KR101707844B1 - Reinforcing method of flexible printed circuit board and reinforcing device of flexible printed circuit board - Google Patents

Abstract

The present invention relates to a flexible printed circuit board reinforcement method capable of reinforcing the strength of a flexible substrate itself at a predetermined position of a flexible substrate and preventing electromagnetic interference (EMI) at a predetermined position, To a reinforcement device of the present invention.
To this end, the method of reinforcing a flexible printed circuit board according to the present invention includes a preliminary curing step, a main curing step, and a finishing curing step. The preliminary curing step heats the flexible substrate and the reinforcing material to the first temperature in a state where the reinforcing material is stacked at a predetermined position of the flexible substrate in which the circuit is embedded. The main curing step is a step of heating the flexible substrate, the reinforcing material, and the cemented sheet while the flexible substrate having undergone the pre-curing step is wrapped with the cemented sheet, while heating the cemented sheet to a second temperature equal to or higher than the first temperature. The finish curing step heats the flexible substrate and the stiffener which have undergone the main curing step to a third temperature equal to or higher than the second temperature so that the reinforcing material is fixed to the flexible substrate.

Description

TECHNICAL FIELD [0001] The present invention relates to a reinforcing method of a flexible printed circuit board and a reinforcing apparatus for a flexible printed circuit board. BACKGROUND OF THE INVENTION [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reinforcing method of a flexible printed circuit board and an apparatus for reinforcing a flexible printed circuit board, and more particularly, to a method of reinforcing a strength of a flexible substrate itself at a predetermined position of a flexible substrate, The present invention relates to a reinforcing method of a flexible printed circuit board capable of preventing EMI (Electro Magnetic Interference) and a reinforcing apparatus for a flexible printed circuit board.

Generally, a printed circuit board (PCB) having a complicated circuit configuration is used due to the appearance of various electronic apparatuses and various high-performance electronic apparatuses made into microcomputers. Printed circuit boards can be roughly divided into single-sided, double-sided, and multi-layer printed circuit boards depending on their use and purpose.

Such a printed circuit board is a circuit board that performs a function of electrically connecting or mechanically fixing predetermined electronic components, and is composed of an insulating layer such as a phenol resin or an epoxy resin, and a wiring pattern And a copper foil layer formed thereon.

However, as the above-described printed circuit board becomes smaller, more highly integrated, and has higher performance, its own strength is lowered by changing to a flexible printed circuit board (FPCB), and when the terminals of a printed circuit board are electrically connected , There is a problem that a short circuit occurs in the circuit configuration of the printed circuit board or the printed circuit board itself is deformed or broken, and EMI (Electro Magnetic Interference) occurs near the terminals of the printed circuit board.

Korean Registered Patent No. 10-0975768 (entitled "Pressure bonding method for multilayer printed circuit boards," published on Aug. 17, 2010)

SUMMARY OF THE INVENTION It is an object of the present invention to solve the conventional problems and to provide a flexible substrate capable of reinforcing the strength of the flexible substrate itself at a predetermined position of the flexible substrate and preventing electromagnetic interference (EMI) A method of reinforcing a printed circuit board and an apparatus for reinforcing a flexible printed circuit board.

According to another aspect of the present invention, there is provided a method of reinforcing a flexible printed circuit board, comprising: forming a flexible printed circuit board on a flexible substrate, A pre-curing step of heating the reinforcing material to a first temperature; A main curing step of heating the flexible substrate, the reinforcing member, and the cushioning sheet to a second temperature equal to or higher than the first temperature while the flexible substrate having been subjected to the pre-curing step is wrapped with the cushioning sheet; And a finish curing step of heating the flexible substrate and the reinforcing material having passed through the main curing step to a third temperature equal to or higher than the second temperature so that the reinforcing material is fixed to the flexible substrate.

Here, the pre-curing step may further include a step of laminating the reinforcing material at a predetermined position of the flexible substrate.

And a cutting step of attaching a thermosetting adhesive band to the continuously supplied reinforcing band and cutting the reinforcing band and the adhesive band simultaneously to obtain the reinforcing material prior to the bonding step.

A layup step of stacking the laminating sheet on the flexible substrate to wrap the reinforcing material stacked on the flexible substrate prior to the main curing step; And a sheet removing step of separating the cushioning sheet from the flexible substrate prior to the finish curing step.

Here, the cushioning sheet may include a cushion layer elastically deformed by pressing in the main curing step; A first release layer integrally fixed to one side of the cushion layer and thermally deformed by heating in the main curing step; And a second release layer integrally fixed to the other side of the cushion layer and thermally deformed by heating in the main curing step.

Here, in the pre-curing step, the soft substrate and the reinforcing material are heated for a first time, and in the main curing step, the soft substrate, the reinforcing material, Heating the sheet, and in the finishing curing step, the soft substrate and the reinforcing material are heated for a second time greater than the first time.

A reinforcing apparatus for a flexible printed circuit board according to the present invention includes a pre-hardening unit for heating the soft substrate and the reinforcing material to a first temperature in a state where a stiffener is stacked at a predetermined position of a soft substrate having a circuit built therein; A main body that pressurizes the flexible substrate, the reinforcing member, and the adhesive sheet in a state in which the adhesive sheet is laminated on the flexible substrate to wrap the reinforcing member stacked on the flexible substrate to a second temperature equal to or higher than the first temperature, A curing unit; And a finishing hardening unit heating the soft substrate and the stiffener, which have passed through the main hardening unit, to a third temperature equal to or higher than the second temperature so that the stiffener is fixed to the soft substrate.

Here, it is preferable that the flexible unit includes a stitching unit for stacking the stiffener at a predetermined position of the flexible substrate; .

And a cutting unit for attaching a thermosetting adhesive band to the continuously supplied reinforcing band and simultaneously cutting the reinforcing band and the adhesive band to obtain the reinforcing material.

Here, in the pre-hardening unit, the soft substrate and the stiffener are heated for a first time, and in the main hardening unit, the soft substrate, the stiffener, And the finishing curing unit heats the soft substrate and the stiffener for a second time greater than the first time.

According to the reinforcing method of the flexible printed circuit board and the reinforcing apparatus of the flexible printed circuit board according to the present invention, the strength of the flexible substrate itself is reinforced at a predetermined position of the flexible substrate, and the electromagnetic interference Interference can be prevented.

In particular, it is possible to facilitate electrical connection with an external device at a connection terminal portion of a predetermined position of the flexible substrate, and to prevent electromagnetic interference at the exposed connection terminal.

In addition, the present invention improves the bonding strength of the reinforcing material fixed to the flexible substrate through the three-stage divided heating process, and prevents the thermosetting adhesive chip included in the reinforcing material from contaminating the flexible substrate by overheating.

Further, the present invention can maintain the characteristics of the flexible substrate itself even if the strength is reinforced at a predetermined position of the flexible substrate, and prevent the flexible substrate from interfering with the external device by the reinforcing member.

Further, the present invention modularizes the reinforcing material through the cutting unit and the connecting unit through the cutting step and the bonding step, facilitates the arrangement of the reinforcing material, and shortens the time required for the work.

In addition, the present invention can stably wrap the outer circumferential surface of the reinforcing material in the flexible substrate through the integrated laminating sheet, smoothly transfer heat to the flexible substrate, thereby rapidly hardening the thermosetting adhesive chip included in the reinforcing material, It is possible to prevent the chip from spreading around the reinforcing member and contamination of the flexible substrate.

