KR101683250B1

KR101683250B1 - A Structure of Bushing and PCB plate for EarMic unit Mounted in the Earphone Cable

Info

Publication number: KR101683250B1
Application number: KR1020150097953A
Authority: KR
Inventors: 강주형; 최상수; 이영재; 류승남; 박종선
Original assignee: 주식회사 알머스
Priority date: 2015-07-09
Filing date: 2015-07-09
Publication date: 2016-12-08

Abstract

The present invention relates to a bushing structure for a PCB substrate of an earphone microphone unit mounted on an earphone cable. According to the present invention, the bushing structure for a PCB substrate of an earphone microphone unit mounted on an earphone cable includes: a housing formed between earphone cables with multiple wires comprising an earphone microphone line and a right ear speaker line inside; an earphone microphone PCB substrate mounted on the inner side of the housing in the longitudinal direction; and a bushing unit formed at one or more among both ends of the housing and protecting insulated coating of the wire passing through an inner hollow hole. The multiple wires forming the earphone microphone line at the end on one side in the longitudinal direction is connected to the earphone microphone PCB substrate in a terminal contact point structure of a soldering method, and the multiple wires forming the right earphone speaker line is arranged at the edge by being formed in a shield cable form. Therefore, the present invention provides a bushing structure and a structure of a PCB substrate for minimizing soldering of earphone microphone unit mounted on earphone cable and bushing structure for same, which can prevent a terminal connection part of a signal line and a ground wire, mounted on the PCB substrate of the earphone microphone unit in the soldering method, from being easily cut by providing the structure of the PCB substrate, which minimizes a contact point of the soldering method, and the bushing structure of separating the multiple signal lines forming the earphone microphone line by a partition.

Description

[0001] 1. Field of the Invention [0002] The present invention relates to a PCB structure and a bushing structure for mounting an earphone,

The present invention relates to a PCB substrate structure and a bushing structure minimizing soldering of an ear microphone unit mounted on an earphone cable, and more particularly, to a bushing structure separating a plurality of signal lines constituting an ear microphone line into barrier ribs, To minimize the soldering of the ear microphone portion that can prevent the terminal connection portions of the signal line and the ground line mounted on the ear microphone substrate from being easily soldered on the PCB substrate, and to a PCB substrate structure and a bushing structure .

Generally, the earphone assembly is an accessory of a portable electronic device for connection to a portable electronic device, such as a radio receiver, a PMP, an MP3, a tape player, a CD player, a DMB, / RTI >

Recently, with the addition of an MP3 player function of a mobile phone and a terrestrial or satellite DMB function and a variety of multimedia services provided through data communication, a user can enjoy multimedia broadcasting as well as radio broadcasting and television broadcasting through a mobile phone while moving.

The earphone cable was also developed as a 3-wire cable for transferring a stereo audio signal from 2 wires transmitting a mono audio signal and a 3-wire cable for exchanging control signals.

In addition, such an earphone assembly requires a control module having a built-in earphone to transmit a voice of a user to the other party when the mobile phone is used in a mobile phone.

FIG. 1 is a schematic structural view of an earphone assembly according to the prior art, and FIG. 2 is a cross-sectional view schematically illustrating a bushing structure for an ear microphone PCB according to the prior art.

As shown in the figure, an earphone assembly according to the prior art may include an earphone jack 101, a left ear ear 102, a right ear ear 103, a branch 104, and a control module 110 .

As shown in the figure, the earphone assembly according to the related art includes a microphone line 131 and a right ear ear speaker line 132 on one side in the longitudinal direction on an ear microphone PCB substrate 120 provided in the control module 110, A signal line 132 and a ground line 133 constituting the right ear speaker line are connected to the terminal edge structure of the solder type terminal contact structure Respectively.

At this time, in order to prevent the insulation of the electric wire from being hurt when the signal line and the ground line are drawn in and out, a connection portion between the earphone cable 1 and the control module 110 requires a bushing portion 130 Respectively.

Meanwhile, since the earphone assembly according to the related art is connected to the ear microphone PCB board 120 by the soldering method, there is a problem that the terminal contact portion of the soldering method is easily finished when the earphone cable 1 is pulled.

In order to prevent this, the bushing structure of the earphone assembly according to the prior art has a structure in which a signal wire and a ground wire located inside the bushing 130 are knotted to pull out the earphone cable 1, To increase the tensile force on the contact point.

However, since the signal line and the ground line embedded in the earphone cable 1 are simultaneously connected to the ear microphone PCB 120 through the single hollow hole formed at the center of the bushing 140, the earphone cable 1 The pulling force is transmitted as it is, and there is a limitation in preventing disconnection of the terminal contact portion of the signal line and the grounding line, and there is a problem that the product is defective.

Accordingly, there is an urgent need for a practical and applicable technology capable of preventing breakage of the terminal contact portion on the earphone cable PCB mounted on the earphone cable, as well as solving various problems occurring in the soldering process.

