KR101683889B1 - Light emitting apparatus and manufacturing method of the same - Google Patents

Light emitting apparatus and manufacturing method of the same Download PDF

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Publication number
KR101683889B1
KR101683889B1 KR1020100028433A KR20100028433A KR101683889B1 KR 101683889 B1 KR101683889 B1 KR 101683889B1 KR 1020100028433 A KR1020100028433 A KR 1020100028433A KR 20100028433 A KR20100028433 A KR 20100028433A KR 101683889 B1 KR101683889 B1 KR 101683889B1
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KR
South Korea
Prior art keywords
light emitting
lens
emitting device
light
phosphor
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Application number
KR1020100028433A
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Korean (ko)
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KR20110108935A (en
Inventor
박주향
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020100028433A priority Critical patent/KR101683889B1/en
Publication of KR20110108935A publication Critical patent/KR20110108935A/en
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Publication of KR101683889B1 publication Critical patent/KR101683889B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The light emitting device includes: a body having a cavity; A light emitting element disposed in the cavity; A resin material disposed on the light emitting element and including a phosphor; A lens disposed on the resin material and including a phosphor included in the resin material; .

Description

TECHNICAL FIELD The present invention relates to a light emitting device and a manufacturing method thereof,

The embodiments relate to a light emitting device and a manufacturing method thereof.

Light emitting diodes (LEDs) are semiconductor light emitting devices that convert current into light. The wavelength of the light emitted from the LED varies depending on the semiconductor material used to fabricate the LED. This is because the wavelength of the emitted light depends on the band gap of the semiconductor material, which represents the energy difference between the valence band electrons and the conduction band electrons.

LEDs are used as a light source for display, a light source for automobile, and a light source for illumination because of improved brightness, and it is also possible to realize a light emitting device that emits white light with excellent efficiency by using fluorescent materials or combining LEDs of various colors.

Such an LED can be provided in the form of a light emitting device package, and a variety of ways to change the color rank of emitted light have been studied.

The embodiment provides a light emitting device and a method of manufacturing the same that can easily control the color rank rank of emitted light.

The light emitting device includes: a body having a cavity; A light emitting element disposed in the cavity; A resin material disposed on the light emitting element and including a phosphor; A lens disposed on the resin material and including a phosphor included in the resin material; .

A method of manufacturing a light emitting device according to an embodiment of the present invention includes: preparing a body provided with a cavity; Disposing a light emitting element in the cavity; Disposing a resin material containing a phosphor on the light emitting element; Disposing a lens including the phosphor contained in the resin material on the resin material; .

According to the light emitting device and the manufacturing method thereof according to the embodiment, there is an advantage that the color sense rank of emitted light can be easily controlled.

1 is a cross-sectional view illustrating a light emitting device according to an embodiment of the present invention.
2 is a cross-sectional view illustrating a light emitting device according to another embodiment of the present invention.
3 is a cross-sectional view illustrating a light emitting device according to another embodiment of the present invention.
4 is a flowchart illustrating a method of manufacturing a light emitting device according to an embodiment of the present invention.

In the description of the embodiments according to the present invention, each layer (film), region, pattern or structure is referred to as being "on" or "under" a substrate, each layer Quot; on "and " under" include both being formed "directly" or "indirectly" from being formed on another layer. In addition, the criteria for above or below each layer will be described with reference to the drawings.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

BRIEF DESCRIPTION OF THE DRAWINGS Fig.

1 is a cross-sectional view showing a light emitting device according to an embodiment.

1, a light emitting device according to an embodiment includes a body 110, a light emitting device 120, a resin 130, a lens 140, a first lead frame 151, a second lead frame 152, .

The body 110 may be formed of a resin material, a ceramic material, or a silicon material. The body 110 includes a cavity 115 and the light emitting device 120 is disposed in the cavity 115. The body 110 may be formed as a laminate structure by integrally injection molding or separately forming the upper part including the cavity 115 and the lower part supporting the upper part.

