KR101657651B1 - Mems microphone package having extension back chamber and manufacturing method thereof - Google Patents

Mems microphone package having extension back chamber and manufacturing method thereof Download PDF

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Publication number
KR101657651B1
KR101657651B1 KR1020150122853A KR20150122853A KR101657651B1 KR 101657651 B1 KR101657651 B1 KR 101657651B1 KR 1020150122853 A KR1020150122853 A KR 1020150122853A KR 20150122853 A KR20150122853 A KR 20150122853A KR 101657651 B1 KR101657651 B1 KR 101657651B1
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KR
South Korea
Prior art keywords
inner case
substrate
back chamber
case
connection terminal
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KR1020150122853A
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Korean (ko)
Inventor
조우성
김용국
김진선
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주식회사 비에스이센서스
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

The present invention relates to a MEMS microphone package having an extension back chamber and a manufacturing method thereof, capable of extending the back volume space of a MEMS transducer by using an inner case and preventing damage to a substrate when being welded to an outer case with laser. The MEMS microphone package of the present invention comprises: the substrate (150) having a coupling groove (151); the inner case (140) having a cask shape with one open surface, having connection terminals (142, 143) protruding from the open surface to the side thereof, mounting the MEMS transducer (130) and a readout integrated circuit (120) on the upper surface thereof, and coupled to the coupling groove (151) to form an additional back chamber space between the substrate (150) and the inner case; and the outer case (110) having a cask shape with one open surface, having a portion of the open surface welded to the connection terminals (142, 143) of the inner case, and stacked on the substrate (150) while interposing the inner case (140). Therefore, the back chamber space of the MEMS transducer (130) is extended. The bonding surfaces of the substrate (150) and the outer case (110) are sealed with an adhesive (160) after the outer case (110) is welded to the inner case (140) and not the substrate (150). The MEMS microphone package and the manufacturing method thereof according to the present invention enable the smooth vibration of a vibration plate by additionally extending or forming the additional back chamber space between the inner case and the substrate to maximize the back volume space of the MEMS transducer, thereby improving the sensitivity of a microphone and significantly mitigating noise such as total harmonic distortion (THD).

Description

TECHNICAL FIELD [0001] The present invention relates to an MEMS microphone package having an extended back chamber space and a method of manufacturing the MEMS microphone package.

[0001] The present invention relates to a MEMS microphone package having a back chamber space, and more particularly, to an MEMS microphone package having a back chamber space, more particularly, to expand the back volume space of an osseous transducer using an inner case, The present invention also relates to a method of manufacturing an EMI microphone package having an extended back chamber space.

2. Description of the Related Art Generally, a condenser microphone widely used in a mobile communication terminal, audio, and the like includes a diaphragm / backplate pair forming a capacitor C that varies in response to a sound pressure, And a field effect transistor (JFET).

In this conventional condenser microphone, a diaphragm, a spacer ring, an insulating ring, a back plate, and an energizing ring are sequentially inserted into a case, and finally, the PCB with circuit components is inserted and the end of the case is bent toward the PCB .

On the other hand, there is a semiconductor processing technology using micromachining as a technology used for integrating a micro device in recent years. In other words, this technology called MEMS (Micro Electro Mechanical System) can manufacture micromachined sensors, actuators and electromechanical structures in the order of micrometers by using a micromachining technique applying semiconductor processing, especially integrated circuit technology.

MEMS chip microphones fabricated using such a micromachining technology are capable of miniaturizing, high-performance, multifunctional, and integrated traditional microphone parts such as a conventional diaphragm, a spacer ring, an insulating ring, a back plate, And reliability can be improved.

The back chamber of the conventional silicon condenser microphone is formed of a MEMS chip. Since the size of the MEMS chip is very small as a semiconductor chip, the back chamber space becomes extremely narrow, The vibration resistance of the diaphragm is lowered, so that the sound quality (sensitivity) of the microphone is lowered.

In order to solve this problem, as shown in Figs. 1 to 3, the conventional arrange- ment microphone package has expanded the back chamber of the responder microphone chip by machining a substrate or adding a chamber barrel.

1 shows a conventional arrange- ment microphone package in which a substrate 4 is processed to form an additional back chamber 5, in which an additional back chamber 5 is formed in an empty space in a substrate 4, 2 mounted on the substrate 4 and mounting a readout integrated circuit (ROIC) 3 on the substrate 4 and then joining the metal case 1 with the acoustic holes 1a formed thereon to the substrate 4 Yes.

2 shows a conventional arrange- ment microphone package in which a dam 6 is formed on a substrate 4 to form an additional back chamber 2a in which a dam 6 is stacked on a substrate 4 and an arresting microphone 2 A readout integrated circuit (ROIC) 3 is mounted on the substrate 4 after the back chamber space 2a is expanded and the metal case 1 on which the acoustic holes 1a are formed is mounted on the substrate 4).

