KR101685917B1 - Apparatus for treating solder on pcb substrate - Google Patents

Apparatus for treating solder on pcb substrate Download PDF

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Publication number
KR101685917B1
KR101685917B1 KR1020150045652A KR20150045652A KR101685917B1 KR 101685917 B1 KR101685917 B1 KR 101685917B1 KR 1020150045652 A KR1020150045652 A KR 1020150045652A KR 20150045652 A KR20150045652 A KR 20150045652A KR 101685917 B1 KR101685917 B1 KR 101685917B1
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KR
South Korea
Prior art keywords
oil
pcb
pcb substrate
processing member
processing
Prior art date
Application number
KR1020150045652A
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Korean (ko)
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KR20160117844A (en
Inventor
이강
엄영환
Original Assignee
(주)화백엔지니어링
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Priority to KR1020150045652A priority Critical patent/KR101685917B1/en
Publication of KR20160117844A publication Critical patent/KR20160117844A/en
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Publication of KR101685917B1 publication Critical patent/KR101685917B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/16—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The PCB substrate solder processing apparatus according to the present invention includes an oil tank member for storing oil, a PCB substrate oil processing member for supplying oil from the oil tank member to the surface of the PCB for PCB, Wherein the oil tank member includes an oil circulation member for circulating oil between the oil tank member and the PCB substrate oil processing member, Wherein the PCB substrate processing member is configured to maintain the oil supplied from the oil tank member at a predetermined temperature, and the oil supplied from the oil tank member is supplied to the inside of the PCB substrate processing member, Is stored at a predetermined height, and the PCB substrate oil Li is characterized in that the nozzle for injecting the oil to the PCB surface mounting is introduced into the inner member.
According to the present invention, the flatness of the lead-free solder formed on the surface of the PCB can be made uniform.
Further, the thickness of the lead-free solder can be freely adjusted according to the required specifications.

Description

[0001] APPARATUS FOR TREATING SOLDER ON PCB SUBSTRATE [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a PCB solder processing apparatus, and more particularly, to a solder processing apparatus for processing a lead-free solder uniformly at a predetermined height by spraying oil heated at a predetermined temperature to a lead- .

A printed circuit board (PCB) is an electronic component in which a conductive circuit (copper foil) with good electrical conductivity is formed on an electrical insulator. The printed circuit board includes an active component, a passive component, Are electrically connected to each other to perform the function, and mechanically fix them.

PCBs are basically installed in home electronic products such as TVs, cameras, DVDs, refrigerators, and the like. In addition to computers, portable terminals, PDAs, and LCDs, It is a core part that is essential for high-density, high-density and high-density products.

Most of the electronic components currently used are attached to the printed circuit board. Various bonding methods have been proposed according to the mounting method. In the manufacturing process, frequently the defective portion is the bonding interface between the component and the PCB solder.

Recently, miniaturization and integration tendency of parts have been increasing, and therefore, a problem of reducing defects at the junction interface is important when assembling parts.

Such defects are caused by the problems of the surface treatment of the printed circuit board and the problem of the soldering technique. Especially, in the case of lead free (Pb free) solder, this problem becomes more serious.

The environmental regulations (ROHS) of electronic products have been applied since July 1, 2006, and the surface treatment of all printed circuit boards has been made lead-free, but compared to conventional (Sn / Pb) solder, soldering workability and reliability It shows a lot of problems.

Moreover, since the reliability of the printed circuit board for automobiles, which is an important issue, is also to be applied as of January 1, 2016, reliability of the solder joints due to such smelting has become an important issue.

Currently, the lead-free surface treatment that is applied to printed circuit boards includes gold plating called ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservative), HASL (Hot Air Solder Leveling) There is a problem that the reliability of the surface treatment is lowered compared with that of the flexible solder.

First, gold plating has problems such as black pad and Brittle Fracture. Replacement silver plating has problems such as discoloration and ECM (electro chemical migration), replacement tin plating is whisker problem, OSP is long term storage There is a problem with sex.

Also, the HASL surface treatment has a problem that the flatness of the solder becomes uneven.

SUMMARY OF THE INVENTION The present invention has been conceived to solve the problems as described above, and it is an object of the present invention to provide a method of manufacturing a semiconductor device, which is capable of uniformly forming a solder flatness by spraying oil heated at a predetermined temperature to a solder formed on a PCB substrate And to provide a PCB solder processing apparatus.

