KR101668035B1 - Improved semiconductor chip package - Google Patents

Improved semiconductor chip package Download PDF

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Publication number
KR101668035B1
KR101668035B1 KR1020160074315A KR20160074315A KR101668035B1 KR 101668035 B1 KR101668035 B1 KR 101668035B1 KR 1020160074315 A KR1020160074315 A KR 1020160074315A KR 20160074315 A KR20160074315 A KR 20160074315A KR 101668035 B1 KR101668035 B1 KR 101668035B1
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KR
South Korea
Prior art keywords
package body
semiconductor chip
package
reinforcing
chip package
Prior art date
Application number
KR1020160074315A
Other languages
Korean (ko)
Inventor
최윤화
최순성
조정훈
Original Assignee
제엠제코(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제엠제코(주) filed Critical 제엠제코(주)
Priority to KR1020160074315A priority Critical patent/KR101668035B1/en
Application granted granted Critical
Publication of KR101668035B1 publication Critical patent/KR101668035B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage

Abstract

The present invention relates to a semiconductor chip package having a structure that prevents a package body from being damaged by a strong pressure when a bolt is coupled to a heat sink or a heat slug by increasing the bonding strength to the surface of the joint portion formed in the semiconductor chip package. And an improved semiconductor chip package.
That is, according to the present invention, there is provided a semiconductor device comprising: a package body in which semiconductor components are disposed and formed by molding; an engaging portion provided at both sides of the package body and vertically penetrated to be bolted to another heat dissipating means; And a reinforcing support portion formed in a shape recessed inside the coupling portion, wherein one surface of the reinforcing support portion is exposed on a surface of the coupling portion.

Description

[0001] The present invention relates to an improved semiconductor chip package,

The present invention relates to a semiconductor chip package having a structure that prevents a package body from being damaged by a strong pressure when a bolt is coupled to a heat sink or a heat slug by increasing the bonding strength to the surface of the joint portion formed in the semiconductor chip package. And an improved semiconductor chip package.

BACKGROUND ART [0002] Generally, a semiconductor chip package includes a package body made of a thermosetting material such as EMC (Epoxy Molding Compound), and a component such as a substrate, a semiconductor chip, and a lead frame disposed in the package body. It is used in electronic products.

In addition, since such a semiconductor chip package generates a lot of heat when current is supplied, a heat dissipation means such as a heat sink or a heat slug is essentially required.

Therefore, in order to use the semiconductor chip package together with the heat dissipating means, the semiconductor chip package is coupled to the joint portion formed in the semiconductor chip package by bolts and fixed to the heat dissipating means. However, in the process of assembling the bolts, the package body having a strength comparatively weaker than that of the metal bolt is inevitably relatively weak. In such a bad condition, the surface of the package body may be damaged due to the strong pressure of the bolts.

Below is a description of prior art techniques for preventing damage to semiconductor chip packages.

(1) Registered Patent No. 10-0951888 (semiconductor package structure) includes a case having a space portion; A cover is provided at an upper end of the case so as to close the space, and a fastening force is improved in the fastening part of the fastening part There is proposed a technique in which a washer member is provided.

The prior art described above is a technique in which a washer member is separately provided and is fitted in a slit portion formed in a coupling portion. Since the washer member must be fitted to the slit portion before the bolt is engaged, a troublesome operation occurs and slit portions and cut- Therefore, since the washer member is structurally placed on the surface of the engaging portion, the pressure of the bolt is directly transferred to the engaging portion through the washer member, thereby achieving a great effect of suppressing the breakage I can not.

(Patent Document 1) Japanese Patent Application Laid-Open No. 10-0687067 (a lead frame having a dummy lead for preventing package cracking and a semiconductor chip package using the same) includes a pair of guide rails parallel to each other, a pair of dam bars vertically connected to the guide rails, A plurality of semiconductor integrated circuit devices disposed on both sides of the die pad and electrically connected to the semiconductor integrated circuit device, the semiconductor integrated circuit device comprising: Although techniques including internal leads are presented,

The prior art does not cause defects such as package cracks when the molded package body is separated from the mold, and does not disclose any structure for preventing breakage of the coupling portion when the package body is coupled with the heat dissipating means.

(C) a heat-resistant semiconductor package and a method of manufacturing the same, wherein the heat-resistant semiconductor package includes at least a semiconductor substrate including an integrated circuit portion, at least locally formed around the integrated circuit portion of the substrate, And a crack propagation preventing portion filled in the crack propagation preventing portion, wherein the trench penetrating through the substrate vertically is filled with a dissimilar material different from the substrate material.

The prior art is a technique for preventing internal damage to parts due to an external impact, and this technique can not solve the problem that the package body is broken by the bolts when the heat dissipating means is coupled.

The present invention has been conceived in order to solve the above-mentioned problems, and it is an object of the present invention to improve a structure in which a joint portion to be in contact with a bolt is integrally formed with a reinforcement support portion, An object of the present invention is to provide a semiconductor chip package having an improved coupling portion having a structure for preventing the body from being broken.

