KR101723727B1 - Apparatus and method for producing semiconductor junction using 3d printer - Google Patents

Abstract

The present invention relates to an apparatus and a method for fabricating a semiconductor junction more quickly and efficiently by configuring a semiconductor material to be supplied separately in the course of manufacturing an electronic device using a printer printing technique. An apparatus for fabricating a semiconductor junction using a printer printing technique associated with an exemplary embodiment of the present invention includes a printing bed; A first material supply part in which a material of the first semiconductor is stored; A second material supply part in which the material of the second semiconductor is stored; A first producing unit for supplying the material of the first semiconductor from the first material supplying unit and fabricating the first semiconductor on the upper surface of the printing bed; A second producing unit for supplying the material of the second semiconductor from the second material supplying unit and fabricating the second semiconductor on the upper surface of the printing bed; And a control unit, wherein the fabricated first semiconductor is bonded to the fabricated second semiconductor.

Description

[0001] APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR JUNCTION USING 3D PRINTER [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for fabricating a semiconductor junction using a printer printing technique, and more particularly, to an apparatus and a method for fabricating a semiconductor junction more quickly and efficiently by configuring the semiconductor material to be supplied separately .

In order to produce a prototype having a three-dimensional solid shape, a method of making a cooperative work by hand and a method of producing by CNC milling are known depending on drawings. However, since the method of making the woodwork is by hand, elaborate numerical control is difficult and time consuming, and the CNC milling method is capable of precise numerical control, but many shapes are difficult to process due to tool interference.

Therefore, in recent years, product designers and designers have created a so-called three-dimensional printing method in which three-dimensional modeling data is generated using CAD or CAM, and prototypes of three-dimensional shapes are produced using the generated data.

A 3D printer (Three-Dimension Printer) is a printer that can create three-dimensional objects. The basic principle of 3D printing is to build a 3D object by stacking thin 2D layers.

3D printers have recently been used in a variety of industrial fields including high-tech industries, and the interest in related technologies is greatly increasing. 3D printers are being used to develop products in various fields such as toys, fashion and entertainment industries, automobiles with high technical difficulties, aerospace, defense, and medical equipment. The 3D printer market is small compared to general printers, but 3D printer demand is expected to expand sharply as low-priced models of less than US $ 1,000 are launched for consumers.

The principle of a 3D printer can be divided into a cutting type in which large chunks are cut into pieces, and a laminated type in which the layers are piled up. Most of the 3D printers used today are stacked prints using the principle of additive processing. While there is a loss of material because the cutting mold is to cut away the excess, the stacked type is a great advantage that there is no loss of extra material.

The 3D printer of the layered type typically uses the FDM method (or the FFF method) and the SLA method. In this regard, FIGS. 1A and 1B schematically illustrate a commonly used 3D printer approach.

Referring to FIG. 1A, in the FDM (Fused Deposition Modeling) method, a filament type material is extruded through a nozzle, and an extruded material is laminated on a bed to produce a desired object. Since the structure and program of the FDM system are simpler than those of other systems, the cost and maintenance cost of the apparatus are low, and it is applicable to various materials and has an advantage of being simple in structure and easy to be enlarged. On the other hand, there are some limitations in implementing difficult and smooth shapes, and the disadvantage is that the production speed is very slow.

Referring to FIG. 1B, the SLA (stereolithography) method is a method of laminating a resin accommodated in a water tank by a method of projecting and curing a laser. The SLA method has a high output accuracy and can produce a product with a higher resolution than the FDM method. On the other hand, since the liquid resin is used, a cleaning process is required after the fabrication, and a process of removing the supporting rods manufactured in the manufacturing process is additionally required.

On the other hand, such a 3D printer has been widely used in various fields, but in reality, it has not been utilized in production of electronic devices. Electronic devices are often produced in large quantities, but it has been difficult to efficiently manufacture them using 3D printers.

Accordingly, there is a demand for development of a device using a printer printing technique that is designed with a structure optimized for manufacturing electronic devices.

US 5121329 A "Apparatus and method for creating three-dimensional objects"

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a device capable of manufacturing semiconductor junctions more quickly and efficiently by providing semiconductor materials separately in the process of manufacturing electronic devices using printer- And to provide a method to a user.

It is another object of the present invention to provide a device and a method for manufacturing a semiconductor device capable of manufacturing various products according to specifications of a semiconductor required by a user and capable of manufacturing semiconductor junctions supporting various controls that can be used for manufacturing electronic devices It has its purpose.

It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are not intended to limit the invention to the precise form disclosed. It can be understood.

An apparatus for manufacturing a semiconductor junction using a printer printing technique related to an example of the present invention for realizing the above-mentioned problems includes a printing bed; A first material supply part in which a material of the first semiconductor is stored; A second material supply part in which the material of the second semiconductor is stored; A first producing unit for supplying the material of the first semiconductor from the first material supplying unit and fabricating the first semiconductor on the upper surface of the printing bed; A second producing unit for supplying the material of the second semiconductor from the second material supplying unit and fabricating the second semiconductor on the upper surface of the printing bed; And a control unit, wherein the fabricated first semiconductor is bonded to the fabricated second semiconductor

The apparatus may further include a user input unit for receiving an input parameter associated with at least one of the first semiconductor and the second semiconductor from a user and generating an output signal corresponding to the input input parameter.

The control unit may further include a production unit connected to the user input unit to receive the output signal generated at the user input unit and to control at least one of the first production unit and the second production unit according to the received output signal, And a control module.

