KR101680293B1 - Apparatus and method for detecting component in gas - Google Patents

Abstract

The present invention relates to a gas detection apparatus comprising a gas supply section in which a passage through which gas flows is formed, a gas containing section formed with a gas inspecting space communicating with the gas passage therein, and an electron beam transmitting member surrounding at least a part of the gas inspecting space An electron beam scanning unit having electron beam generating means capable of scanning an electron beam to the gas receiving unit; a detecting unit connected to one side of the electron beam scanning unit in a direction toward the electron beam transmitting member; and a data processing unit connected to the detecting unit A method for inspecting a component, comprising the steps of passing a gas to be inspected into a gas inspection space, scanning an electron beam into the gas inspection space, detecting X-rays generated in the gas inspection space, - By analyzing the components of the gas using a line, Of can be easily analyzed by the device, to obtain a qualitative test and a quantitative test result of gas at one time, and the analysis of the result, the easy-to-gas component inspection device and a gas component than the conventional inspection method is provided.

Description

Technical Field [0001] The present invention relates to a gas component inspecting apparatus and a gas component inspecting method,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gas component inspection apparatus and a gas component inspection method, and more particularly, to a gas component inspection apparatus and a gas component inspection method that can simplify the configuration of a device and the process of inspecting components of a gas.

Gas chromatography (GC) and mass spectroscopy (MS) are used for analyzing the composition of the gas. For example, US Patent No. 5,426,300 discloses a gas analysis system. Hereinafter, the conventional analysis method including the analysis method of the gas and the like presented in the above patent document will be described, and the problems thereof will be described together.

First, in the case of gas chromatography, a mixed gas of a plurality of components is injected into a column together with a carrier gas prepared as a mobile phase. Each component of the gas injected into the column interacts with the stationary phase physically and chemically differently in the column and differs in its distribution, and each component arriving at the detector is converted into an electrical signal and recorded. The gas component is analyzed in such a way that the recorded electrical signal is compared with an already known gas chromatographic value of the authentic reference samples and a standard sample corresponding to the agreed value is identified.

However, if the user has fewer gas chromatographic values of standard samples, analysis of the gas composition becomes difficult. In addition, even if the user has a plurality of gas chromatographic values, the accuracy of the analysis is significantly lowered only by gas chromatography because the result obtained in the process of inspecting the gas component is sensitive to disturbance such as gas contamination. In addition, in the case of gas chromatography, a separable substance varies depending on the type of capillary, and in particular, there is a problem that it can not be applied to a non-polar gas depending on the kind of the capillary.

Therefore, mass spectrometric analysis of a gas in which a gas mixed with a plurality of components is ionized in a vacuum atmosphere, the generated ions are separated according to a non-electric charge value, and the value is analyzed in a detector, should be carried out together with gas chromatography .

However, in the case of gas mass spectrometry, even if a spectroscopic analyzer having a resolution higher than four decimal places is used, it is difficult to accurately determine the components mixed in the gas.

In addition, the methods described above can not avoid the deformation and damage of the gas used for the component analysis, and there is a problem in that a loss due to the component analysis occurs when the gas to be analyzed is a gas to be used in a specific process. Further, in order to analyze the components in the above-described manner for each gas generated in a large-scale process, the time and manpower consumed in the body odor and its analysis are significant.

Accordingly, there is a demand for a new gas component inspection method capable of quickly and easily inspecting components mixed in various gases generated in various processes without the above-described problems.

US 5426300 A

The present invention provides a gas component inspecting apparatus that can simplify the structure of a device and a gas component inspecting method that can simplify a gas component inspecting process.

The present invention provides a gas component inspecting apparatus and a gas component inspecting method capable of preventing change and damage of a gas.

A gas component inspecting apparatus according to an embodiment of the present invention is an apparatus for inspecting a component of a gas, comprising: a gas supply unit in which a passage through which gas flows is formed; A gas receiving portion having an inside of a gas inspecting space communicating with the passage and an electron beam transmitting member surrounding at least a part of the gas inspecting space; An electron beam scanning unit including electron beam generating means capable of scanning an electron beam to the gas receiving portion; A detecting unit connected to one side of the electron beam scanning unit in a direction toward the electron beam transmitting member; And a data processor connected to the detector.

Wherein the gas receiving portion has a gas holder having the gas inspection space opened upward and the electron beam transmitting member is mounted on an open upper portion of the gas holder so that the upper surface is located in the electron beam scanning portion, Space.

A gas injection hole is formed in a side surface of the electron beam transmitting member, a gas injection hole is formed in a lower surface of the electron beam transmitting member, and a connection pipe for connecting the gas introduction hole and the gas injection hole is formed in the electron beam transmission member .

The plurality of gas injection holes may be formed, and may be radially formed around the center position of the lower surface of the electron beam transmitting member.

The gas injection holes may be inclined in a direction toward a center position of the gas inspection space.

Wherein the exhaust pipe is opened at an edge of the gas inspecting space and has an inner opening opened at an edge portion of the gas inspecting space and including the passage, the gas inlet hole, the connecting pipe, the gas injection hole and the exhaust pipe, A flow path can be formed.

An electron beam transmitting film may be provided on one side of the electron beam transmitting member, and the electron beam transmitting film may include a silicon nitride material.

Wherein the electron beam scanning unit includes: a column having an internal space extending in a direction toward the electron beam transmitting member; Electron emitting means disposed in an inner space of the column in a direction toward a center position of the electron beam transmitting member; And a plurality of lenses arranged to focus the electrons emitted from the electron emitting means in a direction toward the center position of the electron beam transmitting member, wherein the electron emitting means includes a light emitting element And an electron gun configured to be capable of emitting electrons in a manner that can emit electrons.

