KR101642595B1 - Multi-layered ceramic electronic components - Google Patents

Multi-layered ceramic electronic components Download PDF

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KR101642595B1
KR101642595B1 KR1020140151923A KR20140151923A KR101642595B1 KR 101642595 B1 KR101642595 B1 KR 101642595B1 KR 1020140151923 A KR1020140151923 A KR 1020140151923A KR 20140151923 A KR20140151923 A KR 20140151923A KR 101642595 B1 KR101642595 B1 KR 101642595B1
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South Korea
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ceramic body
margin
longitudinal direction
internal electrodes
recognition unit
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KR1020140151923A
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Korean (ko)
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KR20160052112A (en
Inventor
노치현
김종훈
김병수
이종호
김창훈
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삼성전기주식회사
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Abstract

The present invention provides a multilayer ceramic electronic device in which a margin in the longitudinal direction can be easily selected through visual observation and image formation without destroying the central portion of the L-T surface in the cutting chip.

Description

[0001] MULTI-LAYERED CERAMIC ELECTRONIC COMPONENTS [0002]

The present invention relates to a multilayer ceramic electronic component.

Electronic components using ceramic materials include capacitors, inductors, piezoelectric elements, varistors or thermistors.

A multi-layered ceramic capacitor (MLCC) among the ceramic electronic parts is small, high capacity is assured, and is easy to be mounted, so that it can be used in various electronic devices.

For example, the multilayer ceramic capacitor may be applied to a display device such as a liquid crystal display (LCD) and a plasma display panel (PDP), a computer, a personal digital assistant (PDA) And can be used in a chip type capacitor which is mounted on a substrate of various electronic products and plays a role of charging or discharging electricity.

Such a multilayer ceramic capacitor may have a structure in which a plurality of dielectric layers and internal electrodes of different polarities are alternately arranged between the dielectric layers.

The multilayer ceramic capacitor may be formed by cutting a ceramic bar that has been pressed in a manufacturing process, and then cutting chips are formed. Then, the WT surface is recognized by visual observation or image to distinguish the internal electrode from the dielectric layer. .

However, the LT surface of the cutting chip can recognize only the dielectric layer when recognizing it with naked eyes or an image, and can not recognize the internal electrode. As a result, the margin in the longitudinal direction of the chip can not be discriminated by the naked eye or the image.

In order to observe the margin in the longitudinal direction of the cutting chip, conventionally, a method of destroying and cutting the central portion of the L-T surface of the cutting chip was used, but in this case, a loss due to breakage of the cutting chip occurred.

In addition, the chip which has not been fractured and cut is subjected to a post-process such as firing, external electrode formation and plating in a state where the chip is not sorted, and then the chip is sorted by electrical characteristics to discard the chip in the longitudinal direction.

However, in the above case, there is a problem that the loss cost is increased by not disposing the chip to be disused in the previous process but disposing the unnecessary post-process after disposing.

Korean Patent Publication No. 2014-0060393

SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer ceramic electronic device capable of easily selecting a margin in the longitudinal direction without breaking the central portion of the LT surface in the cutting chip.

One aspect of the present invention provides a multilayer ceramic electronic component in which a margin recognition portion is disposed on at least one surface of a mounting surface or a mounting surface of a ceramic body so as to confirm a margin in a longitudinal direction of the ceramic body.

According to the embodiment of the present invention, there is an effect that the margin in the longitudinal direction can be easily selected through visual observation and image without breaking the central portion of the LT surface in the cutting chip.

1 is a perspective view schematically showing a multilayer ceramic electronic component according to an embodiment of the present invention.
2 is a sectional view taken along the line A-A 'in Fig.
3 is a perspective view showing the external electrode omitted from FIG.
4 is a perspective view of a multilayer ceramic electronic device according to another embodiment of the present invention, in which external electrodes are omitted.
5 is a perspective view of a multilayer ceramic electronic device according to another embodiment of the present invention, in which external electrodes are omitted.
Fig. 6 is a side sectional view of Fig. 5. Fig.
7 is a perspective view of a multilayer ceramic electronic device according to another embodiment of the present invention, in which external electrodes are omitted.
8 is a perspective view of a multilayer ceramic electronic device according to another embodiment of the present invention, in which external electrodes are omitted.
9 is a perspective view of a multilayer ceramic electronic device according to another embodiment of the present invention, in which external electrodes are omitted.
10 is a side sectional view of Fig.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below.

Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art.

The shape and size of elements in the drawings may be exaggerated for clarity.

In the drawings, like reference numerals are used to designate like elements that are functionally equivalent to the same reference numerals in the drawings.

In addition, to include an element throughout the specification does not exclude other elements unless specifically stated otherwise, but may include other elements.