The present invention relates to a semiconductor device comprising a package body in which a semiconductor component is disposed and formed by molding, an engaging portion provided on both sides of the package body and vertically penetratingly formed so as to be bolted to another heat dissipating means, And a reinforcement supporting part formed in a shape of being embedded in the inside of the reinforcing supporting part, wherein one side of the reinforcing supporting part is exposed on the surface of the engaging part.

The reinforcement supporting part is formed together with the package body so as to be integrally formed with the coupling part of the package body.

In addition, the reinforcing support portion is formed in a plate shape having a predetermined thickness, and is formed into an exposed surface on an upper portion and a bent portion formed on the upper surface, and inserted into the package body.

The reinforcement supporting part is composed of a first supporting piece coming into the inside from the outside of the package body and a second supporting piece bent in the vertical direction from the first supporting piece to the exposed surface.

The reinforcing support portion has a cylindrical shape having a constant inner diameter, an upper portion of which is formed with an outer diameter corresponding to the size of the engaging portion, and a support tube portion having a size smaller than the outer diameter of the support plate portion, Is vertically long and inserted into the package body.

Further, a step is formed on the outer circumferential surface of the support tube at a predetermined height to increase the coupling force with the package body.

According to the present invention, the reinforcing support portion is partially formed on the surface of the coupling portion of the package body, thereby providing a structure in which the bolt head is closely attached to the bottom surface of the bolt.

Further, since the reinforcing and supporting portion serves as a rigid frame in the coupling portion, it has an effect of enhancing the supporting force of the coupling portion and preventing the coupling portion from being broken by external pressure.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an example of bolt connection of a semiconductor chip package according to the present invention; Fig.
2 is a perspective view showing a semiconductor chip package of the present invention.
3 is a cross-sectional view of the semiconductor chip package of the present invention
4 is a perspective view showing a reinforcement supporting portion of the present invention.
5 is a perspective view showing a process of forming the reinforcing support portion of the present invention
6 is a view showing that the reinforcing and supporting portion of the present invention is integrally formed by being molded together in the molding process of the package body
7 is a perspective view showing a semiconductor chip package to which another type of reinforcing support portion is applied in the present invention.
8 is a perspective view showing the reinforcement supporting portion of Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

When a conventional semiconductor chip package is bolted to a heat dissipating means such as a heat sink or a heat slug, the package body having a strength comparatively weaker than that of a metal bolt is relatively weak, There is a problem that the surface of the package body is damaged due to the strong pressure of the bolt during the process. By increasing the bonding strength to the surface of the coupling portion formed on the semiconductor chip package through the improved semiconductor chip package of the present invention, So as to prevent the package body from being damaged.

The present invention provides a package body 100 in which a semiconductor component is disposed and formed by molding and a separate heat dissipating means 10 and bolts 20 are provided on both sides of the package body 100, And a reinforcement supporting part 300 formed in a shape recessed inward of the engaging part 200. The reinforcing supporting part 300 may have one surface of the reinforcement supporting part 300, 200). ≪ / RTI >

The package body 100 of the present invention is formed through a mold, and a thermosetting material such as EMC (epoxy molding compound) is used. Various semiconductor parts are disposed inside the package body 100, It is a form to wrap around. The semiconductor component may be composed of a substrate 110 on which a circuit pattern is formed, a semiconductor chip 120, a lead frame 130, a bonding wire 140 and the like as shown in the figure, And may be changed according to the specifications and application fields of the chip package. However, the present invention is not limited thereto.

The joint portion 200 of the present invention is vertically penetrated on both sides of the package body 100 by inserting bolts 20 for coupling with the heat dissipating means 10. [ The shape of the coupling part 200 may be formed as a circular hole and may be formed such that one side is opened in a "U" shape. When the bolt 20 is coupled, A groove having a certain depth may be formed so as to be embedded in the groove.

The reinforcement supporting part 300 of the present invention is formed of a metal material and is formed in the shape of being embedded in the inside of the coupling part 200 and only one side of the reinforcing supporting part 300 is exposed on the upper surface of the coupling part 200. At this time, the exposed portion of the reinforcing support portion 300 may be formed to be the same as the surface of the coupling portion 200 without being protruded or protruded slightly more than the upper surface of the coupling portion 200. The reinforcing support 300 having the one surface exposed on the upper surface of the coupling part 200 is formed to be in tight contact with the bottom surface of the head of the bolt 20 when the bolt 20 is coupled, The strength can be increased.

6, the reinforcement supporting part 300 may not be separated from the engaging part 200. In the injection molding process of the package body 100 by the mold, as shown in FIG. 6, And is formed integrally with the coupling part 200 of the package body 100 by being molded together with the package body 100 after positioning the coupling part 200 at an accurate position. The structure in which the reinforcing supporter 300 is integrally formed with the engager 200 is advantageous in that the reinforcing supporter 300 of the recessed portion serves as a rigid frame in the engager 200, Thereby preventing the coupling portion 200 from being damaged by external pressure.