It is still another object of the present invention to provide a PCB substrate solder processing apparatus configured so that the thickness of the lead-free solder to be cut can be adjusted according to the specification.

According to another aspect of the present invention, there is provided a PCB solder processing apparatus including an oil tank member for storing oil, a PCB substrate processing unit for supplying oil from the oil tank member to the surface of the PCB, And an oil circulating member for circulating the oil between the oil tank member and the PCB substrate oil processing member, wherein the oil circulation member is disposed in the oil tank, Wherein the member is configured to heat the oil to be stored to a predetermined temperature, wherein the PCB substrate oil processing member is configured to maintain the oil supplied from the oil tank member at a predetermined temperature, The oil supplied from the tank member is stored at a predetermined height It said, is characterized in that the nozzle for injecting the fluid into the installation PCB surface are input into the PCB oil treatment member.

Preferably, an oil cooling member for cooling the gaseous oil and an oil collecting member for collecting the cooled oil are included.

Here, it may include a blower member for guiding the gaseous oil toward the oil cooling member.

In addition, a heater for heating the oil to a predetermined temperature is provided in the PCB substrate oil processing member, and an oil supply nozzle for spraying oil onto the surface of the PCB to be charged into the PCB substrate processing member, The oil supply nozzles may be installed on both sides of the PCB to be charged in the PCB.

Preferably, the oil supply nozzles provided on both sides in the PCB substrate oil processing member are installed at different heights.

Here, the oil supply nozzle may be installed in the upper portion of the heater within the PCB substrate processing member.

In addition, the oil supply nozzle is composed of two different kinds of nozzles, and a first oil supply nozzle for spraying the oil as a whole across the PCB substrate processing member is provided at a lower portion of the oil supply nozzle, And a plurality of second oil supply nozzles for spraying oil to predetermined areas of the PCB to be charged into the PCB processing oil processing member may be provided on the upper portion.

Here, the oil injection openings of the second oil supply nozzles may be installed at an angle slope predetermined from the horizontal direction.

Further, the oil cooling member is formed in the shape of a pipe, and the pipe may be formed of a double pipe, and the oil and the cooling water may be configured to flow into the pipe.

According to the present invention, the flatness of the lead-free solder formed on the surface of the PCB can be made uniform.

 Further, the thickness of the lead-free solder can be freely adjusted according to the required specifications.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
1 is a front perspective view of a PCB solder processing apparatus according to the present invention,
2 is a rear perspective view of the solder processing apparatus,
3 is a front perspective view of a PCB substrate oil processing member included in the processing apparatus,
4 is a rear perspective view of the oil treatment member,
5 is an internal cross-sectional view of the oil treatment member,
6 is a perspective view of an oil supply nozzle provided in the oil treatment member,
7 is a perspective view of the first oil supply nozzle,
8 is a sectional view and a front view of the second oil supply nozzle,
Fig. 9 is a perspective view of the PCB substrate transfer member,
10 is a perspective view of the oil cooling member and the oil collecting member,
11 is a sectional view of the oil cooling member.

Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.

Prior to this, the terms used in the specification and claims should not be construed in a dictionary sense, and the inventor may, on the principle that the concept of a term can be properly defined in order to explain its invention in the best way And should be construed in light of the meanings and concepts consistent with the technical idea of the present invention.

Therefore, the embodiments shown in the present specification and the drawings are only exemplary embodiments of the present invention, and not all of the technical ideas of the present invention are presented. Therefore, various equivalents It should be understood that water and variations may exist.

2 is a rear perspective view of the solder processing apparatus, FIG. 3 is a front perspective view of a PCB substrate oil processing member included in the processing apparatus, and FIG. 4 is a front perspective view of the solder processing apparatus of FIG. Fig. 6 is a perspective view of an oil supply nozzle provided in the oil treatment member, Fig. 7 is a perspective view of a first oil supply nozzle, and Fig. 10 is a perspective view of the oil cooling member and the oil collecting member, and Fig. 11 is a sectional view of the oil cooling member. Fig. 10 is a perspective view of the oil cooling member and the oil collecting member .

