KR101760002B1 - A cooling device for invertor of heanting induction - Google Patents

A cooling device for invertor of heanting induction Download PDF

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Publication number
KR101760002B1
KR101760002B1 KR1020150094009A KR20150094009A KR101760002B1 KR 101760002 B1 KR101760002 B1 KR 101760002B1 KR 1020150094009 A KR1020150094009 A KR 1020150094009A KR 20150094009 A KR20150094009 A KR 20150094009A KR 101760002 B1 KR101760002 B1 KR 101760002B1
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KR
South Korea
Prior art keywords
inverter
heat
space
switching element
housing
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KR1020150094009A
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Korean (ko)
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KR20170004109A (en
Inventor
이민기
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자원전자 주식회사
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Priority to KR1020150094009A priority Critical patent/KR101760002B1/en
Publication of KR20170004109A publication Critical patent/KR20170004109A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/12—Cooking devices
    • H05B6/1209—Cooking devices induction cooking plates or the like and devices to be used in combination with them
    • H05B6/1245—Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements
    • H05B6/1263—Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements using coil cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
    • H05B3/50—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material heating conductor arranged in metal tubes, the radiating surface having heat-conducting fins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B41/00—Circuit arrangements or apparatus for igniting or operating discharge lamps
    • H05B41/14—Circuit arrangements
    • H05B41/26—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc
    • H05B41/28—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters
    • H05B41/288—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters with semiconductor devices and specially adapted for lamps without preheating electrodes, e.g. for high-intensity discharge lamps, high-pressure mercury or sodium lamps or low-pressure sodium lamps
    • H05B41/2881—Load circuits; Control thereof
    • H05B41/2882—Load circuits; Control thereof the control resulting from an action on the static converter
    • H05B41/2883—Load circuits; Control thereof the control resulting from an action on the static converter the controlled element being a DC/AC converter in the final stage, e.g. by harmonic mode starting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/12—Cooking devices
    • H05B6/1209—Cooking devices induction cooking plates or the like and devices to be used in combination with them
    • H05B6/1218—Cooking devices induction cooking plates or the like and devices to be used in combination with them with arrangements using lights for heating zone state indication
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a heat dissipating device of an induction heating inverter and includes a housing 110 and a lower space portion 131a provided in the housing 110 to partition the space into a first space portion S1 and a second space portion S2, And a support portion 122 bent from the mounting plate portion 121 and the mounting plate portion 121 and a support portion 122 is formed on the upper surface of the housing 110, The induction heating inverter IH is constituted by a switching element substrate IHb and a main substrate IHa separated from each other and the switching element substrate IHb is constituted by an inverter mounted on the bottom surface 110a of the inverter IHb, The main board IHa is disposed in contact with the mounting plate portion 121 of the mount 120. The main board IHa is spaced apart from the switching element board IHb and supported by the support bar IHc, And a heat radiation wind is supplied to the inverter mount 120 through the lower discharge port 131a A lower blower 141 which blows air to heat the switching element IHsw and a lower blower 141 which is located above the partition frame 130 and is spaced upward from the lower blower 141 and radiates heat radiation through the upper discharge port 133a to the main board And an upper blower 145 for blowing air to the heaters IHa, IHa. According to this structure, there is an advantage that the heat radiation efficiency of the inverter can be increased.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an induction heating inverter,

The present invention relates to a heat dissipation device of an induction heating inverter, and more particularly to a heat dissipation device of an induction heating inverter which is divided into a main substrate for mounting a substrate of a switching element and other elements in consideration of a heat generation amount and a heat generation characteristic of the induction heating inverter, The blower for dissipating heat from the switching element and the main board is separately provided and the wind from the blower for cooling the switching element is blown to the inside of the inverter mount in which the switching element is in surface contact And a heat dissipation device of an induction heating inverter adapted to independently cool the switching element and the main board in accordance with the characteristics of the respective elements to cool the switching element and the main board so as to enhance the cooling efficiency of the inverter.

Generally, an inverter converts a DC power source to an AC power source. Specifically, an inverter converts a commercial AC power source into a DC power source using a power semiconductor, and then converts the DC power source into an AC power source having a desired frequency and voltage .

