KR101673568B1 - Led lighting apparatus having heat radiant function - Google Patents

Led lighting apparatus having heat radiant function Download PDF

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Publication number
KR101673568B1
KR101673568B1 KR1020160032942A KR20160032942A KR101673568B1 KR 101673568 B1 KR101673568 B1 KR 101673568B1 KR 1020160032942 A KR1020160032942 A KR 1020160032942A KR 20160032942 A KR20160032942 A KR 20160032942A KR 101673568 B1 KR101673568 B1 KR 101673568B1
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KR
South Korea
Prior art keywords
heat
pcb
heat dissipating
housing
protrusion
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Application number
KR1020160032942A
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Korean (ko)
Inventor
박한규
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박한규
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Priority to KR1020160032942A priority Critical patent/KR101673568B1/en
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Publication of KR101673568B1 publication Critical patent/KR101673568B1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The present invention relates to an LED lighting apparatus having a heat radiation function which not only can quickly radiate heat generated in an LED, but also can prevent damages of the LED and durability shortening caused by high temperature by enlarging a specific surface area by increasing a contact surface between a housing and a PCB having a plurality of LEDs mounted therein. The present invention relates to the LED lighting apparatus which comprises: the housing (10) with opened one surface to install the PCB (20) having the LEDs (21) mounted therein; and a cover (30) installed in an opening of the housing (10).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an LED lighting device having a heat-

The present invention relates to an LED lighting device having a heat dissipating function, more specifically, by increasing a contact surface between a PCB on which a plurality of LEDs are mounted and a housing, thereby increasing the specific surface area, And more particularly, to an LED lighting device having a heat dissipating function capable of preventing damage to the LED due to high temperature and shortening the service life thereof.

BACKGROUND ART [0002] In general, an illumination device for illuminating a dark room in a room, such as a ceiling or a wall, is widely used in homes, offices, and the like.

Recently, as interest in energy has increased, demand for lighting devices using LEDs has been rapidly increasing for energy saving of lighting devices.

The LED is a device that joins a p-type semiconductor and an n-type semiconductor and emits light while coupling electrons and holes at the junctions. It generates high brightness with low power consumption, and is environmentally friendly as well as excellent in life and durability.

As the performance of the LED is improved, high-temperature heat is generated and the heat is transmitted to the PCB.

The LED may be damaged due to the high temperature heat generated from the LED and shorten the service life. Therefore, a separate heat dissipating device is required to lower the temperature of the PCB that receives the heat generated from the LED.

Accordingly, various techniques for dissipating the heat of the PCB, which receives heat from the LED, have been developed in the lighting apparatus using the LED.

In this heat dissipation technology, a cooling fan is used for the lighting device to radiate the heat of the LED, but this increases the size and weight of the lighting device and increases the manufacturing cost .

In order to solve the above-mentioned problem, in the registered patent No. 10-1309845 (registered date: Sep. 11, 2013), there is disclosed a lighting system including an illumination unit having an LED installed therein to emit light, A base plate for supporting the LED, a plurality of heat sinks vertically stacked on the base plate for radiating heat generated in the illumination unit, a disk plate provided between the heat sinks, and a plurality of heat sinks And a cover mounted on the upper portion of the converter to protect the converter, wherein the base plate, the heat radiating plate, and the end plate are coupled to each other by an engaging bolt, LED lighting is posted.

However, in the above-mentioned Japanese Patent No. 10-1309845, since a plurality of heat sinks are stacked in order to dissipate the heat of the LEDs, the manufacturing process can be complicated and it is difficult to significantly reduce the manufacturing cost.

In addition, since the heat sink is positioned in a horizontal state with respect to the illuminating unit, the flow rate is reduced due to the flow resistance of air flowing horizontally between the heat sinks, which may result in deterioration of heat transfer performance.

 Tae Sung Jung and Hwan Kook Kang, 2013 "Investigation of Natural Convective Heat Flow Characteristics of Heat Sink", Trans. Korean Soc. Mech. Eng. B, Vol. 37, No. 1, pp. 27 to 33  Sang-Gyu Park, Sang-Hoon Park, Kyung-Hoon Kim, 2009, "Design and Manufacture of Heat Dissipation System for LED Lamp", Conference of the Korean Society of Mechanical Engineers, P.2431-2436, 2009

It is an object of the present invention to provide an LED lighting device having a heat radiating function with a surface area increased by forming a heat dissipating protrusion inside a housing for mounting a PCB on which a plurality of LEDs are mounted. In other words, it is an object of the present invention to provide an LED lighting device having a heat dissipating function in which a heat radiating protrusion is formed inside the housing to increase the surface area, thereby increasing the contact surface between the PCB and the heat dissipating protrusion, thereby improving thermal conductivity.

