KR101677248B1 - Apparatus for wafer polishing - Google Patents

Apparatus for wafer polishing Download PDF

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Publication number
KR101677248B1
KR101677248B1 KR1020150058128A KR20150058128A KR101677248B1 KR 101677248 B1 KR101677248 B1 KR 101677248B1 KR 1020150058128 A KR1020150058128 A KR 1020150058128A KR 20150058128 A KR20150058128 A KR 20150058128A KR 101677248 B1 KR101677248 B1 KR 101677248B1
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KR
South Korea
Prior art keywords
polishing
wafer
unit
cleaning
specimen holding
Prior art date
Application number
KR1020150058128A
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Korean (ko)
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KR20160126705A (en
Inventor
서임춘
Original Assignee
(주) 진우테크
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Priority to KR1020150058128A priority Critical patent/KR101677248B1/en
Publication of KR20160126705A publication Critical patent/KR20160126705A/en
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Publication of KR101677248B1 publication Critical patent/KR101677248B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02054—Cleaning before device manufacture, i.e. Begin-Of-Line process combining dry and wet cleaning steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Abstract

Disclosed is a wafer polishing apparatus capable of polishing and drying with good polishing uniformity and capable of confirming the polishing state.
A wafer polishing apparatus according to an aspect of the present invention includes a polishing unit that polishes a wafer having an abrasive, a cleaning unit that cleans and dries the wafer, and an enlarged display unit that acquires and enlarges and displays an image of the wafer.

Description

[0001] Apparatus for wafer polishing [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer polishing apparatus, and more particularly, to a wafer polishing apparatus capable of mechanically and chemically polishing small semiconductor wafers in order to analyze defects and quality of semiconductors.

In general, for semiconductor defect and quality analysis, it is necessary to delayer semiconductor by removing layers of wafers one layer at a time. However, conventional large-area wafer chemical and mechanical polishing equipment for semiconductor de-layer is not suitable in many aspects such as basic performance, equipment cost, operation cost and space. Conventional large area wafer chemical and mechanical polishing equipment has a structure in which a wafer W is placed on a disc-shaped polishing table 3 on which a polishing cloth 2 is placed as shown in FIG. 1, The polishing is performed by pressing the wafer W from above and rotating the polishing table 3 and the wafer while feeding the slurry 4 and the polishing effect is generated due to the flying effect due to the surface contact between the polishing pad and the wafer, to be. Particularly, recent semiconductor is getting thinner and becoming more and more multilayered with high integration.

Generally, a method used for improving the uniformity in an industrial field is a method in which a human being polishes a specimen after washing and drying and then taken under a microscope to observe a portion of the unpolished portion by manual polishing, After grinding, it is observed again and repeatedly. In this process, it is time-consuming, not perfect, especially for those who do the job professionally, causing wrist injuries.

A small polishing apparatus capable of polishing a scraped wafer has only a basic polishing function. Therefore, in order to observe the abrasive condition repeatedly from time to time, it takes time and expense due to inefficiency of washing and drying by hand and observing in a separate microscope facility, and occupational diseases are frequently caused by repeated use of the operator's wrist.

Korean Registered Patent Publication No. 10-0624589 (issued on November 30, 2006)

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a wafer polishing apparatus which has good polishing uniformity, can be cleaned and dried, and can confirm the polishing state.

According to an aspect of the present invention, there is provided a wafer polishing apparatus comprising: a polishing unit having an abrasive to polish a wafer; a cleaning unit for cleaning and drying the wafer; an enlargement / .

According to another aspect of the present invention, the wafer polishing apparatus may further include a sample holding unit having a linear motor, a piezoelectric actuator coupled to the lower side of the linear motor, and a vacuum chuck coupled to the lower side of the piezoelectric actuator to hold and lift the wafer .

According to still another aspect of the present invention, the wafer polishing apparatus may further include a transfer unit for transferring the specimen holding portion between the polishing portion, the cleaning portion, and the magnified display portion.