Such an inverter is widely used for an induction heating apparatus (device) for heating a metal or the like by using a high frequency power source.

The inverter includes a circuit unit including a switching element (for example, a thyristor, a power transistor, an IGBT, etc.) for switching a DC power supply and outputting it as a high frequency power source. Many IGBTs and other heating elements are mounted, A technique for cooling a heating element has been developed.

Conventionally, as a technique for cooling an inverter, a heat sink for rapidly radiating heat and a cooling fan for guiding external air to a heat sink have been adopted.

As a conventional technique relating to such a cooling apparatus for an inverter, Japanese Patent Application Laid-Open No. 10-2013-0140454 (published on December 24, 2013) discloses an "heating element cooling apparatus for an inverter ".

This technique uses a heat sink and a heat dissipation fan, and there is a limitation in the heat dissipation efficiency that can not be used for the structure of the heat sink and the large power in the flow path forming structure of the heat dissipation fan.

Further, the technology for cooling circuit elements other than the IGBTs is lacking, which has limitations in technology.

As a technique of the prior art relating to a cooling device for an inverter, Japanese Unexamined Patent Application Publication No. 10-2015-0025348 (published on May 31, 2015) discloses a cooling device for an inverter.

No. 10-2015-0025348 was also difficult to use for large power, and there was a problem that the cooling method for a heating element other than the IGBT was not adopted.

Literature 1. Japanese Patent Application Laid-Open No. 10-2013-0140454 (Publication date: December 24, 2014) Document 2. Japanese Patent Application Laid-Open No. 10-2015-0025348 (Publication date: March 10, 2013)

The object of the present invention is to provide a heat dissipating device for an induction heating inverter according to the present invention,

First, considering the heating value and the heating characteristics of the induction heating inverter, the switching element substrate and the main substrate are separated into a main substrate for mounting the substrate of the switching element and other elements, and the switching element substrate and the main substrate are vertically spaced apart. The blower for dissipating heat from the main board is separately provided and the wind from the blower for cooling the switching device is blown into the inverter mount in which the switching device is in contact with the surface, The cooling efficiency of the inverter can be increased by cooling the switching element and the main board by independently adopting them according to the characteristics,

Second, the heat generated in the switching element is conducted to the inverter mount by the thermally conductive plate, thereby transferring the heat from the switching element to the inverter mount quickly and efficiently, thereby increasing the heat radiation efficiency.

Third, by providing a heat sink inside the inverter mount, the heat generated from the switching device can be more efficiently dissipated to the inner space of the inverter mount,

Fourth, by adopting a configuration in which a pair of rail grooves are formed and the flow guide member is slidably engaged with the flow guide member, the flow guide member can be easily and quickly installed on the heat sink,

Fifth, by adopting the flow guide member composed of the flat guide portion and the inclined guide portion, the heat radiation wind generated in the lower blower can be guided to the inside of the heat sink without loss and the heat of the switching element gathered in the heat sink is re- Also, it is possible to discharge 100%

Sixth, by adopting the dividing frame having a specific bending structure, it is possible to separately transmit the wind sent to the switching element and the main board in correspondence with the target, to facilitate the installation of the upper and lower blowers, It is possible to prevent the heat generated in the blower from falling to the first space portion,

Seventhly, in order to improve the cooling efficiency of the main board and the switching element, the wind direction of the lower blower is directed toward the heat sink as the blowing target and the wind direction of the upper blower is directed toward the main board as the blowing target There is provided a heat dissipating device of an induction heating inverter adapted to be suitable for the following.

According to another aspect of the present invention, there is provided an apparatus for dissipating heat in an induction heating inverter, the apparatus comprising: a housing; and a housing installed in the housing so as to cross in a lateral direction orthogonal to the longitudinal direction of the housing, The housing is divided into a first space portion and a second space portion which are spaces in which the induction heating inverter is installed and a lower discharge port is formed to communicate the first space portion and the second space portion, And the upper discharge port is formed so as to communicate with the first space portion and the second space portion, and is composed of a partition frame, a flat plate-like mounting plate portion, and a support portion bent downward in a direction in which the bottom surface of the housing is located in the mounting plate portion And the support portion contacts the bottom surface of the housing while the rear end contacts the partition frame. Comprising: an inverter that is mounted,