Further, a hole is formed in the heat dissipating protrusion formed on the inner side of the housing to enlarge an area exposed to the atmosphere, thereby increasing the specific surface area, and having a heat dissipating function for dissipating heat accumulated by natural convection while accumulating heat in the hole An object of the present invention is to provide an LED lighting device.

A further object of the present invention is to provide an LED lighting device having a heat dissipating function capable of quickly dissipating heat generated from an LED due to the formation of a heat dissipating protrusion in the inside of the housing, have.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a LED lighting device having a heat dissipation function, the LED lighting device including: a housing for mounting a PCB (20) having a plurality of LEDs (21) The LED lighting apparatus according to any one of claims 1 to 3, wherein the housing (10) comprises a cover (30) mounted on an opening of the housing (10) And a plurality of heat dissipating protrusions (11) protruding inwardly to be vertically engaged with the PCB (20) in order to be conductive, wherein the heat dissipating protrusions (11) are hollow and open to the outside of the housing A thermal storage hole 12 for discharging the heat accumulated by the natural convection while accumulating heat and a hooking jaw for preventing the detachment of the PCB 20 coupled to the PCB 20, A plurality of heat dissipating protrusions 11 to be fitted to the heat dissipating protrusions 11, A circuit break surface 23 of an insulator is formed along the edge of the heat dissipating protrusion insertion hole 22 so as to be insulated from the heat dissipating protrusion 11 and inserted into the heat dissipating protrusion insertion hole 22, And a thermally conductive adhesive (25) is applied to the outside of the heat dissipating protrusion (11) adjacent to the PCB (20) to improve thermal conductivity.

At this time, the heat radiating protrusions 11 may be perpendicular to the PCB 20 and may be formed as a columnar or polygonal columnar shape.

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As described above, according to the present invention, a heat dissipating protrusion is formed inside a housing to mount a PCB on which a plurality of LEDs are mounted, thereby widening a contact surface between the PCB and the heat dissipating protrusion to improve thermal conductivity, So that the heat radiation performance can be improved while widening the area exposed to the atmosphere. That is, since the heat dissipating protrusion is formed inside the housing to improve the surface area, the specific surface area can be increased, so that the high heat of the LED can be quickly released, thereby preventing damage to the LED due to the high temperature and shortening the service life.

In addition, since holes are formed in the heat dissipating protrusions, heat is accumulated in the holes while heat is accumulated using natural convection, so that a separate cooling fan or the like is not used, thereby reducing manufacturing costs.

In addition, since the heat dissipating protrusion is formed inside the housing, it is possible to improve the appearance of the appearance.

1 is an exploded perspective view of an LED lighting device having a heat radiation function according to an embodiment of the present invention,
FIG. 2A is a sectional view of a housing of an LED lighting apparatus having a heat radiation function according to an embodiment of the present invention,
2B is a partial cross-sectional view of a housing of a LED lighting apparatus having a heat radiation function according to an embodiment of the present invention,
3 is a perspective view illustrating a PCB of an LED lighting device having a heat radiation function according to an embodiment of the present invention,
4A is a cross-sectional view of an LED lighting device having a heat radiation function according to an embodiment of the present invention,
4B is a partial cross-sectional view of an LED lighting device having a heat radiation function according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an LED lighting apparatus having a heat radiation function according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating an LED lighting apparatus having a heat radiation function according to an exemplary embodiment of the present invention. FIG. 2A is a sectional view of a housing of an LED lighting apparatus having a heat radiation function according to an exemplary embodiment of the present invention, Sectional view of a housing of a LED lighting apparatus having a heat radiation function according to an embodiment of the present invention.

4A is a cross-sectional view of an LED lighting apparatus having a heat-dissipating function according to an embodiment of the present invention, and FIG. 4B is a cross-sectional view of the LED lighting apparatus according to an embodiment of the present invention. Sectional view of a LED lighting device having a heat radiation function according to an embodiment of the present invention.

