KR101746655B1 - Non-slip plate and method of manufacturing non-slip plate - Google Patents

Abstract

A non-slip plate (1) comprises a base plate (10) and a non-slip portion (20) attached to the surface of the base plate (10) And a laser marking portion 30 formed around the non-slip portion 20 and enhancing the discrimination power of the non-slip portion 20. The non-slip portion 20 is formed by mixing nickel powder with tungsten powder (10) is bonded to a brazing furnace (10) by brazing the brazing furnace (10) to which the non-slip material is adhered, Respectively.
INDUSTRIAL APPLICABILITY The present invention can be applied to a step fan, a step jaw, an elevator threshold, etc. of a vehicle to provide a slip resistant non-slip function, as well as being semi-permanently usable and having high discrimination power.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a non-slip plate,

The present invention relates to a non-slip plate and a method of manufacturing the same, and more particularly, to a non-slip plate having a non-slip function applied to a step fan, a step stitch, an elevator threshold, a manhole cover and the like of a vehicle.

The step fan of the vehicle is installed at the lower part of the door of the vehicle to help the passenger to ride safely in the vehicle. In the case of an SUV, a lorry, a bus, etc., a step fan is provided for safe boarding of the vehicle because it is inconvenient for a passenger to ride on the foot unless the step fan is provided.

However, in the conventional step fan, since the pedestal portion of the occupant climbing up the foot is made of synthetic resin or rubber material and the surface is formed in a lattice-like or diamond-like protruding portion in order to prevent the passenger from slipping, There is a problem that it is difficult to sufficiently prevent the slip.

Also, there is a problem that the stairs jaw, the elevator threshold, the manhole cover, etc. are vulnerable to slip when rain or snow is present.

Accordingly, an object of the present invention is to provide a non-slip function by attaching dissimilar metal particles to a rigid base plate (metal plate) to impart a non-slip characteristic to a step fan, a step jaw, an elevator threshold, The present invention provides a non-slip plate and a method for manufacturing the non-slip plate, which have high manufacturing efficiency and excellent appearance, do not cause wear and peeling problems, and have high discrimination power,

According to an aspect of the present invention for achieving the above object, the present invention provides a non-slip part which is attached to a surface of a mother board and forms a protruding shape on the surface of the mother board, And a laser marking unit for increasing the discrimination power of the non-slip part.

The mother board is made of one selected from the group consisting of stainless steel, iron, copper, brass and alloy steel.

Wherein the non-slip part is formed by bonding a non-slip material diluted in a solvent with nickel powder to tungsten powder, adhering the non-slip material to the plate, brazing the brazing material to which the non-slip material is adhered, As shown in FIG.

The laser marking unit is formed by performing laser marking in a circle shape or semicircle shape surrounding the non-slip part, or in a color to be a company logo shape to be advertised.

A non-slip material preparation step of preparing a non-slip material, a step of bonding the non-slip material to the bonding surface of the base material plate to form a protruding shape A brazing step of putting a brazing material to which the non-slip material has been adhered, into a brazing furnace and brazing the brazing furnace; and a step of performing laser marking around the non-slipping part.

The mother board is made of one selected from the group consisting of stainless steel, iron, copper, brass and alloy steel.

The non-slip material is a mixture of 95 to 97 wt% of tungsten powder and 3 to 5 wt% of nickel powder and diluted in a solvent.

The brazing step includes a first step of firstly baking at a temperature of 500 to 700 ° C in a brazing furnace in a reducing gas atmosphere and a second step of raising the temperature of the brazing furnace to 900 to 1350 ° C .

The reducing gas is hydrogen gas.

The brazing has a dew point of -55 占 폚 or less.

The present invention is excellent in adhesion of a base plate and a non-slip material, has excellent abrasion resistance, and is excellent in a slip prevention function. Therefore, it is possible to provide a slip resistant non-slip function applied to a vehicle and a facility requiring slip prevention (e.g., a stair tuck, an elevator threshold, a manhole cover), and can be used semi-permanently.

Particularly, the present invention performs reduction in a hydrogen gas atmosphere at a dew point of -55 ° C or less in the brazing process, so that the adhesion force between the mother board and the non-slip material is further increased and the foreign substances such as oxides are completely removed during the brazing process. It is possible to manufacture a non-slip plate having an excellent appearance while having a good appearance.