1 to 11, a PCB substrate solder processing apparatus according to the present invention includes an oil tank member 10 for storing oil, and an oil tank 10 for supplying oil from the oil tank member 10 to the surface of the PCB 200 (30) for feeding and discharging the PCB (200) to and from the inside and outside of the PCB labor-and-oil treating member (20), and an oil tank And an oil circulating member (40) for circulating oil between the member (10) and the PCB body oil treating member (20), the oil tank member (10) being configured to heat the stored oil to a predetermined temperature, The PCB substrate oil processing member 20 is configured to maintain the oil supplied from the oil tank member 10 at a predetermined temperature and the inside of the PCB substrate oil processing member 20 is provided with the oil tank member 10, The supplied oil is stored at a predetermined height and nozzles 124, 125, 126, and 127 for spraying oil onto the surface of the PCB to be charged into the PCB substrate processing member 20 are installed .

The oil tank member 10 has a structure for heating the oil to a predetermined temperature while storing oil therein, and a heater is installed inside the oil tank member 10.

The heater is controlled by a control unit (not shown), and is configured to hold the oil stored in the oil tank member 10 at a temperature of, for example, 260 ° C to 280 ° C.

As the oil to be stored and used in the oil tank member 10, petroleum-based or synthetic oil-based oil may be used.

The oil heated to the above temperature by the oil tank member 10 is supplied to the PCB substrate processing member 20 through the oil supply pipe 40.

The oil supplied to the PCB side oil treatment member 20 through the oil supply pipe 40 is supplied to the nozzles 124 and 125 provided on both sides of the PCB side oil treatment member 20 through the branch pipe 42 , 126 and 127, respectively.

At this time, the oil supplied from the oil tank member 10 to the oil treatment member 20 may be supplied at a pressure of approximately 5 to 10 kgf / cm 2.

A plurality of heaters 122 are provided along the height direction in the PCB substrate processing member 20 so as to maintain the oil supplied from the oil tank member 10 at a predetermined temperature.

A heater 122 installed inside the PCB substrate processing member 20 is also controlled by the control unit and a temperature sensor 26 is installed near the heater 122 to be heated by the heater 122 And is configured to sense the temperature of the oil.

The oil is maintained at a temperature of 250 ° C to 270 ° C and stored at a predetermined height 300 in the PCB substrate processing member 20, and the PCB substrate 200 is held by the PCB supporting member 30 And then discharged into the oil.

In addition, nozzles 124, 125, 126, and 127 for spraying oil onto the surface of the PCB 200 to be charged into the PCB substrate processing member 20 are installed in the PCB substrate processing member 20 .

The oil supply nozzles 124, 125, 126, and 127 are installed on both sides of the PCB 200 to be introduced into the PCB substrate processing member 20.

Two types of nozzles different from each other along the height direction may be disposed in the oil supply nozzles 124, 125, 126, and 127, and the lower and upper sides of the PCB substrate processing member 20 may be arranged in a direction First oil supply nozzles 126 and 127 for simultaneously injecting oil onto the entire surface of the PCB 200 are provided across the first oil supply nozzles 126 and 127, Nozzles 124 and 125 are provided.

The second oil supply nozzles 124 and 125 include a plurality of nozzles for injecting oil by a predetermined area with respect to the PCB 200 to be introduced into the PCB body oil processing member 20.

As shown in FIGS. 6 and 7, the first oil supply nozzles 126, 127 inject oil at the same time by a width W across the PCB substrate processing member 20 in the direction perpendicular to the paper surface of FIG. And an oil supply hole 126-3 for feeding oil from the oil supply pipe 48 to the oil injection hole 126-1 is formed at the rear of the oil supply hole 126-1 .

A buffer space 126-2 is formed between the oil supply hole 126-3 and the oil injection hole 126-1 so that oil from the oil supply hole 126-3 flows into the buffer space 126-3, And is then uniformly injected onto the surface of the PCB 200 through the oil injection port 126-1.

The second oil supply nozzles 124 and 125 receive the oil from the oil supply pipe 46 and inject the oil onto the PCB 200. The oil supply nozzles 125 and 125 are connected to the PCB 200, The oil is sprayed by a predetermined area width.

As shown in FIG. 8, the second oil supply nozzle 125 injects oil toward the oil injection port 125-1 formed at the front, and the oil injected through the oil injection port 125-1 is flat And is injected at an angle a1 of about 110 degrees.

