KR101652901B1 - Side docking type test handler and pushing apparatus for test handler - Google Patents

Abstract

The present invention relates to a side-docked test handler.
According to the present invention, when the pusher of the pushing device moves away from the semiconductor device after the test is completed, the stability of the device can be improved by allowing the pusher to be separated from the semiconductor device after the holding state of the semiconductor device is properly restored Is disclosed.

Description

[0001] DESCRIPTION [0002] SIDE DOCKING TEST HANDLERS AND PUSHING APPARATUS FOR TEST HANDLERS [0003]

The present invention relates to a side-docking test handler, and more particularly, to a pushing device for pushing a semiconductor device toward a tester.

The test handler supports a semiconductor device manufactured through a predetermined manufacturing process so that the semiconductor device can be tested by a tester. The test handler classifies semiconductor devices according to the test results and loads the semiconductor devices on a customer tray.

1 is a conceptual view of a general test handler 100 including a test handler according to the present invention. Referring to FIG. 1, the test handler 100 includes a test tray 110, a loading device 120, a soak chamber 130 A SOAK CHAMBER, a test chamber 140, a pushing device 150, a DESOAK chamber 160, and an unloading device 170.

The test tray 110 is provided with a plurality of inserts 111 on which a semiconductor device D can be mounted as shown in FIG. 2, and a closed path C defined by a plurality of transfer devices (not shown) Cycle.

The loading device 120 loads the untested semiconductor device loaded in the customer tray into a test tray at a loading position (LP).

The soak chamber 130 is provided for preheating or precooling semiconductor devices loaded in the test tray 110 transferred from the loading position LP according to test environment conditions before being tested. do.

The test chamber 140 is provided to test the semiconductor device loaded in the test tray 110 that has been preheated / precooled in the soak chamber 130 and then transferred to a test position (TP).

The pushing device 150 pushes the semiconductor device loaded in the test tray 110 in the test chamber 140 toward the tester TESTER side docked to the tester chamber 140 side, As shown in Fig. Such a pushing device 150 will be described later in more detail.

The desolator chamber 160 is provided to return the heated or cooled semiconductor element loaded in the test tray 110 transferred from the test chamber 140 to normal temperature.

The unloading device 170 classifies the semiconductor devices loaded in the on-test tray 110 in the unloading position (UP: UNLOADING POSITION) from the desock chamber 160 according to the test grade and unloads ).

As described above, the semiconductor device is loaded from the loading position LP to the unloading position UP through the soak chamber 130, the test chamber 140, and the desock chamber 160 while being loaded on the test tray 110. [ (C). ≪ / RTI >

The test handler 100 having the above basic circulation path includes a test handler 100 and a test handler 110 for testing a semiconductor device loaded in a horizontal state with a test tray 110. The test handler 100 includes a UNDER HEAD DOCKING TYPE test handler, And a side docking type test handler in which a semiconductor device loaded in a vertical state is tested.

Therefore, in the test handler 100 of the side docking system, a first posture conversion device for converting a horizontal test tray into a vertical posture in which a semiconductor device is completely loaded, and a vertical posture changing device for unloading the tested semiconductor device. The posture changing device is required to convert the posture to the horizontal posture. The first posture changing device and the second posture changing device have the same configuration, and have the same configuration as that of Korean Patent Laid-Open Publication No. 10-2009-0056580 (entitled " side docking type test handler operation method, side docking type test handler posture conversion Device and an open device for a test handler). For reference, as shown in FIGS. 2A and 2B of Korean Patent Application Publication No. 10-2008-0084341 (entitled "Handler for semiconductor device test and test method"), the first posture changing device and the second posture changing device (Defined as " rotator " in the corresponding patent publication).

3, the conventional pushing device 150 includes a plurality of pushing units 151, a mounting plate 152, and a moving source 153, And the like.

The pushing unit 151 includes a pusher 151a contacting the semiconductor element D seated on the insert 111 of the test tray 110 and a base 151a contacting one surface of the insert 111 151b.

The mounting plate 152 is provided with a plurality of pushing units 151.

The moving source 153 is provided as a cylinder or the like so that the pusher 151a contacts the semiconductor element D and then moves the semiconductor element D toward the test tray 110 by moving the mounting plate 152 in the test tray 110 direction. (TESTTER) side or the contact can be released. 3, the spacing between the pushing unit 151, the test tray 110, and the tester is exaggerated.