In addition, since the tungsten powder of the present invention can recycle the tungsten powder that has been discarded in the past, it is possible to reduce the cost in manufacturing the non-slip plate.

In addition, the present invention has an effect that laser marking is performed around the non-slip portion to increase the discrimination power and can be applied to a company advertisement.

1 is a view showing a non-slip plate according to an embodiment of the present invention.
2 is a process diagram showing a method of manufacturing a non-slip plate according to an embodiment of the present invention.
FIG. 3 and FIG. 4 are photographs showing the bonding surfaces of the base plate and the non-slip material of the present invention.
5 is a view showing a state where an embodiment of the present invention is applied to a step fan of an automobile.
6 is a view showing a state where an embodiment of the present invention is applied to a subway drainage lid.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As shown in Fig. 1, the non-slip plate of the present invention comprises a non-slip portion 20 attached to a surface of a base plate 10 and a base plate 10 to form a protruding shape and providing a non-slip function, And a laser marking unit 30 formed around the non-slip part 20 so as to increase discrimination power of the non-slip part 20. [

The mother board (10) is made of one selected from stainless steel, iron, copper, brass and alloy steel. Preferably, the mother board 10 becomes SUS304.

The non-slip portion 20 is formed by attaching a non-slip material, which is a mixture of tungsten powder and metal powder, to the mother board 10.

The metal powder includes at least one selected from silver, copper, zinc, cadmium, phosphorus, nickel, manganese, tin, indium, gold, silicon, paradigm and lithium. Preferably, the metal powder is a nickel powder.

More preferably, the non-slip portion 20 is formed by mixing 95 to 97% by weight of tungsten powder and 3 to 5% by weight of nickel powder, bonding the non-slip material diluted in the solvent to the mother board 10, And is firmly attached to the surface of the mother board 10 through a brazing process in which the mother board is brazed and inserted into the brazing furnace.

The laser marking unit 30 is formed by performing laser marking in a circle shape or semicircle shape surrounding the non-slip portion 20, or in a color to be a logo of a company to be advertised.

The non-slip plate 1 may be applied to a step fan of a vehicle, a step jaw, an elevator threshold, a manhole cover, and the like.

As shown in FIG. 2, the non-slip plate manufacturing method includes the steps of preparing a blank plate, preparing a blank, preparing a blank, preparing a non-slip material (S10) (S30) of bonding a non-slip material to the bonding surface of the base plate to form a protrusion shape; a brazing step (S40) of brazing the base plate to which the non-slip material is adhered after the bonding step into the brazing furnace; And performing laser marking around the non-slip part (S50).

The mother plate preparation step (S10) is to design the mother plate to be suitable for brazing. The most important element of brazing is the capillary action. The joint surface is designed to use this capillary phenomenon most efficiently.

The design of the joint surface is to set the shape of joining the non-slip material to the mother board, the joint spacing, and so on. When designing the joint spacing, the joint spacing is designed considering the thermal expansion coefficient of the mother board or non-slip material at the brazing temperature, since the thermal expansion coefficients are different for different metals.

The joint design can use a laser.

The mother board is made of one material selected from stainless steel, iron, copper, brass and alloy steel. Preferably, SUS304 is used as the base plate.

SUS304 has a chemical composition of 18Cr-8Ni and has excellent processability, so it is easy to manufacture with a design required by a consumer, and it is easy to upgrade the appearance of a product by marking a text or a letter with a laser.

In addition, SUS304 is easy to mass-produce with low cost and has excellent corrosion resistance and oxidation resistance, so it does not rust and has high temperature strength and low temperature strength. The melting point of SUS304 is 1400 ~ 1450 ℃.

Cleaning is to clean the mother board. The capillary phenomenon occurs well when the mother board is clean. If oil, grease, rust, scale, paint residues, physical residues (dust, foreign material), etc. are present in the mother board, bonding of mother board and non-slip material is not smooth.

Therefore, the factors that impede the wettability, fluidity, and diffusion of the mother board and non-slip material should be removed from the mother board. When these factors remain on the mother board, the flow of the non-slip material is disturbed or the bubbles are formed to lower the bonding strength between the mother board and the non-slip material.

Washing may be carried out by a method selected from the group consisting of alkali washing, solvent washing, cleaner washing, acid pickling, ultrasonic washing and high-speed water spraying, or a combination of two or more methods .

Basically, since the metal surface is combined with oxygen in air to form an oxide layer, it is preferable to use two or more cleaning methods in combination to remove complicated impurities such as scales and physical residues, rather than using one cleaning method.