In this case, as shown in FIG. 8 (b), in order to prevent the oil injected from the adjacent second oil supply nozzle 125 from overlapping on the PCB 200, the oil injection port 125 -1) is inclined by a predetermined angle a2 with respect to the horizontal direction.

Preferably, the oil jet opening 125-1 is installed to be inclined in a range of approximately 5 degrees to 10 degrees with respect to the horizontal direction.

Thus, when the PCB 200 is moved in the vertical direction within the PCB substrate processing member 20 by inclining the oil jet opening 125-1 as described above, So that the oil injected from the oil passage 125 is prevented from overlapping and being injected into a certain area.

The temperature of the solder is raised and melted during the immersion of the PCB 200 on which the solder is formed into the oil of the predetermined temperature stored in the PCB substrate oil processing member 20 so that the PCB 200 is taken out from the oil Lead-free solder that is protruded from the surface of the PCB 200 is shaved by spraying heated oil onto the lead-free solder in a molten state.

Here, the amount of the lead-free solder to be ground by the injected oil is determined by the time (the moving time of the PCB for the PCB) passing the PCB substrate 200 into the oil processing member 20 and the distance between the first and second oil supply nozzles 124 , 126). ≪ / RTI >

The first and second oil supply nozzles 124 and 126 are installed in the oil accommodated in the PCB substrate processing member 20, that is, in the region where the heater 122 is installed, The amount of lead-free solder to be soldered varies.

Accordingly, it is possible to adjust the pressure of the oil injected from the first and second oil supply nozzles 124 and 126 or the time for moving the PCB 200 to the inside of the PCB 200, The amount (thickness) of the lead-free solder to be cut can be adjusted depending on whether the first and second oil supply nozzles 124 and 126 are installed inside or outside the oil.

At this time, in order to prevent oil from being sprayed from both sides of the PCB to the lead-free solder formed in the through hole of the PCB substrate 200 and cutting out the lead-free solder, the PCB substrate processing member 20, The oil supply nozzles 124, 125, 126, and 127 installed on both sides in the inside are installed at different heights with a slight height difference.

That is, the left and right first oil supply nozzles 126 (126) are arranged so that the oil sprayed from the pair of the first oil supply nozzles 126, 127 facing each other is jetted at different heights relative to the PCB 200 And 127 are provided so as to have a minute height difference from each other.

The second oil supply nozzles 124 and 125 provided on both sides in the PCB substrate oil processing member 20 are also mounted on the PCB 200 in such a manner that the oil is sprayed to the PCBs 200 at different heights, Respectively.

An air injection nozzle 128 for injecting air onto the surface of the PCB 200 is provided on both sides of the second oil supply nozzles 124 and 125.

Thus, air is strongly jetted to the PCB 200 through the air injection nozzle 128, thereby dropping the oil remaining on the PCB 200 to the inside of the PCB member 20.

In addition, by injecting air heated to a predetermined temperature through the air injection nozzle 128, the heated air injected as described above functions as a kind of air curtain, It is possible to prevent the internal oil from being cooled.

The oil over the predetermined height 300 within the PCB substrate oil processing member 20 is recovered to the oil tank member 10 through the oil transfer pipe 40 through the drain box portion 24.

Further, the oil changed into the steam state flows into the oil cooling member 55 through the steam outlet 28 via the pipe.

At this time, a blower is installed inside the blower member 60 to introduce the steam-state oil into the oil-cooling member 55 side, so that the steam-state oil generated from the PCB substrate oil- And flows into the cooling member 55 side.

11, the oil cooling member 55 is formed in the form of a double tube composed of an inner tube 55-1 and an outer tube 55-2, and the outer tube 55-2 To cool the cooling water cooled to 5 ° C to 10 ° C and to flow the steamed oil through the inner pipe 55-1.

Thus, the oil in the vapor state is changed into the liquid phase while passing through the oil cooling member 55, and the oil thus changed into the liquid phase is collected into the oil collecting member 50.

The PCB 30 for feeding and discharging the PCB 200 to and from the PCB 30 includes a PCB 200 fixed to the PCB fixing jig 37, Thereby transferring the PCB 200 to the interior and the exterior of the PCB.

The PCB substrate transferring member 30 includes a jig rail 32 for guiding and conveying the fixing jig 37 in the vertical direction and a rail guide 34 for fixing the jig rail 32.