The pusher 151a applies force to the semiconductor element D and the base 151b is also brought into contact with one surface of the insert 111. In this case, After that, the force is applied to the tester side.

On the other hand, a holding device for preventing deviation of the seated semiconductor device as referred to in Korean Utility Model Publication No. 20-2009-0001188 (design name: design insert of test handler of test handler) . In general, the holding device releases the holding state of the semiconductor element by an external force acting from the outside, and returns to a state of holding the semiconductor element when the external force is removed.

The external force applied to the holding device is referred to in Korean Patent Laid-Open No. 10-2006-0003893 (entitled " insert for electronic part handling device, tray, and electronic part handling device, (Referred to as " XY transport device " in the corresponding publication) or a separate open device (corresponding to the < RTI ID = 0.0 > (Which is defined in the Gazette as an " insert opening device ").

However, in the case of an insert presented in a reference technique or an application number 10-2010-0077196 (the name of the invention: an insert for a test handler, hereinafter referred to as "prior art"), the applicant of the present invention, If an external force is applied after the base 151b comes into contact with one surface of the insert 111, the holding device may cause holding of the semiconductor device to be released. This is because the base 151b is in contact with one surface of the insert 111 to apply an external force to the insert in the direction of the tester to thereby release the holding of the semiconductor device by the holding device Quot; pressing member " in the prior art) moves relative to the insert body in a direction to release holding of the holding device. Therefore, the test of the semiconductor device can be performed in a state in which holding is released.

In such a case, a problem may arise in the side-docked test handler when the pusher is separated from the semiconductor element after the completion of the subsequent test. That is, after the completion of the test, the mounting plate quickly retracts toward the opposite side of the tester due to the reverse drive of the source, so that the pusher is also rapidly spaced from the semiconductor element. At this time, before the holding device returns to the state holding the semiconductor element, This is because the semiconductor element can deviate from the place.

For this reason, it is difficult to apply the inserts described in Reference Technology 1 or the prior art techniques to side-docked test handlers.

It is an object of the present invention to provide a technique for enabling an insert having a configuration such as the reference technology and the prior art technique to be used for a side-docked test handler.

According to an aspect of the present invention, there is provided a side-docked test handler comprising: a test tray having a plurality of inserts on which a semiconductor device can be mounted, the test tray circulating a closed path defined by a plurality of transfer devices; A loading device for loading a semiconductor device into the test tray in a horizontal state; A first posture converting device for converting posture of the test tray loaded with semiconductor elements into a vertical state by the loading device; A test chamber provided for testing a semiconductor device loaded in a test tray whose posture has been changed to a vertical state by the first posture changing device; A pushing device for pushing the semiconductor element toward the tester to electrically connect the semiconductor element loaded in the test tray in the test chamber to the tester; A second posture converting device for converting posture of the vertically stacked test tray into a horizontal posture in which the loaded semiconductor devices have been tested; An unloading device for unloading a tested semiconductor device from a test tray transformed into a horizontal state by the second posture converting device; Wherein the insert comprises: a body having a seating space in which a semiconductor device can be seated; A holding device for holding a semiconductor device placed in a seating space of the main body; And an operating member for releasing the holding state of the semiconductor device by the holding device when an external force is applied to the insert; The pushing device comprising: a plurality of pushing units for pushing the semiconductor elements respectively seated on the plurality of inserts to the tester side; A mounting plate for mounting the plurality of pushing units; And a moving source for moving the mounting plate to the test tray side; Wherein the pushing unit pushes the semiconductor element toward the tester side while contacting the semiconductor element mounted on the insert when the mounting plate is moved to the test tray side while the moving source is driven; A base for pushing the insert toward the tester side while being in contact with one surface of the main body of the insert when the mounting plate is moved to the test tray side while the moving source is driven; And an elastic member elastically supporting the pusher with respect to the base; .

Wherein when the mounting plate moves to the test tray side by driving the moving source and the base applies an external force to one side of the insert, the operating member moves relative to the main body while holding the semiconductor device by the holding device State is released.

Wherein an insertion groove is formed in the base to insert a portion of the pusher, the pusher includes: an insertion portion inserted into the insertion groove; And a contact portion contacting the semiconductor element; And the elastic member is provided to elastically support the insertion portion in the direction of the semiconductor element in a state where the elastic member is inserted into the insertion groove.