The detecting portion may extend in a direction toward the electron beam transmitting member, and at least a portion of the detecting portion may be mounted through the lower one side of the electron beam scanning portion.

Wherein the data processing unit comprises: an operation unit for quantitatively and qualitatively analyzing the gas component from X-ray energy intensity data output from the detection unit and detection frequency data for each energy intensity; A storage unit for storing qualitative analysis and quantitative analysis information of the gas outputted from the operation unit; And an output unit for outputting qualitative analysis and quantitative analysis information of the gas output from the operation unit as time information.

A gas component inspection method according to an embodiment of the present invention is a method of inspecting a component of a gas, comprising: passing a gas to be inspected through a gas inspection space; Scanning the electron beam to the gas inspection space; Detecting X-rays generated in the gas inspection space; And analyzing the component of the gas using the detected X-ray.

Passing the gas to be inspected includes the steps of injecting the gas toward the center of the gas inspection space and introducing the gas into the gas inspection space; And discharging the gas outside the gas inspection space at an edge portion of the gas inspection space.

The scanning of the electron beam into the gas inspection space may include scanning the electron beam to a center position of the gas inspection space, and scanning the electron beam with an acceleration voltage of 5 kV to 20 kV.

The scanning of the electron beam into the gas inspection space may include scanning the electron beam to a central position of the gas inspection space, and scanning the electron beam with a probe current of 0.02 to 5 kPa.

The scanning of the electron beam into the gas inspection space may include scanning the electron beam to a central position of the gas inspection space, and scanning the electron beam with a probe size of 10 nm to 500 nm.

The scanning of the electron beam into the gas inspection space may include scanning the electron beam to a central position of the gas inspection space, focusing the electron beam at a position spaced apart by 50 to 80 μm from the upper portion of the gas inspection space So that the electron beam can be scanned as much as possible.

The step of analyzing the components of the gas may include acquiring energy intensity information of the X-ray to be detected and detection frequency information of each energy intensity; Removing noise from the obtained energy intensity information and detection frequency information for each energy intensity; Analyzing the noise-removed energy intensity information with respect to the gas-component data by the predetermined energy intensity; And quantitatively analyzing the component of the gas using the detection frequency information of each energy intensity from which the noise is removed.

Wherein the gas to be inspected includes a gas generated as a by-product or an output of a semiconductor manufacturing process, and the step of passing the gas to be inspected into the gas inspection space includes a step of performing the semiconductor manufacturing process during the semiconductor manufacturing process As shown in FIG.

According to the embodiment of the present invention, it is possible to simplify the configuration of the apparatus, simplify the process of inspecting the constituents of the gas, and prevent change or deformation and damage of the gas.

In addition, it is possible to analyze the gas of various components in the same process in one apparatus regardless of the type, phase and physicochemical properties of the gas, and obtain qualitative test results and quantitative test results of the gas at a time , The interpretation of the result can be made easier than in the past.

Therefore, it can be applied to both large-scale facilities such as a university research institute and a semiconductor facility.

For example, when the present invention is applied to inspection of a component of a gas generated as a by-product or an output of a semiconductor manufacturing process, a gas to be inspected is supplied from a semiconductor manufacturing facility while passing through a gas inspection space while a semiconductor manufacturing process is being performed, And the X-ray generated by the X-ray detector is detected, the component of the gas can be precisely inspected in real time.

At this time, the result is obtained by counting the number of counts per second corresponding to the one-to-one correspondence of the electronic volt value (eV) and the intrinsic component mixing ratio, which correspond one-to-one to the intrinsic component of the gas, A more reliable result can be obtained.

Instead of complicated processes such as mounting a sample in a chamber and injecting it into a column packed with a fixed phase, a gas is supplied from the facility and the electron beam is scanned while passing through the gas inspection space. The X-ray diffractometer is capable of analyzing the components of the gas. At this time, the gas inspecting space is not a space in which the inside is controlled in a separate atmosphere such as a chamber and a column, and may be various spaces satisfying that the gas is passed at a predetermined pressure and flow rate. From this, the component inspection process and the time consumed in the component inspection can be significantly reduced, and the result can be obtained quickly. Of course, it is also possible to prevent deformation and damage of the gas.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 and FIG. 2 illustrate a gas component inspection apparatus and a gas component inspection method according to an embodiment of the present invention, respectively.
3 to 5 are graphs for explaining a gas component inspection method according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below, but may be embodied in various forms. It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. For the purpose of illustrating embodiments of the present invention, the drawings may be exaggerated or enlarged, and the same reference numbers refer to the same elements throughout the drawings.

The gas component inspecting apparatus and the gas component inspecting method according to the embodiment of the present invention can be applied to a gas component inspecting apparatus and a gas component inspecting apparatus, It provides a technical feature that can quickly and precisely inspect the components of the product.

For example, in the embodiment of the present invention, at least one of the secondary electrons, the backscattering electrons, and the X-ray signal generated in the gas by emitting the electron beam through the membrane while passing the gas through the membrane in a predetermined atmospheric pressure atmosphere This paper presents a technical feature that can quickly and precisely inspect the components of the gas by collecting and analyzing the gas. At this time, the component of the gas to be inspected can be displayed in the form of a spectrum.

1 is a schematic diagram of an apparatus for inspecting a gas component according to an embodiment of the present invention.

Referring to FIG. 1, a gas component inspecting apparatus is an apparatus for inspecting a component of a gas. The gas component inspecting apparatus includes a gas supplying unit 100 for forming a passage through which a gas passes, a gas inspecting unit (not shown) A gas receiving portion 200 having an electron beam transmitting member 230 having a space 210 and surrounding at least a part of the gas inspecting space 210, an electron beam generating means capable of scanning an electron beam to the gas receiving portion 200 A detecting unit 400 connected to one side of the electron beam scanning unit 300 in a direction toward the electron beam transmitting member 230, a data processing unit 500 connected to the detecting unit 400, .