Wherein the induction heating inverter is constituted by a switching element substrate on which a switching element is mounted and a main substrate on which elements of the induction heating inverter other than the switching element are mounted and the switching substrate is in surface contact with the mounting plate portion of the inverter mount Wherein the main board is supported by a plurality of support rods spaced upward from the switching board and installed in a mounting plate portion of the inverter mount,

A lower blower installed at a lower side of the partition frame in the second space portion and blowing heat radiation wind to the inner space of the inverter mount through the lower discharge port to radiate heat to the switching device;

And an upper blower installed above the partition frame in the second space so as to be spaced upward from the lower blower and blowing heat radiation wind to the main board through the upper discharge port to radiate heat to the main board .

The heat dissipating device of the induction heating inverter according to the present invention further comprises a heat conduction plate provided in face-to-face contact with a mounting plate portion of the inverter mount, wherein the switching element is arranged in the heat conduction plate And the heat generated in the switching element is conducted to the inverter mount by the heat conduction plate.

The heat dissipating device of the induction heating inverter according to the present invention includes a heat dissipation device installed in an inner space of the inverter mount in close contact with the mounting plate part, and heat of the switching device conducted to the inverter mount through the heat conduction plate, Wherein the heat sink is constituted by a plate-shaped body portion provided in contact with the mounting plate portion in a plane, and a plurality of radiating fins formed downwardly from the body portion,

Wherein the plurality of radiating fins are composed of a pair of left and right outer radiating fins bent downward from an edge of the body portion and a plurality of inner radiating fins protruding downward from the body portion at equal intervals between the pair of outer radiating fins,

The outer radiating fins are formed to be longer than the inner radiating fins,

A pair of rail grooves are formed opposite to each other below the pair of outer radiating fins,

A plurality of heat dissipating fins disposed on the inner surface of the heat sink, the heat dissipating fins being slidably fitted in the pair of rail grooves while maintaining a sliding tolerance on ends of the plurality of internal radiating fins, And further comprises a guide member,

The flow-

A flat flat guide portion that is slidably fitted in the pair of rail grooves while maintaining a sliding tolerance at the ends of the plurality of the inner radiating fins and is coupled to the heat sink 160 at a rear end of the flat guide portion, And guiding the cooling air discharged from the lower discharge port to the inner space of the heat sink.

The heat dissipating device of the induction heating inverter according to the present invention is characterized in that the partition frame has a lower vertical portion having the lower discharge port (131a) formed in a transverse direction transverse to the longitudinal direction of the housing and a rear vertical portion And a lower vertical portion bent upward from the bending horizontal portion 132 and having the upper discharge port formed therein, wherein the lower blower is disposed in a space defined by the lower vertical portion and the bending horizontal portion And the upper blower is installed in a room immediately after the upper vertical part.

In the heat dissipating device of the induction heating inverter according to the present invention, the lower blower and the upper blower are installed such that the rotation axis of the lower blower and the upper blower are parallel to the lateral direction orthogonal to the longitudinal direction of the housing, and the lower blower is formed such that the wind is formed in a direction The upper blower is rotated in one direction so that the upper blower rotates in the other direction so that the wind is formed in a direction inclining from top to bottom.

The heat dissipating device of the induction heating inverter of the present invention having the above-described configuration has the following effects.

First, considering the heating value and the heating characteristics of the induction heating inverter, the switching element substrate and the main substrate are separated into a main substrate for mounting the substrate of the switching element and other elements, and the switching element substrate and the main substrate are vertically spaced apart. The blower for dissipating heat from the main board is separately provided and the wind from the blower for cooling the switching element is blown into the inverter mount in which the switching element is in contact with the surface, It is possible to increase the cooling efficiency of the inverter by cooling the switching element and the main board by independently adopting them in accordance with the characteristics.

Second, the heat generated in the switching element is conducted to the inverter mount by the thermally conductive plate, so that the heat from the switching element can be transferred quickly and efficiently to the inverter mount, thereby enhancing heat radiation efficiency.