According to another aspect of the present invention, there is provided a pushing device for a test handler, comprising: a plurality of pushing units for pushing semiconductor devices respectively mounted on a plurality of inserts provided in a test tray to a tester side; A mounting plate for mounting the plurality of pushing units; And a moving source for moving the mounting plate to the test tray side; Wherein the pushing unit pushes the semiconductor element toward the tester side while contacting the semiconductor element mounted on the insert when the mounting plate is moved to the test tray side while the moving source is driven; A base for pushing the insert toward the tester side while being in contact with one surface of the main body of the insert when the mounting plate is moved to the test tray side while the moving source is driven; And an elastic member elastically supporting the pusher with respect to the base; .

When the mounting plate is moved toward the test tray side by the driving of the source and the base exerts an external force on one side of the insert, a part of the insert moves relative to the other part of the insert, Is released from the holding state.

Even if the base, which applies an external force to one side of the insert due to the movement of the mounting plate in the opposite direction of the test tray, is released from contact with the insert due to the inverse driving of the source, the pusher at least holds the semiconductor device The contact with the semiconductor element is maintained until the holding time.

According to the present invention, even if the mounting plate of the pushing device is quickly retracted toward the opposite side of the tester, since the pusher is separated from the semiconductor device after the holding device returns to the holding state of the semiconductor device, Docking can be stably applied.

Figure 1 is a conceptual top view of a generic test handler.
Figure 2 is a top view of a generic test handler.
3 is a conceptual side view of a conventional pushing device.
4 is a conceptual top view of a test handler according to an embodiment of the present invention.
5 is a conceptual cross-sectional view of an insert included in a test tray applied to the test handler of FIG.
Figure 6 is a conceptual side view of a pushing device applied to the test handler of Figure 4;
7 is an example of application of the pushing device of Fig.
Figures 8A-8F are operational status diagrams for the main parts in the test handler of Figure 4;
Figure 9 is a conceptual cross-sectional view of an insert according to another example that may be applied to the test handler of Figure 4;

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For simplicity of description, redundant description is omitted or compressed as much as possible.

<Examples>

4 is a conceptual plan view of a main part of a side docking type test handler 400 (hereinafter, referred to as a 'test handler') according to an embodiment of the present invention.

4, the test handler 400 according to the present invention includes a test tray 410, a loading device 420, a soak chamber 430, a first posture changing device 440, a test chamber 450 A pushing device 460, a dissocking chamber 470, a second posture changing device 480, and an unloading device 490, and the like.

In the test handler 400 having the above configuration, the loading device 420, the soak chamber 430, the first posture changing device 440, the test chamber 450, the dissocking chamber 470, (480) and the unloading device 490 are not only general structures that have been well known, but also have been mentioned in the background art, so that the description thereof will be omitted.

In the test tray 410, a plurality of inserts 411, for example, as shown in the conceptual side cross-sectional view of Fig. 5, are provided in a matrix form.

5, the insert 411 includes a main body 411a, a holding device 411b, an operating member 411c, a restoring spring 411d, and the like.

The main body 411a has a seating space S in which the semiconductor elements D can be seated.

The holding device 411b holds the semiconductor device D seated in the seating space S of the main body 411a and is composed of the latch 411b-1 and the torsion spring 411b-2. Therefore, when an external force F or F 'is applied to the latch 411b-1, the latch 411b-1 rotates in the direction b about the fixed point R, The holding state of the semiconductor element D seated on the semiconductor chip S is released and when the external force F or F 'is removed, the latch 411b- R, the semiconductor device D seated in the seating space S is held as shown in FIG. 5 (a).

The operating member 411c moves relative to the main body 411a when the external force F or F 'is applied and the latch 411b-1, which is spaced apart from the fixed point R by the pressing protrusion 411c- 1). It is also possible to implement an external force F applied to the operating member 411c and to apply an external force F 'to the main body 411a. If an external force F 'is applied to the main body 411a, the main body 411a substantially moves.

The restoring spring 411d elastically supports the operating member 411c with respect to the main body 411a.

The pushing device 460 includes a plurality of pushing units 461, a mounting plate 462, a moving source 463, and the like, as shown in Fig.

The pushing unit 461 includes a pusher 461a, a base 462b, an elastic member 462c, and the like.