The gas supply unit 100 includes a supply pipe 110 having a passage through which gas flows, a gas supply source 120 connected to the supply pipe 110 to supply gas, a flow meter 130 installed at one side of the supply pipe 110, And a control valve 140 which is installed on the other side of the supply pipe 110 from one side of the supply pipe 110 on which the flow meter 130 is mounted and is spaced away from the gas supply source 120.

The supply pipe 110 is a component provided to be able to supply a gas constantly to a gas accommodating portion 200 to be described later and extends to a predetermined length and is connected to a gas supply source 120 and a gas accommodating portion 200 Lt; / RTI > The structure and shape of the supply pipe 110 are not particularly limited, and may be various structures and shapes that satisfy, for example, structural collision and interference with a semiconductor manufacturing facility are prevented. In the meantime, gas generated as a by-product or an outcome of the semiconductor manufacturing process may pass through the supply pipe 110, and the supply pipe 110 may correspond to a semiconductor Various pipe materials provided in the manufacturing facility can be applied.

The gas supply source 120 is a component provided to supply the gas to be inspected smoothly to the supply pipe 110. The gas supply source 120 may be, for example, a predetermined branch branched from a utility line of a semiconductor manufacturing facility. At this time, although not shown in the drawing, the supply pipe 110 may be detachably attached to the gas supply source 120 Can be mounted.

Meanwhile, the embodiment of the present invention can be applied not only to a large-scale production line including a semiconductor manufacturing facility, but also to a relatively small scale research facility for analyzing a small amount of gas, for example. In such a case, the gas supply source 120 may be a storage container in which a predetermined gas to be inspected is temporarily stored.

In addition, the embodiment of the present invention can be applied to a portable device performing a role of analyzing a gas scattered to a predetermined work space or the atmosphere. In such a case, the gas supply source 120 may be a blower or a compressor that sucks the gas scattered into the work space or the atmosphere and exhausts the gas to the supply pipe 110.

The flow meter 130 is a component mounted on one side of the supply pipe 110 and is provided to measure the flow rate and pressure of the gas passing through the supply pipe 110. The flow meter 130 is connected to the supply pipe 110 so that the gas passing through the supply pipe 110 and supplied to the gas accommodating portion 200 follows the predetermined reference flow rate value and the reference pressure value in the gas accommodating portion 200. [ For example, an area flow meter capable of changing the cross-sectional area of one side passage. Here, the reference flow rate value and the reference pressure value must be supplied into the gas accommodating portion 200 so as to generate a sufficient amount of X-rays for inspecting the gas component when the electron beam is injected into the gas accommodating portion 200 Flow rate value and pressure value of gas. The reference flow rate value and the reference pressure value can be changed according to the process to which the embodiment of the present invention is applied and can be obtained with a certain range of values while repeating the inspection of the components of the gas, and thus a detailed description thereof will be omitted. Although not shown in the drawings, a predetermined dashboard may be connected to the flow meter 130, and the flow rate and pressure values of the gas being supplied to the gas receiver 200 may be displayed in real time using the dashboard.

The control valve 140 is a component provided to adjust the opening degree of the gas inlet side passage of the supply pipe 110. The control valve 140 receives the flow rate value or the pressure value of the gas from the flow meter 130 and controls the opening degree of the control valve 140 so that the flow rate of the supplied gas follows the reference flow rate value and the pressure value. 130 to control the flow rate and pressure of the gas.

On the other hand, the gas supplied to the gas supplier 100 may have an upper limit of the supply amount depending on the process and the equipment to which the gas component inspecting apparatus is applied, and the upper limit value thereof may be smaller than the reference flow rate value and the pressure value . Accordingly, the gas supplier 100 may not be able to supply the gas to be inspected to the reference flow rate value and the pressure value.

In order to prevent this, the gas supplier 100 may further include a carrier gas supply source 150, which is a predetermined container in which a carrier gas is stored. At this time, the flow meter 130 and the control valve 140 The branch 160 of the supply line can be branched from the supply line 110 to be connected to the carrier gas supply source 150. Further, a delivery gas control valve 170 may be mounted on the branch 160 of the supply pipe. The transport gas control valve 170 is connected to the flow meter 130 so as to compare the flow rate value and the pressure value of the gas output from the flow meter 130 with the reference flow rate value and the pressure value, It is possible to control the opening degree of the supply pipe branch 160 so as to be able to supply the gas flow rate and the pressure of the flow meter 130,

The transporting gas may be an inert gas, for example, helium (He), neon (Ne) and argon (Ar) of high purity may be used as the inert gas, respectively, or a mixture of these inert gases may be used.

In addition to the above-described configuration and method, the gas supply unit 100 formed as described above can be modified into various configurations and systems that satisfy the requirement that the gas to be inspected can be supplied uniformly to the gas storage unit 200 described later.

The gas accommodating portion 200 may include a gas holder 220 having a gas inspecting space 210 opened upward and an electron beam transmitting member 230 mounted on an opened upper portion of the gas holder 220.

The gas holder 220 is a component provided to stably pass the gas supplied from the gas supplying part 100 and is a container having various shapes and sizes satisfying that a predetermined gas inspecting space 210 can be formed. . For example, the gas holder 220 may be a cylindrical container having a predetermined size, and may be formed as a gas inspecting space 210 having a central region of the upper surface recessed downward and opened at an upper portion. The gas holder 220 may be made of any one of the material of the supply pipe 110 and the material of the electron beam transmitting member 230 to be described later. For example, in this embodiment, an SUS alloy is exemplified as a material of the base holder 220.