Further, the present invention facilitates detachment and attachment to and detachment from the flexible substrate through the integrated laminating sheet, and it is possible to prevent a part of the laminating sheet from remaining on the flexible substrate or the heat plate.

In addition, the present invention can simplify the entire work process for reinforcing a flexible substrate, greatly reduce the working time, maximize the production amount compared with the conventional one, safely control the melt-hardened state of the adhesive chip included in the reinforcing material, Lt; / RTI >

1 is a flowchart illustrating a method of reinforcing a flexible printed circuit board according to an embodiment of the present invention.
2 is a cross-sectional view illustrating a flexible substrate in a method of reinforcing a flexible printed circuit board according to an embodiment of the present invention.
3 is a cross-sectional view illustrating a flexible substrate according to a layup process in a method of reinforcing a flexible printed circuit board according to an embodiment of the present invention.
FIG. 4 is a cross-sectional view illustrating a pressurized state of a flexible substrate in a method of reinforcing a flexible printed circuit board according to an embodiment of the present invention.
5 is a cross-sectional view illustrating a flexible substrate completed by a method of reinforcing a flexible printed circuit board according to an embodiment of the present invention.
6 is a block diagram showing a reinforcing apparatus for a flexible printed circuit board according to an embodiment of the present invention.
7 is a view schematically showing a pressure unit in a reinforcing apparatus for a flexible printed circuit board according to an embodiment of the present invention.
8 is a view schematically showing a cutting unit in a device for insuring a flexible printed circuit board according to an embodiment of the present invention.

Hereinafter, a method for reinforcing a flexible printed circuit board and a reinforcing apparatus for a flexible printed circuit board according to the present invention will be described with reference to the accompanying drawings. Here, the present invention is not limited or limited by the examples. Further, in describing the present invention, a detailed description of well-known functions or constructions may be omitted for clarity of the present invention.

First, a reinforcing method of a flexible printed circuit board according to an embodiment of the present invention will be described.

FIG. 1 is a flowchart illustrating a method for reinforcing a flexible printed circuit board according to an embodiment of the present invention, FIG. 2 is a cross-sectional view illustrating a flexible substrate in a method for reinforcing a flexible printed circuit board according to an embodiment of the present invention FIG. 3 is a cross-sectional view showing the arrangement of a flexible substrate according to a layup step in a method of reinforcing a flexible printed circuit board according to an embodiment of the present invention, and FIG. 4 is a cross- FIG. 5 is a cross-sectional view illustrating a flexible substrate completed by a method of reinforcing a flexible printed circuit board according to an embodiment of the present invention. FIG.

The flexible substrate F according to an embodiment of the present invention is a substrate having a built-in circuit as shown in FIG. 2. A connection terminal F1 for electrical connection with an external device is formed on the surface of the flexible substrate F, Is exposed. For example, the connection terminal F1 may protrude from the surface of the flexible substrate F and may be recessed from the surface of the flexible substrate F. Here, the arrangement of the connection terminals F1 is not limited, and the connection terminals F1 may be exposed in the flexible substrate F through various forms.

In one embodiment of the present invention, the flexible substrate F is described as a Flexible Printed Circuit Board (FPCB) that is bent with elasticity. In addition, in the embodiment of the present invention, the predetermined position of the flexible substrate F is defined as a portion where the connection terminal F1 for electrical connection between the external device and the flexible substrate F is exposed.

The reinforcing member 165 may be fixed at a predetermined position of the flexible substrate F to reinforce the strength of the flexible substrate F at a predetermined position of the flexible substrate F And prevents EMI (Electro Magnetic Interference) at preset positions.

In particular, the stiffener 165 according to an embodiment of the present invention is fabricated through the cutting step S5 described later or the cutting unit 50 described later. The reinforcing member 165 is composed of a reinforcing chip 145 and an adhesive chip 135.

The reinforcing chip 145 is stacked at a predetermined position of the flexible substrate F. The strength of the flexible substrate F itself is reinforced through the reinforcing chip 145 and electromagnetic interference (EMI) at a predetermined position can be prevented.

The adhesive chip 135 is disposed between the reinforcing chip 145 and the flexible substrate F and fixes the reinforcing chip 145 to the flexible substrate F by thermal curing. More specifically, the adhesive chip 135 is adhered to the flexible substrate F in a state of being attached to the reinforcing chip 145, and is heat-cured stepwise in three steps, Thereby fixing the chip 145.

The adhesive sheet 100 according to an embodiment of the present invention protects the flexible substrate F by pressing in a main curing step S2 or a later described main curing unit 20, It is possible to suppress or prevent the heat sink 165 from flowing due to thermal deformation.

The adhesive sheet 100 includes a cushion layer 103, a first release layer 101, and a second release layer 102 as shown in FIG.

The cushion layer 103 is elastically deformed by a main curing step (S2) described later or pressing in the main curing unit 20 described later. The cushion layer 103 is elastically deformed by the pressure corresponding to the arrangement of the connection terminal F1 or the reinforcing member 165 or the surface shape of the flexible substrate F. [

The first release layer 101 is integrally fixed to one side of the cushion layer 103. The first release layer 101 is thermally deformed by heating in a main curing step S2 or a main curing unit 20 described later. The first release layer 101 is disposed to face the flexible substrate F. [ At this time, the material of the first release layer 101 and the adhesive chip 135 is selected so that the temperature at which the first release layer 101 is thermally deformed is lower than the temperature at which the adhesive chip 135 is thermally deformed, It is possible to prevent the adhesive chips 135 from spreading to the surface of the flexible substrate F by thermal deformation.

The second release layer 102 is integrally fixed to the other side of the cushion layer 103. The second release layer 102 is thermally deformed by a main curing step S2 or a main curing unit 20 described later. The second release layer 102 is disposed to face the heat plate of the main curing unit 20 described later.

At this time, the second release layer 102 may be made of the same material as the first release layer 101. In addition, the second release layer 102 may have the same thickness as the first release layer 101. Thus, the orientation of the cushioning sheet 100 is eliminated, and the lamination with the flexible substrate F is simplified.

1 to 5, a method of reinforcing a flexible printed circuit board according to an embodiment of the present invention includes a preliminary curing step S1, a main curing step S2, and a finishing curing step S3 .

The preliminary curing step S1 is a step of heating the flexible substrate F and the reinforcing material 165 at a first temperature T1 in a state where the reinforcing material 165 is stacked at a predetermined position of the flexible substrate F, . At this time, the first temperature T1 may be a set temperature value or a set temperature range.

The preliminary curing step S1 may heat the flexible substrate F on which the reinforcing material 165 is laminated through hot air supplied at a first temperature T1 to the hollow housing. At this time, a plurality of the flexible substrates F may be stacked on the hollow housing. Further, the flexible substrates F to be stacked may be spaced apart from each other by a separate cassette.

Also, in the pre-curing step S1, the flexible substrate F and the reinforcing material 165 are heated for a first time t1. At this time, the first time t1 may be a set time value or a set time range.

The first temperature T1 or the first time t1 according to an embodiment of the present invention may be substantially the same as the temperature or time required for pre-baking in the conventional hot press process.