In the drawings, the same reference numerals are given to the same elements even when they are shown in different drawings. In the drawings, the same reference numerals as used in the accompanying drawings are used to designate the same or similar elements. And detailed description of the configuration will be omitted. Also, directional terms such as "top", "bottom", "front", "back", "front", "forward", "rear", etc. are used in connection with the orientation of the disclosed drawing (s). Since the elements of the embodiments of the present invention can be positioned in various orientations, the directional terminology is used for illustrative purposes, not limitation.

As shown in FIG. 1, a PCB 20 having a plurality of LEDs 21 for emitting light is mounted on an inner surface of a LED lighting apparatus having a heat dissipating function according to a preferred embodiment of the present invention. And a cover 30 mounted on the opening surface of the housing 10.

2A and 2B, the housing 10 includes a plurality of heat dissipating protrusions 11 protruding inward to receive heat generated from the PCB 20, And a housing wiring hole 13 for drawing a wiring to be connected to the semiconductor device.

The housing 10 is formed in a cylindrical shape and is formed to be bent in an outward direction along the edge of the housing 10 so as to be easily engaged with the cover 30. At this time, the housing 10 is not limited to a cylindrical shape, and may be formed in a rectangular tube shape having a space formed therein and having one side opened.

The heat radiating protrusions 11 should be formed perpendicular to the PCB 20. That is, the heat dissipating protrusions 11 are formed to be perpendicular to the PCB 20, and thus, the heat dissipating protrusions 11 can be formed in accordance with the reference 1 [Reference 1: Tae Sung Jung and Hwan Kook Kang, 2013 "Investigation of Natural Convective Heat Flow Characteristics of Heat Sink" . Korean Soc. Mech. Eng. B, Vol. 37, No. 1, pp. 27 ~ 33], the flow rate of the heat sink is relatively lower than that of the vertical case due to the flow resistance of air flowing horizontally between the pins. As shown in the experimental results, the heat dissipation performance It is possible to obtain an improved effect.

The heat dissipating protrusion 11 is formed as a cylinder or a polygonal column, and a heat accumulating hole 12 which is hollow and opens to the outside of the housing 10 is formed.

The heat accumulating holes 12 accumulate the heat transferred from the PCB 20, and heat accumulated by the natural convection is discharged to the outside.

In other words, the heat dissipating protrusion 11 is formed inside the housing 10 to widen the contact surface contacting the PCB 20 mounted inside the housing 10. The thermal conductivity for transferring the heat from the PCB 20 to the heat dissipating protrusion 11 can be improved due to the improved contact surface with the PCB 20. [

A heat accumulating hole 11 is formed in the heat dissipating protrusion 11 so as to enlarge an area exposed to the air to increase the specific surface area and to accelerate the heat of the PCB 20 through natural convection using a temperature difference in the atmosphere . In other words, when the heat of the heat dissipating protrusion 11 is accumulated in the heat accumulating hole 12, a natural convection phenomenon occurs due to a difference between the temperature of the heat accumulating hole 12 and the atmospheric temperature, It is possible to shorten the heat dissipation time and improve the heat dissipation performance.

In addition, since the heat dissipating protrusion 11 does not protrude outwardly from the housing 10, it is possible to improve the apparent beauty.

It is preferable that the heat dissipating protrusion 11 is further formed at the leading end of the PCB 20 to prevent the PCB 20 from being detached when the PCB 20 is mounted.

The housing wiring hole 13 is preferably formed on the lower surface of the housing 10, and may be formed at the center of the lower surface.

3, the PCB 20 includes a plurality of heat dissipating protrusion insertion holes 22 to be inserted into the heat dissipating protrusions 11, and a housing wiring hole 13 of the housing 10, And a PCB wiring hole (24) corresponding to the PCB wiring hole (24).

At this time, the PCB 20 may be formed in a disc shape, but not limited thereto, and may be formed in a rectangular plate shape.

In addition, the PCB 20 uses a single-pattern PCB having an electric circuit on one side thereof, so that when the other side of the PCB 20 is brought into close contact with the lower surface of the housing 10, So that it can be prevented in advance.

The heat dissipation protrusion insertion hole 22 is formed to correspond to the heat dissipation protrusion 11 for inserting the heat dissipation protrusion 11 formed on the lower surface of the housing 10.

At this time, a circuit blocking surface 23 is formed in the periphery of the heat dissipating protrusion insertion hole 22 to prevent electricity from passing through the heat dissipating protrusion 11 inserted into the heat dissipating protrusion insertion hole 22. That is, the PCB 200 and the heat dissipating protrusion 11 can be isolated from each other by forming a circuit cut-off surface 23 along the edge of the heat dissipating protrusion insertion hole 22.