The gas holder 220 may be provided with an exhaust pipe 250c for smooth escape of the gas supplied to the gas inspecting space 210. The exhaust pipe 250c may extend through one side of the gas holder 220 and may extend from one side of the edge of the gas inspection space 210 to the side or bottom of the gas holder 220. Therefore, the inner opening 250a of the exhaust pipe can be opened at the edge of the gas inspection space 210, and the inner opening 250a of the exhaust pipe can be formed at the side surface of the inner surface of the gas holder 220, for example. The gas flowing into the gas inspection space 210 flows into the gas inspection space 210 for a predetermined time while flowing through the central position of the gas inspection space 210, Gt; 250c < / RTI > That is, the residence time of the gas can be increased. On the other hand, the outer opening 250b of the exhaust pipe is not particularly limited, and may be formed on the side surface or the bottom surface of the outer surface of the gas holder 220 corresponding to the position of the inner opening 250a of the exhaust pipe. The outer opening 250b of the exhaust pipe may be formed on the side surface of the outer surface of the gas holder 220. [

The electron beam transmitting member 230 may be formed in a disc shape having a predetermined size, for example, to be mountable on the opened upper portion of the substrate holder 220, and may have a shape in which the central portion of the lower surface protrudes downward.

An electron beam transmitting film 232 is provided on one side of the electron beam transmitting member 230, for example, a membrane. The electron beam transmitting member 230 is provided on the lower surface of the electron beam transmitting member 230 to correspond to the arrangement structure of the gas discharging holes 240b May be provided at the center position. The details are as follows. An electron beam guide hole 231 is formed through the center position of the electron beam transmitting member 230 in the vertical direction so that the electron beam transmitting film 232 described above is hermetically sealed at the lower end of the electron beam guide hole 231. Here, the electron beam transmitting film 232 is a film formed in a thin film shape so as to seal the electron beam guiding hole 231, and serves to maintain the internal vacuum of the column 320, which will be described later, And passes through the inside and outside of the inspection space 210.

Meanwhile, a predetermined plate member (not shown) such as a silicon substrate may be further provided between the electron beam transmitting film 232 and the electron beam guiding hole 231. The details are as follows. A silicon substrate can be adhered, for example, to seal the lower end of the electron beam guide hole 231, a through hole is provided in the center of the silicon substrate, and an electron beam transmitting film 232 is coated to seal the through hole, May be provided between the electron beam transmitting member 230 and the electron beam transmitting film 232. The electron beam transmitting film 232 and the electron beam transmitting member 230 can be easily coupled.

The electron beam transmitting member 230 may be mounted on the opened upper portion of the gas holder 220 so as to enclose the upper surface of the gas inspection space 210. The upper surface of the electron beam transmitting member 230 may be an electron- (300) and connected to the inner space, and the lower surface can be connected to the gas inspection space (210).

Although not shown in the drawing, the electron beam transmitting member 230 may be detachably mounted on the open upper portion of the substrate holder 220, for example, in a bolting manner, or may be detachably attached to the upper surface of the substrate holder 220, Or the like. A sealing member (not shown) is provided between the electron beam transmitting member 230 and the substrate holder 220 to hermetically seal the open upper surface of the substrate inspection space 210.

The electron beam transmitting member 230 may include, for example, an SUS alloy to facilitate coupling with the column 320, which will be described later, and the electron beam transmitting film 232 may include a gas component An electron beam for inspection, and an electron beam and an X-ray transmissive material such as silicon nitride to allow X-rays or the like to pass therethrough.

A gas injection hole 240a is formed in a side surface of the electron beam transmitting member 230 and a gas injection hole 240b is formed in a lower surface of the electron beam transmitting member 230. Inside the electron beam transmitting member 230, A connection pipe 240c connecting the hole 240a and the gas injection hole 240b may be formed.

The gas inflow hole 240a may be formed through the side surface of the electron beam transmitting member 230 at the outer side of the gas accommodating portion 200 and the gas inflow hole 240a may be formed with the supply pipe 110 So that the gas to be inspected can be transferred from the gas supplying part 100 to the gas receiving part 200 through the gas inlet hole 240a. That is, the gas can be connected to the electron beam transmitting member 230 and the gas inspection space 210 through the gas inlet hole 240a.

A plurality of gas diffusion holes 240b may be formed and the shape of the gas diffusion holes 240b may be formed radially around the center position of the lower surface of the electron beam transmitting member 230. [ That is, the structure may be formed so that gas is injected at 360 ° all around. In particular, the gas injection holes 240b may be formed to be inclined in the direction toward the center position of the gas inspection space. The gas injected into the gas inspecting space 210 from the gas inspecting space 210 may have a plurality of gas injected into the gas inspecting space 210 toward the central position of the gas inspecting space 210 instead of forming a single gas flow flowing in only one direction in the gas inspecting space 210 A plurality of gas flows can be formed. This is to form the concentration of the gas at the central position by bringing the gas into the center position of the gas inspection space 210, which is the position where the electron beam scanning unit 300, which will be described later, forms the focal point of the electron beam, From this, the collision between the electron beam and the gas actively proceeds, and the X-ray can be radiated smoothly.

That is, in the embodiment of the present invention, the gas inspecting space 210 and the gas injection hole 240b of the gas accommodating part 200 are configured as described above, so that the sample is extracted from the gas and fixed in the chamber The gas can be easily collected to a specific position, and therefore, the process of irradiating an electron beam to a gas and radiating the X-ray can be performed smoothly.