In the preliminary curing step S1, the flexible substrate F and the reinforcing material 165 are heated to the first temperature T1 in a state where the reinforcing material 165 is laminated through the pre-curing unit 10 to be described later . The pre-curing step (S1) is not limited to the preliminary curing step (S1), and the preliminary curing step (S1) may include supplying the hot air of the first temperature (T1) to the hollow housing through various forms, (F) and the reinforcing member (165).

As a result, the adhesive chip 135 is thermally deformed by the first temperature T1 and the first time t1 as a result of the preliminary curing step S1, The bubbles are discharged between the adhesive chips 135 and between the flexible substrate F and the adhesive chips 135 and the adhesion between the reinforcing chips 145 and the adhesive chips 135 and the flexible substrate F And stabilizes the adhesion state of the reinforcing member 165 on the flexible substrate F. [ At this time, even if the adhesive chips 135 are thermally deformed, they do not spread over the edge of the reinforcing chip 145 and spread on the surface of the flexible substrate.

In the main curing step S2, the soft substrate F, the reinforcing material 165, and the cemented sheet F are stacked while the flexible substrate F, which has undergone the pre-curing step S1, 100 is heated to a second temperature T2 equal to or higher than the first temperature T1 while being pressurized. At this time, the second temperature T2 may be a set temperature value or a set temperature range.

In the main curing step S2, a pair of heating plates are stacked on the flexible substrate F and the reinforcing member 165 (FIG. 1) in a state where the flexible substrate F and the adhesive sheet 100 are laminated between a pair of elevatable, And the cushioning sheet 100 are heated with the heat of the heat plate while being pressed. 3, the adhesive sheet 100 is laminated on the flexible substrate F so as to surround the reinforcing member 165 corresponding to the stacking position of the reinforcing member 165. As shown in FIG.

In the main curing step S2, a plurality of the flexible substrates F and the cushioning sheets 100 are alternately stacked and pressed and heated by a hot plate, so that a plurality of the flexible substrates F F) can be processed.

In particular, as in the embodiment of the present invention, in the main curing step S2, pressing and heating are performed in a state that the cushioning sheet 100 is stacked on the flexible substrate F, And the interference between the stacked flexible substrates F can be prevented. In addition, it is possible to shorten the heat transfer time to the adhesive chips 135 and prevent the adhesive chips 135 from spreading to the surface of the flexible substrate F by thermal deformation.

The main curing step S2 is performed by pressing the flexible sheet F and the reinforcing material 165 and the adhesive sheet 100 through the main curing unit 20, 100) to the second temperature (T2).

The heat plate of the main curing unit 20 to be described later is composed of an upper heat plate 24 and a lower heat plate 25 separated from the upper heat plate 24 downward. The flexible substrate (F) and the adhesive sheet (100) are stacked on the lower heating plate (25).

At this time, if the heating temperature in the main curing step S2 is lower than the first temperature T1, the adhesive chips 135, the first release layer 101 and the second release layer 102 Heat is not transferred and the first release layer 101 does not sufficiently cover the reinforcing member 165 and the thermal deformation of the adhesive chip 135 is lowered and the adhesive chip 135 and the reinforcing chip 145 ) And the flexible substrate (F) are reduced.

If the heating temperature in the main curing step S2 is higher than the second temperature T2, excessive heat is applied to the adhesive chip 135, the first release layer 101 and the second release layer 102 And thermal deformation of the adhesive chip 135, the first release layer 101 and the second release layer 102 is excessively generated. Then, in the main curing step S2, pressing and heating proceed substantially simultaneously, so that the adhesive chip 135 is pressed against the flexible substrate F (F) while the first release layer 101 surrounds the reinforcing member 165. [ ). ≪ / RTI > In the main curing step S2, the first release layer 101 is pressed against the flexible substrate F by virtue of the fact that the pressurization and heating are substantially simultaneously performed, and the second release layer 102 is pressed against the flexible substrate F, And presses against the heat plate portion 24 or the lower heat plate portion 25 to lose the function of the release layer.

Further, due to the above-described problems, the soft substrate F is contaminated or the upper heating plate 24 or the lower heating plate 25 is contaminated.

However, by fixing the heating temperature in the main curing step (S2), the above-mentioned problem is solved so that the first release layer (101) stably surrounds the reinforcing material (165) It is prevented from spreading to the surface of the flexible substrate F by the first release layer 101 and preventing the functions of the first release layer 101 and the second release layer 102 from being deteriorated And the flexible substrate (F), the upper heating plate (24), or the lower heating plate (25) can be prevented from being contaminated by the adhesive sheet (100).

Also, the main curing step (S2) heats the flexible substrate (F) and the cushioning sheet (100) for 1/30 to 1/18 of the first time. More specifically, the main curing step (S2) heats the flexible substrate (F) and the cushioning sheet (100) for 1/29 to 1/19 of the first time. Also, the main curing step S2 heats the flexible substrate F and the cushioning sheet 100 for 1/28 to 1/19 of the first time. Also, the main curing step S2 heats the flexible substrate F and the cushioning sheet 100 for 1/28 to 1/19 of the first time. Also, the main curing step S2 heats the flexible substrate F and the cushioning sheet 100 for 1/28 to 1/20 of the first time.

At this time, if the heating time in the main curing step S2 is higher than the upper limit value of the set time, excess heat is transmitted to the adhesive chip 135, the first release layer 101 and the second release layer 102 There is a problem that excessive thermal deformation of the adhesive chip 135, the first release layer 101 and the second release layer 102 occurs and the soft substrate F is contaminated or the upper part The heat plate portion 24 or the lower heat plate portion 25 is contaminated.

If the heating time in the main curing step S2 is lower than the lower limit value of the set time, sufficient heat is applied to the adhesive chip 135, the first release layer 101 and the second release layer 102 The thermal deformation of the adhesive chip 135 is lowered and the adhesion between the adhesive chip 135 and the reinforcing chip 145 and the flexible substrate F is lowered.

However, by solving the above-described problem by limiting the heating time in the main curing step S2, the first release layer 101 stably surrounds the reinforcing member 165, It is prevented from spreading to the surface of the flexible substrate F by the first release layer 101 and preventing the functions of the first release layer 101 and the second release layer 102 from being deteriorated And the flexible substrate (F), the upper heating plate (24), or the lower heating plate (25) can be prevented from being contaminated by the adhesive sheet (100).

As a result, by limiting the second temperature (T2) and the heating time according to the main curing step (S2), the first release layer (101) Tightly surrounds the reinforcing member (165), and at the same time, is brought into close contact with the flexible substrate (F). At this time, the cushion layer 103 is elastically deformed so that the reinforcing member 165 is inserted, and the second release layer 102 is adhered to the heat plate. Further, it is prevented that the soft substrate F spreads to the surface, and the flow of the reinforcing material 165 is prevented, so that the reinforcing material 165 can be hardened at a predetermined position.

The finishing curing step S3 is a step in which the soft substrate F and the reinforcing material F that have been subjected to the main curing step S2 are fixed so that the reinforcing material 165 is fixed to the soft substrate F through the main curing step S2. (165) is heated to a third temperature (T3) equal to or higher than the second temperature (T2). At this time, the third temperature T3 may be a set temperature value or a set temperature range.

