KR101732813B1 - Manufacturing method for led array - Google Patents

Manufacturing method for led array Download PDF

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Publication number
KR101732813B1
KR101732813B1 KR1020150152402A KR20150152402A KR101732813B1 KR 101732813 B1 KR101732813 B1 KR 101732813B1 KR 1020150152402 A KR1020150152402 A KR 1020150152402A KR 20150152402 A KR20150152402 A KR 20150152402A KR 101732813 B1 KR101732813 B1 KR 101732813B1
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KR
South Korea
Prior art keywords
light emitting
emitting diode
unit
printed circuit
circuit board
Prior art date
Application number
KR1020150152402A
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Korean (ko)
Inventor
강인목
Original Assignee
희성전자 주식회사
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Priority to KR1020150152402A priority Critical patent/KR101732813B1/en
Application granted granted Critical
Publication of KR101732813B1 publication Critical patent/KR101732813B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Abstract

The present invention relates to a manufacturing method for a light emitting diode (LED) array, capable of manufacturing an LED array which is a light source device of a backlight unit in a thin type and mass producing the LED array by simplifying a manufacturing process. According to an embodiment of the present invention, a unit area is formed as multiple holes in which at least a part of the inside is filled with a conductive matter are electrically connected by a circuit pattern. A printed circuit board in which the unit areas are repetitively arranged is prepared. Also, unit substrates are formed as the multiple holes included in the unit area are penetrated and the printed circuit board is cut. The unit substrates are piled in order for a cutting unit of the hole to face a same side. After the cutting unit of the hole and an LED chip are shouldered to be electrically connected, the unit substrates piled are separated from each other. According to the present invention, the manufacturing method for an LED array can form the LED array to be thin as much as the printed circuit board as the LED chip is mounted on a cutting surface of the printed circuit board. The LED array is mass produced at low costs by using a method of cutting the printed circuit board at same time and mounting the LED chip at the same time. So, the manufacturing method for an LED array can improve a competitive price of a product using the LED array as the light source device.

Description

TECHNICAL FIELD [0001] The present invention relates to a manufacturing method of a light emitting diode array,

The present invention relates to a method of manufacturing a light emitting diode array, and more particularly, to a method of manufacturing a light emitting diode array in which a light source device of a backlight unit is made thinner and a manufacturing process is simplified to mass production.

The liquid crystal display device includes a liquid crystal display (LCD) panel. Since the liquid crystal display panel itself can not emit light, a backlight unit for supplying light behind the display panel is required.

Edge type backlight units are mainly used for liquid crystal display devices such as notebook PCs and monitor PCs where thickness is important. Due to the trend toward miniaturization and light weight of electronic components, demands for a thinner backlight unit Is increasing.

In general, a light emitting diode package (LED PKG) is used as the light source device of the backlight unit. 1 is a perspective view of a conventional light emitting diode package.

The conventional light emitting diode package 10 includes a light emitting diode chip, a lead frame 11, a groove 12, and a wire 13.

The lead frame 11 is a covering material surrounding the light emitting diode chip, and is a structure used for connecting the light emitting diode chip to a printed circuit board (not shown) or the like.

Referring to FIG. 1, the lead frame 11 is formed with a groove 12 in which a light emitting diode chip is mounted, and the groove 12 is filled with an encapsulant for protecting the light emitting diode chip. The light emitting diode chip and the printed circuit board are electrically connected through the wire (13). Further, the conventional light emitting diode package 10 having such a structure is directly bonded to the printed circuit board by an adhesive or the like.

Therefore, in the conventional LED package 10, due to the thickness of the lead frame 11 itself, the area of the surface on which the LED package is adhered to the printed circuit board, the bonding space of the wire 13 connected to the LED chip, There is a limit to miniaturization. Furthermore, the backlight unit including such a conventional light emitting diode package 10 also has a limitation in reducing its thickness.

On the other hand, Korean Patent Registration No. 10-1037507 discloses a manufacturing method capable of mass-producing a light emitting diode package using a molding method. In this manufacturing method, several light emitting diode chips are collectively arranged on a PCB, the LED chips are arrayed by a transfer molding method, and a plurality of LED packages arranged are separated into individual light emitting diode packages Thereby manufacturing a light emitting diode package.

1, the light emitting diode package has a merit that it can be made thinner than a conventional light emitting diode package including a lead frame and can be mass-produced. However, like the conventional light emitting diode package, A space to be molded, a wire to be connected to the light emitting diode chip, and a space to which the wire is bonded. Accordingly, the light emitting diode package manufactured by the manufacturing method disclosed in Patent Registration No. 10-1037507 also has a limitation in reducing its thickness.

