KR101746847B1 - Electrostatic capacity type touch screen panel and method of manufacturing the same - Google Patents

Abstract

The present invention is intended to prevent the electrode pattern and the routing wiring from being disconnected even if an over-etching occurs in the insulating layer in the process of patterning the insulation layer. A touch screen panel of the present invention includes a substrate; An electrode forming unit including a plurality of first electrode rows arranged on a substrate in parallel in a first direction and a plurality of second electrode rows arranged to cross the first electrode rows; A plurality of first routing wirings formed on the substrate at an outer portion of the electrode forming portion and connected to the plurality of first electrode rows, respectively, and a plurality of second routing wirings A routing wiring section including a plurality of wiring patterns; A plurality of first connection patterns formed on the same layer as the plurality of first and second routing wirings and formed separately from each other; A plurality of first insulating patterns for insulating the first electrode row and the second electrode row at the intersection of the first electrode row and the second electrode row; And a second insulating pattern formed on the plurality of first and second routing wirings to expose a portion of the plurality of first and second routing wirings facing the electrode forming portion, Each of the plurality of first electrode patterns is formed of a plurality of first electrode patterns and a first electrode pattern outermost among the plurality of first electrode patterns extends to the routing wiring portion and is electrically connected to the first routing wiring, And adjacent pairs of the electrode patterns are connected by the first connection pattern.

Description

TECHNICAL FIELD [0001] The present invention relates to an electrostatic capacity type touch screen panel,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a touch screen panel and a method of manufacturing the same.

In recent years, display devices such as liquid crystal displays (LCDs), electroluminescent displays, and plasma display panels have attracted attention because of their high response speed, low power consumption, and excellent color recall . Such display devices have been used in various electronic products such as televisions, computer monitors, notebook computers, mobile phones, display parts of refrigerators, personal digital assistants, and automated teller machines. Generally, these display devices constitute an interface with a user by using various input devices such as a keyboard, a mouse, and a digitizer. However, the use of a separate input device such as a keyboard and a mouse has been required to learn how to use the device and to inconvenience such as occupying a space, thereby making it difficult to improve the completeness of the product. Therefore, there is a growing demand for an input device that is convenient and simple and can reduce malfunctions. In accordance with such a demand, a touch screen panel has been proposed in which a user directly touches a screen with a hand or a pen to input information.

The touch screen panel is simple, has little malfunction, can be input without using a separate input device, and can be operated quickly and easily through the contents displayed on the screen. .

The touch screen panel includes a resistive type in which a metallic electrode is formed on a top plate or a bottom plate in accordance with a method of detecting a touched portion to determine a touched position as a voltage gradient according to a resistance in a state in which a direct current voltage is applied, (Electrostatic capacitive type) which detects the position where the voltage change of the upper and lower plates due to the touch is sensed by forming the equal potential on the conductive film and reads the LC value induced by touching the conductive film And an electro-magnetic type in which an indented portion is detected.

Hereinafter, a conventional capacitive touch screen panel according to the related art will be described with reference to FIGS. 1, 2 and 3A to 3E. FIG. 1 is a plan view of a conventional capacitive touch screen panel, FIG. 2 is a cross-sectional view taken along line I-I 'of the touch screen panel shown in FIG. 1, FIG. 2 is a cross-sectional view illustrating a manufacturing process of a touch screen panel.

Referring to FIGS. 1 and 2, a conventional capacitive touch screen panel includes a substrate 10, a plurality of first electrodes (not shown) arranged on the substrate 10 and arranged in a first direction Electrode patterns 40 and a plurality of second electrode patterns 50 arranged in a direction (for example, Y-axis direction) intersecting with the first electrode patterns 40, (61) electrically connected to the outermost first electrode pattern among the plurality of second electrode patterns (40) and a second electrode pattern electrically connected to the outermost second electrode pattern out of the plurality of second electrode patterns And second routing wirings 63. The touch screen panel further includes a bridge 20 formed on the substrate 10 and connecting neighboring first electrode patterns 40 to each other and a substrate 20 on which the bridge 20 is formed, First contact holes 33 for exposing both ends of the bridge 20 and second contact holes 35 for exposing a part of the first and second routing wirings 61 and 63, And an insulating layer 30 for electrically insulating the electrode patterns 40 and the second electrode patterns 50 from each other.