The surface treatment of the mother board may be mechanical polishing.

The non-slip material preparation step S20 is to prepare a material for imparting non-slip characteristics by attaching to a mother board.

The non-slip material is a mixture of tungsten powder with one or more metal powders selected from silver, copper, zinc, cadmium, phosphorus, nickel, manganese, tin, indium, gold, silicon, paradigm and lithium and a solvent.

Tungsten (W) has a high hardness and tungsten microparticles keep a strong non-slip function and can be used semi-permanently.

Silver (Ag) is not as strong as silver itself, but has strong strength when combined with other elements. Further, since the silver alloy has a strong penetrating power when melting, a strong bonding surface can be obtained. Therefore, silver can lower the melting point during brazing and improve the wettability and workability.

Copper (Cu) has many advantages such as ductility, thermal conductivity, conductivity, corrosion resistance, strong penetration power, but it is relatively cheap compared to silver and can be used as a substitute for silver.

Also, unlike silver, copper is compatible with iron, nickel, and many hardly soluble alloys. Also, when copper and silver are combined in a weight ratio of 28:27, they form a 780 ° C. process alloy and have stronger properties than copper or silver and have ductility and good penetration.

Zinc (Zn) is a useful metal in brazing due to its low melting point, and it has the advantage of improving wettability and low cost. However, zinc is excessively fragile and has a low vaporization point, so that the zinc-containing metal is destroyed when it is heated for a long time or heated at a high temperature.

Cadmium (Cd), like zinc, has a low melting point and good wettability. Cadmium also has better corrosion resistance than zinc and improves the flow of silver alloy at low temperatures. However, cadmium has vulnerability and low vaporization point, it is higher than zinc, and oxides are toxic. Therefore, when brazing non-slip materials containing cadmium, ventilation should be good.

Phosphorus (P) is a highly active substance, and there are two main reasons for its formation. One markedly drops the liquid line and the other is due to high chemical activity. Phosphorus acts as an oxidizing agent that consumes oxygen, which can be identified by a strong, thin, thin film on the melting surface when phosphorus is melted. An alloy of 92.8 wt% Cu / 7.2 wt% P has a high tensile strength, but the ductility is deteriorated and silver can be added to reinforce the rigidity and brittleness.

Nickel (Ni) imparts rigidity and toughness to the silver alloy. It also improves wettability and improves corrosion resistance in areas where it is difficult to melt, such as carbide. Nickel-containing alloys inhibit corrosion at the brazing interface during the brazing of stainless steel. Nickel, however, has a high melting point (1453 ° C) and tends to make the alloy flow for brazing less active. This can be effectively used where the brazing interval is large.

When manganese (Mn) is alloyed with a high melting point metal or a ratio of 85 wt% Ag / 15 wt% Mn, the melting point is lowered to about 959 캜. Manganese contributes to the formation of strong and ductile joints and improves the wettability of stainless steel, other nickel and chromium alloys. Alloys containing manganese remain intact even at high temperatures.

Tin (Sn) has a very low melting point and is therefore contained to lower the melting point of the alloy. Tin also improves flowability, wettability, penetration, and the like.

Indium (In) lowers the melting point of the alloy and improves flowability during brazing.

Gold (Au) enhances the color after brazing and improves the corrosion resistance.

Silicon (Si) lowers the melting point and prevents the vaporization of zinc.

Pd (Pd) has excellent wettability to nickel alloy and minimizes intergranular erosion of the mother board.

Lithium (Li) has good bonding property to stainless steel and the like by deoxidizing action.

Of these, the non-slip material is preferably prepared by mixing 95 to 97% by weight of tungsten powder and 3 to 5% by weight of nickel powder and diluting with water in a solvent.

The tungsten powder is the main component of the non-slip material, and the nickel powder is included to enhance the adhesion affinity between the tungsten powder and the base plate. Nickel powder and one or more metal powders selected from silver, copper, zinc, cadmium, phosphorus, manganese, tin, indium, gold, silicon, paradigm and lithium described above.

The alloy of tungsten powder and nickel powder has high hardness and good wettability with the mother board (SUS304). The melting point of tungsten powder is 3422 캜 and the melting point of nickel is 1453 캜, which is stable without decomposition upon brazing. Tungsten powder has affinity with nickel powder and alloys.