Third, since the heat sink is provided in the inverter mount, the heat generated in the switching element can be more efficiently dissipated to the internal space of the inverter mount.

Fourth, by adopting a configuration in which a pair of rail grooves are formed and the flow guide member is slidably engaged with the flow guide member, the flow guide member can be easily and quickly installed on the heat sink. As a result, have.

Fifth, by adopting the flow guide member composed of the flat guide portion and the inclined guide portion, the heat radiation wind generated in the lower blower can be guided into the heat sink without loss, and the heat of the switching element It is possible to quickly and completely discharge 100% of the product to the outside.

Sixth, by adopting the dividing frame having a specific bending structure, it is possible to separately transmit the wind sent to the switching element and the main board in correspondence with the target, to easily install the upper and lower blowers, It is possible to prevent the generated heat from being transferred to the first space portion.

Seventhly, it is possible to configure the wind direction of the lower blower to be directed toward the heat sink, which is the blowing target, and the wind direction of the upper blower to be directed toward the main board as the blowing target, thereby improving the cooling efficiency of the main board and the switching element It is effective.

1 is a front view of a heat dissipating device of an induction heating inverter according to an embodiment of the present invention.
Fig. 2 is a side cross-sectional view of Fig. 1. Fig.
FIG. 3 is a plan view of the housing 110 of FIG. 1 with the lid 110c removed.
4 is a perspective view of a partition frame 130 in a heat dissipating device of an induction heating inverter according to an embodiment of the present invention.
5 is an exploded perspective view of the inverter mount 120 and the heat sink 160 in the heat dissipating device of the induction heating inverter according to the embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a heat dissipation device of an induction heating inverter according to the present invention will be described in detail below with reference to the accompanying drawings.

As shown in the drawing, the heat dissipation device 100 of the induction heating inverter according to the embodiment of the present invention includes an induction heating inverter IH provided in an induction heating appliance such as an induction heating cooker, an induction heating mold, The induction heating inverter IH includes a switching element substrate IHb on which a switching element IHsw (for example, an IGBT) in which the most heat is generated is mounted, and an induction heating inverter IHsw other than the switching element IHsw The switching element substrate IHb is separated from the main substrate IHa on which the elements of the inverter IH are mounted and the switching element substrate IHb is provided in surface contact with the mounting plate portion 121 of the inverter mount 120 The main board IHa of the induction heating inverter IH is spaced upward from the switching element board IHb so that the mounting of the inverter mount 120 In the plate portion 121 A side surface 110b bent upward at the bottom surface 110a and a bottom surface 110b bent at the side surface 110b to be supported by the plurality of support rods IHc, A housing 110 which is made up of an opposing lid portion 110c and penetrates in a longitudinal direction and a housing 110 which is upright on a bottom surface 110a of the housing 110 and which extends in a left- The housing 110 is divided into a first space S1 and a second space S2 in which the induction heating inverter IH is installed, A plurality of discharge ports 131a are formed to communicate the first space S1 and the second space S2 so that the upper discharge port 133a is spaced upward from the lower discharge port 131a, (S1) and the second space (S2), the partition frame (130) And a support portion 122 bent downward in a direction in which the bottom surface 110a of the housing 110 is located in the mounting plate portion 121. The rear end of the support portion 122 is connected to the partition frame The support portion 122 is installed on the bottom surface 110a of the housing 110 and contacts the first space 130 and the second space S2, Which blows heat radiation wind to the inner space Sa of the inverter mount 120 through the lower discharge port 131a and radiates heat to the switching device IHsw, (130) and the upper portion of the partition frame (130) in the second space portion (S2) so as to be spaced upward from the lower blower (141) The main substrate IHa is blown to the substrate IHa, And an upper blower 145 for radiating heat.

The induction heating inverter IH is divided into a main substrate IHa for mounting the substrate IHb of the switching device IHsw and other devices in consideration of the heating value and the heat generating characteristic, And the blower 141 and 145 for dissipating heat from the switching device IHsw and the main board IHa after the main board IHa and the main board IHa are vertically spaced apart from each other, The wind from the blowers 141 and 145 for blowing the air is blown into the inverter mount 120 in which the switching device IHsw is in contact with the surface so that the cooling method of the switching device IHsw and the main substrate IHa is changed The switching device IHsw and the main substrate IHa can be cooled to improve the cooling efficiency of the inverter.