The input factor includes at least one of the characteristics of the first semiconductor and the second semiconductor to be fabricated. When the input factor includes the specification of the first semiconductor, Wherein the production unit is controlled to produce the first semiconductor having the specification included in the input factor, and when the specification of the second semiconductor is included in the input factor, the second production unit So that the second semiconductor having the included specification can be controlled.

In addition, the fabricated semiconductor junction is electrically connected to a terminal, and the terminal may be at least one of copper (Cu), silver (Silver), a carbon composite, a conductive electrode, a transparent electrode, and indium tin oxide It can be done in one.

The first production unit may include: a first head installed at an upper portion of the printing bed; And a first extrusion unit for extruding the first semiconductor material stored in the first material supply unit to the first head, wherein the second production unit includes a second head ; And a second extrusion unit for extruding the material of the second semiconductor stored in the second material supply unit to the second head.

The first head may further include: a first heater for heating the material of the first semiconductor, which is pressure-fed by the first head, to a predetermined first temperature range; And a first ejection port formed at a tip of the first head and ejecting the heated first semiconductor material toward an upper surface of the printing bed.

The first head may further include a first temperature sensing unit sensing a temperature of the heated first semiconductor material.

The control unit may further include a first heater control module for controlling a degree of heating by the first heater, wherein the control unit determines that the temperature sensed by the first temperature sensing unit is out of the first temperature range The first heater control module can control the first heater such that the temperature of the material of the heated first semiconductor falls within the first temperature range.

The second head may further include: a second heater for heating the material of the second semiconductor pressure-fed by the second head to a predetermined second temperature range; And a second ejection opening formed at the tip of the second head and ejecting the heated second semiconductor material toward the upper surface of the printing bed.

The second head may further include a second temperature sensing unit sensing a temperature of the heated second semiconductor material.

The control unit may further include a second heater control module for controlling the degree of heating by the second heater, wherein the control unit determines that the temperature sensed by the second temperature sensing unit is out of the second temperature range The second heater control module may control the second heater such that the temperature of the material of the heated second semiconductor falls within the second temperature range.

The control unit may include a first extrusion unit control module for controlling a position of the first extrusion unit to adjust a position where the heated first semiconductor material is injected; And a second extrusion unit control module for controlling the position of the second extrusion part to adjust a position where the material of the heated second semiconductor is injected.

Further, the position where the material of the heated first semiconductor is injected and the position where the material of the heated second semiconductor is injected can be controlled separately.

The first extruder control module controls the speed at which the material of the first semiconductor is extruded into the first head, and the second extruder control module controls the speed of extrusion of the material of the second semiconductor into the second head Can be controlled.

In addition, the speed at which the material of the first semiconductor is extruded into the first head and the speed at which the material of the second semiconductor is extruded into the second head can be controlled separately.

The first production portion may further include a first connection shaft having an upper end connected to the first extruded portion and a lower end connected to the first head, And a second connecting shaft connected to the second head at a lower end thereof.

The control unit may include a first connection axis control module for controlling a length of the first connection axis to adjust a separation distance between the first injection hole and the printing bed; And a second connection axis control module for controlling a length of the second connection axis to adjust a separation distance between the second injection port and the printing bed.

In addition, the length of the first connection shaft and the length of the second connection shaft can be separately controlled.

The apparatus may further include a lifting member installed at a lower portion of the printing bed to support the printing bed.

The control unit may further include a printing bed control module for controlling a height of the lifting member to adjust a position of the printing bed.

The lifting member may include: a first lifting member supporting one side of the printing bed; And a second lifting member for supporting the other side of the printing bed.

The lifting member may include: a first rotating piece interposed between an upper portion of the first lifting member and a lower surface of the printing bed; And a second rotating piece interposed between an upper portion of the second lifting member and a lower surface of the printing bed.

The height of one of the first lifting member and the second lifting member is adjusted by the printing bed control module, and at least one of the first and second turning pieces corresponds to the height adjustment, And tilting of the printing bed is possible according to rotation of at least one of the first rotating piece and the second rotating piece.

A method of fabricating a semiconductor junction using a printer printing technique according to an embodiment of the present invention for realizing the above-mentioned problems is characterized in that the material of the first semiconductor stored in the first material supply section is supplied to the first production section, A first step of supplying a material of a second semiconductor stored in a material supply unit to a second production unit; And a second step in which the first semiconductor is fabricated on the top surface of the printing bed by the first production unit and the second semiconductor is fabricated on the top surface of the printing bed by the second production unit, Wherein at least one of the first step and the second step is controlled, and the fabricated first semiconductor is bonded to the fabricated second semiconductor.

Also, before the first step, an input factor associated with at least one of the first semiconductor and the second semiconductor is input to a user input; And generating an output signal corresponding to the inputted input factor in the user input unit.

The control unit may further include a production unit connected to the user input unit to receive the output signal generated at the user input unit and to control at least one of the first production unit and the second production unit according to the received output signal, A control module may be provided.

The first production section may include a first head installed to be positioned above the printing bed and a first extrusion section for extruding the material of the first semiconductor stored in the first material supply section to the first head, The second production section may include a second head installed to be positioned above the printing bed and a second extrusion section for extruding the material of the second semiconductor stored in the second material supply section into the second head.

The first head further includes a first heater for heating the material of the first semiconductor pressure-fed by the first head to a predetermined first temperature range, and a second heater formed at a tip of the first head, And a first jet port for jetting the semiconductor material toward the upper surface of the printing bed.

The second head further includes a second heater for heating the material of the second semiconductor pressure-fed to the second head to a predetermined second temperature range, and a second heater formed at the tip of the second head, And a second jetting port for jetting the semiconductor material toward the upper surface of the printing bed.