3 is an example of a conventional arrestor microphone package in which a chamber 7 is mounted on a substrate 4 and then an arm transducer 2 is mounted on the chamber 7 to expand the back chamber 7a. FIG. 3 is a silicon condenser microphone registered in Korean Patent Publication No. 10-1088400. The chamber 7 is formed in a rectangular tube shape or a cylindrical shape with one side opened and a through hole formed on the opposite side of the opening side, A readout integrated circuit 3 is mounted on the substrate 4 and the metal case 1 on which the acoustic holes 1a are formed is bonded to the substrate 4. [

However, in the conventional arrange- ment microphone package having the above-described additional back chamber, the back chamber space is still narrow and the air resistance is generated by the heavy back stream. As a result, the vibration force of the diaphragm is lowered, .

In addition, the conventional EMI microphone package has a problem that since the metal case is laser-welded to a narrow metal pattern formed on the substrate, the pattern or the substrate itself is damaged due to heat, thereby decreasing reliability.

KR 10-1088400 B1 KR 10-2015-0063825 A KR 10-2015-0060469 A KR 10-2015-0058780 A

SUMMARY OF THE INVENTION It is an object of the present invention to enlarge the back volume space of an osseous transducer using an inner case coupled with a substrate, And an extended back chamber space for preventing damage to the substrate by laser welding the outer case, and a method of manufacturing the same.

In order to achieve the above object, the present invention provides an EMI microphone package comprising: a substrate having an engaging groove formed therein; a tubular shape having one side open; a connection terminal projecting laterally from an opening surface; An inner case coupled to the coupling groove to form an additional back chamber space between the substrate and the coupling groove, and a tubular shape having one side open, and a part of the opening surface is welded to the connection terminal of the inner case And an outer case stacked on the substrate with the inner case interposed therebetween to expand the back chamber space of the transducer and weld the outer case to the inner case rather than the substrate, And the joint surface of the outer case is sealed with an adhesive.

The connection terminal may be disposed at right angles to each other, and the coupling groove is formed in a substantially cross shape at four sides of a central rectangle along a plane shape of the inner case, The upper surface of the connection terminal can be aligned with the upper surface of the substrate.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming an inner case coupling groove on a substrate; Coupling the inner case to the coupling groove; Mounting a readout integrated circuit and a stripe microphone on an upper surface of the inner case; Stacking an outer case on the substrate with the inner case interposed therebetween; Welding the inner case and a part of the outer case; And sealing the joint surface between the substrate and the outer case with an adhesive.

According to the present invention, since the additional back chamber space is further expanded and formed between the inner case and the substrate, the back volume space of the wrist transducer is maximally extended, vibration of the diaphragm is smoothly performed to improve the sensitivity of the microphone, (Total Harmonic Distortion) can be remarkably improved.

Further, according to the present invention, when the substrate and the outer case are bonded to each other, the inner case and the outer case are laser-welded and then sealed with an adhesive, And the reliability of laser welding is maximized.

According to an aspect of the present invention, there is provided an array microphone package having an extended back chamber space and a method of manufacturing the same. According to another aspect of the present invention, It is effective.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view of an arthroscopic microphone package having an additional back volume according to the prior art,
FIG. 2 is a cross-sectional view of an EMI microphone package having an additional back volume in another embodiment according to the prior art; FIG.
Figure 3 is a cross-sectional view of an EMI microphone package having an additional back-up volume in another embodiment according to the prior art;
FIG. 4 is a cross-sectional view illustrating an arresting microphone package having an extended back chamber space according to an embodiment of the present invention. FIG.
FIG. 5 is an exploded perspective view showing an arresting microphone package having an extended back chamber space according to the present invention, FIG.
6 is a flowchart illustrating a method of manufacturing an EMI microphone package having an extended back chamber space of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings. The following examples are merely illustrative of the present invention and are not intended to limit the scope of the present invention.

FIG. 4 is a cross-sectional view illustrating an arrange- ment microphone package having an extended back chamber space according to an embodiment of the present invention, and FIG. 5 is an exploded perspective view illustrating an arrange- ment microphone package having an extended back chamber space according to an embodiment of the present invention.

4 and 5, an EMI microphone package 100 having an extended back chamber space according to an embodiment of the present invention includes an external case 110 having an acoustic hole 111 formed thereon, And a substrate 150 on which an inner case 140 on which the ROIC 120 and the transducer 130 are mounted and a groove 151 for coupling with the inner case 140 are formed, The connection terminals 142 and 143 of the inner case 140 and the lower side surface of the outer case are welded and fixed by laser welding to improve the reliability of laser welding.

