KR101762028B1 - Coil component and method of manufacturing the same - Google Patents

Abstract

The present disclosure relates to a coil part including a coil pattern in which a plurality of conductor patterns are stacked, wherein the plurality of conductor patterns are different in line width from one another, and a manufacturing method thereof.

Description

TECHNICAL FIELD [0001] The present invention relates to a coil component and a method of manufacturing the coil component.

The present disclosure relates to coil components.

In recent years, such IT electronic devices have not only a single device but also mutual USB and other communication ports are connected to each other for multi-functional, composite communication The frequency of use is expected to be high. Here, in order to rapidly transmit and receive the data, the frequency band of the MHz band shifts to the high frequency band of the GHz band, and data is exchanged through a larger amount of internal signal lines.

On the other hand, in order to transmit and receive such a large amount of data, there is a problem in processing smooth data due to signal delay and other noise in transmission / reception of a high frequency band in the GHz band between the main device and the peripheral device. In order to solve such a problem, an electromagnetic interference (EMI) countermeasure part is provided around the connection between the IT and the peripheral device. For example, a common mode filter (CMF) is used.

On the other hand, coil components such as a common mode filter are required to be downsized and thinned as electronic apparatuses are reduced in size and thickness. In order to meet such demands, the line width of coils is becoming smaller and smaller. At this time, when the line width of the coil becomes smaller, the DC resistance (Rdc) rises. To reduce the DC resistance, the area of the coil must be widened. A method of increasing the area of the coil is to increase the thickness of the coil to realize a high aspect ratio (AR). However, implementing a fine pattern and a high aspect ratio at the same time requires a very high degree of difficulty, and the coil forming method proposed so far has a limitation in realizing them at the same time.

One of the objects of the present disclosure is to provide a coil part and a manufacturing method thereof which can simultaneously realize a fine pattern and a high aspect ratio.

One of the various solutions proposed through this disclosure is to laminate a plurality of conductor patterns to implement a coil pattern. For example, a double stacking (DS) method in which a resist pattern for forming a coil pattern is laminated in two layers can be used.

A coil part and a manufacturing method thereof that can simultaneously realize a fine pattern and a high aspect ratio as one of the effects of the present disclosure can be provided.

Fig. 1 schematically shows an example of a coil component applied to an electronic device.
2 is a schematic perspective view showing an example of a coil part.
FIG. 3 is a schematic II 'cross-sectional view of the coil component of FIG. 2;
Figure 4 is a schematic enlarged cross-sectional view of the R region of the coil component of Figure 3;
5 is another schematic II 'cross-sectional view of the coil part of FIG. 2;
6 is a schematic enlarged cross-sectional view of the Q region of the coil component of Fig.
Fig. 7 shows an example of a schematic manufacturing process of a coil pattern capable of simultaneously realizing a fine line width and a high aspect ratio.
Fig. 8 shows an example of a schematic fabrication process of a coil pattern having a limit to simultaneously realize a fine line width and a high aspect ratio.

Hereinafter, the present disclosure will be described in more detail with reference to the accompanying drawings. The shape and size of elements in the drawings may be exaggerated for clarity.

Electronics

1 schematically shows an example of a coil part applied to an electronic device. Referring to the drawings, an electronic device 1000 may be a mobile phone including a case 1001, a USB input unit 1002, a camera unit 1003, and the like. The interior of the mobile phone 1000 may include various electronic components 1030 and 1040 mounted or embedded in the main board 1010 and the main board 1010 and connected through the circuit pattern 1020. At this time, the coil component 10 of the present disclosure as a part of the electronic components 1030 and 1040 is connected to the USB input part 1002, the camera part 1003, and the like of the electronic device 1000, for example, Area. ≪ / RTI >

Needless to say, the coil parts of the present disclosure can be similarly or differently applied to mobile phones as well as other electronic devices exemplarily shown in the drawings. For example, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer, a monitor, a television television, video game, smart watch, or any of a variety of other electronic devices well known to those of ordinary skill in the art.