The PCB wiring hole 24 is preferably formed at a central portion of the PCB 20, and a wiring for connecting to the PCB 20 is inserted.

In addition, the circuit break surface 23 is formed along the edge of the PCB wiring hole 24 to insulate the PCB 20 from the wiring.

The cover 30 is seated on the end of the housing 10 and is fixed to the housing 10 by means of fixing means (not shown) such as a screw or a piece so as to cover the opening face of the housing 10 .

Dust and foreign matter can be prevented from entering the inside of the housing 10 due to the cover 30.

The cover 30 may be generally formed of a concave or flat plate.

One embodiment of the LED flat panel illumination configured as described above includes a plurality of heat dissipating protrusions 11 protruding inwardly and formed into a cylindrical shape with one side opened, The housing 10 having the housing wiring hole 13 formed therein is prepared.

The heat radiating protrusions 11 may be perpendicular to the PCB 20 and formed into a cylinder.

Here, the heat dissipation protrusion 11 is formed with a heat storage hole 12 whose outside is opened so that the heat accumulated by the natural convection while discharging the heat of the PCB 20 which is conducted is discharged to the outside.

When the temperature of the air flowing into the heat storage holes 12 becomes higher due to the heat of the heat dissipating protrusions 11 due to the formation of the heat storage holes 12, the temperature of the air is different from the atmospheric temperature and circulated by natural convection, Lt; / RTI >

Since the heat dissipating protrusion 11 formed with the heat accumulating hole 12 protrudes inwardly from the housing 10, the surface area is increased to widen the contact surface of the PCB 20 and to increase the contact area with the atmosphere The specific surface area is increased and the heat radiation performance can be greatly improved.

Meanwhile, the heat dissipating protrusion 11 may be formed at the tip of the latch 20 to prevent the PCB 20 from escaping when the PCB 20 is mounted.

A plurality of heat dissipating protrusion insertion holes 22 for mounting LEDs 21 for emitting light and for inserting the heat dissipating protrusions 11 of the housing 10 and a PCB wiring hole 13 corresponding to the housing wiring hole 13, The PCB 20 on which the PCB 24 is formed is coupled to the housing 10.

In order to insulate the heat dissipating protrusion 11 inserted into the heat dissipating protrusion inserting hole 22, the PCB 20 has a single pattern with an electric circuit on one side, and the edge of the heat dissipating protrusion inserting hole 22 The circuit cut-off surface 23 is formed so as not to constitute the electric circuit.

4A to 4B, the PCB 20 is inserted into the heat dissipation protrusion insertion hole 22 so that the other surface of the PCB 20 is in close contact with the inner lower surface of the housing 10, The protrusion 11 is inserted.

At this time, if the heat dissipating protrusion insertion hole 22 is inserted into the heat dissipating protrusion 11, the PCB 20 can be mounted so as not to be detached due to the protrusion of the heat dissipating protrusion 11.

The PCB 20 is inserted into the housing wiring hole 13 of the housing 10 and the PCB wiring hole 24 of the PCB 20 while passing through the wiring.

Since the housing 10 and the PCB 20 are inserted into the heat dissipating protrusion insertion hole 22 of the PCB 20, the heat dissipating protrusion 11 protruding inward of the housing 10 is inserted into the housing 10 and the PCB 20, The contact surface between the heat dissipating protrusion 11 and the PCB 20 is widened and the heat generated by the LED 21 is transferred to improve the thermal conductivity of the PCB 20 to conduct heat to the heat dissipating protrusion 11 .

Meanwhile, heat transfer efficiency can be improved by using a thermally conductive adhesive agent 25 such as epoxy in a gap formed between the heat dissipating protrusion 11 and the heat dissipating protrusion insertion hole 22.

The use of the thermally conductive adhesive 25 improves the heat transfer efficiency in accordance with reference 2 [Reference 2: Sang-Kyu Park, Sanghoon Park, and Kyung-Hoon Kim, 2009, "Design and Fabrication of a Heat Radiation System for LED Lamps" , P.2431-2436, 2009], by using a heat-conductive adhesive to increase the heat transfer efficiency while eliminating the gap between the LED substrate and the heat sink, the temperature of the LED substrate is reduced by about 10 ° C compared to the case where the heat- . Therefore, by using the thermally conductive adhesive 25, not only the bonding force between the housing 10 and the PCB 20 can be improved, but also the heat transfer efficiency can be improved.