In the heat dissipating device 100 of the induction heating inverter according to the embodiment of the present invention, a thermally conductive plate 150 made of a thermally conductive material, which is provided in surface contact with the mounting plate portion 121 of the inverter mount 120, And the switching element IHsw is in contact with the thermally conductive plate 150 in a plane so that the switching element substrate IHb is directed toward the main substrate IHa and is generated in the switching element IHsw Heat is conducted to the inverter mount (120) by the heat conduction plate (150).

According to this, there is an advantage that the heat from the switching device IHsw can be quickly and efficiently transferred to the inverter mount 120 to dissipate heat.

The thermally conductive plate 150 may be made of a copper (Cu) material having excellent thermal conductivity, for example.

In the heat dissipating device 100 of the induction heating inverter according to the embodiment of the present invention, the heat dissipating device 100 is installed in the inner space Sa of the inverter mount 120 in close contact with the mounting plate portion 121 and the support portion 122 And a heat sink 160 for dissipating the heat of the switching device IHsw conducted to the inverter mount 120 through the heat conduction plate 150 to the internal space Sa of the inverter mount 120 The heat sink 160 includes a plate-shaped body portion 161 provided in contact with the mounting plate portion 121 in a planar manner and a plurality of radiating fins 162 and 163 formed downwardly from the body portion 161 The plurality of radiating fins 162 and 163 may include a pair of right and left outer radiating fins 163 bent downward from an edge of the body 161 and formed at left and right ends thereof and a pair of outer radiating fins 163 formed between the pair of outer radiating fins 163, Lt; RTI ID = 0.0 > 161 < / RTI & Being composed of a plurality of inner heat radiation fin 162 to the dolseol characterized.

The heat sink 160 is provided inside the inverter mount 120 so that the heat generated from the switching device IHsw can be dissipated more efficiently into the internal space Sa of the inverter mount 120 .

In the heat dissipating device 100 of the induction heating inverter according to the embodiment of the present invention, the outer radiating fins 163 are formed to be longer than the inner radiating fins 162, and the pair of outer radiating fins 163, And a pair of rail grooves 163a are formed to be opposed to each other on the lower side.

Thus, the flow path guide member 170 can be easily and quickly installed on the heat sink 160, which improves installation workability.

In the heat dissipation device 100 of the induction heating inverter according to the embodiment of the present invention, the sliding shafts are slidably fitted in the pair of rail grooves 163a while maintaining a sliding tolerance at the ends of the plurality of internal radiating fins 162 And a flow guide member 170 coupled to the heat sink 160 and guiding the cooling air discharged from the lower discharge port 131a to the internal space Sb of the heat sink 160 .

The flow path guide member 170 is slidably fitted in the pair of rail grooves 163a while maintaining a sliding tolerance at the ends of the plurality of internal radiating fins 162 and is coupled to the heat sink 160. [ A flat guide portion 171 having a flat shape such that the heat of the heat sink IHsw is gathered in the inner space Sb of the heat sink 160; And an inclined guide portion 172 which is bent downwardly and guides the cooling air discharged from the lower discharge port 131a to the internal space Sb of the heat sink 160. [

In this case, the heat radiation wind generated in the lower blower 141 can be guided into the heat sink without loss, and the heat of the switching device IHsw gathered in the heat sink 160 can be quickly re- There is an advantage that it can be discharged to the outside.

In the heat dissipating device 100 of the induction heating inverter according to the embodiment of the present invention, the partition frame 130 is disposed in the housing 110 so as to extend in the lateral direction orthogonal to the longitudinal direction of the housing 110, A lower vertical portion 131 formed upright on the bottom surface 110a and having the lower discharge port 131a formed thereon, a bending horizontal portion 132 vertically bent backward from the lower vertical portion 131, The lower blower 141 is vertically bent upward from the bending horizontal portion 132 and is formed with an upper vertical portion 133 on which the upper discharge port 133a is formed. And the upper blower 145 is installed in a space immediately after the upper vertical part 133. The upper blower 145 is installed in a space formed by the horizontal part 132,

According to this, the wind sent to the switching device IHsw and the main board IHa can be sent separately in correspondence with the target, and the upper and lower blowers 141 and 145 can be easily installed.