The connection pipe 240c is formed in various structures satisfying that the gas inlet hole 240a and the gas injection hole 240b are connected to each other without interfering with or interfering with the electron beam passing member 230 . For example, the connecting tube 240c includes an annular ring portion formed in the electron beam transmitting member 230, a first connecting tube portion extending horizontally and connecting the ring portion and the gas inlet hole 240a, and a plurality of And a plurality of second connection pipe portions that are formed to connect the ring portion and the gas injection hole 240b at the position.

The gas supplying unit 100 and the gas receiving unit 200 inject the electron beam toward the gas in the electron beam scanning unit 300 and the detecting unit 400 to be described later so as to easily radiate X- Provide a route. The flow path of the gas is a flow path including a passage of the supply pipe 110, a gas inflow hole 240a, a connection pipe 240c, a gas injection hole 240b, and an exhaust pipe 250c.

Particularly, as described above, as the inner opening 250a of the exhaust pipe is opened at the edge portion of the gas inspection space 210, not at the center position of the gas inspection space 210, The flow is somewhat stagnant at the center position of the inspection space 210 and can have a desired concentration. The electron beam scanning unit 300, which will be described later, scans an electron beam to a center position of the gas inspection space 210 to generate a desired number of X-rays.

The electron beam scanning unit 300 may be disposed on the upper surface of the electron accepting unit 200 and on the upper surface of the electron beam transmitting member 230 in a direction crossing the electron beam transmitting member 230. The electron beam scanning unit 300 includes a column 320 having an internal space 310 extending in a direction toward the electron beam transmitting member 230 and a beam generating unit 300 generating and accelerating an electron beam in the electron beam scanning unit 300 controlled in a high vacuum atmosphere. And a controller (not shown) for controlling the electron beam generating means 330 so as to control electron beam generation and acceleration by the electron beam generating means 330 and the electron beam generating means 330. At this time, the electron beam generating means 330 may be formed in various configurations and systems satisfying that it can generate and accelerate the electron beam toward the gas inspection space 210. For example, The electron emitting means 331 disposed in the inner space 310 of the column in the direction of the electron emitting member 331 and the electron emitting means 331 disposed in the direction toward the center position of the electron beam transmitting member 230 And may include a plurality of lenses.

The column 320 may be a container of various shapes that satisfies that the electron beam generating means 330 can be accommodated therein and the inner space 310 is controlled to a vacuum of a predetermined size for generating and accelerating the electron beam . On the other hand, the column 320 must be formed to pass an electron beam, at least one side of which is generated and focused inside the column 320, while satisfying maintaining the vacuum inside, The X-ray generated from the outside of the column 320 must be formed. The electron beam transmitting member 230 of the gas receiving portion 200 is airtightly mounted to the open lower opening of the column 320 so that the inner vacuum of the column 320 is separated from the outside, And X-rays may pass through the interior and exterior of the column 320.

The electron emitting means 311 may include, for example, an electron gun capable of emitting electrons with an acceleration voltage and a probe current of a desired size by using any one of an electric field emission system and a heat radiation system. In this embodiment, the field emission type Schottky type electron gun is illustrated as an electron emitting means 311. The electron gun emits electrons from the tip of the electron gun by applying a predetermined high voltage from the first anode of the electron gun, A predetermined acceleration voltage is applied to accelerate the electron beam. Here, the electric field emission system and the unillustrated thermal radiation system described above are not known in the art, so that the gist of the present invention is not obscured and a detailed description thereof will be omitted.

The plurality of lenses arranged to focus and accelerate the electrons emitted from the electron emitting means 331 are, for example, a condenser lens 332 for collecting electron beams and an objective lens 332 for focusing the electron beam to a desired position And an objective lens 333. The focusing lens 332 and the objective lens 333 may be arranged in the order from the electron emitting means 331 to the electron beam transmitting member 230 in this order. Between these lenses, a scanning coil (not shown) capable of correcting the deflection of the electron beam may be further disposed. The above-described plurality of lenses may be arranged in various structures so as to cause the electron beam of a desired probe size to be incident on a desired focus forming position. The electron beam is guided along the electron beam guiding path formed by the plurality of lenses and can be converged and adjusted to a desired size and position. At this time, the force required to guide the path of the electron beam can be calculated by multiplying the charge vector by a scalar multiplication of a vector externally of the electron velocity vector and the magnetic field vector. On the other hand, a known technique can be applied to the arrangement structure of a plurality of lenses for focusing and accelerating the electron beam, and thus a detailed description thereof will be omitted in order not to obscure the gist of the present invention.

The detecting unit 400 may extend in a direction toward the electron beam transmitting member 230, and at least a part of the detecting unit 400 may be mounted through the lower one side of the electron beam scanning unit 300. The detector 400 may include an energy dispersive X-ray spectroscopy detector (EDS detector). The above-described energy-dispersive spectroscopic detector can be formed so that the energy of X-rays obtained from a gas by scanning of an electron beam can be inspected in the form of energy using a p-i-n semiconductor element of silicon single crystal.

For example, an elemental component of a gas which is incident on a gas and collided with an electron beam is excited and excited by internal electrons, and generates X-rays of an inherent size for each element in the process of transition of external electrons while being stabilized again. The detection unit 400 inserted into the column 320 of the scanning unit 300 detects the X-rays emitted from the gas and detects the respective component elements from the magnitudes of the X-rays. In the embodiment of the present invention, It is possible to inspect the components of the gas. X-rays emitted from the gas passing through the gas inspection space 210 and entering the detection unit 400 collide with atoms and electrons in the semiconductor element of the detection unit 400, To the conduction band and leaves a void. The number of vacancies is measured in terms of current, converted into voltage pulses, amplified and then output in spectral form. At this time, it is possible to derive, from the obtained data, the spectrum and kind of the components contained in the gas, for example, the atom, and the atomic% value and the wt% value of each element. On the other hand, the detection unit 400 formed as described above can simultaneously detect X-rays of different sizes emitted from the gas, and can have a resolution of, for example, 125 eV to 130 eV.