1. Korean Patent No. 10-1037507 (entitled " Light Emitting Diode Package, Light Emitting Diode Array and Backlight Unit Using It)

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a light emitting diode chip, which is mounted on a cut surface of a printed circuit board to realize a light emitting diode array as thin as a thickness of a printed circuit board, The present invention provides a method of manufacturing a light emitting diode array capable of mass-producing a light emitting diode array at a low cost through a method of collectively mounting a light emitting diode chip on a printed circuit board.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a method of manufacturing a light emitting diode array, the method comprising: forming a unit region by electrically connecting a plurality of holes filled with a conductive material, A printed circuit board on which the unit areas are repeatedly arranged is prepared. The plurality of holes included in the unit area are passed through and the printed circuit board is cut to form unit substrates, and the unit substrates are stacked such that the cut parts of the holes are directed in the same direction. The LED chip is electrically connected to the cut portion of the hole, and then the laminated unit substrates are separated from each other.

According to another aspect of the present invention, in the soldering step, the light emitting diode chip is soldered to a cut portion of the hole in a flip-chip manner.

According to another aspect of the present invention, a reflector is further formed around the light emitting diode chip.

According to still another aspect of the present invention, before the step of soldering, the step of bonding the unit substrates is further included.

According to the method for manufacturing a light emitting diode array of the present invention, the light emitting diode chip can be mounted on the cut surface of the printed circuit board to realize the light emitting diode array as thin as the thickness of the printed circuit board. Furthermore, by mass-producing the light emitting diode arrays at a low cost through a method of collectively mounting the light emitting diode chips on a printed circuit board, it is possible to increase the price competitiveness of the products using such light emitting diode arrays as light source devices.

1 is a perspective view of a conventional light emitting diode package.
2 is a flowchart illustrating a method of manufacturing a light emitting diode array according to an embodiment of the present invention.
Fig. 3 is a perspective view showing a state in which each step of the manufacturing method of Fig. 2 is completed. Fig.
4 is a schematic perspective view of a light emitting diode array completed by the manufacturing method of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

It is to be understood that elements or layers are referred to as being "on " other elements or layers, including both intervening layers or other elements directly on or in between.

Although the first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical scope of the present invention.

Like reference numerals refer to like elements throughout the specification.

The sizes and thicknesses of the individual components shown in the figures are shown for convenience of explanation and the present invention is not necessarily limited to the size and thickness of the components shown.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other partially or entirely and technically various interlocking and driving is possible as will be appreciated by those skilled in the art, It may be possible to cooperate with each other in association.

Hereinafter, a method for fabricating a light emitting diode array according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a flowchart illustrating a method of manufacturing a light emitting diode array according to an embodiment of the present invention, FIG. 3 is a perspective view illustrating a state in which each step of the manufacturing method of FIG. 2 is completed, FIG. 1 is a schematic perspective view of a light emitting diode array completed by a method of manufacturing a light emitting diode according to a first embodiment of the present invention.

2 and 3, a method of manufacturing a light emitting diode array according to an embodiment of the present invention will be described.

The manufacturing method according to an embodiment of the present invention includes a step S10 of preparing a printed circuit board 100 in which unit areas 100A are repeatedly arranged, a plurality of holes 110 included in the unit area 100A, A step S30 of stacking the unit substrates 100B so as to face in the same direction, a step of cutting the holes 112 of the holes, A step S40 of soldering the LED chip 200 so that the LED chips 200 are electrically connected to each other and a step S50 of separating the stacked unit substrates 100B from each other.

First, as shown in FIG. 3A, a printed circuit board 100 in which unit areas 100A are repeatedly arranged is prepared (S10).

The printed circuit board 100 is formed by repeatedly arranging the unit area 100A and the unit area 100A includes a plurality of holes 110, a circuit pattern 120 connecting the holes 110, 130).

The printed circuit board 100 may be in the form of a thin plate, and may be formed of a metal material, a polymer material, a resin material, a ceramic material, a silicon material, or the like. In addition, the shape and material of the printed circuit board 100 are not limited to the above-described shapes and materials, and may be any shapes and materials known to those skilled in the art.

The unit area 100A includes at least two or more holes 110 and the holes 110 included in the unit area 100A are connected by the circuit pattern 120. [ Electrodes 130 are positioned at both ends of the circuit pattern 120 connecting the holes 110.

The hole 110 is a structure in which the printed circuit board 100 is penetrated. In FIG. 3 (a), the cross section of the hole 110 is represented by a circle, but this is an example. As will be described later, if the anode and cathode of the light emitting diode chip 200 can be respectively soldered to the cut portions 112 of the holes separated by a predetermined width, the shape of the cross section of the holes 110 may be formed to be unlimited have.

Meanwhile, the holes 110 may be formed on the printed circuit board 100 by a mechanical method such as a drill, a punching method, or a chemical etching method.