In addition, the heat generated in the upper and lower blowers 141 and 145 installed in the second space S2 can be prevented from being transferred to the first space S1, so that the heat radiation efficiency of the inverter can be increased.

Specifically, the lower blower 141 may be mounted on the lower vertical portion 131 by a fastening screw, and the upper blower 145 may be mounted on the upper vertical portion 133 by a fastening screw.

In the heat dissipating apparatus 100 of the induction heating inverter according to the embodiment of the present invention, the lower blower 141 and the upper blower 145 are arranged such that the rotational shafts 141a and 145a thereof extend in the longitudinal direction of the housing 110 And the blades 141b and 145b of the lower blower 141 and the upper blower 145 are rotated so as to be orthogonal to the rotation shafts 141a and 145a of the lower blower 141 and the lower blower 141, And the upper blower 145 rotates in the other direction so that the wind is formed in a direction inclining from top to bottom.

According to this, the direction of the wind of the lower blower 141 can be formed toward the heat sink 160, which is the blowing target (the flow is shown slanting from the bottom to the top as shown in FIG. 2) , And the advantage that the direction of wind of the upper blower 145 can be formed into the direction of the wind toward the main substrate IHa which is the blowing target (the flow is shown sloping from top to bottom as shown in FIG. 2) have.

It will be apparent to those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or scope of the invention as defined in the appended claims. It is self-evident to those who have.

Therefore, the above-described embodiments are to be considered as illustrative rather than restrictive, and the present invention is not limited to the above description, but may be modified within the scope of the appended claims and equivalents thereof.

100: a heat dissipation device of an induction heating inverter according to an embodiment of the present invention
110: housing 110a: bottom surface of the housing
110b: side part of the housing 110c: cover part of the housing
S1: first space part of the housing S2: second space part of the housing
120: Inverter mount Sa: Internal space of inverter mount
121: Mounting plate portion 122: Support
IH: Induction heating inverter IHa: Main substrate
IHb: switching element substrate IHsw: switching element
IHc: support bar 130:
131: Lower vertical portion 131a: Lower outlet portion
132: bending horizontal part 133: upper vertical part
133a: upper discharge port 141: lower blower
141a: rotational axis of the lower blower 141b: blade of the lower blower
145: Upper blower 145a: Rotation axis of the upper blower
145b: blade of upper blower
150: heat conduction plate 160: heat sink
161: Body portion of the heat sink 162: Internal heat radiating fin
163: outer radiating fin 163a: rail groove
170: Flow guide member 171: Flat guide part
172: inclined guide portion

Claims (4)

