellicle structure 100a according to the second embodiment of the present invention, the EUV pellicle structure 200a according to the fourth embodiment of the present invention may include a cooling structure 10a having a separated structure. The cooling structure 10a of the EUV pellicle structure 200a according to the fourth embodiment of the present invention is the same as the cooling structure 10 according to the third embodiment of the present invention, Second, third, and fourth segments 11s, 12s, 12s, 13s, 14s are separated structures in which the first, second, third, and fourth portions 11, 13s, and 14s may be combined.

10 is a perspective view illustrating an EUV pellicle structure according to a fourth embodiment of the present invention. In the following description of the EUV pellicle structure according to the fourth embodiment of the present invention shown in FIG. 10, the overlapping portions of the second and third embodiments of the present invention shown in FIGS. 5 to 8 will be described with reference to FIGS. Referring to FIG. Sectional view of the EUV pellicle structure according to the fourth embodiment of the present invention is the same as the sectional view of the EUV pellicle structure according to the third embodiment of the present invention,

Referring to FIG. 10, the EUV pellicle structure 200a according to the fourth embodiment of the present invention may include a pellicle membrane 20, and a cooling structure 10a.

The pellicle membrane 20 may include a plurality of EUV transmissive layers 23 including a plurality of low extinction coefficient materials and a plurality of low thermal conductivity layers 23, The heat releasing layer 25 including the high material may be alternately laminated. Thus, the pellicle membrane 20 having excellent permeability to EUV, mechanical strength, and thermal stability can be provided.

The cooling structure 10a may be configured to have the first, second, third, and fourth openings 18a of the cooling structure 10 according to the third embodiment of the present invention, The first, second, third, and fourth segments 11s, 12s, 13s, and 14s may be a structure in which the portions 11, 12, 13, and 14 are separated.

The first to fourth segments 11s, 12s, 13s, and 14s of the cooling structure 10a, in which the receiving portion 18 is formed, And the pellicle membrane 20 may be independently disposed on the edge side on which the pellicle membrane 25 is exposed. At this time, the pellicle membrane 20 may be disposed on the receiving portion 18 of the cooling structure 10a.

As described above, when the first to fourth segments 11s, 12s, 13s, 14s of the cooling structure 10a are independently disposed on the edge side of the pellicle membrane 20, the cooling structure 10a may be disposed more closely depending on the shape of the edge side of the pellicle membrane 20. [

When the pellicle membrane 20 is inserted into the first through fourth segments 11s, 12s, 13s, and 14s in which the receiving portion 18 replacing the role of the pellicle frame 40 is formed, The components of the EUV pellicle structure 200 are simplified, and the number of contact surfaces due to the separated structure can be reduced. Accordingly, the pellicle membrane 20 and the cooling structure 10 are attached more closely to each other, so that the contact efficiency between the cooling structure 10 and the pellicle membrane 20 can be improved. Therefore, heat accumulated in the pellicle membrane 20 through the cooling structure 10a is radiated to the outside, and the thermal stability of the pellicle membrane 20 can be improved.

Hereinafter, a method of manufacturing an EUV pellicle structure according to a fourth embodiment of the present invention will be described.

11 is a view for explaining a method of manufacturing an EUV pellicle structure according to a fourth embodiment of the present invention. 11, a method of manufacturing an EUV pellicle structure according to a fourth embodiment of the present invention will be described. In the second, third, and fourth embodiments of the present invention shown in FIGS. 5 to 10, 5 to 10 will be referred to. A flow chart for explaining a method of manufacturing an EUV pellicle structure according to a fourth embodiment of the present invention is the same as that of the EUV pellicle structure according to the first embodiment of the present invention, and therefore, reference is made to FIG.

Referring to FIG. 11, the pellicle membrane 20 in which a plurality of the EUV transmissive layers 23 and the heat releasing layer 25 are alternately stacked may be prepared (S100). As described above, when the pellicle membrane 20 is manufactured using the EUV transmissive layer 23 including a material with a low extinction coefficient and the heat release layer 25 including a material having a high thermal conductivity, The pellicle membrane 20 having excellent permeability to EUV, mechanical strength, and thermal stability can be provided.