The first lead frame 151 and the second lead frame 152 are disposed inside the body 110. The cavity 115 has a predetermined depth on the inner side of the upper portion of the body 110. The cavity 115 may have a polygonal or circular surface shape, and the shape of the cavity 115 may be variously modified.

The first lead frame 151 and the second lead frame 152 may be exposed on the bottom surface of the cavity 115. The light emitting device 120 may be electrically connected to the first lead frame 151 and the second lead frame 152. For example, the light emitting device 120 may be connected to the first lead frame 151 by a first wire 161. The light emitting device 120 may be connected to the second lead frame 152 by a second wire 162. The light emitting device 120 may be electrically connected to the first lead frame 151 or the second lead frame 152 by die bonding or flip bonding. The first lead frame 151 and the second lead frame 152 may be exposed in the form of an electrode on the side surface of the body 110 or extended to a part of the back surface along the side surface of the body 110 .

At least one light emitting device 120 may be disposed in the cavity 115. For example, the light emitting device 120 may be formed of a compound semiconductor. The light emitting device 120 may be a light emitting diode. The light emitting device 120 may be an LED chip or a UV LED chip in a visible light region such as a blue LED chip, a red LED chip, and a green LED chip.

A resin material 130 containing a fluorescent material is disposed in the cavity 115. The resin material 130 may include silicon or an epoxy material, and may be transparently realized. The fluorescent material contained in the resin material 130 may be selected from a red fluorescent material, a green fluorescent material, a blue fluorescent material, a yellow fluorescent material, and the like.

Here, when the light to be emitted from the light emitting device is white, a phosphor emitting yellow light may be selected when the light emitting device 120 is a blue LED chip. The type of chip and the type of the phosphor may be changed according to the light to be emitted .

When the resin material 130 including the fluorescent material is molded on the light emitting device 120, the CIE color of the light emitting device 120 may vary depending on the light characteristics of the light emitting device 120 and the uniformity of the fluorescent material contained in the resin material 130. The light scattering in the coordinate system is determined. Accordingly, the color tone rank of light emitted through the resin material 130 is determined. At this time, due to problems such as the particle size and distribution of the phosphor, the color sense rank of light emitted through the resin material 130 is distributed over a relatively large area. On the other hand, the light emitting device deviating from the required color saturation rank can not be applied to products.

The light emitting device according to the embodiment provides a way to control the color saturation rank of the light emitted by disposing the lens 140 on the resin 130. In selecting the phosphor to be included in the lens 140, it may be implemented by selecting the same phosphor as the phosphor included in the resin 130. That is, the embodiment suggests a method of rank-shifting the color saturation rank of the light emitted through the adjustment of the phosphor amount.

The phosphor included in the lens 140 may be formed on the surface of the lens 140. The phosphor may be formed on an outer surface of the lens 140 or may be formed on an inner surface thereof. Further, the phosphor may be distributed over the entire volume constituting the lens 140. The lens 140 may be formed in a convex lens shape, and its shape may be variously modified.

Accordingly, the light emitted from the light emitting device 120 may be transmitted through the resin 130 and the lens 140, for example, and white light may be emitted. At this time, it is assumed that light emitted from the light emitting element 120 is transmitted through the resin 130 including the phosphor, and light having a color rank of A rank is emitted. According to the embodiment, the light having the color rank A can be transmitted through the lens 140 including the phosphor, and the light having the color rank B rank can be emitted. That is, the lens 140 including the phosphor transmits the resin material 130 and emits the light by changing the color sense rank of the incident light. Here, the phosphor included in the lens 140 and the phosphor included in the resin 130 are selected as the same phosphor. Thus, according to the embodiment, a desired color rank can be easily controlled.

If it is necessary to satisfy at least the color saturation of B rank in order to be applied to a product, the light emitting device package that emits light with the A rank color tone can not be applied to the product. Here, the light emitting device package includes a light emitting element and a resin material. According to the embodiment, by using the lens 140 including the phosphor, the light of the A rank color is converted into the light of the B rank color, so that the light emitting device package that emits the B rank light is not discarded, It will be possible.