Further, a lifting member for supporting the printing bed may be installed under the printing bed.

In addition, the control unit may include a printing bed control module for controlling the height of the lifting member to adjust the position of the printing bed.

On the other hand, the semiconductor junction relating to one example of the present invention for realizing the above-mentioned problems can be manufactured by the above-described manufacturing method.

On the other hand, in a program tangibly embodying instructions that can be executed by a digital processing apparatus to perform a method of manufacturing a semiconductor junction using a printer printing technique, there is provided a program for implementing the above- A first step in which a material of a first semiconductor stored in a first material supply section is supplied to a first production section and a material of a second semiconductor stored in a second material supply section is supplied to a second production section; And a second step in which the first semiconductor is fabricated on the top surface of the printing bed by the first production unit and the second semiconductor is fabricated on the top surface of the printing bed by the second production unit, Wherein at least one of the first step and the second step is controlled, and the fabricated first semiconductor is bonded to the fabricated second semiconductor.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a device capable of manufacturing semiconductor junctions more quickly and efficiently by providing semiconductor materials separately in the process of manufacturing electronic devices using printer- And methods to the user.

In addition, the present invention provides a device and a method that can manufacture various products according to specifications of a semiconductor required by a user, and can manufacture a semiconductor junction supporting various controls that can be used for manufacturing electronic devices .

It should be understood, however, that the effects obtained by the present invention are not limited to the above-mentioned effects, and other effects not mentioned may be clearly understood by those skilled in the art to which the present invention belongs It will be possible.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate a preferred embodiment of the invention and, together with the description, serve to provide a further understanding of the technical idea of the invention, It should not be construed as limited.
Figures 1A and 1B schematically illustrate the manner of a commonly used 3D printer.
Figure 2 shows one embodiment of a 3D printer that may be implemented in accordance with the present invention.
Fig. 3 shows an embodiment of a block diagram of a 3D printer according to the present invention.
4 shows an example of a head that can be applied to the 3D printer of the present invention.
Fig. 5 shows an example of an extrusion portion that can be applied to the 3D printer of the present invention.
6A and 6B show an example of a lifting member that can be applied to the 3D printer of the present invention.
7 is a flowchart showing one embodiment of a method of manufacturing a semiconductor junction using a 3D printer according to the present invention.
8 shows a semiconductor junction fabricated using the 3D printer of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. In addition, the embodiment described below does not unduly limit the contents of the present invention described in the claims, and the entire configuration described in this embodiment is not necessarily essential as the solution means of the present invention.

Recently, as the interest in utilizing 3D printing technology has increased, the spread of 3D printers is gradually increasing. The present invention proposes a method of manufacturing a semiconductor junction using a printer printing technique.

Hereinafter, the configuration of the 3D printer proposed by the present invention will be described in detail with reference to the drawings.

Fig. 2 shows an embodiment of a 3D printer that can be implemented according to the present invention, and Fig. 3 shows an embodiment of a block diagram of a 3D printer according to the present invention. Referring to FIGS. 2 and 3, the 3D printer 100 for fabricating the semiconductor junction of the present invention may include a material supply unit 10, 20, a printing bed 30, a manufacturing unit, a control unit 110, and the like .

However, the components shown in FIG. 2 and FIG. 3 are not essential, and a 3D printer having components with fewer components or fewer components may be implemented. Further, the components shown in Figs. 2 and 3 are connected to each other in an interdependent manner, and it is possible that each component is separately or integrally implemented as shown in Figs. 2 and 3. Hereinafter, each configuration will be described.

Referring to FIG. 2, the 3D printer 100 of the present invention includes a material supply unit 10, 20, in which a material 12 of a first semiconductor is stored in a first material supply unit 10, The material (22) of the second semiconductor is stored in the supply part (20). The semiconductor material may include a p-type semiconductor, an n-type semiconductor, and the like. The first semiconductor material 12 and the second semiconductor material 22 stored in the first material supply portion 10 and the second material supply portion 20 are separated from the heads 40 and 50 by the extrusion portions 60 and 70, And are used for the fabrication of the first semiconductor and the second semiconductor, respectively.

Further, the 3D printer 100 of the present invention may further include a third material supply unit (not shown), and the material of the terminal is stored in the third material supply unit. As the material of the terminal, copper (Cu), silver, a carbon composite, a conductive electrode, a transparent electrode, indium tin oxide (ITO), or the like may be used.

The material of the terminal stored in the third material supply portion is extruded to a third head (not shown) by a third extrusion portion (not shown), and the material of the terminal jetted from the third head is stacked on the upper surface of the printing bed 30 do. Thus, the terminal can be manufactured, and the terminal thus manufactured can be electrically connected to the first semiconductor or the second semiconductor.

The semiconductor junction fabricated in accordance with the present invention can be used in various applications such as resistors, variable resistors, inductors, capacitors, diodes, rectifier diodes, zener diodes, Schottky diodes, light emitting diodes, organic light emitting diodes, laser diodes, transistors, BJTs, , An operational amplifier, a CMOS, a vacuum tube, and the like. An electronic device is electrically connected to two or more terminals.

On the other hand, the production section is divided into a first production section for manufacturing the first semiconductor and a second production section for manufacturing the second semiconductor. A first side portion 4 and a second side portion 6 orthogonal to the lower plate 2 are provided on the left and right sides of the lower plate 2, The upper portion of the two side portions 6 is connected by a fixing rod 8. The first side 4 and the second side 6 may provide mobility in the Z-axis direction.

The first producing unit and the second producing unit are installed on the stationary bar 8 and are spaced apart from the printing bed 30 at the upper part of the printing bed 30. The first production portion and the second production portion are movable along the fixed bar 8 in the X-axis direction.