However, in the conventional capacitive touch screen panel, as shown in FIG. 2, in the process of forming the first and second contact holes 33 and 35 in the insulating layer 30, The first electrode pattern 40 and / or the second electrode pattern 50 are formed in the lower portion of the insulating layer 30 where the first and second contact holes 33 and 35 are formed, Defects may occur in the holes (33, 35). 2 shows an example in which the first electrode pattern 40a is formed by disconnection of the first electrode pattern 40 due to overgrowth of the insulating layer 30 in the second contact hole 35 for convenience of explanation The disconnection may occur for the same reason in the second electrode pattern. When the first and / or second electrode patterns 40 and 50 are disconnected along the lower edge of the second contact hole 35 by the overvoltage of the insulating layer 30, Since the connection of the first routing wiring 61 and / or the connection of the second electrode pattern 50 and the second routing wiring 63 are cut off, the touch is not recognized even if the touch screen panel is touched .

The disconnection of the first electrode pattern 40 and / or the second electrode pattern 50 in the second contact hole 35 due to the overheating of the insulating layer 30 may cause the first and / The second contact holes 33 and 35 are formed in the etching process. Hereinafter, a detailed description will be given with reference to FIGS. 3A to 3E. 3A to 3E, only the portion where the first routing wiring 61 and the first electrode pattern 40 are connected will be mainly described for the sake of simplicity.

3A to 3E, a first conductive layer is formed on a substrate 10 by a deposition process such as sputtering, as shown in FIG. 3A, and then a first conductive layer is formed using a photolithography process, The first routing wiring 61 is formed by wet etching the layer.

Next, an insulating layer 30 is formed on the substrate 10 on which the first routing wiring 61 is formed through a deposition method such as sputtering as shown in FIG. 3B.

After the formation of the insulating layer 30, as shown in FIG. 3C, the photolithography process is used so that only the both ends of the first routing wiring 61 and the peripheral portion thereof are not overlapped with the central portion of the first routing wiring 61 A photoresist pattern PR is formed so as to overlap.

3D, when the insulating layer 30 is dry-etched using the photoresist pattern PR as a mask, the insulating layer 30 is patterned by etched gas particles to form the first routing wiring 61, The second contact hole 35 is formed to expose a central portion of the second contact hole 35. [ As described above, the second contact hole 35 is formed in the insulating layer 30 by the dry etching method using the etching gas in the process of forming the second contact hole 35. At this time, The wiring 61 is a conductive metal, and does not react at all to an oxygen plasma used as an etching gas. Therefore, the etch gas particles collide with the bottom surface of the first routing wiring 61 and are reflected or moved along the bottom surface of the first routing wiring 61. The etching gas particles moved along the bottom surface of the first routing wiring 61 are concentrated in the lower edge region of the second contact hole 35 and the insulating layer 30 is formed along the lower edge region of the second contact hole 35 And overexposed portion D1 is generated.

Next, referring to 3e, the second conductive layer is entirely deposited on the substrate 10 on which the insulating layer 30 is over-crystallized in the lower border region of the second contact hole 35 through a process such as sputtering, The first and second electrode patterns 40 and 50 are formed by wet-etching the second conductive layer using a photolithography process. However, since the insulating layer 30 is over-angled along the lower edge of the second contact hole 35, the second conductive layer is deposited and patterned to form the first and second electrode patterns 40 and 50 The first and second electrode patterns 40 and 50 may be disconnected from the overdrive portion D1 formed under the second contact hole 35 of the insulating layer 30 as shown in FIG. do. As described above, when the first and second electrode patterns 40 and 50 are disconnected from each other in the overexposed portion D1 of the second contact hole 35, the connection between the first electrode pattern 40 and the first routing wiring 61 And / or the connection between the second electrode pattern 50 and the second routing wiring 63 is cut off. Thus, even if a touch is made on the touch screen panel, the touch recognition can not be performed.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to solve the above problems and to provide a method of manufacturing a semiconductor device having a first electrode pattern and a first routing pattern, And the connection of the second electrode pattern (61) and / or the connection of the second electrode pattern (50) and the second routing wiring (63) is not cut off, and a manufacturing method thereof.