If the amount of the tungsten powder is less than 95 wt%, the relative nickel content increases and the flowability of the alloy for brazing becomes insufficient. When the tungsten powder exceeds 97 wt%, the relative nickel powder content decreases, Is not easily adhered.

The nickel powder should be contained in an amount of 3 wt% or more to improve the adhesion between the non-slip material and the mother board during brazing, and to suppress corrosion on the brazing interface at the time of brazing. On the other hand, when the nickel powder is contained in an amount exceeding 5 wt%, the flowability of the non-slip material is not active. Since the flowability of the non-slip material is related to the appearance of the non-slip plate, the flowability of the non-slip material is deteriorated, it is impossible to produce a non-slip plate having an excellent appearance.

In order to improve the appearance of the non-slip plate, the particle size of the tungsten powder and the nickel powder is preferably 10 탆 or less.

Non-slip material is diluted with water as a solvent, and the amount is not specified.

The bonding step (S30) is a step of bonding the non-slip material to the mother board.

The non-slip material is adhered to the joint surface of the mother board by applying or immersing with a brush or a brush, or by an automatic application method to form a protruding shape on the mother board. Since the dilution ratio of the non-slip material varies depending on the application or immersion using a brush or brush, and the automatic application method, the amount of the solvent for dilution, that is, the amount of water, is not specifically defined.

In addition to water, other components such as binders and fluxes may be used as the solvent.

It is possible to treat the metal oxide with the non-slip material although the shape and characteristics of the oxide formed by the brazing at the time of brazing differ greatly.

Copper, brass, and silver, for example, are relatively easily removed oxides and are highly resistant to local overheating due to high thermal conductivity. In addition, copper, brass, and silver can minimize oxide formation using relatively low temperature alloy non-slip materials. In this case, the concentration of the non-slip material to be diluted by the solvent can be used relatively low.

Bronze containing a small amount of aluminum, beryllium, silicon, and titanium contains strong and stable oxides, so strong solvents are required. Alloy steels containing chromium, vanadium and manganese are rapidly oxidized. Therefore, stronger solvents are required for safer stainless steels containing high chromium.

After bonding non-slip material to the mother board, dry it naturally.

Since most of the oxides are formed slowly from room temperature to about 537 ° C, the heating time does not greatly affect oxide formation. Therefore, it is also possible to dry by heating gradually in the above temperature range.

At this time, the moisture in the non-slip material escapes and the non-slip material swells up, so that the oxide rapidly increases on the surface to be brazed, so it is preferable to heat slowly or indirectly. Indirect heating is heating while avoiding the side to which the non-slip material is bonded.

During induction heating, non-slip material and base plate are metal, so they are fast to heat. However, in case of solvent, it maintains several hundreds lower temperature than non-slip material and base plate. Thus, the solvent may boil and cause pores in the non-slip material. If this happens, it is important to lower the power, increase the heating time, or use the minimum amount of solvent.

The brazing step (S40) is for firmly attaching the non-slip material to the mother board by putting the mother board to which the non-slip material is adhered into the furnace brazing process.

Tungsten powder, which is the main component of stainless steel and non-slip material, is a high-temperature alloy and does not adhere well to each other.

In particular, SUS304 is 18Cr-8Ni, which has a high Cr content, making it difficult to adhere to tungsten powder. Since Cr has a strong oxygen affinity to make Cr oxide and Cr is stable, it is difficult to attach SUS304 and non-slip material when Cr oxide is formed.

In order to increase the adhesion of stainless steel and tungsten powder during the brazing process, nickel is contained in the non-slip material, hydrogen gas is used as the reducing gas in the brazing process, and the dew point in brazing is controlled to be below -55 ° C.

The tungsten powder is a substantial non-slip material, and the nickel powder is included to enhance the affinity of the chromium contained in the tungsten powder and the stainless steel by suppressing the corrosion at the joint interface at the time of brazing of the stainless steel.

Specifically, the brazing step includes a first step of firstly firing at a temperature of 500 to 700 ° C in a brazing furnace in a reducing gas atmosphere, and a second step of raising the temperature of the brazing to 900 to 1350 ° C to carry out second firing do.

When the mother board to which the non-slip material is adhered is put into the brazing furnace and the first sintering is performed at a temperature of 500 to 700 ° C in a reducing gas atmosphere, the solvent is decomposed and burned to be removed, the grain boundary corrosion of the mother board is prevented, Secondary firing at a temperature of 1350 ° C results in firm adhesion of the mother board and non-slip material.