The first production section for manufacturing the first semiconductor is composed of the first head 40, the first connection shaft 41, the first extrusion section 60 and the like. (50), a second connecting shaft (51), a second extruding portion (70), and the like. The first production part and the second production part are formed in a symmetrical shape. Here, for convenience of explanation, the first production part will be mainly described.

Referring to FIG. 4, first, the structure of the head will be described in detail. 4 shows an example of a head that can be applied to the 3D printer of the present invention. Referring to FIG. 4, the first head 40 may further include a first jetting port 42, a first heater 43, a first temperature sensing unit 44, and the like.

The upper part of the first head 40 is connected to the first connecting shaft 41 and the material 12 of the first semiconductor is transported from the first connecting shaft 41 to the inside of the first head 40. A first heater 43 is provided inside the first head 40 to heat the material 12 of the first semiconductor that is pressed into the first head 40 to a predetermined first temperature range. The first temperature range corresponds to a temperature suitable for fabricating the first semiconductor.

The first jetting port 42 is formed at the tip of the first head 40. The material 12 of the first semiconductor heated to the first temperature range by the first heater 43 is injected onto the upper surface of the printing bed 30 through the first injection port 42, The material 12 may be laminated on the printing bed 30 to fabricate the first semiconductor.

The first head 40 may further include a first temperature sensing unit 44 capable of sensing the temperature of the first semiconductor material 12 heated by the first heater 43. The first temperature sensing unit 44 senses the temperature of the heated first semiconductor material 12 and generates an electrical signal corresponding thereto. The electrical signal generated by the first temperature sensing unit 44 is supplied to the controller 110 to the heater control module 114 of the controller. The heater control module 114 determines whether the temperature of the material 12 of the first semiconductor is within a first temperature range based on the electrical signal and determines whether the temperature of the material 12 of the first semiconductor is within a first temperature range The degree of heating by the first heater 43 may be controlled to adjust the temperature of the material 12 of the first semiconductor to fall within the first temperature range.

Similarly, the second head 50 may further include a second jetting port, a second heater, a second temperature sensing unit, and the like.

The second semiconductor material 22 is fed from the second connecting shaft 51 to the inside of the second head 50 while the second heater provided in the second head 50 is fed into the second head 50, The second semiconductor material 22 is heated to a predetermined second temperature range. The second temperature range corresponds to a temperature suitable for the fabrication of the second semiconductor.

The second jetting orifice is formed at the tip of the second head 50 and the second semiconductor material 22 heated by the second heater to the second temperature range is supplied to the upper surface of the printing bed 30 through the second jetting port .

The second temperature sensing portion can sense the temperature of the heated second semiconductor material (22). The second temperature sensing unit generates an electrical signal corresponding to the sensed temperature of the material 22 of the second semiconductor and the electrical signal generated by the second temperature sensing unit is transmitted to the heater control module 114 of the control unit 110 do. The heater control module 114 determines whether the temperature of the material 22 of the second semiconductor is within the second temperature range based on the electrical signal and determines whether the temperature of the material 22 of the second semiconductor is within the second temperature range It is possible to control the degree of heating by the second heater so that the temperature of the material 22 of the second semiconductor falls within the second temperature range.

On the other hand, the extruded portions 60 and 70 are formed by the first extruding portion 60 for extruding the first semiconductor material 12 into the first head 40 and the second semiconductor material 22 to the second head 50 And a second extruding part 70 for extruding the extruded product. The material 12 of the first semiconductor and the material 22 of the second semiconductor extruded from the first material supply part 10 and the second material supply part 20 are supplied to the first side part 4 and the second side part 6 (Not shown) so that it can be transported smoothly without being entangled.

Refer to Fig. 5 for a detailed description of the configuration of the extruded portion. Fig. 5 shows an example of an extrusion portion that can be applied to the 3D printer of the present invention.

Referring to FIG. 5, the material 12 of the first semiconductor is transferred to the upper surface of the first extruding portion 60 from the first material supplying portion 10. The first connection shaft 41 is provided on the lower surface of the first extrusion portion 60 and the first semiconductor material 12 transferred into the first extrusion portion 60 is connected to the first connection shaft 41 Move.

A first roller (61) and a first gear (63) are provided in the first extruding part (60). The first roller 61 rotates about the first roller shaft 62, and the first gear 63 rotates about the first gear shaft 64. The first roller 61 and the first gear 63 can be rotated by receiving power from a separate power generator (not shown).

5, the first roller 61 rotates in a counterclockwise direction, the first gear 63 rotates in a clockwise direction, and the first roller 61 and the first gear 63 are engaged and rotated, The semiconductor material 12 can be extruded downward.

The first gear 63 may be configured to provide an elastic restoring force so that the transfer of the material 12 of the first semiconductor is performed more smoothly. That is, a spring is connected to the first gear shaft 64, and the spring connected to the first gear shaft 64 can be compressed or restored at a predetermined interval to provide an elastic restoring force to the first gear 63 . Accordingly, the first gear 63 can induce smooth transfer while pressing the first semiconductor material 12 transferred to the inside of the first extruded portion 60.

A protrusion is formed on the outer surface of the first roller 61. The protrusion formed on the outer surface of the first roller 61 generates a large frictional force while being in contact with the outer surface of the first semiconductor material 12, . Even if the projections of the first roller 61 are worn, the first gear 63 generates the elastic restoring force, so that the first semiconductor material 12 can be stably extruded.