Patent Registration No. KR 10-11336540 (Notification date Apr. 10, 2012)

SUMMARY OF THE INVENTION The present invention has been conceived to solve the above problems, and it is an object of the present invention to provide a bushing structure separating a plurality of signal lines constituting a microphone line into barrier ribs, The present invention provides a bushing structure for an earphone PCB substrate, which is mounted on an earphone cable, which can prevent a terminal connection portion of a ground wire from being easily broken and reduce a soldering process.

A bushing structure for an earphone circuit board mounted on an earphone cable according to an embodiment of the present invention includes: a housing formed between an earphone cable including therein a plurality of wires constituting a microphone wire and a right ear spring wire; An ear microphone PCB disposed in the longitudinal direction of the housing; And a bushing portion formed at one or more ends of both ends of the housing to protect an insulation coating of a wire passing through the inner hollow hole, wherein the ear microphone PCB substrate has a microphone line And the plurality of wires constituting the right ear speaker wire are formed in the shape of a shield cable and can be disposed at the edge.

The bushing portion is formed to cross the diameter of the hollow hole of the bushing portion so that the core wire knotted portion can be caught when the wires that are mounted on the earphone PCB substrate among the wires passing through the bushing portion are brazed to each other. And a barrier rib separating the plurality of wires from each other.

The ear microphone PCB substrate may include a clip member for fixing the right ear speaker wire disposed at the edge in the form of the shield cable.

The right ear ear speaker wire may be integrally joined to the core wire knot part when the wires mounted on the earphone PCB substrate by soldering method are mutually twisted.

Minimizing Soldering of the Ear Microphone Unit Mounted on the Earphone Cable According to the Embodiment of the Present Invention The PCB board structure includes a housing formed between an earphone cable including a microphone wire and a plurality of wires constituting a right ear ear splicing wire, An ear microphone PCB disposed in the longitudinal direction of the housing; And a bushing portion formed at one or more ends of both ends of the housing to protect an insulation coating of a wire passing through the inner hollow hole, wherein the ear microphone PCB substrate has a microphone line And a plurality of wires constituting a right ear speaker wire are formed in the form of a shield cable and disposed on the edge, and the right ear ear speaker wire And a clip member for fixing the clip.

As described above, the present invention provides a bushing structure for separating a plurality of signal lines constituting a microphone line into barrier ribs, thereby providing a tensile force for supporting a signal line and a ground line mounted on the ear microphone PCB by brazing So that it is possible to prevent the terminal connection portion from being easily broken, thereby preventing the occurrence of defective products.

Further, in order to minimize the terminal structure of the signal line and the ground line mounted on the ear microphone PCB substrate on the ear microphone PCB substrate, the right ear loudspeaker line is formed of a shield cable which surrounds the signal line around the signal line, .

In addition, the present invention is characterized in that a clipping member for fixing a right ear speaker wire formed by a shield cable to one side of an ear microphone PCB substrate provided in the control module is provided, and a signal wire and a ground wire, It is possible to further enhance the tensile force for the above-mentioned pulling force.

1 is a schematic diagram of an earphone assembly according to the prior art;
2 is a cross-sectional view schematically illustrating a bushing structure for an ear microphone PCB according to the prior art;
3 is a cross-sectional view schematically illustrating a bushing structure for an ear microphone PCB according to an embodiment of the present invention.
4 is a detailed perspective view for explaining the bushing structure shown in FIG. 3 in detail;
5 is a schematic view for explaining a core wire knot of a bushing structure according to an embodiment of the present invention.
6 is a cross-sectional view schematically illustrating a bushing structure for an ear microphone PCB according to another embodiment of the present invention

The description of the present invention is merely an example for structural or functional explanation, and the scope of the present invention should not be construed as being limited by the embodiments described in the text. That is, the embodiments are to be construed as being variously embodied and having various forms, so that the scope of the present invention should be understood to include equivalents capable of realizing technical ideas.

Meanwhile, the meaning of the terms described in the present invention should be understood as follows.

The terms "first "," second ", and the like are intended to distinguish one element from another, and the scope of the right should not be limited by these terms. For example, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" to another element, it may be directly connected to the other element, but there may be other elements in between. On the other hand, when an element is referred to as being "directly connected" to another element, it should be understood that there are no other elements in between. On the other hand, other expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

It should be understood that the singular " include "or" have "are to be construed as including a stated feature, number, step, operation, component, It is to be understood that the combination is intended to specify that it does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

In each step, the identification code (e.g., a, b, c, etc.) is used for convenience of explanation, the identification code does not describe the order of each step, Unless otherwise stated, it may occur differently from the stated order. That is, each step may occur in the same order as described, may be performed substantially concurrently, or may be performed in reverse order.

All terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used predefined terms should be interpreted to be consistent with the meanings in the context of the related art and can not be interpreted as having ideal or overly formal meaning unless explicitly defined in the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 3 is a cross-sectional view schematically illustrating a bushing structure for an ear microphone PCB according to an embodiment of the present invention, and FIG. 4 is a detailed perspective view for explaining the bushing structure shown in FIG.

As shown in the figure, a bushing structure for an earphone PCB substrate mounted on an earphone cable according to an embodiment of the present invention includes a housing 10, a PCB substrate 20, a bushing 30, .