Chromium, and tungsten are easily oxidized elements, so surface contaminants such as oxide films and remnants of lubricants formed during the manufacturing process are removed by pyrolysis or reduction reaction during the first firing.

If the primary firing temperature is less than 500 ° C, the solvent and the oxide film are not removed. If the primary firing temperature exceeds 700 ° C, defects such as blistering due to residual solvent may occur. If the first sintering process is omitted and only secondary sintering is performed, the adhesion strength between the mother board and the non-slip material may be weakened due to swelling between the mother board and the non-slip material.

If the secondary sintering temperature is less than 900 ° C, the non-slip material having a high melting point remains in a state in which the non-slip material is not melted and it is difficult to firmly adhere the mother board and the non-slip material.

The first firing time is about 5 to 10 minutes, and the second firing time is about 5 to 20 minutes. If the primary firing time is less than 5 minutes, it is difficult to secure the desired effect, and if it exceeds 10 minutes, the effect is saturated. If the secondary baking time is less than 5 minutes, it is difficult to secure the desired effect. If the baking time exceeds 20 minutes, the effect is saturated and cracks may occur in the mother board.

During the brazing process, the reducing gas is hydrogen gas. The hydrogen gas is 76% or more and 100% or less of the total amount of the reducing gas.

If the hydrogen gas is less than 76%, the reduction reaction is not smooth due to the lack of hydrogen which is the main medium of reduction.

The tungsten powder can be reduced and sintered in a hydrogen gas atmosphere. Ammonia gas may be used as a reducing gas, but it is difficult to reduce ammonia gas itself, and when ammonia gas is used, it is difficult to convert ammonia gas into hydrogen gas, and a separate process for converting ammonia gas into hydrogen gas must be added The brazing process becomes complicated.

Hydrogen penetrates into the joint surface between the mother board and the non-slip material and burns the solvent, resulting in CO ₂ and H ₂ O. The hydrogen contained in the solvent contains minerals including -OH or crystal water, water containing the fixing agent, moisture adsorbed on the solvent, Only the non-slip material is melted while burning moisture and oils adhering to the surface.

In the process, wetting phenomenon and capillary phenomenon occur between the mother board and the non-slip material, penetration and spreading occur, and adhesion of the mother board and non-slip material is firmly established.

The brazing process does not melt the mother board but microscopically generates intermetallic compounds at the interface of the joint by the reaction between the mother board and the molten non-slip material, or causes a complicated reaction similar to the dissolution phenomenon of the mother board to harden the mother board and non- .

When an affinity between a metal and a metal is large, an intermetallic compound is formed by combining two or more kinds of metal elements with a simple atomic ratio to form an independent compound having properties different from those of the constituent metals, and generally expressed by the formula of AmBn.

For example, Cr in stainless steel reacts with Ni in non-slip material to form Cr-Ni intermetallic compound, or Cr in stainless steel reacts with W in non-slip material to form Cr-W intermetallic compound. W generates Cr and an intermetallic compound due to a property of going to a stable state in a reducing atmosphere.

Specifically, nickel having a corrosion resistance and a reducing atmosphere preventing the formation of Cr oxide and reducing tungsten interact to generate a Cr-W intermetallic compound and a Cr-Ni intermetallic compound at the interface between the stainless steel and the non-slip material It causes a complicated reaction similar to the dissolution phenomenon of stainless steel so that stainless steel and non-slip material are firmly attached.

The dew point is below -55 캜. When the firing is carried out in a hydrogen gas atmosphere having a dew point of -55 ° C or less, adhesion strength between the mother board and the non-slip material is improved.

When the dew point is maintained below -55 ° C in a hydrogen gas atmosphere, the melting point of tungsten is lowered, and nickel, which has high affinity with stainless steel, acts as a catalyst to react with chromium and tungsten to prevent the formation of Cr oxides. Cr-Ni-based intermetallic compound is formed, and Cr oxides can also be removed.

A dew point is a measure of humidity, although at that temperature it is given as a temperature value, which means that the atmosphere is capable of saturation equilibrium.

It is particularly important that the present embodiment has conditions of not less than 76% of hydrogen gas and not more than -55 占 폚 of hydrogen gas in the brazing process, which prevents hydrogen from contacting the metal surface during the brazing process, This is because the oxide film formed on the metal surface is removed by reduction by the reaction represented by the following formula (1).