FIG. 1 is a perspective view schematically showing a multilayer ceramic electronic component according to an embodiment of the present invention, FIG. 2 is a sectional view taken on line A-A 'of FIG. 1, and FIG. 3 is a perspective view Which shows a cutting chip of a multilayer ceramic electronic component.

1 to 3, a multilayer ceramic electronic device 100 according to the present embodiment includes a ceramic body 110; First and second internal electrodes 121 and 122; First and second external electrodes 131 and 132; And margin recognition units 141a, 141b, 142a, and 142b.

The ceramic body 110 is formed by laminating a plurality of dielectric layers 111 in the thickness direction T and then firing.

At this time, the dielectric layers 111 adjacent to each other of the ceramic body 110 can be integrated so as to make it difficult to check boundaries.

In addition, the ceramic body 110 may have a hexahedral shape, but is not limited thereto.

In this embodiment, for the sake of convenience of explanation, the mutually facing surfaces of the dielectric layers 111 of the ceramic body 110 in the thickness direction T are laminated on the lower surface 1 and the upper surface 2 and the upper and lower surfaces 2 Facing surfaces of the ceramic body 110 connecting the first and second side surfaces 3 and 4 are perpendicular to the first and second side surfaces 3 and 4 and the first and second side surfaces 3 and 4, And the mutually facing surfaces of the intersecting width directions W are defined as the third and fourth sides 5 and 6.

On the other hand, the ceramic body 110 may have an upper cover layer 112 of a predetermined thickness formed on the uppermost portion of the inner electrode, and a lower cover layer 113 may be formed on the lower portion of the inner electrode.

The upper and lower cover layers 112 and 113 may have the same composition as that of the dielectric layer 111. A dielectric layer not including the internal electrode may be formed on the upper portion of the inner electrode and the lower portion As shown in FIG.

The dielectric layer 111 may include a ceramic material having a high dielectric constant, for example, BaTiO 3 ceramic powder, and the present invention is not limited thereto.

The BaTiO 3 based ceramic powder is, for example, BaTiO 3 in (barium titanate) such as Ca (calcium), Zr (zirconium), the part job (Ba 1 - x Ca x) TiO 3, Ba (Ti 1 - y Ca y ) O 3 , (Ba 1 - x Ca x ) (Ti 1 - y Zr y ) O 3, or Ba (Ti 1 - y Zr y ) O 3 , and the present invention is not limited thereto.

The dielectric layer 111 may further include at least one of a ceramic additive, an organic solvent, a plasticizer, a binder, and a dispersant.

The ceramic additive may be, for example, a transition metal oxide or a carbide, a rare earth element, magnesium (Mg), or aluminum (Al).

The first and second internal electrodes 121 and 122 are formed on and stacked on a ceramic sheet forming a dielectric layer 111 and then fired to form a ceramic body 110 with one dielectric layer 111 sandwiched therebetween. Respectively.

The first and second internal electrodes 121 and 122 are electrodes having different polarities and arranged to face each other along the stacking direction of the dielectric layers 111 and electrically connected to each other by the dielectric layer 111 disposed in the middle Can be insulated.

The first and second internal electrodes 121 and 122 are respectively exposed through the first and second side surfaces 3 and 4 in the longitudinal direction of the ceramic body 110.

The end portions of the first and second internal electrodes 121 and 122 alternately exposed through the first and second side surfaces 3 and 4 in the longitudinal direction of the ceramic body 110 are arranged in the longitudinal direction of the ceramic body 110 And may be electrically connected to the first and second external electrodes 131 and 132 on the first and second sides 3 and 4, respectively.

The first and second internal electrodes 121 and 122 may be formed of a conductive metal such as Ni or Ni alloy. However, the present invention is not limited thereto .

When a predetermined voltage is applied to the first and second external electrodes 131 and 132, charges are accumulated between the first and second internal electrodes 121 and 122, which are opposed to each other.

At this time, the electrostatic capacity of the multilayer ceramic electronic component 100 is proportional to the overlapping area of the first and second internal electrodes 121 and 122 overlapping each other along the stacking direction of the dielectric layers 111.

The first and second external electrodes 131 and 132 are disposed at both ends of the ceramic body 110 in the longitudinal direction.

The first and second external electrodes 131 and 132 may include first and second front portions and first and second band portions, respectively.

The first and second front portions each cover first and second side surfaces 3 and 4 in the longitudinal direction of the ceramic body 110 and are connected to the exposed ends of the first and second internal electrodes 121 and 122 And are electrically connected to each other.

The first and second band portions extend from the first and second front portions so as to cover a part of the circumferential surface of the ceramic body 110, respectively.