Also, according to the embodiment, the lens 140 may be formed into a convex lens shape. Accordingly, the lens 140 can improve the directivity angle and luminance characteristic of the emitted light.

2 is a cross-sectional view illustrating a light emitting device according to another embodiment.

2, the light emitting device according to the embodiment includes a body 210, a light emitting element 220, a resin material 230, a lens 240, a first lead frame 251, a second lead frame 252, .

The body 210 may be formed of a resin material, a ceramic material, or a silicon material. The body 210 includes a cavity 215 and the light emitting device 220 is disposed in the cavity 215. The body 210 may be formed as a laminate structure by integrally injection molding or separately forming the upper part including the cavity 215 and the lower part supporting the upper part.

The first lead frame 251 and the second lead frame 252 are disposed inside the body 210. The cavity 215 having a predetermined depth is formed inside the upper part of the body 210. The cavity 215 may have a polygonal or circular surface shape, and the shape of the cavity 215 may be variously modified.

The first lead frame 251 and the second lead frame 252 may be exposed on the bottom surface of the cavity 215. The light emitting device 220 may be electrically connected to the first lead frame 251 and the second lead frame 252. For example, the light emitting device 220 may be connected to the first lead frame 251 by a first wire 261. The light emitting device 220 may be connected to the second lead frame 252 by a second wire 262. The light emitting device 220 may be electrically connected to the first lead frame 251 or the second lead frame 252 by die bonding or flip bonding. The first lead frame 251 and the second lead frame 252 may be exposed in the form of an electrode on the side of the body 210 or extended to a portion of the back side along the side of the body 210 .

At least one light emitting device 220 may be disposed in the cavity 215. For example, the light emitting device 220 may be formed of a compound semiconductor. The light emitting device 220 may be a light emitting diode. The light emitting device 220 may be an LED chip or a UV LED chip in a visible light region such as a blue LED chip, a red LED chip, or a green LED chip.

A resin material 230 including a fluorescent material is disposed in the cavity 215. The resin material 230 may include silicon or an epoxy material, and may be transparently realized. The fluorescent material contained in the resin material 230 may be selected from a red fluorescent material, a green fluorescent material, a blue fluorescent material, a yellow fluorescent material, and the like.

Here, when the light to be emitted from the light emitting device is white, a phosphor emitting yellow light may be selected when the light emitting device 220 is a blue LED chip. The type of chip and the type of the phosphor may be changed according to the light to be emitted .

When the resin material 230 including the phosphor is molded on the light emitting device 220, the CIE color of the light emitting device 220 and the uniformity of the fluorescent material contained in the resin material 230 are changed. The light scattering in the coordinate system is determined. Accordingly, the color tone rank of light emitted through the resin material 230 is determined. At this time, due to problems such as particle size and distribution of the phosphor, the color sense rank of light emitted through the resin material 230 is distributed over a relatively wide area. On the other hand, the light emitting device deviating from the required color saturation rank can not be applied to products.

The light emitting device according to the embodiment provides a method of controlling the color tone rank of light emitted by disposing the lens 240 on the resin material 230. This can be implemented by selecting the phosphor to be included in the lens 240 so that it includes the same phosphor as the phosphor contained in the resin 230. That is, the embodiment suggests a method of rank-shifting the color saturation rank of the light emitted through the adjustment of the phosphor amount.

The phosphor may be distributed over the entire volume of the lens 240. The lens 240 may be implemented in a planar shape. When the lens 240 is implemented as a flat surface, the thickness of the phosphor included in the lens 240 can be more easily controlled by controlling the thickness of the lens 240. Accordingly, in controlling the color tone rank of the emitted light, it is possible to more easily control the desired color tone rank through the control of the amount of the phosphor.