The hydrogen gas content is very important because the removal of the oxide film on the metal surface is a reversible reaction, and the hydrogen gas content should be 76% or more to maintain the reducing atmosphere. Hydrogen gas must use pure hydrogen, and when using decomposed hydrogen using ammonia or the like, a desired dew point can not be secured.

≪ Chemical Formula 1 >: Metal Oxide + H ₂ ↔ Metal + H ₂ O

More specifically, the dew point is intended to increase the metal binding force. At dew point below -55 ℃, the amount of oxygen aggregation is reduced to reduce the oxidation reaction and lower the melting point to further increase the metal binding force. The lower the dew point is under the condition of -55 ° C or less, the easier it is to reduce the oxidation reaction.

The reaction rate of hydrogen and water in the formula (1) and the formula (2) below is as follows. When more water is added, the reaction to the left (metal oxide formation) Is reduced, pure metal formation is performed).

≪ Formula 2 > 2H ₂ O + O ₂ ↔ H ₂ O

Therefore, maintaining the dew point below -55 캜 causes the atmosphere in the furnace to have a lowered water vapor and more reducing atmosphere, thereby forming a pure metal, thereby increasing the metal binding force.

By the above-described principle, foreign substances such as oxides can be completely removed by the reduction reaction in the brazing process, and a bright step fan having a slip prevention function can be manufactured with a beautiful appearance.

In addition, since the brazing process is a hydrogen gas atmosphere, it is possible to conduct hydrogen continuously and mass production is possible.

2, the step fan 1 manufactured by the above-described method is attached to the surface of a mother board 10 made of stainless steel (for example, SUS304) and a mother board 10 to provide a non-slip function And a non-slip portion 20 made of a tungsten-nickel alloy.

The thickness of the mother board is preferably in the range of 1 to 10 mm, and the thickness of the non-slip part is preferably in the range of 1 to 5 mm.

The bonding surface 25 of the mother board 10 and the non-slip portion 20 is excellent in adhesion strength because the non-slip material is melted and sintered in the brazing process and adhered to the mother board 10.

Further, tungsten attached to the mother board 10 is an ultra-hard powder having excellent abrasion resistance and excellent slip prevention function.

Hereinafter, the present invention will be described in comparison with a comparative example. It is to be understood, however, that the present invention is not limited to the embodiments described below.

The brazing process was firstly baked in a brazing furnace in a reducing gas atmosphere at a temperature of 600 DEG C for 10 minutes, and the temperature of the brazing furnace was increased to 1300 DEG C for secondary baking for 20 minutes.

The non - slip material was automatically applied to the base plate, dried at room temperature, and water was used as the solvent.

Tungsten powder and nickel powder having particle sizes of less than 10 mu m were used.

Remarks
Mother trial
Non-slip material dew point
(° C) Reducing gas Attachment
Tungsten powder
(wt%) Nickel powder
(wt%) Hydrogen gas Ammonia gas Inventory 1 SUS304 95 5 -55 76 0 Robust Inventory 2 SUS304 97 3 -56 80 0 Robust Comparative Example 1 SUS304 94 6 -55 76 0 detach Comparative Example 2 SUS304 98 2 -55 76 0 detach Comparative Example 3 SUS304 95 5 -55 0 76 detach Comparative Example 4 SUS304 95 5 -55 75 0 Part
detach Comparative Example 5 SUS304 95 5 -54 76 0 Part
detach

According to Table 1, a non-slip material comprising a mixture of 95 to 97 wt% of tungsten powder and 3 to 5 wt% of nickel powder was attached to a base plate and brazing was performed at a dew point of -55 DEG C or less and hydrogen gas of 76% In the case of Inventive Example 2, adhesion was excellent.

On the other hand, in Comparative Example 2 where the nickel powder content was less than 3 wt% and Comparative Example 1 where the nickel powder content was more than 5 wt%, the adhesion was poor.

In Comparative Example 3, the non-slip material was not adhered to the substrate using ammonia gas as the reducing gas. In the ammonia gas atmosphere, the reduction reaction did not occur and the tungsten powder was not sintered.

In the case of Comparative Example 4, it was confirmed that the reduction reaction was insufficient because the hydrogen gas was less than 76%, so that the sintering was not smooth and the partial separation occurred in a part.

