KR101674157B1 - Controlling Temperature Substrate For Having Hotrunner System - Google Patents

Controlling Temperature Substrate For Having Hotrunner System Download PDF

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Publication number
KR101674157B1
KR101674157B1 KR1020150066306A KR20150066306A KR101674157B1 KR 101674157 B1 KR101674157 B1 KR 101674157B1 KR 1020150066306 A KR1020150066306 A KR 1020150066306A KR 20150066306 A KR20150066306 A KR 20150066306A KR 101674157 B1 KR101674157 B1 KR 101674157B1
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KR
South Korea
Prior art keywords
temperature
heat
pcb substrate
heat dissipation
dissipation plate
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Application number
KR1020150066306A
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Korean (ko)
Inventor
유성진
Original Assignee
주식회사 유도
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Priority to KR1020150066306A priority Critical patent/KR101674157B1/en
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Publication of KR101674157B1 publication Critical patent/KR101674157B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/207—Thermal management, e.g. cabinet temperature control

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention relates to a temperature control board for a hot runner equipped with a heat dissipation plate.
The present invention relates to a method of controlling a temperature controller, comprising: a PCB substrate on which electronic elements are circuit-configured to execute programmed control logic; A heat sink coupled to the PCB substrate to dissipate heat generated when the PCB substrate is driven; And a heat dissipating unit formed on a front portion of the PCB substrate and integrated with the heat dissipating plate and having a temperature sensor for sensing the temperature of the heat dissipating plate and electrically connected to the heat dissipating unit, And a heat dissipation plate formed of a controller for protecting the control board and the mold according to whether or not the control board and the mold are integrated with the PCB substrate to make the appearance of the control board look good.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a temperature control substrate for a hot runner having a heat dissipation plate,

The present invention relates to a temperature control board for a hot runner equipped with a heat dissipation plate. More particularly, the present invention relates to a control board, and more particularly, to a control board having a heat dissipation plate connected to a heat dissipation plate at a front portion of the control board to maximize a heat dissipation effect. By sensing a temperature of the heat dissipation plate itself and providing a sensed temperature, Or a control body portion to which a control board is fixed is deformed to prevent deterioration of a coupling force.

In general, the hot runner injection molding can completely commercialize raw materials and can always use only new raw materials. Therefore, it is possible to prevent defects and troubles caused by foreign substances, and since the injection pressure of the injection molding machine is directly transferred to the cavity, And the internal stress can be solved, thereby improving the quality of the injection molding, reducing the pressure received in the mold, and extending the life of the mold.

In order to control the temperature of the hot runner to a proper temperature through the detection of the temperature sensor, a temperature sensor for temperature sensing must be installed. Is required.

As described above, the temperature controller required in the hot runner injection molding is disclosed in various manners through the Korean Patent Registration No. 10-0305241, Korean Registered Utility Model No. 20-0469333, and the like.

However, according to the above-mentioned prior art documents, the control board provided in the temperature controller is formed with a heat radiating plate, a heat radiating plate, a heat radiating fan, or the like formed on a normal printed circuit board, The control substrate or the control body portion to which the control substrate is fixed is deformed due to the heat generated from the control substrate due to insufficient heat emission effect and the bonding force is reduced to cause malfunction of the control substrate.

According to the prior art documents, the temperature of the hot runner can be sensed and controlled by driving the temperature controller. However, since the temperature of the control board, which is an essential component of the temperature controller, is not detected, The reliability of the temperature sensing and control is deteriorated.

Korean Patent No. 10-0305241

Korean Registered Utility Model No. 20-0469333

In order to solve such problems, the present invention provides a temperature control substrate for a hot runner having a heat dissipation plate connected to a heat dissipation plate at a front portion of a control substrate to maximize a heat dissipation effect It has its purpose.

In addition, the present invention provides a heat sink that senses the temperature of the heat sink and provides a sensed temperature, thereby preventing the control board or the control board, to which the control board is fixed, from being deformed due to heat generated in the control board, And to provide a temperature control board of a hot runner provided with a plate.