Coil parts

Hereinafter, the coil component of the present disclosure will be described, but the common mode filter will be described for convenience, but the present invention is not limited thereto. It goes without saying that the contents of this disclosure may be applied to other various uses of coil parts. For example, the coil component of the present disclosure may be an inductor depending on the arrangement of the coil pattern.

2 is a schematic perspective view showing an example of a coil part. Referring to the drawings, a coil component 10 according to an example includes a coil portion 200 and cover portions 101 and 102 disposed above and below the coil portion 200. The coil part 200 and the cover parts 101 and 102 become the bodies of the coil parts. External electrodes 301a, 301b, 302a, and 302b are disposed outside the body. Here, the upper part means the lamination direction of the resist pattern in the manufacturing process to be described later, and the lower part means the opposite direction. In this case, the upper part or the lower part includes not only the direct contact of the target component with the reference component, but also the case where the target component is located in the corresponding direction but does not make direct contact.

The cover parts 101 and 102 function as passages for magnetic flux generated in the coil part 200 and may include a magnetic material. In addition, it can perform the role of supporting the external electrodes 301a, 301b, 302a, and 302b and / or mechanically and electrically protecting the coil part 200. [ The cover portions 101 and 102 may also provide a mounting surface when the coil component 10 is mounted on various electronic apparatuses. The cover parts 101 and 102 may be sheet-type. In this case, the cover parts 101 and 102 can be formed by pressing and laminating a sheet-type magnetic material, so that process productivity can be improved. That is, the cover portions 101 and 102 may be the first magnetic sheet 101 and the second magnetic sheet 102 disposed on both sides of the coil portion 200, respectively.

The magnetic material contained in the cover portions 101 and 102 can be used without particular limitation as long as it has magnetic properties. For example, it may include at least one selected from the group consisting of a metal magnetic powder and a ferrite, but the present invention is not limited thereto. The metal magnetic material powder may be, for example, crystalline or amorphous metal including at least one selected from the group consisting of Fe, Si, Cr, Al and Ni, but is not limited thereto. Examples of the ferrite include Fe-Ni-Zn ferrite, Fe-Ni-Zn-Cu ferrite, Mn-Zn ferrite, Ni-Zn ferrite, Zn-Cu ferrite, Ni- Based ferrite, Ba-based ferrite, Li-based ferrite, or the like, but is not limited thereto.

The coil part 200 functions to perform various functions in the electronic device through the characteristics expressed from the coil of the coil part 10. In the coil component 10 according to an example, the coil portion 200 is distinguished from a winding type having a structure in which a conductor is wound around a magnetic core as a so-called thin film type or the like. Details of the coil part 200 will be described later.

The external electrodes 301a, 301b, 302a, and 302b serve to connect the coil component 10 to the electronic device. In the coil component 10 according to the example, at least a part of the external electrodes 301a, 301b, 302a, and 302b are disposed on the first and second magnetic sheets 101 and 102, respectively. As described above, at least a part of the external electrode 300 is disposed on both the first and second magnetic sheets 101 and 102, so that both the first and second magnetic sheets 101 and 102 can provide the mounting surface . Therefore, when the coil component 10 is mounted on an electronic device, the orientation can be unaffected, so that the process can be simplified. The external electrodes 301a, 301b, 302a, and 302b may be first to fourth external electrodes 301a, 301b, 302a, and 302b, 211a, 211b, 231a, 231b. In addition, they may each have a shape of 'C' shape. However, it is needless to say that the arrangement and shape of the external electrodes 301a, 301b, 302a and 302b are not limited thereto, but may be other known arrangements or shapes well known in the art.

As the material of the external electrode 300, a metal capable of imparting conductivity can be used without any particular limitation. For example, the external electrode 300 may be formed of one selected from the group consisting of gold (Au), silver (Ag), platinum (Pt), copper (Cu), nickel (Ni), palladium (Pd) But is not limited thereto. (Cu) and nickel (Ni) are cheap, but they are oxidized during the sintering and have a high conductivity, because the gold (Au), silver (Ag), platinum There is a disadvantage that it can be lowered.

