KR101672648B1 - Antireflection coating layer using nano-structure for solar cell device and its production method - Google Patents
Antireflection coating layer using nano-structure for solar cell device and its production method Download PDFInfo
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- KR101672648B1 KR101672648B1 KR1020150119147A KR20150119147A KR101672648B1 KR 101672648 B1 KR101672648 B1 KR 101672648B1 KR 1020150119147 A KR1020150119147 A KR 1020150119147A KR 20150119147 A KR20150119147 A KR 20150119147A KR 101672648 B1 KR101672648 B1 KR 101672648B1
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- 239000002086 nanomaterial Substances 0.000 title claims abstract description 173
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000011247 coating layer Substances 0.000 title description 2
- 239000010409 thin film Substances 0.000 claims abstract description 52
- 239000010408 film Substances 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 21
- 239000003054 catalyst Substances 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 4
- 238000005063 solubilization Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 129
- 230000015572 biosynthetic process Effects 0.000 description 9
- 230000004907 flux Effects 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000000059 patterning Methods 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000003980 solgel method Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- -1 CIGS Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002173 high-resolution transmission electron microscopy Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000002070 nanowire Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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- 238000005530 etching Methods 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011254 layer-forming composition Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02366—Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Abstract
Description
BACKGROUND OF THE
In order to reduce reliance on fossil fuels worldwide, research and development on alternative energy and clean energy, which are new energy sources that do not cause exhaustion without adversely affecting the environment, are actively under way.
At one time, nuclear power was developed as a viable alternative energy and showed a high contribution, but it is gradually decreasing its reliance on it due to instability and serious damage caused by accidents, The solar power generation system that converts solar energy into electricity using solar cells is becoming more popular as a practical application.
A solar cell is a semiconductor device that converts solar energy directly into electric energy. It has a form of p-type and n-type semiconductor junctions. Its basic structure is similar to diodes and has been proposed and utilized in various structures.
For example, in Japanese Patent No. 1541657, in a solar cell having a selective emitter structure, the purpose of suppressing a positional shift between an n + -type diffusion layer having a high n-type impurity concentration directly below an electrode and an electrode is proposed, And an n + -type diffusion layer having a higher n-type impurity concentration than the n-type diffusion layer, wherein the surface of the n + -type diffusion layer has a concave portion.
In addition, Japanese Laid-Open Patent Publication No. 2014-0057189 discloses a method of manufacturing a solar cell element having a p-type diffusion layer-forming composition containing a boron nitride, a dispersion medium, and an inorganic binder, and a p-type diffusion layer.
Japanese Patent No. 1149768 discloses a method for producing a III-V compound solar cell based on a silicon substrate, comprising the steps of: a) etching a surface, heating the substrate to a predetermined temperature preset in an organometallic chemical vapor deposition reaction tube, Providing a silicon substrate having properties; b) forming a seed layer of a III-V compound on the silicon substrate provided in the step a), depositing a metal electrode and a dielectric layer thereon, patterning the deposited electrode and the dielectric layer, Growing the III-V compound into a rod-shaped solar cell by controlling the temperature and pressure of the deposition reaction tube; And c) forming a transparent electrode on the outside of the solar cell cell of the III-V compound grown selectively as a vertical bar according to the patterning in the step b) so that the sheet resistance is reduced. Lt; / RTI >
In addition to the structure for enhancing the characteristics of the device itself, the structure for reducing the reflectance of the surface of the solar cell element to increase the overall efficiency is an anti-reflection film. Conventional antireflection films use a single-layer insulator thin film, and at this time, it is common to form an antireflection film confined to a single target wavelength through the control of the thickness of the thin film. However, have.
In addition, a conventional method of improving the characteristics of various wavelengths using nano patterning is also proposed. However, this method is disadvantageous in terms of cost due to the addition of an expensive patterning process, Surface recombination occurs.
SUMMARY OF THE INVENTION The present invention has been made in order to overcome the disadvantages of the prior art as described above, and it is an object of the present invention to provide an antireflection film for a solar cell using a nanostructure having a low manufacturing cost and a low surface reflectivity by controlling the density of the nanostructure do.
It is another object of the present invention to provide a method for manufacturing an antireflection film for a solar cell which is low in manufacturing cost.
According to an aspect of the present invention, there is provided an antireflection film for a solar cell using a nanostructure formed on a surface of a solar cell plate, the antireflection film comprising: a thin film layer formed on a surface of the solar cell plate; A first nanostructure layer formed on the top of the thin film layer and including a dense nanostructure; And a second nanostructure layer formed on the first nanostructure layer and including a porous nanostructure.
Preferably, the thickness of the thin film layer is 50 nm to 500 nm.
More preferably, the material of the thin film layer is ITO.
More preferably, the first nanostructure layer and the second nanostructure layer are made of the same material as the thin film layer, the density of the first nanostructure layer is 80 to 90%, and the density of the second nanostructure layer is 10 to 30%.