According to an aspect of the present invention, there is provided a method of controlling a temperature controller, the method comprising: a PCB substrate for executing control logic programmed with electronic elements for controlling the temperature controller; A heat sink coupled to the PCB substrate to dissipate heat generated when the PCB substrate is driven; And a heat dissipating unit formed on a front portion of the PCB substrate and integrated with the heat dissipating plate and having a temperature sensor for sensing the temperature of the heat dissipating plate and electrically connected to the heat dissipating unit, And a heat dissipation plate formed of a controller for protecting the control board and the mold according to whether or not the control board and the mold are integrated with the PCB substrate to make the appearance of the control board look good.

According to an embodiment of the present invention, the controller includes a power on / off terminal for controlling whether power is supplied or not so as to control whether the heat radiating plate is driven, a power on / off terminal connected to the heat radiating plate, And a control terminal unit including a signal transmission / reception terminal for transmitting / receiving a temperature signal of the heat sink.

According to an embodiment of the present invention, the controller further includes a connection connector for electrically connecting the PCB substrate, the control terminal unit, and the temperature display unit.

According to an embodiment of the present invention, the heat dissipation unit may further include a heat dissipation member having the temperature sensor incorporated therein and connected to the heat dissipation plate to allow heat dissipation of the PCB substrate together with the heat dissipation plate .

According to an embodiment of the present invention, the heat radiating member is further provided with a transmission cable for connecting the temperature sensor to the PCB substrate so as to transmit the temperature of the heat sink.

According to the embodiment of the present invention, the heat dissipation effect can be maximized through the heat dissipation plate connected to the heat dissipation plate at the front part of the control board.

According to the embodiment of the present invention, by sensing the temperature of the heat sink and providing the sensed temperature, the control board, or the control body portion to which the control board is fixed, is deformed due to heat generated in the control board, There is an effect that can be prevented.

1 is a view showing a state where a control board according to an embodiment of the present invention is installed in a temperature controller,
2 is a view illustrating a heat dissipation plate of a control board according to an embodiment of the present invention,
3 is a front view showing a heat dissipation plate of a control board according to an embodiment of the present invention,
4 is a schematic view illustrating a heat dissipating plate according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to designate the same or similar components throughout the drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

In describing the components of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected to or connected to the other component, It should be understood that an element may be "connected," "coupled," or "connected."

2 is a view illustrating a heat dissipating plate of a control board according to an embodiment of the present invention. FIG. 3 is a cross- FIG. 4 is a schematic view of a heat dissipation plate according to an embodiment of the present invention. FIG.

As shown, the control board 100 of the temperature controller of the present invention includes a PCB substrate 110 on which circuits for temperature control of the hot runner injection molding apparatus are arranged, a heat sink A heat dissipating plate 130 integrally formed with the heat sink 120 and the heat sink 120 and electrically connected to the PCB substrate 110 to sense the temperature of the heat sink 120 and improve the heat radiation effect of the heat sink 120, .

The PCB substrate 110 performs control logic in which electronic elements are circuit-configured and programmed for control of the temperature controller, and from the temperature sensing signal of the temperature sensor 320 configured in the hot runner injection molding by the control logic, The present temperature is sensed, the state of the control board 100 is checked according to the sensed temperature, and the control board 100 is safely controlled within a predetermined temperature.

It is needless to say that the PCB substrate 110 includes a circuit section configured to control the heater and the temperature sensor, and a terminal section configured to be electrically connected to the temperature sensor and the heater.

The heat sink 120 is coupled to one side of the PCB substrate 110 to dissipate heat generated when the PCB substrate 110 is driven to prevent malfunction of the PCB substrate 110.

The heat dissipation plate 130 is integrally formed at the front end of the heat dissipation plate 120. The heat dissipation plate 130 improves the heat dissipation effect of the heat dissipated from the heat dissipation plate 120 and senses the temperature of the heat dissipation plate 120, It is possible to protect the control board 100 and the mold according to the overheating of the PCB board 110 by sensing whether the PCB board 110 is overheated or not, So as to make the appearance of the control board 100 look good.