According to an aspect of the present invention, there is provided a capacitive touch screen panel including: a substrate; An electrode forming unit including a plurality of first electrode rows arranged on the substrate in parallel in a first direction and a plurality of second electrode rows arranged to cross the first electrode rows; A plurality of first routing wirings formed on the substrate at an outer portion of the electrode formation portion and connected to the plurality of first electrode rows and a plurality of second routing wirings connected to the plurality of second electrode rows, A routing wiring portion including two routing wirings; A plurality of first connection patterns formed on the same layer as the plurality of first and second routing wirings and formed separately from each other; A plurality of first insulating patterns for insulating the first electrode row and the second electrode row at a position where the first electrode row and the second electrode row cross each other; And a second insulating pattern formed on the plurality of first and second routing wirings to expose a portion of the plurality of first and second routing wirings facing the electrode forming portion, Wherein each of the first electrode patterns includes a plurality of first electrode patterns and a first electrode pattern outermost among the plurality of first electrode patterns extends to the routing wiring section and is electrically connected to the first routing wiring, And adjacent pairs of the first electrode patterns are connected by the first connection pattern.

In the above structure, the first electrode pattern extending to the routing wiring portion is formed to be formed on the exposed portion of the first routing wiring and at least a part of the second insulation pattern, and at least a portion of the first electrode pattern And is formed on a portion of the first connection pattern and a portion of the first insulation pattern.

The first and second routing patterns may include any one of Al, AlNd, Mo, MoTi, Cu, CuOx, and Cr. Or a first layer formed on the first layer and formed of ITO and IZO in the form of a single layer made of Al, AlNd, Mo, MoTi, Cu, CuOx or Cr; Layer structure including a second layer including any one of them.

Each of the plurality of second electrode rows may include a plurality of second electrode patterns and a second electrode pattern connecting portion for connecting neighboring second electrode patterns, The pattern is preferably formed on the same side of the substrate.

A method of fabricating a capacitive touch screen panel according to an embodiment of the present invention includes forming a first conductive layer on a front surface of a substrate, patterning the first conductive layer to form a plurality of first connection patterns, And forming second routing interconnections; Forming an insulating layer on a front surface of the substrate on which the first conductive pattern is formed, forming a first insulating pattern on a central portion of the first connecting pattern, and forming a first insulating pattern on a portion of each of the plurality of first and second routing wires A second step of forming a second insulating pattern formed on the plurality of first and second routing wirings so as to expose the plurality of first routing wirings; A plurality of first electrode rows arranged in parallel in a first direction by patterning the second conductive layer and forming a second conductive layer on a front surface of the substrate on which the first and second insulating patterns are formed; And a third step of forming a second conductive pattern including a plurality of second electrode rows arranged in parallel in a second direction intersecting the first direction, wherein each of the plurality of first electrode columns includes a plurality of first electrodes Wherein a first electrode pattern outermost among the plurality of first electrode patterns is electrically connected to the first routing wiring and an adjacent pair of the first electrode patterns is formed by the first connection pattern Is connected.

The second process may include a first photoresist pattern having a width smaller than the length of the first connection pattern so as to overlap the central portion of the first connection pattern on the insulating layer formed on the substrate, Forming a second photoresist pattern overlapping with the first routing wiring so that a part of the first routing wiring is exposed; And dry-etching the insulating layer using the first and second photoresist patterns as masks to form the first insulation pattern and the plurality of first and second wiring lines overlapping with the center of the first connection pattern, And forming a second insulation pattern that exposes a part of the second insulation pattern.

According to the capacitance type touch screen panel of the present invention, even if an overexposure angle occurs in the insulating pattern in the step of forming the insulating pattern by patterning the insulating layer, the connection between the first electrode pattern 40 and the first routing wiring 61 Or the connection between the second electrode pattern 50 and the second routing wiring 63 is not cut off. Thus, it is possible to prevent the failure of the touch screen panel.