Accordingly, the light emitted from the light emitting device 220 may be transmitted through the resin 230 and the lens 240, for example, and white light may be emitted. At this time, it is assumed that light emitted from the light emitting device 220 is transmitted through the resin material 230 containing the phosphor, for example, light having an A rank color tone is emitted. According to the embodiment, the light having the color rank A can be transmitted through the lens 240 including the phosphor, so that the light having the B rank color can be emitted. In other words, the lens 240 including the phosphor transmits the resin material 230 to emit light by changing the color sense rank of the incident light. Here, the phosphor included in the lens 240 and the phosphor included in the resin 230 are selected as the same phosphor. Thus, according to the embodiment, a desired color rank can be easily controlled.

If it is necessary to satisfy at least the color saturation of B rank in order to be applied to a product, the light emitting device package that emits light with the A rank color tone can not be applied to the product. Here, the light emitting device package includes a light emitting element and a resin material. According to the embodiment, by using the lens 240 including the phosphor, the light of the A rank color is converted into the light of the B rank color, so that the light emitting device package that emits the B rank light is not discarded, It will be possible.

3 is a cross-sectional view illustrating a light emitting device according to another embodiment.

3, the light emitting device according to the embodiment includes a body 310, a light emitting element 320, a resin material 330, a lens 340, a first lead frame 351, a second lead frame 352, .

The body 310 may be formed of a resin material, a ceramic material, or a silicon material. The body 310 includes a cavity 315 and the light emitting device 320 is disposed in the cavity 315. The body 310 may be formed as a laminate structure by integrally injection molding or separately forming an upper portion including the cavity 315 and a lower portion supporting the upper portion.

The first lead frame 351 and the second lead frame 352 are disposed inside the body 310. The cavity 315 having a predetermined depth is formed inside the upper portion of the body 310. The cavity 315 may have a polygonal or circular surface shape, and the shape of the cavity 315 may be variously modified.

The first lead frame 351 and the second lead frame 352 may be exposed on the bottom surface of the cavity 315. The light emitting device 320 may be electrically connected to the first lead frame 351 and the second lead frame 352. For example, the light emitting device 320 may be connected to the first lead frame 351 by a first wire 361. The light emitting device 320 may be connected to the second lead frame 352 by a second wire 362. The light emitting device 320 may be electrically connected to the first lead frame 351 or the second lead frame 352 by die bonding or flip bonding. The first lead frame 351 and the second lead frame 352 may be exposed in the form of an electrode on the side surface of the body 310 or extended to a part of the back surface along the side surface of the body 310 .

At least one light emitting device 320 may be disposed in the cavity 315. For example, the light emitting device 320 may be formed of a compound semiconductor. The light emitting device 320 may be a light emitting diode. The light emitting device 320 may be an LED chip or a UV LED chip in a visible light region such as a blue LED chip, a red LED chip, and a green LED chip.

A resin material 330 including a phosphor is disposed in the cavity 315. The resin material 330 may include silicon or an epoxy material, and may be implemented in a transparent manner. The fluorescent material contained in the resin material 330 may be selected from a red fluorescent material, a green fluorescent material, a blue fluorescent material, a yellow fluorescent material, and the like.

Here, when the light to be emitted from the light emitting device is white, the phosphor emitting yellow light may be selected when the light emitting device 320 is a blue LED chip. The type of chip and the type of the phosphor may be changed according to the light to be emitted .

When the resin material 330 containing the phosphor is molded on the light emitting device 320, the CIE color of the light emitting device 320 may be changed according to the light characteristics of the light emitting device 320 and the uniformity of the phosphor included in the resin material 330. [ The light scattering in the coordinate system is determined. Thus, the color tone rank of light emitted through the resin material 330 is determined. At this time, due to problems such as particle size and distribution of the phosphor, the color sensation rank of light emitted through the resin material 330 is distributed over a relatively large area. On the other hand, the light emitting device deviating from the required color saturation rank can not be applied to products.