The heat radiating plate 130 includes a controller 132 formed at a front portion of the PCB 110 for displaying the sensed temperature of the heat radiating plate 120 connected to the PCB 110, And a heat dissipation unit 134 having a built-in temperature sensor 320 to sense the temperature of the heat sink 120. [

Here, it is preferable that the controller 132 and the heat dissipating unit 134 are integrally formed, but the present invention is not limited thereto. That is, a separate heat insulating material may be further provided on the connection portion of the controller 132 and the heat dissipating portion 134, or on the boundary line so as to prevent the heat dissipated through the heat dissipating portion 134 from being transmitted to the controller 132 side Of course it is.

The controller 132 includes a power on / off terminal 212 for controlling whether or not the power is supplied so as to control whether the heat radiating plate 130 is driven, and a power supply on / off terminal 212 for controlling whether the heat radiating plate 130 and the PCB substrate 110 are connected to the heater / And a signal transmitting / receiving terminal 214 for transmitting / receiving a temperature signal of the temperature sensor 120. [

The controller 132 constitutes a temperature display unit 220 that displays the temperature of the heat sink 120 measured in the heat dissipating unit 134 step by step and notifies the temperature danger level of the PCB substrate 110.

The temperature display unit 220 is configured to be divided into the first to sixth steps to be displayed, and the temperature display unit 220 is configured to display the LEDs by color for each step.

Here, the temperature display unit 220 is divided into green, yellow and red according to the control of the PCB substrate 110 connected by the control terminal unit 210 and a connection connector 250 to be described later, In the first and second steps, green is displayed in the case of normal temperature, and in the third and fourth steps, yellow is displayed as an initial stage of overheating of the heat sink 120 so that the temperature of the heat sink 120 can be lowered And 5 and 6 are displayed only when the heat radiation plate 120 is in an overheated state and the heat radiation is not smooth so that the user can lower the temperature of the current PCB substrate 110 through the temperature display unit 220 There will be.

In this case, when the lamp of five levels is displayed through the temperature display unit 220, the alarm sound output unit 230 may be further provided to allow the user to transmit a danger signal through voice, alarm sound, etc. to be.

The temperature display unit 220 of the present invention is connected to the control terminal unit 210 so that when the six-stage lamp is displayed, the power supply is interrupted to forcibly stop the driving of the PCB substrate 110, A malfunction, a breakdown of the PCB substrate 110, and the like.

That is, the heat dissipation plate 130 of the present invention senses the temperature of the heat dissipation plate 120 formed on the PCB substrate 110, checks whether the PCB substrate 110 is overheated according to the temperature of the heat dissipation plate 120, The PCB substrate 110 can be prevented from being malfunctioned or damaged due to overheating by controlling whether the PCB substrate 110 is driven.

In addition, the connection connector 250 is formed on the heat dissipation plate 130 of the present invention so that the PCB substrate 110, the control terminal unit 210, and the temperature display unit 220 are electrically connected to each other, It is possible to detect whether the heat sink 120 is overheat based on the set allowable temperature range.

The heat dissipating unit 134 of the present invention may be integrally connected to the heat sink 120 formed on the PCB substrate 110 and extend to the heat sink 120 And the temperature of the heat sink 120 is sensed to provide a current temperature of the PCB substrate 110. [

The heat dissipating unit 134 is connected to the heat dissipating plate 120 to form a heat dissipating member 310 for dissipating heat of the PCB substrate 110 together with the heat dissipating plate 120, And a temperature sensor 320 for sensing the temperature of the heat sink 120 during the heat radiation operation of the heat sink 120.

At this time, the temperature sensor 320 is connected to both the PCB substrate 110 and the temperature display unit 220 to provide a sensed temperature, so that the display is performed in stages according to the temperature sensed through the temperature display unit 220.

The temperature sensor 320 may further include a transmission cable 330 connected to the PCB substrate 110 to transmit the sensed temperature signal. The transmission cable 330 may be coupled to the PCB substrate 110, May be coupled through means 332.

The heat dissipation plate 130 of the present invention configured as described above is coupled to each of the heat dissipation plates 120 formed on the PCBs 110 having a plurality of temperature controllers, So that it is detachably coupled to a frame portion of the temperature controller.

That is, the heat dissipation plate 130 of the present invention may be integrally formed with the PCB substrate 110 and the heat dissipation plate 120 to be installed in the temperature controller.

The heat dissipation plate 130 of the present invention includes a model of a plurality of PCBs 110 and a writing unit 240 for writing control numbers of the heaters connected to the PCBs 110 But is not so limited.