Similarly, the second semiconductor material 22 to be transferred from the second material supply unit 20 flows into the upper surface of the second extrusion unit 70, and the material of the second semiconductor unit 22 transferred into the second extrusion unit 70 The material 22 moves to the second connecting shaft 51.

A second roller and a second gear are installed in the second extruding part (70). The second roller rotates about the second roller shaft, and the second gear rotates around the second gear shaft. The second roller and the second gear rotate in opposite directions, whereby the material 22 of the second semiconductor can be extruded downward.

The second gear can be configured to provide an elastic restoring force so that the transport of the material 22 of the second semiconductor is made more smooth. That is, the spring is connected to the second gear shaft, and the spring connected to the second gear shaft can be compressed or restored at a predetermined interval to provide elastic restoring force to the second gear. Thus, the second gear can induce smooth transport while pressing the second semiconductor material 22 transferred to the inside of the second extruded portion.

A protrusion is formed on the outer surface of the second roller and a protrusion formed on the outer surface of the second roller contacts the outer surface of the second semiconductor material 22 to generate a large frictional force and smoothly move downward. Even if the projection of the second roller is worn, the second gear generates the elastic restoring force, so that the second semiconductor material 22 can be stably extruded.

Referring again to FIGS. 2 and 3, the lower plate 2 of the 3D printer 100 of the present invention is provided with a printing bed 30 supported by lifting members 32 and 34.

The upper surface of the printing bed 30 is provided with a first semiconductor material 12 which is ejected from the first ejection opening 42 of the first head 40 and a second semiconductor material 12 which is ejected from the second ejection opening of the second head 50 The material 22 is stacked, and the completed semiconductor device can be fabricated while the first semiconductor and the second semiconductor fabricated in this manner are bonded.

The height of the lifting members 32 and 34 can be controlled by the printing bed control module 120 of the control unit 110. The height of the lifting members 32 and 34 is adjusted so that the position of the printing bed 30 is controlled and the distance between the printing bed 30 and the heads 40 and 50 can be changed.

The lifting members 32 and 34 may include a first lifting member 32 supporting one side of the printing bed 30 and a second lifting member 34 supporting the other side of the printing bed 30. At least one of the first lifting member 32 and the second lifting member 34 that can be applied to the present invention may be plural.

In this regard, Figs. 6A and 6B show an example of a lifting member that can be applied to the 3D printer of the present invention. As shown in Figs. 6A and 6B, the first lifting member 32 may be composed of a first left lifting member 32a disposed on the left side and a first right lifting member 32b disposed on the right side.

The first left lifting member 32a and the printing bed 30 are provided with a first left pivotal piece 31a capable of rotating at a predetermined angle, A first right-hand side rotating piece 31b that can rotate at a predetermined angle is provided.

Accordingly, the printing bed 30 embodied in the present invention can provide lateral tilting. That is, the height of the first left lifting member 32a and the first right lifting member 32b can be individually adjusted, and the height difference between the first left lifting member 32a and the first right lifting member 32b The lateral tilt of the printing bed 30 can be formed.

When the first left lifting member 32a or the first right lifting member 32b is lifted or lowered, the first leftward turning piece 31a or the first rightward turning piece 31b is designed to be inclined together while rotating at a predetermined angle . With this design, the distance between the first left lifting member 32a and the first right lifting member 32b can be kept the same, thereby enabling the provision of lateral tilting.

3, the control unit 110 generally controls the overall operation of the 3D printer 100 of the present invention. The control unit 110 includes a production unit control module 112, a heater control module 114, A connection axis control module 118, a printing bed control module 120, and the like.

The production control module 112 determines the first semiconductor fabricated by the first production section or the second semiconductor fabricated by the second production section and controls the operations of the first production section and the second production section.

For example, when the type or specification of the first semiconductor desired by the user is input to the user input unit 130, the manufacturing unit control module 112 receives the output signal generated by the user input unit 130, The first production section can be controlled so that the first semiconductor can be manufactured. When the type or specification of the second semiconductor desired by the user is input to the user input unit 130, the manufacturing unit control module 112 receives the output signal generated by the user input unit 130, The second production section can be controlled so as to be produced.

The heater control module 114 includes a first heater control module capable of controlling the degree of heating of the first heater 43 and a second heater controlling the degree of heating of the second heater, A control module, and the like. The first heater control module and the second heater control module can separately control the first heater 43 and the second heater.

For example, the first heater control module may control the first heater 43 such that the temperature of the material 12 of the first semiconductor heated by the first heater 43 falls within the first temperature range, The second heater control module can control the second heater such that the temperature of the material 22 of the second semiconductor heated by the second heater falls within the second temperature range.

The extruding portion control module 116 controls the extruding portion and includes a first extruding portion control module for controlling the position of the first extruding portion 60 and a second extruding portion control module for controlling the position of the second extruding portion 70. [ An extrusion unit control module, and the like. The first extruder control module and the second extruder control module can control the first extruder 60 and the second extruder 70 individually.

For example, the first extrusion control module may control the movement of the first extrusion portion 60 in the X-axis direction to adjust the position at which the material 12 of the first semiconductor is injected. The second extruder control module controls the movement of the second extruder 70 in the X-axis direction to adjust the position at which the material 22 of the second semiconductor is injected.

The first extruder control module can control the speed at which the material 12 of the first semiconductor material is extruded in consideration of the entire manufacturing process of the first semiconductor, The amount of material 12 can be adjusted. The second extruder control module can control the speed at which the material 22 of the second semiconductor material is extruded in consideration of the overall fabrication process of the second semiconductor so that the amount of the material of the second semiconductor injected from the second injection port Can be adjusted.