FIG. 3 is a schematic II 'cross-sectional view of the coil component of FIG. 2; A coil portion 200 of a coil component 10A according to an example includes an insulating layer 214 and coil layers 210 and 220 disposed on the insulating layer 214. In one embodiment,

The insulating layer 214 bonds the coil layers 210 and 220 to the outside. The material of the insulating layer 214 is not particularly limited and may be an insulating material. The insulating material may be a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as a glass fiber or an inorganic filler such as prepreg, ABF (Ajinomoto Build- up Film, FR-4, and BT (Bismaleimide Triazine) resin. In some cases, the insulating layer 214 may be omitted.

Each of the coil layers 210 and 220 has a dual coil on which two coil patterns 211a, 211b / 231a and 231b are formed on substantially the same plane. Of course, this is merely an example, and alternatively, it may be implemented as a single coil of a multilayer type. For example, as a coil layer composed of four layers, each coil layer may have a single coil.

The coil layers 210 and 220 include a first coil layer 210 and a second coil layer 220. And has first and second coil patterns 211a and 211b on substantially the same plane of the first coil layer 210. [ The second coil layer 220 has third and fourth coil patterns 231a and 231b on substantially the same plane. Although only two layers 210 and 220 are shown in the drawing, it is understood that they may be composed of more layers. Each of the coil patterns 211a, 211b, 231a, and 231b may be a flat spiral pattern.

The first coil pattern 211a is electrically connected to the third coil pattern 221a through the first via pattern 232a. A single first coil electrode composed of a series circuit of two coils 211a and 221a can be constituted. The second coil pattern 211b is electrically connected to the fourth coil pattern 221b through the second via pattern 232b. A single second coil electrode composed of a series circuit of two coils 211b and 221b can be formed. In this case, if a current in the same direction flows between the first and second coil electrodes, the magnetic fluxes are strengthened each other to increase the common mode impedance and suppress the common mode noise. When the current flows in the opposite direction, the magnetic fluxes cancel each other, To pass a desired transmission signal.

The first coil layer 210 includes first and second via connection patterns 212a and 212b that are directly connected to the via patterns 232a and 232b. The first and second via connection patterns 212a and 212b refer to the end portions of the first and second coil patterns 211a and 211b directly connected to the via patterns 232a and 232b. The second coil layer 220 may include third and fourth via connection patterns 222a and 222b directly connected to the via patterns 232a and 232b. The third and fourth via connection patterns 222a and 222b refer to the end portions of the third and fourth coil patterns 221a and 221b directly connected to the via patterns 232a and 232b.

The first coil layer 210 may include first and second lead terminals 213a and 213b connected to the external electrodes 301a and 301b. Here, the first and second lead terminals 213a and 213b are connected to the first and second external electrodes 301a and 301b, respectively. The second coil layer 220 may include third and fourth lead terminals 223a and 223b connected to the external electrodes 302a and 302b. Here, the third and fourth lead terminals 223a and 223b are connected to the third and fourth external electrodes 302a and 302b, respectively. The coil portion 200 can be electrically connected to the external electrodes 301a, 301b, 302a, and 302b.

The coil component 10 according to an example may further include a magnetic core 103 penetrating the center portion of the coil portion 200 if necessary. The magnetic core 103 may penetrate both the insulating layer 214 and the coil layers 210 and 220 but may penetrate only the coil layers 210 and 220 in some cases. If the magnetic core 103 is further included, the inductance of the coil layers 210 and 220 can be further increased, and the coil component 10 of higher performance can be obtained.

The magnetic material included in the magnetic core 103 can be used without particular limitation as long as it has magnetic properties. For example, it may include at least one selected from the group consisting of a metal magnetic powder and a ferrite, but the present invention is not limited thereto. The metal magnetic material powder may be, for example, crystalline or amorphous metal including at least one selected from the group consisting of Fe, Si, Cr, Al and Ni, but is not limited thereto. Examples of the ferrite include Fe-Ni-Zn ferrite, Fe-Ni-Zn-Cu ferrite, Mn-Zn ferrite, Ni-Zn ferrite, Zn-Cu ferrite, Ni- Based ferrite, Ba-based ferrite, Li-based ferrite, or the like, but is not limited thereto.