According to another aspect of the present invention, the wafer polishing apparatus may further include a reciprocating unit for allowing the sample holding unit to reciprocate laterally when the polishing unit polishes the wafer.

According to the present invention, since the wafer is linearly reciprocated on the rotating cylindrical abrasive, polishing is carried out to cause linear contact polishing, thereby improving polishing uniformity.

Further, since the force of the wafer touching the polishing surface can be fed back and precisely adjusted, accurate polishing amount adjustment becomes possible.

Further, in addition to polishing, cleaning and drying, and enlarged display of the polishing surface are performed in one equipment, the working efficiency is improved.

1 is a side view of a conventional wafer polishing apparatus.
2 is a perspective view of a wafer polishing apparatus according to an embodiment of the present invention;
Fig. 3 is an enlarged view of a specimen holding portion of the wafer polishing apparatus of Fig. 2; Fig.
Fig. 4 is an internal configuration view of the wafer polishing apparatus of Fig. 2; Fig.

The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and examples taken in conjunction with the accompanying drawings. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a perspective view of a wafer polishing apparatus 100 according to a preferred embodiment of the present invention, FIG. 3 is an enlarged view of a specimen holding portion of the wafer polishing apparatus of FIG. 2, and FIG. 4 is an internal configuration view of the wafer polishing apparatus of FIG. to be.

2 to 4, a wafer polishing apparatus 100 according to a preferred embodiment of the present invention includes a polishing unit 110, a cleaning unit 120, an enlarged display unit 130, a specimen holding unit 140, A transfer unit 150, and a reciprocating unit 160 are integrally formed.

The polishing part 110 is formed by including a cylindrical polishing material 111 and polishes the wafer. The polishing unit 110 may include a bearing and an electric motor for supporting the polishing compound 111 and rotating the polishing compound 111 about the center axis. Since the polishing is performed by the rotating cylindrical abrasive 111, line contact is made at the time of polishing to uniformly polish all the surfaces of the wafer. The abrasive is mainly composed of solid abrasive grains (abrasive grains) and oxidizing materials. As the solid abrasive grains, alumina abrasive grains or silica abrasive grains having a particle diameter of several tens to several hundreds of nm may be used. As the oxidizing substance, hydrogen peroxide (H2O2), ferric nitrate (Fe (NO3) 3) and potassium oxalate (KIO3) can be used.

The cleaning section 120 cleans and dries the polished wafer from the polishing section 110. Therefore, the cleaning section 120 includes a cleaning water injection nozzle 121 for spraying cleaning water, and an air injection nozzle 122 for supplying a gas to dry the wafer with cleaning water.

The enlarged display unit 130 acquires an image of the wafer and enlarges and displays the image. Therefore, the operator can confirm the polishing state of the wafer through the enlarged display unit 130. [ The enlarged display unit 130 includes an image sensor 131 such as a CCD or CMOS for acquiring an image of a wafer and converting it into an electric signal, a control circuit 132 for processing a signal received from the image sensor and transmitting the signal to a display device, A display device 133 such as an LCD, a PDP, an LED, and an OLED for displaying a signal transmitted from the display device 132 on a screen.

3, the sample holding unit 140 includes a piezoelectric actuator 142 coupled to the linear motor 141 and the linear motor 141, a vacuum chuck 143 coupled to the lower side of the piezoelectric actuator 142, ). The specimen holding unit 140 configured as described above holds the wafer W by the suction force of the vacuum chuck 143 and moves the wafer W up and down.

Conventionally, molding or adhesive is used to hold a wafer, but this method is robust, but has a disadvantage that it is troublesome and time consuming. The method according to the present invention is advantageous in that it is easy to attach and detach wafers, thereby reducing work time and cost. The vacuum chuck is preferably fabricated using a porous metal.

In addition, by controlling the force of the wafer contacting the abrasive 111 by using the piezoelectric actuator 142 and the linear motor 141, it is possible to control the exact amount of polishing.