The finish curing step S3 may heat the flexible substrate F on which the reinforcing material 165 is laminated through the hot air supplied at the third temperature T3 to the hollow housing. At this time, a plurality of the flexible substrates F may be stacked on the hollow housing. Further, the flexible substrates F to be stacked may be spaced apart from each other by a separate cassette.

The finish curing step S3 may heat the flexible substrate F to a third temperature T3 in a state where the reinforcing material 165 is laminated through a finishing curing unit 30 described later. The finishing curing step (S3) is not limited to the finishing curing step (S3). The finishing curing step (S3) may include supplying hot air of a third temperature (T3) to the hollow housing through various forms, (F) can be heated.

At this time, if the heating temperature in the finish curing step S3 is lower than the second temperature T2, sufficient heat is not transferred to the adhesive chips 135, and the thermal deformation of the adhesive chips 135 is lowered , The adhesion between the adhesive chip 135, the reinforcing chip 145 and the flexible substrate F is lowered.

When the heating temperature in the finish curing step S3 is higher than the third temperature T3, excessive heat is transferred to the adhesive chips 135, and the adhesive chips 135 are transferred to the flexible substrate F It spreads to the surface. The adhesive chip 135 may be thermally deformed excessively or the flexible substrate F or the adhesive chip 135 may be subjected to plastic deformation so that the material properties of the flexible substrate F and the adhesive chip 135 Is changed to lose the function of the flexible substrate (F) and the adhesive chip (135). Further, the flexible substrate F may be contaminated by plastic deformation.

However, by limiting the heating temperature in the finish curing step S3, the above-mentioned problem is solved, and the adhesive chip 135 is prevented from spreading to the surface of the flexible substrate F even if it is thermally deformed, It is possible to improve the degree of adhesion between the flexible substrate 135 and the reinforcing chip 145 and the flexible substrate F, and to prevent the flexible substrate F from being contaminated.

The finish curing step S2 heats the flexible substrate F during a second time t2 which is greater than the first time t1.

If the heating time in the finish curing step S3 is greater than the second time t2, excess heat is transferred to the flexible substrate F and the adhesive chip 135, And the adhesive chips 135 may be excessively thermally deformed and the adhesive chips 135 may spread to the surface of the flexible substrate F or the flexible substrate F may be contaminated.

If the heating time in the finish curing step S3 is equal to or smaller than the first time t1, sufficient heat is not transferred to the adhesive chips 135, and the thermal deformation of the adhesive chips 135 And the adhesion between the adhesive chip 135 and the reinforcing chip 145 and the flexible substrate F is lowered.

However, by limiting the heating time in the finish curing step S3, the above-mentioned problems are solved, and the adhesive chips 135 are prevented from spreading to the surface of the flexible substrate F even if they are thermally deformed, It is possible to improve the degree of adhesion between the reinforcing chip 135 and the reinforcing chip 145 and the flexible substrate F and to prevent the flexible substrate F from being contaminated by the bonding sheet 100.

As a result, the adhesive chip 135 is thermally deformed in a third order by the third temperature T3 and the second time t2 along the finish hardening step S3, The bubbles are discharged between the adhesive chips 135 and between the flexible substrate F and the adhesive chips 135 and the adhesion between the reinforcing chips 145 and the adhesive chips 135 and the flexible substrate F Thereby stabilizing the adhesion state of the reinforcing member 165 on the flexible substrate F. [ At this time, even though the adhesive chips 135 are thermally deformed, they do not spread to the surface of the flexible substrate F through the edge of the reinforcing chip 145.

The method of reinforcing a flexible printed circuit board according to an embodiment of the present invention further includes a stitching step (S4).

The stitching step S4 stacks the reinforcing member 165 at a predetermined position of the flexible substrate F prior to the pre-curing step S1.

The adhesion step S4 allows the adhesive chips 135 to adhere to the predetermined position of the flexible substrate F in a state where the adhesive chip 135 is attached to the reinforcing chip 145. For example, in the stitching step S4, the reinforcing member 165 can be grasped and transported by the attraction force.

The stitching step S4 may stack the reinforcing member 165 at a predetermined position of the flexible substrate F through the connecting unit 40, which will be described later. Here, the stitching step S4 is not limited to the stitching step S4, and the stiffener 165 may be attached to a predetermined position of the soft substrate F through various forms.

The stiffener 165 is attached to the predetermined position of the flexible substrate F and the flexible substrate F is fixed on the flexible substrate F when the flexible substrate F is transferred, The flow of the reinforcing member 165 can be suppressed or prevented.

The method of reinforcing a flexible printed circuit board according to an embodiment of the present invention further includes a cutting step (S5).

The cutting step S5 may be performed by attaching a thermosetting adhesive band 133 to the continuously supplied reinforcing band 143 prior to the attaching step S4 and attaching the adhesive band 133 to the reinforcing band 143, And the stiffener 165 is obtained. At this time, the portion cut at the reinforcing band 143 forms the reinforcing chip 145, and the portion cut at the bonding band 133 forms the bonding chip 135.

In the cutting step S5, the reinforcing member 165 may be obtained through the cutting unit 50 described later.

The stiffener 165 can be supplied in real time corresponding to a predetermined position of the flexible substrate F by acquiring the stiffener according to the cutting step S5, It is possible to suppress or prevent foreign matter from adhering, improve the adhesion of the adhesive chips 135, and minimize defects of the reinforcing member 165.

The method of reinforcing a flexible printed circuit board according to an embodiment of the present invention further includes a layup step (S6) and a sheet removing step (S7).

The layup step S6 may be performed such that the adhesive sheet 100 is stacked on the flexible substrate F so as to surround the reinforcing member 165 stacked on the flexible substrate F prior to the main curing step S2, do. The layup step S6 is carried out through the operation buffer unit 23 of the main curing unit 20 or an opening 22 of the main curing unit 20 to be described later, F).

3, the layup step S6 is disposed between the upper heating plate 24 and the lower heating plate 25 such that the soft substrate F and the liner sheet 100 are stacked . The layup step S6 is performed by placing the flexible substrate F and the adhesive sheet 100 in a stacked state in the work buffer unit 23 of the main curing unit 20 to be described later, The flexible substrate F and the cushioning sheet 100 may be inserted between the upper heating plate 24 and the lower heating plate 25.

As a result, only one piece of the laminating sheet 100 integrated in the layup step S6 is laminated on the flexible substrate F, thereby shortening the working time. In the flexible substrate F, 100) can be positively positioned. Also, the air layer between the two members due to the lamination is reduced by the layup step (S6), and the first release layer (101) covers the reinforcement member (165) And it is possible to prevent the adhesive chips 135 from spreading to the surface of the flexible substrate F in the main curing step S2.

In the sheet removing step (S7), the cushioning sheet (100) is separated from the flexible substrate (F) prior to the finish curing step (S3). The sheet removing step S7 may be performed in the work buffer unit 23 of the main curing unit 20 or an opening 22 of the main curing unit 20 described later.

In the sheet removing step S7, as shown in FIG. 4, only the cushioning sheet 100 is removed in a state where the reinforcing material 165 is thermally cured on the flexible substrate F. As shown in FIG. Since the concavo-convex shape of the flexible substrate F remains in the cushioning sheet 100 separated through the sheet removing step S7, the cushioning sheet 100 used for the effect of the layup step S6 ) Is advantageous to discard.