1 is a plan view of a conventional capacitive touch screen panel,
FIG. 2 is a cross-sectional view taken along line I-I 'of the capacitive touch screen panel shown in FIG. 1,
FIGS. 3A to 3E are cross-sectional views illustrating a manufacturing process of a capacitive touch screen panel according to a conventional technique shown in FIG. 1;
4 is a plan view of a capacitive touch screen panel according to an embodiment of the present invention,
FIG. 5A is a cross-sectional view taken along the line II-II 'of the capacitive touch screen panel of the present invention shown in FIG. 4,
FIG. 5B is a cross-sectional view illustrating an example in which the lower portion of the first and second insulating patterns is over-deflected during the process of patterning the insulating layer in the correction capacitance type touch screen of the present invention shown in FIG. 4,
6A to 6E are cross-sectional views illustrating a manufacturing process of the touch screen panel according to the embodiment of the present invention shown in FIG. 4,
FIG. 6F is a cross-sectional view showing an example in which the bottom of the first and second insulating patterns is over-deflected and the electrode pattern is broken during the patterning process of the insulating layer of FIG. 6D;

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals refer to like elements throughout the specification.

4 and 5, a touch screen panel according to an embodiment of the present invention will be described. FIG. 4 is a plan view of a capacitive touch screen panel according to an embodiment of the present invention, and FIG. 5 is a cross-sectional view taken along line II-II 'of the capacitive touch screen panel of FIG.

4 and 5, a capacitive touch screen panel according to an embodiment of the present invention includes an electrode forming portion A, a routing wiring forming portion B, and a pad portion C. As shown in FIG.

The electrode forming portion A includes a plurality of first electrode rows 140 arranged in parallel in a first direction (e.g., an X axis direction) and a plurality of first electrode rows 140 arranged in a second direction And a plurality of second electrode rows 150 arranged in parallel in a Y-axis direction. The electrode forming portion A is also formed at an intersection of the first electrode line 140 and the second electrode line 150 to electrically connect the first electrode line 140 and the second electrode line 150 to each other, The first insulating patterns 130 of the first insulating layer 130 are formed. Each of the plurality of first electrode lines 140 includes a plurality of first electrode patterns 141 formed in a triangular shape, a square shape, a diamond shape, a polygonal shape, and the like, And the first connection patterns 120 connecting the one-electrode patterns 141. Each of the plurality of second electrode columns 150 includes a plurality of second electrode patterns 151 each formed of a triangle, a quadrangle, a rhombic, a polygon, or the like similar to the first electrode patterns 141, And a plurality of second electrode pattern connecting portions 153 connecting the patterns 151. [ Each of the first connection patterns 120 is formed on the substrate 100 under the first insulation pattern 130 at the intersection of the first electrode line 140 and the second electrode line 150 The second electrode pattern connection part 153 is formed integrally with the second electrode patterns 151 and the second electrode pattern connection part 153 is formed integrally with the first electrode pattern part 151 on the upper part of the substrate 100, Are formed on the substrate 130.

The routing wiring formation portion B is formed in the outer portion of the electrode formation portion A and includes a plurality of first routing wiring lines 161 connected to the plurality of first electrode lines 140, And a plurality of second routing wirings 163 each connected to the electrode rows 150. The first and second routing wirings 161 and 163 have a second insulation pattern 133 ).

The pad portion C includes a plurality of first pads 171 connected to the plurality of first electrode lines 140 through a plurality of first routing wirings 161 and a plurality of second routing wirings And a plurality of second pads 173 connected to the plurality of second electrode lines 150 through the plurality of first electrode rows 163.

In the touch screen panel according to the embodiment of the present invention, the ends of the first and second routing wirings 161 and 163 on the electrode forming portion A side at the interface between the electrode forming portion A and the routing wiring forming portion B, The insulating layer is removed. That is, the second insulation pattern 133 is formed so as to expose a portion of the first routing wiring 161 and the second routing wiring 163 (a portion facing the electrode formation portion side). Therefore, the first connection pattern 120 and the first and second routing wirings 161 and 163 are formed on the substrate 100, and an insulating layer is formed thereon. Then, The dry etched gas particles overlie the first insulation pattern 130 and the lower portion of the second insulation pattern 133 and are electrically connected to the first and second electrode patterns 141 and 151 by patterning, Even if the portion D2 is generated, there is no problem because the disconnected first electrode pattern 141a connects the first routing wiring 161 and the first connection pattern 120 as shown in FIG. 5B.