The reinforcing supporter 300 is formed in the shape of a plate having a predetermined thickness so that the exposed surface 310 is formed on the upper surface and the bolt 20 is formed in the central portion of the exposed surface 310 in the same manner as the engaging portion 200, And the remaining portion except for the exposed surface 310 is bent and inserted into the inside of the package body 100. That is, the reinforcing supporter 300 is not simply formed in a "one" shape, but as shown in the drawing, the reinforcing supporter 300 has a first And a second support piece 330 bent in a direction perpendicular to the exposed surface 310 from the first support piece 320. By bending the reinforcing support portion 300 in this manner, the reinforcing support portion 300 can be more firmly supported in the engaging portion 200. [ The third supporting piece 340 is further bent at an extended portion passing through the exposed surface 310 to prevent separation of the exposed surface 310 of the reinforcing supporting portion 300 It can be firmly fixed.

Although the plate-like reinforcing supporter 300 is shown in the drawing so that the exposed surface 310 has a rectangular shape, it can be deformed in a semicircular shape or a circular shape depending on the shape of the coupling portion 200 Of course, the mounting position of the reinforcing support portion 300 may not be provided only on the upper surface of the coupling portion 200, but may be provided at one of the upper and lower portions of the coupling portion 200.

7 to 8 of the present invention show another embodiment of the reinforcing supporter 300. The reinforcing supporter 300 may have a cylindrical shape having a constant inner diameter instead of a plate-like structure. The cylindrical reinforcing supporter 300 includes a support plate 350 having an exposed surface 310 and an outer diameter corresponding to the size of the engager 200, A support cylinder 360 having a size smaller than the outer diameter of the support body 350 is vertically elongated and inserted into the package body 100.

In addition, when the step 361 is formed on the outer surface of the support tube 360 at a predetermined height, the coupling force with the package body 100 can be further increased. Two or more of the stepped portions 361 may be formed, and a similar effect can be obtained by forming concave and convex portions that are not in the shape of the step 361.

By forming the reinforcement supporting portion 300 in a cylindrical shape, it is possible to improve not only the surface of the coupling portion 200 contacting the bolt 20 but also the overall supporting force of the coupling portion 200, The damage of the coupling part 200 due to the bolt 20 can be minimized because the reinforcing support part 300 is exposed.

While the present invention has been described with reference to the exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

10: heat sink 20: bolt
100: package body 110: substrate
120: semiconductor chip 130: lead frame
140: Bonding wire
200: coupling part 300: reinforcing support part
310: exposed surface 320: first support piece
330: second support piece 340: third support piece
350: support plate portion 360: support tube portion
361: step

Claims (6)

A package body 100 in which a semiconductor component is disposed and formed by molding,
A coupling part 200 provided at both sides of the package body 100 and vertically penetrated to be coupled with a separate heat dissipating means 10 and a bolt 20,
And a reinforcement supporting part 300 formed in a shape recessed inside the coupling part 200. One surface of the reinforcing supporting part 300 is exposed on the surface of the coupling part 200,
The reinforcing supporter 300 is formed in a plate shape having a predetermined thickness so that the exposed surface 310 is formed on the upper surface of the reinforcing supporter 300 and the remainder is bent to be inserted into the package body 100. In this embodiment, A first support piece 320 which is inserted into the package body 100 from the outside of the package body 100 in a direction in which the first support piece 320 is formed and a second support piece 320 which is bent in the vertical direction from the first support piece 320 to the exposed surface 310, And a third support piece (340) bent diagonally at an extended portion passing through the exposed surface (310). The semiconductor chip package
The method according to claim 1,
Wherein the reinforcing supporter 300 is molded together with the package body 100 and integrally formed with the engaging portion 200 of the package body 100. [
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KR1020160074315A 2016-06-15 2016-06-15 Improved semiconductor chip package KR101668035B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160074315A KR101668035B1 (en) 2016-06-15 2016-06-15 Improved semiconductor chip package

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Application Number Priority Date Filing Date Title
KR1020160074315A KR101668035B1 (en) 2016-06-15 2016-06-15 Improved semiconductor chip package

Publications (1)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0569473B2 (en) * 1988-06-16 1993-10-01 Mitsubishi Electric Corp
JP2010034348A (en) * 2008-07-30 2010-02-12 Sanyo Electric Co Ltd Semiconductor device and semiconductor module
JP4569473B2 (en) * 2006-01-04 2010-10-27 株式会社日立製作所 Resin-encapsulated power semiconductor module
JP2014183242A (en) * 2013-03-20 2014-09-29 Denso Corp Semiconductor device and method for manufacturing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0569473B2 (en) * 1988-06-16 1993-10-01 Mitsubishi Electric Corp
JP4569473B2 (en) * 2006-01-04 2010-10-27 株式会社日立製作所 Resin-encapsulated power semiconductor module
JP2010034348A (en) * 2008-07-30 2010-02-12 Sanyo Electric Co Ltd Semiconductor device and semiconductor module
JP2014183242A (en) * 2013-03-20 2014-09-29 Denso Corp Semiconductor device and method for manufacturing the same

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