Then, the state of attachment of the reinforcing member 165 on the flexible substrate F can be confirmed through the sheet removing step S7. The adhesive sheet 100 is not exposed to the third temperature T3 of the finish curing S3 as the sheet removing step S7 is performed, (F) can be prevented from being contaminated by thermal deformation of the cushioning sheet (100) by the third temperature (T3).

The method of reinforcing a flexible printed circuit board according to an embodiment of the present invention further includes a checking step (S8).

In the inspection step S8, the fixing state of the reinforcing member 165 on the flexible substrate F is inspected after finishing the final hardening step S3. In the inspecting step S8, electromagnetic interference (EMI) is detected at an arrangement position of the stiffener 165, a strength of the flexible substrate F according to the stiffener 165, and a predetermined position of the flexible substrate F. [ The degree of contact between the reinforcing member 165 and the flexible substrate F and the degree of exposure of the adhesive chip 135 on the flexible substrate F are checked.

When the reinforcing method of the flexible printed circuit board according to an embodiment of the present invention is completed, the flexible substrate F on which the reinforcing material 165 is fixed is packed and delivered.

Next, a reinforcing apparatus for a flexible printed circuit board according to an embodiment of the present invention will be described.

FIG. 6 is a block diagram illustrating a reinforcing apparatus for a flexible printed circuit board according to an embodiment of the present invention, and FIG. 7 is a perspective view of a reinforcing apparatus of a flexible printed circuit board according to an embodiment of the present invention, And FIG. 8 is a view schematically showing a cutting unit in a device for securing a flexible printed circuit board according to an embodiment of the present invention.

1 to 8, an apparatus for reinforcing a flexible printed circuit board according to an embodiment of the present invention includes a preliminary curing unit 10, a main curing unit 20, and a finishing curing unit 30 .

The preliminary curing unit 10 is configured to heat the flexible substrate F and the reinforcing member 165 at a first temperature T1 in a state where the reinforcing member 165 is stacked at a predetermined position of the flexible substrate F, . At this time, the first temperature T1 may be a set temperature value or a set temperature range.

The preliminary curing unit 10 can heat the flexible substrate F on which the reinforcing member 165 is stacked through hot air supplied at a first temperature T1 to the hollow housing. At this time, a plurality of the flexible substrates F may be stacked on the hollow housing. Further, the flexible substrates F to be stacked may be spaced apart from each other by a separate cassette.

In addition, the pre-curing unit 10 heats the flexible substrate F and the reinforcing member 165 for a first time t1. At this time, the first time t1 may be a set time value or a set time range.

The first temperature T1 or the first time t1 according to an embodiment of the present invention may be substantially the same as the temperature or time required for pre-baking in the conventional hot press process.

The preliminary curing unit 10 can heat the flexible substrate F and the reinforcing member 165 to the first temperature T1 in a state where the reinforcing member 165 is laminated through the preliminary curing step S1 have. Here, the pre-curing unit 10 is not limited to the pre-curing unit 10, and the pre-curing unit 10 may supply hot air of a first temperature T1 to the hollow housing through various forms, (F) and the reinforcing member (165).

As a result, the adhesive chip 135 is thermally deformed by the first temperature T1 and the first time t1 according to the preliminary curing unit 10, Bubbles are discharged between the chip 135 and the flexible substrate F and the adhesive chip 135 to improve the adhesion between the reinforcing chip 145 and the adhesive chip 135 and the flexible substrate F And stabilizes the bonding state of the reinforcing member 165 on the flexible substrate F. [ At this time, even though the adhesive chips 135 are thermally deformed, they do not spread to the surface of the flexible substrate F through the edge of the reinforcing chip 145.

The main curing unit 20 is configured such that the flexible substrate F having passed through the preliminary curing unit 10 is wound around the flexible substrate F and the reinforcing member 165 and the cushioning sheet 100 is heated to a second temperature T2 equal to or higher than the first temperature T1 while being pressurized. At this time, the second temperature T2 may be a set temperature value or a set temperature range.

The main curing unit 20 is configured such that a pair of heating plates are disposed between the flexible substrate F and the reinforcing member 165 And the cushioning sheet 100 are heated with the heat of the heat plate while being pressed. The adhesive sheet 100 is laminated on the flexible substrate F so as to surround the reinforcing member 165 corresponding to the stacking position of the reinforcing member 165.

In more detail, the main curing unit 20 includes a main body 21, an upper heating plate 24, and a lower heating plate 25. As shown in FIG.

The main body 21 forms an outer appearance of the main curing unit 20.

Here, the main body 21 has an opening 22 formed therein. The opening 22 is inserted in a state where the flexible substrate F and the cushioning sheet 100 are laminated. The opening 22 is recessed in the main body 21 and can be opened and closed through a separate door member. At least one of the upper heating plate 24 and the lower heating plate 25 can be raised or lowered in the opening 22. A plurality of the openings 22 may be formed in the main body 21.

In addition, the main body 21 is provided with a work buffer unit 23. The work buffer unit 23 is formed by laminating the cushioning sheet 100 on the flexible substrate F.

In the work buffer unit 23, the adhesive sheet 100 is laminated on the flexible substrate F so as to enclose the reinforcing member 165 laminated on the flexible substrate F. In addition, in the work buffer unit 23, the cushioning sheet 100 is separated from the soft substrate F which has been pressurized and heated through the main curing unit 20.

The work buffer unit 23 is not limited to the work buffer unit 23. The work buffer unit 23 may be formed by stacking the luting sheet 100 on the flexible substrate F through various forms, The cushioning sheet 100 is separated.

The upper heating plate 24 is coupled to the main body 21 so as to move up and down corresponding to the opening 22. The upper heat plate 24 is heated by an applied power source. The upper heating plate 24 is coupled to the main body 21 so as to be movable up and down. The upper heating plate 24 pressurizes the flexible substrate F and the laminated sheet 100 stacked in the opening 22 in the main body 21 while pressing them.

Here, the upper heat plate 24 is not limited to the upper heat plate 24, and the upper heat plate 24 may be heated while being raised or lowered through various forms such as hydraulic pressure, pneumatic pressure, or motor driving.

The lower heat plate portion 25 is disposed to face the upper heat plate portion 24 corresponding to the opening portion 22. Heat is generated in the lower heat plate portion 25 by an applied power source. The lower heating plate 25 is coupled to the main body 21 so as to be movable up and down. The lower heating plate 25 pressurizes the flexible substrate F and the cushioning sheet 100 laminated on the opening 22 inside the main body 21 while pressing them. The flexible substrate F and the adhesive sheet 100 may be stacked on the lower heating plate 25.

The lower heating plate 25 is not limited to the lower heating plate 25. The lower heating plate 25 can be heated while being raised or lowered through various forms such as hydraulic pressure, pneumatic pressure, or driving of a motor.

For example, a plurality of the flexible substrates F and the cushioning sheets 100 are alternately laminated in one opening 22 of the main curing unit 20, and the pressing and heating are performed by the heat plate, It is possible to process a plurality of the flexible substrates F in one apparatus.

Particularly, as in the embodiment of the present invention, in the main curing unit 20, pressing and heating are performed in a state in which the cushioning sheet 100 is stacked on the flexible substrate F, And the interference between the stacked flexible substrates F can be prevented. In addition, it is possible to shorten the heat transfer time to the adhesive chips 135 and prevent the adhesive chips 135 from spreading to the surface of the flexible substrate F by thermal deformation.