Figure 4 is a schematic enlarged cross-sectional view of the R region of the coil component of Figure 3; Referring to the drawing, a coil pattern of the first coil layer 210 is formed by stacking a plurality of conductor patterns. For example, the first conductor patterns 216 and 217 and the second conductor pattern 218 stacked on the first conductor patterns 216 and 217. Thus, when a plurality of conductor patterns are laminated to form a coil pattern, the fine line width and the high aspect ratio, which have been limited by the conventional method, can be realized at the same time.

Specifically, in order to realize a high aspect ratio, the coil pattern should be formed to have a greater thickness than the line width. In general, the thickness of the coil pattern is determined by the thickness of the photoresist (PR) . At this time, as the thickness of the photoresist is thicker due to the limitation of the current exposure technique, the photoresist may be incompletely developed, thereby making it difficult to form a desired pattern. That is, due to the limitation of exposure, when a coil pattern is simply implemented as a conductor pattern of one layer as shown in FIG. 8, it is difficult to have a high aspect ratio. In contrast, when a coil pattern is implemented by a method of sequentially laminating a plurality of conductor patterns as in a coil component according to an example, since the thickness of each photoresist for forming the coil pattern does not need to be thick, The problem of incomplete phenomenon does not occur. That is, since the conductor patterns of the fine pattern are sequentially laminated, the fine line width and the high aspect ratio can be simultaneously realized.

In the case of forming a coil pattern by laminating a plurality of conductor patterns, alignment accuracy that can accurately match the resist pattern for forming these coil patterns is important. A method of increasing the degree of freedom with respect to the alignment accuracy is to implement the line width of the resist pattern used for forming the conductor pattern differently. For example, when the line width of the resist pattern to be formed first is narrowly implemented and the line width of the resist pattern to be formed next is wider, the degree of freedom in alignment accuracy can be increased. This is because the area occupied by the resist pattern having a narrower line width formed earlier is wider than the area occupied by the resist pattern having a larger line width formed next, and thus the resist pattern having a smaller area is formed on the resist pattern having a wider area to be. That is, when the line width (W ₂₎ of the second conductive pattern 218 is formed in the following compared to the line width (W ₁₎ of the first conductive pattern (216, 217) to form first, wider, increasing the degree of freedom for the alignment precision .

The coil pattern formed by stacking a plurality of conductor patterns may have an aspect ratio of more than 1, for example, 3 or more. The aspect ratio is the thickness of the first conductive pattern (216, 217), the line width (W ₁₎ and a second average over the first conductive pattern (216, 217) of the line width (W ₂₎ of the conductor pattern 218 of the (H ₁₎ and a second conductive pattern (218) means ratio of agreement, that is, _{[H 1 + H 2] /} [(W 1 + W 2) / 2] having a thickness (H ₂₎ of the. As described above, a coil pattern formed by stacking a plurality of conductor patterns can realize a high aspect ratio at the same time as implementing a fine pattern.

The first coil patterns 216 and 217 are composed of a seed layer 216 and a first plating layer 217 formed on the seed layer 216. The second coil pattern 218 is composed of a second plating layer 218. The seed layer 216 is for easily forming the plating layer 217 and can be used without any particular limitation as long as it is a metal capable of imparting conductivity. The seed layer 216 may include a buffer seed layer containing at least one selected from the group consisting of Cr (Cr), Ti (Ti), Ta (Ta), Pd A buffer layer formed on the buffer seed layer and containing at least one selected from the group consisting of gold (Au), silver (Ag), platinum (Pt), copper (Cu), nickel (Ni), palladium (Pd) And a plating seed layer containing a plating seed layer. For example, a double layer structure composed of titanium (Ti) and copper (Cu). The buffer seed layer plays a role of ensuring adhesion to the insulating layer 214, and the plating seed layer functions as a base plating layer for easily forming the plating layer 217. The plating layers 217 and 218 are main materials constituting the coil patterns 211a, 211b / 231a and 231b, and can be used without any particular limitation as long as they are metals capable of imparting conductivity. For example, at least one selected from the group consisting of gold (Au), silver (Ag), platinum (Pt), copper (Cu), nickel (Ni), palladium (Pd) .