More specifically, the housing 10 can be formed between the earphone cable 1 including a plurality of wires constituting the microphone wire 50 and the right ear wire 60.

Here, the earphone cable 1 has a base portion 104 positioned between the left ear ear speaker 102 and the right ear ear 103 shown in FIG. 1, May indicate a cable located between the earphone jack 101 and the branched portion 104 or located on the right ear ear speaker 103 side.

Although not shown in the embodiment of the present invention, the earphone cable 1 may include a control module including a call-on-off switch and a volume up / down controller, It is possible to mount or separate structures.

As shown in the drawing, the ear microphone PCB substrate 20 may be disposed in the longitudinal direction within the housing 10 described above. At this time, the bushing unit 30 may be mounted on the housing 10, At one or more ends of the opposite side ends of the inner hollow hole 10 to protect the insulation coating of the wire passing through the inner hollow hole.

The bushing structure according to the embodiment of the present invention is characterized in that, when wires to be mounted on the ear microphone PCB substrate 20 among the wires passing through the bushing 30 are braided to each other, As shown in FIG. 1, the partition wall 40 may be formed across the diameter of the hollow hole 31 of the bushing 30 to separate the plurality of wires so that the core wire is knotted.

Also, as in the embodiment of the present invention, the ear microphone PCB substrate 20 has a plurality of wires constituting the microphone line 50 connected to one end in the longitudinal direction thereof by a terminal contact structure of a soldering type, A plurality of wires constituting the ear speaker line 60 may be formed in the shape of a shield cable and disposed at the edges.

That is, the ear microphone PCB substrate 20 constituting the bushing structure according to the embodiment of the present invention has a contact structure of a three-wire soldering method unlike the contact structure of the five-wire soldering method of FIG. 1 according to the related art, It is possible to reduce the possibility of disconnection of the contact portion. This is made possible by forming the speaker wire on the right side by a shield cable method in which the ground wire surrounds the signal wire.

5 is a schematic view for explaining a core wire knot of a bushing structure according to an embodiment of the present invention.

As shown in the drawing, the wires 51 and 52 corresponding to the signal line and the ground line constituting the ear microphone line 50, which is disposed inside the bushing 30 and whose ends are mounted on the ear microphone PCB 20, The core wire may be knotted.

At this time, although the right ear ear speaker line is not shown in detail in the drawing, the wires mounted on the ear microphone PCB 20 by brazing may be integrally joined to the same core wire knot portion as the portion where the wires are mutually twisted So that even if the earphone cable 1 is pulled, a tensile force can be ensured that the core wire knot portion can be caught by the part of the partition wall 40 described above.

6 is a cross-sectional view schematically illustrating a bushing structure for an ear microphone PCB according to another embodiment of the present invention.

As shown in the drawings, the bushing structure for an ear microphone PCB according to another embodiment of the present invention includes a right ear speaker disposed on the edge in shielded cable form on the ear microphone PCB described above with reference to Figs. 3 to 5, A clip member 70 for fixing the wire 60 may be additionally provided to improve the tensile force.

As described above, the present invention provides a bushing structure for separating a plurality of signal lines constituting a microphone line into barrier ribs, thereby improving the tensile force for supporting signal lines and ground lines mounted on the ear microphone PCB by soldering It is possible to prevent the terminal connecting portion from being easily broken, thereby preventing the occurrence of defective products.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, It is within the scope of the present invention that component changes to such an extent that they can be coped evenly within a range that does not deviate from the scope of the present invention.

1: earphone cable 10: housing
20: PCB board 30: Bushing part
31: hollow hole 40: partition wall
50: Ear microphone line 51, 52: Wire
60: right ear ear speaker line 70: clip member
101: Earphone jack 102: Left ear speaker
103: Right ear ear speaker 104:
110: Control module 120: PCB for ear microphone
131: Ear microphone line 132: Right ear ear speaker line
133: ground wire 140: bushing part

Claims

A housing formed between the earphone cable including a plurality of wires constituting a microphone wire and a right ear ear splicing wire therein;
An ear microphone PCB disposed in the longitudinal direction of the housing; And
And a bushing portion formed at one or more ends of both ends of the housing to protect the insulation coating of the wire passing through the inner hollow hole,
In the ear microphone PCB substrate,
A plurality of wires constituting a microphone line are connected to one end in the longitudinal direction by a terminal contact structure of a soldering method,
A plurality of wires constituting a right ear ear speaker line are formed in the form of a shield cable in which a ground wire is wrapped around a signal wire,
And a clip member for fixing the right ear ear speaker wire arranged at the edge in the form of the shield cable.

The bushing according to claim 1,
Wherein a plurality of wires passing through the bushing portion are formed to cross the diameter of a hollow hole of the bushing portion so that the wires to be mounted on the earphone PCB substrate by soldering method are knotted to each other, And a partition wall for separating the wires from each other.

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2. The ear speaker according to claim 1,
Wherein when the wires to be mounted on the ear microphone PCB are braided to each other, core wire is knotted integrally with the same core wire knot portion.

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