The data processing unit 500 includes an operation unit 510 for quantitatively and qualitatively analyzing the components of gas from X-ray energy intensity data and detection frequency data for each energy intensity output from the detection unit 400, And an output unit 530 for outputting qualitative analysis and quantitative analysis information of the gas output from the operation unit 510 as time information. The storage unit 520 stores the qualitative analysis and quantitative analysis information of the gas to be analyzed.

The data processing unit 500 is provided with a database in which the intrinsic energy magnitude information of the emitted X-ray for each element is stored, and the calculating unit 510 compares the energy intensity data of the detected X-ray with the intrinsic energy magnitude Analyzes the component elements of the database that correspond to the energy intensity of the X-rays detected against the database in which the information is stored, as the constituent elements of the gas. In addition, the operation unit 510 can analyze the atomic% values of the constituent elements in comparison with the detection frequencies of the detected X-ray energy intensities and derive the wt% value therefrom. The results analyzed in the above process are stored in the storage unit 520 and constructed as a data base of a process to which the gas component testing apparatus is applied. The output unit 530 may be a variety of display devices including a mobile display device, It is output as start information.

2 is a flowchart of a gas component inspection method according to an embodiment of the present invention.

Referring to FIG. 2, the gas component inspection method includes the steps of passing a gas to be inspected into a gas inspection space 210, scanning the gas inspection space 210 with an electron beam, A process of detecting X-rays generated in the gas inspection space 210, and a process of analyzing the components of the gas using X-rays. Here, the gas to be inspected includes gas generated as a by-product or an output of the semiconductor manufacturing process.

First, the gas is passed through the gas inspection space 310 (S100). At this time, the above-described process of passing the gas to be inspected is performed by receiving gas from the equipment for conducting the semiconductor manufacturing process during the semiconductor manufacturing process and injecting the gas in the direction toward the center position of the gas inspection space 210, A process of introducing the gas into the inspection space 210 and a process of discharging the gas from the edge of the gas inspection space 210 to the outside of the gas inspection space 210. Gas supplied from a semiconductor manufacturing facility flows into the supply line 110 through the gas supply source 120 and is controlled by the flow meter 130 and the control valve 140 to a pressure of 0.3 psi to 0.5 psi, (210). The gas forms a flow collecting to the center position of the gas inspection space 210 and then flows into the exhaust pipe 250c at the edge of the gas inspection space 210 and is exhausted. At this time, the exhaust pipe 250c may be provided with a gas return pipe 180 and an exhaust gas control valve 190. The exhaust gas control valve 190 may be opened to exhaust gas at a desired constant pressure and flow rate . The exhausted gas can be recovered and reprocessed into a semiconductor manufacturing facility, or utilized in semiconductor manufacturing and various processes in a semiconductor manufacturing process.

Meanwhile, the process of passing the gas to be inspected may further include a process of passing high-purity transport gas with the gas to be inspected into the gas inspection space, and a method of passing the transport gas with the gas to be inspected, Since the gas-component-inspecting apparatus has been fully described above, a detailed description thereof will be omitted.

Next, the electron beam is scanned into the gas inspection space 210 (S200). At this time, in scanning the electron beam into the gas inspecting space 210, the electron beam is scanned at the center position of the gas inspecting space 210, and the electron beam is scanned at an acceleration voltage of 5 kV to 20 kV, The electron beam is scanned with the probe current of the probe. The ranges of the acceleration voltage and the probe current are the values for scanning the electron beam to satisfy the emission of the desired amount of X-rays at the central position of the gas inspection space 210 and vary depending on, for example, . At this time, the probe size of the electron beam scanned to the center position of the gas inspection space 210 can be controlled to a probe size of 10 nm to 500 nm, and the focus of the electron beam scanned as described above is detected at the upper portion of the gas inspection space And may be formed at a position spaced apart by 50 mu m to 80 mu m in the downward direction.

Here, the acceleration voltage is a factor for controlling the degree to which the electron beam is accelerated. When the acceleration voltage is lower than the numerical range of the acceleration voltage, that is, less than 5 kV, The depth at which the reaction between the gas passing through the electrodes 210 and the electron beam, e.g., the depth at which X-rays are generated, becomes small. This means that the amount of X-ray generated is less than the amount of X-ray required for gas inspection.

That is, when the acceleration voltage is less than 5 kV, there is a problem that the accuracy of the result obtained in the process of inspecting the gas component is lowered.

On the other hand, when the acceleration voltage is higher than the above-described numerical range, that is, when the acceleration voltage is higher than 20 kV, the amount of X-ray is increased and the resultant value for inspecting the gas component becomes correct. However, the capacity of the column 320 and the cost for manufacturing the electron beam scanning unit 300 are increased because the performance of the electron beam generating means 330 must be increased. Therefore, in the embodiment of the present invention, the acceleration voltage of 5 kV to 20 kV is exemplified by the acceleration voltage of the electron beam.

Meanwhile, in this embodiment, the focal point of the electron beam is formed at a position spaced apart by 50 μm to 80 μm in the direction from the upper portion to the lower portion of the gas inspection space, but the X-ray is not generated only at the position where the focus of the electron beam is formed, But also at a position adjacent to the position where the focus is formed. The position at which the X-ray is generated with respect to the entire gas inspection space may be variable depending on parameter values such as acceleration voltage, probe current, and focus state of the lens, and may also be different depending on the type of gas. In response to this, even if the focal point of the electron beam is formed at a position exceeding 0 mu m in the direction from the upper portion to the lower portion of the gas inspection space, the emission of X-rays and the inspection of the components of the gas using this can be made. Even if the focal point of the electron beam is formed at a position of 占 퐉 to 200 占 퐉, it is possible to radiate X-rays and inspect the composition of the gas using the X-ray.