4 and 5, the board 150 is provided with a user board connection terminal 152 for connection to the user board side connection terminal 152, and the upper surface of the board 150 has a first board 1 / Coupling groove 151 for coupling with the second connection terminals 142 and 143 are formed. The coupling groove 151 may be machined by a milling machine in a substantially cross shape at four sides of a central rectangle along the plane shape of the inner case 140, It is preferable that the upper surfaces of the connection terminals 142 and 143 can coincide with the upper surface of the substrate 150 when the first and second connection terminals 142 and 143 are inserted.

The inner case 140 is formed in a rectangular shape having a relatively small depth and having one side of a metal material. The inner case 140 has a cross shape at four sides of the opening, A first connection terminal 142 and a second connection terminal 143 are mounted on the upper side of the inner case 140 and the back chamber space 131 of the transducer and the additional back chamber space 144 Through holes 141 for communicating with each other are formed.

The diaphragm and the backplate pair are formed on the silicon wafer by a MEMS technique and are mounted on the upper surface of the through hole 141 formed on the upper surface of the inner case 140 to form the acoustic port 111 (ROIC) 120 is mounted on one side of the upper surface of the inner case 140, and is connected to the worm transducer 130 by a wire, Amplifies the electric signal of the ducer 130, and outputs the signal to the connection terminal 152 through the substrate 150.

The outer case 110 is formed in the shape of a rectangular tube with one side of a metal material being opened, and an acoustic port 111 is formed on the opposite side of the opening surface, and is stacked on the substrate 150 with the inner case 140 interposed therebetween. At this time, the connection terminals 142 and 143 of the inner case 140 and the lower side surfaces of the outer case 110 are spot welded by laser 170 and fixed to the substrate 150, Thereby sealing the inner space.

4 and 5, since the readout integrated circuit 120 and the stripe microphone 130 are both mounted on the inner case 140, the stripe- The inner space 140 formed by the inner space 140 and the substrate 150 may be combined to form the additional back chamber space 144. [ Can be relatively large. In addition, after inserting the additional back chamber space 144 relatively large, the insufficient back chamber 131 space of the transducer 130 itself is extended to the additional back chamber space 144 to improve the sensitivity, and THD (Total Harmonic Distortion) and the like can be improved.

Unlike the conventional technique in which the case is laser-welded to the substrate, in the present invention, since the outer case 110 is laser-welded to the connection terminals 152 and 153 of the inner case 140 instead of the substrate 150, .

Next, a procedure of manufacturing the arresting microphone package 100 according to the present invention will be described.

6 is a flowchart showing a method of manufacturing an arresting microphone package having an enlarged back chamber space according to the present invention.

Referring to FIG. 6, a method of manufacturing an EMI microphone package having an extended back chamber space according to an embodiment of the present invention includes a step S1 of forming an inner case coupling groove 151 in a substrate 150, A step S2 of coupling the inner case 140 to the groove 151, a step S3 of mounting a reading integrated circuit (ROIC) 120 and an arresting microphone 130 on the upper surface of the inner case 140, A step S4 of laminating the outer case 110 on the substrate 150 with the inner case 140 therebetween, a step S5 of welding the inner case 140 and a part of the outer case 110, And sealing the joint surface of the substrate 140 and the outer case 110 with the adhesive 160 (S6).

The inner case 140 has a tubular shape with one side opened and the connection terminals 142 and 143 protrude laterally from the opening surface. The outer case 110 is spot welded to the connection terminals 142 and 143 of the inner case with a laser will be.

The MEMS microphone package according to the present invention thus manufactured is characterized in that the ROIC chip 120 and the MEMS transducer 130 are mounted on the upper surface of the inner case 140, The additional back chamber space 144 is further extended between the inner case 140 and the substrate 150 as the through holes 141 of the sleeve 140 are disposed to further expand the back volume space 131 of the sleeve transducer 130. [ Is expanded to the maximum.

The MEMS microphone package 100 according to the present invention is characterized in that the ROIC chip 120 and the transducer 130 are mounted on the side surface of the inner case 140 so as not to be directly mounted on the substrate 150, The degree of freedom in designing the printed circuit pattern of the substrate 150 can be secured by not receiving any restriction in constituting the printed circuit pattern in the printed circuit board 150.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

100: Rear microphone package
110: outer case 111: sound port
120: ROIC chip 130: Ores transducer
131: back chamber 140: inner case
141: Through hole 142: First connection terminal
143: second connection terminal 144: additional back chamber space
150: substrate 151: first / second connection terminal engaging groove
152: connection terminal for joining user board 160: adhesive
170: welding point

Claims (6)