The main curing unit 20 presses the cushioning sheet 100 laminated on the flexible substrate F through the main curing step S2 so that the flexible substrate F, The sheet 100 can be heated to the second temperature T2.

At this time, if the heating temperature in the main curing unit 20 is lower than the first temperature T1, the adhesive chip 135, the first release layer 101, and the second release layer 102 Heat is not transferred and the first release layer 101 does not sufficiently cover the reinforcing member 165 and the thermal deformation of the adhesive chip 135 is lowered and the adhesive chip 135 and the reinforcing chip 145 ) And the flexible substrate (F) are reduced.

When the heating temperature in the main curing unit 20 is higher than the second temperature T2, excessive heat is applied to the adhesive chip 135, the first release layer 101 and the second release layer 102 And thermal deformation of the adhesive chip 135, the first release layer 101 and the second release layer 102 is excessively generated. Then, in the main curing unit 20, the pressing and heating substantially progress simultaneously, so that the adhesive chip 135 is pressed against the flexible substrate F (F) while the first release layer 101 surrounds the reinforcing member 165, ). ≪ / RTI > In the main curing unit 20, the first release layer 101 is pressed against the flexible substrate F by virtue of the pressing and heating substantially simultaneously, and the second release layer 102 is pressed against the flexible substrate F, And presses against the heat plate portion 24 or the lower heat plate portion 25 to lose the function of the release layer.

Further, due to the above-described problems, the soft substrate F is contaminated or the upper heating plate 24 or the lower heating plate 25 is contaminated.

However, by fixing the heating temperature in the main curing unit 20, the above-mentioned problem is solved so that the first release layer 101 stably surrounds the reinforcing member 165, It is prevented from spreading to the surface of the flexible substrate F by the first release layer 101 and preventing the functions of the first release layer 101 and the second release layer 102 from being deteriorated And the flexible substrate (F), the upper heating plate (24), or the lower heating plate (25) can be prevented from being contaminated by the adhesive sheet (100).

Also, the main curing unit 20 heats the flexible substrate F and the cushioning sheet 100 for 1/30 to 1/18 of the first time. More specifically, the main curing unit 20 heats the flexible substrate F and the cushioning sheet 100 for 1/29 to 1/19 of the first time. Also, the main curing unit 20 heats the flexible substrate F and the cushioning sheet 100 for 1/28 to 1/19 of the first time. Also, the main curing unit 20 heats the flexible substrate F and the cushioning sheet 100 for 1/28 to 1/19 of the first time. Also, the main curing unit 20 heats the flexible substrate F and the cushioning sheet 100 for 1/28 to 1/20 of the first time.

At this time, if the heating time in the main curing unit 20 is higher than the upper limit value of the set time, excess heat is transmitted to the adhesive chip 135, the first release layer 101 and the second release layer 102 There is a problem that excessive thermal deformation of the adhesive chip 135, the first release layer 101 and the second release layer 102 occurs and the soft substrate F is contaminated or the upper part The heat plate portion 24 or the lower heat plate portion 25 is contaminated.

When the heating time in the main curing unit 20 is lower than the lower limit of the set time, sufficient heat is applied to the adhesive chip 135, the first release layer 101 and the second release layer 102 The thermal deformation of the adhesive chip 135 is lowered and the adhesion between the adhesive chip 135 and the reinforcing chip 145 and the flexible substrate F is lowered.

However, by fixing the heating time in the main curing unit 20, the above-mentioned problem is solved so that the first release layer 101 stably surrounds the reinforcing member 165, It is prevented from spreading to the surface of the flexible substrate F by the first release layer 101 and preventing the functions of the first release layer 101 and the second release layer 102 from being deteriorated And the flexible substrate (F), the upper heating plate (24), or the lower heating plate (25) can be prevented from being contaminated by the adhesive sheet (100).

As a result, by limiting the second temperature and the heating time according to the main curing unit 20, the first release layer 101 is deformed in the thermally deformed state, And at the same time, it is brought into close contact with the flexible substrate F. At this time, the cushion layer 103 is elastically deformed to insert the reinforcing member 165, and the second release layer 102 is in close contact with the upper heat plate 24 and the lower heat plate 25, respectively. Further, it is prevented that the soft substrate F spreads to the surface, and the flow of the reinforcing material 165 is prevented, so that the reinforcing material 165 can be hardened at a predetermined position.

The finishing curing unit 30 is disposed between the soft substrate F and the reinforcing member 165 so that the reinforcing member 165 is fixed to the soft substrate F via the main curing unit 20. [ (165) is heated to a third temperature (T3) equal to or higher than the second temperature (T2). At this time, the third temperature T3 may be a set temperature value or a set temperature range.

The finishing curing unit 30 can heat the flexible substrate F on which the reinforcing member 165 is stacked through hot air supplied at a third temperature T3 to the hollow housing. At this time, a plurality of the flexible substrates F may be stacked on the hollow housing. Further, the flexible substrates F to be stacked may be spaced apart from each other by a separate cassette.

The finish curing unit 30 may heat the flexible substrate F to a third temperature T3 in a state where the reinforcing material 165 is laminated through the finish curing step S3. The finishing curing unit 30 is not limited to the finishing curing unit 30. The finishing curing unit 30 can supply the hot air of the third temperature to the hollow housing through the various forms to form the soft substrate F in the hollow housing, Can be heated.

At this time, if the heating temperature in the finish curing unit 30 is lower than the second temperature T2, sufficient heat is not transferred to the adhesive chip 135, and the thermal deformation of the adhesive chip 135 is lowered , The adhesion between the adhesive chip 135, the reinforcing chip 145 and the flexible substrate F is lowered.

If the heating temperature in the finish curing unit 30 is higher than the third temperature T3, excess heat is transferred to the adhesive chips 135, and the adhesive chips 135 are transferred to the flexible substrate F It spreads to the surface. The adhesive chip 135 may be thermally deformed excessively or the flexible substrate F or the adhesive chip 135 may be subjected to plastic deformation so that the material properties of the flexible substrate F and the adhesive chip 135 Is changed to lose the function of the flexible substrate (F) and the adhesive chip (135). Further, the flexible substrate F may be contaminated by plastic deformation.

However, by limiting the heating temperature in the finish curing unit 30, the above-mentioned problem is solved, and the adhesive chip 135 is prevented from spreading to the surface of the flexible substrate F even if it is thermally deformed, It is possible to improve the degree of adhesion between the flexible substrate 135 and the reinforcing chip 145 and the flexible substrate F, and to prevent the flexible substrate F from being contaminated.

Also, the finish curing unit 30 heats the flexible substrate F during a second time t2, which is greater than the first time t1.

If the heating time in the finish curing unit 30 is greater than the second time t2, excess heat is transferred to the flexible substrate F and the adhesive chip 135, And the adhesive chips 135 may be excessively thermally deformed and the adhesive chips 135 may spread to the surface of the flexible substrate F or the flexible substrate F may be contaminated.

When the heating time in the finish curing unit 30 is equal to or smaller than the first time t1, sufficient heat is not transferred to the adhesive chip 135, and thermal deformation of the adhesive chip 135 And the adhesion between the adhesive chip 135 and the reinforcing chip 145 and the flexible substrate F is lowered.