The transfer unit 150 allows the specimen holding part 140 to be transferred between the polishing part 110, the cleaning part 120 and the enlarged display part 130. The transfer unit 150 may include a linear module (LM) guide (not shown) for guiding the transfer of the specimen holding part 140 and a pneumatic cylinder (not shown) for providing a transfer force to the specimen holding part And a linear motor (not shown) may be used. A linear motor is preferred for precise control. Further, a control device for operating the pneumatic cylinder or the linear motor is further provided, and the wafer is polished. Then, the specimen holding part is transferred through button operation without any manual operation such as detaching the wafer from the specimen holding part, Because it can be confirmed, work efficiency is greatly improved.

The reciprocating unit (not shown) causes the polishing unit 110 to reciprocate the specimen holding unit 140 to the left and right when polishing the wafer. As the reciprocating unit, an LM guide and a pneumatic cylinder may be used, or a linear motor may be used. As the wafer is polished while linearly reciprocating, it is possible to precisely adjust the amount of polishing by measuring the amount of polishing performed once in a linear reciprocating motion.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but many variations and modifications may be made without departing from the scope of the present invention. It will be apparent that modifications and improvements can be made by those skilled in the art. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: wafer polishing apparatus 110: polishing unit
111: abrasive agent 120:
121: wash water spray nozzle 122: air spray nozzle
130: magnification display section 131: image sensor
132: Control device 133: Display device
140: specimen holding unit 150: transfer unit
160: reciprocating unit

Claims (6)

A polishing unit having a cylindrical polishing body that rotates about a horizontal axis and polishes the wafer;
A cleaning part formed on a side of the polishing part to clean and dry the wafer;
An enlargement / display unit formed on a side of the cleaning unit to acquire an image of the wafer and enlarge and display the image;
A piezoelectric actuator coupled to a lower side of the linear motor; a specimen holding part coupled to a lower side of the piezoelectric actuator and having a vacuum chuck made of a porous metal to hold and elevate the wafer;
A transfer unit for horizontally moving the specimen holding part between the polishing part, the cleaning part, and the enlarged display part; And
A reciprocating unit that reciprocates the specimen holding part in the lateral direction when the polishing part polishes the wafer;
Respectively,
Wherein the polishing unit is polished while linearly reciprocating in a state where the polishing unit is horizontally disposed on the polishing body on the polishing body on which the wafer is rotated when the wafer is polished, thereby performing line contact polishing.
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KR1020150058128A 2015-04-24 2015-04-24 Apparatus for wafer polishing KR101677248B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150058128A KR101677248B1 (en) 2015-04-24 2015-04-24 Apparatus for wafer polishing

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Application Number Priority Date Filing Date Title
KR1020150058128A KR101677248B1 (en) 2015-04-24 2015-04-24 Apparatus for wafer polishing

Publications (2)

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KR20160126705A KR20160126705A (en) 2016-11-02
KR101677248B1 true KR101677248B1 (en) 2016-11-17

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021112034A1 (en) * 2019-12-03 2021-06-10 株式会社荏原製作所 Polishing device and polishing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002103213A (en) * 2000-09-25 2002-04-09 Ibiden Co Ltd Wafer holding tool
JP2013240846A (en) * 2012-05-18 2013-12-05 Renesas Electronics Corp Polishing device and manufacturing method of semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6012966A (en) * 1996-05-10 2000-01-11 Canon Kabushiki Kaisha Precision polishing apparatus with detecting means
JP3371775B2 (en) 1997-10-31 2003-01-27 株式会社日立製作所 Polishing method
KR20080113710A (en) * 2007-06-25 2008-12-31 세크론 주식회사 Apparatus and method for grinding wafer backside

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002103213A (en) * 2000-09-25 2002-04-09 Ibiden Co Ltd Wafer holding tool
JP2013240846A (en) * 2012-05-18 2013-12-05 Renesas Electronics Corp Polishing device and manufacturing method of semiconductor device

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