An apparatus for radiating heat from an inverter (IH) of an induction heating apparatus,
A housing 110,
The housing 110 is installed in the housing 110 across the longitudinal direction of the housing 110 to define a first space S1 in which the induction heating inverter IH is installed, And a lower discharge port 131a is formed to communicate with the first space S1 and the second space S2 so as to communicate with the lower discharge port 131a upward from the lower discharge port 131a The upper discharge port 133a is formed so as to communicate with the first space S1 and the second space S2 so that the partition 130,
And a support portion 122 bent downward in a direction in which the bottom surface 110a of the housing 110 is located in the mounting plate portion 121. The rear end of the mounting plate portion 121 is connected to the partition frame And an inverter mount 120 installed on the bottom surface 110a of the housing 110 so as to contact the support portion 122 while being in contact with the housing 110,
The induction heating inverter IH includes a switching element substrate IHb on which a switching element IHsw is mounted and a main substrate IHa on which elements of the induction heating inverter IH other than the switching element IHsw are mounted Respectively,
The switching element substrate IHb is provided in surface contact with the mounting plate portion 121 of the inverter mount 120,
The main board IHa is supported by a plurality of supporting rods IHc spaced upward from the switching element board IHb and installed in a mounting plate portion 121 of the inverter mount 120,
The second space part S2 is provided below the partition frame 130 and blows heat radiation wind to the internal space Sa of the inverter mount 120 through the lower discharge port 131a, A lower blower 141 for dissipating heat of the IHsw,
Is installed on the upper side of the partition frame 130 in the second space S2 so as to be spaced upward from the lower blower 141 and radiates heat radiation to the main substrate IHa through the upper discharge port 133a Further comprising an upper blower (145) for blowing air to the main board (IHa) to dissipate heat.
The method according to claim 1,
And a thermal conductive plate 150 provided in surface contact with the mounting plate portion 121 of the inverter mount 120,
The switching device IHsw is in contact with the thermally conductive plate 150 in a plane so that the switching device substrate IHb faces toward the main substrate IHa,
Wherein the heat generated in the switching device (IHsw) is conducted to the inverter mount (120) by the heat conduction plate (150).
The method of claim 2,
The heat of the switching device IHsw which is in close contact with the mounting plate portion 121 and is installed in the internal space Sa of the inverter mount 120 and is conducted to the inverter mount 120 through the heat conductive plate 150 And a heat sink 160 for dissipating heat to the internal space Sa of the inverter mount 120,
The heat sink 160 includes a plate-shaped body portion 161 provided in a surface contact with the mounting plate portion 121 and a plurality of radiating fins 162 and 163 formed downwardly from the body portion 161,
The plurality of radiating fins 162 and 163 may include a pair of left and right outer radiating fins 163 bent downward from an edge of the body portion 161 and a pair of right and left outer radiating fins 163 extending downward from the body portion 161 between the pair of outer radiating fins 163. [ And a plurality of internal radiating fins 162 protruding downward at regular intervals,
The outer radiating fins 163 are longer than the inner radiating fins 162,
A pair of rail grooves 163a are formed on the lower side of the pair of outer radiating fins 163 so as to face each other,
And is slidably fitted into the pair of rail grooves 163a while maintaining a sliding tolerance at the ends of the plurality of internal radiating fins 162 so as to be coupled to the heat sink 160 and cooled And a flow path guide member (170) for guiding wind to the internal space (Sb) of the heat sink (160)
The flow path guide member 170 is formed of,
A flat flat guide portion 171 slidably fitted in the pair of rail grooves 163a while being coupled to the heat sink 160 while maintaining a sliding tolerance at the ends of the plurality of internal radiating fins 162, A slope that is bent downward in the direction of the lower discharge port 131a from the rear end of the flat guide portion 171 to guide the cooling wind discharged from the lower discharge port 131a to the inner space Sb of the heat sink 160, And a guide portion (172).
The method according to claim 1,
The partition frame (130)
A lower vertical portion 131 having the lower discharge port 131a formed in the left and right direction perpendicular to the longitudinal direction of the housing 110,
A bending horizontal portion 132 bent backward from the lower vertical portion 131,
And an upper vertical portion 133 which is bent upward in the bending horizontal portion 132 and on which the upper discharge port 133a is formed,
The lower blower 141 is provided in a space defined by the lower vertical portion 131 and the bending horizontal portion 132,
Wherein the upper blower (145) is installed in a room immediately after the upper vertical part (133).
KR1020150094009A 2015-07-01 2015-07-01 A cooling device for invertor of heanting induction KR101760002B1 (en)

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Citations (3)

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JP2008059982A (en) 2006-09-01 2008-03-13 Matsushita Electric Ind Co Ltd Induction-heating cooking device
KR100813730B1 (en) 2006-12-27 2008-03-13 엘지전자 주식회사 Induction cooking apparatus
JP2013162052A (en) 2012-02-08 2013-08-19 Mitsubishi Electric Corp Control device

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KR101831196B1 (en) 2012-06-14 2018-02-22 엘에스산전 주식회사 Heat-generating element cooling apparatus for inverter
KR101777439B1 (en) 2013-08-29 2017-09-11 엘에스산전 주식회사 Cooling device for invertor

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2008059982A (en) 2006-09-01 2008-03-13 Matsushita Electric Ind Co Ltd Induction-heating cooking device
KR100813730B1 (en) 2006-12-27 2008-03-13 엘지전자 주식회사 Induction cooking apparatus
JP2013162052A (en) 2012-02-08 2013-08-19 Mitsubishi Electric Corp Control device

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