An arm 36 is connected to the fixing jig 37 and the arm 36 is installed on the upper and lower drive rails 38.

The arm 36 is vertically transferred by the drive cylinder 39 so that the PCB to be fixed 200 fixed to the fixing jig 37 is inserted into the PCB body oil treatment member 20 .

Here, the upward and downward movement speed of the arm 36 is also determined by the control of the controller, and can be appropriately adjusted according to the amount of lead-free solder to be cut.

While the present invention has been described with reference to the exemplary embodiments and the drawings, it is to be understood that the technical scope of the present invention is not limited to these embodiments and that various changes and modifications will be apparent to those skilled in the art. Various modifications and variations may be made without departing from the scope of the appended claims.

10: Oil tank member
20: PCB body oil processing member
30:
40: Oil circulation member
50: Oil collecting member
55: Oil cooling member
60: Blower member

Claims (9)

An oil tank member for storing the oil;
A PCB substrate processing member for receiving oil from the oil tank member and injecting oil onto a surface of the PCB substrate;
A substrate transferring member for transferring and inserting the PCB to / from the inside and outside of the PCB substrate processing member;
And an oil circulation member for circulating the oil between the oil tank member and the PCB substrate oil processing member,
Wherein the oil tank member is configured to heat the stored oil to a predetermined temperature,
Wherein the PCB substrate oil processing member is configured to maintain the oil supplied from the oil tank member at a predetermined temperature,
Wherein the oil supplied from the oil tank member is stored at a predetermined height within the PCB substrate processing member,
Wherein a nozzle for spraying oil onto the surface of the PCB to be charged into the PCB substrate oil processing member is provided. The method according to claim 1,
An oil cooling member connected to the steam outlet of the PCB substrate oil processing member through a pipe to cool the gaseous oil generated in the PCB substrate processing member; And an oil collecting member for collecting oil that has been cooled by the oil collecting member. 3. The method of claim 2,
And a blower member connected to the oil collecting member through a pipe to guide the gaseous oil generated in the PCB substrate oil treating member toward the oil cooling member. The method of claim 3,
A heater for heating the oil to a predetermined temperature and an oil supply nozzle for spraying oil onto the surface of the PCB to be charged into the PCB substrate processing member are provided in the PCB substrate processing member,
Wherein the oil supply nozzle is installed facing both sides of a PCB to be charged in the PCB substrate oil processing member. 5. The method of claim 4,
Wherein the oil supply nozzles provided on both sides in the PCB substrate oil processing member are installed at different heights. 6. The method of claim 5,
Wherein the oil supply nozzle is installed in an upper portion of the heater in the PCB substrate oil processing member. The method according to claim 6,
The oil supply nozzle is composed of two different kinds of nozzles,
A first oil supply nozzle for spraying the oil as a whole across the PCB substrate processing member,
And a plurality of second oil supply nozzles for spraying oil to a predetermined area of the PCB to be filled into the PCB processing oil treatment member are provided on the upper portion of the first oil supply nozzle. 8. The method of claim 7,
And the oil injection openings of the second oil supply nozzles are provided so as to be inclined at a predetermined angle from the horizontal direction. 9. The method of claim 8,
Wherein the oil cooling member is configured in the form of a tube,
Wherein the pipe is formed as a double pipe and the oil and the cooling water flow into the pipe.
KR1020150045652A 2015-03-31 2015-03-31 Apparatus for treating solder on pcb substrate KR101685917B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150045652A KR101685917B1 (en) 2015-03-31 2015-03-31 Apparatus for treating solder on pcb substrate

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Application Number Priority Date Filing Date Title
KR1020150045652A KR101685917B1 (en) 2015-03-31 2015-03-31 Apparatus for treating solder on pcb substrate

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KR20160117844A KR20160117844A (en) 2016-10-11
KR101685917B1 true KR101685917B1 (en) 2016-12-14

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Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02194690A (en) * 1989-01-24 1990-08-01 Toshiba Corp Solder coating device for printed board
JPH07241501A (en) * 1994-03-07 1995-09-19 Toshiba Corp Self-sucking type liquid-removing device for printed wiring board
JPH104259A (en) * 1996-06-17 1998-01-06 Tokuyama Corp Surplus solder stripper
JPH09107182A (en) * 1996-08-26 1997-04-22 Tokuyama Corp Removal method of excess solder

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