On the other hand, a plating layer (not shown) may be formed on the first and second external electrodes 131 and 132. The plating layer includes, for example, first and second nickel (Ni) plating layers respectively formed on the first and second external electrodes 131 and 132, first and second plating layers formed on the first and second nickel plating layers, And a second tin (Sn) plating layer.

The margin recognition sections 141a, 141b, 142a and 142b are formed on at least one surface of the lower surface 1 as the mounting surface of the ceramic body 110 or the upper surface 2 as the opposite surface to the mounting surface, So that the margin in the longitudinal direction of the ceramic body 110 can be confirmed.

The upper margin recognition units 141a and 142a may be constructed by stacking the marking unit last when the dielectric layer 111 and the first and second internal electrodes 121 and 122 are stacked, And 142b may be formed by stacking a marking portion and stacking a dielectric layer 111 and first and second internal electrodes 121 and 122 thereon.

That is, the margin recognizing units 141a, 141b, 142a and 142b serve as indexes of the longitudinal direction margins. The margin recognition units 141a, 141b, 142a, So that it can be easily selected.

In the present embodiment, the margin recognition unit is shown as being disposed on both the lower surface 1 and the upper surface 2 of the ceramic body 110. However, the present invention is not limited to this, Ceramic body 110 may be disposed on only one of the lower surface 1 or the upper surface 2 of the ceramic body 110. [

It is preferable that the margin recognition unit is disposed on the upper surface 2 of the ceramic body 110 so that the margin recognition unit can be easily confirmed even after the substrate is mounted.

At this time, the margin recognition units 141a, 141b, 142a, and 142b are arranged so that the overlap between the first internal electrode 121 and the second internal electrode 122 is set so as to facilitate identification of the margin in the longitudinal direction of the ceramic body 110 And can be arranged linearly along the width direction W at the starting point.

In addition, the margin recognition units 141a, 141b, 142a, and 142b may be disposed so as to be positioned at the center when viewed from the W-T surface of the ceramic body 110. [ Therefore, when the multilayer ceramic electronic component is manufactured, the laminated bar can be divided into individual chips by cutting the central portions of the margin recognition portions 141a, 141b, 142a and 142b.

At this time, the widths of the margin recognition units 141a, 141b, 142a and 142b may be 5 占 퐉 or more, and their thickness may be 1 占 퐉 or more. If the width of the margin recognition units 141a, 141b, 142a, 142b is less than 5 占 퐉 or the thickness thereof is less than 1 占 퐉, there may be a problem that recognition is difficult.

In the present embodiment, the edge of the margin recognition unit is angled in a square shape, but it is needless to say that the margin recognition unit can be modified in various ways such as rounding the corner portion if necessary.

Variation example

4 is a perspective view of a multilayer ceramic electronic device according to another embodiment of the present invention, in which external electrodes are omitted. Here, except for the shape of the margin recognition unit, the structure is different from that of the above-described embodiment, and a detailed description thereof will be omitted.

4, the margin recognition units 141a 'and 142a' according to the present embodiment are formed on the first and second side surfaces 3 and 4 in the longitudinal direction of the ceramic body 110, 121, 122 are started.

In this case, as shown in FIGS. 5 and 6, the margin recognition units 1410a and 1420a may have a length corresponding to the width of the ceramic body 110, and the length of the margin recognition units 1410a and 1420a may correspond to the width of the ceramic body 110.

In this case, when the multilayer ceramic electronic component is manufactured, the laminated bar can be divided into individual chips by cutting the laminate bar to correspond to the lengths of the margin recognition portions 141a, 141b, 142a and 142b.

7, the margin recognition units 1430 and 1440 are formed such that both longitudinal sides thereof are tapered toward the center of the first and second side surfaces 3 and 4 in the longitudinal direction of the ceramic body 110 .

Therefore, the margin recognition units 1430 and 1440 may have a trapezoidal shape in which the inner side is longer than the outer side in the longitudinal direction (L).

At this time, the margin recognition units 1430 and 1440 may be configured as a bottleneck shape by adjusting the tapered shape.

8, the margin recognizing units 1450 and 1460 are formed so that both longitudinal sides of the ceramic body 110 are tapered toward the opposite center on the first and second side surfaces 3 and 4 in the longitudinal direction of the ceramic body 110, .

Therefore, the margin recognition units 1450 and 1460 may have a trapezoidal shape whose inner side is shorter in length than the outer side in the longitudinal direction (L).

Fig. 9 is a perspective view of a multilayer ceramic electronic device according to still another embodiment of the present invention, in which external electrodes are omitted, and Fig. 10 is a side sectional view of Fig. 9. Fig.

Referring to Figs. 9 and 10, the multilayer ceramic electronic component of the present embodiment may further include dummy electrodes 151a, 151b, 152a and 152b. Here, except for the dummy electrode, it has a different structure from that of the above-described embodiment, and a detailed description thereof will be omitted.