The connection axis control module 118 controls the connection axis and includes a first connection axis control module for controlling the length of the first connection axis 41 and a second connection axis control module for controlling the length of the second connection axis 51. [ And a connection axis control module. The first connection axis control module and the second connection axis control module can control the first connection axis 41 and the second connection axis 51 individually.

For example, the first connection axis control module can adjust the distance between the first head 40 and the printing bed 30 by controlling the length of the first connection shaft 41 in the Y axis direction. The second connection axis control module can adjust the distance between the second head 50 and the printing bed 30 by controlling the length of the second connection shaft 51 in the Y axis direction.

The printing bed control module 120 controls the height of the first lifting member 32 and the height of the second lifting member 34, 2 printing bed control module, and the like. The first printing bed control module and the second printing bed control module can individually control the first lifting member 32 and the second lifting member 34. [ At least one of the first lifting member 32 and the second lifting member 34 may be provided in plurality and the first printing bed control module and the second printing bed control module may include a plurality of first lifting members 32 And the second lifting member 34 can be individually controlled.

For example, the printing bed control module 120 can change the height in the Y-axis direction while keeping the height of the first lifting member 32 and the second lifting member 34 the same. The printing bed control module 120 can provide lateral tilting of the printing bed 30 while changing the first lifting member 32 and the second lifting member 34 differently.

Meanwhile, the user input unit 130 generates input data for controlling the operation of the 3D printer 100 of the present invention. The user input unit 130 may receive from the user a signal designating two or more contents among the displayed contents according to the present invention. A signal for designating two or more contents may be received via the touch input, or may be received via the hard key and soft key input. The user input unit 130 may receive an input from the user for selecting the one or more contents. In addition, an input may be received from the user to generate an icon associated with a function that may be performed in the 3D printer 100. The user input unit 130 may include a direction key, a key pad, a dome switch, a touch pad (static / static), a jog wheel, a jog switch, and the like.

The interface unit 132 serves as a path for communication with all external devices connected to the 3D printer 100 of the present invention. The interface unit 132 receives data from an external device or supplies power to each component in the 3D printer 100 or transmits data in the 3D printer 100 to an external device.

For example, a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device having an identification module, an audio I / O port, A video input / output (I / O) port, an earphone port, a power port, and the like may be included in the interface unit 132.

The memory 134 may store a program for processing and controlling the controller 110, and may perform a function for temporarily storing input / output data. The memory 134 may also store the frequency of use of each of the data.

The memory 134 may be a flash memory type, a hard disk type, a multimedia card micro type, a card type memory (for example, SD or XD memory) (Random Access Memory), a static random access memory (SRAM), a read-only memory (ROM), an electrically erasable programmable read-only memory (EEPROM), a programmable read-only memory (PROM) A magnetic disk, and / or an optical disk. The present invention may also operate in connection with web storage that performs the storage function of the memory 134 on the Internet

The sensing unit 136 senses the current state of the 3D printer 100 of the present invention and generates a sensing signal for controlling the operation of the 3D printer 100. For example, it is possible to sense whether the 3D printer 100 is operating, whether the power supply unit 140 is powered on, whether the interface unit 132 is connected to an external device, and the like. In addition, the sensing unit 136 may further include a proximity sensor, which may operate in association with a touch screen, which will be described later.

The output unit 138 is for generating an output related to visual, auditory, tactile or the like. The output unit 138 may display an operation state of the 3D printer 100 to recognize the operation state of the 3D printer 100. The output unit 138 may include a display unit, An output module, an alarm unit, and the like.

The display unit may include a liquid crystal display (LCD), a thin film transistor liquid crystal display (TFT LCD), a light emitting diode (LED), an organic light emitting diode (OLED) And the like. There may be two or more display units, and in the case where the display unit and the sensor (touch sensor) for sensing the touch operation form a mutual layer structure (touch screen), the display unit may be used as an input device in addition to the output device. The touch sensor may have the form of, for example, a touch film, a touch sheet, a touch pad, or the like.

The touch sensor may be configured to convert a change in a pressure applied to a specific portion of the display portion or a capacitance occurring in a specific portion of the display portion into an electrical input signal. The touch sensor can be configured to detect not only the position and area to be touched but also the pressure at the time of touch.

The sound output module may include a receiver, a speaker, a buzzer, and the like. The sound output module outputs an acoustic signal related to the function performed in the 3D printer 100 of the present invention.

The alarm unit outputs a signal for informing occurrence of the preset event. The alarm unit may output a signal for informing occurrence of an event in a form other than a video signal or an audio signal, for example, vibration. The video signal or the audio signal may be output through the display unit or the audio output module. In this case, the display unit and the audio output module may be classified as an alarm unit.

Hereinafter, a method of using the 3D printer proposed by the present invention will be described in detail with reference to FIG. 7 is a flowchart showing one embodiment of a method of manufacturing a semiconductor junction using a 3D printer according to the present invention.

Referring to FIG. 7, an input factor related to a first semiconductor or a second semiconductor to be fabricated is input through a user input unit 130 (S10). The user input unit 130 generates an output signal corresponding to the input factor input in step S10 and the output signal generated in the user input unit 130 is transmitted to the production unit control module 112 of the control unit 110. [

Next, the materials stored in the material supply units 10 and 20 are supplied to the production unit (S20). That is, the material 12 of the first semiconductor stored in the first material supply unit 10 is supplied to the first production unit, and the material 22 of the second semiconductor stored in the second material supply unit 20 is supplied to the second production unit do.