The heat dissipation effect can be maximized through the heat dissipation plate 130 connected to the heat dissipation plate 120 in the front part of the PCB substrate 110 of the present invention configured as described above and the temperature of the heat dissipation plate 120 can be sensed The PCB substrate 110 or the control body portion to which the PCB substrate 110 is fixed is deformed by the heat generated from the PCB substrate 110 to prevent the bonding force from being lowered.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. That is, within the scope of the present invention, all of the components may be selectively coupled to one or more of them.

It is also to be understood that the terms such as " comprises, "" comprising," or "having ", as used herein, mean that a component can be implanted unless specifically stated to the contrary. And all terms including technical and scientific terms are to be construed in a manner generally known to one of ordinary skill in the art to which this invention belongs, It has the same meaning as understood.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

110: PCB substrate 120: Heat sink
130: heat radiating plate 132: controller
134: heat dissipating part 210: control terminal part
220: temperature display unit 230: alarm sound output unit
240: Write section 250: Connection connector
310: heat dissipation panel 320: temperature sensor
330: Transmission cable

Claims (5)

A PCB substrate on which electronic components are circuit-configured to execute programmed control logic for control of the temperature controller;
A heat sink coupled to the PCB substrate to dissipate heat generated when the PCB substrate is driven; And
And a heat dissipating member formed in the front portion of the PCB substrate and integrated with the heat dissipating plate to incorporate a temperature sensor for sensing the temperature of the heat dissipating plate and connected to the heat dissipating plate, And a controller that is electrically connected to the heat dissipating unit and protects the control board and the mold according to whether the PCB board is overheated or not. The controller is integrally assembled with the PCB board, And a heat dissipation plate
The temperature sensor is connected to the PCB through a transmission cable
Wherein the temperature control substrate comprises a heat dissipation plate.
The method according to claim 1,
The controller
A power on / off terminal for controlling the supply of power to control whether the heat dissipation plate is driven,
A control terminal unit connected to the heat dissipation plate and the PCB substrate and including a signal transmission / reception terminal for transmitting / receiving a temperature signal of the heat dissipation plate,
Wherein the temperature control substrate is provided with a heat dissipation plate.
3. The method of claim 2,
Wherein the controller further comprises a connection connector for electrically connecting the PCB substrate to the control terminal unit and the temperature display unit.
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KR1020150066306A 2015-05-12 2015-05-12 Controlling Temperature Substrate For Having Hotrunner System KR101674157B1 (en)

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KR1020150066306A KR101674157B1 (en) 2015-05-12 2015-05-12 Controlling Temperature Substrate For Having Hotrunner System

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150066306A KR101674157B1 (en) 2015-05-12 2015-05-12 Controlling Temperature Substrate For Having Hotrunner System

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KR101674157B1 true KR101674157B1 (en) 2016-11-08

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102065085B1 (en) 2018-01-30 2020-01-10 주식회사 스튜디오쓰리에스코리아 Temperature controller for hot runner system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990078678A (en) * 1999-07-26 1999-11-05 유영희 controller of injection molding machine be easy combination and mending
JP2002353385A (en) * 2001-05-29 2002-12-06 Yaskawa Electric Corp Servo drive device
KR101173192B1 (en) * 2011-05-17 2012-08-10 주식회사 오킨스전자 Test socket assembly for heat package
KR200469333Y1 (en) 2011-09-27 2013-10-04 조경준 Temperature controller for hot runner

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990078678A (en) * 1999-07-26 1999-11-05 유영희 controller of injection molding machine be easy combination and mending
KR100305241B1 (en) 1999-07-26 2001-09-24 유 영 희 controller of injection molding machine be easy combination and mending
JP2002353385A (en) * 2001-05-29 2002-12-06 Yaskawa Electric Corp Servo drive device
KR101173192B1 (en) * 2011-05-17 2012-08-10 주식회사 오킨스전자 Test socket assembly for heat package
KR200469333Y1 (en) 2011-09-27 2013-10-04 조경준 Temperature controller for hot runner

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102065085B1 (en) 2018-01-30 2020-01-10 주식회사 스튜디오쓰리에스코리아 Temperature controller for hot runner system

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