The pusher 461a contacts the semiconductor element D placed on the insert 411 while the mounting plate 462 moves toward the test tray 410 while the moving source 463 is driven, TESTER, and has an air passage hole 461a-1 through which temperature-regulating air can pass in the direction toward the semiconductor element D (see Patent Document 10-2008-0086320). The pusher 461a is composed of an insertion portion 461a-2 inserted into the insertion groove 461b-1 of the base 461b and a contact portion 461a-3 contacting the semiconductor element D.

The base 461b contacts the one surface of the main body of the insert 411 (the surface of the operating member facing the base) when the mounting plate 462 moves toward the test tray 410 while the moving source 463 is driven, And has the above-mentioned insertion groove 461b-1 into which the insertion portion 461a-12 of the pusher 461a can be inserted. The base 461b may be formed integrally with the mounting plate 762 as shown in Fig. In addition, the mounting plate may be provided with an insertion groove only on the base without forming a separate groove, which can be selectively selected by the designer depending on the height of the base, the depth of the insertion groove, and the processing conditions. In this embodiment, since the pushing unit 461 has a structure in which two pushers 461a are coupled to one base 461b, the number of the pushing units 461 is half the number of the inserts 411 , And when one pusher is coupled to one base, the number of pushing units and the number of inserts are the same (plural = plural).

The elastic member 461c elastically supports the pusher 461a with respect to the base 461b. It is preferable that the elastic member 461c is provided as a coil spring so as to support a portion other than the air passage hole 461a-1 of the pusher 461a.

Of course, as described above, the pushing device 460 having the features of the present invention is not limited to the insert 411 shown in Fig. 5 configured to hold or release the semiconductor device while the operating member 411c moves relative to the main body 411a, The present invention can be applied to a case where a general insert is applied.

Subsequently, the operation of the main part of the test handler 400 having the above-described configuration will be described.

8A, when the test tray 410 is placed in the test chamber 450, the moving source 463 is driven to move the mounting plate 462 to the tester side (test tray side) The contact portion 461a-3 of the pusher 461a is first brought into contact with the semiconductor element D as referenced in Figs. 8C, the elastic member 461c is compressed and then the base 461b is pressed against one surface of the insert 411, that is, The semiconductor element D is moved by the pusher 461a to the tester TESTER 461a as shown in Fig. 8D as the operating member 411c of the insert 411 is pressed by the base 461b, And is electrically connected to the tester stably, and the holding state of the semiconductor device D by the holding device 411b is released. 8C and 8D, since the base 461b is in contact with the insert 411 on one side of the operation member 411c, the base 461b presses the operation member 411c The holding state of the semiconductor device D is released by operating the holding device 411b while the member 411 moves relative to the main body 411a (moves in the tester side direction).

When the next test is completed, the moving source 463 is driven backward so that the mounting plate 462 is retreated toward the opposite side of the tester. At this time, as shown in FIG. 8E, the base 461b The pusher 461a keeps pushing the semiconductor element D toward the tester side while the elastic member 461c expands due to the elastic restoring force and at this point the pusher 461a pushes the operating member 411c by the base 461b, The holding device 411b returns to a state in which the semiconductor device D is held by the restoring force of the torsion spring 411b-2. Then, as the mounting plate 462 is continuously retracted to a predetermined point, the contact portion 461a-3 of the pusher 461a is also separated from the semiconductor element D as shown in Fig. 8f.

<Another example of insert>

Figure 9 is a perspective view of an insert 911 according to another example that may be applied to a test handler 400 according to the present invention.

9, when the element seating member 911a on which the semiconductor element can be mounted receives the external force F or F 'and relatively moves with respect to the main body 911b, 9B in which the holding state of the holding device 911c is released in the same state as in FIG. 9A. 9, the base 461b of the pushing device 460 contacts the upper end of the element seating member 911a (the portion protruding upward from the body in FIG. 9) The holding state of the holding device 911c is released.

That is, when the external force is applied to the insert, the pushing device 460 can move the insert in a state where some elements (for example, an operating member or a device seating member) of the insert move relative to some other element It can be understood that the present invention can be suitably applied to a case where the holding state of the mounted semiconductor element is released.

Although the present invention has been fully described by way of example only with reference to the accompanying drawings, it is to be understood that the present invention is not limited thereto. It is to be understood that the scope of the invention is to be construed as being limited only by the following claims and their equivalents.