The light emitting device according to the embodiment provides a way to control the color saturation rank of light emitted by disposing the lens 340 on the resin 330. This can be implemented by selecting the phosphor to be included in the lens 340 so that it includes the same phosphor as the phosphor contained in the resin 330.

The lens 340 may be formed in a planar shape. The phosphor may be formed on the surface of the lens 340. 3 shows a case where the phosphor layer 341 is formed on the outer surface of the lens 340. In FIG. However, the phosphor may be formed on the inner surface of the lens 340.

The thickness of the phosphor layer 341 can be more easily controlled when the lens 340 is implemented as a plane and the phosphor layer 341 is formed on the surface of the lens 340 as described above . Accordingly, in controlling the color tone rank of emitted light, the desired color tone rank can be more easily controlled by controlling the amount of the phosphor through the thickness control of the phosphor layer 341.

Accordingly, the light emitted from the light emitting device 320 can be emitted as white light while passing through the resin layer 330 and the phosphor layer 341 formed on the lens 340, for example. At this time, it is assumed that light emitted from the light emitting device 320 is transmitted through the resin material 330 containing the phosphor, for example, light having an A rank color tone is emitted. According to the embodiment, the light having color saturation of the A rank can be emitted through the lens 340 having the phosphor layer 341 formed thereon and having color B rank. That is, the lens 340 on which the phosphor layer 341 is formed transmits the resin material 330 and emits the light by changing the color sense rank of the incident light. Here, the phosphor layer 341 is formed of the same phosphor as the phosphor included in the resin material 330. Thus, according to the embodiment, a desired color rank can be easily controlled.

If it is necessary to satisfy at least the color saturation of B rank in order to be applied to a product, the light emitting device package that emits light with the A rank color tone can not be applied to the product. Here, the light emitting device package includes a light emitting element and a resin material. According to the embodiment, by using the lens 340 in which the phosphor layer 341 is formed, the light of the A rank color tone is converted into the light of the B rank color tone, so that the light emitting device package which emits the B rank light can be additionally So that it can be applied to products.

4 is a flowchart showing a method of manufacturing a light emitting device according to an embodiment.

1 and 4, a method of manufacturing a light emitting device according to an embodiment of the present invention includes preparing a body 110 having a cavity 115 at step S401, and arranging the light emitting device 120 in the cavity 115 (S403).

The body 110 may be formed as a laminate structure by integrally injection molding or separately forming the upper part including the cavity 115 and the lower part supporting the upper part.

At least one light emitting device 120 may be disposed in the cavity 115. For example, the light emitting device 120 may be formed of a compound semiconductor. The light emitting device 120 may be a light emitting diode. The light emitting device 120 may be an LED chip or a UV LED chip in a visible light region such as a blue LED chip, a red LED chip, and a green LED chip.

A resin 130 containing a phosphor is disposed on the light emitting device 120 (S405).

The resin material 130 may include silicon or an epoxy material, and may be transparently realized. The fluorescent material contained in the resin material 130 may be selected from a red fluorescent material, a green fluorescent material, a blue fluorescent material, a yellow fluorescent material, and the like.

Here, when the light to be emitted from the light emitting device is white, a phosphor emitting yellow light may be selected when the light emitting device 120 is a blue LED chip. The type of chip and the type of the phosphor may be changed according to the light to be emitted .

When the resin material 130 including the fluorescent material is molded on the light emitting device 120, the CIE color of the light emitting device 120 may vary depending on the light characteristics of the light emitting device 120 and the uniformity of the fluorescent material contained in the resin material 130. The light scattering in the coordinate system is determined. Accordingly, the color tone rank of light emitted through the resin material 130 is determined. At this time, due to problems such as the particle size and distribution of the phosphor, the color sense rank of light emitted through the resin material 130 is distributed over a relatively large area. On the other hand, the light emitting device deviating from the required color saturation rank can not be applied to products.

Next, a lens 140 including a phosphor included in the resin material 130 is disposed on the resin material 130 (S407).