The cooling structure 10a that absorbs heat from the pellicle membrane 20 on the edge side of the pellicle membrane 20 exposed to the heat release layer 25 may be disposed S200. The pellicle membrane 20 is inserted into the cooling structure 10a such that the pellicle membrane 20 is disposed on the receiving portion 18 of the cooling structure 10a as described with reference to Fig. . Specifically, the first through fourth segments 11s, 12s, 13s, and 14s formed with the receiving portion 18 are formed on the edge side surface of the pellicle membrane 20 on which the heat-releasing layer 25 is exposed And the pellicle membrane 20 may have a structure that is independent of the pellicle membrane 20 and surrounds the pellicle membrane 20.

As described above, when the first to fourth segments 11s, 12s, 13s, 14s of the cooling structure 10a are independently disposed on the edge side of the pellicle membrane 20, the cooling structure 10a may be disposed more closely depending on the shape of the edge side of the pellicle membrane 20. [

When the pellicle membrane 20 is inserted into the first through fourth segments 11s, 12s, 13s, and 14s in which the receiving portion 18 replacing the role of the pellicle frame 40 is formed, The components of the EUV pellicle structure 200 can be simplified, and the number of contact surfaces due to the separated structure can be reduced. Accordingly, the pellicle membrane 20 and the cooling structure 10 are attached more closely to each other, so that the contact efficiency between the cooling structure 10 and the pellicle membrane 20 can be improved. Therefore, the heat dissipation efficiency of heat accumulated inside the pellicle membrane 20 through the cooling structure 10a to the outside can be improved.

Unlike the embodiments of the present invention described above, conventionally, a single layer of silicon thin film is fabricated using silicon having a high transmittance to EUV for manufacturing a pellicle for EUV lithography. In this case, there is a disadvantage that the silicon thin film is physically deformed and destroyed because of its low transmittance to EUV, but its mechanical strength is weak due to its thin thickness. On the other hand, when the thickness of the silicon thin film is increased, there is a problem that the transmittance of the silicon thin film is reduced to EUV.

In addition, in order to solve the above-described problems, when a support structure for supporting the silicon thin film is added to fabricate a pellicle structure for EUV lithography, the distribution of EUV light sources irradiated by the support structure is disadvantageous.

 However, as described above, according to an embodiment of the present invention, there is provided a method of manufacturing a pellicle membrane, comprising the steps of preparing a pellicle membrane 20 in which a plurality of EUV transmissive layers 23 and a heat-releasing layer 25 are alternately laminated, (10, 10a) for absorbing heat from the pellicle membrane (20) on the exposed side edge of the heat release layer (25) of the EUV pellicle structure Can be provided.

First, when the EUV transmissive layer 23 including a substance having a low extinction coefficient is used, since the absorption rate of the EUV transmissive layer 23 with respect to EUV is small, the EUV transmissive layer 23 having a relatively high thickness, The preparation of layer 23 may be possible. In addition, when the heat-releasing layer 25 including a material having a high thermal conductivity is used, the thermal stress concentrated on the EUV exposed portion of the pellicle membrane 20 is reduced, and the thermal durability of the pellicle membrane 20 is improved Is possible. Thus, according to the embodiment of the present invention, a method of manufacturing the pellicle membrane 20 having excellent permeability to EUV, mechanical strength, and thermal stability can be provided.

In addition, a protruding pattern is formed on the outer surface of the cooling structure 10, 10a including a material having a high emissivity, so that radiation emitted from the pellicle membrane 20 through the cooling structure 10, It can be easy.

In addition, according to an embodiment of the present invention, the cooling structure 10a may include a receiving portion 18 that replaces the role of the pellicle frame 20 supporting the pellicle membrane 20. Accordingly, the step of attaching the pellicle membrane 20 on the pellicle frame 40 can be omitted, so that the processing time and the process cost can be reduced.