X-rays are emitted from the gas passing through the gas inspection space 210 as the electron beam controlled in the numerical range as described above is scanned into the gas inspection space 210.

Next, the X-ray generated in the gas inspection space 210 is detected (S300). X-rays emitted from the gas inspection space 210 can be detected by the detection unit 400 provided through the lower side of the column 320 of the electron beam scanning unit 300 through the electron beam transmission member 230 .

Next, the component of the gas is analyzed using the detected X-ray (S400). First, the detected X-ray energy intensity information and detection frequency information for each energy intensity are obtained. Here, the energy intensity (eV) of the X-ray corresponds one-to-one with each component element contained in the gas. In addition, the detection frequency (CPS / eV) value of the X-ray energy intensity corresponds one-to-one with the relative content of each component element with respect to the whole gas.

Next, the noise is removed from the energy intensity information obtained using the operation unit 510 and the detection frequency information for each energy intensity. Here, the noise value may be, for example, energy intensity information on the X-ray emitted from the electron beam transmitting member 230 and detection frequency information thereof. That is, predetermined X-rays are emitted even when the electron beam is transmitted through the electron beam transmitting member 230. Therefore, in this embodiment, before analyzing the value detected by the detecting unit 400, The noise corresponding to the X-ray emitted from the light source 230 is determined and the noise is removed from the detected values. At this time, since the material of the electron beam transmitting member 230 is a known material, the energy intensity of the X-ray corresponding to the material and the count value per second may be easily obtained by, for example, experiments.

Next, the noise-removed energy intensity information is qualitatively analyzed with respect to the gas component in comparison with the gas component information data according to the predetermined energy intensity. That is, by using the database storing the intrinsic energy magnitude information of the emission X-ray for each element, it is possible to compare the detected energy intensity information with the gas component information data for each predetermined energy intensity stored in the database, Analyze the components of the gas with the component elements of the gas currently being inspected.

In addition, quantitative analysis of gas components is performed using the detection frequency information for each energy intensity from which noises are removed. That is, the detection ratios of the detected X-rays may be compared with each other, and the content ratios for the respective component elements corresponding to the detected X-rays may be obtained. For example, when the CPS / eV value of the X-ray of 1 keV is 800 and the CPS / eV value of the X-ray of 2 keV is 200, the one element corresponding to the X-ray intensity of 1 keV and the X- Can be obtained at a ratio of 8: 2.

The gas inspection method using the gas inspecting apparatus according to the embodiment of the present invention inspects the components of the air and analyzes the results thereof to show the results as shown in FIG. 3 to FIG.

FIG. 3 is a graph showing the energy intensity of the X-ray detected by inspecting the air component by the gas component inspection method according to the embodiment of the present invention and the number of counts per second, and FIG. FIG. 5 is a graph showing the energy intensity of the X-ray and the count value per second, and FIG. 5 is a graph showing the result of repeatedly examining the components of air by the gas component inspection method according to the embodiment of the present invention, Graph.

While passing air through the gas inspection space 210, an electron beam was scanned thereon, and X-rays emitted from the gas inspection space were detected. As a result, the data obtained by the detecting unit 400 are obtained as electronic volt values and initial count values corresponding to different sizes, as shown in FIG. 3, and the shape follows a normal distribution as shown in the figure . At this time, the component elements corresponding to the respective electron volt values are shown together on the graph of FIG.

Then, the noise was removed from the detected information. For example, as shown in Fig. 3, the portion indicated by blue in the graph is noise. As a result, as shown in FIG. 4, only information corresponding to the nitrogen and oxygen components of air remained in the graph, and information corresponding to the silicon nitride material corresponding to the noise was removed.

3, all of the energy intensities of the X-rays detected by the detector and the counts per second (CPS / eV) of X-rays having different intensities are shown in the graph, The information corresponding to the noise, that is, the energy intensity information of the X-ray corresponding to the one-to-one correspondence with the silicon nitride material, is removed from the graph.

From the above information, in which noises are removed, nitrogen and oxygen components, which are the main components of the air, appear well as a result of the qualitative analysis. It can be seen that the value corresponding to the nitrogen is 0.808 and that the value corresponding to oxygen is 0.280, as seen from the per-second count information, that is, the peak of the CPS / eV value. Therefore, quantitative analysis showed that the molecular weight ratio of nitrogen and oxygen is 74.26: 25.74.

Finally, the above inspection process is repeated, and the results are superimposed and shown in the graph of FIG. As a result, it was possible to obtain reproducible inspection information, and thus it was possible to verify the reliability and validity of the gas component inspection apparatus and method according to the embodiment of the present invention.

As described above, the embodiment of the present invention can easily inspect components of various gases generated as byproducts or outcomes of various processes, and obtain reliable inspection results. Particularly, in the embodiment of the present invention, there is a technical feature that an electron beam is scanned on a gas passing through a predetermined space to analyze an element of the gas by a method of detecting an electron beam, for example, X-rays emitted from the gas. That is, it is possible to inspect the components of the gas while allowing the gas to pass through the space at atmospheric pressure without complicated preparation such as sample extraction from the gas and mounting in a predetermined chamber. In addition, although the gas to be inspected flows uniformly along the flow path of the gas, the gas may locally have a relatively stable or stagnant flow at the central position of the gas inspection space 210, Ray is radiated to the gas inspecting space 210 while it is controlled to a target concentration, the process of radiating the X-ray can be performed smoothly.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, Will be implemented. It is to be understood that various modifications may be made by those skilled in the art without departing from the scope of the present invention.