The interior 111 of the hole is at least partially filled with a conductive material such as a metal. The conductive material may be a conductive material including silver (Ag) or copper (Cu), but is not limited thereto and may be any conductive material known to those skilled in the art. The conductive material filled in the inside 111 of the hole is electrically connected to the circuit pattern 120 and the circuit pattern 120 formed at both ends of the circuit pattern 120 in a step S40 in which the light emitting diode chip 200 is soldered to the cut- The electrode 130, and the LED chip 200 electrically.

The circuit pattern 120 is a conductor line that electrically connects the adjacent holes 110 on the printed circuit board 100. The manufacturing method according to an embodiment of the present invention is for manufacturing the thin type LED array 300, and the circuit pattern 120 is preferably formed flat on the printed circuit board 100.

The holes 110 included in the unit area 100A and the circuit patterns 120 connecting the holes 110 are formed in the plurality of holes 110 in the step S20 of cutting the printed circuit board 100, Are arranged in a line so as to be cut in a lump.

The holes 110 and the circuit patterns 120 connecting the holes 110 may be formed on the printed circuit board 100 having a large area in a plurality of rows and a plurality of rows, The manufacturing process, the manufacturing facility, the manufacturing cost, and the like of the semiconductor device 300 according to the present invention.

The electrode 130 is preferably formed at both ends of the unit area 100A. However, if the electrode 130 is included in the unit area 100A, the shape and arrangement of the electrode 130 is not particularly limited. Can be formed in a known manner.

The electrode 130 is electrically connected to the circuit pattern 120, the cut portion 112 of the hole, and the light emitting diode chip 200 in the step S40 in which the light emitting diode chip 200 is soldered to the cut portion 112 of the hole, .

3B, the printed circuit board 100 is cut into a plurality of holes 110 included in the unit area 100A, thereby forming a unit substrate 100B (S20).

The unit substrate 100B is different from the unit area 100A described above with reference to FIG. 3B. The unit substrate 100B includes a printed circuit board 100A on which the unit area 100A is repeatedly arranged Is cut and formed.

Referring to FIG. 4, the unit substrate 100B serves as a body of the light emitting diode array 300 manufactured by the manufacturing method of the present invention, and the printed circuit board 100 on which the unit area 100A is repeatedly disposed It is preferable that the plurality of holes 110 arranged in a row are cut while being passed through at one time.

The unit substrate 100B includes a cut portion 112 of a hole on its side surface and further includes a circuit pattern 120 and an electrode 130. [

The cut portion 112 of the hole specifies an area including the conductive material filled in the inside 111 of the hole and the inside 111 of the hole exposed through the hole while being cut through the hole 110. The light emitting diode chip 200 is soldered to the cutout portion 112 of the hole S40 so that the cutout portion 112 of the hole electrically connects the light emitting diode chip 200 together with the circuit pattern 120 and the electrode 130 It serves as a lead.

Next, the unit substrate 100B is stacked such that the side surfaces of the unit substrate 100B including the cut portions 112 of the holes are oriented in the same direction as shown in FIG. 3C (S30).

The main step S30 of stacking the unit substrates 100B is a step S30 in which the light emitting diode chip 200 is mounted on the side of the unit substrate 100B in the step S40 in which the light emitting diode chip 200 is soldered, To collectively solder the cut portion 112 of the hole. That is, the stacking step S30 is a step of arranging the light emitting diode chips 200 in succession to the stacked unit substrates 100B and collectively soldering them.

Therefore, the stacking step S30 simplifies the process compared to the conventional known process of arranging the light emitting diode chips at a predetermined distance from the substrate and soldering them, thereby making the manufacturing method of the light emitting diode array suitable for mass production It is appropriate as a step.

Therefore, for the soldering of the light emitting diode chip 200, it is preferable that the side surface of the stacked unit substrate 100B forms a flat surface as shown in FIG. 3C. Furthermore, it is preferable that the cut portions 112 of the holes included in each unit substrate 100B are in contact with each other, and the cut portions 112 of the holes are arranged in a line.

Next, the light emitting diode chip 200 is soldered to the side surface of the unit substrate 100B stacked so that the light emitting diode chip 200 is electrically connected to the conductive material included in the cut portion 112 of the hole (S40).

The light emitting diode chip 200 is soldered to the portion where the circuit pattern 120 is not located in the space between the cut portions 112 of adjacent holes as shown in FIG. 4, the electrode 130 included in the unit substrate 100B, the circuit pattern 120, the cut portion 112 of the hole, and the light emitting diode chip 200 to be soldered are electrically connected in series, The light emitting diode chip 200 is disposed at a position where the array 300 can be formed.