The coil pattern formed by laminating a plurality of conductor patterns may be surrounded by an insulating material 215. The insulating material 215 isolates the coil pattern as needed. As the insulating material 215, a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as glass fiber or inorganic filler such as prepreg, ABF, FR-4, BT Resin or the like can be used. If desired, a photosensitive resin (Photo Imagable Dielectric: PID) may also be used.

The first conductor patterns 216 and 217 and the second conductor pattern 218 are integrated to form a boundary between the first conductor patterns 216 and 217 and the second conductor pattern 218. However, May not be distinguished. In addition, although only two conductor patterns are laminated in the drawing, the present invention is not limited thereto, and it goes without saying that two or more conductor patterns may be laminated. Although only the first coil layer 210 has been described for the sake of convenience, it goes without saying that the above-described contents may be applied to other coil layers such as the second coil layer 220 and the like.

5 is another schematic II 'cross-sectional view of the coil part of FIG. 2; Referring to the drawings, a coil portion 200 of a coil component 10B according to another example includes coil layers 210 and 220, insulating layers 214 and 234 disposed on both sides of the coil layers 210 and 220, And an insulating layer 224 disposed between the coil layers 210 and 220. Hereinafter, the coil component 10B according to another example will be described, but the contents overlapping with those described above will be omitted.

The insulating layers 214 and 224 bond the coil layers 210 and 220 to the outside. The insulating layer 234 insulates between the coil layers 210 and 220. The material of the insulating layers 214, 224, and 234 is not particularly limited and may be an insulating material. Examples of the insulating material include a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as glass fiber or inorganic filler such as prepreg, ABF, FR-4, BT resin Etc. may be used. If necessary, a photosensitive insulating resin may also be used.

6 is a schematic enlarged cross-sectional view of the Q region of the coil component of Fig. Referring to the drawing, a coil pattern of the first coil layer 210 is formed by stacking a plurality of conductor patterns. For example, the first conductor patterns 216 and 217 and the second conductor pattern 218 stacked on the first conductor patterns 216 and 217. Thus, when a plurality of conductor patterns are laminated to form a coil pattern, the fine line width and the high aspect ratio, which have been limited by the conventional method, can be realized at the same time. Hereinafter, the coil component 10B according to another example will be described, but the contents overlapping with those described above will be omitted

The coil pattern formed by laminating a plurality of conductor patterns may be surrounded by the resist patterns 402 and 403. [ For example, the first coil patterns 216 and 217 may be surrounded by the first resist pattern 402. The second coil pattern 218 may be surrounded by the second resist pattern 403. [ The resist patterns 402 and 403 insulate the coil pattern as necessary. The material of the resist patterns 402 and 403 is not particularly limited and may be a known photosensitive insulating resin.

Although the boundaries of the first resist pattern 402 and the second resist pattern 403 are shown in the drawing, they may be integrated and not bounded. Although only the first coil layer 210 has been described for the sake of convenience, it goes without saying that the above-described contents may be applied to other coil layers such as the second coil layer 220 and the like.

Fig. 7 shows an example of a schematic manufacturing process of a coil pattern capable of simultaneously realizing a fine line width and a high aspect ratio. The description of the manufacturing process of the coil component will be omitted.

Referring to FIG. 7A, substrates 101 and 214 having a seed layer 216 formed on at least one surface thereof are prepared. The substrates 101 and 214 may be a magnetic sheet 101 and an insulating layer 214 disposed on the magnetic sheet 101 but not limited thereto and may be, Or may be merely insulating layer 214. The material of the seed layer 216, the magnetic sheet 101, the insulating layer 214, and the like are as described above.