100: gas supply unit 130: flow meter
200: gas receiving part 220: gas holder
230: electron beam transmitting member 240b: gas injection hole
300: electron beam scanning unit 400: detecting unit
500:

Claims (18)

An apparatus for inspecting a component of a gas,
An electron beam scanning unit having an electron beam generating unit inside and opening downward;
A gas supply unit in which a passage through which gas flows is formed;
A gas holder mounted on a lower opening of the electron beam scanning unit and opening upwardly and having a gas inspecting space formed therein communicating with the gas passage and an electron beam inserting unit mounted on an open upper portion of the gas holder and surrounding at least a part of the gas inspecting space A gas receiving portion having a permeable member;
A detecting unit connected to one side of the electron beam scanning unit in a direction toward the electron beam transmitting member; And
And a data processing unit connected to the detecting unit,
Wherein the electron beam generating means is formed to be capable of emitting an electron beam to the gas inspection space,
Wherein the electron beam transmitting member is mounted on an open upper portion of the gas holder so that the lower surface thereof is in contact with the gas inspection space, and the upper surface is in contact with the inner space of the electron beam scanning portion, Mounted on an open lower opening,
An electron beam guide hole is formed through the electron beam transmitting member in a vertical direction,
And an electron beam transmission membrane is provided by sealing the lower end of the electron beam guide hole. delete The method according to claim 1,
A gas inlet hole is formed in a side surface of the electron beam transmitting member,
A gas injection hole is formed in a lower surface of the electron beam transmitting member,
And a connection pipe connecting the gas inlet hole and the gas injection hole is formed in the electron beam transmitting member. The method of claim 3,
Wherein a plurality of the gas spray holes are formed and formed radially around the center position of the lower surface of the electron beam transmitting member. The method of claim 4,
Wherein the gas injection hole is formed to be inclined in a direction toward a center position of the gas inspection space. The method of claim 3,
An exhaust pipe is formed through one side of the base holder,
Wherein the exhaust pipe has an inner opening opened at an edge portion of the gas inspection space,
Wherein the gas flow path including the passage, the gas inlet hole, the connection pipe, the gas injection hole, and the exhaust pipe is formed. The method according to claim 1,
Wherein the electron beam transmitting film comprises a silicon nitride material. The method according to claim 1,
The electron beam scanning unit includes:
A column having an inner space extending in a direction toward the electron beam transmitting member;
Electron emitting means disposed in an inner space of the column in a direction toward a center position of the electron beam transmitting member; And
And a plurality of lenses arranged to converge the electrons emitted from the electron emitting means in the direction toward the center position of the electron beam transmitting member,
Wherein the electron emission means comprises an electron gun configured to emit electrons in one of an electric field emission system and a heat radiation system. The method according to claim 1,
Wherein the detecting section extends in a direction toward the electron beam transmitting member and at least a part of the electron beam is passed through the lower one side of the electron beam scanning section. The method according to claim 1,
Wherein the data processing unit comprises:
An operation unit for quantitatively and qualitatively analyzing the components of the gas from X-ray energy intensity data output from the detection unit and detection frequency data for each energy intensity;
A storage unit for storing qualitative analysis and quantitative analysis information of the gas outputted from the operation unit; And
And an output unit for outputting qualitative analysis and quantitative analysis information of the gas output from the operation unit as time information. A method of inspecting a component of a gas,
Passing a gas to be inspected through a gas inspecting space formed inside the gas holder and having an upper surface surrounded by an electron beam transmitting member;
Scanning the electron beam to the gas inspection space through an electron beam guide hole formed through the electron beam transmitting member in a vertical direction and an electron beam transmission membrane sealing the lower end of the electron beam guide hole;
Detecting X-rays generated in the gas inspection space;
And analyzing the component of the gas using the detected X-ray. The method of claim 11,
The process of passing the gas to be inspected comprises:
Injecting the gas toward the center of the gas inspecting space and introducing the gas into the gas inspecting space;
And exhausting the gas from the edge of the gas inspection space to the outside of the gas inspection space. The method of claim 12,
The step of scanning the electron beam to the gas inspection space includes:
And scanning the electron beam at an acceleration voltage of 5 kV to 20 kV while scanning the electron beam to the center position of the gas inspection space. The method of claim 12,
The step of scanning the electron beam to the gas inspection space includes:
And scanning the electron beam to a center position of the gas inspection space, wherein the electron beam is scanned with a probe current of 0.02 to 5 kPa. The method of claim 12,
The step of scanning the electron beam to the gas inspection space includes:
And scanning the electron beam with a probe size of 10 nm to 500 nm while scanning the electron beam to the center position of the gas inspection space. The method of claim 12,
The step of scanning the electron beam to the gas inspection space includes:
Scanning an electron beam to a central position of the gas inspection space and scanning the electron beam such that a focus of the electron beam is formed at a position spaced apart by 50 to 80 占 퐉 from the upper portion of the gas inspection space toward the lower portion. 18. The method of claim 16,
The process of analyzing the components of the gas includes:
Obtaining energy-intensity information of the X-ray to be detected and detection frequency information of each energy intensity;
Removing noise from the obtained energy intensity information and detection frequency information for each energy intensity;
Analyzing the noise-removed energy intensity information with respect to the gas-component data by the predetermined energy intensity; And
And quantitatively analyzing the component of the gas using the detection frequency information for each energy intensity from which the noise is removed. The method according to any one of claims 11 to 16,
Wherein the gas to be inspected includes a gas generated as a by-product or an output of a semiconductor manufacturing process,
The process of passing the gas to be inspected into the gas inspection space includes:
Wherein the semiconductor component is supplied from a facility for performing the semiconductor manufacturing process during the semiconductor manufacturing process.

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