Hereinafter, a method of manufacturing a touch panel of a corrected capacitance type according to an embodiment of the present invention will be described with reference to FIGS. 4 and 6A to 6E. 6A to 6E are cross-sectional views each illustrating a manufacturing process of the touch screen panel shown in FIG. It should be understood that the description of the present embodiment has been given only for the sake of simplicity and avoiding redundancy by exemplifying the relationship between one first electrode row 140 and one first routing wiring 161. [

Referring to FIG. 6A, a first conductive layer is formed on a substrate 100 through a deposition process such as sputtering, and then the first conductive layer is exposed and developed using a photolithography process, A plurality of first connection patterns 120, a first routing wiring 161 and a second routing wiring (not shown) Here, as a material for forming the first conductive layer, a metal material such as Al, AlNd, Mo, MoTi, Cu, CuOx, Cr, or a transparent conductive material such as ITO or IZO is used. The first connection pattern 120 may be formed of any one of Al, AlNd, Mo, MoTi, Cu, CuOx, and Cr. And a second layer formed on the first layer and including any one of ITO and IZO. When the first and second routing wirings 161 and 163 and the first connection pattern 120 are both formed as a single layer, the first and second routing wirings 161 and 163 are formed of Al, AlNd, Mo, MoTi, Cu, CuOx, and Cr. The first connection pattern 120 is preferably formed of a transparent conductive material such as ITO or IZO.

Next, an insulating layer INS is formed on the substrate 100 on which the first connection pattern 120 is formed through a deposition method such as sputtering as shown in FIG. 6B. As the material of the insulating layer INS, an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide is preferable, but an organic insulating material such as photoacryl can also be used.

After the insulating layer INS is formed on the substrate 100, a photolithography process is performed to form a first connection pattern 120 on the electrode formation portion A, as shown in FIG. 6C, The first photoresist pattern PR1 having a width smaller than the length of the connection pattern 120 is formed and a part of the first routing wiring 161 toward the electrode formation portion A is formed in the routing wiring formation portion B, The second photoresist pattern PR2 is formed so as to overlap with the substrate 100 at the other end of the first routing wiring 161 and its periphery so as not to overlap with the region. Then, the insulating layer INS is exposed and developed using the first and second photoresist patterns PR1 and PR2 as masks.

6D, when the insulating layer INS is dry-etched, the insulating layer INS is patterned so that the electrode forming portion A is overlapped with the central portion of the first connection pattern 120, The first wiring pattern forming portion B is formed with a first insulating pattern 130 on which a part of the first routing wiring 161 and a peripheral portion of the first routing wiring 161 are overlapped with each other, The second insulation pattern 133 exposing a part of the first wiring line 161 is formed.

When the first connection pattern 120, the first routing wiring 161, and the first and second insulation patterns 130 and 133 are formed as described above, the substrate 100 on which the first connection pattern 120 and the first insulation pattern 130 are formed is sputtered, The conductive layer is entirely deposited. As the material of the second conductive layer, ITO or IZO may be used. The first and second electrode patterns 141 and 151 and the second electrode pattern connecting portion 153 are formed as shown in FIG. 6E by wet etching the second conductive layer using a photolithography process.

However, in the process of patterning the insulating layer INS by the dry etching method using the etching gas, the conductive metal formed under the insulating layer INS does not react at all to the oxygen plasma used as the etching gas, And moves along the bottom surface of the connection pattern 120 and / or the first routing wiring 161. Since the etching gas particles moved along the bottom surfaces of the first connection pattern 120 and / or the first routing wiring 161 are concentrated on the bottom surfaces of the first and second insulation patterns 130 and 133, The overdrive angle portion D2 is generated in the second insulation patterns 130 and 133 as shown in FIG. 6F. Accordingly, the first electrode pattern 141 can be disconnected in the overexposed portion D2 in the process of depositing the second conductive layer as a subsequent process and patterning the second conductive layer to form the first and second electrode patterns. However, according to the embodiment of the present invention, even if the first electrode pattern 141 is disconnected in the overexposed portion D2 of the first and second insulation patterns 130 and 133, Since the first connection pattern 120 and the first routing wiring 161 are connected to each other, it is possible to prevent the failure of the touch screen panel.