Referring to FIG. 7B, a photoresist 401 is formed on the seed layer 216. The material of the photoresist 401 is not particularly limited and may be a known photosensitive insulating resin. The method of forming the photoresist 401 is also not particularly limited, and can be formed by a known lamination method or a known coating method. As the lamination method, for example, a hot pressing method in which the resin is pressed at a high temperature for a certain period of time and then reduced in pressure to room temperature, and then cooled in a cold press to separate the working tool can be used. As the application method, for example, a screen printing method in which ink is applied by squeezing, a spray printing method in which ink is fogged and applied, and the like can be used.

Referring to FIG. 7C, the photoresist 401 is patterned. The pattern may be a pattern corresponding to a coil pattern, a via pattern, a via connection pattern or the like, and the pattern corresponding to the coil pattern may be a flat spiral shape. The patterning method is not particularly limited, and can be performed by a known photolithography method. For example, the photoresist 401 can be patterned by a method in which exposure is performed using a mask that has been previously patterned and then development is performed using a known etchant.

Referring to FIG. 7D, the seed layer 216 is patterned using the patterned photoresist 401, that is, the resist pattern 401 as a mask. The pattern may be a pattern corresponding to a coil pattern, a via pattern, a via connection pattern or the like, and the pattern corresponding to the coil pattern may be a flat spiral shape. The patterning method is not particularly limited, and can also be performed by a known photolithography method.

Referring to FIG. 7E, the resist pattern 401 is removed. The method of removing the resist pattern 401 is also not particularly limited, and can be performed by a known photolithography method.

Referring to FIG. 7F, a first resist pattern 402 is formed on the substrates 101 and 214. The first resist pattern 402 has a line width W ₁ substantially equal to the width of the seed layer 216. The first resist pattern 402 may also be a pattern corresponding to a coil pattern, a via pattern, a via connection pattern or the like, and the pattern corresponding to the coil pattern may be a flat spiral pattern. The method of forming the first resist pattern 402 is not particularly limited and can be similarly performed by a known photolithography method.

Referring to FIG. 7G, a first plating layer 217 is formed on the seed layer 216 using the first resist pattern 402 as a mask, thereby forming the first conductor patterns 216 and 217. The first conductor patterns 216 and 217 may have a line width W ₁ and a thickness H ₁ substantially equal to those of the first resist pattern 402.

Referring to FIG. 7H, a second resist pattern 403 is formed on the first resist pattern 402. The second resist pattern 403 has a line width W _{2 that} is wider than the line width W ₁ of the first resist pattern 402. Therefore, the first resist pattern 402 has a small area compared to the area of the first resist pattern 402, and as a result, the degree of alignment that can accurately match the resist pattern is high. The second resist pattern 403 may also be a pattern corresponding to a coil pattern, a via pattern, a via connection pattern or the like, and the pattern corresponding to the coil pattern may be a flat spiral pattern. The method of forming the second resist pattern 403 is not particularly limited, and can also be performed by a known photolithography method.

Referring to FIG. 7I, a first plating layer 218 is formed on the first plating layer 217 using the second resist pattern 403 as a mask, thereby forming a second conductor pattern 218. The second conductor pattern 218 may have a line width W ₂ and a thickness H ₂ substantially equal to those of the second resist pattern 403.

Referring to FIG. 7J, the first and second resist patterns 402 and 403 are removed. The method of removing the first and second resist patterns 402 and 403 is also not particularly limited and can be performed by a known photolithography method. Alternatively, instead of removing the first and second resist patterns 402 and 403, they may be used as an insulating material. That is, as in the coil component 10B according to another example, it goes without saying that it can be used as a plating layer in this state.