The cooling structure 10a includes first to fourth segments 11s, 12s, 13s and 14s of separated structures including the accommodating portion 18, and the first to fourth segments 11s The cooling structure 10 is attached more closely according to the shape of the edge surface of the pellicle membrane 20 when the pellicle membrane 20, 12s, 13s, 14s is independently attached to the pellicle membrane 20, The contact efficiency between the structure 10 and the pellicle membrane 20 can be improved. Accordingly, the efficiency of heat dissipation through which the heat accumulated in the pellicle membrane 20 is dissipated to the outside through the cooling structure 10a is improved, and the EUV pellicle structure 200a improved in thermal stability can be provided.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the scope of the present invention is not limited to the disclosed exemplary embodiments. It will also be appreciated that many modifications and variations will be apparent to those skilled in the art without departing from the scope of the invention.

10, 10a: cooling structure
11: First part
12: second part
13: third part
14: fourth part
11s: 1st segment
12s: 2nd segment
13s: third segment
14s: fourth segment
18:
20: Pellicle membrane
23: EUV transmission layer
25: Heat release layer
40: Pellicle frame
100, 100a, 200, 200a: EUV pellicle structure

Claims (13)

Preparing a pellicle membrane in which a plurality of EUV (Extreme Ultraviolet) permeable layers and a heat releasing layer are alternately laminated; And
Disposing a cooling structure that absorbs heat from the pellicle membrane on an exposed sidewall of the heat dissipating layer of the pellicle membrane,
Wherein the heat-releasing layer is disposed between the plurality of EUV transmissive layers, and the edge side of the heat-releasing layer is in direct contact with the cooling structure.
The method according to claim 1,
Wherein the cooling structure includes first and second portions that extend opposite each other in a first direction and third and fourth portions that extend opposite each other in a second direction that intersects the first direction,
Wherein the first to fourth parts are constituted by one body,
The step of disposing the cooling structure comprises:
And inserting the pellicle membrane into any cooling structure.
3. The method of claim 2,
Wherein the cooling structure further includes a receiving portion protruding inwardly surrounded by the first to fourth portions,
The step of disposing the cooling structure comprises:
Inserting the pellicle membrane into the cooling structure such that the pellicle membrane is disposed on the receiving portion of the cooling structure.
The method according to claim 1,
The cooling structure includes first and second segments extending opposite each other in a first direction and third and fourth segments extending opposite each other in a second direction intersecting the first direction, ,
The step of disposing the cooling structure comprises:
And attaching the first to fourth segments independently to the pellicle membrane.
5. The method of claim 4,
Wherein the cooling structure further includes an accommodating portion protruding inwardly surrounded by the first through fourth segments,
The step of disposing the cooling structure comprises:
Inserting the pellicle membrane into the cooling structure such that the pellicle membrane is disposed on the receiving portion of the cooling structure.
The method according to claim 1,
Wherein the heat releasing layer conveys the heat absorbed from the EUV transmissive layer to the cooling structure,
Wherein the cooling structure includes dissipating heat absorbed from the EUV transmissive layer and the heat evacuation layer to the outside.
The method according to claim 1,
Before the cooling structure is disposed,
Preparing a pellicle frame; And
Further comprising attaching the pellicle membrane on the pellicle frame.
8. The method of claim 7,
Wherein the cooling structure covers an outer surface of the pellicle frame.
A pellicle membrane in which a plurality of EUV (Extreme Ultraviolet) permeable layers and a heat releasing layer are alternately laminated; And
A cooling structure disposed on an exposed sidewall of the pellicle membrane to surround the pellicle membrane and to absorb heat from the pellicle membrane,
Wherein the heat-releasing layer is disposed between the plurality of EUV transmissive layers, and the edge side of the heat-releasing layer is in direct contact with the cooling structure.
10. The method of claim 9,
Wherein the cooling structure includes an inner surface receiving heat directly from the heat releasing layer in direct contact with the heat releasing layer of the pellicle membrane and an outer surface releasing heat to the outside.
10. The method of claim 9,
Wherein an outer surface of the cooling structure has a protruded pattern shape.
10. The method of claim 9,
Wherein the cooling structure further comprises a receiving portion led to the inside of the cooling structure in which the pellicle membrane is disposed,
Wherein the pellicle membrane is disposed on the receiving portion.
10. The method of claim 9,
Further comprising a pellicle frame supporting the pellicle membrane and surrounded by the cooling structure.
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