However, by limiting the heating time in the finish curing unit 30, the above-mentioned problem is solved, so that the adhesive chips 135 are prevented from spreading to the surface of the flexible substrate F even if they are thermally deformed, It is possible to improve the degree of adhesion between the reinforcing chip 135 and the reinforcing chip 145 and the flexible substrate F and to prevent the flexible substrate F from being contaminated by the bonding sheet 100.

As a result, the adhesive chip 135 is thermally deformed by the third temperature T3 and the second time t2 in a third order as the final hardening unit 30 passes over the adhesive chip 135, The bubbles are discharged between the adhesive chips 135 and between the flexible substrate F and the adhesive chips 135 and the adhesion between the reinforcing chips 145 and the adhesive chips 135 and the flexible substrate F Thereby stabilizing the adhesion state of the reinforcing member 165 on the flexible substrate F. [ At this time, even though the adhesive chips 135 are thermally deformed, they do not spread to the surface of the flexible substrate F through the edge of the reinforcing chip 145.

The reinforcing apparatus for a flexible printed circuit board according to an embodiment of the present invention further includes a contact unit (40).

The connecting unit 40 stacks the reinforcing member 165 at a predetermined position of the flexible substrate F. [

The adhesive unit 40 allows the adhesive chip 135 to be attached to a predetermined position of the flexible substrate F in a state where the adhesive chip 135 is attached to the reinforcing chip 145. For example, the attaching unit 40 can grip and transport the reinforcing member 165 by an attraction force.

The connecting unit 40 may stack the reinforcing member 165 at a predetermined position of the flexible substrate F through the bonding step S4. Here, the connection unit 40 is not limited to the connection unit 40, and the connection unit 40 may connect the reinforcing member 165 to a predetermined position of the flexible substrate F through various forms such as a vision recognition technique or a centering technique. Can be attached.

The stiffener 165 is attached to the predetermined position of the flexible substrate F as the stiffener 165 passes through the flexible connection unit 40 and the flexible substrate F is fixed to the flexible substrate F The flow of the reinforcing member 165 can be suppressed or prevented. The flexible substrate F having passed through the connecting unit 40 is moved to the pre-curing unit 10 through a separate moving unit.

The apparatus for reinforcing a flexible printed circuit board according to an embodiment of the present invention further includes a cutting unit 50.

The cutting unit 50 is formed by attaching a thermosetting adhesive band 133 to a continuously supplied reinforcing band 143 and cutting the reinforcing band 143 and the adhesive band 133 at the same time, . At this time, the portion cut at the reinforcing band 143 forms the reinforcing chip 145, and the portion cut at the bonding band 133 forms the bonding chip 135. The cutting unit 50 may obtain the reinforcement 165 through the cutting step S5.

In more detail, the cutting unit 50 includes a reinforcing winding unit 140, an adhesive winding unit 130, a first protection winding unit 110, a second protection winding unit 120, a joint unit 150, , And a punching unit (160).

The reinforcing band 143 is wound around the reinforcing winding part 140. The reinforcing winding portion 140 continuously supplies the reinforcing band 143 to the catching portion 150. [ A reinforcing support portion 141 for guiding the reinforcing band 143 to the joining portion 150 is provided between the reinforcing winding portion 140 and the joining portion 150. The reinforcing support portion 141 can change the moving direction of the reinforcing band 143 while supporting the reinforcing band 143. [ The reinforcing winding portion 140 is rotated in a roller shape.

The adhesive winding unit 130 is wound with the thermosetting adhesive band 133 having the first protection band 113 and the second protection band 123 attached to both sides thereof. The adhesive winding unit 130 continuously supplies the adhesive band 133 to the sticking unit 150. The first protection band 113 and the second protection band 123 protect both sides of the adhesive band 133 and protect the adhesive material formed on both sides of the adhesive band 133, Can be prevented from adhering to both surfaces of the adhesive band (133). An adhesive support portion 131 is provided between the adhesive winding portion 130 and the sticking portion 150 to guide the adhesive band 133 to the sticking portion 150. The adhesive support portion 131 can change the moving direction of the adhesive band 133 while supporting the adhesive band 133. The adhesive support 131 may form a boundary between the adhesive band 133 and the first protective band 113. The first protection band 113 separated from the adhesive band 133 is collected in the first protection winding part 110. The adhesive winding portion 130 and the adhesive support portion 131 are formed in a roller shape capable of rotating.

The first protection band 110 separates from the adhesive band 133 and collects the first protection band 113. The first protective band 110 is wound around the first protective band 113 separated from the adhesive band 133. A first protective support part 111 is provided between the adhesive winding part 130 and the first protection winding part 110. The first protection support part 111 can change the moving direction of the first protection band 113 while supporting the first protection band 113. The first protection winding part (110) and the first protection supporting part (111) are formed in a roller shape capable of rotating.

The second protection band 120 is collected by the second protection band 123 separated from the adhesive band 133. [ The second protection band 120 may be collected by the second protection band 123 separated from the adhesive band 133 that has passed through the joining portion 150. The second protective band 120 may be wound with the second protective band 123 separated from the adhesive band 133. A second protective support part 121 is provided between the securing part 150 and the second protection case mounting part 120. The second protection support part 121 can change the moving direction of the second protection band 123 while supporting the second protection band 123. The second protective portion mounting portion 120 and the second protective support portion 121 are formed in a roller shape capable of rotating.

The joining part 150 attaches the adhesive band 133 to the reinforcing band 143. At this time, the first protection band 113 is separated from the one side of the adhesive band 133 and the second protection band 123 is attached to the other side of the adhesive band 133, (133) is supplied to the catching portion (150). The joining part 150 is not limited to the joining part 150, and the joining part 150 can attach the joining band 133 to the joining band 143 through various shapes such as a pair of rollers.

By separating the second protective band 123 from the adhesive band 133 in a state where the reinforcing band 143 and the adhesive band 133 are attached to the adhesive band 150, 133 can be prevented from adhering to the catching portion 150.

The punching unit 160 simultaneously punctures the reinforcing band 143 and the adhesive band 133 which are attached through the sticking unit 150. Then, the stiffener 165 is obtained through the punching unit 160. Here, the punching unit 160 is not limited to the punching unit 160, and the punching unit 160 may be operated through various forms such as hydraulic pressure, pneumatic pressure, or motor driving. The punching unit 160 can puncture the reinforcing band 143 and the adhesive band 133 in a state where the second protective band 123 is separated from the adhesive band 133.

The stiffener 165 is supplied in real time corresponding to a predetermined position of the flexible substrate F through the cutting unit 50 so as to restrain adhesion of foreign matter to the adhesive chip 135, The adhesive force of the adhesive chips 135 can be improved, and the failure of the reinforcing member 165 can be minimized. The reinforcing member 165 obtained by the operation of the punching unit 160 is transferred to the flexible substrate F by the attaching unit 40.

The reinforcing apparatus for a flexible printed circuit board according to an embodiment of the present invention further includes an inspection unit (60).

The inspection unit (60) inspects the fixed state of the reinforcing member (165) on the flexible substrate (F) passed through the finishing curing unit (30). The inspecting unit 60 can detect electromagnetic interference (EMI) at the position of the reinforcing member 165, the strength of the flexible substrate F according to the reinforcing member 165, The degree of contact between the reinforcing member 165 and the flexible substrate F and the degree of exposure of the adhesive chip 135 on the flexible substrate F are checked.