More preferably, the thickness of the first nanostructure layer is 100 nm to 500 nm, and the thickness of the second nanostructure layer is 10 nm to 10 μm.
More preferably, the second nanostructure layer is formed by applying an oblique angle deposition method in addition to a self catalyst vapor-liquid-liquid (VLS) method.
According to another aspect of the present invention, there is provided a method of manufacturing an antireflection film for a solar cell using a nanostructure, the method comprising: preparing a solar panel for preparing a solar panel for forming an antireflection film on a surface; A thin film layer forming step of forming a thin film layer on the surface of the solar cell plate; A first nanostructure layer forming step of forming a first nanostructure layer on top of the thin film layer; And forming a second nanostructure layer having a density different from that of the first nanostructure layer on the first nanostructure layer.
Preferably, the thickness of the thin film layer is 50 nm to 500 nm.
More preferably, the material of the thin film layer is ITO.
More preferably, the first nanostructure layer and the second nanostructure layer are made of the same material as the thin film layer, the density of the first nanostructure layer is 80 to 90%, and the density of the second nanostructure layer is 10 to 30%.
More preferably, the first nanostructure layer forms a nanostructure by self-catalyst vapor-liquid-liquid (VLS) method.
Preferably, the second nanostructure layer is formed by applying an oblique angle deposition method in addition to the self catalyst vapor-liquid-liquid (VLS) method.
The antireflection film for a solar cell using the nanostructure according to the present invention is formed on the surface of a solar cell and includes a thin film layer, a first nanostructure layer formed on the top of the thin film, and a second nanostructure layer formed on the top of the first nanostructure layer Wherein the first nanostructure layer and the second nanostructure layer have different densities so that the reflectance of light radiated from the outside is extremely lowered and the transmittance of the solar cell is increased to increase the efficiency of the solar cell have.
1 is a sectional view of an antireflection film for a solar cell using the nanostructure according to the present invention,
FIG. 2 is a flowchart illustrating a method of manufacturing an antireflection film for a solar cell using the nanostructure according to the present invention.
FIG. 3 is a schematic diagram of the solar panel preparation step shown in FIG. 2,
4 is a schematic view of the thin film layer forming step shown in FIG. 2,
5 is a schematic view of the first nanostructure layer forming step shown in FIG. 2,
FIG. 6 is a schematic diagram of the second nanostructure layer forming step shown in FIG. 2,
7 is an XRD and HR-TEM graph of the antireflection film formed in the example,
8 is a graph of transmittance and reflectance of the antireflection film formed in Example,
FIG. 9 is a graph of transmittance of an antireflection film formed according to an embodiment,
10 is an IV curve of the solar cell before and after the formation of the nanostructure,
11 is a parameter of the solar cell before and after the formation of the nanostructure,
FIG. 12 is a graph of the solar cell efficiency measurement according to the incident angle of light, a daily output power graph and an annual output power graph according to the southern elevation of Seoul in 2014.
Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings.
1, the
First, the
The present invention is applied to the
The
The material of the
The
At this time, if the thickness of the
It is preferable that the process conditions are set by setting the angle of incidence of the flux at 90 degrees in a state where no reactive gas is inserted in a vacuum atmosphere of 6 torr.
Meanwhile, the
At this time, the nanostructure (nanowire) formed in the
The thickness of the
The first
At this time, the
Particularly, the
Preferably, the
Here, the density (volume ratio) means the percentage of the volume ratio of the nanostructure to the total volume.
The
The
At this time, the
The
In addition, the nanostructure of the
Also, the thickness of the
Hereinafter, a method for fabricating an antireflection film for a solar cell using the nanostructure according to the present invention will be described.
As shown in FIG. 2, the method for fabricating an antireflection film for a solar cell using the nanostructure according to the present invention includes a solar cell plate preparation step S1, a thin film layer formation step S2, a first nanostructure layer formation step S3, 2 nanostructure layer forming step (S4).
Each step will be described below.
Solar panel preparing step (S1)
The solar panel preparation step S1 is a step of preparing a
The
Thin Film Layer Forming Step (S1)
The thin film layer forming step S1 is a step of forming the
The material of the
The
The thickness of the
The first nanostructure layer forming step (S3)
The first nanostructure layer forming step S3 is a step of forming a dense nanostructure on the top of the
The nanostructure is formed as a typical nanostructure and is formed in an upward direction and exhibits high density characteristics.
The material of the
In addition, the nanostructure of the
The thickness of the
The
Further, it is preferable to perform the self-catalyst Vapor-Liquid-Solvent (VLS) method in which a separate catalyst is not required.
The second nanostructure layer formation step (S4)
As shown in FIG. 6, the second nanostructure layer forming step S4 may include forming an additional nanostructure layer on top of the
Accordingly, the two layers have a density difference due to the nanostructure contained therein, and exhibit an effect of preventing reflection of light due to the density difference.