The material 12 of the first semiconductor stored in the first material supply unit 10 is transferred to the first extrusion unit 60 along the guide member provided on the first side 4. The first roller 61 and the first gear 63 are rotated to rotate and the material 12 of the first semiconductor is fed to the first connecting shaft 41 ). The first semiconductor material 12 extruded by the first connecting shaft 41 is transferred to the first head 40. In the first head 40, the first heater 43 heats the first semiconductor material 12 to a first temperature range and the heated first semiconductor material 12 is injected through the first jet opening 42 .

Similarly, the material 22 of the second semiconductor stored in the second material supply unit 20 is transferred to the second extrusion unit 70 along the guide member provided on the second side 6. In the second extruding part 70, the second roller and the second gear are engaged and rotated to extrude the material 22 of the second semiconductor into the second connecting shaft 51 provided below the second extruding part 60. The material 22 of the second semiconductor material extruded by the second connecting shaft 51 is transferred to the second head 50. In the second head 50, the second heater heats the material 22 of the second semiconductor to a second temperature range, and the heated second semiconductor material 22 is injected through the second jetting port.

Subsequently, the fabrication unit fabricates a semiconductor junction by stacking the supplied materials (S30). That is, the first semiconductor is fabricated on the top surface of the printing bed 30 by the first production unit, and the second semiconductor is fabricated on the top surface of the printing bed 30 by the second production unit. The fabricated first semiconductor and the second semiconductor form a junction.

The material 12 of the first semiconductor injected into the first injection port 42 is stacked on the upper surface of the printing bed 30 to form the first semiconductor and the material 22 of the second semiconductor injected to the second injection port is printed And the second semiconductor is formed while being stacked on the top surface of the bed 30. The production control module 112 may control the operations of the first production part and the second production part so that the first semiconductor and the second semiconductor are manufactured in accordance with the inputted specification.

The present invention can also be embodied as computer-readable codes on a computer-readable recording medium. A computer-readable recording medium includes all kinds of recording apparatuses in which data that can be read by a computer system is stored. Examples of the computer-readable recording medium include a ROM, a RAM, a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like, and may be implemented in the form of a carrier wave (for example, transmission via the Internet) . The computer readable recording medium may also be distributed over a networked computer system so that computer readable code can be stored and executed in a distributed manner. In addition, functional programs, codes, and code segments for implementing the present invention can be easily inferred by programmers of the technical field to which the present invention belongs.

It should be understood that the above-described apparatus and method are not limited to the configurations and methods of the embodiments described above, but the embodiments may be modified such that all or some of the embodiments are selectively combined .

10: First material supply part
12: Material of the first semiconductor
20: second material supply unit
22: Material of the second semiconductor
30: Printing bed
32: first lifting member
34: second lifting member
40: first head
41: first connecting shaft
42: First nozzle
43: first heater
44: First temperature sensing
50: second head
51: Second connection axis
60: first extrusion part
61: first roller
63: first gear
70: Second extruding part
100: 3D printer
110:
112: Production control module
114: Heater control module
116: Extrusion part control module
118: Connection axis control module
120: Printing bed control module
130: user input section

Claims (34)