The dummy electrodes 151a, 151b, 152a, and 152b may be disposed on at least one of the upper or lower cover layers 112 and 113, respectively.

The dummy electrodes 151a, 151b, 152a and 152b are overlapped with the first and second internal electrodes 121 and 122 at the first and second side surfaces 3 and 4 in the longitudinal direction of the ceramic body 110 So that the left and right margins in the longitudinal direction of the ceramic body 110 can be more clearly recognized.

At this time, the dummy electrodes 151a, 151b, 152a, and 152b may be formed such that both end portions in the longitudinal direction are exposed through the third and fourth side surfaces 5 and 6 in the width direction of the ceramic body 110.

Further, the dummy electrodes 151a, 151b, 152a, and 152b can reduce the level difference, thereby reducing cracking and delamination.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the scope of the present invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. And will be apparent to those skilled in the art.

100; Multilayer Ceramic Electronic Components
110; Ceramic body
111; Dielectric layer
112, 113; The upper and lower cover layers
121, 122; The first and second internal electrodes
131, 132; The first and second outer electrodes
141a, 141b, 142a, 142b, 141a ', 142a', 1410a, 1420a, 1430, 1440, 1450, 1460; The margin recognition unit
151a, 151b, 152a, 152b; Dummy electrode

Claims (7)

A ceramic body including a plurality of dielectric layers;
First and second internal electrodes disposed in the ceramic body so as to be alternately exposed through both longitudinal sides of the ceramic body;
First and second external electrodes arranged at both ends in the longitudinal direction of the ceramic body so as to be connected to the first and second internal electrodes, respectively; And
A margin recognition unit arranged on at least one of a mounting surface and an opposite surface of the ceramic body so as to confirm a margin in the longitudinal direction of the ceramic body; Lt; / RTI >
Wherein the margin recognition unit is disposed between a position where overlapping of the first and second internal electrodes is started on both sides in the longitudinal direction of the ceramic body, and the length of the margin recognition unit is formed to have a length corresponding to the width of the ceramic body Multilayer Ceramic Electronic Components.
delete delete delete A ceramic body including a plurality of dielectric layers;
First and second internal electrodes disposed in the ceramic body so as to be alternately exposed through both longitudinal sides of the ceramic body;
First and second external electrodes arranged at both ends in the longitudinal direction of the ceramic body so as to be connected to the first and second internal electrodes, respectively; And
A margin recognition unit arranged on at least one of a mounting surface and an opposite surface of the ceramic body so as to confirm a margin in the longitudinal direction of the ceramic body; And
Wherein the margin recognition unit is disposed between a point where overlapping of the first and second internal electrodes is started on both sides in the longitudinal direction of the ceramic body, and the margin recognition unit is formed such that both longitudinal sides of the margin recognition unit are tapered.
6. The method according to claim 1 or 5,
An upper or lower cover layer disposed above and below the ceramic body; And
A dummy electrode disposed on at least one of at least one of the upper and lower cover layers, the dummy electrode being disposed between the first and second internal electrodes at both sides of the longitudinal direction of the ceramic body, at which overlapping of the first and second internal electrodes starts; Further comprising:
The method according to claim 6,
Wherein the dummy electrode is formed such that both longitudinal ends thereof are exposed through both lateral sides of the ceramic body.
KR1020140151923A 2014-11-04 2014-11-04 Multi-layered ceramic electronic components KR101642595B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282332A (en) * 2002-03-25 2003-10-03 Murata Mfg Co Ltd Ceramic electronic component and method of manufacturing the ceramic electronic component
JP5489023B1 (en) 2012-11-06 2014-05-14 サムソン エレクトロ−メカニックス カンパニーリミテッド． Multilayer ceramic capacitor and manufacturing method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06314630A (en) * 1993-04-28 1994-11-08 Murata Mfg Co Ltd Ceramic-lamination electronic component
KR101771730B1 (en) * 2012-08-07 2017-08-25 삼성전기주식회사 Laminated ceramic electronic parts and fabricating method thereof
KR101452049B1 (en) 2012-11-09 2014-10-22 삼성전기주식회사 Multi-layered ceramic capacitor, mounting structure of circuit having thereon multi-layered ceramic capacitor and packing unit for multi-layered ceramic capacitor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282332A (en) * 2002-03-25 2003-10-03 Murata Mfg Co Ltd Ceramic electronic component and method of manufacturing the ceramic electronic component
JP5489023B1 (en) 2012-11-06 2014-05-14 サムソン エレクトロ−メカニックス カンパニーリミテッド． Multilayer ceramic capacitor and manufacturing method thereof

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