The phosphor included in the lens 140 may be formed on the surface of the lens 140. The phosphor may be formed on an outer surface of the lens 140 or may be formed on an inner surface thereof. Further, the phosphor may be distributed over the entire volume constituting the lens 140.

Accordingly, the light emitted from the light emitting device 120 may be transmitted through the resin 130 and the lens 140, for example, and white light may be emitted. At this time, it is assumed that light emitted from the light emitting element 120 is transmitted through the resin 130 including the phosphor, and light having a color rank of A rank is emitted. According to the embodiment, the light having the color rank A can be transmitted through the lens 140 including the phosphor, and the light having the color rank B rank can be emitted. That is, the lens 140 including the phosphor emits a color shift rank of the incident light transmitted through the resin 130 and shifts the color rank. Here, the phosphor included in the lens 140 and the phosphor included in the resin 130 are selected as the same phosphor. Thus, according to the embodiment, a desired color rank can be easily controlled.

If it is necessary to satisfy at least the color saturation of B rank in order to be applied to a product, the light emitting device package that emits light with the A rank color tone can not be applied to the product. Here, the light emitting device package includes a light emitting element and a resin material. According to the embodiment, by using the lens 140 including the phosphor, the light of the A rank color is converted into the light of the B rank color, so that the light emitting device package that emits the B rank light is not discarded, It will be possible.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

110, 210, 310 ... body
115, 215, 315 ... cavity
120, 220, 320, ...,
130, 230, 330 ... resin
140, 240, 340 ... lenses
151, 251, 351 ... first lead frame
152, 252, 352 ... second lead frame
161, 261, 361 ... first wire
162, 262, 362 ... second wire

Claims (12)

A body having a cavity;
A light emitting element disposed in the cavity;
A resin material disposed on the light emitting element and including a phosphor;
And a lens disposed on the resin material,
Wherein the lens includes the same fluorescent material as the fluorescent material contained in the resin material. The light emitting device according to claim 1, wherein the lens is a convex lens. The light emitting device according to claim 1, wherein the lens is planar. The light emitting device according to claim 1, wherein the phosphor included in the lens is disposed on a surface of the lens. The light emitting device according to claim 1, wherein the phosphor included in the lens is distributed over the entire volume of the lens. The light emitting device according to claim 1, wherein light emitted from the light emitting element is emitted as white light while transmitting the resin material and the lens. The light emitting device according to claim 1, wherein the lens including the phosphor transmits the resin material to emit light by changing the color sense rank of the incident light. Preparing a body provided with a cavity;
Disposing a light emitting element in the cavity;
Disposing a resin material containing a phosphor on the light emitting element;
Disposing a lens including the phosphor contained in the resin material on the resin material;
Lt; / RTI >
Wherein the lens comprises the same fluorescent material as the fluorescent material contained in the resin material. The method according to claim 1,
And a lead frame is exposed on a bottom surface of the cavity. 10. The method of claim 9,
Wherein the light emitting element is electrically connected to the lead frame by a wire. The method according to claim 1,
And a lead frame extending along the side surface of the body. The method of claim 3,
And controlling the thickness of the phosphor to control the thickness of the phosphor included in the lens.
KR1020100028433A 2010-03-30 2010-03-30 Light emitting apparatus and manufacturing method of the same KR101683889B1 (en)

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KR102051616B1 (en) * 2017-08-21 2019-12-03 주식회사 옵티맥 Light emitting diode package

Citations (1)

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JP2006202962A (en) * 2005-01-20 2006-08-03 Toyoda Gosei Co Ltd Light emitting apparatus

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Publication number Priority date Publication date Assignee Title
KR100616413B1 (en) * 2004-05-22 2006-08-29 서울반도체 주식회사 Light emitting diode and method of manufacturing the same
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JP2006202962A (en) * 2005-01-20 2006-08-03 Toyoda Gosei Co Ltd Light emitting apparatus

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