Printing bed;
A first material supply part in which a material of the first semiconductor is stored;
A second material supply part in which the material of the second semiconductor is stored;
A first producing unit for supplying the material of the first semiconductor from the first material supplying unit and fabricating the first semiconductor on the upper surface of the printing bed;
A second producing unit for supplying the material of the second semiconductor from the second material supplying unit and fabricating the second semiconductor on the upper surface of the printing bed; And
An apparatus for bonding a first semiconductor and a second semiconductor using a printer printing technique including a control unit,
The first production section
A first roller which rotates around a first roller shaft and a first gear which is engaged with the first roller about the first gear shaft and rotates so that the material of the first semiconductor stored in the first material supply portion is extruded into the first head A first extruding part for forming a first extrusion part;
A first heater installed to be positioned above the printing bed and heating the material of the first semiconductor pressure-fed from the first extruder to a predetermined first temperature range; And
And a first ejection port formed at the tip of the first head for ejecting the material of the heated first semiconductor toward the upper surface of the printing bed,
Wherein,
A second roller rotating about a second roller shaft and a second gear rotatably engaged with the second roller about the second gear shaft to rotate the material of the second semiconductor stored in the second material supply unit into a second head A second extruding portion for forming a second extrusion portion;
A second heater installed at an upper portion of the printing bed and heating the material of the second semiconductor pressure-fed from the second extruder to a predetermined second temperature range; And
And a second ejection port formed at a tip of the second head and ejecting the material of the heated second semiconductor toward an upper surface of the printing bed,
Wherein projections are formed on outer surfaces of the first roller and the second roller,
A spring is connected to each of the first gear shaft and the second gear shaft,
The control unit controls the position where the heated first semiconductor material is injected and the position where the heated second semiconductor material is injected at the same time,
Wherein the fabricated first semiconductor and the fabricated second semiconductor are bonded to each other. The method according to claim 1,
Further comprising a user input unit for receiving an input parameter associated with at least one of the first semiconductor and the second semiconductor from a user and generating an output signal corresponding to the input parameter, The first semiconductor and the second semiconductor are bonded to each other. 3. The method of claim 2,
Wherein,
And a production unit control module connected to the user input unit to receive the output signal generated at the user input unit and to control the operation of at least one of the first production unit and the second production unit according to the received output signal Wherein the first and second semiconductors are bonded using a printer printing technique. The method of claim 3,
Wherein the input factor includes at least one of the first semiconductor and the second semiconductor to be fabricated,
Wherein the first production section is controlled to produce the first semiconductor having the specification included in the input factor in accordance with the output signal when the input factor includes the specification of the first semiconductor,
Characterized in that when the specification of the second semiconductor is included in the input factor, the second production section controls to produce the second semiconductor having the specification included in the input factor in accordance with the output signal Device to bond the first semiconductor and the second semiconductor. The method according to claim 1,
The fabricated semiconductor junction is electrically connected to the terminal,
The terminal includes:
Characterized in that it comprises at least one of copper (Cu), silver, a carbon composite, a conductive electrode, a transparent electrode and indium tin oxide (ITO) Device for bonding semiconductor. delete delete The method according to claim 1,
Wherein the first head comprises:
And a first temperature sensing unit for sensing the temperature of the heated first semiconductor material. The apparatus of claim 1, 9. The method of claim 8,
Wherein,
And a first heater control module for controlling a degree of heating by the first heater,
When it is determined that the temperature sensed by the first temperature sensing unit is out of the first temperature range,
Wherein the first heater control module controls the first heater such that the temperature of the material of the heated first semiconductor is within the first temperature range. Device for bonding semiconductor. delete The method according to claim 1,
The second head
And a second temperature sensing unit for sensing the temperature of the heated second semiconductor material. ≪ Desc / Clms Page number 13 > 12. The method of claim 11,
Wherein,
And a second heater control module for controlling the degree of heating by the second heater,
When it is determined that the temperature sensed by the second temperature sensing unit is out of the second temperature range,
Wherein the second heater control module controls the second heater such that the temperature of the material of the heated second semiconductor is within the second temperature range. Device for bonding semiconductor. The method according to claim 1,
Wherein,
A first extrusion unit control module for controlling a position of the first extrusion unit to adjust a position where the heated first semiconductor material is injected; And
And controlling a position of the second extruded part in order to adjust a position where the material of the heated second semiconductor is injected. The printer of claim 1, And an apparatus for bonding the second semiconductor. delete 14. The method of claim 13,
The first extrusion control module controls the speed at which the material of the first semiconductor is extruded into the first head,
Wherein the second extruder control module controls the speed at which the material of the second semiconductor is extruded into the second head. 16. The method of claim 15,
Characterized in that the speed at which the material of the first semiconductor is extruded into the first head and the speed at which the material of the second semiconductor is extruded into the second head are controlled individually, And an apparatus for bonding the second semiconductor. The method according to claim 1,
Wherein the first production section comprises:
And a first connecting shaft connected to the first extruding part and having a lower end connected to the first head,
Wherein,
Further comprising a second connection axis connected at an upper end to the second extrusion and at a lower end to a second head. ≪ RTI ID = 0.0 >< / RTI > 18. The method of claim 17,
Wherein,
A first connection axis control module for controlling a length of the first connection axis to adjust a distance between the first jetting port and the printing bed; And
And a second connection axis control module for controlling a length of the second connection axis to adjust a distance between the second ejection port and the printing bed, And an apparatus for bonding the second semiconductor. 19. The method of claim 18,
Wherein the length of the first connection axis and the length of the second connection axis are controlled individually. ≪ RTI ID = 0.0 > 15. < / RTI > The method according to claim 1,
And a lifting member installed at a lower portion of the printing bed to support the printing bed. 21. The method of claim 20,
Wherein,
And controlling a height of the lifting member to adjust the position of the printing bed. The apparatus of claim 1, further comprising a control unit for controlling the height of the lifting member. 22. The method of claim 21,
The lifting member comprises:
A first lifting member for supporting one side of the printing bed; And
And a second lifting member for supporting the other side of the printing bed. ≪ Desc / Clms Page number 20 > 23. The method of claim 22,
The lifting member comprises:
A first rotating piece interposed between an upper portion of the first lifting member and a lower surface of the printing bed; And
And a second rotating piece interposed between an upper portion of the second lifting member and a lower surface of the printing bed. 24. The method of claim 23,
The height of one of the first lifting member and the second lifting member is adjusted by the printing bed control module,
At least one of the first and second turning pieces is rotated at a predetermined angle corresponding to the height adjustment,
Wherein the tilting of the printing bed is enabled in accordance with rotation of at least one of the first rotating piece and the second rotating piece. The apparatus for bonding a first semiconductor and a second semiconductor using a printer printing technique, . A method of bonding a first semiconductor and a second semiconductor using an apparatus for bonding a first semiconductor and a second semiconductor using the printer printing technique according to claim 1,
A first step of supplying a material of a first semiconductor stored in a first material supply section to a first production section and a material of a second semiconductor stored in a second material supply section to a second production section; And
And a second step of fabricating the first semiconductor on the top surface of the printing bed by the first production unit and the second semiconductor on the top surface of the printing bed by the second production unit,
The control unit controls at least one of the first step and the second step,
Wherein the fabricated first semiconductor and the fabricated second semiconductor are bonded to each other. 26. The method of claim 25,
Prior to the first step,
Inputting an input factor associated with at least one of the first semiconductor and the second semiconductor to a user input; And
And generating an output signal corresponding to the input input factor at the user input unit. ≪ Desc / Clms Page number 19 > 27. The method of claim 26,
In the control unit,
And a production unit control module connected to the user input unit to receive the output signal generated at the user input unit and to control at least one of the first production unit and the second production unit according to the received output signal Wherein the first and second semiconductors are bonded using a printer printing technique. delete delete delete 26. The method of claim 25,
And a lifting member for supporting the printing bed is installed at a lower portion of the printing bed. 32. The method of claim 31,
In the control unit,
And a printing bed control module for controlling the height of the lifting member to adjust the position of the printing bed. The method of bonding a first semiconductor and a second semiconductor using a printer printing technique. delete delete

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