At this time, the
The
At this time, the
The thickness of the
The method for fabricating an antireflection film for a solar cell using the nanostructure according to the present invention comprises a
Example
An antireflection film was formed on the
In this case, the material is ITO, the thickness of the
The thickness of the
The density ratio of the nanostructure to the nanostructure of the
Test example (optical property test)
7 is an XRD and HR-TEM graph of the antireflection film formed in the above embodiment. Referring to FIG. 7, it was confirmed that the nanostructure of the anti-reflection film manufactured according to the present invention is a single crystal.
8 is a graph of transmittance and reflectance of the above embodiment. It can be seen that the reflectance at the height of 2 μm of the nanostructure is about 7% and the transmittance is 96%.
9 is a graph of transmittance for each wavelength according to the embodiment. 9, it was confirmed that the overall diffraction by wavelength according to the height of the nanostructure is lowered.
10 is an I-V curve of the solar cell before and after the formation of the nanostructure, and FIG. 11 is a parameter of the solar cell before and after the formation of the nanostructure.
10 and 11, when the efficiency was measured at a typical angle of incidence of AM 1.5G before and after coating the nanostructure on the solar cell, the efficiency increase rate was 48% at 1 nm of the nanostructure, Respectively.
FIG. 12 is a graph of the solar cell efficiency according to the angle of incidence of light (left and top), a daily output power graph (right and top) and an annual output power graph (left and bottom) according to the southern elevation of Seoul in 2014.
12, it can be seen that the longer the length of the nanostructure, the greater the amount of light absorbed due to the Refractive Index Matching. Further, considering the annual output power, the GRIN 2um shows the highest output power improvement rate.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, And all of the various forms of embodiments that can be practiced without departing from the technical spirit.
1: Solar panel 10: Thin layer
20: first nanostructure layer 30: second nanostructure layer
100: antireflection film
S1: Solar panel preparing step S2: Thin film forming step
S3: First nanostructure layer formation step S4: Second nanostructure layer formation step
Claims (12)
A thin film layer formed on the surface of the solar cell plate;
A first nanostructure layer formed on the top of the thin film layer and including a dense nanostructure; And
And a second nanostructure layer formed on the first nanostructure layer and including a porous nanostructure,
Wherein the first nanostructure layer and the second nanostructure layer are made of the same material as the thin film layer,
The density of the first nanostructure layer is 80 to 90% and the density of the second nanostructure layer is 10 to 30%
Wherein the density is a percentage of the volume ratio of the nanostructure to the total volume of each layer.
A solar panel preparation step of preparing a solar panel for forming an antireflection film on a surface;
A thin film layer forming step of forming a thin film layer on the surface of the solar cell plate;
A first nanostructure layer forming step of forming a first nanostructure layer on top of the thin film layer; And
And forming a second nanostructure layer having a density different from that of the first nanostructure layer on the first nanostructure layer,
Wherein the first nanostructure layer and the second nanostructure layer are made of the same material as the thin film layer,
The density of the first nanostructure layer is 80 to 90% and the density of the second nanostructure layer is 10 to 30%
The density is a percentage of the volume ratio of the nanostructure to the total volume of each layer,
The first nanostructure layer forming step may include forming a nanostructure using a self catalyst vapor-liquid-soli (VLS)
Wherein the second nanostructure layer forming step forms a nanostructure by applying an oblique angle deposition method in addition to a self-catalyst vapor-liquid-solubilization (VLS) method.
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100109307A (en) * | 2009-03-31 | 2010-10-08 | 엘지이노텍 주식회사 | Solar cell and method of fabricating the same |
KR20120029235A (en) * | 2010-09-16 | 2012-03-26 | 한국전자통신연구원 | Solar cell and method of forming the same |
US8941001B1 (en) * | 2009-11-17 | 2015-01-27 | Aeris Capital Sustainable Ip Ltd. | Transparent layer with anti-reflective texture |
US20150162459A1 (en) * | 2013-12-11 | 2015-06-11 | Tsmc Solar Ltd. | Solar cell anti reflective coating and wet chemical method for forming the same |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20100109307A (en) * | 2009-03-31 | 2010-10-08 | 엘지이노텍 주식회사 | Solar cell and method of fabricating the same |
US8941001B1 (en) * | 2009-11-17 | 2015-01-27 | Aeris Capital Sustainable Ip Ltd. | Transparent layer with anti-reflective texture |
KR20120029235A (en) * | 2010-09-16 | 2012-03-26 | 한국전자통신연구원 | Solar cell and method of forming the same |
US20150162459A1 (en) * | 2013-12-11 | 2015-06-11 | Tsmc Solar Ltd. | Solar cell anti reflective coating and wet chemical method for forming the same |
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