The cover 30 is stacked on the housing 10 to which the PCB 20 is coupled and then fixed to cover the opening face of the housing 10.

The LED lighting apparatus thus manufactured is installed so that the outer lower surface of the housing 10 is adjacent to the ceiling or wall surface of the room.

Accordingly, the LED lighting apparatus manufactured as described above has a surface area increased by forming the heat dissipating protrusion 11 inwardly in the housing 10, and the specific surface area is increased, thereby greatly improving the heat dissipation performance.

In other words, when the PCB 20 is inserted into the heat dissipating protrusion 11 of the housing 10, the contact surface between the heat dissipating protrusion 11 and the PCB 20 is widened, There is an effect of improving the thermal conductivity by which the heat of the PCB 20 transferred to the heat dissipating protrusion 11 is conducted.

In addition, since the heat accumulating hole 11 of the heat dissipating protrusion 11 is formed, the area exposed to the atmosphere can be enlarged, and the heat of the PCB 20 can be rapidly dissipated through natural convection, It is advantageous in that the manufacturing cost is reduced.

As described above, since the heat radiation performance is improved, damage to the LED 21 due to the high temperature and shortening of the service life can be prevented, thereby greatly improving the merchantability of the product.

In addition, since the heat dissipating protrusion 11 is not exposed to the outside as in the prior art, the appearance of the heat dissipating protrusion 11 can be improved.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention if they are apparent to those skilled in the art.

10: housing 11: heat radiating projection
12: heat storage hole 13: housing wiring hole
20: PCB 21: LED
22: Heat dissipation projection insertion hole 23: Circuit cut-off surface
24: PCB wiring hole 25: thermally conductive adhesive
30: cover

Claims (4)

And a cover (30) mounted on an opening of the housing (10), the LED lighting device comprising: a housing (10) for mounting a PCB (20) In this case,
The housing 10 includes a plurality of heat dissipating protrusions protruding inwardly to be vertically coupled to the PCB 20 to receive heat generated from the PCB 20 on the inner side of the PCB 20 11)
The heat dissipating protrusion 11 includes a heat accumulating hole 12 for discharging the heat accumulated in the natural convection while discharging the heat that has been hollow and opened to the outside of the housing 10 and conducted, A hooking jaw is formed to prevent the detachment of the hook 20,
The PCB 20 includes a plurality of heat dissipating protrusion insertion holes 22 to be inserted into and bonded to the heat dissipating protrusions 11 and an edge of the heat dissipating protrusion insertion holes 22 to be insulated from the heat dissipating protrusions 11 A circuit blocking surface 23 of an insulator is formed,
And a thermally conductive adhesive (25) is applied to the outside of the heat dissipating protrusion (11) which is sandwiched by the heat dissipating protrusion insertion hole (22) and adjacent to the PCB (20) to improve thermal conductivity. Lighting device.
The method according to claim 1,
Wherein the heat dissipating protrusion (11) is formed of a cylindrical or polygonal columnar shape. delete delete
KR1020160032942A 2016-03-18 2016-03-18 Led lighting apparatus having heat radiant function KR101673568B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019743A (en) * 2003-06-26 2005-01-20 Minebea Co Ltd Heat radiation mounting structure of electric equipment
WO2010146933A1 (en) * 2009-06-17 2010-12-23 シャープ株式会社 Display device and television receiver
KR20120106374A (en) * 2011-03-18 2012-09-26 주식회사 벤츠산업조명 Led lighting
KR20140074525A (en) * 2012-12-10 2014-06-18 엘지이노텍 주식회사 Light emitting device array module and lighting system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019743A (en) * 2003-06-26 2005-01-20 Minebea Co Ltd Heat radiation mounting structure of electric equipment
WO2010146933A1 (en) * 2009-06-17 2010-12-23 シャープ株式会社 Display device and television receiver
KR20120106374A (en) * 2011-03-18 2012-09-26 주식회사 벤츠산업조명 Led lighting
KR20140074525A (en) * 2012-12-10 2014-06-18 엘지이노텍 주식회사 Light emitting device array module and lighting system

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Tae Sung Jung and Hwan Kook Kang, 2013 "Investigation of Natural Convective Heat Flow Characteristics of Heat Sink", Trans. Korean Soc. Mech. Eng. B, Vol. 37, No. 1, pp. 27~33
이상규, 박상훈, 김경훈, 2009, "LED 램프의 방열시스템 설계 및 제작", 대한기계학회 춘추학술대회, P.2431-2436, 2009

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