A substrate on which a coupling groove is formed,
A connecting terminal protruding sideways from the opening surface and having an upper transducer and a reading integrated circuit mounted on the upper surface thereof and being coupled to the coupling groove to provide an additional back chamber space between the substrate and the substrate An inner case for forming the inner case,
And an outer case which is formed in a cylindrical shape and whose one surface is opened and a part of the opening surface is welded to the connection terminal of the inner case and which is stacked on the substrate with the inner case interposed therebetween,
And an extended back chamber space which expands the back chamber space of the transducer and seals the joint surface of the substrate and the outer case with an adhesive after welding the outer case to the inner case rather than the substrate. 1. An EMI microphone package coupled to a user board side connection terminal of a user board,
A board 150 having a connection terminal 152 for user board connection at its bottom surface and an inner case coupling groove 151 formed at an upper surface thereof;
An inner case having a through hole formed in the shape of a cylinder having an opening on one side thereof and being seated in the inner case engaging groove 151 to form an additional bag chamber space between the substrate and the connecting terminal protruding laterally from the opening face, (140);
A readout integrated circuit (ROIC) 120 spaced a predetermined distance from the substrate 150 and mounted on one side of the upper surface of the inner case 140;
An electrode transducer 130 spaced apart from the substrate 150 by a predetermined distance and mounted vertically above the through hole 141 on the other side of the upper surface of the inner case 140; And
An outer case 110 having an acoustic port 111 formed in a cylindrical shape with one side opened and laser welded to a connection terminal of the inner case 140 to seal the inner space with the substrate, An array microphone package having a back chamber space. The connector according to claim 2, wherein the connection terminal of the inner case (140)
Wherein the first connection terminal (142) and the second connection terminal (143) are arranged at right angles to each other. 3. The connector according to claim 1 or 2,
Wherein a depth of the coupling groove is set such that when the connection terminal of the inner case is inserted, the upper surface of the connection terminal may coincide with the upper surface of the substrate, Wherein the rear microphone has an extended back chamber space. Forming an inner case coupling groove on the substrate;
Coupling the inner case to the coupling groove;
Mounting a readout integrated circuit and a stripe microphone on an upper surface of the inner case;
Stacking an outer case on the substrate with the inner case interposed therebetween;
Welding the inner case and a part of the outer case; And
And sealing an interface between the substrate and the outer case with an adhesive. 6. The electronic device according to claim 5, wherein the inner case has a tubular shape with one side opened and the connection terminal protrudes laterally of the opening surface, and the outer case is spot welded to the connection terminal of the inner case with a laser A method of manufacturing an EMI microphone package having a back chamber space.
KR1020150122853A 2015-08-31 2015-08-31 Mems microphone package having extension back chamber and manufacturing method thereof KR101657651B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109451383A (en) * 2018-12-29 2019-03-08 华景科技无锡有限公司 A kind of microphone

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100033129A (en) * 2008-09-19 2010-03-29 주식회사 씨에스티 Acoustic-signal/electric-signal converting device and method for fabricating the same
JP2010104006A (en) * 2006-05-09 2010-05-06 Bse Co Ltd Directional silicon capacitor microphone having additional back chamber
KR101088400B1 (en) 2009-10-19 2011-12-01 주식회사 비에스이 Silicon condenser microphone having additional back chamber and method of making the same
US20140309559A1 (en) * 2008-12-30 2014-10-16 Masimo Corporation Acoustic sensor assembly
KR20150058780A (en) 2013-11-21 2015-05-29 삼성전기주식회사 Microphone package and mounting structure thereof
KR20150060469A (en) 2013-11-26 2015-06-03 삼성전기주식회사 Mems microphone package and manufacturing method thereof
KR20150063825A (en) 2013-12-02 2015-06-10 삼성전기주식회사 Microphone package and method for microphone package
US9067780B1 (en) * 2000-11-28 2015-06-30 Knowles Electronics, Llc Methods of manufacture of top port surface mount MEMS microphones

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9067780B1 (en) * 2000-11-28 2015-06-30 Knowles Electronics, Llc Methods of manufacture of top port surface mount MEMS microphones
JP2010104006A (en) * 2006-05-09 2010-05-06 Bse Co Ltd Directional silicon capacitor microphone having additional back chamber
KR20100033129A (en) * 2008-09-19 2010-03-29 주식회사 씨에스티 Acoustic-signal/electric-signal converting device and method for fabricating the same
US20140309559A1 (en) * 2008-12-30 2014-10-16 Masimo Corporation Acoustic sensor assembly
KR101088400B1 (en) 2009-10-19 2011-12-01 주식회사 비에스이 Silicon condenser microphone having additional back chamber and method of making the same
KR20150058780A (en) 2013-11-21 2015-05-29 삼성전기주식회사 Microphone package and mounting structure thereof
KR20150060469A (en) 2013-11-26 2015-06-03 삼성전기주식회사 Mems microphone package and manufacturing method thereof
KR20150063825A (en) 2013-12-02 2015-06-10 삼성전기주식회사 Microphone package and method for microphone package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109451383A (en) * 2018-12-29 2019-03-08 华景科技无锡有限公司 A kind of microphone

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