Referring to FIG. 7K, an insulating material 215 surrounding the first and second conductor patterns 216, 217, 218 is formed. The insulating material 215 can be formed by a known lamination method or a known coating method. As the lamination method, for example, a hot pressing method in which the resin is pressed at a high temperature for a certain period of time and then reduced in pressure to room temperature, and then cooled in a cold press to separate the working tool can be used. As the application method, for example, a screen printing method in which ink is applied by squeezing, a spray printing method in which ink is fogged and applied, and the like can be used.

Although a single coil component is shown for convenience in the drawing, it is needless to say that, in an actual mass production process, a plurality of coil components may be simultaneously formed on one large substrate, and then they may be separately manufactured.

In the present disclosure, the term " electrically connected " means a concept including both a case of being physically connected and a case of being not connected. Also, the first, second, etc. expressions are used to distinguish one component from another, and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the right, the first component may be referred to as a second component, and similarly, the second component may be referred to as a first component.

The expression " exemplary " used in this disclosure does not mean the same embodiment but is provided for emphasizing and explaining different unique features. However, the above-mentioned examples do not exclude that they are implemented in combination with the features of other examples. For example, although the description in the specific example is not described in another example, it can be understood as an explanation related to another example, unless otherwise described or contradicted by the other example.

The terms used in this disclosure are used only to illustrate an example and are not intended to limit the present disclosure. Wherein the singular expressions include plural expressions unless the context clearly dictates otherwise.

1000: electronic device 1001: case
1002: USB input unit 1003:
1010: Motherboard 1020: Circuit pattern
1030, 1040: Electronic parts 10, 10A, 10B: coil parts
101, 102: cover part 103: magnetic core
200: coil part 210, 220: coil layer
214, 224, 234: insulating layer 215, 225: insulating material
216: Seed layer 217, 227, 218, 228: Plated layer
211a, 211b, 221a and 221b:
212a, 212b, 222a, 222b: pattern for via connection
232a. 232b: via pattern
213a, 213b, 223a, 223b:
301a, 301b, 302a, and 302b:

Claims (10)

In a coil part including a coil part,
Wherein the coil portion includes at least one coil pattern,
Wherein each of the coil patterns includes a first conductor pattern and a second conductor pattern stacked on the first conductor pattern,
The first conductor pattern and the second conductor pattern being in contact with each other to realize a planar spiral pattern having a plurality of turns,
The number of conductor layers constituting each of the first conductor pattern and the second conductor pattern is different,
Wherein the first conductor pattern and the second conductor pattern have line widths different from each other,
Coil parts.
The method according to claim 1,
Wherein the second conductor pattern has a larger width than the first conductor pattern,
Coil parts.
3. The method of claim 2,
Wherein the first conductor pattern comprises a seed layer and a first plating layer,
Wherein the second conductor pattern comprises a second plating layer,
Coil parts.
The method according to claim 1,
Each of the coil patterns having an aspect ratio of more than 1,
Coil parts.
The method according to claim 1,
Each coil pattern having a planar spiral pattern,
Coil parts.
The method according to claim 1,
Wherein the coil component further comprises a plurality of magnetic sheets,
Wherein the plurality of magnetic sheets are disposed on both sides of the coil portion,
Coil parts.
The method according to claim 1,
The coil component further includes an external electrode,
Wherein the external electrode is electrically connected to the coil portion,
Coil parts.
Preparing a substrate having a seed layer on at least one surface thereof;
Patterning a seed layer formed on the substrate;
Forming a first resist pattern on a substrate on which the patterned seed layer is formed;
Forming a first plating layer on the patterned seed layer by plating using the first resist pattern as a mask based on the seed layer to form a first plating pattern;
Forming a second resist pattern having a line width different from that of the first resist pattern on the first resist pattern; And
Forming a second plating pattern on the first plating layer using the second resist pattern as a mask by forming a second plating layer in contact with the first plating layer on the basis of the first plating layer; / RTI >
A method of manufacturing a coil component.
9. The method of claim 8,
Wherein the second resist pattern has a width larger than that of the first resist pattern,
A method of manufacturing a coil component.
9. The method of claim 8,
Wherein the first and second resist patterns have a planar spiral pattern,
A method of manufacturing a coil component.

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