According to the embodiment of the present invention, the flexible substrate F passed through the inspection unit 60 is packaged and delivered.

According to the reinforcing method of the flexible printed circuit board and the reinforcing apparatus of the flexible printed circuit board described above, the strength of the flexible substrate (F) itself is reinforced at a predetermined position of the flexible substrate (F) It is possible to prevent EMI (Electro Magnetic Interference). Particularly, it is possible to facilitate the electrical connection with the external device at the connection terminal F1 of the predetermined position of the flexible substrate F, and to prevent the electromagnetic interference at the exposed connection terminal F1.

Further, the bonding strength of the reinforcing member 165 fixed to the flexible substrate F is improved through the three-step divided heating process, and the thermosetting adhesive chip 135 included in the reinforcing member 165 is heated by overheating, Can be prevented from contaminating the flexible substrate (F).

Even if the strength of the flexible substrate F is reinforced at a predetermined position, the characteristics of the flexible substrate F itself can be maintained. If the flexible substrate F is interfered with the external device by the reinforcing member 165, .

The reinforcing member 165 may be modularized through the cutting step S5 and the attaching step S4 or through the cutting unit 50 and the attaching unit 40 so that the arrangement of the reinforcing member 165 And the time required for the operation can be shortened.

The outer peripheral surface of the reinforcing member 165 can be stably wrapped on the flexible substrate F through the integrated laminating sheet 100 and the heat transfer to the flexible substrate F can be smoothly performed, And the adhesive chips 135 spread around the reinforcing member 165 to prevent the flexible substrate F from being contaminated by the adhesive chips 135. [

It is also possible to facilitate detachment and attachment of the adhesive sheet 100 with the flexible substrate F through the integrated adhesive sheet 100 and to prevent a part of the adhesive sheet 100 from remaining on the flexible substrate F or the hot plate have.

In addition, the entire work process for reinforcing the flexible substrate F is simplified, the working time is greatly reduced, the production amount can be maximized, and the amount of the adhesive chips 135 contained in the reinforcing material 165 The softened state can be safely controlled to protect the flexible substrate.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Modify or modify the Software.

F: flexible substrate F1: connection terminal 100: adhesive sheet
101: first release layer 102: second release layer 103: cushion layer
165: stiffener S1: preliminary curing step S2: main curing step
S3: finish hardening step S4: contact step S5: cutting step
S6: lay-up step S7: sheet removal step S8: inspection step
T1: first temperature T2: second temperature T3: third temperature
t1: first time t2: second time 10: preliminary curing unit
20: main curing unit 21: main body 22: opening
23: work buffer section 24: upper heat plate section 25: lower heat plate section
30: finish curing unit 40: connecting unit 50: cutting unit
60: Inspection unit 110: First protection unit mounting 111: First protection unit
113: first protection band 120: second protection protection unit 121: second protection protection unit
123: second protection band 130: adhesive winding section 131:
133: adhesive band 135: adhesive chip 140: reinforcing winding part
141: reinforcing supporting portion 143: reinforcing band 145: reinforcing chip
150: sticking part 160: punching part

Claims (10)

A thermosetting adhesive band is attached to a continuously supplied reinforcing band, a reinforcing chip cut at the same time as the reinforcing band and the adhesive band, and a bonding chip cut at the adhesive band and attached to the reinforcing chip A cutting step of obtaining a formed reinforcing material;
A stitching step of stacking the stiffener at a predetermined position of the flexible substrate so that the adhesive chip attached to the stiffening chip is attached to a predetermined position of the flexible substrate having the circuit built therein;
A plurality of flexible substrates are stacked so as to be spaced apart from each other in a state where the reinforcing material is stacked at a predetermined position of the flexible substrate through the step of bonding, and the flexible substrate and the reinforcing material A preliminary curing step of heating;
A plurality of flexible substrates and a laminating sheet which have been subjected to the preliminary curing step are alternately stacked so as to enclose the reinforcing material stacked on the flexible substrate having undergone the preliminary curing step, Up phase;
The soft substrate and the cigarette sheet alternately stacked after the layup step are disposed between the pair of heat plates, and a pair of heat plates press the soft substrate and the cigarette sheet, A main curing step of heating the flexible substrate, the reinforcing material and the cushioning sheet for a second temperature equal to or higher than the first temperature and 1/30 to 1/18 of the first time;
A sheet removing step of separating the cushioning sheet from the flexible substrate after the main curing step; And
A step of heating the flexible substrate and the reinforcing material to a third temperature equal to or higher than the second temperature and a second time greater than the first time after the sheet removing step to fix the reinforcing material to the flexible substrate, A curing step,
The above-
A cushion layer elastically deformed by the pressing in the main curing step;
A first release layer integrally fixed to one side of the cushion layer and thermally deformed by heating in the main curing step; And
And a second release layer integrally fixed to the other side of the cushion layer and being thermally deformed by heating in the main curing step,
Wherein the first release layer and the second release layer have the same material and thickness and are thermally deformed at a lower temperature than the adhesive chip. delete delete delete delete delete A thermosetting adhesive band is attached to a continuously supplied reinforcing band, a reinforcing chip cut at the same time as the reinforcing band and the adhesive band, and a bonding chip cut at the adhesive band and attached to the reinforcing chip A cutting unit for obtaining a formed reinforcing material;
A bonded unit for stacking the reinforcing member at a predetermined position of the flexible substrate so that the adhesive chip attached to the reinforcing chip is attached to a predetermined position of the flexible substrate having the circuit built therein;
A plurality of flexible substrates are stacked so as to be spaced apart from each other in a state where the reinforcing material is stacked at predetermined positions of the flexible substrate through the connecting unit, and the flexible substrate and the stiffener are stacked at a first temperature and a first time, A preliminary curing unit for heating;
The main body and a plurality of the flexible substrates and the adhesive sheets are alternately stacked so that a single sheet of the flexible substrate sandwiched by the preliminary curing unit is disposed between the main body and the adhesive sheet, Wherein the flexible substrate and the cushion sheet are alternately laminated and at least one opening portion into which the flexible sheet and the cushion sheet are inserted or discharged and the flexible substrate and the cushioning sheet which are alternately stacked and provided in the opening portion are pressed A main heating unit including an upper heating plate and a lower heating plate for heating the soft substrate, the reinforcing material, and the cushioning sheet for a second temperature equal to or higher than the first temperature and 1/30 to 1/18 of the first time, ; And
The flexible substrate and the reinforcing member, from which the cushioning sheet has been separated from the work buffer unit, through the main curing unit so that the reinforcing member is fixed to the flexible substrate, are heated to a third temperature equal to or higher than the second temperature, And a finish curing unit for heating the substrate for a second time greater than one hour,
The above-
A cushion layer elastically deformed by the pressure in the main curing unit;
A first release layer integrally fixed to one side of the cushion layer and thermally deformed by heating in the main curing unit; And
And a second release layer integrally fixed to the other side of the cushion layer and being thermally deformed by heating in the main curing unit,
Wherein the first release layer and the second release layer have the same material and thickness and are thermally deformed at a lower temperature than the adhesive chip. delete delete delete

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