In the case of Comparative Example 5, the tungsten and nickel powders were partially unmelted at a second firing temperature of more than -55 ° C. at the dew point, so that the melt adhesion of the non-slip material to the base plate was insufficient. It was confirmed that the effect of lowering the melting point of the tungsten powder at a dew point exceeding -55 캜 was low.

Fig. 3 and Fig. 4 are photographs of a joint surface (inventive example 1) of the mother board and the non-slip material of the present invention.

3, it can be seen that the base plate and the non-slip material are firmly attached to one body. In FIG. 4, which is further enlarged, the base plate is not melted and the non-slip material is melted and sintered, It can be confirmed that it is firmly attached to the mother board.

When the tungsten powder, which is a super hard metal, is attached to the stainless steel base plate through the comparative example and the examples, 3 to 5 wt% of nickel powder is mixed with the tungsten powder to improve the adhesion affinity with stainless steel. It is understood that the adhesion of stainless steel and tungsten powder can be increased by satisfying the condition of hydrogen gas of 76% or more and lowering the melting point of tungsten and sufficiently providing reduction conditions.

As shown in FIG. 5, the non-slip plate 1 manufactured by the above-described method may be installed at a lower portion of a door of the vehicle, and may serve as a step fan to help the passenger to ride safely in the vehicle.

In addition, the above-described non-slip plate 1 can be applied to a subway drain cover, as shown in FIG. 6, to perform a slip prevention function.

The non-slip plate 1 applied to the subway drainage lid has a color similar to that of the mother slab 10 and the non-slip portion 20 because the non-slip portion 20 is manufactured by attaching tungsten powder to the stainless steel base plate 10, .

Therefore, a step (S50) of performing laser marking around the non-slip portion 30 is performed. In the step (S50) of performing laser marking, the laser marking section 30 is formed around the non-slip section 20.

The laser marking unit 30 performs laser marking with a color in a circle shape, semicircle shape or a company logo shape to be wrapped around the non-slip part 20 in the mother plate 10 so that the identification of the non-slip part 20 . In this case, the discrimination power of the non-slip portion 20 is high and can be used for company advertising purposes.

Further, the non-slip plate 1 may be attached to a step jaw, an elevator threshold, a manhole cover, or the like to perform a slip prevention function when it comes to rain or snow.

As described above, according to the present invention, the base plate is made of stainless steel, preferably SUS304, and the non-slip material is made of 95 to 97 wt% of tungsten, 3 to 5 wt% of nickel powder for three purposes of adhesion, By weight, and diluted in a solvent. The brazing furnace is to include a condition that hydrogen gas is 76% or more and the dew point is -55 ° C or less.

The non-slip plate manufactured by the above-described method can be applied to a step fan, a step jaw, an elevator threshold, etc. of a vehicle to provide a non-slip function that is not slippery, an advantage that can be applied semi-permanently, .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the above teachings. will be.

1: non-slip plate 10:
20: non-slip portion 25:
30: laser marking unit

Claims (10)

delete delete delete delete A mother plate preparation process for preparing a mother plate, designing a bonding surface, cleaning and surface treatment,
A non-slip material preparation step of preparing a non-slip material,
An adhering step of adhering the non-slip material to the joint surface of the mother board to form a projecting shape;
A brazing step of putting the brazing material to which the non-slip material is adhered in a brazing furnace and brazing the brazing furnace after the bonding step;
And performing color laser marking around the non-slip material,
The base plate is made of stainless steel,
The non-slip material comprises 95 to 97 wt% tungsten powder and
3 to 5% by weight of nickel powder are mixed and diluted with a solvent,
The brazing process
A first step of firstly calcining the brazing furnace at a temperature of 500 to 700 占 폚 in a brazing furnace in a reducing gas atmosphere and a second step of raising the temperature of the brazing furnace to 900 to 1350 占 폚,
The reducing gas is hydrogen gas, the hydrogen gas is 76% or more,
Wherein the brazing has a dew point of not more than -55 占 폚. A method for producing a non-slip plate according to claim 5,
Mother trial;
A non-slip portion attached to a surface of the mother board to form a protruding shape, and made of a non-slip material to provide a non-slip function; And
And a laser marking unit formed around the non-slip part to increase the discrimination power of the non-slip part,
Wherein the laser marking unit is formed by performing laser marking in a circle shape or semicircle shape that surrounds the non-slip portion or in a color of a company logo to be advertised. delete delete delete delete

Images