A touch screen panel according to an exemplary embodiment of the present invention includes a liquid crystal display (LCD), a field emission display (FED), a plasma display panel (PDP), an electroluminescent display device Electroluminescence Device, EL), an electrophoretic display device, and the like. In this case, the substrate of the touch screen panel according to the embodiments of the present invention can be used as a substrate of the display device.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

100: substrate 120: first connection pattern
130: first insulation pattern 133: second insulation pattern
140: first electrode row 141: first electrode pattern
150: second electrode row 151: second electrode pattern
153: second electrode pattern connecting portion 161: first routing wiring
163: Second routing wiring

Claims (9)

Board;
A plurality of first electrode lines arranged on the substrate in a first direction and each having a first connection pattern connecting a plurality of first electrode patterns and first electrode patterns adjacent to each other, A plurality of second electrode patterns arranged in parallel in a second direction intersecting the first direction on the substrate and each being disposed on the same layer as the first electrode pattern and the second electrode patterns adjacent to each other, An electrode forming unit including a plurality of second electrode lines having a second connection pattern;
A plurality of first routing wirings formed on the substrate at an outer frame portion of the electrode formation portion and connected to the plurality of first electrode rows and a plurality of second routing wirings connected to the plurality of second electrode rows, A routing wiring portion including two routing wirings;
A plurality of first insulation patterns disposed at positions where the first connection pattern and the second connection pattern overlap each other to insulate the first connection pattern and the second connection pattern;
And a second insulating pattern formed on the plurality of first and second routing wirings to expose a portion of the plurality of first and second routing wirings facing the electrode formation portion side,
The first electrode pattern outermost among the plurality of first electrode patterns extends to the routing wiring portion and is electrically connected to the first routing wiring,
Wherein the first connection pattern is formed on the same layer as the plurality of first and second routing wirings and is disposed separately from each other.
The method according to claim 1,
Wherein the first electrode pattern extending to the routing wiring portion is formed on at least a portion of the exposed portion of the first routing wiring and the second insulation pattern.
3. The method of claim 2,
Wherein at least a portion of the first electrode pattern is formed on a portion of the first connection pattern and a portion of the first insulation pattern.
4. The method according to any one of claims 1 to 3,
Wherein the first and second routing wires include any one of Al, AlNd, Mo, MoTi, Cu, CuOx, and Cr, and the first connection pattern includes a transparent conductive material.
4. The method according to any one of claims 1 to 3,
Wherein the first connection pattern comprises a first layer comprising any one of Al, AlNd, Mo, MoTi, Cu, CuOx, Cr, and a second layer formed on the first layer and comprising a transparent conductive material Wherein the touch screen panel is formed in a multi-layered structure.
delete delete A first process of forming a first conductive layer on a front surface of a substrate and patterning the first conductive layer to form a plurality of first connection patterns separated from each other and a plurality of first and second routing wirings;
Forming an insulating layer on a front surface of the substrate on which the first conductive pattern is formed, forming a first insulating pattern on a central portion of the first connecting pattern, and forming a first insulating pattern on a portion of each of the plurality of first and second routing wires A second step of forming a second insulating pattern formed on the plurality of first and second routing wirings so as to expose the plurality of first routing wirings;
A second conductive layer is formed on the front surface of the substrate on which the first and second insulating patterns are formed and the first conductive patterns are arranged in parallel in the first direction by patterning the second conductive layer, And a plurality of second electrode lines arranged in parallel in a second direction intersecting with the first direction and arranged in the same layer as the first electrode pattern, And a third step of forming a second conductive pattern including a plurality of second electrode lines having electrode patterns and a second connection pattern connecting the adjacent second electrode patterns,
The outermost first electrode pattern among the plurality of first electrode patterns is electrically connected to the first routing wiring,
Wherein the first connection pattern is formed on the same layer as the plurality of first and second routing wirings and is disposed separately from each other and overlaps the second connection pattern with the first insulation pattern interposed therebetween The method comprising the steps of:
9. The method of claim 8,
In the second step,
A first photoresist pattern having a width smaller than a length of the first connection pattern so as to overlap a central portion of the first connection pattern on the insulating layer formed on the substrate; Forming a second photoresist pattern overlapping the first routing wiring; And
Dry etching the insulating layer using the first and second photoresist patterns as a mask to form the first insulation pattern and the second wiring pattern overlapping with the center of the first connection pattern, And forming a second insulation pattern that exposes a portion of the second insulation pattern.

Images