In this step, the LED chip 200 is soldered to the printed circuit board 100 by a flip-chip method. 5, a solder ball or a bump made of a conductive material such as Sn / Pb is formed on a circuit of the LED chip 200, and the solder bump and the printed circuit A soldering method in which the light emitting diode chips 200 are electrically connected by soldering the circuit pattern 120 printed on the substrate 100.

The light emitting diode package manufactured by the flip-chip method is superior to the light emitting diode package in which the light emitting diode chip 200 and the printed circuit board 100 are connected by the conventional wire method, Since the connection distance between the circuit boards 100 is short, the light emitting diode package can be miniaturized. Therefore, when the light emitting diode chip 200 is soldered by the flip-chip method, the object of the present invention to realize the light emitting diode array 300 as thin as the thickness of the printed circuit board 100 can be realized.

Meanwhile, in the method of manufacturing the light emitting diode array according to the embodiment of the present invention, in order to solder the LED chip 200 to the correct connection position in the step of soldering the LED chip 200, And further joining the unit substrates 100B so that the substrates 100B do not move.

Illustratively, the unit substrates 100B can be bonded together using a double-sided adhesive tape capable of ultraviolet curing and heat peeling. The adhesive tape is cured by ultraviolet rays to fix the unit substrate 100B and solder the light emitting diode chip 200. [ After the step of soldering the light emitting diode chip 200 is completed, the light emitting diode array 300 must be separated into the LED array 300, so that the adhesive tape is easily peeled from the unit substrate 100B And thus it is preferable. In addition, the unit substrates 100B can be bonded together according to any bonding method known to those skilled in the art.

Finally, as shown in FIG. 3E, when the stacked unit substrates 100B are separated from each other (S50), the light emitting diode array 300 according to the method of manufacturing the light emitting diode array according to the embodiment of the present invention is formed do.

Meanwhile, the method of fabricating a light emitting diode array according to an embodiment of the present invention may further include forming a reflector around the LED chip 200.

The light emitting diode array 300 manufactured by the manufacturing method of the present invention is required to condense and emit light to the side of the light guide plate as a light source device included in the edge type backlight unit, And a reflector, which is a structure for condensing light scattered to other than the predetermined directing angle.

The reflector may be formed on the surface of the printed circuit board 100 between the light emitting diode chips 200 or may be formed around the light emitting diode chip 200 in a separate structure. Further, the reflecting portion is not limited to the above described one, and may be formed according to any structure, arrangement, and material known to those skilled in the art.

For mass production of the light emitting diode array 300 according to the present invention, it is appropriate that the step of forming the reflection part is also performed collectively. That is, it is preferable that the step of forming the reflective portion is included before the step S40 in which the LED chip 200 is soldered and the step S50 in which the stacked unit substrates 100B are separated from each other.

In the soldering step of the LED chip 200, an underfill process is performed to fill the space between the LED chip 200 and the PCB 100 using a resin such as epoxy, which is a nonconductive material, The light emitting diode chip 200 and the printed circuit board 100 may be firmly connected to each other.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

10 ... Conventional light emitting diode packages
11 ... Lead frame
12 ... home
13 ... wire
100 ... Printed circuit board
100 ... Unit area
100 B ... Unit substrate
110 ... hall
111 ... Inside the hole
112 ... Cutting of holes
120 ... Circuit pattern
130 ... electrode
200 ... Light emitting diode chip
300 ... Light emitting diode array

Claims (4)

Preparing a printed circuit board in which a plurality of holes filled with a conductive material at least a part of the inside are electrically connected by a circuit pattern to form a unit area and the unit areas are repeatedly arranged;
Cutting the printed circuit board through the plurality of holes included in the unit area to form unit substrates;
Stacking the unit substrates such that cut portions of the holes face the same direction;
Soldering the LED chip to electrically connect the cut portion of the hole; And
Separating the stacked unit substrates from each other; Wherein the light emitting diode array comprises a plurality of light emitting diodes. The method according to claim 1,
Characterized in that, in the soldering step, soldering is performed by a flip-chip method. The method according to claim 1,
Further comprising forming a reflector around the light emitting diode chip after the soldering. ≪ Desc / Clms Page number 21 > The method according to claim 1,
Bonding the unit substrates together before the soldering step; Wherein the light emitting diode array further comprises a light emitting diode array.
KR1020150152402A 2015-10-30 2015-10-30 Manufacturing method for led array KR101732813B1 (en)

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Application Number Priority Date Filing Date Title
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001111195A (en) 1999-10-13 2001-04-20 Eastern Co Ltd Method of manufacturing circuit board
KR100961770B1 (en) 2009-08-28 2010-06-07 주식회사 네오스코 Packaging method for light emitting diode device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001111195A (en) 1999-10-13 2001-04-20 Eastern Co Ltd Method of manufacturing circuit board
KR100961770B1 (en) 2009-08-28 2010-06-07 주식회사 네오스코 Packaging method for light emitting diode device

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