400: Test handler
410: Test tray
411: Insert
411a: main body 411b: holding device
411c:
420: loading device
430: Soak chamber
440: first posture changing device
450: test chamber
460: Pushing device
461: Pushing unit
461a: pusher
461a-1: air vent hole
461a-2:
461a-3:
461b: Base
461b-1: insertion groove
461c: elastic member
462: Mounting plate
463:
470: Disk chamber
480: second posture changing device
490: Unloading device

Claims (6)

A test tray provided with a plurality of inserts on which semiconductor elements can be placed and circulating a closed path defined by a plurality of transfer devices;
A loading device for loading a semiconductor device into the test tray in a horizontal state;
A first posture converting device for converting posture of the test tray loaded with semiconductor elements into a vertical state by the loading device;
A test chamber provided for testing a semiconductor device loaded in a test tray whose posture has been changed to a vertical state by the first posture changing device;
A pushing device for pushing the semiconductor element toward the tester to electrically connect the semiconductor element loaded in the test tray in the test chamber to the tester;
A second posture converting device for converting posture of the vertically stacked test tray into a horizontal posture in which the loaded semiconductor devices have been tested;
An unloading device for unloading a tested semiconductor device from a test tray transformed into a horizontal state by the second posture converting device; / RTI &gt;
The above-
A body having a seating space in which a semiconductor element can be seated;
A holding device for holding a semiconductor device seated in a seating space of the main body; And
An operating member for releasing the holding state of the semiconductor device by the holding device when an external force is applied to the insert; Lt; / RTI &gt;
The pushing device includes:
A plurality of pushing units for pushing the semiconductor elements respectively seated on the plurality of inserts to the tester side;
A mounting plate for mounting the plurality of pushing units; And
A moving source for moving the mounting plate toward the test tray; / RTI &gt;
In the pushing unit,
A pusher for pushing the semiconductor element to the tester side while contacting the semiconductor element mounted on the insert when the mounting plate is moved to the test tray side while the moving source is driven;
A base for pushing the insert toward the tester side while being in contact with one surface of the main body of the insert when the mounting plate is moved to the test tray side while the moving source is driven; And
An elastic member elastically supporting the pusher against the base; Lt; / RTI &gt;
Wherein when the mounting plate moves to the test tray side by driving the moving source and the base applies an external force to one side of the insert, the operating member moves relative to the main body while holding the semiconductor device by the holding device State is released.
Side docked test handler. delete The method according to claim 1,
An insertion groove into which a part of the pusher is inserted is formed in the base,
The pusher
An insertion portion inserted into the insertion groove; And
A contact portion contacting the semiconductor element; / RTI &gt;
And the elastic member is provided so as to elastically support the insertion portion in the direction of the semiconductor element in a state of being inserted into the insertion groove
Side docked test handler. A plurality of pushing units for pushing the semiconductor elements respectively seated on the plurality of inserts provided in the test tray to the tester side;
A mounting plate for mounting the plurality of pushing units; And
A moving source for moving the mounting plate toward the test tray; / RTI &gt;
In the pushing unit,
A pusher for pushing the semiconductor element to the tester side while contacting the semiconductor element mounted on the insert when the mounting plate is moved to the test tray side while the moving source is driven;
A base for pushing the insert toward the tester side while being in contact with one surface of the main body of the insert when the mounting plate is moved to the test tray side while the moving source is driven; And
An elastic member elastically supporting the pusher against the base; Lt; / RTI &gt;
When the mounting plate is moved toward the test tray side by the driving of the moving source and the base exerts an external force on one side of the insert, a part of the insert moves relative to the main body of the insert while holding the semiconductor element State is released,
Some of the elements of the insert are an operating member for releasing the holding state of the semiconductor element by the holding apparatus for holding the semiconductor element seated in the seating space of the main body of the insert when an external force is applied to the insert, Characterized in that it is an element seating member coupled to be flowable within a range
Pushing device for test handler. delete 5. The method of claim 4,
Even if the base, which applies an external force to one side of the insert due to the movement of the mounting plate in the opposite direction of the test tray, is released from contact with the insert due to the inverse driving of the source, the pusher at least holds the semiconductor device And the contact with the semiconductor element is maintained until the holding time.
Pushing device for test handler

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